Magnet assembling device for vapor deposition process

Abstract

The invention provides a magnet assembling device for a vapor deposition process. The magnet assembling device comprises a bottom plate; the plurality of magnets are mounted on the bottom plate, the plurality of magnets form a comprehensive magnetic field, and the comprehensive magnetic field is used for controlling the motion trail of plasma in the PVD process; and the fastener is used for detachably and fixedly connecting the magnet to the bottom plate. Compared with the prior art that the influence of a magnetic field on a plasma track is tested after a fixed magnet layout is generally adopted, a new magnet layout is used after a result is confirmed, and long manufacturing time is needed. By using the magnet assembling device for the vapor deposition process, the new configuration time can be saved, and the development cost can be saved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and in particular, relates to a magnet assembly device for a vapor deposition process. Background Art

[0002] PVD (physical vapor deposition) usually generates Ar+ plasma in a sealed chamber, and uses the plasma to physically impact a metal target at the top of the chamber, causing the atoms of the metal target to fall downward and deposit onto the substrate surface.

[0003] In this technical method, during the plasma generation and collision process, the magnet located above the metal target generates a magnetic field, which affects the collision speed and direction. Therefore, the shape of the magnetic field generated can be changed by changing the layout of the magnetic field, which directly affects the results of the PVD film.

[0004] Therefore, in the development of PVD equipment, in order to obtain the desired characteristics when depositing semiconductor metal films, it is necessary to experiment with the development and configuration of appropriate magnetic components. Important characteristics such as uniformity, density, and resistance of the metal film in the desired direction can be controlled.

[0005] At present, it is common to conduct experiments after fixing the magnet layout. However, if the experimental results are not ideal, the magnet layout needs to be changed and the experiment needs to be repeated. This requires reprocessing the magnets, which takes a long time. This seriously affects the development efficiency. In addition, the repeated manufacture of the structure with a fixed magnet layout also increases the R&D cost to a certain extent.

[0006] In view of this, a new method is needed that can save magnet configuration time and development costs. Summary of the invention

[0007]

Technical issues

[0008] In order to solve the above-mentioned problems, the object of the present invention is to provide a magnet assembly device for vapor deposition process, which can quickly configure the magnet layout, save the time of new configuration, and save development costs.

[0009]

Technical solution

[0010] A magnet assembly device for a vapor deposition process, comprising:

[0011] Base plate;

[0012] A plurality of magnets are mounted on the bottom plate, wherein the plurality of magnets form a comprehensive magnetic field, and the comprehensive magnetic field is used to control the motion trajectory of plasma in the PVD process;

[0013] A fastener is used to detachably fix the magnet to the base plate.

[0014] Optionally, the base plate is a metal plate.

[0015] Optionally, a plurality of mounting holes penetrating the bottom plate are provided on the plate surface of the bottom plate, a threaded hole is provided at the end of the magnet, and the fastener passes through the mounting hole and is screwed onto the threaded hole to mount the magnet on the bottom plate.

[0016] Optionally, rectangular coordinate axis markings are provided on the surface of the base plate.

[0017] Optionally, the mounting holes are arranged in a plurality of rows and columns, and the rows and columns are parallel to the rectangular coordinate axes.

[0018] Optionally, two groups of magnets are installed on the bottom plate, wherein the N poles of one group of magnets face upwards, and the S poles of the other group of magnets face upwards.

[0019] Optionally, the distance between the mounting holes is such that there is a gap between the mounted magnets.

[0020] Optionally, the mounting hole has a thread in the same form as the threaded hole of the magnet.

[0021] Optionally, a magnet insertion hole coaxially arranged with the mounting hole is provided on one side of the bottom plate, and the bottom of the magnet is inserted into the magnet insertion hole.

[0022] Optionally, a nut insertion hole coaxially arranged with the mounting hole is provided on the other side of the base plate, and when the bolt is screwed onto the magnet, the nut thereof sinks into the nut insertion hole.

[0023]

Beneficial Effects

[0024] In the past, a fixed magnet layout was generally used to conduct experiments on the influence of magnetic field on the trajectory of plasma. After confirming the results, it took a long time to use a new magnet layout. Using the magnet assembly device of the present application can save time for new configuration and development costs.

[0025] Coordinate axis markings are provided on the magnet mounting surface of the bottom plate, and the mounting holes are arranged in multiple rows and columns, and the rows and columns are parallel to the coordinate axis, respectively, which can accurately identify the position of each magnet, thereby enabling the position of the magnet to be adjusted quickly and accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the installation of magnets in a magnet assembly device for a vapor deposition process according to an embodiment of the present application.

[0027] Figure 2 It is a top view of a magnet assembly device for a vapor deposition process according to an embodiment of the present application.

