Circuit board gold immersion and sand blasting device and gold immersion and sand blasting method

Abstract

The invention belongs to the technical field of circuit board gold immersion and sand blasting, and particularly relates to a circuit board gold immersion and sand blasting device which comprises a rack and two groups of chains, two groups of transmission shafts are rotationally arranged in the rack, two groups of chain wheels are mounted on the transmission shafts, each group of chain is meshed with the two groups of chain wheels, a plurality of groups of discharging assemblies are arranged around the chains, and a sand blasting mechanism is arranged above the rack. The sand blasting mechanism comprises a transparent cover, side plates are fixed to the two ends of the transparent cover, the lower ends of the side plates are fixedly connected with the machine frame, the lower ends of the side plates are provided with material passing grooves used for allowing the discharging assembly to pass through, and the discharging assembly is provided with rectangular grooves. A closed space is formed by the multiple sets of discharging assemblies, the two sets of side plates, the transparent cover, the two sets of sealing edge strips and the dustproof filter bag, and frosted sand splashed in the closed space only falls into the dustproof filter bag, so that the situation that the frosted sand splashes to the outside is greatly reduced, waste of the frosted sand is reduced, and meanwhile pollution of the frosted sand to the external environment is greatly reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of immersion gold sandblasting of circuit boards, in particular to an immersion gold sandblasting device and an immersion gold sandblasting method for circuit boards. Background Art

[0002] The gold immersion process of circuit boards is also called the gold plating process. Before gold plating the circuit board, the surface of the circuit board needs to be cleaned of debris and the roughness needs to be increased. Currently, the surface of the circuit board is sandblasted by a sandblasting machine, which can not only quickly clean the debris on the surface of the circuit board, but also make the surface of the circuit board produce tiny bumps and bumps, thereby increasing the surface roughness and actual surface area, which helps to increase the contact area between the gold-plated layer and the substrate and enhance adhesion. Therefore, sandblasting is an important step before gold plating of the circuit board.

[0003] The patent with announcement number CN217619992U discloses a sandblasting machine for immersion gold of circuit boards, including a frame with a support plate on the top; a flat shell is arranged on the support plate, a hopper is arranged on the flat shell, the lower end of the hopper is connected to a feeding mechanism, the feeding mechanism is connected to a sandblasting pipeline, two groups of recovery hoppers are symmetrically arranged below the flat shell, and a plurality of groups of rollers are rotatably installed on the support plate. The problem of the hopper being easily blocked and affecting the normal operation of the sandblasting machine is solved through the setting of the feeding mechanism. Secondly, the sand sprayed by the sandblasting gun for grinding the circuit board will fall into the recovery hopper, thereby realizing the recycling and reuse of the grinding sand.

[0004] In the above scheme, during the process of sandblasting the circuit board with a sandblasting gun, since the area where the circuit board and the sandblasting gun are located is not sealed, part of the frosted sand will be scattered outside the frame with the airflow, which will not only make the surrounding environment dusty and affect the work and health of the staff, but also cause a large amount of frosted sand to be wasted; for this reason, the present invention provides a circuit board immersion gold sandblasting device and an immersion gold sandblasting method. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve its technical problem is: a circuit board immersion gold sandblasting device described in the present invention comprises a frame and two sets of chains, two sets of transmission shafts are rotated in the frame, two sets of sprockets are installed on the transmission shafts, each set of chains meshes with the two sets of sprockets, and several sets of discharge components are arranged around the chains, a sandblasting mechanism is arranged above the frame, and a conveyor belt is arranged below the frame, the sandblasting mechanism comprises a transparent cover, side plates are fixed at both ends of the transparent cover, the lower ends of the side plates are fixedly connected to the frame, a material passing trough for the discharge component to pass through is arranged at the lower ends of the side plates, a rectangular groove is arranged on the discharge component, dust filter bags are arranged on both sides of the lower end of the transparent cover, two sets of spray guns are fixedly installed on the upper end of the transparent cover, the upper ends of the two sets of spray guns are connected to air pipes, two sets of lower ports of the storage barrel are respectively connected to two sets of sand feeding mechanisms, the sand feeding mechanisms are connected to the spray guns, and two sets of sealing edge strips for guiding the discharge component are arranged between the two sets of side plates;

[0007] When the discharge components continuously pass through the sandblasting mechanism, a closed space is formed by multiple discharge components, two sets of side panels, a transparent cover, two sets of sealing edge strips, and a dust filter bag. The flying sand in the closed space will only fall into the dust filter bag, which greatly reduces the flying of the sand to the outside world, which not only reduces the waste of the sand, but also greatly reduces the pollution of the sand to the external environment.

