Block coil

Abstract

An electronic module includes: a substrate or lead frame including a primary conductive pattern and a secondary conductive pattern; a magnetic core on or above the substrate or the lead frame; a block coil including: a resin body on or above the substrate or the lead frame and extending above the magnetic core; a first terminal on or embedded in the resin body and connected to the primary conductive pattern; and a second terminal on or embedded in the resin body and connected to the secondary conductive pattern; and an electronic component on the substrate or the lead frame.

Description

Technical Field

[0001] The present invention relates to a block coil. More particularly, the present invention relates to a block coil that can be attached to a substrate or a lead frame and can be used in a magnetic assembly or an electronic module. Background Art

[0002] It is known to use windings comprising terminals which extend over the core. Since there is no structure to support the terminals, there is a risk that the terminals will short or fall off sideways. Summary of the invention

[0003] To overcome the above problems, an exemplary embodiment of the present invention provides a block coil including a resin body and terminals on or in the resin body, thereby eliminating or significantly reducing the risk of the block coil causing a short circuit and terminal falling off.

[0004] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, which is located on the first substrate or the first lead frame and includes a primary conductive pattern and a secondary conductive pattern; a magnetic core, which is located on or above the second substrate or the second lead frame; a block coil, including: a resin body, which is located on or above the second substrate or the second lead frame and extends above the magnetic core; a first terminal, which is on or embedded in the resin body and connected to the primary conductive pattern; and a second terminal, which is on or embedded in the resin body and connected to the secondary conductive pattern; an electronic component, which is located on the first substrate or the first lead frame; and an insulating material, which covers the second substrate or the second lead frame, the magnetic core and the block coil.

[0005] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be disposed adjacent to and spaced apart from the second terminal group.

[0006] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and from a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may overlap vertically. The electronic module may also include an additional primary conductive pattern in the third layer of the second substrate and an additional secondary conductive pattern in the fourth layer of the second substrate, wherein from a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may overlap vertically.

[0007] The magnetic core may be located on or above a first surface of the first substrate or the first lead frame. The electronic component may be located on a second surface of the first substrate or the first lead frame opposite to the first surface. The electronic component may be located on the first surface of the first substrate or the first lead frame. The electronic component may be located between the first substrate and the second substrate. The electronic component may include an integrated circuit (IC) and / or a capacitor.

[0008] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, which is located above the first substrate or the first lead frame and includes a conductive pattern; a magnetic core, which is located on or above the second substrate or the second lead frame; a first block coil and a second block coil, each of the first block coil and the second block coil including a resin body and including a first terminal, which is located on or above the substrate or the lead frame and extends above the magnetic core, and the first terminal is located on or embedded in the resin body and connected to the conductive pattern; an electronic component, which is located on the first substrate or the first lead frame; and an insulating material, which covers the second substrate or the second lead frame, the magnetic core and the block coils.

[0009] The conductive pattern may be a primary conductive pattern, and the first terminal of the first coil may be connected only to the primary conductive pattern. The conductive pattern may be a secondary conductive pattern, and the first terminal of the second coil may be connected only to the secondary conductive pattern. The electronic module may further include a third coil including a first terminal and a second terminal, wherein the first terminal may be connected to the primary conductive pattern, and the second terminal may be connected to the secondary conductive pattern.

[0010] The first coil may include a first terminal group and a second terminal group, and the first terminal may be included in the first terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding primary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be disposed adjacent to the second terminal group and spaced apart from the second terminal group.

[0011] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The electronic module may also include a primary conductive pattern in the first layer and a secondary conductive pattern in the second layer, wherein, from a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap. The electronic module may also include an additional primary conductive pattern in a third layer of the second substrate and an additional secondary conductive pattern in a fourth layer of the second substrate, wherein, from a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap.

[0012] The electronic component may include an integrated circuit (IC) and / or a capacitor. The magnetic core may be located on or above a first surface of the first substrate or the first lead frame. The electronic component may be located on a second surface of the first substrate or the first lead frame opposite to the first surface. The electronic component may be located on the first surface of the first substrate or the first lead frame. The electronic component may be located between the first substrate and the second substrate.

[0013] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, located on the first substrate or the first lead frame and including a primary conductive pattern and a secondary conductive pattern; a conductive pin, located between the first substrate and the second substrate or between the first lead frame and the second lead frame; a magnetic core, located on or above the second substrate or the second lead frame; a block coil, including: a resin body, located on or above the second substrate or the second lead frame and extending above the magnetic core; a first terminal, on or embedded in the resin body and connected to the primary conductive pattern; and a second terminal, on or embedded in the resin body and connected to the secondary conductive pattern; an electronic component, located on the first substrate or the first lead frame; and an insulating material, covering the second substrate or the second lead frame, the magnetic core and the block coil.

[0014] The block coil may include an additional first terminal and an additional second terminal; the first terminal and the additional first terminal may define a first terminal group; and the second terminal and the additional second terminal may define a second terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern; and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be disposed adjacent to and spaced apart from the second terminal group.

[0015] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and from a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may overlap vertically. The electronic module may also include an additional primary conductive pattern in the third layer of the second substrate and an additional secondary conductive pattern in the fourth layer of the second substrate, wherein from a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may overlap vertically.

[0016] The magnetic core may be located on or above a first surface of the first substrate or the first lead frame. The electronic component may be located on a second surface of the first substrate or the first lead frame opposite to the first surface. The electronic component may be located on the first surface of the first substrate or the first lead frame. The electronic component may be located between the first substrate and the second substrate. The electronic component may include an integrated circuit (IC) and / or a capacitor.

[0017] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, which is located above the first substrate or the first lead frame and includes a conductive pattern; a conductive pin, which is located between the first substrate and the second substrate or between the first lead frame and the second lead frame; a magnetic core, which is located on or above the second substrate or the second lead frame; a first block coil and a second block coil, each of the first block coil and the second block coil including a resin body and including a first terminal, which is located on or above the substrate or the lead frame and extends above the magnetic core, and the first terminal is located on or embedded in the resin body and connected to the conductive pattern; an electronic component, which is located on the first substrate or the first lead frame; and an insulating material, which covers the second substrate or the second lead frame, the magnetic core and the block coils.

