Immersed liquid cooling system

Abstract

The embodiment of the invention provides an immersed liquid cooling system which comprises a case and an electrical device arranged in the case, and the case is internally provided with cooling liquid used for liquid cooling and heat dissipation of the electrical device; the fluid pump is located at the inner top of the case and used for pumping the low-temperature cooling liquid at the bottom of the case; the spraying pipeline is located in the machine box, one end of the spraying pipeline is connected with the fluid pump, the other end of the spraying pipeline extends to the position below the electrical device, and the spraying pipeline is used for conveying the low-temperature cooling liquid to the periphery of the immersed electrical device. The fluid pump and the spraying pipeline are arranged in the case, the fluid pump extracts low-temperature cooling liquid at the bottom of the case and conveys the low-temperature cooling liquid to the periphery of the immersed electrical device through the spraying pipeline, circulation of the cooling liquid around the immersed electrical device is accelerated, heat is more effectively taken away, and the heat exchange efficiency is improved; and uniform distribution of the cooling liquid in the system is ensured, electrical equipment is kept to operate at a relatively low working temperature, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of liquid cooling and heat dissipation, and in particular, to an immersion liquid cooling system. Background Art

[0002] As server computing power increases, server heat generation also increases dramatically, which places higher demands on server heat dissipation. Traditional air cooling can no longer meet high-intensity heat dissipation requirements, while liquid cooling has been widely used in server heat dissipation due to its high heat dissipation efficiency.

[0003] At present, immersion liquid cooling has been applied to high heat dissipation demand scenarios such as servers. The server is immersed in a chassis filled with coolant to directly exchange heat with the coolant to achieve heat dissipation. However, on the one hand, the overall immersion cooling method requires a large amount of coolant, and often requires the heating elements in the server to be arranged in a relatively concentrated manner. For scenarios where the heating elements are relatively dispersed, such as the heat dissipation of some edge computing devices, the layout cost is high and the use is inconvenient; on the other hand, the coolant in the current overall immersion cooling method mainly relies on the natural convection of the liquid to dissipate heat, and the liquid flow rate inside the chassis is very small. When the temperature of the coolant reaches a certain value, the heat exchange effect is significantly reduced. Summary of the invention

[0004] An immersion liquid cooling system is provided in an embodiment of the present application to solve the problems that the existing heat dissipation method mainly relies on natural convection heat dissipation of the liquid, the liquid flow rate inside the chassis is low, and the heat exchange effect is poor.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] An immersion liquid cooling system, comprising:

[0007] A chassis and an electrical device disposed in the chassis, wherein the chassis is provided with a coolant for liquid cooling and heat dissipation of the electrical device;

[0008] A fluid pump, located at the inner top of the chassis, for extracting low-temperature coolant from the bottom of the chassis;

[0009] A spray pipeline is located in the chassis, one end of which is connected to the fluid pump and the other end of which extends to the bottom of the electrical device, and is used to transport low-temperature coolant to the surroundings of the immersed electrical device.

[0010] Optionally, the spray pipeline includes:

[0011] A main spray line and a plurality of branch spray lines, wherein the main spray line is laid in a U shape along the circumference of the electrical device;

[0012] A nozzle is provided at the front end of any of the spray branches, and the spray branches are arranged in sequence on the main spray line.

[0013] Optionally, the main spray line and any one of the branch spray lines are connected via a one-to-two adapter.

[0014] Optionally, it also includes:

[0015] A heat dissipation element is located at the inner top of the chassis;

[0016] The liquid separation pipeline is located below the heat dissipation element and is connected to the tail end of the spray pipeline. The liquid separation pipeline has a plurality of nozzles for spraying the heat dissipation element.

[0017] Optionally, it also includes:

[0018] The filter element is located between the fluid pump and the spray pipeline and is used for filtering the low-temperature coolant.

[0019] Optionally, the filter element is a filter mesh.

[0020] Optionally, the spray pipeline is a universal fixed hose.

[0021] Optionally, the electrical device comprises a main board and a heating element located on the main board, and the heating element is immersed in a cooling liquid;

[0022] The spray branches are arranged in one-to-one correspondence with the heating elements, and the nozzles of the spray branches are located below the heating elements to spray the cooling liquid around the heating elements from bottom to top.

[0023] Optionally, a water inlet is provided in the case and on the back side of the electrical device, and the water inlet is located below the case;

[0024] The fluid pump is connected to the water inlet via a universal shaped hose to extract low-temperature coolant from the bottom of the chassis.

[0025] Optionally, the water inlet is a fan-shaped water inlet.

[0026] An immersion liquid cooling system provided in an embodiment of the present application includes: a chassis and an electrical device arranged in the chassis, wherein a coolant for liquid cooling the electrical device is arranged in the chassis; a fluid pump, located at the inner top of the chassis, and used to extract low-temperature coolant from the bottom of the chassis; a spray pipeline, located in the chassis, with one end connected to the fluid pump and the other end extending to the bottom of the electrical device, for transporting the low-temperature coolant to the surrounding area of ​​the immersed electrical device.