[0008] Preferably, the material discharge assembly comprises a base, two groups of chains are fixedly connected to the bottom of the base, two groups of guide blocks movably installed on the base, a movable block fixedly connected to the guide blocks, the two groups of movable blocks are merged into a rectangular groove, the two groups of movable blocks are both plugged into the movable plate, a movable column fixedly connected to the lower end of the movable plate, a spring sleeved on the movable column, a guide groove is provided on the base, the two groups of guide blocks are both slidably connected to the guide groove, two groups of oblique grooves are provided on the movable plate, a pin is provided in the oblique groove, the pin is fixedly installed in the guide block, a guide plate is provided between the two groups of transmission shafts, an oblique surface and a step are provided on the outer ring of the guide plate, a roller is rotatably installed at the lower end of the movable column, and the roller is rotatably connected to the outer ring of the guide plate;

[0009] Under the guidance of the oblique groove, the two groups of pins drive the two groups of guide blocks to move toward each other along the guide groove. The two groups of guide blocks merge the two groups of movable blocks, so that the edge of the circuit board is close to the inner wall of the rectangular groove, avoiding fine frosting from entering between the edge of the circuit board and the inner wall of the rectangular groove. When the roller rolls to the step, the two groups of movable blocks are separated under the rebound force of the spring, which not only allows the circuit board to fall smoothly onto the conveyor belt, but also further reduces the waste of frosting.

[0010] Preferably, a turning mechanism is further provided below the frame, the turning mechanism comprising a material unloading frame, the upper end of the material unloading frame is fixedly connected to the frame, a limit cover is fixedly installed on the material unloading frame, a fan-shaped block is rotatably installed at the lower end of the material unloading frame, a plurality of groups of rollers are rotatably installed in the material unloading frame, a stopper for blocking the circuit board is provided on the fan-shaped block, and a conveyor belt is located below the lower end of the material unloading frame;

[0011] The motor drives the fan-shaped block to rotate toward the conveyor belt, so that the fan-shaped block drives the circuit board to rotate. When the circuit board is turned over, the circuit board will automatically fall onto the conveyor belt, thereby realizing the turning over of the circuit board and improving the processing efficiency of the next set of processes for the circuit board.

[0012] Embodiment 3

[0013] A circuit board immersion gold sandblasting method, the method comprising the following steps:

[0014] Step 1: Place the circuit board to be sandblasted on a set of empty unloading components;

[0015] Step 2: The motor drives the transmission shaft to rotate, so that several groups of unloading components slowly move in a circular motion, and the unloading components carrying the circuit board move into the sandblasting mechanism, and the spray gun on the sandblasting mechanism sandblasts the slowly moving circuit board;

[0016] Step 3: While several groups of unloading components are slowly moving in a circular motion, the staff continues to place the circuit boards to be sandblasted onto the next group of unloading components;

[0017] Step 4: The circuit board after sandblasting in step 2 is transferred to the conveyor belt below, and the circuit board is transferred to the next set of gold deposition process through the conveyor belt;

[0018] Step 5: Perform gold immersion treatment on the circuit board;

[0019] The circuit board after sandblasting first falls into the turning mechanism, and then the circuit board is turned over by the turning mechanism, and the turned circuit board is conveyed to the conveyor belt.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. When the discharge components continuously pass through the sandblasting mechanism, a closed space is formed by multiple discharge components, two sets of side panels, a transparent cover, two sets of sealing edge strips, and a dust filter bag. The flying sand in the closed space will only fall into the dust filter bag, which greatly reduces the flying of the sand to the outside world, not only reducing the waste of the sand, but also greatly reducing the pollution of the sand to the external environment.