[0018] The conductive pattern may be a primary conductive pattern, and the first terminal of the first coil may be connected only to the primary conductive pattern. The conductive pattern may be a secondary conductive pattern, and the first terminal of the second coil may be connected only to the secondary conductive pattern. The electronic module may further include a third coil including a first terminal and a second terminal, wherein the first terminal may be connected to the primary conductive pattern, and wherein the second terminal may be connected to the secondary conductive pattern.

[0019] The first coil may include a first terminal group and a second terminal group, and the first terminal may be included in the first terminal group. Each terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding primary conductive pattern. Each terminal in the first terminal group and each terminal in the second terminal group may be connected to a corresponding secondary conductive pattern. The first terminal group may be disposed adjacent to the second terminal group and spaced apart from the second terminal group.

[0020] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The electronic module may also include a primary conductive pattern in the first layer and a secondary conductive pattern in the second layer, wherein, from a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern may vertically overlap. The electronic module may also include an additional primary conductive pattern in a third layer of the second substrate and an additional secondary conductive pattern in a fourth layer of the second substrate, wherein, from a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern may vertically overlap.

[0021] The electronic component may include an integrated circuit (IC) and / or a capacitor. The magnetic core may be located on or above a first surface of the first substrate or the first lead frame. The electronic component may be located on a second surface of the first substrate or the first lead frame opposite to the first surface. The electronic component may be located on the first surface of the first substrate or the first lead frame. The electronic component may be located between the first substrate and the second substrate.

[0022] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, which is located on the first substrate or the first lead frame and includes a primary conductive pattern and a secondary conductive pattern; a magnetic core, which is located on or above the second substrate or the second lead frame; a block coil, including: a resin body, which is located on or above the second substrate or the second lead frame and extends above the magnetic core; a first terminal, which defines a first terminal group and is on or embedded in the resin body; a second terminal, which defines a second terminal group and is on or embedded in the resin body; an IC, which is located on the first substrate or the first lead frame; and a capacitor, which is located on the first substrate or the first lead frame. Two first terminals in the first terminal group are connected to corresponding primary conductive patterns; two second terminals in the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any of the secondary conductive patterns.

[0023] Each first terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group may be connected to a corresponding secondary conductive pattern.The first terminal group may be disposed adjacent to and spaced apart from the second terminal group.

[0024] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and from a side view of the second substrate, a portion of the primary conductive pattern may vertically overlap with a corresponding portion of the secondary conductive pattern. The electronic module may also include an additional primary conductive pattern in the third layer of the second substrate and an additional secondary conductive pattern in the fourth layer of the second substrate, wherein from a side view of the second substrate, a portion of the additional primary conductive pattern may vertically overlap with a corresponding portion of the additional secondary conductive pattern.

[0025] The electronic module may further include an insulating material covering the second substrate or the second lead frame, the magnetic core and the block coil. The electronic module may include a second substrate, and the second substrate may include a via. The magnetic core may be located on or above the first surface of the second substrate or the second lead frame. The capacitor may be located on a second surface of the second substrate or the second lead frame opposite to the first surface. The capacitor may be located on the first surface of the first substrate or the first lead frame. The capacitor may be located between the first substrate and the second substrate. The electronic module may further include a coating covering the magnetic core.

[0026] According to an exemplary embodiment of the present invention, an electronic module includes: a first substrate or a first lead frame; a second substrate or a second lead frame, located on the first substrate or the first lead frame and including a primary conductive pattern and a secondary conductive pattern; a magnetic core, located on or above the second substrate or the second lead frame; a first coil and a second coil, each of the first coil and the second coil including: a resin body, located on or above the second substrate or the second lead frame and extending above the magnetic core; a first terminal, defining a first terminal group and on or embedded in the resin body; and a second terminal, defining a second terminal group and on or embedded in the resin body; an IC, located on the first substrate or the first lead frame; and a capacitor, located on the first substrate or the first lead frame. Two first terminals in the first terminal group are connected to corresponding primary conductive patterns; two second terminals in the second terminal group are connected to corresponding secondary conductive patterns; and the first primary conductive pattern is closer to the second primary conductive pattern than any of the secondary conductive patterns.

[0027] Each first terminal in the first terminal group may be connected to a corresponding primary conductive pattern, and each second terminal in the second terminal group may be connected to a corresponding secondary conductive pattern.The first terminal group may be disposed adjacent to and spaced apart from the second terminal group.

[0028] The electronic module may include a second substrate, and the second substrate may include a first layer and a second layer. The primary conductive pattern may be in the first layer; the secondary conductive pattern may be in the second layer; and from a side view of the second substrate, a portion of the primary conductive pattern may vertically overlap with a corresponding portion of the secondary conductive pattern. The electronic module may also include an additional primary conductive pattern in the third layer of the second substrate and an additional secondary conductive pattern in the fourth layer of the second substrate, wherein from a side view of the second substrate, a portion of the additional primary conductive pattern may vertically overlap with a corresponding portion of the additional secondary conductive pattern.

[0029] The electronic module may further include an insulating material covering the second substrate or the second lead frame, the magnetic core and the block coil. The electronic module may include a second substrate, and the second substrate may include a via. The magnetic core may be located on or above the first surface of the second substrate or the second lead frame. The capacitor may be located on a second surface of the second substrate or the second lead frame opposite to the first surface. The capacitor may be located on the first surface of the first substrate or the first lead frame. The capacitor may be located between the first substrate and the second substrate. The electronic module may further include a coating covering the magnetic core.

[0030] The above and other features, components, characteristics, steps and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a top perspective view of a block coil mounted to a baseplate of a magnetic assembly.

[0032] Figure 2 Is installed to Figure 1 Top view of the coil of the magnetic assembly PCB block.

[0033] Figure 3 Is installed in the electronic module Figure 1 A top perspective view of the coil of the magnetic assembly's PCB block.

[0034] Figure 4 yes Figure 3 A top perspective view of the electronics module, with insulation material covering the block coils.

[0035] Figure 5 yes Figure 3 Top view of an electronic module.

[0036] Figure 6 yes Figure 1 A top perspective view of the block coil.

[0037] Figure 7 yes Figure 1Bottom perspective view of the block coil.

[0038] Figure 8 is a top perspective view of a block coil having terminals of different widths.

[0039] Fig. 9 Shows that it can be Figure 3 Top view of the different layers of a PCB used in conjunction with an electronic module.

[0040] Fig.10 yes Figure 4 A partial cross-section of an electronic module, with insulation material covering the coil block.

[0041] Figures 11 to 15 It shows the manufacturing Figure 3 A perspective view of an approach to an electronic module.

