An alloy creep test apparatus and method

Abstract

The application discloses an alloy creep test testing device and method, relates to the field of metal creep test, and comprises a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control end and a cooling system. The control end controls the loading device to load stress on an alloy sample according to a set loading condition, controls the electric heating system to heat the alloy sample, so that the alloy sample reaches a set temperature, and controls the digital image correlation system to collect surface images of the alloy sample under the set loading condition and the set temperature. The digital image correlation system determines strain field data of the alloy sample according to the surface images. When a set test time is reached or the alloy sample is broken, the control end controls the electric heating system to be disconnected, and the cooling system introduces inert gas into the vacuum chamber to cool the alloy sample. The cooled alloy sample is used for dislocation configuration analysis, and the application can realize synchronous measurement of local strain field and high-temperature creep real dislocation configuration of the alloy.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of metal creep testing, and in particular to an alloy creep test device and method. BACKGROUND

[0002] The advanced level of aero-engine and gas turbine development is an important symbol to measure the industrial level of a country. Nickel-based single crystal superalloy has become the key material of aero-engine single crystal turbine blade due to its excellent high-temperature strength and oxidation resistance. As the core hot end component, the turbine blade not only has to withstand extremely high temperature in actual service, but also has to withstand huge centrifugal load, so the nickel-based single crystal alloy will experience high-temperature creep and fatigue damage during service. Effective evaluation of high-temperature creep and fatigue damage has important reference value for the reliability and service life of the turbine blade.

[0003] The complex structure of the turbine blade (such as the film hole, impact hole, rib plate, spoiler column, etc.) is easy to produce local stress concentration, which is the weak link of the service failure of the single crystal turbine blade. Studying the stress field distribution, dislocation organization evolution and related high-temperature mechanical behavior of the nickel-based single crystal superalloy in the stress concentration area during service can better clarify the failure mechanism of the single crystal turbine blade under the stress concentration condition of the complex structure, which has important significance for improving the fatigue life and creep resistance of the turbine blade and is an important link to improve the service safety of the blade. Through fine design of the complex cooling structure of the turbine blade, the stress concentration level can be effectively reduced, the risk of blade failure can be reduced, the service life of the blade can be improved, and the service safety of the blade can be improved.

[0004] When the nickel-based single crystal superalloy is subjected to high-temperature creep test, the sample is tested at a constant temperature and stress to observe the deformation behavior of the alloy under long-term loading condition. Dislocation analysis and creep strain analysis are important means to analyze the plastic deformation mechanism. However, the samples obtained by researchers using the traditional creep method have the following shortcomings.

[0005] (1) The dislocation analysis lacks sufficient authenticity. When the high-temperature testing machine stops heating, the sample will gradually cool to room temperature, which usually lasts for several hours or even ten hours. During the cooling process, the stress remains unchanged, which causes the dislocations to have enough time to diffuse and recover, resulting in inconsistent dislocation motion behavior of the sample with the tested dislocation behavior at high temperature. In this case, the accuracy of the test results for evaluating the long-term high-temperature low-stress service of the material may be affected. Because under high-temperature loading condition, the motion behavior of dislocations is affected by temperature and stress. When the sample cools down, the temperature decreases, which causes the sample to shrink and thus the stress to suddenly increase, resulting in new dislocation motion behavior and causing the dislocations to redistribute in the alloy. The original dislocation configuration at high temperature may not be able to be replicated and preserved after cooling, affecting the subsequent dislocation analysis of the alloy.

[0006] (2) Creep strain analysis is limited. In the conventional creep test method for nickel-based high-temperature single crystal alloy creep test, the obtained strain test results are usually the average values of the entire specimen gauge length, and the local specimen transmission electron microscope image is usually used to represent the overall plastic deformation behavior. This may be effective in the evaluation of homogeneous materials, but for specimens with special cooling structures such as air film holes, impact holes, rib plates, and turbulence columns, this average value may not accurately reflect the true plastic strain behavior of the local area. Near the air film hole, impact hole, rib plate, and turbulence column area, stress concentration phenomenon occurs in the material, which leads to more active dislocation activity in these parts. Some areas may have more dislocation slip due to high stress, while other areas may be relatively stable. In materials containing defects or irregular structures, microstructure changes such as dislocation aggregation or recrystallization phenomenon occur in different ways in different areas. Under creep or other long-term load conditions, local areas may be the starting point of failure. When the local stress exceeds the carrying capacity of the material in that area, it may lead to early failure, and this premature failure cannot be reflected by the overall strain value. If only the overall is concerned, the behavior of these high stress areas may be ignored, and the creep strain data obtained may not accurately reflect the performance of the material under actual working conditions, making it difficult to accurately predict the life and failure mode of the material in a high-temperature environment, which may lead to early failure or safety hazards.

