Preparation equipment and process of gold bump for chip

Abstract

The invention relates to the related technical field of chip processing equipment, in particular to equipment and process for preparing a gold bump for a chip, and the equipment comprises a gluing mechanism, an exposure mechanism, a developing mechanism, a sputter coating mechanism, an evaporation mechanism, a photoresist removing mechanism and an annealing mechanism, the sputter coating mechanism comprises an equipment rack, a material seat, a sealing plate, a sputter coating module and a vacuumizing module, a front support and a rear support are fixedly installed on the equipment rack, and a stepping motor is fixedly installed on the front support. The gold bump preparation equipment for the chip is composed of a gluing mechanism, an exposure mechanism, a developing mechanism, a sputter coating mechanism, an evaporation mechanism, a photoresist removing mechanism and an annealing mechanism, and the sputter coating mechanism is composed of an equipment rack, a material seat, a sealing plate, a sputter coating module and a vacuumizing module. And therefore, the equipment rack is driven through the stepping motor, continuous machining of the device is achieved, and the machining efficiency of the equipment is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip processing equipment, and in particular to equipment and a process for preparing gold bumps for chips. Background Art

[0002] Gold and copper-nickel-gold bump technology is applied to the packaging and testing of display driver chips. As display pixels become higher and higher, the number of driver chip pins continues to increase, and the number of bumps per chip continues to increase, even to more than 4,000. Due to the increase in the number of gold bumps, the chip size continues to shrink, and the cost reduction demand due to the rising gold price, the spacing and size of the gold bumps are also shrinking, and the bumps are becoming more and more slender, and the structural stability requirements of the bumps are getting higher and higher; However, in the prior art, the preparation process of gold bumps requires an electroplating process, but the current mainstream stable formula of the electroplating solution is a cyanide-containing plating solution, which is highly toxic, resulting in the need for more protective measures during the processing process, which is more troublesome. In order to avoid the electroplating process, a commonly used solution in the prior art is to adopt a sputtering coating method, but this process needs to be maintained in a vacuum environment. The traditional vacuuming method is to use a vacuum pump for exhaust, so that the circuit structure of the device is more complicated, and the equipment cannot achieve continuous processing, which affects the processing efficiency of the equipment to a certain extent. For this reason, the present invention proposes a preparation device and process for gold bumps for chips to solve the above problems. Summary of the invention

[0003] The purpose of the present invention is to provide a device and process for preparing gold bumps for chips to solve the problems raised in the above background technology.

[0004] To achieve the above object, the present invention provides the following technical solution: a device for preparing gold bumps for chips, comprising a coating mechanism, an exposure mechanism, a developing mechanism, a sputtering coating mechanism, an evaporation mechanism, a degumming mechanism and an annealing mechanism, wherein the sputtering coating mechanism comprises: An equipment rack, on which a front bracket and a rear bracket are fixedly mounted, and on which a stepping motor is fixedly mounted: A material seat, the material seat is fixedly connected to the output shaft of the stepper motor, and a material slot is provided on the material seat, a limit stopper is fixedly connected to the rear port of the material slot, the material slot is used to place the chip to be processed, and the limit stopper is used to limit the chip to be processed, and a gold bump is formed on the chip; A sealing plate, which is fixed on the rear bracket and has a blocking effect on the rear end surface of the material trough, and a material port is provided on the sealing plate; A sputtering coating module, wherein the sputtering coating module is fixed to the outer side of the sealing plate, and a coating port of the sputtering coating module is aligned with a material port on the sealing plate; A vacuum pumping module is used to extract the gas in the material slot between the chip and the sealing plate.

[0005] Preferably, an air groove is opened on the side wall of the material trough, an air hole is opened through the side of the air groove, a first-level air pipe connecting port is formed at the end of the air hole, a first-level sealing rubber layer is fixedly glued to the rear side of the material seat, a second-level sealing rubber layer is fixedly glued to the front side of the sealing plate, and a third-level sealing rubber layer is fixedly glued to the side wall of the material trough.

[0006] Preferably, the air groove and the limit stopper are arranged on the same plane.