[0042] Fig.16 It is a cross-sectional view of a block coil mounted on a single-layer substrate of an electronic component.

[0043] Fig.17 yes Fig.16 Top view of the top layer of the substrate.

[0044] Fig.18 is a cross-sectional view of a magnetic assembly showing various distances.

[0045] Fig.19 is a top perspective view of the block coil mounted to the lead frame of the magnetic assembly.

[0046] Fig. 20 Is installed to Fig.19 A side cross-sectional view of a block coil of the lead frame of a magnetic assembly.

[0047] Fig.21 Is installed to Fig.19 Bottom perspective view of the lead frame block coil of the magnetics assembly.

[0048] Fig. 22 yes Fig. 20 Top perspective view of a partially assembled magnetic assembly.

[0049] Fig.23 yes Fig. 20 A top perspective view of the magnetic assembly with insulation covering the block coil.

[0050] Fig.24 An EE or EI core is shown that can be used with three block coils.

[0051] Fig.25 A bar core is shown that can be used with a single block coil.

[0052] Figure 26 to Figure 31It shows that it can be Figure 1 The magnetic components and Figure 3 An example substrate used in an electronic module.

[0053] Fig.32 and Fig.33 is a cross-sectional view of a magnetic assembly and an electronic assembly attached to a main substrate of an electronic module.

[0054] Fig.34 and Fig.35 is a cross-sectional view of a magnetic assembly attached to a main substrate of an electronic module via pins. DETAILED DESCRIPTION

[0055] Figure 1 and Figure 2 A magnetic assembly 100 is shown, which includes a substrate 20 , a magnetic core 30 and two block coils 10 . Figures 3 to 5 An electronic module 200 is shown, which includes Figure 1 The magnetic assembly 100 and the additional electronic assembly 50. Although Figures 1 to 5 Two block coils 10 are shown in FIG. 1 , but any number of block coils 10 , including a single block coil 10 , may be used.

[0056] The magnetic assembly 100 may include one or more windings wound around the magnetic core 30. For example, the magnetic assembly 100 may include a primary winding and a secondary winding, both of which extend around the magnetic core 30. Each winding may include one or more terminals 11 in one or more block coils 10, and may include one or more traces or conductive patterns 23 located on or in the substrate 20.

[0057] The substrate 20 may be any suitable substrate, including, for example, a printed circuit board (PCB). The substrate 20 may include a single layer or multiple layers, and may include traces or conductive patterns 23 located on the outer surfaces (i.e., the top and bottom surfaces) of the substrate 20 and / or in the substrate 20 (i.e., on the inner layers of the substrate 20). If the substrate 20 includes a single layer, the traces or conductive patterns 23 for both the primary winding and the secondary winding may be located on the same layer, for example, on the top surface of the substrate 20. If the substrate 20 includes multiple layers, the traces or conductive patterns 23 for the primary winding and the secondary winding may be located on the same layer or may be located on different layers. Fig. 9 Four possible layers of substrate 20 are shown. Fig. 9 Four layers are shown in FIG, but any number of layers, including one, may be used.

[0058] like Figure 3 (exist Figure 3 , the insulating material 40 is shown as transparent) and Figure 4 (exist Figure 4As shown in FIG. 1 , the insulating material 40 is opaque, and the insulating material 40 can be applied to the electronic module 200 to cover the substrate 20, the magnetic core 30, the two block coils 10, and any additional electronic components 50. Any suitable insulating material 40 can be used, including, for example, molding compound or epoxy resin. The insulating material 40 can be applied in any suitable manner. The insulating material 40 can improve and help maintain the isolation between the primary circuit and the secondary circuit of the magnetic assembly 100. The insulating material 40 can also be applied to Figure 1 The magnetic assembly 100.

[0059] exist Figure 1 and Figure 2 In the embodiment, no additional electronic components 50 are shown on the substrate 20, but Figure 3 and Figure 5 As shown in the electronic module 200 of FIG. 2 , an additional electronic component 50 may be included on the substrate 20. The electronic component 50 may be an active component, such as a transistor, an integrated circuit (IC), etc., or may be a passive component, such as a resistor, a capacitor, an inductor, etc. The electronic component 50 may be connected to the same surface as the magnetic core 30, such as Figure 3 and Figure 5 As shown, and / or may be connected to a surface (not shown) opposite to the magnetic core 30. For example, positioning the capacitor on the surface of the substrate 20 opposite to the magnetic core 30 may help (i) "miniaturize" the electronic module 200 and (ii) prevent or significantly reduce short circuits.

[0060] The electronic module 200 may be, for example, a power converter, an isolator, or a transformer, and the electronic component 50 may be a component of the power converter, isolator, or transformer. The electronic module 200 may be any suitable power converter, including, for example, a DC-DC converter or an AC-DC converter. For example, if the electronic module 200 is an isolated DC-DC converter, then Figure 3 and Figure 5 As shown, electronic components 50 of primary circuit 21 on a first side of the isolation barrier may be located at one end of the substrate, and electronic components 50 of secondary circuit 22 on a second side of the isolation barrier may be located at an opposite end of substrate 20 .

[0061] Fig.16 Shown with Figure 1 and Figure 2 Similar to magnetic assembly 100, but Fig.16 The substrate 20 in the embodiment includes a single-layer substrate.

[0062] exist Fig. 9, the first layer of the substrate 20 shows the top surface of the electronic module 200, on which the magnetic core 30 can be located and to which the block coil 10 and the electronic component 50 can be attached. The first layer may include traces or conductive patterns 23 connecting the electronic component 50. The traces 23 of the primary winding (i.e., primary traces or primary conductive patterns) and the traces 23 of the secondary winding (i.e., secondary traces or secondary conductive patterns) may be as shown. Fig. 9 The primary traces 23 and the secondary traces 23 may be located on different layers of the substrate 20, or may be located on the same layer of the substrate 20. For example, the primary traces 23 may be located on the third layer of the substrate 20, and the secondary traces 23 may be located on the first layer. The primary traces 23 and the secondary traces 23 may be separated by one or more layers. Fig. 9 In FIG. 1 , the primary trace 23 and the secondary trace 23 are separated by the second layer of the substrate 20. Fig.10 In the cross-sectional view of , the primary trace 23 and the secondary trace 23 are separated by three film layers, with a total spacing of 0.15 mm. Fig. 9 The shaded area in FIG. 1 is an exclusion zone, but other exclusion zone arrangements are also possible. For example, the area between the legs 12 of the terminal 11 of the block coil 10 on the first layer can also be an exclusion zone, such as Fig.10 As shown, the exclusion zone includes an exclusion zone with a minimum width of 0.4 mm between the block coils 10. The outer layer of the substrate 20 may include input / output (I / O) terminals P1, P2, P3, P4, which may be used to connect the electronic module 200 to a main substrate (not shown). The I / O terminals P1, P2 may be connected to an input voltage, and the I / O terminals P3, P4 may provide an output voltage.

