Laser cutting mechanism for medical instrument production

Abstract

The invention relates to the technical field of medical instrument cutting, in particular to a laser cutting mechanism for medical instrument production. The cutting cavity is formed in the front wall of the cutting table; the four supporting legs are symmetrically and fixedly mounted at the bottom of the cutting table; the positive pressure cavity and the negative pressure cavity are formed in the left end and the right end of the cutting table correspondingly. And the scrap suction assembly is used for sucking scraps in the cutting cavity into the negative pressure cavity. Through cooperation of the suction pump, the positive pressure cavity and the negative pressure cavity, scraps generated in the medical instrument cutting process can be collected in the scrap collecting box in the negative pressure cavity, so that the scraps are prevented from splashing, and certain safety is achieved; and meanwhile, a first electric linear guide rail and a second linear guide rail are used for controlling transverse movement and longitudinal movement of the laser cutting machine correspondingly, cutting of different positions of the medical instrument can be achieved, the cutting range of the medical instrument is widened, and the cutting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of medical device cutting, and in particular to a laser cutting mechanism for producing medical devices. Background Art

[0002] With the rapid development of the market economy and the rapid advancement of science and technology, laser cutting technology has been widely used in the fields of automobiles, medical treatment, hardware and electrical appliances. Compared with traditional cutting processes, laser cutting machines have the advantages of fast speed, narrow cutting seams, small heat-affected zones and good verticality of cutting seam edges. They have broad development prospects and huge application space.

[0003] After searching, Chinese patent publication number CN215966931U discloses a laser cutting machine for medical device production, including a laser cutting structure, a support frame is arranged on the top of the laser cutting structure, a base is arranged horizontally at the bottom of the support frame, a connecting block is arranged vertically on the top of the base, a second groove is arranged in the connecting block, and a second screw rod is arranged vertically in the second groove; the medical device to be processed is clamped by the first clamping plate and the second clamping plate, which brings convenience to the laser cutting work.

[0004] The above technical solution has the following disadvantages when used:

[0005] 1. When cutting, the machine is in an exposed environment without protective measures, which may cause the waste generated during the cutting process to splash, which has certain safety defects;

[0006] 2. The laser cutting structure is in a fixed position and cannot move during cutting, which limits the cutting range of medical devices and affects the cutting quality. Summary of the invention

[0007] The purpose of the present invention is to solve the problems in the background technology and to propose a laser cutting mechanism for medical device production.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] A laser cutting mechanism for producing medical devices, comprising:

[0010] Cutting table;

[0011] A cutting chamber, which is provided on the front wall of the cutting table;

[0012] Four legs are symmetrically fixedly mounted on the bottom of the cutting table;

[0013] A positive pressure chamber and a negative pressure chamber are respectively provided at the left and right ends of the cutting table;

[0014] A chip suction assembly, used for sucking waste chips in the cutting chamber into the negative pressure chamber;

[0015] a positioning assembly for fixing the medical device in the cutting chamber;

[0016] Moving cutting assembly;

[0017] The controller is fixedly mounted on the surface of the cutting table and is electrically connected to the chip suction assembly, the positioning assembly and the mobile cutting assembly.

[0018] Preferably, the chip suction assembly includes a suction pump fixedly mounted on the top of the cutting table, the input end and output end of the suction pump are respectively fixedly connected with a suction pipe and an air outlet pipe, the ends of the suction pipe and the air outlet pipe away from the suction pump are respectively fixedly connected to the bottom of the negative pressure chamber and the positive pressure chamber, and a plurality of ventilation holes are provided on opposite sides of the negative pressure chamber and the positive pressure chamber.

[0019] Preferably, the positioning assembly includes a dual-axis motor fixedly mounted on the bottom of the cutting table, the two driving ends of the dual-axis motor are fixedly mounted with screws, and the threads on the surfaces of the two screws are arranged in opposite directions, the outer walls of the two screws are threadedly connected with nuts, and the surfaces of the two nuts are fixedly mounted with connecting rods, the other end of each connecting rod is movably passed through the bottom of the cutting table and fixedly mounted with a splint, and the bottom of the cutting chamber is provided with two sliding holes which are respectively slidably connected to the two connecting rods.

[0020] Preferably, the mobile cutting assembly includes a first electric linear guide fixedly installed in the cutting chamber, a second electric linear guide is slidably connected to the first electric linear guide, a laser cutting machine is slidably connected to the second electric linear guide, and the second electric linear guide and the first electric linear guide are respectively arranged longitudinally and transversely.

[0021] Preferably, a chip collecting frame is slidably inserted into the front side of the cutting table, and the chip collecting frame extends into the negative pressure chamber, a filter plate is fixedly installed at the bottom of the chip collecting frame, and a pull-out handle is fixedly installed on the front side of the chip collecting frame.