[0007] In summary, the conventional creep test cannot replicate the true dislocation configuration under high-temperature creep conditions of nickel-based single crystal high-temperature alloys, and it is difficult to accurately measure the creep strain of local areas of specimens with special structures such as air film holes, impact holes, rib plates, and turbulence columns, and it cannot accurately reflect the performance of single crystal blades under actual working conditions. SUMMARY

[0008] The purpose of the present application is to provide an alloy creep test device and method that can simultaneously measure the local strain field of the alloy and the true dislocation configuration under high-temperature creep.

[0009] To achieve the above-mentioned purpose, the present application provides the following solutions:

[0010] In a first aspect, the present application provides an alloy creep test device, comprising: a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control end, and a cooling system.

[0011] The loading device and the alloy specimen are arranged in the vacuum chamber; the digital image correlation system, the loading device, and the electric heating system are connected to the control end; and the electric heating system is connected to the vacuum chamber.

[0012] The control terminal is configured to control the loading device to load stress on the alloy sample according to a set loading condition, control the electric heating system to heat the alloy sample to a set temperature, and control the digital image correlation system to collect surface images of the alloy sample under the set loading condition and the set temperature.

[0013] The digital image correlation system is configured to collect surface images of the alloy sample under the set loading condition and the set temperature, and determine strain field data of the alloy sample according to the surface images, wherein the strain field data is used to represent the creep behavior of the alloy sample.

[0014] The control terminal is further configured to control the electric heating system to be disconnected when a set test time is reached or the alloy sample is broken.

[0015] The cooling system is configured to introduce inert gas into the vacuum chamber to cool the alloy sample after the electric heating system is disconnected, and the cooled alloy sample is used for dislocation configuration analysis.

[0016] Optionally, the alloy creep test device further comprises a temperature measuring device, wherein the temperature measuring device is configured to monitor temperature changes of the alloy sample in real time.

[0017] Optionally, the cooling system comprises a gas pump and a vacuum pump, wherein the gas pump is connected to an inlet of the vacuum chamber, and the vacuum pump is connected to an outlet of the vacuum chamber, the gas pump is configured to introduce inert gas into the vacuum chamber after the electric heating system is disconnected, and the vacuum pump is configured to extract the inert gas in the vacuum chamber after the alloy sample is cooled.

[0018] Optionally, the digital image correlation system comprises a microscope imaging system and an image acquisition terminal, wherein the microscope imaging system is connected to the image acquisition terminal, the microscope imaging system is configured to collect surface images of the alloy sample under the set loading condition and the set temperature, and the image acquisition terminal is configured to determine the strain field data of the alloy sample according to the surface images.

[0019] Optionally, the electric heating system is a current control heating system based on the principle of resistance heating.

[0020] Optionally, the loading condition comprises a loading stress value, a loading duration and a loading rate.

[0021] Optionally, the temperature measuring device comprises an infrared temperature measuring instrument.

[0022] Optionally, the inert gas is argon.

[0023] In a second aspect, the present application provides an alloy creep test method, which is used in the alloy creep test device, and the alloy creep test method comprises the following steps:

[0024] controlling the loading device to load stress on the alloy sample according to the set loading condition;

[0025] controlling the electric heating system to heat the alloy sample to reach the set temperature;

[0026] controlling the digital image correlation system to collect surface images of the alloy sample under the set loading condition and the set temperature; the surface images are used to determine strain field data of the alloy sample; and the strain field data are used to represent the creep behavior of the alloy sample;

[0027] when the set test time is reached or the alloy sample is broken, controlling the electric heating system to be disconnected;

[0028] after the electric heating system is disconnected, controlling the cooling system to introduce inert gas into the vacuum chamber to cool the alloy sample; and the cooled alloy sample is used for dislocation configuration analysis.