[0063] like Fig. 9 As shown, one or more terminals 11 of each block coil 10 may be connected to a trace 23. For example, in one of the block coils 10, a single secondary trace 23 may connect the leg of one secondary terminal 11 to the leg of another secondary terminal 11 to define a single-turn secondary winding, or in one of the block coils 10, a primary trace 23 may connect the legs 12 of three primary terminals 11 to the legs 12 of other three primary terminals 11 to define a single-turn primary winding. That is, a single-turn winding may include one or more terminals 11 connected by a single trace 23. Fig.17 2 shows a possible circuit arrangement of an electronic module 200, which includes (a) a single-layer substrate 20 or (b) a multi-layer substrate 20, wherein the electronic components 50 and all traces 23 are on the top surface of the substrate 20. Fig. 9As shown, one or more terminals 11 of each block coil 10 can be connected to a trace 23. The trace 23 on the substrate 20 can determine how many terminals 11 a single turn includes, and can determine how many turns there are in the primary winding or the secondary winding. Therefore, the same block coil 10 can be used for different applications, which can save design costs because a different block coil 10 does not have to be made for each application.

[0064] Instead of including the electronic components 50 on the substrate 20, the substrate 20 may be attached to a mother substrate 70 and the additional electronic components 50 may be attached to the mother substrate 70, such as Figure 32 to Figure 35 As shown, instead of being attached to substrate 20. As described above, electronic component 50 may be an active component such as a transistor, an integrated circuit (IC), etc., or may be a passive component such as a resistor, a capacitor, an inductor, etc. For example, electronic component 50 may include an IC and a capacitor.

[0065] Fig.32 An example arrangement is shown in which a substrate 20 as a daughter card is attached to a mother substrate 70. The substrate 20 may be attached to the mother substrate 70 in any suitable manner so that the substrate 20 is physically and electrically connected to the mother substrate 70. The electronic component 50 may be attached to the same surface as the substrate 20 and may be electrically connected to the substrate 20. One or more block coils 10 may be attached to the substrate 20 to extend over the magnetic core 30. The insulating material 40 may cover the one or more block coils 10, the magnetic core 30, and the substrate 20, but not the electronic component 50 and / or the mother substrate 70. By not covering the electronic component 50 and / or the mother substrate 70, the amount of insulating material 40 may be reduced, which may reduce cost and manufacturing time, and may reduce the risk of short circuits. When high temperatures are used to apply the insulating material 40, the substrate, components attached to the substrate, and any solder may expand and contract, which may cause cracking, thereby increasing the risk of short circuits. By limiting the area where the insulating material 40 is applied, the risk of short circuits may be reduced. Fig.33 It is shown that additional electronic components 50 may be located on a surface of the mother substrate 70 opposite the substrate 20 .

[0066] Fig.34 An example arrangement is shown in which a substrate 20 as a daughter card is attached to a mother substrate 70 via pins 71 to physically and electrically connect the substrate 20 and the mother substrate 70. The electronic component 50 may be attached to the same surface as the substrate 20 and may be electrically connected to the substrate 20 via the pins 71. Fig.34As shown, the electronic component 50 can be located between the substrate 20 and the mother substrate 70, which can reduce the size of the electronic module including the substrate 20 and the mother substrate 70. One or more block coils 10 can be attached to the substrate 20 to extend above the magnetic core 30. The insulating material 40 can cover the one or more block coils 10, the magnetic core 30 and the substrate 20, but not the electronic component 50 and / or the mother substrate 70. By not covering the electronic component 50 and / or the mother substrate 70, the amount of insulating material 40 can be reduced, which can reduce costs and manufacturing time, and can reduce the risk of short circuits, as described above. Fig.35 It is shown that additional electronic components 50 may be located on a surface of the mother substrate 70 opposite the substrate 20 .

[0067] Similar to disposing the electronic component 50 apart from the substrate 20, the electronic component 50 may be disposed in a manner similar to the electronic component 50 discussed below. Figures 19 to 23 The lead frame 60 is separated. For example, Figures 19 to 23 The magnetic assembly 100 may include a second lead frame (not shown) on which the electronic assembly 50 may be located. This arrangement allows the insulating material 40 to cover one or more block coils 10, the magnetic core 30, and the substrate 20, but not the electronic assembly 50 and / or the second lead frame. By not covering the electronic assembly 50 and / or the second lead frame, the amount of insulating material 40 may be reduced, which may reduce cost and manufacturing time, and may reduce the risk of short circuits. Additional electronic assemblies 50 and lead frames 60 may be attached to the same surface and / or different surfaces of the second lead frame.

[0068] The magnetic core 30 may have any suitable shape, including Figures 1 to 3 as well as Figure 5 The ring shown or other suitable shapes, such as Fig.24 The EI or EE core 31 shown, Fig.25 The straight or rod-shaped magnetic core 32 shown, the oval magnetic core (not shown), etc. The magnetic cores 30, 31, 32 may include any suitable magnetic material, including, for example, ferrite. The magnetic cores 30, 31, 32 may be coated or uncoated. Coating the magnetic cores 30, 31, 32 may improve isolation. The coating may be any suitable material, including, for example, epoxy, polyimide, etc. The magnetic cores 30, 31, 32 may be attached to the substrate 20 or the block coil 10. If the magnetic cores 30, 31, 32 are attached to the block coil 10, the magnetic cores 30, 31, 32 may be attached to the inner upper surface of the block coil 10.