[0027] Compared with the prior art, the immersion liquid cooling system provided in the embodiment of the present application has the following technical effects:

[0028] A fluid pump and a spray pipe are arranged in the chassis. The fluid pump extracts low-temperature coolant from the bottom of the chassis and delivers it to the periphery of the immersed electrical device through the spray pipe, thereby accelerating the circulation of coolant around the immersed electrical device, more effectively removing heat and improving heat exchange efficiency; and ensuring uniform distribution of coolant in the system, keeping the electrical equipment running at a lower operating temperature and extending the service life of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0030] Figure 1 A schematic structural diagram of an immersion liquid cooling system provided in an embodiment of the present application.

[0031] The following are marked in the accompanying drawings:

[0032] Chassis 1, fluid pump 2, filter element 3, one-to-two adapter 4, water inlet 5, heat dissipation element 6, nozzle 7, liquid separation pipeline 8, spray pipeline 9. DETAILED DESCRIPTION

[0033] The embodiment of the present invention discloses an immersion liquid cooling system to solve the problems that the existing heat dissipation method mainly relies on the natural convection heat dissipation of liquid, the liquid flow rate inside the chassis is low, and the heat exchange effect is poor.

[0034] In order to make the technical solutions and advantages in the embodiments of the present application more clearly understood, the exemplary embodiments of the present application are further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than an exhaustive list of all the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0035] See also Figure 1 , Figure 1 A schematic structural diagram of an immersion liquid cooling system provided in an embodiment of the present application.

[0036] In a specific embodiment, the immersion liquid cooling system provided by the present application includes a chassis 1, and an electrical device, a fluid pump 2 and a spray pipe 9 arranged in the chassis 1; wherein, a water inlet 5 is provided at the bottom of the chassis 1, and the coolant spreads from bottom to top to immerse the electrical device, and the electrical device is partially immersed in the coolant. The electrical device has a heating element, and the heating element is completely immersed in the coolant. The heat of the heating element is taken away by the coolant. In order to speed up the circulation of the coolant near the heating element, the above-mentioned system is provided with a fluid pump 2 and a spray pipe 9, specifically, one end of the fluid pump 2 is connected to the bottom of the chassis 1 to extract the low-temperature coolant at the bottom of the chassis 1, and the low-temperature coolant is transported to the heating element of the immersed electrical device through the spray pipe 9, so as to speed up the liquid circulation around the electrical device, effectively take away the heat, and improve the heat exchange efficiency; and ensure the uniform distribution of the coolant in the system, keep the electrical equipment running at a lower operating temperature, and extend the service life of the equipment.

[0037] Specifically, the spray pipeline 9 includes a main spray pipeline and a plurality of branch spray pipelines. The main spray pipeline is laid in a U shape along the circumference of the electrical device. A nozzle 7 is provided at the front end of any branch spray pipeline, and each branch spray pipeline is sequentially arranged on the main spray pipeline.

[0038] The spray main line is a U-shaped structure, which is arranged circumferentially in the electrical device. The spray main line is provided with a number of spray branches. One end of each spray branch is connected to the spray main line, and the other end is provided with a nozzle 7. The nozzle 7 is opposite to the heating element of the electrical device to promptly take away the heat of the coolant around the heating element, accelerate the circulation of the coolant around the heating element, and improve the heat exchange effect. Furthermore, the spray main line and any spray branch are connected via a one-to-two adapter 4, so that the coolant can be more evenly covered in the area that needs to be cooled, especially near the heating element. The nozzle 7 is specially designed to spray liquid at different angles to meet different heat dissipation requirements.

[0039] The spray pipe 9 is a universal shaped hose, which is highly flexible and can adapt to various complex spatial layouts, and is convenient for installation and maintenance; and can maintain the shape after bending to avoid deformation caused by external interference.

[0040] In another embodiment, the liquid cooling system further includes a heat dissipation element 6 and a liquid separation pipeline 8; a heat dissipation element 6 is provided above the chassis 1, and the heat dissipation element 6 is generally a heat sink to achieve heat dissipation inside the chassis 1; the liquid separation pipeline 8 is provided below the heat dissipation element 6, and is connected to the tail end of the spray pipeline 9, which has a plurality of nozzles 7 thereon to spray the heat dissipation element 6, and the coolant is atomized through the nozzles 7 and then sprayed onto the heat sink, thereby increasing the contact area between the coolant and the air, and promoting the occurrence of the condensation process, further improving the heat dissipation efficiency, and the condensed water droplets fall back to the bottom to complete a cycle.

[0041] Furthermore, during the circulation of the coolant, by providing a filter element 3 to filter out impurities in the coolant, these impurities can be effectively prevented from clogging the pipeline or damaging the water pump and other precision components, thereby ensuring the long-term stable operation of the system. In this embodiment, the filter element 3 is provided as a multi-layer filter screen, which can effectively remove fine particles.

