Automatic chip testing device

Abstract

The invention relates to an automatic chip testing device, and relates to the technical field of chip testing, the automatic chip testing device comprises a side edge supporting mechanism, the side edge supporting mechanism comprises a supporting mechanism and a turnover clamping mechanism, and the clamping parts of the supporting mechanism and the turnover clamping mechanism are adjustable. The test chip can be stably clamped under the combined action of the supporting mechanism and the turnover clamping mechanism, when the back face of the test chip needs to be subjected to turnover detection, only the clamping part of the supporting mechanism needs to be moved away from the test chip, the turnover clamping mechanism is clamped in the middle of the test chip, and the test chip can be subjected to turnover detection. According to the technical scheme, the test chip is stably clamped through the clamping mechanism, then the test chip is overturned through the overturning clamping mechanism, after overturning, the supporting mechanism is clamped on the test chip again, automatic overturning of the test chip is achieved, and therefore the problem that in the prior art, the test chip cannot be overturned easily is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to an automatic chip testing device. Background Art

[0002] Chip automated testing is a vital part of the integrated circuit industry. In order to improve testing efficiency and reduce testing costs, manual testing is eliminated and a more efficient testing process is obtained.

[0003] For example, in the patent document with application number 202322999927.8, a chip automatic testing device is disclosed, and it is specifically disclosed that a plurality of workstations are arranged on the rotating disk to realize chip loading and testing. At the same time, a pushing mechanism is arranged on the test station of the rotating disk to push the workpiece out, thereby realizing automatic unloading of the workpiece.

[0004] In the above technical scheme, since the chip test is not limited to single-sided testing, certain test results also need to be obtained for the back side of the chip. Therefore, there is no space for flipping the chip in the above technical scheme, which requires setting up two sets of test equipment to realize the chip test function, resulting in an increase in test costs and affected test accuracy. Summary of the invention

[0005] The purpose of the present invention is to provide a chip automatic testing device.

[0006] The technical problem solved by the present invention is to solve the problem in the prior art that the chip cannot be turned over during the disc-shaped loading detection of the chip.

[0007] The present invention can be implemented through the following technical scheme: a chip automatic testing device includes a side support mechanism for supporting a test chip, the side support mechanism includes a support mechanism for supporting and clamping the test chip and a flip clamping mechanism for flipping the test chip, and the clamping parts of the support mechanism and the flip clamping mechanism are adjustable.

[0008] A further technical improvement of the present invention is that the flip clamping assembly includes a second supporting clamping plate, the second supporting clamping plate is fixedly mounted on the internal rotating shaft, and the internal rotating shaft is mounted on the output end of the internal motor.

[0009] A further technical improvement of the present invention is that the internal motor is fixedly mounted on the second support base, and the second support base is fixedly mounted on the output end of the second support telescopic rod.

[0010] A further technical improvement of the present invention is that the supporting mechanism includes a first supporting splint, the first supporting splint is fixedly mounted on the output end of the first supporting telescopic rod, and the first supporting telescopic rod and the second supporting telescopic rod are respectively fixedly mounted on supporting side plates, and the supporting side plates are fixedly mounted on the output end of the supporting telescopic rod.

[0011] A further technical improvement of the present invention is that it also includes a loading and unloading mechanism, which includes a loading and unloading telescopic rod, and an loading and unloading support plate is fixedly installed on the output end of the loading and unloading telescopic rod, and a loading clamping assembly for loading the test chip and a unloading clamping assembly for unloading the test chip are respectively installed on the loading and unloading support plate.

[0012] A further technical improvement of the present invention is that it also includes a bottom stabilizing suction cup for adsorbing and fixing the bottom of the test chip, the bottom stabilizing suction cup is fixedly installed at the output end of the bottom stabilizing telescopic rod, and the bottom stabilizing telescopic rod can move laterally.

[0013] A further technical improvement of the present invention is that the second supporting clamping plate comprises a clamping base, a clamping groove for clamping the test chip is provided on the clamping base, and a clamping slide plate is slidably arranged inside the clamping groove via a clamping spring.

[0014] A further technical improvement of the present invention is that a clamping groove for contacting the test chip is provided on the clamping slide plate, and the clamping slide plate is made of metal.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The present application utilizes a support mechanism for clamping the test chip and a flip clamping mechanism for flipping the test chip. When in use, the support mechanism and the flip clamping mechanism work together to achieve a stable clamping of the test chip. When it is necessary to flip the back of the test chip for detection, it is only necessary to move the clamping part of the support mechanism away from the test chip and clamp the flip clamping mechanism in the middle position of the test chip to achieve stable clamping of the test chip. The flip clamping mechanism is then used to flip the test chip. After flipping, the support mechanism is re-clamped on the test chip to achieve automatic flipping of the test chip, thereby solving the problem in the prior art that the test chip cannot be easily flipped.