[0029] Optionally, the alloy creep test method further comprises the following steps:

[0030] real-time acquiring temperature change of the alloy sample.

[0031] According to the specific embodiments provided by the present application, the present application has the following technical effects:

[0032] The present application provides an alloy creep test device and method, which collects surface images of the alloy sample under the set loading condition and the set temperature through a digital image correlation (DIC) system, and determines strain field data of the alloy sample according to the surface images, so as to capture local plastic deformation of the alloy in real time under a high-temperature environment and acquire high-resolution local area strain field data; and the alloy is rapidly cooled through the electric heating system and the cooling system, compared with the natural cooling method, which can reduce distortion caused by dislocation re-movement in the cooling process, so as to better preserve the real dislocation configuration of high-temperature creep. The present application realizes synchronous measurement of local strain field of the alloy and the real dislocation configuration of high-temperature creep. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained based on these drawings without creative labor.

[0034] Figure 1 A structural diagram of an alloy creep test testing device provided by an embodiment of the present application is shown in the figure.

[0035] Figure 2 A creep test testing result schematic diagram of the embodiment of the present application is shown in the figure.

[0036] Figure 3 A traditional creep test testing result schematic diagram is shown in the figure.

[0037] The figure shows the following: an electric heating system 1, a vacuum chamber 2, a control end 3, a temperature measuring device 4, a gas pump 5, a vacuum pump 6, a microscope imaging system 7, and an image acquisition end 8. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0040] In view of the problems existing in the conventional creep test, a new type of nickel-based single crystal high-temperature alloy creep test device is urgently needed, which can completely retain the real dislocation configuration under high-temperature creep conditions, realize the creep strain characterization of local special structure, and further clarify the dislocation deformation mechanism and improve the authenticity of service safety evaluation.

[0041] The present application builds a new creep test platform by combining digital image correlation (DIC) technology, resistance heating technology and inert gas (such as argon) rapid gas cooling technology to solve the above problems. The DIC technology can capture the local plastic deformation of the single crystal alloy in real time under high temperature environment and obtain high-resolution local area strain field data. The resistance heating technology and the inert gas rapid gas cooling technology realize rapid cooling and preserve the high-temperature creep dislocation configuration. The test scheme designed by the present application can realize synchronous local strain field measurement and complete preservation of high-temperature creep dislocation configuration. In the creep test, the DIC technology is used to realize local strain field measurement; after the test of the creep testing machine is completed, the resistance heating technology is used to couple the inert gas rapid gas cooling technology to cool the sample to room temperature quickly, so as to preserve the real dislocation configuration under the high-temperature creep loading condition. The present application plays an important role in optimizing alloy design, clarifying alloy failure mechanism, promoting the development of new alloys and fine structure design.

[0042] In one exemplary embodiment, as shown in Figure 1 An alloy creep test device is provided, comprising: a digital image correlation system, an electric heating system 1, a vacuum chamber 2, a loading device, a control end 3 and a cooling system.

[0043] The loading device and the alloy sample are arranged in the vacuum chamber 2; the digital image correlation system, the loading device and the electric heating system 1 are connected with the control end 3; and the electric heating system 1 is connected with the vacuum chamber 2.

[0044] The control end 3 is used to control the loading device to load stress on the alloy sample according to the set loading condition, control the electric heating system 1 to heat the alloy sample so that the alloy sample reaches the set temperature, and control the digital image correlation system to collect the surface image of the alloy sample under the set loading condition and the set temperature. The loading condition includes: loading stress value, loading duration and loading rate.

[0045] The digital image correlation system is used to collect the surface image of the alloy sample under the set loading condition and the set temperature, and determine the strain field data of the alloy sample according to the surface image; and the strain field data is used to represent the creep behavior of the alloy sample.

[0046] The control end 3 is also used to control the electric heating system 1 to be disconnected when the set test time is reached or the alloy sample is broken.