[0007] Preferably, the vacuum module is composed of a vacuum mechanism and a stress-bearing frame combination, the vacuum mechanism is fixed to the front side of the material seat through a positioning hoop, a positioning ring is fixedly installed on the rear bracket, and the stress-bearing frame is fixedly connected to the positioning ring through a connecting bracket.

[0008] Preferably, the vacuum mechanism includes a cylinder body, a sealing cover, a piston and a return spring combination, the cylinder body is positioned by a positioning hoop, the sealing cover is fixedly connected to the port of the cylinder body, and a force rod hole, an air inlet hole and an exhaust hole are provided on the sealing cover, the piston is movably arranged in the inner cavity of the cylinder body, and the inner end surface of the piston is connected to the return spring, the outer end surface of the piston is fixedly connected to a force rod, and the force rod is movably arranged through the force rod hole, the outer ports of the air inlet hole and the exhaust hole are respectively connected to a secondary air pipe connecting port and a tertiary air pipe connecting port, the secondary air pipe connecting port is connected to the primary air pipe connecting port through a connecting air pipe, the tertiary air pipe connecting port is connected to an exhaust pipe, and the secondary air pipe connecting port and the tertiary air pipe connecting port are respectively provided with an intake check valve and an exhaust check valve.

[0009] Preferably, the stress-bearing frame is an annular frame structure arranged in a plum blossom shape, and when the stress-bearing rod contacts the larger radius portion of the stress-bearing frame, the reset spring is in a reset state, and when the stress-bearing rod contacts the smaller radius portion of the stress-bearing frame, the reset spring is in a compressed state.

[0010] Preferably, the outer end of the force-bearing rod is hemispherical, a rubber sealing ring is provided between the cylinder body and the sealing cover, a sealing groove is provided on the side wall of the force-bearing rod hole, a rubber sealing ring is embedded in the sealing groove, and when the vacuum mechanism is actually assembled, the rubber sealing ring and the rubber sealing ring are both under pressure.

[0011] Preferably, a pressure stabilizing hole is provided at the bottom of the cylinder body.

[0012] Preferably, the sealing plate is a three-quarter circular plate, point A on the material seat is a chip loading point, and point B on the material seat is a chip unloading point.

[0013] A process for preparing gold bumps for chips, which is realized by the above-mentioned gold bump preparation equipment for chips, and the process includes a glue coating process, a colloid exposure process, a developing process, a sputtering coating process, an evaporation process, a degumming process and an annealing process.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. By setting up a chip gold bump preparation device composed of a coating mechanism, an exposure mechanism, a developing mechanism, a sputtering coating mechanism, an evaporation mechanism, a degumming mechanism and an annealing mechanism, and setting the sputtering coating mechanism to be composed of a device frame, a material seat, a sealing plate, a sputtering coating module and a vacuum module, the device frame is driven by a stepping motor, thereby realizing continuous processing of the device, so as to effectively improve the processing efficiency of the equipment; 2. The vacuum module is configured to be composed of a vacuum mechanism and a force-bearing frame, and the vacuum mechanism is configured to be composed of a cylinder body, a sealing cover, a piston and a return spring, and a force rod is arranged on the outer end face of the piston, so that the force rod and the force frame are in contact with force through the rotation of the material seat, thereby driving the piston to move, and the gas between the chip and the sealing plate is extracted through the action of the air intake check valve and the exhaust check valve on the secondary air pipe connection port and the tertiary air pipe connection port, thereby ensuring that the position between the two is in a relative vacuum state. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a front schematic diagram of the present invention; Figure 2 for Figure 1 A magnified schematic diagram of the structure at C in the middle; Figure 3 It is a schematic diagram of the back side of the present invention; Figure 4 This is a schematic diagram of the sealing plate structure of the present invention; Figure 5 This is a schematic diagram of the material seat structure of the present invention; Figure 6 for Figure 5 A magnified schematic diagram of the structure at D in the middle; Figure 7 for Figure 6 The enlarged schematic diagram of the structure at E in the middle; Figure 8 It is a cross-sectional view of the material seat of the present invention; Fig. 9 for Figure 8 A magnified schematic diagram of the structure at F in the middle; Fig.10 It is a schematic diagram of the vacuum pumping mechanism of the present invention; Fig.11 It is a schematic diagram of the sealing cover structure of the present invention.