[0016] 2. The present application utilizes a loading and unloading mechanism to move the test chip upward to the side support mechanism to realize the loading of the test chip, and then utilizes the loading and unloading mechanism to control the unloading of the test chip on the side support mechanism after the test is completed. During this process, the loading and unloading mechanism and the side support mechanism can maintain automatic loading and unloading and automatic testing of the test chip, thereby ensuring the testing efficiency of the test chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the position of the side support mechanism of the present invention; Figure 2 It is a schematic diagram of the structure of the side support mechanism of the present invention; Figure 3 It is a schematic diagram of the structure of the loading and unloading mechanism of the present invention; Figure 4 It is a schematic diagram of the bottom support mechanism structure of the present invention; Figure 5 It is a schematic diagram of the first supporting splint structure of the present invention; Figure 6 It is a schematic diagram of the positions of the clamping block and the clamping slot of the present invention.

[0019] In the figure: 1. Loading and unloading mechanism; 2. Bottom support mechanism; 3. Side support mechanism; 4. Test chip; 5. First support clamping plate; 6. First support telescopic rod; 7. Second support telescopic rod; 8. Second support base; 9. Internal rotating shaft; 10. Second support clamping plate; 11. Loading and unloading clamping plate; 12. Loading and unloading clamping telescopic rod; 13. Unloading clamping assembly; 14. Loading and unloading support plate; 15. Loading and unloading telescopic rod; 16. Loading clamping assembly; 17. Support telescopic rod; 18. Support side panel; 19. Support assembly; 20. Bottom stabilizing suction cup; 21. Bottom stabilizing telescopic rod; 22. Clamping base; 23. Clamping spring; 24. Clamping slide; 25. First induction sensor; 26. Second induction sensor; 27. Clamping groove; 28. Clamping slide; 29. ​​Clamping slide; 30. Micro cylinder; 31. Clamping block; 32. Mounting groove; 33. Clamping groove; 34. Clamping groove. DETAILED DESCRIPTION

[0020] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation mode, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0021] See also Figure 1-6 As shown, the chip automatic testing device includes a loading and unloading mechanism 1 for realizing loading and unloading of the test chip 4, and a side supporting mechanism 3 arranged between the loading and unloading mechanism 1, that is, when in use, the loading and unloading mechanism 1 is utilized to move the test chip 4 upward to the side supporting mechanism 3 to realize the loading of the test chip 4, and then after the test is completed, the loading and unloading mechanism 1 is utilized to control the unloading of the test chip 4 on the side supporting mechanism 3. In this process, the loading and unloading mechanism 1 and the side supporting mechanism 3 can maintain automatic loading and unloading and automatic testing of the test chip 4, thereby ensuring the testing efficiency of the test chip 4.

[0022] As a further embodiment of the present application, the side support mechanism 3 includes a flipping assembly for adjusting the position of the test chip 4, and a bottom support mechanism 2 is also provided for supporting the bottom of the test chip 4, that is, when testing the test chip 4, the test chip 4 is stably placed by utilizing the bottom support mechanism 2, and then the position of the flipping assembly is adjusted by the side support mechanism 3 to ensure that the flipping assembly is clamped at the center position of the test chip 4, and then the bottom support mechanism 2 releases the clamping function of the test chip 4, and the flipping function of the test chip 4 is realized by utilizing the flipping assembly.

[0023] Specifically, the loading and unloading mechanism 1 includes a loading and unloading telescopic rod 15, wherein the output end of the loading and unloading telescopic rod 15 is fixedly installed with a loading and unloading support plate 14, wherein the two ends of the loading and unloading support plate 14 are respectively provided with a loading clamping assembly 16 and a unloading clamping assembly 13, wherein the heights of the loading clamping assembly 16 and the unloading clamping assembly 13 are different, and when in use, when the loading and unloading telescopic rod 15 is started, the loading and unloading support plate 14 is driven to adjust the height in the longitudinal direction, thereby adjusting the heights of the loading clamping assembly 16 and the unloading clamping assembly 13, and when the loading clamping assembly 16 reaches the bottom, the loading clamping assembly 16 is used to achieve For the loading function of the test chip 4, at this time, the unloading clamping component 13 contacts the side support mechanism 3, and clamps the test chip 4 after the test is completed. Then, by starting the loading and unloading telescopic rod 15, the loading clamping component 16 and the unloading clamping component 13 reach the highest point respectively. At this time, the test chip 4 on the loading clamping component 16 is contacted and received by the side support mechanism 3, and the test chip 4 on the unloading clamping component 13 is unloaded. In this process, automatic loading and unloading processing of the test chip 4 can be realized, avoiding the problem of insufficient space for flipping the test chip 4 due to the disc-shaped testing process.

