Semiconductor package cutting system and method

Abstract

A semiconductor package cutting system includes a cutting device for partially cutting at least a portion of a strip including a plurality of semiconductor packages, a cutting device mounted on one side of the cutting device, the inspection device is arranged on one side of the cutting device, is used for supplying a first strip to be cut to the cutting device, and is used for receiving and inspecting a second strip cut by the cutting device; the storage device is used for storing a first strip stored in the storage device and supplying the first strip stored in the storage device to the inspection device and receiving and storing a second strip inspected by the inspection device, and the inspection device comprises an inspection table used for placing the second strip on the inspection table and moving the second strip in the first direction.

Description

This application claims priority to Korean Patent Application No. 10-2023-0118946, filed on September 7, 2023, and incorporates the entire content of this application by reference. Technical Field

[0001] The present invention relates to a semiconductor package cutting system and method, and in particular to a semiconductor package cutting system and method capable of partially cutting a portion of a semiconductor package arranged on a strip during a semiconductor device manufacturing process. Background Art

[0002] Generally speaking, a series of manufacturing processes need to be repeated on a silicon wafer serving as a semiconductor substrate to form a semiconductor device. The semiconductor device formed as above can be produced into a semiconductor strip including a plurality of semiconductor packages through processes such as dicing, chip bonding, and molding.

[0003] The semiconductor strip can be individually cut into a plurality of semiconductor packages, and then the semiconductor packages can be sorted into defective products or non-defective products through a sawing and sorting process. For example, the sawing and sorting equipment may include a cutting device and an inspection device. The cutting device is used to load the semiconductor strip onto a chuck table, and then use a cutting blade to individually cut the semiconductor strip into a plurality of semiconductor packages. The inspection device is used to clean and dry the individually cut semiconductor packages, use an inspection camera to inspect the semiconductor packages, and then sort and unload the semiconductor packages according to the inspection results.

[0004] Currently, with the rapid growth of the mobile industry, the demand for small semiconductors is increasing, and the demand for a part-cutting process that increases wettability by cutting parts of semiconductor packages before the sawing and sorting processes is also increasing.

[0005] Although the above-mentioned partial cutting process is realized by modifying the existing cutting and sorting equipment, due to the use of the detection device of the existing cutting and sorting equipment, an additional storage unit is required to store the partially cut semiconductor strips, thereby increasing the cost of the partial cutting process and the footprint of the entire equipment. Summary of the invention

[0006] The present invention provides a semiconductor package cutting system and method, which does not require an additional storage unit and can perform a partial cutting process by loading and unloading materials by itself. The above description is only an example, and the scope of the present invention is not limited thereto.

[0007] According to one aspect of the present invention, there is provided a semiconductor package cutting system, comprising: a cutting device for partially cutting at least a portion of a strip comprising a plurality of semiconductor packages; an inspection device, mounted on one side of the cutting device, for supplying a first strip to be cut to the cutting device, and for receiving and inspecting a second strip cut by the cutting device; and a storage device, mounted on one side of the inspection device, for supplying the first strip stored in the storage device to the inspection device, and for receiving and storing the second strip inspected by the inspection device, wherein the inspection device comprises a detection table for placing the second strip and moving the second strip along a first direction.

[0008] The inspection device further comprises a vision unit mounted on the path of the inspection table for inspecting the cutting depth of the second strip, and a track extending along the second direction for placing the first strip or the second strip.

[0009] The inspection device may further include: a first gate provided at one side of the inspection device to be connected to the storage device; and a second gate provided at the other side of the inspection device to be connected to the cutting device.

[0010] The first gate and the second gate face each other, and the track is installed between the first gate and the second gate.

[0011] The storage device stores the first strip or the second strip in a direction corresponding to a direction in which the track extends.

[0012] The inspection device may include a plurality of inspection stations to sequentially inspect a plurality of second strips in the inspection device.

[0013] The cutting device includes: a chuck table for fixing the first strip or the second strip; a cutting unit including a replaceable blade for partially cutting at least a portion of the first strip fixed to the chuck table; and a cleaning unit for cleaning one surface or the other surface of the cut second strip.

