Semiconductor package cutting system and method

Abstract

A semiconductor package cutting system comprises a loading device for storing at least one strip or at least one magazine containing the strip, a cutting device mounted behind the loading device and used for partially cutting at least one part of the strip supplied by the loading device, and a cutting device mounted behind the cutting device and used for partially cutting at least one part of the strip supplied by the cutting device. The inspection device is arranged behind the cutting device and is used for inspecting the strip cut by the cutting device, and the unloading device is arranged behind the inspection device and is used for unloading the inspected strip.

Description

This application claims priority to Korean Patent Application No. 10-2023-0118944 filed on September 7, 2023, which is hereby incorporated by reference in its entirety. Technical Field

[0001] The present invention relates to a semiconductor package cutting system and method, and in particular to a semiconductor package cutting system and method capable of partially cutting a portion of a semiconductor package arranged on a strip during a semiconductor device manufacturing process. Background Art

[0002] Generally speaking, a series of manufacturing processes need to be repeated on a silicon wafer serving as a semiconductor substrate to form a semiconductor device. The semiconductor device formed as above can be produced into a semiconductor strip including a plurality of semiconductor packages through processes such as dicing, chip bonding, and molding.

[0003] The semiconductor strip can be individually cut into a plurality of semiconductor packages, and then the semiconductor packages can be sorted into defective products or non-defective products through a sawing and sorting process. For example, the sawing and sorting equipment may include a cutting device and an inspection device. The cutting device is used to load the semiconductor strip onto a chuck table, and then use a cutting blade to individually cut the semiconductor strip into a plurality of semiconductor packages. The inspection device is used to clean and dry the individually cut semiconductor packages, use an inspection camera to inspect the semiconductor packages, and then sort and unload the semiconductor packages according to the inspection results.

[0004] Currently, with the rapid growth of the mobile industry, the demand for small semiconductors is increasing, and the demand for a local cutting process that increases wettability by cutting parts of semiconductor packages before the sawing and sorting processes is also increasing.

[0005] Although the above-mentioned partial cutting process is realized by modifying the existing cutting and sorting equipment, since the detection device of the existing cutting and sorting equipment is used, an additional storage unit is required to store the partially cut semiconductor strips, thereby increasing the cost of the partial cutting process and the footprint of the entire equipment. Summary of the invention

[0006] The present invention provides a semiconductor package cutting system and method, which does not require an additional storage unit and can perform a partial cutting process by loading and unloading materials by itself. The above description is only an example, and the scope of the present invention is not limited thereto.

[0007] According to one aspect of the present invention, there is provided a semiconductor packaging cutting system, comprising: a loading device for storing at least one strip or at least one material box containing the strip; a cutting device, installed behind the loading device, for partially cutting at least a portion of the strip supplied from the loading device; an inspection device, installed behind the cutting device, for inspecting the strips cut by the cutting device; and an unloading device, installed behind the inspection device, for unloading the inspected strips.

[0008] The inspection device includes: an inspection table for placing the strip cut by the cutting device and movable back and forth along a first direction; a visual unit installed on the path of the inspection table for inspecting the cutting depth of the strip; and an exit track for placing the strip transferred from the inspection table.

[0009] The unloading device is installed at the rear of the inspection device, and the exit track includes a first exit track extending in the first direction toward the unloading device to place the strip supplied from the inspection station on the first exit track.

[0010] The unloading device is installed at a side of the inspection device, and the exit track includes a second exit track extending toward the unloading device in a second direction to place the strips transferred from the inspection station on the second exit track.

[0011] The inspection table is rotatable about a third direction to rotate the strip placed on the inspection table.

[0012] The loading device comprises a loading pusher for moving the strip in the second direction to feed the strip to the cutting device.

[0013] The cutting device includes: an inlet track extending along the second direction for placing the strip supplied from the loading device; a chuck table for receiving and fixing the strip aligned on the inlet track and rotating the strip; a cutting unit including a replaceable blade for partially cutting at least a portion of the strip fixed on the chuck table; and a cleaning unit for cleaning one surface or the other surface of the strip that has been cut.

[0014] The cutting device may further include a strip picker for moving the strip located on one of the inlet track, the chuck table, the cutting unit, and the cleaning unit to another one or to an inspection table of the inspection device to perform a plurality of processes on the strip.