[0024] Therefore, the structures of the loading and unloading clamping assembly 16 and the unloading and unloading clamping assembly 13 in the present application are the same. Taking the loading and unloading clamping assembly 16 as an example, the loading and unloading clamping assembly 16 includes a loading and unloading clamping telescopic rod 12, wherein the loading and unloading clamping telescopic rod 12 is fixedly mounted on the loading and unloading support plate 14, and an loading and unloading clamping plate 11 is fixedly mounted on the output end of the loading and unloading clamping telescopic rod 12. When in use, the lateral position of the loading and unloading clamping plate 11 is controlled by starting the loading and unloading clamping telescopic rod 12, and the relative movement of the two relatively arranged loading and unloading clamping plates 11 is utilized to realize the clamping function of the test chip 4, and the reverse movement of the two loading and unloading clamping plates 11 is utilized to realize the un-clamping function of the test chip 4.

[0025] Furthermore, the side support mechanism 3 includes a support mechanism and a flipping mechanism, wherein the support mechanism and the flipping mechanism are both fixedly mounted on the support side plate 18, wherein the support side plate 18 is fixedly mounted on the output end of the support telescopic rod 17. When in use, the position of the support side plate 18 is controlled by starting the support telescopic rod 17, and the positions of the support mechanism and the flipping mechanism are adjusted, so as to facilitate the use of the joint action of the support mechanism and the flipping mechanism to realize the clamping and fixing function of the test chip 4, and when the test chip 4 is flipped, the position of the support mechanism is adjusted so that the support mechanism is away from the position of the test chip 4, and only the flipping mechanism is applied to the test chip 4, and the flipping mechanism is used to realize the flipping of the test chip 4, and after flipping, the support mechanism is used to act on the test chip 4 to realize the clamping function of the test chip 4 to ensure the stable placement of the test chip 4.

[0026] The supporting mechanism includes a first supporting telescopic rod 6, wherein the first supporting telescopic rod 6 is fixedly mounted on a supporting side plate 18, wherein a first supporting clamping plate 5 is fixedly mounted on an output end of the first supporting telescopic rod 6, wherein the first supporting telescopic rod 6 can control the distance between the first supporting clamping plates 5, so that the clamping function of the test chip 4 is realized by clamping the first supporting clamping plate 5 on the side of the test chip 4.

[0027] The flipping mechanism includes a second supporting telescopic rod 7, wherein the second supporting telescopic rod 7 is fixedly mounted on the other side of the supporting side plate 18, wherein a second supporting base 8 is mounted on the output end of the second supporting telescopic rod 7, wherein an internal power chassis is mounted on the second supporting base 8, and the internal power chassis includes a power motor and a transmission device for driving the rotation of an internal rotating shaft 9, so the internal rotating shaft 9 is mounted on the output end of the internal power chassis, wherein a second supporting clamping plate 10 is fixedly mounted on the internal rotating shaft 9, and when in use, the rotation of the internal rotating shaft 9 drives the rotation of the second supporting clamping plate 10, so that the test chip 4 clamped on the second supporting clamping plate 10 can be directly flipped, thereby enabling the back side of the test chip 4 to be directly flipped.

[0028] In the above technical scheme, after the test chip 4 is loaded, the first support telescopic rod 6 and the second support telescopic rod 7 are started, so that the first support clamp 5 and the second support clamp 10 act on the side of the test chip 4 respectively to clamp the test chip 4 firmly. Then, after the clamping is completed, the support telescopic rod 17 is started to control the support side plate 18 to move laterally, so that the first support clamp 5 is away from the edge position of the test chip 4 until the second support clamp 10 is located in the middle position of the test chip 4. The clamping function of the test chip 4 is realized by the relative movement of the second support clamp 10, and then the power motor is used to drive the internal rotating shaft 9 to drive the second support clamp 10 to rotate relative to the second support base 8 until it rotates to 180 degrees. At this time, the support telescopic rod 17 is started to clamp the first support clamp 5 and the second support clamp 10 at both ends of the test chip 4 respectively to realize the clamping function of the test chip 4.