[0022] Preferably, a refrigeration pipe is fixedly installed in the positive pressure chamber, and the refrigeration pipe is arranged in a continuous S shape.

[0023] Preferably, two support plates are fixedly mounted on the bottom of the cutting chamber.

[0024] Preferably, a plurality of rollers are installed at the bottom of the negative pressure chamber, and the rollers are rotatably arranged at the bottom of the filter plate.

[0025] Preferably, a transparent sealing door is provided on the front side of the cutting chamber, and the transparent sealing door is rotatably mounted on the front wall of the cutting table.

[0026] Preferably, a fixing plate is rotatably mounted on one end of the two screw rods away from the dual-axis motor, and the fixing plate is fixedly mounted on the bottom of the cutting table.

[0027] Compared with the existing technology, the advantages of the laser cutting mechanism for medical device production provided by the present invention are:

[0028] 1. Use a suction pump to suck air into the negative pressure chamber through the suction pipe and blow air into the positive pressure chamber. Then, through the ventilation holes on both sides, the waste chips generated during the cutting process of the medical device can be sucked into the chip collection frame in the negative pressure chamber, thereby collecting the waste chips to prevent them from splashing, thus ensuring a certain degree of safety.

[0029] 2. The lateral movement and longitudinal movement of the laser cutting machine are controlled by the first electric linear guide and the second linear guide respectively, so that cutting at different positions on the medical device can be achieved, and the cutting range of the medical device can be increased to improve the cutting efficiency;

[0030] 3. The dual-axis motor controls the two screws to rotate synchronously, so that the two nuts drive the two clamping plates to move toward each other through the connecting rod until they are respectively pressed against the two sides of the medical device, thereby clamping and fixing the medical device and ensuring the stability of the medical device during the cutting process;

[0031] To summarize, the present invention can collect the waste chips generated during the cutting process of medical devices in a chip collection box in the negative pressure chamber through the cooperation of the suction pump, the positive pressure chamber and the negative pressure chamber to prevent the waste chips from splashing, thereby having a certain degree of safety. At the same time, the first electric linear guide and the second linear guide are used to respectively control the lateral movement and longitudinal movement of the laser cutting machine, which can also achieve cutting at different positions on the medical device, increase the cutting range of the medical device, and improve the cutting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the structure of a laser cutting mechanism for medical device production proposed by the present invention from a first perspective;

[0033] Figure 2 A cross-sectional view of a laser cutting mechanism for producing medical devices proposed by the present invention;

[0034] Figure 3 A schematic diagram of the structure of a laser cutting mechanism for medical device production proposed by the present invention from a second perspective;

[0035] Figure 4 This is a second perspective structural schematic diagram of a laser cutting mechanism for medical device production proposed by the present invention.

[0036] In the figure: 1 cutting table, 2 cutting chamber, 3 legs, 4 negative pressure chamber, 5 positive pressure chamber, 6 ventilation hole, 7 suction pump, 8 suction pipe, 9 air outlet pipe, 10 double-axis motor, 11 screw rod, 12 nut, 13 connecting rod, 14 clamping plate, 15 sliding hole, 16 first electric linear guide, 17 second electric linear guide, 18 laser cutting machine, 19 chip collection frame, 20 pull handle, 21 refrigeration pipe, 22 support plate, 23 roller, 24 controller, 25 transparent sealing door, 26 fixing plate. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0038] Reference Figures 1 to 4 , a laser cutting mechanism for medical device production, comprising:

[0039] Cutting table 1.

[0040] The cutting chamber 2 is opened on the front wall of the cutting table 1. Two support plates 22 are fixedly installed on the bottom of the cutting chamber 2. The support plates 22 can support the medical device to be cut to avoid the bottom of the medical device from contacting the bottom of the cutting chamber 2, ensuring that waste chips can pass through the bottom. A transparent sealing door 25 is provided on the front side of the cutting chamber 2, and the transparent sealing door 25 is rotatably installed on the front wall of the cutting table 1. When cutting, the transparent sealing door 25 can be closed to play a certain protective role.

[0041] Four legs 3 are symmetrically fixedly mounted on the bottom of the cutting table 1 .

[0042] The positive pressure chamber 5 and the negative pressure chamber 4 are respectively opened at the left and right ends of the cutting table 1 .