[0014] The cutting device may further include a strip picker for moving the strip located on one of the chuck table, the cutting unit, the cleaning unit, and the track to another one.

[0015] The strip picker may move back and forth along the second direction at a position corresponding to the track.

[0016] According to another aspect of the present invention, there is provided a semiconductor package cutting method, comprising: (a) moving a strip supplied from a storage device and placed on a track of an inspection device to the cutting device by moving a strip picker of the cutting device, (b) partially cutting at least a portion of the strip using the cutting device, (c) moving the cut strip to the inspection device and inspecting the cutting depth, and (d) moving and storing the inspected strip into the storage device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and advantages of the present invention will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a top view of a semiconductor package cutting system according to an embodiment of the present invention;

[0019] Figure 2 is a top view of an inspection device of a semiconductor package cutting system according to an embodiment of the present invention;

[0020] Figure 3 A flowchart of a semiconductor package cutting method provided by an embodiment of the present invention;

[0021] Figure 4 is a cross-sectional view of a semiconductor package that has not been partially cut; and

[0022] Figure 5 The diagram is a cross-sectional view of a semiconductor package that is partially cut according to the semiconductor package cutting system and method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] Hereinafter, the present invention will be described in detail by explaining embodiments of the invention with reference to the attached drawings.

[0024] However, the present invention can be embodied in many different forms and should not be construed as being limited to the embodiments described herein; rather, these embodiments are provided to make the present disclosure thorough and complete and to fully convey the concept of the present invention to those of ordinary skill in the art. In the accompanying drawings, the thickness or size of the layers is exaggerated for clarity and convenience of explanation.

[0025] Embodiments of the invention are described below with reference to schematic diagrams of idealized embodiments (and intermediate structures) of the invention. Therefore, the shapes of the illustrations may vary due to manufacturing techniques and / or tolerances. Therefore, embodiments of the invention should not be construed as limited to the specific shapes of regions shown herein, but rather include deviations in shapes due to manufacturing and the like.

[0026] In the following description, the first direction refers to the y-axis direction in the figure, the second direction refers to the x-axis direction, and the third direction refers to the direction perpendicular to the x-axis and y-axis directions. In addition, with respect to the strips described herein, for the convenience and clarity of explanation, the strips before cutting are referred to as the first strips, the strips after cutting are referred to as the second strips, and the first strips and the second strips are not different strips.

[0027] Figure 1 FIG. 1 is a top view of a semiconductor package cutting system 1000 according to an embodiment of the present invention. Figure 1 As shown, the semiconductor package cutting system 1000 may include: a storage device 100 for supplying and storing a strip S; a cutting device 200 for partially cutting a portion of a semiconductor package mounted on the strip S; and an inspection device 300 for inspecting the cut strip S.

[0028] Specifically, a plurality of first strips that have not been cut can be stored in the storage device 100. The first strips can be transferred to a position accessible to the inspection device 300 by the elevator 110, and then transferred to the track R installed on the inspection device 300 by the pusher 120.

[0029] The cutting device 200 may include: a chuck table 210 for supporting and fixing the first strip; a cutting unit 220 for partially cutting a portion of the semiconductor package fixed on the first strip of the chuck table 210; and a cleaning unit 230 for cleaning and drying the cut second strip.

[0030] Specifically, the cutting unit 220 may include a circular blade for partially cutting at least a portion of the plurality of semiconductor packages disposed on the strip. For example, the circular blade may be moved in a first direction, and the first strip fixed on the chuck table 210 may be partially cut (or half-cut) while the chuck table 210 is moved in a second direction. The cleaning unit 230 may clean the second strip using a brush or a cleaning liquid to remove particles or foreign matter generated during the cutting process.

[0031] The cutting device 200 may further include a strip picker 240 for moving a strip located on one of the rail R, the chuck stage 210, the cutting unit 220, the cleaning unit 230, and the inspection stage 310 to another one to perform a plurality of processes on the first strip.