[0069] Figure 6 and Figure 7The block coil 10 is shown. The block coil 10 may include a resin body 17 and a terminal 11. The resin body 17 may include two legs 13 connected by a bridge 14 to define a cavity or groove 16 that accommodates a portion of the magnetic core 30. The resin body 17 may have a Figure 6 and Figure 7 The U-shape shown, or may have any suitable shape such that the resin body 17 extends over or bridges the magnetic core 30. The resin body 17 may extend over three sides of the cross-section of the magnetic core 30. The resin body 17 may include slots 15 (the terminals 11 may be located or embedded in the slots 15), and may define a flat pick-up surface that a pick-and-place machine may use to accurately place the block coil 10 on the substrate 20 at one time. That is, multiple turns of winding may be produced at one time. In addition, the block coil 10 provides a structure that protects the terminals 11 and prevents or significantly reduces the possibility of any short circuits. Because the resin body 17 allows different arrangements of the terminals 11 to be used with the same resin body 17, the same resin body 17 may be used in different applications, which may save design costs because a different resin body 17 does not have to be made for each application. For example, if the resin body 17 is made by a molding process, the same mold may be used for different applications, thereby saving design costs. Figure 6 and Figure 7 In the finished product, for example, the groove 15 in the resin body 17 is visible, but in the finished product, the groove 15 may not be visible, for example, in the case of using a resin mold that fills the gap in the groove 15.

[0070] The resin body 17 may be made of any suitable insulating material, including, for example, a liquid crystal polymer (LCP) resin, and may be made in any suitable manner. The terminal 11 may be made of any suitable conductive material, including, for example, copper or a copper alloy.

[0071] Figure 6 Twelve terminals 11 and four empty slots 15 are shown. Any number of terminals 11 may be used, including, for example, 14, 16, 18, 20, or more than 20 terminals. The terminals 11 may have a plurality of Figure 6 and Figure 7 The U-shape shown may be any suitable shape such that the terminal 11 extends over or bridges the magnetic core 30. The terminal 11 may extend over three sides of the cross section of the magnetic core 30. The terminal 11 may include a foot 12 that can be surface mounted to the substrate 20. Alternatively, the terminal 11 may be connected to the substrate 20 in any suitable manner. The foot 12 of the terminal 11 may be attached to the substrate 20 such that the block coil 10 including the resin body 17 is located on or over the substrate 20. The terminal 11 may be located or embedded in a slot 15 in the block coil 10. Figure 6 As shown, not all slots 15 necessarily have corresponding terminals 11. Figure 6 In the embodiment, four slots 15 have no corresponding terminals 11, but any number of slots 15 may be empty. Figure 6 Sixteen slots 15 are shown, but any number of slots 15 may be used.

[0072] The terminals 11 in the block coil 10 and the traces 23 on or in the substrate 20 may be included in the windings of the magnetic assembly 100. If the windings include a primary winding and a secondary winding, some of the terminals 11 may be included in the primary winding and connected to the primary trace 23, and some of the terminals 11 may be included in the secondary winding and connected to the secondary trace 23. Alternatively, all of the terminals 11 in the block coil 10 may be included in the primary winding and connected to the primary trace 23, or may be included in the secondary winding and connected to the secondary trace 23. If all of the terminals 11 in one block coil 10 are included in the primary winding, all of the terminals 11 in another block coil 10 may be included in the secondary winding, and vice versa. If all of the terminals 11 in one block coil 10 are included in the primary winding, the other block may include the terminals 11 in both the primary winding and the secondary winding, and vice versa.

[0073] The terminals 11 in the block coil 10 may be included in groups. Which terminal group each terminal 11 belongs to is determined by the traces 23 on the substrate 20. For example, for one substrate 20, all the terminals 11 may belong to the first terminal group, while for another substrate 20, adjacent terminals 11 may belong to two different terminal groups (i.e., the first terminal group or the second terminal group). Figure 6 Two terminal groups are shown, a first terminal group and a second terminal group. Figure 6 In the embodiment, the first terminal group includes four first terminals 11 located at both ends of the block coil 10, and the second terminal group includes four second terminals 11 located in the middle of the block coil 10 between the first terminals 11 of the first terminal group. Other arrangements are also possible. For example, the first and second terminals 11 can alternate along the length of the block coil 10 so that each terminal 11 of one terminal group can be between two terminals 11 of the other terminal group. Alternatively, the terminal groups do not have to be split. That is, the terminals 11 of the first terminal group can be located at one end of the block coil 10 (e.g., seven first terminals 11 at one end), and the terminals 11 of the second terminal group can be located at the other end of the block coil 10 (e.g., seven second terminals 11 at the other end, with two slots 15 in the middle without any terminals 11). The terminals 11 can also be arranged in a two-wire arrangement, in which two windings are arranged adjacent to each other. For example, adjacent terminals 11 can be connected to the first primary winding or the second primary winding.

[0074] Each terminal 11 in the first terminal group or the second terminal group can be closer to the adjacent terminal 11 of the same group than the terminal 11 of the other group. That is, each first terminal 11 can be closer to another first terminal 11 than any second terminal 11, and each second terminal 11 can be closer to another second terminal 11 than any first terminal 11. The grooves 15 between adjacent terminal groups can be empty (that is, the number of terminals 11 can be reduced or lowered) to help improve the isolation between the first terminal group and the second terminal group. More empty grooves 15 between adjacent terminal groups can improve the isolation between terminal groups. Adjacent terminal groups can be spaced apart from each other. Alternatives include empty grooves 15, and adjacent terminal groups can be spaced farther apart from each other than adjacent terminals 11 in a terminal group. For example, the distance between adjacent terminal groups can be twice the distance between adjacent terminals 11 in a terminal group, and there are no empty grooves 15 between adjacent terminal groups.

[0075] Figure 8 Two block coils 10 are shown with terminals 11 of different widths. Figure 8 As shown, the terminals 11 of each block coil 10 may have the same width. Alternatively, terminals 11 of different widths may be included in the same block coil 10.

[0076] Fig.10 A cross section of two block coils 10 connected to a multilayer substrate 20 is shown. Fig.10 Various minimum distances are shown to ensure adequate isolation. For example, the wall of the resin body 17 should be at least 0.4 mm thick so that the terminal 11 is at least 0.4 mm from the cavity or groove 16 in the block coil 10. If the core 30 is coated, the 0.4 mm wall thickness can be reduced to, for example, 0.2 mm. The isolation distance will depend on the application. The minimum distance between the core 30 and the wall of the resin body 17 can be 0.0 mm so that there is no distance between the core 30 and the wall of the resin body 17. On the surface of the substrate 20, the minimum distance between the traces or conductive patterns 23 of the primary and secondary circuits should be at least 0.4 mm.