[0029] In the present application, in order to make the test chip 4 flip stably and reduce the damage caused by the sliding of the first support clamp 5 and the second support clamp 10 on the test chip 4, the present application also includes a bottom support mechanism 2, wherein the bottom support mechanism 2 includes a bottom stabilizing telescopic rod 21, wherein the end of the bottom stabilizing telescopic rod 21 is fixed with a bottom stabilizing suction cup 20. When in use, the bottom stabilizing telescopic rod 21 is moved to the bottom of the test chip 4 by moving the device horizontally, and the height of the bottom stabilizing suction cup 20 is controlled by starting the bottom stabilizing telescopic rod 21 until the bottom stabilizing suction cup 20 is adsorbed in the middle position of the test chip 4, thereby realizing the stabilization function of the test chip 4. In this process, the mobile device includes corresponding screw modules and other existing devices that can realize the lateral movement function.

[0030] In the present application, the structures of the loading and unloading clamping plate 11, the first supporting clamping plate 5 and the second supporting clamping plate 10 are the same. In the present application, the loading and unloading clamping plate 11 is taken as an example, that is, the loading and unloading clamping plate 11 includes a clamping base 22, wherein the clamping base 22 is provided with a clamping groove 33 for clamping and fixing the test chip 4, and a clamping slide groove 24 is also provided at the end of the clamping groove 33, wherein a clamping spring 23 is fixed inside the clamping slide groove 24, and a clamping slide rod 29 is slidably provided at the end of the clamping spring 23, wherein a clamping slide plate 28 for clamping and contacting the test chip 4 is provided at the end of the clamping slide rod 29, and the clamping slide rod 28 is located inside the clamping groove 33. In the present application, the test chip 4 first contacts the clamping slide plate 28, and at this time, pressure is applied to the clamping slide rod 29 until the clamping slide rod 29 is on the clamping slide The inside of the groove 24 slides to squeeze the clamping spring 23, and the elastic force applied by the clamping spring 23 is used to squeeze the test chip 4. When the test chip 4 causes vibration under the external environment, the clamping spring 23 can be used to buffer it, so as to avoid the corners of the test chip 4 hitting the frame with a large force and causing the test chip 4 to break. At the same time, a first induction sensor 25 and a second induction sensor 26 for sensing the position of the clamping slide plate 28 are also provided inside the clamping groove 33, so that the clamping position of the test chip 4 can be determined. When in use, the first induction sensor 25 is used to judge the clamping position of the test chip 4, and the second induction sensor 26 is used to judge the rebound force of the clamping spring 23, so as to ensure the clamping stability of the test chip 4.

[0031] In the present application, a clamping groove 27 for contacting the test chip 4 is provided at the end of the clamping slide 28, wherein the contact surface of the clamping slide 28 is made of metal, which can prevent the position movement of the test chip 4 during testing and ensure the test accuracy of the test chip 4.

[0032] When the position of the test chip 4 is precisely corrected, when the test chip 4 is clamped to a certain extent, the position of the clamping slide 28 is fixed, that is, a clamping groove 34 is opened on the clamping slide 28, and a mounting groove 32 is opened on the clamping base 22, and a micro cylinder 30 is fixed inside the mounting groove 32, wherein a clamping block 31 is fixed at the output end of the micro cylinder 30, and the clamping block 31 cooperates with the clamping groove 34. When in use, the micro cylinder 30 is started to control the clamping block 31 to move longitudinally until the clamping block 31 reaches the inside of the clamping groove 34, thereby limiting the position of the clamping slide 28 to ensure stable clamping while ensuring that the test chip 4 is in a stable position and will not hit the frame.