[0022] 2. The roller will be squeezed by the inclined surface, so that the roller drives the movable column and the movable plate to move upward, and the movable column compresses the spring. As the movable plate moves upward, the two sets of pins will slide along the two sets of inclined grooves. Under the guidance of the inclined grooves, the two sets of pins drive the two sets of guide blocks to move toward each other along the guide grooves. The two sets of guide blocks merge the two sets of movable blocks, so that the edge of the circuit board is close to the inner wall of the rectangular groove, avoiding fine frosting from entering between the edge of the circuit board and the inner wall of the rectangular groove. When the roller rolls to the step, the two sets of movable blocks are separated under the rebound force of the spring, which not only allows the circuit board to fall smoothly onto the conveyor belt, but also further reduces the waste of frosting.

[0023] 3. After sandblasting, the circuit board will fall into the unloading rack and slide obliquely downward along the rollers in the unloading rack, so that the circuit board passes through the limit cover until it is blocked by the block on the fan-shaped block. Then the fan-shaped block is driven by the motor to rotate toward the conveyor belt, so that the fan-shaped block drives the circuit board to rotate. When the circuit board is turned over, it will automatically fall onto the conveyor belt, thereby realizing the turning of the circuit board and improving the processing efficiency of the next set of processes for the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] Figure 1 It is a partial schematic diagram of the structure of the present invention.

[0026] Figure 2 It is a cross-sectional schematic diagram of the frame, transmission shaft, sprocket, chain, unloading assembly and sandblasting mechanism of the present invention.

[0027] Figure 3 It is a cross-sectional schematic diagram of the transparent cover, side panels, dust filter bag, sealing edge strips, and material discharge assembly of the present invention.

[0028] Figure 4 It is a schematic diagram of the combination of the chain and the unloading assembly of the present invention.

[0029] Figure 5 It is a cross-sectional schematic diagram of the discharge assembly of the present invention.

[0030] Figure 6 It is a schematic diagram of the combination of the transmission shaft, guide plate and discharge assembly of the present invention.

[0031] Figure 7 It is a schematic diagram of the combination of the frame, the unloading assembly, the unloading mechanism and the conveyor belt of the present invention.

[0032] Figure 8 It is a schematic diagram of the material unloading mechanism of the present invention.

[0033] Fig. 9 It is a schematic diagram of the overall structure of the present invention.

[0034] In the figure: 1, frame; 2, transmission shaft; 201, guide plate; 2011, inclined surface; 2012, step; 3, sprocket; 4, chain; 5, unloading assembly; 51, rectangular groove; 6, sandblasting mechanism; 7, turning mechanism; 8, conveyor belt; 601, transparent cover; 602, side plate; 6021, material chute; 603, dust filter bag; 604, spray gun; 605, air pipe; 606, storage barrel ; 607, sand feeding mechanism; 608, sealing edge strip; 501, base; 5011, guide groove; 502, movable block; 503, guide block; 504, movable plate; 5041, oblique groove; 5042, pin shaft; 505, movable column; 5051, roller; 506, spring; 701, unloading rack; 702, roller; 703, limit cover; 704, fan-shaped block; 7041, stop block. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0036] Embodiment 1

[0037] like Figures 1 to 9 As shown, a circuit board immersion gold sandblasting device described in an embodiment of the present invention includes a frame 1 and two groups of chains 4. Two groups of transmission shafts 2 rotate in the frame 1, and two groups of sprockets 3 are installed on the transmission shafts 2. Each group of chains 4 meshes with two groups of sprockets 3. Several groups of unloading components 5 are arranged around the chains 4. A sandblasting mechanism 6 is arranged above the frame 1, and a conveyor belt 8 is arranged below the frame 1. The sandblasting mechanism 6 includes a transparent cover 601, and side plates 602 are fixed at both ends of the transparent cover 601. The lower ends of the side plates 602 are fixedly connected to the frame 1. A material passing chute 6021 for the discharge component 5 to pass through is provided at the lower end, a rectangular groove 51 is provided on the discharge component 5, dust filter bags 603 are provided on both sides of the lower end of the transparent cover 601, two groups of spray guns 604 are fixedly installed on the upper end of the transparent cover 601, the upper ends of the two groups of spray guns 604 are connected to the air pipe 605, the two groups of lower ports of the storage barrel 606 are respectively connected to two groups of sand delivery mechanisms 607, the sand delivery mechanisms 607 are connected to the spray guns 604, and two groups of sealing edge strips 608 for guiding the discharge component 5 are provided between the two groups of side panels 602.