[0047] The cooling system is used to introduce inert gas into the vacuum chamber 2 to cool the alloy sample after the electric heating system 1 is disconnected; and the cooled alloy sample is used for dislocation configuration analysis. The inert gas can be argon.

[0048] In another exemplary embodiment of the present application, still referring to Figure 1 The alloy creep test testing device further comprises a temperature measuring device 4, which is used to monitor the temperature change of the alloy sample in real time. The temperature measuring device 4 comprises an infrared thermometer.

[0049] In another exemplary embodiment of the present application, still referring to Figure 1 The cooling system comprises an air pump 5 and a vacuum pump 6. The air pump 5 is connected to the inlet of the vacuum chamber 2, and the vacuum pump 6 is connected to the outlet of the vacuum chamber 2. The air pump 5 is used to introduce inert gas into the vacuum chamber 2 after the electric heating system 1 is turned off. The vacuum pump 6 is used to extract the inert gas in the vacuum chamber 2 after the alloy sample is cooled.

[0050] In another exemplary embodiment of the present application, still referring to Figure 1 The digital image correlation system comprises a microscope imaging system 7 and an image acquisition end 8. The microscope imaging system 7 is connected to the image acquisition end 8. The microscope imaging system 7 is used to collect the surface image of the alloy sample under the set loading condition and the set temperature. The image acquisition end 8 is used to determine the strain field data of the alloy sample according to the surface image. The microscope imaging system 7 can be a microscope CCD.

[0051] In another exemplary embodiment of the present application, the electric heating system 1 is a current control heating system based on the principle of resistance heating. In actual application, the heating current of the electric heating system 1 is usually controlled between several amperes and several tens of amperes, which is determined according to the size of the sample and the test stability. For example, for small samples or lower temperature tests, the heating current of the electric heating system 1 can be about 5 to 20 amperes. For large samples or higher temperature (such as more than 1000℃) tests, the heating current of the electric heating system 1 needs to be about 20 to 100 amperes.

[0052] The following takes a nickel-based single crystal alloy sample as an example to further describe a test process of the alloy creep test testing device and illustrate the effectiveness of the present embodiment.

[0053] The present embodiment can synchronously realize the measurement of local strain field and complete reservation of high temperature creep dislocation configuration. The specific steps are as follows:

[0054] Step 1: Use the Bridgman method to prepare a nickel-based single crystal alloy sample, and perform solid solution treatment and aging treatment on the sample. Use sandpaper to perform surface treatment so that the surface has characteristics suitable for shooting by a digital image correlation (DIC) system.

[0055] Step 2: Configure the high-temperature creep test equipment, place the processed nickel-based single crystal alloy sample in the vacuum chamber 2, and install the digital image correlation system, the electric heating system 1, the air pump 5, the vacuum pump 6, the loading device, and the control end 3 for real-time monitoring of the images required by the DIC system and realizing the ventilation rapid cooling.

[0056] Step 3: The control end 3 sets the loading conditions, determines the loading stress, temperature, and duration of the creep experiment, sets the loading rate and the desired creep conditions.

[0057] Step 4: Start the creep test and the DIC system, and take real-time images of the sample surface. Analyze the displacement and strain of the sample through DIC technology, obtain strain field data under high temperature and loading conditions, and record the creep behavior of the sample in real time. In this embodiment, DIC technology is applied to the creep testing machine to obtain strain field data.

[0058] Step 5: When the sample reaches the set test time or breaks, stop loading and end the creep test.

[0059] Step 6: Quickly disconnect the power (i.e., disconnect the electric heating system 1) to achieve rapid cooling. The electric heating system 1 uses resistance heating principle to ensure quick disconnection of the power.

[0060] Step 7: Introduce inert gas (such as argon) into the vacuum chamber 2 to further achieve rapid cooling.

[0061] Step 8: Use an infrared temperature measuring instrument to monitor the temperature change of the sample to ensure that thermal stress problems caused by sudden temperature drop are avoided during the cooling process.

[0062] Step 9: After the sample is cooled to ambient temperature, open the vacuum chamber 2 and take out the sample.