[0028] Figure 3 It is a schematic diagram of a form of mounting hole in an embodiment of the present application.

[0029] Figure 4 Schematic diagram of a magnet according to an embodiment of the present application.

[0030] Figure 5 It is a schematic diagram of the rectangular coordinate axis marking lines of an embodiment of the present application.

[0031] [Brief Description of Reference Numerals]

[0032] 100: Base plate 110: Mounting hole

[0033] 111: Magnet insertion hole 112: Nut insertion hole

[0034] 200: Magnet 210: Threaded hole

[0035] 300: Fasteners 400: Fasteners DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] This embodiment provides a magnet assembly device for vapor deposition process, which can be used to quickly adjust the magnet layout so as to quickly experiment the influence of the magnet layout on the trajectory of plasma in vapor deposition. It reduces the waiting time for magnet layout processing that has been carried out many times in the past, and can greatly shorten the time for magnet configuration. In addition, it also correspondingly reduces the processing material cost, labor cost, etc. of magnet layout processing that has been carried out many times in the past, thereby saving development costs.

[0038] The present embodiment provides a magnet assembly device for a vapor deposition process, including a base plate 100 for mounting a plurality of magnets 200; the magnets 200, wherein the plurality of magnets 200 form a comprehensive magnetic field, and the comprehensive magnetic field can affect the motion trajectory of the plasma in the vapor deposition process; and a fastener 300, which is used to fix the magnets 200 to the base plate 100.

[0039] The bottom plate 100 may be a flat plate, a metal plate, or any other shape such as a circle or a polygon, without limitation. A plurality of mounting holes 110 penetrating the bottom plate are provided on the plate surface, and the mounting holes may be arranged on the plate surface at certain intervals, and fasteners are inserted into the mounting holes 110 to fix the magnet 200 on the bottom plate 100. The bottom plate 100 is also provided with an equipment mounting hole for connecting with a vapor deposition process equipment.

[0040] The cross section of the mounting hole 110 is circular, and a threaded hole 210 may be provided at the end of the magnet 200. The magnet 200 is mounted on the bottom plate 100 by passing a fastener 400 such as a bolt through the mounting hole 110 and screwing it into the threaded hole 210. The diameter of the mounting hole 110 is the same as the diameter of the fastener. Specifically, the magnet 200 is placed on the bottom plate 100 so that the threaded hole 210 of the magnet 200 is coaxially opposed to the mounting hole 110 of the bottom plate 100, and then a bolt is passed through the mounting hole 110 from the other side and then screwed into the threaded hole 210, and the nut of the bolt is restricted on the bottom surface of the bottom plate 100, so that the magnet 200 is fixedly connected to the bottom plate 100. This mounting method can be used to mount multiple magnets 200 on the bottom plate 100.

[0041] In some embodiments, the mounting hole 110 may also be a threaded hole with the same thread form as the threaded hole 210 of the magnet 200. For example, if the threaded hole 210 of the magnet 200 is an M6 threaded hole, then the mounting hole 110 is also an M6 threaded hole. Bolts can be screwed on the threads of the mounting hole and the magnet 200 at the same time to fasten them to the base plate 100.

[0042] In some embodiments, the shape of each magnet 200 is not limited, for example, it can be a three-dimensional shape such as a column, a polyhedron, etc. Moreover, for a column, its cross section is not limited to a circle, and can also be a variety of forms such as a ring, a semicircular ring, an arc, a polygon, etc.

[0043] In some embodiments, both ends of the mounting hole 110 may also have holes coaxially, thereby forming a stepped hole with the mounting hole 110. For example, a magnet insertion hole 111 may be provided on one side of the base plate 100, and the magnet insertion hole 111 is coaxially arranged with the mounting hole 110. The diameter of the magnet insertion hole 111 is equivalent to the diameter of the magnet 200. The bottom of the magnet 200 can be placed in the magnet insertion hole 111, making it more stable during installation. A nut insertion hole 112 may be provided on the other side of the base plate 100, and the nut insertion hole 112 is coaxially arranged with the mounting hole 110. The nut insertion hole 112 is used for sinking the nut into the nut insertion hole 112 when the bolt is screwed on the magnet 200 to prevent collision with other mechanisms.

[0044] There should be a certain distance between the mounting holes 110, and the distance should be such that there can be a gap between the mounted magnets. For example, if the magnet 200 is a magnet with a circular cross-section, and the diameter of the magnet 200 is 12 mm, then the distance between the two mounting holes 110 can be greater than or equal to 12 mm, and can be, for example, 12 mm, 16 mm, 20 mm, and the like. Preferably, the distance between the two mounting holes 110 is greater than 12 mm. For example, if the cross-section of the magnet 200 is a hexagon, then the two magnets can be mounted in the mounting hole 110 in a manner that the sides of the hexagon are parallel, and then the distance between the two mounting holes 110 should be greater than or equal to the distance between the two parallel sides of the hexagon. Preferably, the distance between the two mounting holes 110 is greater than the distance between the two parallel sides of the hexagon.