[0077] like Fig.10 As shown, the substrate 20 may include laser vias, which may be created by a laser and do not necessarily extend all the way through the substrate 20, and may include buried vias, which may extend between internal layers of the substrate 20 but not to the outer surface of the substrate 20. Within manufacturing and / or measurement tolerances, each of the multiple layers of the substrate 20 may be 0.05 mm or approximately 0.05 mm. Fig.10As shown, the primary trace 23 and the secondary trace 23 can be separated by three internal layers so that the total distance between the primary trace 23 and the secondary trace 23 is at least 0.15 mm to ensure sufficient isolation. Although the minimum distance between the primary circuit and the secondary circuit is required to be 0.4 mm on the surface of the substrate 20, the minimum distance between the primary circuit and the secondary circuit inside the substrate 20 depends on the isolation requirements of each product. Other distances are also possible. For example, Fig.18 , Distance 1 is the thickness of the wall of the block coil 10, and may be about 0.01 mm to about 2.0 mm within manufacturing and / or measurement tolerances; Distance 2 is the distance between the trace 23 on the top layer of the substrate 20 and the magnetic core 30, and may be about 0.01 mm to about 2.0 mm within manufacturing and / or measurement tolerances; and Distance 3 is the minimum distance between the block coils 10 (i.e., Fig.18 The distance between the legs 12 of the terminals 11 in FIG. 1 ) and may be about 0.01 mm to about 2.0 mm within manufacturing and / or measurement tolerances.

[0078] Figure 26 to Figure 31 Possible different substrates 20 that may be used in the magnetic assembly 100 or the electronic module 200 are shown. Figures 26 to 30 Different possible multilayer substrates 20 are shown, and Fig.31 A single-layer substrate 20 is shown. Figures 26 to 30 As shown, the substrate 20 may include multiple layers, including a top mask 24, one or more prepreg layers 27, a core layer 28, one or more prepreg layers 27, and a bottom mask 24. The core layer 28 may also include a core prepreg layer 28a. The core layer 28 may include any suitable material, including, for example, FR-4. The traces 23 may be included on the top and bottom surfaces of the substrate 20, and may be included in the internal layers of the substrate 20. The traces 23 on different layers may be connected by vias. The vias may include holes in the substrate 20 that are plated with a conductive material (including, for example, a metal or a metal alloy) and filled with any suitable material (including, for example, a resin). Alternatively, the vias may be filled only with a conductive material. The vias may be made in any suitable manner, including, for example, mechanical drilling or laser drilling. Any suitable vias may be used, including buried vias (i.e., buried vias, where neither side of the via is exposed on the top or bottom surface of substrate 20), blind vias (where one side of the via is exposed on the top or bottom surface of substrate 20), and through vias (where both sides of the via are exposed on the top or bottom surface of substrate 20). Trace 23 may include copper or other suitable conductive material. Similarly, as Fig.31 As shown, substrate 20 may include a single layer including top mask 24 , core layer 28 , and bottom mask 24 . Fig.31 The traces 23 in FIG. 2 may be located on the top surface or the bottom surface of the substrate 20 .

[0079] Fig.26 A multilayer substrate 20 is shown, which includes a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, the top surface of the core prepreg layer 28a, and the bottom surface of the core layer 28.

[0080] Fig. 27 A multilayer substrate 20 is shown, which includes a top mask 24, a prepreg layer 27, a core prepreg layer 28a, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20, the top surface of the core prepreg layer 28a, and the bottom surface of the core layer 28.

[0081] Fig.28 A multilayer substrate 20 is shown including a top mask 24, a prepreg layer 27, a core layer 28, three prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20 and the top and bottom surfaces of the core layer 28.

[0082] Fig.29 A multilayer substrate 20 is shown including a top mask 24, a prepreg layer 27, a core layer 28, a prepreg layer 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20 and the top and bottom surfaces of the core layer 28.

[0083] Fig.30 A multilayer substrate 20 is shown including a top mask 24, two prepreg layers 27, a core layer 28, two prepreg layers 27, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20 and the top and bottom surfaces of the core layer 28.

[0084] Figures 26 to 30 The multi-layer substrate in the embodiment makes it easier to position the primary traces and the secondary traces or conductive patterns 23 and provide insulation between the primary traces and the secondary traces or conductive patterns 23. If multiple block coils 10 are used, then Figures 26 to 30 The multi-layer substrate in can more easily provide isolation between the primary traces and the secondary traces or conductive patterns 23.

[0085] Fig.31 The bottom of FIG. 2 shows a single layer substrate 20, which includes a top mask 24, a core layer 28, and a bottom mask 24. Traces 23 are located on the top and bottom surfaces of the substrate 20. Fig.31The upper portion of FIG. 1 shows a magnetic assembly 100 that includes two block coils 10 mounted to a single-layer substrate 20 and includes a magnetic core 30. The trace 23 is located on the top surface of the single-layer substrate 50. The single-layer substrate 20 allows for a smaller magnetic assembly 100 or electronic module 200. As an example, one of the block coils 10 may include a primary terminal 11, and the other block coil 10 may include a secondary terminal 11, so that a primary trace 23 connected to the primary terminal 11 and a secondary trace 23 connected to the secondary terminal may be located on the same surface of the substrate 10.

[0086] like Fig.10 As shown, portions of the secondary trace 23 and the primary trace 23 may overlap vertically, which may improve the coupling between the primary winding and the secondary winding. The greater the overlap between the primary winding and the secondary winding, the greater the coupling between the primary winding and the secondary winding. If the primary trace 23 or the secondary trace 23 is located on an adjacent layer, the resistance may be reduced. That is, if the primary traces 23 on different layers are separated by only a single layer, the resistance in the primary winding may be reduced, and if the secondary traces 23 on different layers are separated by only a single layer, the resistance in the secondary winding may be reduced.

[0087] Figures 11 to 15 A method of manufacturing an electronic module 200 having a block coil 10 mounted to a substrate 20 is shown. Fig.11 It is shown that a substrate 20 is provided and then solder paste 25 is applied. The substrate 20 may be one of the substrates 20 described above, and may be a multi-layer substrate or a single-layer substrate. Fig.12 Glue or adhesive 26 is shown dispensed onto substrate 20. Glue or adhesive 26 may be dispensed as part of a surface mount technology (SMT) process or separate from the SMT process. Fig.13 The placement of the magnetic core 30 and the electronic components 50 are shown. Fig.14 The placement of two block coils 10 extending over or bridging the magnetic core 30 is shown. Fig.15 An insulating material 40 is shown covering the substrate 20 , the electronic components 50 , the magnetic core 30 , and the block coil 10 . Fig.15 The insulating material 40 is shown to cover the entire substrate 20, but the insulating material 40 may cover only a portion of the substrate 20 and / or only one or some of the electronic components 50, the magnetic core 30, and the block coil 10. Typically, a mother substrate may be used, wherein an array of electronic modules 200 is included in the mother substrate. The mother substrate is then cut or singulated to form individual electronic modules 200. Alternatively, individual electronic modules 200 may be manufactured without using a mother substrate.