[0063] Step 10: Perform subsequent analysis and dislocation configuration observation on the cooled sample. Summarize the data recorded by DIC technology and the observation results, and analyze the relationship between the creep behavior and the microstructure change.

[0064] The rapid cooling technology used in this embodiment effectively avoids the redistribution of dislocations that may occur during natural cooling after high-temperature creep of nickel-based single crystal superalloys, thereby better preserving the real dislocation motion behavior and dislocation configuration at high temperature and effectively avoiding distortion of dislocations; DIC technology, inert gas rapid cooling technology, and resistance heating technology are combined and applied to the creep test, forming a new test method that is multipurpose, has high dislocation preservation, and meets the needs of local testing.

[0065] The creep test results of the embodiment of the present application are as follows Figure 2As shown, the dislocation movement in the γ channel is still clearly visible (shown in the red circle), and the dislocation network arrangement in the channel is clearly visible (shown in the blue circle), and the complete copy retains the real dislocation movement behavior dislocation configuration.

[0066] The conventional creep test results are shown in FIG. 1. Figure 3 As shown, the shrinkage of the sample during the cooling process leads to stress increase, and the dislocations under the action of high stress produce obvious interaction, a large number of cutting into γ' strengthening phase (shown in the blue circle), and the dislocation network in the channel is twisted under the action of stress (shown in the red circle).

[0067] At present, nickel-based single crystal superalloys are widely used in turbine blades of aero-engine and gas turbine. Retaining the high-temperature dislocation configuration of nickel-based single crystal superalloys, in-depth analysis of the creep plastic deformation behavior and dislocation movement behavior of nickel-based single crystal alloys facilitates optimization of alloy composition design and improvement of fine structure design, so as to improve the high-temperature creep resistance and service safety. The present application can also be used for research and analysis of other metal materials, increase the application potential of metal structural materials in various industries, and provide a test method for evaluating the performance retention rate and failure mode during long-term high-temperature use. With the increasing demand for the thrust-to-weight ratio of aero-engines, the performance requirements of nickel-based single crystal alloys for single crystal turbine blades for new-generation aero-engines are becoming higher and higher. The performance optimization of nickel-based single crystal superalloys will provide important theoretical guidance and practical data for the design and manufacture of these high-performance engines, thereby promoting the development of advanced aero-engines.

[0068] Based on the same inventive concept, the embodiments of the present application also provide an alloy creep test testing method for the alloy creep test testing device described above. The implementation scheme for solving the problem provided by the method is similar to the implementation scheme described in the above device, so the specific limitations in one or more alloy creep test testing method embodiments provided below can refer to the limitations of the alloy creep test testing device in the above, which will not be repeated here.

[0069] In one exemplary embodiment, an alloy creep test testing method is provided, which is used in the alloy creep test testing device described above, and the alloy creep test testing method comprises:

[0070] (1) controlling the loading device to load stress on the alloy sample according to the set loading condition; controlling the electric heating system 1 to heat the alloy sample, so that the alloy sample reaches the set temperature; controlling the digital image correlation system to collect the surface image of the alloy sample under the set loading condition and the set temperature; the surface image is used to determine the strain field data of the alloy sample; and the strain field data is used to characterize the creep behavior of the alloy sample.

[0071] (2) when a set test time is reached or the alloy sample is broken, the electric heating system 1 is controlled to be turned off; after the electric heating system 1 is turned off, the cooling system is controlled to introduce inert gas into the vacuum chamber 2 to cool the alloy sample; and the cooled alloy sample is used for dislocation configuration analysis.

[0072] As an optional implementation, the alloy creep test testing method further comprises: acquiring the temperature change of the alloy sample in real time.