[0038] Specifically, the thickness of the side plate 602 is greater than the gap between the discharge components 5, the end of the air pipe 605 is connected to the air pump, the storage barrel 606 stores frosted sand, and the sand feeding mechanism 607 adopts the above-mentioned patent announcement number CN217619992U which discloses the unloading mechanism in the sandblasting machine for circuit board immersion gold. When the circuit board needs to be sandblasted, the circuit board is placed in a rectangular groove 51 on a set of discharge components 5, and then a set of motors drives a set of transmission shafts 2 to rotate, a set of transmission shafts 2 drives two sets of sprocket wheels 3 to rotate, and the two sets of sprocket wheels 3 drive two sets of chains 4 together with a number of discharge components 5 to slowly make a circular motion, and the attached Figure 1 The direction indicated by the middle arrow is the direction of circular motion. At the same time, the discharge assembly 5 carrying the circuit board enters the structure composed of the side plate 602 and the transparent cover 601 through the material slot 6021 on one set of side plates 602, and the two sides of the discharge assembly 5 slide against the two sets of sealing edge strips 608 respectively. At this time, the frosting in the storage barrel 606 is transported into the spray gun 604 through the sand feeding mechanism 607, and then the air is transported into the spray gun 604 through the air pipe 605 by the air pump. The air entering the spray gun 604 sprays the frosting on the circuit board, and the sputtered frosting will fall into the dust filter bag 603 with the air flow, so as to realize the sandblasting of the circuit board, until the discharge assembly 5 carrying the circuit board passes through the material slot on another set of side plates 602. The slot 6021 moves out of the sandblasting mechanism 6. During this process, the staff continues to put the circuit boards to be sandblasted onto the next group of discharge components 5. The circuit boards after sandblasting will fall onto the conveyor belt 8 as the discharge components 5 move in a circle, and are conveyed to the next process through the conveyor belt 8. The above operations are repeated in a cycle. Compared with the prior art, during the process of the discharge components 5 continuously passing through the sandblasting mechanism 6, a closed space is formed by multiple groups of discharge components 5, two groups of side panels 602, a transparent cover 601, two groups of sealing edge strips 608, and a dust-proof filter bag 603. The sand splashed in the closed space will only fall into the dust-proof filter bag 603, which greatly reduces the sand splashing to the outside world, not only reducing the waste of sand, but also greatly reducing the pollution of the sand to the external environment.

[0039] like Figures 4 to 6As shown, the material discharge assembly 5 includes a base 501, two groups of chains 4 are fixedly connected to the bottom of the base 501, two groups of guide blocks 503 are movably installed on the base 501, and a movable block 502 is fixedly connected to the guide block 503. The two groups of movable blocks 502 are combined into a rectangular groove 51. The two groups of movable blocks 502 are both plugged into a movable plate 504, a movable column 505 fixedly connected to the lower end of the movable plate 504, and a spring 506 sleeved on the movable column 505. A guide groove 5011 is opened on the base 501, and the two The guide blocks 503 are all slidably connected to the guide grooves 5011. Two groups of oblique grooves 5041 are opened on the movable plate 504. Pins 5042 are arranged in the oblique grooves 5041. The pins 5042 are fixedly installed in the guide blocks 503. A guide plate 201 is arranged between the two groups of transmission shafts 2. An oblique surface 2011 and a step 2012 are arranged on the outer ring of the guide plate 201. A roller 5051 is rotatably installed at the lower end of the movable column 505. The roller 5051 is rollingly connected to the outer ring of the guide plate 201.