[0015] The strip picker may include: a first strip picker for moving the strip placed on the inlet track to the chuck table; and a second strip picker for moving the strip cut on the chuck table to the cleaning unit and moving the strip cleaned by the cleaning unit to the inspection table.

[0016] According to another aspect of the present invention, a semiconductor package cutting method is provided, comprising: (a) moving a strip from a loading device storing the strip or a material box containing the strip to a cutting device, (b) partially cutting at least a portion of the strip using the cutting device, (c) moving the cut strip to the inspection device and inspecting the cutting depth, and (d) storing the inspected strip in the unloading device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and advantages of the present invention will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a top view of a semiconductor package cutting system according to an embodiment of the present invention;

[0019] Figure 2 and Figure 3 is a top view of a semiconductor package cutting system according to another embodiment of the present invention;

[0020] Figure 4 A flowchart of a semiconductor package cutting method provided by an embodiment of the present invention;

[0021] Figure 5 is a cross-sectional view of a semiconductor package that has not been partially cut; and

[0022] Figure 6 The diagram is a cross-sectional view of a semiconductor package that is partially cut according to the semiconductor package cutting system and method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] Hereinafter, the present invention will be described in detail by explaining embodiments of the invention with reference to the attached drawings.

[0024] However, the present invention can be embodied in many different forms and should not be construed as being limited to the embodiments described herein; rather, these embodiments are provided to make the present disclosure thorough and complete and to fully convey the concept of the present invention to those of ordinary skill in the art. In the accompanying drawings, the thickness or size of the layers is exaggerated for clarity and convenience of explanation.

[0025] Embodiments of the invention are described below with reference to schematic diagrams of idealized embodiments (and intermediate structures) of the invention. Therefore, the shapes of the illustrations may vary due to manufacturing techniques and / or tolerances. Therefore, embodiments of the invention should not be construed as limited to the specific shapes of regions shown herein, but rather include deviations in shapes due to manufacturing and the like.

[0026] In the following description, the first direction refers to the y-axis direction in the figure, the second direction refers to the x-axis direction, and the third direction refers to the direction perpendicular to the x-axis and y-axis directions. In addition, with respect to the strips described herein, for the convenience and clarity of explanation, the strips before cutting are referred to as the first strips, the strips after cutting are referred to as the second strips, and the first strips and the second strips are not different strips.

[0027] Figure 1 FIG. 1 is a top view of a semiconductor package cutting system 1000 according to an embodiment of the present invention. Figure 1 As shown, the semiconductor package cutting system 1000 may include: a loading device 100 for supplying a strip S; a cutting device 200 for partially cutting a portion of the semiconductor package mounted on the strip S; an inspection device 300 for inspecting the cut strip S; and an unloading device 400 for unloading the inspected strip S.

[0028] Specifically, a plurality of uncut first strips S1 may be stored in the loading device 100. The first strips S1 may be transferred to a position accessible to the cutting device 200 by the loading elevator 110 and then transferred to a plurality of entry rails R1 installed on the cutting device 200 by the pusher 120.

[0029] The cutting device 200 may include: a chuck table 210 for supporting and fixing the first strip S1; a cutting unit 220 for partially cutting the semiconductor package portion on the first strip S1 fixed to the chuck table 210; and a cleaning unit 230 for cleaning and drying the cut second strip S2.

[0030] Specifically, the cutting unit 220 may include a circular blade for partially cutting at least a portion of the plurality of semiconductor packages disposed on the strip. For example, the circular blade may be moved in a first direction, and the first strip S1 fixed on the chuck table 210 may be partially cut (or half-cut) while the chuck table 210 is moved in a second direction. The cleaning unit 230 may clean the second strip S2 using a brush or a cleaning liquid to remove particles or foreign matter generated during the cutting process.

[0031] The cutting device 200 may further include a strip picker for moving the strip located on one of the inlet track R1, the cutting unit 220, and the cleaning unit 230 to another one, thereby performing a plurality of processes on the first strip S1.

[0032] Specifically, the strip picker may include: a first strip picker 240, used to move the first strip S1 placed on the entrance track R1 to the chuck table 210; and a second strip picker 250, used to move the second strip S2 cut on the chuck table 210 to the cleaning unit 230, and move the second strip S2 cleaned by the cleaning unit 230 to the inspection device 300.

[0033] The first tape picker 240 and the second tape picker 250 may move back and forth in the second direction, and the inlet rail R1 , the chuck stage 210 , and the cleaning unit 230 may be disposed in the second direction.