[0032] Specifically, the tape picker 240 may move the first tape placed on the track R to the chuck table 210 , move the second tape cut on the chuck table 210 to the cleaning unit 230 , and move the second tape cleaned by the cleaning unit 230 to the inspection table 310 .

[0033] The strip picker 240 may move back and forth along the second direction, and the chuck stage 210 and the cleaning unit 230 may be disposed along the second direction.

[0034] Therefore, the first strip brought to the track R by the pusher 120 of the storage device 100 can be transferred to the chuck table 210 through the strip picker 240, and the second strip partially cut on the chuck table 210 by the cutting unit 220 can be transferred to the cleaning unit 230 and then transferred to the track R of the inspection device 300 after being cleaned.

[0035] The inspection device 300 may include an inspection table 310 for placing the second strip and being movable forward and backward in the first direction. Therefore, the second strip placed on the track R may be placed on the inspection table 310 by the strip picker 240 and moved to the vision unit 340 .

[0036] The inspection device 300 may further include a first drying unit 320 and a second drying unit 330 for drying one surface and the other surface of the second strip, and a vision unit 340 for inspecting a cutting depth of the second strip.

[0037] At this time, the first drying unit 320 may be installed on a path where the second strip is transferred by the strip picker 240 to dry a surface of the second strip, and the second drying unit 330 may be installed on a path where the second strip is transferred to the vision unit 340 by the inspection table 310 to dry the other surface of the second strip. Alternatively, the first drying unit 320 may dry the other surface of the second strip and the second drying unit 330 may dry the surface of the second strip.

[0038] The plurality of second strips that have been cut and inspected may be stored in the storage device 100. The second strips may be transferred from the rail R mounted on the inspection device 300 to the storage device 100 by the pusher 120, and then transferred to the storage location by the elevator 110. The pusher 120 may be a push block type capable of pushing the second strips from the rail R to the storage device 100, or a clamper or strip picker type capable of bringing the second strips placed on the rail R into the storage device 100 by clamping the second strips.

[0039] At this time, the inspection device 300 of the semiconductor package cutting system 1000 of the embodiment of the present invention may also include a first gate G1 arranged on one side of the inspection device 300 to connect with the storage device 100 , and a second gate G2 arranged on the other side of the inspection device 300 to connect with the cutting device 200 .

[0040] Specifically, Figure 2As shown, the first gate G1 and the second gate G2 are positioned facing each other, and a rail R may be installed between the first gate G1 and the second gate G2.

[0041] Therefore, the first tape can be sent to the track R by the pusher 120 of the storage device 100 through the first gate G1, the first tape placed on the track R can be moved to the chuck table 210 by the tape picker 240 through the second gate G2, and the second tape after cleaning can be sent back to the track R by the tape picker 240 through the second gate G2.

[0042] Based on the configuration of the first gate G1 and the second gate G2 , the second tape placed on the track R can be moved to the storage device 100 by the tape picker 240 , and the tape can be moved without using an additional pusher 120 .

[0043] Although not shown in the figure, in order to improve the transfer efficiency by considering the path of the strip, a plurality of inspection stations may be included. Therefore, interference between the first strip supplied to the cutting device 200 and the second strip sent to the storage device 100 can be prevented, and the processing efficiency can be improved.

[0044] Figure 3 A flowchart of a semiconductor package cutting method provided by an embodiment of the present invention. Figure 3 As shown, a semiconductor package cutting method according to an embodiment of the present invention may include: (a) moving a strip supplied from a storage device and placed on a track of an inspection device to the cutting device by moving a strip picker of the cutting device, (b) partially cutting at least a portion of the strip using the cutting device, (c) moving the cut strip to the inspection device and inspecting the cutting depth, and (d) moving and storing the inspected strip into the storage device.

[0045] In this case, the step (b) of partially cutting at least a portion of the strip may include partially cutting a portion of the terminals 2 of the semiconductor packages 1 disposed on the strip, such as Figure 4 and 5 shown.