[0016] In the figure: material seat 1, sealing plate 2, sputtering coating module 3, stepping motor 4, front bracket 5, equipment frame 6, rear bracket 7, vacuum mechanism 8, force frame 9, material slot 10, limit block 11, air slot 12, air hole 13, primary air pipe connecting port 14, positioning hoop 15, chip 16, gold bump 17, cylinder body 18, sealing cover 19, piston 20, return spring 21, force rod hole 22, air inlet hole 23, exhaust hole 24, secondary air pipe connecting port 25, tertiary air pipe connecting port 26, force rod 27, pressure stabilizing hole 28, rubber sealing ring 29, rubber sealing ring 30, positioning ring 31, connecting bracket 32, primary sealing rubber layer 35, secondary sealing rubber layer 36, tertiary sealing rubber layer 37. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] See also Figure 1-11 The present invention provides the following three preferred embodiments: Embodiment 1: A preparation device for gold bumps for chips, including a coating mechanism, an exposure mechanism, a developing mechanism, a sputtering coating mechanism, an evaporation mechanism, a degumming mechanism and an annealing mechanism, wherein the sputtering coating mechanism includes an equipment frame 6, a material seat 1, a sealing plate 2, a sputtering coating module 3 and a vacuum module, a front bracket 5 and a rear bracket 7 are fixedly mounted on the equipment frame 6, a stepping motor 4 is fixedly mounted on the front bracket 5, the material seat 1 is fixedly connected to the output shaft of the stepping motor 4, and a material slot 10 is opened on the material seat 1, and the material slot 10 is provided with a material slot 10. A limit stopper 11 is fixedly connected to the rear port position, the material slot 10 is used to place the chip 16 to be processed, and the limit stopper 11 is used to limit the chip 16 to be processed, and a gold bump 17 is formed on the chip 16, the sealing plate 2 is fixed on the rear bracket 7, and the sealing plate 2 forms a blocking effect on the rear end face of the material slot 10, and a material port is opened on the sealing plate 2, the sputtering coating module 3 is fixed on the outer side of the sealing plate 2, and the coating port of the sputtering coating module 3 is aligned with the material port on the sealing plate 2, and the vacuum module It is used to extract the gas in the material slot 10 between the chip 16 and the sealing plate 2. An air slot 12 is opened on the side wall of the material slot 10. An air hole 13 is opened through the side of the air slot 12. The end of the air hole 13 is formed with a first-level air pipe connection port 14. The rear side of the material seat 1 is fixedly glued with a first-level sealing rubber layer 35, the front side of the sealing plate 2 is fixedly glued with a second-level sealing rubber layer 36, and the side wall of the material slot 10 is fixedly glued with a third-level sealing rubber layer 37 to ensure the sealing of the contact position between the material seat 1 and the sealing plate 2, thereby In order to maintain the vacuum environment, the gas groove 12 and the limit stop block 11 are arranged in the same plane, and a gold bump preparation device for a chip is arranged which is composed of a gluing mechanism, an exposure mechanism, a developing mechanism, a sputtering coating mechanism, an evaporating mechanism, a degumming mechanism and an annealing mechanism, and the sputtering coating mechanism is arranged to be composed of a device frame 6, a material seat 1, a sealing plate 2, a sputtering coating module 3 and a vacuum module, so that the device frame 6 is driven by a stepping motor 4, thereby realizing continuous processing of the device, so as to effectively improve the processing efficiency of the equipment.

[0019] Embodiment 2: On the basis of embodiment 1, the vacuum module is composed of a vacuum mechanism 8 and a force frame 9, the vacuum mechanism 8 is fixed to the front side of the material seat 1 through a positioning hoop 15, a positioning ring 31 is fixedly installed on the rear bracket 7, and the force frame 9 is fixedly connected to the positioning ring 31 through a connecting bracket 32. The vacuum mechanism 8 includes a cylinder body 18, a sealing cover 19, a piston 20 and a return spring 21. The cylinder body 18 is positioned by the positioning hoop 15, and the sealing cover 19 is fixedly connected to the port of the cylinder body 18, and the sealing cover 19 is provided with a force rod hole 22, an air inlet 23 and an exhaust hole 24. The piston 20 is movably arranged in the inner cavity of the cylinder body 18, and the inner end surface of the piston 20 is connected to the return spring 21, and the outer end surface of the piston 20 is fixedly connected with a force rod 27, and the force rod 27 is movably arranged through the force rod hole 22, and the outer ports of the intake hole 23 and the exhaust hole 24 are respectively connected with the secondary air pipe connection port 25 and the tertiary air pipe connection port 26, the secondary air pipe connection port 25 is connected to the primary air pipe connection port 14 through the connecting air pipe, and the tertiary air pipe connection port 26 is connected with the exhaust pipe, and the secondary air pipe connection port 25 and the tertiary air pipe connection port 26 are respectively provided with an intake check valve and an exhaust check valve.