[0040] Specifically, if the size of the rectangular groove 51 is designed to be compact with the circuit board, when the circuit board is sandblasted, fine sand will enter between the edge of the circuit board and the inner wall of the rectangular groove 51, resulting in an increase in the friction between the edge of the circuit board and the inner wall of the rectangular groove 51, causing the circuit board to be stuck in the rectangular groove 51 and unable to fall smoothly onto the conveyor belt 8. The size of the rectangular groove 51 is designed to be large, and the rectangular groove 51 will bring out more sand, resulting in waste of sand. Therefore, in the initial state, the two groups of movable blocks 502 are in a separated state, so that it is convenient for the staff to put the circuit board into the rectangular groove 51. Then, during the circular motion of the discharge component 5, the roller 5051 on the discharge component 5 will roll along the outer ring of the guide plate 201, and the roller 5051 will be squeezed by the inclined surface 2011, causing the roller 5 051 drives the movable column 505 and the movable plate 504 to move upward, and the movable column 505 compresses the spring 506. As the movable plate 504 moves upward, the two groups of pin shafts 5042 will slide along the two groups of oblique grooves 5041. Under the guidance of the oblique grooves 5041, the two groups of pin shafts 5042 drive the two groups of guide blocks 503 to move toward each other along the guide grooves 5011. The two groups of guide blocks 503 merge the two groups of movable blocks 502, so that the edge of the circuit board is close to the inner wall of the rectangular groove 51, and fine frosting is prevented from entering between the edge of the circuit board and the inner wall of the rectangular groove 51. When the roller 5051 rolls to the step 2012, the two groups of movable blocks 502 are separated under the rebound force of the spring 506, which not only enables the circuit board to fall smoothly onto the conveyor belt 8, but also further reduces the waste of frosting.

[0041] Embodiment 2

[0042] like Figure 7 and Figure 8As shown, compared with Example 1, another embodiment of the present invention is: a turning mechanism 7 is also arranged below the frame 1, the turning mechanism 7 includes a feed rack 701, the upper end of the feed rack 701 is fixedly connected to the frame 1, a limit cover 703 is fixedly installed on the feed rack 701, a fan-shaped block 704 is rotatably installed at the lower end of the feed rack 701, a plurality of groups of rollers 702 are rotatably installed in the feed rack 701, a block 7041 for blocking the circuit board is arranged on the fan-shaped block 704, and a conveyor belt 8 is located below the lower end of the feed rack 701.

[0043] Specifically, the sandblasted surface of the circuit board dropped onto the conveyor belt 8 is facing downward. Since the next process needs to process the surface of the circuit board after sandblasting, the circuit board needs to be turned over, which affects the processing efficiency of the next set of processes for the circuit board. The sandblasted circuit board will fall into the unloading rack 701, and will slide obliquely downward along the roller 702 in the unloading rack 701, so that the circuit board passes through the limit cover 703 until it is blocked by the block 7041 on the fan block 704, and then the fan block 704 is driven by the motor to rotate toward the conveyor belt 8, so that the fan block 704 drives the circuit board to rotate. When the circuit board is turning over, the circuit board will automatically fall onto the conveyor belt 8, thereby realizing the turning over of the circuit board and improving the processing efficiency of the circuit board in the next set of processes.

[0044] Embodiment 3

[0045] A circuit board immersion gold sandblasting method, the method adopts the circuit board immersion gold sandblasting device described above, and comprises the following steps:

[0046] Step 1: placing the circuit board to be sandblasted on a set of empty discharge components 5;

[0047] Step 2: The transmission shaft 2 is driven by a motor to rotate, so that the plurality of feeding components 5 slowly move in a circular motion, and the feeding components 5 carrying the circuit boards are moved into the sandblasting mechanism 6, and the slowly moving circuit boards are sandblasted by the spray gun 604 on the sandblasting mechanism 6;

[0048] Step 3: While several groups of unloading components 5 are slowly moving in a circular motion, the staff continues to place the circuit boards to be sandblasted onto the next group of unloading components 5;

[0049] Step 4: The circuit board after sandblasting in step 2 is transferred to the conveyor belt 8 below, and the circuit board is transferred to the next set of gold deposition process through the conveyor belt 8;

[0050] Step 5: Perform immersion gold treatment on the circuit board.