[0088] Figures 19 to 23 Shown with Figure 1The magnetic assembly 100 is similar to the magnetic assembly 100. For the sake of brevity, the description of similar components is not repeated. The magnetic assembly 100 may include Figure 1 The magnetic assembly 100 includes a coil 10 and a magnetic core 30 .

[0089] Figures 19 to 23 The magnetic assembly 100 and Figure 1 The magnetic assembly 100 differs in that Figures 19 to 23 The block coil 10 of the magnetic assembly 100 is connected to the lead frame 60 instead of the substrate 20 . Figures 19 to 23 The magnetic assembly 100 includes an insulating material 40, which is applied to Figure 4 The insulating material 40 of the electronic module 200 is similar. Figures 19 to 21 Insulating material 40 is shown as transparent, but in Fig.23 , the insulating material 40 is shown as opaque. For clarity, Fig. 22 One of the block coils 10 and the insulating material 40 are not shown.

[0090] Although not shown, additional electronic components may be included to form the electronic module 200 , such that the magnetic assembly 100 may be part of a DC-DC converter, for example.

[0091] The lead frame 60 may include mounting terminals 62 and a conductive pattern 61. The mounting terminals 62 may be used to connect the lead frame 60 and the magnetic assembly 100 or the electronic module 200 to a main substrate (not shown). The conductive pattern 61 is similar to the trace 23 included on or within the substrate 20, and as similarly described above, the conductive pattern 61 may connect one or more terminals 11 to define a single-turn winding. The conductive pattern 61 may determine to which winding the terminal 11 is connected. For example, the conductive pattern 61 may be connected to the terminal 11 so that one block coil 10 includes two turns of a primary winding and another block coil includes four turns of a secondary winding. Figures 19 to 23 The terminals 11 in the block coil 10 of the magnetic assembly 100 can be separated into different terminal groups, as described above. Figure 1 The magnetic assembly 100 includes a block coil 10 as described above.

[0092] It should be understood that the foregoing description is only for illustrating the present invention. Various substitutions and modifications may be devised by those skilled in the art without departing from the present invention. Therefore, the present invention is intended to include all such substitutions, modifications and variations that fall within the scope of the appended claims.

Claims

1. An electronic module, comprising: a first substrate or a first lead frame; a second substrate or a second lead frame, located on the first substrate or the first lead frame and comprising a primary conductive pattern and a secondary conductive pattern; a magnetic core, located on or above the second substrate or the second lead frame; Block coil, including: a resin body located on or over the second substrate or the second lead frame and extending over the magnetic core; a first terminal on or embedded in the resin body and connected to the primary conductive pattern; and a second terminal on or embedded in the resin body and connected to the secondary conductive pattern; an electronic component, located on the first substrate or the first lead frame; and An insulating material covers the second substrate or the second lead frame, the magnetic core and the block coil.

2. The electronic module according to claim 1, wherein: The block coil includes an additional first terminal and an additional second terminal; The first terminal and the additional first terminal define a first terminal group; and The second terminal and the additional second terminal define a second terminal group.

3. The electronic module according to claim 2, wherein: Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

4. The electronic module according to claim 2, wherein: The first terminal group is disposed adjacent to the second terminal group and is spaced apart from the second terminal group.

5. The electronic module according to claim 1, wherein: The electronic module includes the second substrate; and The second substrate includes a first layer and a second layer.

6. The electronic module according to claim 5, wherein: The primary conductive pattern is in the first layer; The secondary conductive pattern is in the second layer; as well as From a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap.

7. The electronic module according to claim 6, further comprising: adding a primary conductive pattern in the third layer of the second substrate; as well as Additional secondary conductive pattern, in the fourth layer of the second substrate, wherein From a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap.

8. The electronic module according to claim 1, wherein: The magnetic core is located on or above a first surface of the first substrate or the first lead frame.

9. The electronic module according to claim 8, wherein: The electronic component is located on a second surface of the first substrate or the first lead frame opposite to the first surface.

10. The electronic module according to claim 8, wherein: The electronic component is located on the first surface of the first substrate or the first lead frame.

11. The electronic module according to claim 10, wherein: The electronic component is located between the first substrate and the second substrate.

12. The electronic module according to claim 1, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

13. An electronic module comprising: a first substrate or a first lead frame; a second substrate or a second lead frame, located above the first substrate or the first lead frame and comprising a conductive pattern; a magnetic core, located on or above the second substrate or the second lead frame; A first coil and a second coil, each of the first coil and the second coil comprising: a resin body located on or over the substrate or the lead frame and extending over the magnetic core; and a first terminal on or embedded in the resin body and connected to the conductive pattern; an electronic component, located on the first substrate or the first lead frame; and An insulating material covers the second substrate or the second lead frame, the magnetic core and the block coil.

14. The electronic module according to claim 13, wherein: The conductive pattern is a primary conductive pattern; and The first terminal of the first coil is connected only to the primary conductive pattern.

15. The electronic module according to claim 13, wherein: The conductive pattern is a secondary conductive pattern; and The first terminal of the second coil is connected only to the secondary conductive pattern.

16. The electronic module according to claim 13, further comprising a third coil, the third coil comprising a first terminal and a second terminal, wherein: The first terminal is connected to the primary conductive pattern; and The second terminal is connected to the secondary conductive pattern.

17. The electronic module according to claim 13, wherein: The first coil includes a first terminal group and a second terminal group; and The first terminal is included in the first terminal group.

18. The electronic module according to claim 17, wherein: Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

19. The electronic module according to claim 17, wherein: Each terminal in the first terminal group and each terminal in the second terminal group are connected to a corresponding primary conductive pattern.

20. The electronic module according to claim 17, wherein: Each terminal in the first terminal group and each terminal in the second terminal group are connected to a corresponding secondary conductive pattern.