[0020] The stressed frame 9 is an annular frame structure arranged in a plum blossom shape. The stressed frame 9 is arranged in a plum blossom shape to realize multiple reciprocating movements of the piston 20, thereby improving the vacuuming effect. When the stressed rod 27 contacts the larger radius part on the stressed frame 9, the reset spring 21 is in a reset state, and when the stressed rod 27 contacts the smaller radius part on the stressed frame 9, the reset spring 21 is in a compressed state. The vacuuming module is arranged to be composed of a vacuuming mechanism 8 and a stressed frame 9, and the vacuuming mechanism 8 is arranged to be composed of a cylinder body 18, a sealing cover 19, a piston 20 and a reset spring 21, and a stressed rod 27 is arranged on the outer end face of the piston 20, so that the stressed rod 27 is in contact with the stressed frame 9 through the rotation of the material seat 1, thereby driving the piston 20 to move, and through the action of the intake check valve and the exhaust check valve on the secondary air pipe connecting port 25 and the tertiary air pipe connecting port 26, the gas between the chip 16 and the sealing plate 2 is extracted, thereby ensuring that the position between the two is in a relative vacuum state.

[0021] The outer end of the force-bearing rod 27 is hemispherical, a rubber sealing ring 29 is arranged between the cylinder body 18 and the sealing cover 19, a sealing groove is provided on the side wall of the force-bearing rod hole 22, and a rubber sealing ring 30 is embedded in the sealing groove. When the vacuum mechanism 8 is actually assembled, the rubber sealing ring 29 and the rubber sealing ring 30 are both in a pressurized state, thereby improving the sealing performance at the contact position of the cylinder body 18, the force-bearing rod 27 and the sealing cover 19.

[0022] A pressure stabilizing hole 28 is provided at the bottom of the cylinder body 18 .

[0023] The sealing plate 2 is a three-quarter circular plate, point A on the material seat 1 is a chip loading point, and point B on the material seat 1 is a chip unloading point.

[0024] Example 3: Based on Example 2, a process for preparing gold bumps for chips is provided. The process is implemented by the above-mentioned equipment for preparing gold bumps for chips, and the process includes a coating process, a colloid exposure process, a developing process, a sputtering coating process, an evaporation process, a degumming process and an annealing process.

[0025] Although the above describes the illustrative specific implementation methods of the present application so that technicians in this technical field can understand the present application, the present application is not limited to the scope of the specific implementation methods. For ordinary technicians in this technical field, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations using the concept of the present application are protected.

Claims

1. A preparation device for gold bumps for chips, comprising a coating mechanism, an exposure mechanism, a developing mechanism, a sputtering coating mechanism, an evaporation mechanism, a degumming mechanism and an annealing mechanism, characterized in that: The sputtering coating mechanism comprises: An equipment frame (6), wherein a front bracket (5) and a rear bracket (7) are fixedly mounted on the equipment frame (6), and a stepping motor (4) is fixedly mounted on the front bracket (5): A material seat (1), the material seat (1) being fixedly connected to the output shaft of the stepper motor (4), and a material slot (10) being provided on the material seat (1), a limit stopper (11) being fixedly connected to a rear port of the material slot (10), the material slot (10) being used to place a chip to be processed (16), and the limit stopper (11) being used to limit the position of the chip to be processed (16), and a gold bump (17) being formed on the chip (16); A sealing plate (2), the sealing plate (2) being fixed on the rear support (7), the sealing plate (2) forming a blocking effect on the rear end surface of the material trough (10), and a material port being provided on the sealing plate (2); A sputtering coating module (3), wherein the sputtering coating module (3) is fixed to the outer side surface of the sealing plate (2), and a coating port of the sputtering coating module (3) is aligned with a material port on the sealing plate (2); A vacuum pumping module, the vacuum pumping module is used to extract gas from the material slot (10) between the chip (16) and the sealing plate (2).