[0051] Furthermore, the circuit board after sandblasting first falls into the turning mechanism 7 , and then the circuit board is turned over by the turning mechanism 7 , and the turned circuit board is conveyed to the conveyor belt 8 .

[0052] Working principle: Place the circuit board in a rectangular groove 51 on a set of discharge components 5, then drive a set of transmission shafts 2 to rotate through a set of motors, and a set of transmission shafts 2 drives two sets of sprockets 3 to rotate, and the two sets of sprockets 3 drive two sets of chains 4 together with several sets of discharge components 5 to slowly make circular motions, and at the same time, the discharge components 5 carrying the circuit board pass through the material slot 6021 on a set of side plates 602 into the structure composed of the side plates 602 and the transparent cover 601, and the two sides of the discharge components 5 slide against the two sets of sealing edge strips 608 respectively, and at this time, the frosting in the storage barrel 606 is transported into the spray gun 604 through the sand feeding mechanism 607, Then, the air is delivered to the spray gun 604 through the air pipe 605 by the air pump. The air entering the spray gun 604 sprays the frosted sand on the circuit board, and the sputtered frosted sand falls into the dust filter bag 603 with the air flow, so as to realize the sandblasting of the circuit board, until the discharge assembly 5 carrying the circuit board moves out of the sandblasting mechanism 6 through the material chute 6021 on the other set of side plates 602. During this process, the staff continues to put the circuit board to be sandblasted on the next set of discharge assembly 5. The circuit board after sandblasting will fall onto the conveyor belt 8 with the circular motion of the discharge assembly 5, and be conveyed to the next process through the conveyor belt 8, and the above operation is repeated in a cycle.

[0053] In the initial state, the two groups of movable blocks 502 are in a separated state, so that it is convenient for the staff to put the circuit board into the rectangular groove 51. Then, during the circular motion of the material discharging component 5, the roller 5051 on the material discharging component 5 will roll along the outer ring of the guide plate 201, and the roller 5051 will be squeezed by the inclined surface 2011, so that the roller 5051 drives the movable column 505 and the movable plate 504 to move upward, and the movable column 505 compresses the spring 506. As the movable plate 504 moves upward, the two groups of pins 5042 will move along the two groups of inclined surfaces. The two sets of pins 5042 drive the two sets of guide blocks 503 to move toward each other along the guide groove 5011 under the guidance of the oblique groove 5041. The two sets of guide blocks 503 merge the two sets of movable blocks 502, so that the edge of the circuit board is close to the inner wall of the rectangular groove 51, and fine frosting is prevented from entering between the edge of the circuit board and the inner wall of the rectangular groove 51. When the roller 5051 rolls to the step 2012, the two sets of movable blocks 502 are separated under the rebound force of the spring 506, so that the circuit board can smoothly fall onto the conveyor belt 8.

[0054] After sandblasting, the circuit board will fall into the unloading rack 701 and will slide obliquely downward along the roller 702 in the unloading rack 701, so that the circuit board passes through the limit cover 703 until it is blocked by the block 7041 on the fan block 704. Then, the fan block 704 is driven by the motor to rotate toward the conveyor belt 8, so that the fan block 704 drives the circuit board to rotate. When the circuit board is turned over, it will automatically fall onto the conveyor belt 8.

[0055] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A circuit board immersion gold sandblasting device, comprising a frame (1) and two sets of chains (4), characterized in that: Two groups of transmission shafts (2) are rotated in the frame (1), two groups of sprockets (3) are installed on the transmission shafts (2), each group of chains (4) meshes with two groups of sprockets (3), a plurality of groups of discharge components (5) are arranged around the chains (4), a sandblasting mechanism (6) is arranged above the frame (1), and a conveyor belt (8) is arranged below the frame (1); The sandblasting mechanism (6) comprises a transparent cover (601), side plates (602) are fixed at both ends of the transparent cover (601), the lower ends of the side plates (602) are fixedly connected to the frame (1), the lower ends of the side plates (602) are provided with a material trough (6021) for the material discharge assembly (5) to pass through, and the material discharge assembly (5) is provided with a rectangular groove (51); Dust-proof filter bags (603) are arranged on both sides of the lower end of the transparent cover (601), and two groups of spray guns (604) are fixedly installed on the upper end of the transparent cover (601); An air pipe (605), the upper ends of the two groups of spray guns (604) are connected to the air pipe (605); A material storage barrel (606), wherein two groups of lower ports of the material storage barrel (606) are respectively connected to two groups of sand delivery mechanisms (607), and the sand delivery mechanisms (607) are connected to the spray gun (604). Two groups of sealing edge strips (608) for guiding the material discharge assembly (5) are arranged between the two groups of side plates (602).

