Chip production plastic packaging machine device and method

Abstract

The invention relates to the field of chip production, in particular to a chip production plastic packaging machine device and method. The device comprises a conveying belt mechanism, a lower die mechanism and an upper jacking mechanism, the conveying belt mechanism comprises a rack, two belt rollers rotationally arranged on the rack, a conveying belt arranged on the two belt rollers in a sleeving mode and a first motor arranged on the rack and connected with one belt roller in a driving mode, and multiple rows of through hole sets are formed in the conveying belt in the annular direction at equal intervals. Each row of through hole group comprises a plurality of through holes which are distributed at equal intervals in the width direction of the conveying belt; the lower mold mechanism comprises a plurality of lower mold assemblies which are distributed at the through holes in a one-to-one correspondence manner; each lower mold assembly comprises a connecting table arranged on the conveying belt, a rotating shaft rotationally arranged on the connecting table, a lower mold which is arranged on the rotating shaft and is provided with a plastic packaging groove, and a demolding assembly arranged on the lower mold; the jacking mechanism is in transmission connection with one belt roller and intermittently jacks the demolding assemblies distributed in rows. According to the invention, the plastic package chip is conveniently and safely demoulded in a jacking manner.

Description

Technical Field

[0001] The present invention relates to the field of chip production, and in particular to a chip production plastic packaging machine device and method. Background Art

[0002] The upstream of the MCU chip industry chain is semiconductor materials and semiconductor equipment, mainly including silicon wafers, photoresists, photomasks, electronic special gases, targets, single crystal furnaces, etc. The midstream is the MCU manufacturing process, mainly including chip design, single crystal silicon wafer manufacturing, wafer manufacturing and chip packaging and testing, etc. Chip packaging and testing generally uses plastic packaging equipment for plastic packaging.

[0003] Chinese patent announcement No. CN216413042U discloses a high-power chip plastic sealing device, including a frame, a screw drive structure is installed on the top of the frame, the top of the screw drive structure is connected to a plastic sealing table, clamping components are installed on the left and right sides of the top of the plastic sealing table, a plastic sealing plate is connected between the two clamping components, an induction switch is installed on the side away from the motor between the screw and the limit slide bar, vertical plates are arranged on both sides of the frame, a sliding structure is installed above the two vertical plates, the sliding structure includes an electric guide rail, a guide slide bar and an electric slide, a first driving cylinder is installed on the top of the electric slide, the bottom of the first driving cylinder passes through the electric slide and is connected to a connecting plate, a plastic sealing mechanism is installed on the bottom of the connecting plate, and the overall automation is improved by cooperating with the induction switch through the provided screw drive structure.

[0004] However, the above technical solution has the following shortcomings:

[0005] After the chip is plastic-sealed, it fits tightly to the chip seat, making it difficult to demold, affecting production efficiency, and even the slightest carelessness will cause damage to the chip. Summary of the invention

[0006] The purpose of the present invention is to solve the problems existing in the background technology and to provide a chip production plastic packaging machine device and method which can conveniently and safely demould the plastic-packaged chip by pushing up.

[0007] On the one hand, the present invention proposes a chip production plastic packaging machine device, including a conveyor belt mechanism, a lower mold mechanism and an upper push mechanism; the conveyor belt mechanism includes a frame, two belt rollers rotatably arranged on the frame, a conveyor belt sleeved on the two belt rollers, and a first motor arranged on the frame and drivingly connected to a belt roller, a plurality of rows of through hole groups are equidistantly arranged along a circular direction on the conveyor belt, and each row of through hole groups includes a plurality of through holes equidistantly distributed along the width direction of the conveyor belt; the lower mold mechanism includes a plurality of lower mold assemblies distributed one by one at the plurality of through holes, the lower mold assembly includes a connecting platform arranged on the conveyor belt, a rotating shaft rotatably arranged on the connecting platform, a lower mold arranged on the rotating shaft and having a plastic packaging groove, and a demolding assembly arranged on the lower mold; the upper push mechanism is connected to a belt roller drivingly and intermittently pushes up a plurality of demolding assemblies distributed in rows.

[0008] Preferably, the bottom of the plastic sealing groove has an engaging groove, the surface of the lower mold facing the conveyor belt has a slide groove facing the through hole, the slide groove and the engaging groove are connected by a slideway, and the demolding assembly includes an engaging platform that matches the engaging groove, a thrust plate slidably arranged in the slide groove, a sliding column connected between the thrust plate and the engaging platform, and a spring mounted on the outer peripheral side of the sliding column, the sliding column is slidably arranged on the slideway, and the two ends of the spring are respectively connected to the bottom of the slide groove and the thrust plate.