[0045] Two groups of magnets may be arranged on the base plate 100, wherein the N pole of one group of magnets faces upward, and the S pole of the other group of magnets faces upward. The arrangement of any group of magnets can be freely set as needed, for example, as shown in the figure, one group of magnets presents a continuous arrangement with two turns. The other group of magnets presents a continuous arrangement with one turn. It should be noted that the figure is only an exemplary arrangement of magnets, and the specific arrangement of magnets is not limited here. In addition, for example, 3 or more groups of magnets may be arranged, and the position of magnets in each group is not required to be arranged continuously. For example, a group of magnets has 10 magnets, and the third and fourth magnets may be arranged with several mounting holes 110 between them. This application only discusses the quick installation method for magnets, and its specific layout is a work in the process design stage and will not be discussed here.

[0046] In some embodiments, a coordinate axis marking is provided on the mounting surface of the magnet 200 of the base plate 100. Figure 5 , XY rectangular coordinate system markings are set on the plane of the board surface. By setting the rectangular coordinate system markings, the position of each mounting hole, that is, the position of each magnet 200, can be accurately marked, so that the position of the magnet 200 can be adjusted more quickly and accurately. Preferably, each mounting hole is arranged in the form of multiple rows and columns, and the rows and columns are parallel to the coordinate axes respectively. For example, the rows are parallel to the X-axis, and the columns are parallel to the Y-axis. Or the rows are parallel to the Y-axis, and the columns are parallel to the X-axis, which is also possible.

[0047] Further, one row of the mounting holes 110 may be arranged on the X-axis marking line, and similarly, one row of the mounting holes may be arranged on the Y-axis marking line.

[0048] It should be noted that, although the present embodiment uses a magnet mounted on the base plate by means of fasteners, the present application does not exclude the possibility of using other mounting methods to mount on the base plate. For example, the diameter of the mounting hole 110 may be set to be an interference fit with the outer diameter of the magnet, and the magnet may be mounted on the base plate 100 by plugging and unplugging. Moreover, by using this interference fit mounting method, the magnet may be knocked from the other side opposite to the magnet, the magnet may be removed, and then mounted in another mounting hole, thereby performing magnet layout configuration.

[0049] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art may make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations shall fall within the protection scope of the claims of the present invention.

Claims

1. A magnet assembly device for a vapor deposition process, characterized in that: include: Base plate; A plurality of magnets are mounted on the bottom plate, wherein the plurality of magnets form a comprehensive magnetic field, and the comprehensive magnetic field is used to control the motion trajectory of plasma in the PVD process; A fastener is used to detachably fix the magnet to the base plate.

2. The magnetic assembly device for vapor deposition process according to claim 1, characterized in that: The bottom plate is a metal plate.

3. The magnetic assembly device for vapor deposition process according to claim 2, characterized in that: A plurality of mounting holes penetrating the bottom plate are arranged on the plate surface of the bottom plate, a threaded hole is arranged at the end of the magnet, and the fastener passes through the mounting hole and is screwed on the threaded hole to mount the magnet on the bottom plate.

4. The magnet assembly device for vapor deposition process according to claim 3, characterized in that: A rectangular coordinate axis marking line is arranged on the plate surface of the bottom plate.

5. The magnetic assembly device for vapor deposition process according to claim 4, characterized in that: The mounting holes are arranged in a plurality of rows and columns, and the rows and columns are parallel to the rectangular coordinate axes.

6. The magnet assembly device for vapor deposition process according to claim 3, characterized in that: Two groups of magnets are installed on the bottom plate, wherein the N poles of one group of magnets face upwards, and the S poles of the other group of magnets face upwards.

7. The magnetic assembly device for vapor deposition process according to claim 3, characterized in that: The distance between the mounting holes is such that there is a gap between the mounted magnets.

8. The magnetic assembly device for vapor deposition process according to claim 3, characterized in that: The mounting hole has a thread in the same form as the threaded hole of the magnet.

9. The magnetic assembly device for vapor deposition process according to claim 3, characterized in that: A magnet insertion hole coaxially arranged with the mounting hole is arranged on one side of the bottom plate, and the bottom of the magnet is inserted into the magnet insertion hole.

10. The magnetic assembly device for vapor deposition process according to claim 9, characterized in that: A nut insertion hole coaxially arranged with the mounting hole is arranged on the other side of the bottom plate. When the bolt is screwed on the magnet, the nut sinks into the nut insertion hole.

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