21. The electronic module according to claim 17, wherein: The first terminal group is disposed adjacent to the second terminal group and is spaced apart from the second terminal group.

22. The electronic module according to claim 13, wherein: The electronic module includes the second substrate; and The second substrate includes a first layer and a second layer.

23. The electronic module according to claim 22, further comprising: a primary conductive pattern in the first layer; as well as A secondary conductive pattern, in the second layer, wherein From a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap.

24. The electronic module according to claim 23, further comprising: adding a primary conductive pattern in the third layer of the second substrate; as well as Additional secondary conductive pattern, in the fourth layer of the second substrate, wherein From a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap.

25. The electronic module according to claim 13, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

26. The electronic module according to claim 13, wherein: The magnetic core is located on or above a first surface of the first substrate or the first lead frame.

27. The electronic module according to claim 26, wherein: The electronic component is located on a second surface of the first substrate or the first lead frame opposite to the first surface.

28. The electronic module according to claim 26, wherein: The electronic component is located on the first surface of the first substrate or the first lead frame.

29. The electronic module according to claim 28, wherein: The electronic component is located between the first substrate and the second substrate.

30. An electronic module comprising: a first substrate or a first lead frame; a second substrate or a second lead frame, located on the first substrate or the first lead frame and comprising a primary conductive pattern and a secondary conductive pattern; A conductive pin, located between the first substrate and the second substrate or between the first lead frame and the second lead frame; a magnetic core, located on or above the second substrate or the second lead frame; Block coil, including: a resin body located on or over the second substrate or the second lead frame and extending over the magnetic core; a first terminal on or embedded in the resin body and connected to the primary conductive pattern; and a second terminal on or embedded in the resin body and connected to the secondary conductive pattern; an electronic component, located on the first substrate or the first lead frame; and An insulating material covers the second substrate or the second lead frame, the magnetic core and the block coil.

31. The electronic module according to claim 30, wherein: The block coil includes an additional first terminal and an additional second terminal; The first terminal and the additional first terminal define a first terminal group; and The second terminal and the additional second terminal define a second terminal group.

32. The electronic module according to claim 31, wherein: Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

33. The electronic module according to claim 31, wherein: The first terminal group is disposed adjacent to the second terminal group and is spaced apart from the second terminal group.

34. The electronic module according to claim 30, wherein: The electronic module includes the second substrate; and The second substrate includes a first layer and a second layer.

35. The electronic module according to claim 34, wherein: The primary conductive pattern is in the first layer; The secondary conductive pattern is in the second layer; as well as From a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap.

36. The electronic module according to claim 35, further comprising: adding a primary conductive pattern in the third layer of the second substrate; as well as Additional secondary conductive pattern, in the fourth layer of the second substrate, wherein From a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap.

37. The electronic module according to claim 30, wherein: The magnetic core is located on or above a first surface of the first substrate or the first lead frame.

38. The electronic module according to claim 37, wherein: The electronic component is located on a second surface of the first substrate or the first lead frame opposite to the first surface.

39. The electronic module according to claim 37, wherein: The electronic component is located on the first surface of the first substrate or the first lead frame.

40. The electronic module according to claim 39, wherein: The electronic component is located between the first substrate and the second substrate.

41. The electronic module according to claim 30, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

42. An electronic module comprising: a first substrate or a first lead frame; a second substrate or a second lead frame, located above the first substrate or the first lead frame and comprising a conductive pattern; A conductive pin, located between the first substrate and the second substrate or between the first lead frame and the second lead frame; a magnetic core, located on or above the second substrate or the second lead frame; A first coil and a second coil, each of the first coil and the second coil comprising: a resin body located on or over the substrate or the lead frame and extending over the magnetic core; and a first terminal on or embedded in the resin body and connected to the conductive pattern; an electronic component, located on the first substrate or the first lead frame; and An insulating material covers the second substrate or the second lead frame, the magnetic core and the block coil.

43. The electronic module according to claim 42, wherein: The conductive pattern is a primary conductive pattern; and The first terminal of the first coil is connected only to the primary conductive pattern.

44. The electronic module according to claim 42, wherein: The conductive pattern is a secondary conductive pattern; and The first terminal of the second coil is connected only to the secondary conductive pattern.

45. The electronic module according to claim 42, further comprising a third coil, the third coil comprising a first terminal and a second terminal, wherein: The first terminal is connected to the primary conductive pattern; and The second terminal is connected to the secondary conductive pattern.

46. ​​The electronic module according to claim 42, wherein: The first coil includes a first terminal group and a second terminal group; and The first terminal is included in the first terminal group.

47. The electronic module according to claim 46, wherein: Each terminal in the first terminal group is connected to a corresponding primary conductive pattern; and Each terminal in the second terminal group is connected to a corresponding secondary conductive pattern.

48. The electronic module according to claim 46, wherein: Each terminal in the first terminal group and each terminal in the second terminal group are connected to a corresponding primary conductive pattern.

49. The electronic module according to claim 46, wherein: Each terminal in the first terminal group and each terminal in the second terminal group are connected to a corresponding secondary conductive pattern.

50. The electronic module according to claim 46, wherein: The first terminal group is disposed adjacent to the second terminal group and is spaced apart from the second terminal group.

51. The electronic module according to claim 42, wherein: The electronic module includes the second substrate; and The second substrate includes a first layer and a second layer.

52. The electronic module of claim 51 , further comprising: a primary conductive pattern in the first layer; as well as A secondary conductive pattern, in the second layer, wherein From a side view of the second substrate, a portion of the primary conductive pattern and a portion of the secondary conductive pattern vertically overlap.

53. The electronic module of claim 52, further comprising: adding a primary conductive pattern in the third layer of the second substrate; as well as Additional secondary conductive pattern, in the fourth layer of the second substrate, wherein From a side view of the second substrate, a portion of the additional primary conductive pattern and a portion of the additional secondary conductive pattern vertically overlap.

54. The electronic module according to claim 42, wherein: The electronic components include an integrated circuit IC and / or a capacitor.

55. The electronic module according to claim 42, wherein: The magnetic core is located on or above a first surface of the first substrate or the first lead frame.

56. The electronic module according to claim 55, wherein: The electronic component is located on a second surface of the first substrate or the first lead frame opposite to the first surface.

57. The electronic module according to claim 55, wherein: The electronic component is located on the first surface of the first substrate or the first lead frame.

58. The electronic module according to claim 57, wherein: The electronic component is located between the first substrate and the second substrate.

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