2. The device for preparing gold bumps for chips according to claim 1, characterized in that: An air groove (12) is provided on the side wall of the material trough (10), an air hole (13) is provided through the side of the air groove (12), and a first-level air pipe connection port (14) is formed at the end of the air hole (13). A first-level sealing rubber layer (35) is fixedly glued to the rear side of the material seat (1), a second-level sealing rubber layer (36) is fixedly glued to the front side of the sealing plate (2), and a third-level sealing rubber layer (37) is fixedly glued to the side wall of the material trough (10).

3. The device for preparing gold bumps for chips according to claim 2, characterized in that: The air groove (12) and the limit stopper (11) are arranged on the same plane.

4. The device for preparing gold bumps for chips according to claim 2, characterized in that: The vacuum module is composed of a vacuum mechanism (8) and a force-bearing frame (9), the vacuum mechanism (8) is fixed to the front side of the material seat (1) via a positioning hoop (15), a positioning ring (31) is fixedly mounted on the rear support (7), and the force-bearing frame (9) is fixedly connected to the positioning ring (31) via a connecting support (32).

5. The device for preparing gold bumps for chips according to claim 4, characterized in that: The vacuum pumping mechanism (8) comprises a cylinder body (18), a sealing cover (19), a piston (20) and a return spring (21), wherein the cylinder body (18) is positioned by a positioning hoop (15), the sealing cover (19) is fixedly connected to the port of the cylinder body (18), and the sealing cover (19) is provided with a force rod hole (22), an air inlet hole (23) and an air outlet hole (24), the piston (20) is movably arranged in the inner cavity of the cylinder body (18), and the inner end surface of the piston (20) is connected to the return spring (21), and the piston (20) The outer end surface of the air inlet (23) is fixedly connected to a stress-bearing rod (27), the stress-bearing rod (27) is movably arranged to pass through the stress-bearing rod hole (22), the outer ends of the air inlet (23) and the air outlet (24) are respectively connected to a secondary air pipe connection port (25) and a tertiary air pipe connection port (26), the secondary air pipe connection port (25) is connected to the primary air pipe connection port (14) via a connecting air pipe, the tertiary air pipe connection port (26) is connected to an exhaust pipe, and the secondary air pipe connection port (25) and the tertiary air pipe connection port (26) are respectively provided with an air inlet check valve and an exhaust check valve.

6. The device for preparing gold bumps for chips according to claim 5, characterized in that: The stressed frame (9) is an annular frame structure arranged in a plum blossom shape. When the stressed rod (27) contacts the portion with a larger radius on the stressed frame (9), the return spring (21) is in a reset state, and when the stressed rod (27) contacts the portion with a smaller radius on the stressed frame (9), the return spring (21) is in a compressed state.

7. The device for preparing gold bumps for chips according to claim 6, characterized in that: The outer end of the force-bearing rod (27) is arranged in a hemispherical shape, a rubber sealing ring (29) is provided between the cylinder body (18) and the sealing cover (19), a sealing groove is provided on the side wall of the force-bearing rod hole (22), a rubber sealing ring (30) is embedded in the sealing groove, and when the vacuum extraction mechanism (8) is actually assembled, the rubber sealing ring (29) and the rubber sealing ring (30) are both in a compressed state.

8. The device for preparing gold bumps for chips according to claim 7, characterized in that: A pressure stabilizing hole (28) is provided at the bottom of the cylinder body (18).

9. The device for preparing gold bumps for chips according to claim 7, characterized in that: The sealing plate (2) is a three-quarter circular plate, point A on the material seat (1) is a chip loading point, and point B on the material seat (1) is a chip unloading point.

10. A process for preparing gold bumps for chips, characterized in that: The preparation process is implemented by any one of the gold bump preparation equipment for chips according to claims 1-9, and the preparation process includes a coating process, a colloid exposure process, a developing process, a sputtering coating process, an evaporation process, a degumming process and an annealing process.

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