2. A circuit board immersion gold sandblasting device according to claim 1, characterized in that: The discharge assembly (5) comprises: A base (501), the bottom of the base (501) being fixedly connected to the two groups of chains (4); Two groups of guide blocks (503) movably mounted on the base (501); A movable block (502) fixedly connected to the guide block (503), wherein two groups of movable blocks (502) are combined into the rectangular groove (51); The two groups of movable blocks (502) are both plugged into the movable plate (504); A movable column (505) fixedly connected to the lower end of the movable plate (504); A spring (506) is sleeved on the movable column (505).

3. A circuit board immersion gold sandblasting device according to claim 2, characterized in that: The base (501) is provided with a guide groove (5011), and the two groups of guide blocks (503) are slidably connected to the guide groove (5011).

4. A circuit board immersion gold sandblasting device according to claim 3, characterized in that: The movable plate (504) is provided with two groups of oblique grooves (5041), and pins (5042) are arranged in the oblique grooves (5041). The pins (5042) are fixedly installed in the guide block (503).

5. The circuit board immersion gold sandblasting device according to claim 4, characterized in that: A guide plate (201) is provided between the two groups of transmission shafts (2), and an outer ring of the guide plate (201) is provided with an inclined surface (2011) and a step (2012).

6. A circuit board immersion gold sandblasting device according to claim 5, characterized in that: A roller (5051) is rotatably mounted on the lower end of the movable column (505), and the roller (5051) is rollingly connected to the outer ring of the guide plate (201).

7. A circuit board immersion gold sandblasting device according to claim 6, characterized in that: A material turning mechanism (7) is also provided below the frame (1), and the material turning mechanism (7) comprises a material unloading frame (701), and the upper end of the material unloading frame (701) is fixedly connected to the frame (1); A limiting cover (703) fixedly mounted on the unloading rack (701); A fan-shaped block (704) is rotatably mounted at the lower end of the unloading frame (701), and a plurality of groups of rollers (702) are rotatably mounted inside the unloading frame (701).

8. The circuit board immersion gold sandblasting device according to claim 7, characterized in that: The fan-shaped block (704) is provided with a stopper (7041) for blocking the circuit board, and the conveyor belt (8) is located below the lower end of the unloading rack (701).

9. A method for immersion gold blasting of a circuit board as claimed in any one of claims 1 to 8, characterized in that: The method comprises the following steps: Step 1: placing the circuit board to be sandblasted on a set of empty discharge components (5); Step 2: The transmission shaft (2) is driven by a motor to rotate, so that the plurality of feeding components (5) slowly move in a circular motion, and the feeding components (5) carrying the circuit boards are moved into the sandblasting mechanism (6), and the spray gun (604) on the sandblasting mechanism (6) is used to sandblast the slowly moving circuit boards; Step 3: While several groups of unloading components (5) are making circular motion, the staff continues to place the circuit boards to be sandblasted onto the next group of unloading components (5); Step 4: The circuit board after sandblasting in step 2 is transferred to the conveyor belt (8) below, and the circuit board is transferred to the next set of gold deposition process through the conveyor belt (8); Step 5: Perform immersion gold treatment on the circuit board.

10. The circuit board immersion gold sandblasting device according to claim 9, characterized in that: The circuit board after sandblasting in step 4 falls into the turning mechanism (7), the circuit board is turned over by the turning mechanism (7), and the turned circuit board is conveyed to the conveyor belt (8).

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