[0034] Therefore, the first tape S1 brought to the entrance track R1 by the pusher 120 of the loading device 100 can be transferred to the chuck table 210 by the first tape picker 240, and the second tape S2 partially cut on the chuck table 210 by the cutting unit 220 can be transferred to the cleaning unit 230 by the second tape picker 250, and then transferred to the inspection device 300 after cleaning.

[0035] The inspection device 300 may include: an inspection table 310, which is used to place the partially cut and cleaned second strip S2 transmitted by the second strip picker 250 of the cutting device 200, and can move back and forth in a first direction; a first drying unit 320 and a second drying unit 330, which are respectively used to dry one surface and the other surface of the second strip S2; a visual unit 340, which is used to check the cutting depth of the second strip S2; and a plurality of exit tracks R2, which are used to place the second strip S2 transmitted by the inspection table 310.

[0036] At this time, the first drying unit 320 may be installed on a path where the second strip picker 250 transfers the second strip S2 to dry the surface of the second strip S2, and the second drying unit 330 may be installed on a path where the inspection station 310 transfers the second strip S2 to the vision unit 340 to dry the other surface of the second strip S2. Alternatively, the first drying unit 320 may dry the other surface of the second strip S2, and the second drying unit 330 may dry the surface of the second strip S2.

[0037] Specifically, a plurality of second strips S2 that have been cut and inspected can be stored in the unloading device 400. The second strip S2 can be transferred from the exit track R2 installed on the inspection device 300 to the unloading device 400 by the unloading pusher 420, and then transferred to the storage position by the unloading elevator 410. The unloading pusher 420 can be a push block type capable of pushing the second strip S2 from the exit track R2 to the unloading device 400, or a clamper or strip picker type capable of clamping the second strip S2 and bringing the second strip S2 placed on the exit track R2 into the unloading device 400.

[0038] In this case, the unloading device 400 of the semiconductor package cutting system 1000 according to the embodiment of the present invention may be installed behind the inspection device 300 and located at the rear of the inspection device 300 with respect to the first direction. Therefore, the exit track R2 of the inspection device 300 may extend toward the unloading device 400 along the first direction to place the second strip S2 transferred by the inspection stage 310 on the exit track R2 and transfer the second strip S2 to the unloading device 400.

[0039] like Figure 2 As shown, the unloading device 400 of the semiconductor package cutting system 2000 according to another embodiment of the present invention can be installed behind the inspection device 300 and installed on the side of the inspection device 300 relative to the second direction. Therefore, the exit track R2' of the inspection device 300 can extend toward the unloading device 400 along the second direction to place the second strip S2 transferred by the inspection station 310 on the track R2' and transfer the second strip S2 to the unloading device 400.

[0040] At this time, the inspection station 310' may receive the second strip S2 aligned in the first direction transferred by the second strip picker 250, and then rotate about the third direction to place the second strip S2 on the exit track R2'.

[0041] Therefore, the inspection station 310' can be Figure 2 As shown, the second strip S2 is received from the second strip picker 250, and then Figure 3 The rotation is shown to place the second strip S2 onto the exit track R2 ′ through the second drying unit 330 and the vision unit 340 .

[0042] The arrangement of the unloading device 400 of the semiconductor package cutting system 1000 and 2000 according to the embodiment of the present invention can be changed according to the installation space of the entire system. For example, depending on the device, when there is free space near the rear of the inspection device 300, the unloading device 400 can be installed at the rear of the inspection device 300 as described in the first embodiment, and when there is no free space near the rear of the inspection device 300, the unloading device 400 can be installed at the side of the inspection device 300 as described in the second embodiment.

[0043] Figure 4 A flowchart of a semiconductor package cutting method provided by an embodiment of the present invention. Figure 4 As shown, the semiconductor package cutting method according to an embodiment of the present invention may include: (a) moving the strip from a loading device storing the strip or a material box containing the strip to a cutting device, (b) using the cutting device to partially cut at least a portion of the strip, (c) moving the cut strip to the inspection device and inspecting the cutting depth, and (d) storing the inspected strip in the unloading device.

[0044] In this case, the step (b) of partially cutting at least a portion of the strip may include partially cutting a portion of the terminals 2 of the semiconductor packages 1 disposed on the strip, such as Figures 5 to 6 shown.