[0046] Figure 4 FIG. 1 shows a general semiconductor package without partial cutting. First, as shown in FIG. Figure 4 As shown, when the semiconductor package 1 is mounted on the substrate 3 through a reflow process of the solder 4 , the solder 4 presents a wetted shape having a first length L1 .

[0047] In contrast, Figure 5As shown, when a portion of the terminal 2 of the semiconductor package 1 is partially cut to form a cut T based on the semiconductor package cutting system and method of an embodiment of the present invention, the solder 4 presents a wetting shape having a second length L2 greater than the first length L1, which means that the wettability is improved.

[0048] Therefore, according to the semiconductor package cutting system and method of the embodiment of the present invention, since the strips can be loaded and unloaded by themselves using one storage device without an additional storage unit, the occupied space can be reduced. In addition, since the configuration of the storage device can be changed according to the installation space of the entire system, the space can be effectively utilized, and the existing sawing and sorting equipment can be used as the cutting device of the present invention by only replacing its blade, and the conversion to the subsequent process can be easily achieved by docking the additional equipment at the rear of the storage device.

[0049] According to the above-mentioned embodiments of the present invention, since the strips can be loaded and unloaded by themselves without requiring an additional storage unit, the occupied area can be reduced, and since the configuration of the storage device can be changed according to the installation space of the entire system, the space can be effectively utilized, and since the cutting device can be used as an existing sawing and sorting device by simply replacing the blade, multifunctionality can be achieved. However, the scope of the present invention is not limited to the above-mentioned effects.

[0050] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the following claims.

Claims

1. A semiconductor packaging cutting system, characterized in that: include: a cutting device for partially cutting at least a portion of a strip including a plurality of semiconductor packages; an inspection device, mounted on one side of the cutting device, for supplying a first strip to be cut to the cutting device, and receiving and inspecting a second strip cut by the cutting device; as well as A storage device is installed on one side of the inspection device, and is used to supply the first strip stored in the storage device to the inspection device, and receive and store the second strip after inspection by the inspection device, wherein the inspection device includes a detection table for placing the second strip and moving the second strip along a first direction.

2. The semiconductor package cutting system according to claim 1, characterized in that: The inspection device also includes: a vision unit mounted in the path of the inspection table for inspecting the cutting depth of the second strip; and The track extends along the second direction and is used for placing the first strip or the second strip.

3. The semiconductor package cutting system according to claim 2, characterized in that: The inspection device also includes: A first gate provided at one side of the inspection device to be connected to the storage device; and The second gate is arranged on the other side of the inspection device to be connected to the cutting device.

4. The semiconductor package cutting system according to claim 3, characterized in that: The first gate and the second gate face each other, and the track is installed between the first gate and the second gate.

5. The semiconductor package cutting system according to claim 2, characterized in that: The storage device stores the first strip or the second strip in a direction corresponding to a direction in which the track extends.

6. The semiconductor package cutting system according to claim 1, characterized in that: The inspection device includes a plurality of inspection stations to sequentially inspect a plurality of second strips in the inspection device.

7. The semiconductor package cutting system according to claim 2, characterized in that: The cutting device comprises: a chuck table, used for fixing the first strip or the second strip; a cutting unit including a replaceable blade for partially cutting at least a portion of the first strip secured to the chuck table; and A cleaning unit is used to clean one surface or the other surface of the cut second strip.

8. The semiconductor package cutting system according to claim 7, characterized in that: The cutting device further includes a strip picker for moving the strip located on one of the chuck table, the cutting unit, the cleaning unit, and the track to another one.

9. The semiconductor package cutting system according to claim 8, characterized in that: The strip picker may move back and forth along the second direction at a position corresponding to the track.

10. A semiconductor package cutting method, comprising: (a) moving a strip fed from a storage device and placed on a track of an inspection device to a cutting device by moving a strip picker of the cutting device; (b) partially cutting at least a portion of the strip using the cutting device; (c) moving the cut strip to the inspection device and inspecting the cutting depth; as well as (d) moving and storing the detected strips into the storage device.

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