[0042] Optionally, the fluid pump 2 is specifically a micro water pump with an automatic speed regulation function, and can adjust the flow rate according to load changes.

[0043] Furthermore, the electrical device includes a main board and a heating element located on the main board, and the heating element is immersed in the coolant; the spray branch is arranged in a one-to-one correspondence with the heating element, and the nozzle 7 of the spray branch is located below the heating element, and the coolant around the heating element is disturbed from bottom to top; it can be understood that the bottom-up spraying method can enhance the convection of the coolant, increase the contact opportunity between the coolant and the surface of the heating element, thereby improving the heat exchange efficiency; and destroy the thermal boundary layer formed on the surface of the heating element, reduce thermal resistance, and make it easier for heat to be transferred to the coolant; at the same time, ensure that the coolant covers all surfaces of the heating element, including difficult-to-reach areas, so as to achieve comprehensive cooling; the formation of bubbles in the coolant can be reduced, because the bubbles will naturally rise and discharge, and will not remain near the heating element; bubbles and cavitation phenomena will cause the local cooling effect to decrease, and even damage the heating element, and the bottom-up spraying method can effectively reduce the occurrence of these phenomena.

[0044] In another embodiment, a water inlet 5 is provided inside the chassis 1 and on the back side of the electrical device, and the water inlet 5 is located below the chassis 1; the fluid pump 2 is connected to the water inlet 5 through a universal shaped hose to extract the low-temperature coolant at the bottom of the chassis 1; the water inlet 5 is arranged on the back side of the mainboard to reduce the risk of accidental leakage of the coolant to the front of the mainboard, and protect sensitive electronic components from damage. Even if a slight leakage occurs, the coolant is not easy to directly contact the circuits and components on the front of the mainboard, thereby reducing the risk of short circuit. At the same time, there is usually more space on the back side of the mainboard, and more nozzles 7 and cooling paths can be designed to ensure that the coolant is evenly distributed around each heating element, thereby improving the overall cooling effect; the coolant can directly contact the heat sink or heat pipe on the back of the mainboard, reducing thermal resistance and improving heat conduction efficiency.

[0045] The water inlet 5 is preferably set as a fan-shaped water inlet 5, which can evenly distribute the coolant, ensure that the coolant is more evenly distributed when entering the chassis 1, avoid local overheating, and improve the overall cooling effect; at the same time, reduce turbulence when the liquid enters, reduce pressure loss, help improve the overall efficiency of the system, reduce energy consumption; extend the service life of the pump and reduce maintenance costs.

[0046] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0047] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. An immersion liquid cooling system, characterized in that: include: A chassis and an electrical device disposed in the chassis, wherein the chassis is provided with a coolant for liquid cooling and heat dissipation of the electrical device; A fluid pump, located at the inner top of the chassis, for extracting low-temperature coolant from the bottom of the chassis; A spray pipeline is located in the chassis, one end of which is connected to the fluid pump and the other end of which extends to the bottom of the electrical device, and is used to transport low-temperature coolant to the surroundings of the immersed electrical device.

2. The immersion liquid cooling system according to claim 1, characterized in that: The spray pipeline comprises: A main spray line and a plurality of branch spray lines, wherein the main spray line is laid in a U shape along the circumference of the electrical device; A nozzle is provided at the front end of any of the spray branches, and the spray branches are arranged in sequence on the main spray line.

3. The immersion liquid cooling system according to claim 2, characterized in that: The main spray line and any one of the branch spray lines are connected via a one-to-two adapter.

4. The immersion liquid cooling system according to claim 1, characterized in that: Also includes: A heat dissipation element is located at the inner top of the chassis; The liquid separation pipeline is located below the heat dissipation element and is connected to the tail end of the spray pipeline. The liquid separation pipeline has a plurality of nozzles for spraying the heat dissipation element.

5. The immersion liquid cooling system according to claim 1, characterized in that: Also includes: The filter element is located between the fluid pump and the spray pipeline and is used for filtering the low-temperature coolant.

6. The immersion liquid cooling system according to claim 5, characterized in that: The filter element is a filter mesh.

7. The immersion liquid cooling system according to claim 1, characterized in that: The spray pipeline is a universal fixed hose.

8. The immersion liquid cooling system according to claim 2, characterized in that: The electrical device comprises a main board and a heating element located on the main board, wherein the heating element is immersed in a cooling liquid; The spray branches are arranged in one-to-one correspondence with the heating elements, and the nozzles of the spray branches are located below the heating elements to spray the cooling liquid around the heating elements from bottom to top.

9. The immersion liquid cooling system according to claim 1, characterized in that: A water inlet is provided in the case and on the back side of the electrical device, and the water inlet is located below the case; The fluid pump is connected to the water inlet via a universal shaped hose to extract low-temperature coolant from the bottom of the chassis.

10. The immersion liquid cooling system according to claim 9, characterized in that: The water inlet is a fan-shaped water inlet.

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