[0045] Figure 5 FIG. 1 shows a general semiconductor package without partial cutting. First, as shown in FIG. Figure 5 As shown, when the semiconductor package 1 is mounted on the substrate 3 through a reflow process of the solder 4 , the solder 4 presents a wetted shape having a first length L1 .

[0046] In contrast, Figure 6 As shown, when a portion of the terminal 2' of the semiconductor package 1 is partially cut to form a notch T based on the semiconductor package cutting system and method according to an embodiment of the present invention, the solder 4 presents a wetting shape having a second length L2 greater than the first length L1, which means that wettability is improved.

[0047] Therefore, according to the semiconductor package cutting system and method of the embodiment of the present invention, since the strip can be loaded and unloaded by itself without an additional storage unit, the occupied area can be reduced, and since the configuration of the unloading device can be changed according to the installation space of the entire system, the space can be effectively utilized. In addition, the existing sawing and sorting equipment can be used as the cutting device of the present invention by simply replacing the blade, and the conversion to the subsequent process can be easily achieved by docking the additional equipment behind the unloading device, and the wettability can be improved by partially cutting the semiconductor package using the cutting device.

[0048] According to the above-mentioned embodiments of the present invention, since the strips can be loaded and unloaded by themselves without an additional storage unit, the occupied area can be reduced, since the configuration of the unloading device can be changed according to the installation space of the entire system, the space can be effectively utilized, and since the cutting device can be used as an existing sawing and sorting device only by replacing the blade, multifunctionality can be achieved. However, the scope of the present invention is not limited to the above-mentioned effects.

[0049] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the following claims.

Claims

1. A semiconductor packaging cutting system, characterized in that: include: a loading device for storing at least one strip or at least one magazine containing said strip; a cutting device, mounted behind the loading device, for partially cutting at least a portion of the strip fed from the loading device; an inspection device, installed behind the cutting device, for inspecting the strips cut by the cutting device; as well as The unloading device is installed behind the inspection device and is used for unloading the inspected strips.

2. The semiconductor package cutting system according to claim 1, characterized in that: The inspection device comprises: An inspection table, used for placing the strips cut by the cutting device and movable back and forth along a first direction; a vision unit mounted in the path of the inspection table for inspecting the cutting depth of the strip; and An exit track is used to place the strips conveyed from the inspection table.

3. The semiconductor package cutting system according to claim 2, characterized in that: The unloading device is installed at the rear of the inspection device, wherein the exit track includes a first exit track extending toward the unloading device in the first direction to place the strip supplied from the inspection station on the first exit track.

4. The semiconductor package cutting system according to claim 2, characterized in that: The unloading device is installed at a side of the inspection device, wherein the exit track includes a second exit track extending in a second direction and toward the unloading device to place the strips transferred from the inspection station on the second exit track.

5. The semiconductor package cutting system according to claim 4, characterized in that: The inspection table is rotatable about a third direction to rotate the strip placed on the inspection table.

6. The semiconductor package cutting system according to claim 2, characterized in that: The loading device comprises a loading pusher for moving the strip in a second direction to feed the strip to the cutting device.

7. The semiconductor package cutting system according to claim 1, characterized in that: The cutting device comprises: an inlet track extending in a second direction for placing the strips supplied from the loading device; a chuck table for receiving and fixing the strip aligned on the inlet track and rotating the strip by rotating; a cutting unit including a replaceable blade for partially cutting at least a portion of the strip secured to the chuck table; and A cleaning unit for cleaning one surface or the other of the already cut strip.

8. The semiconductor package cutting system according to claim 7, characterized in that: The cutting device further includes a strip picker for moving the strip located on one of the inlet track, the chuck table, the cutting unit, and the cleaning unit to another one or to an inspection table of the inspection device to perform a plurality of processes on the strip.

9. The semiconductor package cutting system according to claim 8, characterized in that: The strip picker comprises: a first strip picker for moving the strip placed on the inlet track to the chuck table; and A second strip picker is used to move the strip cut on the chuck table to the cleaning unit, and to move the strip cleaned by the cleaning unit to the inspection table.

10. A semiconductor package cutting method, comprising: (a) moving a strip from a loading device storing the strip or a magazine containing the strip to a cutting device; (b) partially cutting at least a portion of the strip using the cutting device; (c) moving the cut strip to an inspection device and inspecting the cutting depth; and (d) storing the strips after inspection in an unloading device.

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