[0043] The chip suction component is used to suck the waste chips in the cutting chamber 2 into the negative pressure chamber 4. The chip suction component includes a suction pump 7 fixedly installed on the top of the cutting table 1. The input end and output end of the suction pump 7 are fixedly connected with a suction pipe 8 and an air outlet pipe 9 respectively. The ends of the suction pipe 8 and the air outlet pipe 9 away from the suction pump 7 are fixedly connected to the bottom of the negative pressure chamber 4 and the positive pressure chamber 5 respectively. A plurality of ventilation holes 6 are provided on opposite sides of the negative pressure chamber 4 and the positive pressure chamber 5. When cutting, the suction pump 7 is started to suck air into the negative pressure chamber 4 through the suction pipe 8 and blow air into the positive pressure chamber 5. Then, the waste chips generated during the cutting process of the medical device can be sucked into the negative pressure chamber 4 through the ventilation holes 6 on both sides, thereby realizing the collection of the waste chips to prevent splashing, which has a certain degree of safety.

[0044] The positioning assembly is used to fix the medical device in the cutting chamber 2. The positioning assembly includes a dual-axis motor 10 fixedly installed at the bottom of the cutting table 1. The two driving ends of the dual-axis motor 10 are fixedly installed with screws 11. The ends of the two screws 11 away from the dual-axis motor 10 are rotatably installed with fixed plates 26, and the fixed plates 26 are fixedly installed at the bottom of the cutting table 1, thereby ensuring the stability of the screws 11 during rotation.

[0045] The threads on the surfaces of the two screw rods 11 are set in opposite directions, and the outer walls of the two screw rods 11 are threadedly connected with nuts 12. The surfaces of the two nuts 12 are fixedly installed with connecting rods 13. The other end of each connecting rod 13 is movably passed through the bottom of the cutting table 1 and fixedly installed with a clamping plate 14. The bottom of the cutting chamber 2 is provided with two sliding holes 15 that are respectively slidably connected to the two connecting rods 13. When in use, the medical device to be cut is first placed on the two support plates 22 in the cutting chamber 2, and then the dual-axis motor 10 is started to control the two screw rods 11 to rotate synchronously, so that the two nuts 12 each drive the two clamping plates 14 to move toward each other through the connecting rod 13 until they are respectively pressed against the two sides of the medical device, thereby clamping and fixing the medical device.

[0046] A mobile cutting assembly includes a first electric linear guide 16 fixedly installed in a cutting chamber 2, a second electric linear guide 17 being slidably connected to the first electric linear guide 16, a laser cutting machine 18 being slidably connected to the second electric linear guide 17, and the second electric linear guide 17 and the first electric linear guide 16 are respectively arranged longitudinally and transversely. The transverse movement and longitudinal movement of the laser cutting machine 18 are respectively controlled by the first electric linear guide 16 and the second linear guide 17, so that cutting at different positions on the medical device can be achieved, thereby increasing the cutting range of the medical device and improving the cutting efficiency.

[0047] The controller 24 is fixedly mounted on the surface of the cutting table 1 and is electrically connected to the chip suction assembly, the positioning assembly and the mobile cutting assembly.

[0048] Furthermore, a chip collecting frame 19 is slidably inserted on the front side of the cutting table 1, and the chip collecting frame 19 extends into the negative pressure chamber 4, and a filter plate is fixedly installed at the bottom of the chip collecting frame 19. After the waste chips enter the negative pressure chamber 4, the waste chips can be retained and collected in the chip collecting frame 19 under the continuous suction of the suction pipe 8 and the interception of the filter plate, and a pulling handle 20 is fixedly installed on the front side of the chip collecting frame 19, and a plurality of rollers 23 are installed at the bottom of the negative pressure chamber 4, and the rollers 23 are rotatably arranged at the bottom of the filter plate. Finally, the chip collecting frame 19 can be pulled out by pulling the handle 20. In this process, under the action of each roller 23, the flexibility of the chip collecting frame 19 when pulling out can also be improved.

[0049] Furthermore, a refrigeration tube 21 is fixedly installed in the positive pressure chamber 5, and the refrigeration tube 21 is arranged in a continuous S shape. When the air outlet pipe 9 blows air into the positive pressure chamber 5, after the airflow contacts the refrigeration tube 21, it can be converted into a cold airflow and then blown on the surface of the medical device, thereby achieving cooling of the medical device during the cutting process to prevent high temperature from causing debris to adhere to the medical device and affect its quality.

[0050] The working principle of the present invention is:

[0051] When in use, the medical device to be cut is first placed on the two support plates 22 in the cutting chamber 2, and then the dual-axis motor 10 is started to control the two screws 11 to rotate synchronously, so that the two nuts 12 drive the two clamping plates 14 to move toward each other through the connecting rod 13, until they are respectively pressed against the two sides of the medical device, thereby clamping and fixing the medical device;

[0052] Then, the transparent sealing door 25 is closed, and the lateral movement and longitudinal movement of the laser cutting machine 18 are controlled by the first electric linear guide 16 and the second linear guide 17 respectively, so that cutting at different positions on the medical device can be achieved, thereby increasing the cutting range of the medical device;

[0053] At the same time, the suction pump 7 can also suck air into the negative pressure chamber 4 through the suction pipe 8 and blow air into the positive pressure chamber 5, and then through the ventilation holes 6 on both sides, the waste chips generated during the cutting process of the medical device can be sucked into the negative pressure chamber 4, thereby realizing the collection of the waste chips to prevent splashing;

[0054] After the waste chips enter the negative pressure chamber 4, they can be retained and collected in the chip collecting frame 19 under the continuous suction of the suction pipe 8 and the interception of the filter plate. Finally, the chip collecting frame 19 can be pulled out by pulling the handle 20. In this process, under the action of each roller 23, the flexibility of the chip collecting frame 19 when pulling it out can also be improved.