[0073] The alloy creep test testing device and method of the present application have significant progress in observing the behavior of alloys (such as nickel-based single crystal superalloys) at high temperatures compared to the prior art. Through DIC technology and rapid cooling technology, the limitations of traditional creep testing machines in high-temperature testing are overcome. The DIC technology is used to realize the accurate measurement of continuous data of real-time local strain and displacement distribution of single crystal alloys at high temperatures. This non-contact measurement method can reveal the local effects of special structure samples under complex loading conditions and provide more accurate stress and strain information. After the testing machine is powered off, the sample is rapidly cooled by introducing inert gas (such as argon) into the vacuum chamber 2, which helps to preserve the real dislocation configuration under high-temperature creep. Compared to the traditional natural cooling method, such technology can reduce the distortion caused by the re-movement of dislocations during the cooling process, thereby better preserving the creep dislocation configuration under high-temperature conditions. The present application plays an important role in clarifying dislocation-related creep failure mechanisms, optimizing alloy design, and refining structure design.

[0074] The technical features of the above embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present application.

[0075] The principles and implementation modes of the present application are described by using specific examples in this paper, and the above embodiments are only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed. In conclusion, the content of the present application should not be understood as a limitation.

Claims

1. An alloy creep test device, characterized in that: The alloy creep test device includes: a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control terminal and a cooling system; The loading device and the alloy sample are arranged in the vacuum chamber; the digital image correlation system, the loading device and the electric heating system are all connected to the control end; the electric heating system is connected to the vacuum chamber; The control end is used to control the loading device to apply stress to the alloy sample according to the set loading conditions, control the electric heating system to heat the alloy sample so that the alloy sample reaches a set temperature, and control the digital image correlation system to capture a surface image of the alloy sample under the set loading conditions and the set temperature; The digital image correlation system is used to collect a surface image of the alloy sample under a set loading condition and a set temperature, and to determine strain field data of the alloy sample based on the surface image; the strain field data is used to characterize the creep behavior of the alloy sample; The control end is also used to control the electric heating system to be disconnected when the set test time is reached or the alloy sample is broken; The cooling system is used to introduce inert gas into the vacuum chamber to cool the alloy sample after the electric heating system is disconnected; the cooled alloy sample is used for dislocation configuration analysis.

2. The alloy creep test device according to claim 1, characterized in that: The alloy creep test device further comprises: a temperature measuring device; the temperature measuring device is used to monitor the temperature change of the alloy sample in real time.

3. The alloy creep test device according to claim 1, characterized in that: The cooling system includes: an air pump and a vacuum pump; the air pump is connected to the inlet of the vacuum chamber; the vacuum pump is connected to the outlet of the vacuum chamber; the air pump is used to introduce inert gas into the vacuum chamber after the electric heating system is disconnected; the vacuum pump is used to extract the inert gas in the vacuum chamber after the alloy sample is cooled.

4. The alloy creep test device according to claim 1, characterized in that: The digital image correlation system includes: a microscope imaging system and an image acquisition end; the microscope imaging system is connected to the image acquisition end; the microscope imaging system is used to acquire a surface image of the alloy sample under set loading conditions and set temperature; the image acquisition end is used to determine the strain field data of the alloy sample based on the surface image.

5. The alloy creep test device according to claim 1, characterized in that: The electric heating system is a current-controlled heating system based on the resistance heating principle.

6. The alloy creep test device according to claim 1, characterized in that: The loading conditions include: loading stress value, loading duration and loading rate.

7. The alloy creep test device according to claim 2, characterized in that: The temperature measuring device includes an infrared thermometer.

8. The alloy creep test device according to claim 1, characterized in that: The inert gas is argon.

9. A creep test method for an alloy, characterized in that: The alloy creep test method is used in the alloy creep test device according to any one of claims 1 to 8, and the alloy creep test method comprises: Controlling the loading device to apply stress to the alloy sample according to the set loading conditions; controlling the electric heating system to heat the alloy sample so that the alloy sample reaches a set temperature; controlling a digital image correlation system to acquire a surface image of the alloy sample under a set loading condition and a set temperature; the surface image is used to determine strain field data of the alloy sample; the strain field data is used to characterize the creep behavior of the alloy sample; When the set test time is reached or the alloy sample is broken, the electric heating system is controlled to be disconnected; After the electric heating system is disconnected, the cooling system is controlled to introduce inert gas into the vacuum chamber to cool the alloy sample; the cooled alloy sample is used for dislocation configuration analysis.

10. The alloy creep test method according to claim 9, characterized in that: The alloy creep test method also includes: The temperature change of the alloy sample is obtained in real time.

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