[0033] When the present invention is in use, the function of the loading clamping assembly 16 is firstly used to realize the clamping function of the test chip 4. At this time, the unloading clamping assembly 13 clamps the test chip 4 on the support assembly 19 after the test is completed. At this time, the loading and unloading telescopic rod 15 is started to control the loading clamping assembly 16 to reach the position of the support assembly 19 to realize the loading of the test chip 4. At this time, the unloading clamping assembly 13 moves the test chip 4 after the test upward until the test chip 4 is unloaded; In this process, the test chip 4 is tested by using the existing test equipment of the peripheral device. Specifically, the first supporting telescopic rod 6 and the second supporting telescopic rod 7 are started, so that the first supporting clamp plate 5 and the second supporting clamp plate 10 act on the sides of the test chip 4 respectively to clamp the test chip 4 firmly. Then, after the clamping and stabilization are completed, the bottom stabilizing telescopic rod 21 is first moved to the bottom of the test chip 4 by means of the horizontal moving device, and the height of the bottom stabilizing suction cup 20 is controlled by the start of the bottom stabilizing telescopic rod 21 until the bottom stabilizing suction cup 20 is adsorbed in the middle position of the test chip 4, thereby realizing the stabilization function of the test chip 4. The start of the supporting telescopic rod 17 is used to control The supporting side plate 18 is laterally moved so that the first supporting clamping plate 5 is away from the edge position of the test chip 4 until the second supporting clamping plate 10 is located in the middle position of the test chip 4. At this time, the adsorption effect of the bottom stabilizing suction cup 20 is released, and the second supporting clamping plate 10 is used to move toward each other to achieve the clamping function of the test chip 4. Then, the power motor is used to drive the internal rotating shaft 9 to drive the second supporting clamping plate 10 to rotate relative to the second supporting base 8 until it rotates to 180 degrees. At this time, the supporting telescopic rod 17 is started so that the first supporting clamping plate 5 and the second supporting clamping plate 10 are respectively clamped at the two ends of the test chip 4 to achieve the clamping and stabilizing function of the test chip 4; When the test chip 4 is clamped, the test chip 4 is clamped by the corresponding clamping assembly. At this time, the test chip 4 reaches the inside of the clamping groove 33, realizing the clamping function of the test chip 4. The micro cylinder 30 is used to start and control the clamping block 31 to move longitudinally until the clamping block 31 reaches the inside of the clamping groove 34, thereby limiting the clamping slide 28 to ensure stable clamping while ensuring the stable position of the test chip 4 and preventing it from hitting the frame.

[0034] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chip automated testing device, comprising a side support mechanism (3) for supporting a test chip (4), characterized in that: The side support mechanism (3) comprises a support mechanism for supporting and clamping the test chip (4) and a flip clamping mechanism for flipping the test chip (4), and the clamping positions of the support mechanism and the flip clamping mechanism are adjustable.

2. The chip automatic testing device according to claim 1, characterized in that: The flip clamping assembly comprises a second supporting clamping plate (10), wherein the second supporting clamping plate (10) is fixedly mounted on an internal rotating shaft (9), and the internal rotating shaft (9) is mounted on an output end of an internal motor.

3. The chip automatic testing device according to claim 2, characterized in that: The internal motor is fixedly mounted on a second support base (8), and the second support base (8) is fixedly mounted on an output end of the second support telescopic rod (7).

4. The chip automatic testing device according to claim 3, characterized in that: The support mechanism comprises a first support clamping plate (5), the first support clamping plate (5) being fixedly mounted on the output end of the first support telescopic rod (6), and the first support telescopic rod (6) and the second support telescopic rod (7) being fixedly mounted on support side plates (18) respectively, and the support side plates (18) being fixedly mounted on the output end of the support telescopic rod (17).

5. The chip automatic testing device according to claim 1, characterized in that: The invention also comprises a loading and unloading mechanism (1), wherein the loading and unloading mechanism (1) comprises a loading and unloading telescopic rod (15), an loading and unloading support plate (14) being fixedly mounted on the output end of the loading and unloading telescopic rod (15), and a loading and unloading clamping assembly (16) for loading the test chip (4) and a unloading clamping assembly (13) for unloading the test chip (4) being respectively mounted on the loading and unloading support plate (14).

6. The chip automatic testing device according to claim 1, characterized in that: It also includes a bottom stabilizing suction cup (20) for adsorbing and fixing the bottom of the test chip (4); the bottom stabilizing suction cup (20) is fixedly mounted on the output end of a bottom stabilizing telescopic rod (21), and the bottom stabilizing telescopic rod (21) can move laterally.

7. The chip automatic testing device according to claim 2, characterized in that: The second supporting clamping plate (10) comprises a clamping base (22), the clamping base (22) being provided with a clamping groove (33) for clamping the test chip (4), and a clamping slide plate (28) being slidably arranged inside the clamping groove (33) via a clamping spring (23).

8. The chip automatic testing device according to claim 7, characterized in that: The clamping slide plate (28) is provided with a clamping groove (27) for contacting the test chip (4), and the clamping slide plate (28) is made of metal.

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