[0055] It is further explained that the above-mentioned fixed connection should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be welding, gluing, or one-piece molding, etc., which are conventional means well known to those skilled in the art.

[0056] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A laser cutting mechanism for medical device production, characterized in that: include: Cutting table (1); A cutting chamber (2) is provided on the front wall of the cutting table (1); Four legs (3) are symmetrically fixedly mounted on the bottom of the cutting table (1); The positive pressure chamber (5) and the negative pressure chamber (4) are respectively disposed at the left and right ends of the cutting table (1); A chip suction assembly, used for sucking waste chips in the cutting chamber (2) into the negative pressure chamber (4); A positioning assembly, used for fixing the medical device in the cutting chamber (2); Moving cutting assembly; The controller (24) is fixedly mounted on the surface of the cutting table (1) and is electrically connected to the chip suction assembly, the positioning assembly and the movable cutting assembly.

2. A laser cutting mechanism for medical device production according to claim 1, characterized in that: The chip suction assembly comprises a suction pump (7) fixedly mounted on the top of the cutting table (1); the input end and the output end of the suction pump (7) are respectively fixedly connected to a suction pipe (8) and an air outlet pipe (9); the ends of the suction pipe (8) and the air outlet pipe (9) away from the suction pump (7) are respectively fixedly connected to the bottom of the negative pressure chamber (4) and the positive pressure chamber (5); and a plurality of ventilation holes (6) are provided on opposite sides of the negative pressure chamber (4) and the positive pressure chamber (5).

3. A laser cutting mechanism for medical device production according to claim 1, characterized in that: The positioning assembly comprises a double-axis motor (10) fixedly mounted on the bottom of the cutting table (1), the two driving ends of the double-axis motor (10) are fixedly mounted with screw rods (11), and the threads on the surfaces of the two screw rods (11) are arranged in opposite directions, the outer walls of the two screw rods (11) are threadedly connected with nuts (12), the surfaces of the two nuts (12) are fixedly mounted with connecting rods (13), the other end of each connecting rod (13) is movably passed through the bottom of the cutting table (1) and fixedly mounted with a clamping plate (14), and the bottom of the cutting chamber (2) is provided with two sliding holes (15) respectively slidably connected with the two connecting rods (13).

4. A laser cutting mechanism for medical device production according to claim 1, characterized in that: The mobile cutting assembly comprises a first electric linear guide (16) fixedly mounted in a cutting chamber (2); a second electric linear guide (17) is slidably connected to the first electric linear guide (16); a laser cutting machine (18) is slidably connected to the second electric linear guide (17); and the second electric linear guide (17) and the first electric linear guide (16) are respectively arranged in a longitudinal direction and a transverse direction.

5. The laser cutting mechanism for medical device production according to claim 1, characterized in that: A chip collecting frame (19) is slidably inserted into the front side of the cutting table (1), and the chip collecting frame (19) extends into the negative pressure chamber (4). A filter plate is fixedly installed at the bottom of the chip collecting frame (19), and a pull-out handle (20) is fixedly installed at the front side of the chip collecting frame (19).

6. A laser cutting mechanism for medical device production according to claim 1, characterized in that: A refrigeration pipe (21) is fixedly installed in the positive pressure chamber (5), and the refrigeration pipe (21) is arranged in a continuous S shape.

7. The laser cutting mechanism for medical device production according to claim 1, characterized in that: Two support plates (22) are fixedly mounted on the bottom of the cutting chamber (2).

8. The laser cutting mechanism for medical device production according to claim 5, characterized in that: A plurality of rollers (23) are installed at the bottom of the negative pressure chamber (4), and the rollers (23) are rotatably arranged at the bottom of the filter plate.

9. A laser cutting mechanism for medical device production according to claim 1, characterized in that: A transparent sealing door (25) is provided on the front side of the cutting chamber (2), and the transparent sealing door (25) is rotatably mounted on the front wall of the cutting table (1).

10. The laser cutting mechanism for medical device production according to claim 1, characterized in that: A fixing plate (26) is rotatably mounted on one end of the two screw rods (11) away from the dual-axis motor (10), and the fixing plate (26) is fixedly mounted on the bottom of the cutting table (1).

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