[0009] Preferably, the lifting mechanism includes a first crankshaft rotatably set on the frame, two synchronous pulleys coaxially connected to the first crankshaft and a belt roller respectively, a synchronous belt meshingly mounted on the two synchronous pulleys, a guide plate horizontally set on the frame, and multiple groups of lifting components distributed side by side, the lifting components include a lifting rod and a first connecting rod, the lifting rod is vertically slidably set on the guide plate, one end of the first connecting rod is eccentrically connected to the first crankshaft, the other end of the first connecting rod is rotatably connected to the bottom end of the lifting rod, the lifting rod passes through the through hole and pushes up the thrust plate.

[0010] Preferably, it also includes a dust suction mechanism, a glue injection mechanism, an upper mold mechanism, and a driving mechanism for driving the dust suction mechanism to suction dust and driving the glue injection mechanism and the upper mold mechanism to lift and lower. The dust suction mechanism, the glue injection mechanism and the upper mold mechanism respectively correspond to three rows of adjacent lower mold assemblies distributed in sequence along the running direction of the conveyor belt. A support plate for lifting the upper part of the conveyor belt flat is horizontally arranged on the frame, and the support plate is located below the dust suction mechanism, the glue injection mechanism and the upper mold mechanism.

[0011] Preferably, the driving mechanism includes a second motor arranged on the frame, a screw rod arranged vertically and rotatably on the frame, a lifting frame threadedly connected to the screw rod, a guide rod arranged vertically on the frame and slidably connected to the lifting frame, a second crankshaft rotatably arranged on the frame, and a transmission mechanism that transmission connects the screw rod and the second crankshaft.

[0012] Preferably, the dust collection mechanism includes a plurality of dust collection components arranged side by side and equidistantly along the width direction of the conveyor belt, the dust collection components include a dust collection cylinder arranged on a frame, a sealing plug sealed at the bottom end of the dust collection cylinder, a second connecting rod eccentrically connected to the second crankshaft at one end, and a piston rotatably connected to the other end of the second connecting rod, the dust collection cylinder includes a vertically distributed piston cylinder portion, a dust collection pipe portion connected to the piston cylinder portion and in an inverted V shape, and an exhaust pipe portion connected to the piston cylinder portion and in a V shape, the piston is slidably arranged on the inner surface of the piston cylinder portion, a first one-way valve that is unidirectionally conductive to the piston cylinder portion is arranged on the dust collection pipe portion, a second one-way valve that is unidirectionally conductive to the outside is arranged on the exhaust pipe portion, a filter is arranged at the outer end of the exhaust pipe portion, and dust cotton is arranged on the top of the sealing plug.

[0013] Preferably, the glue injection mechanism includes a glue supply barrel arranged on a lifting frame, a heating device arranged in the glue supply barrel, a plurality of glue injection heads arranged side by side and equidistantly connected to the bottom of the glue supply barrel along the width direction of the conveyor belt, a mounting rod vertically arranged on the frame and slidably connected to the top of the glue supply barrel, and a fan blade structure arranged at the bottom end of the mounting rod and located on the inner side of the glue supply barrel.

[0014] Preferably, the upper mold mechanism includes a plurality of upper molds which are arranged side by side and equidistantly along the width direction of the conveyor belt, and the upper molds are adapted to the lower molds.

[0015] On the other hand, the present invention provides a chip production plastic packaging method, which is implemented using the above chip production plastic packaging machine device, and the method includes the following steps:

[0016] S1. After the chip is plastic-sealed, the lower mold assembly is conveyed to the top of the lifting rod by a conveyor belt;

[0017] S2, the belt roller drives the first crankshaft to rotate through the synchronous pulley and the synchronous belt, and the first crankshaft drives the lifting rod to rise through the first connecting rod;

[0018] S3, the lifting rod pushes up the push plate, and the push plate drives the fitting table to move up through the sliding column, the spring is compressed, and the fitting table pushes the plastic-encapsulated chip upward, so that the plastic-encapsulated chip is loosened from the lower mold, and demoulding is achieved;

[0019] S4, the first crankshaft continues to rotate, the lifting rod moves downward, the spring pushes the thrust plate downward, and the engaging platform moves downward again and engages in the engaging groove;

[0020] S5, looping through steps S1-S4 to sequentially demold the plastic-encapsulated chips in other rows of lower mold assemblies using the lifting rods.

[0021] Compared with the prior art, the present invention has the following beneficial technical effects:

[0022] The present invention conveniently and safely demolds the plastic-encapsulated chip by means of a push-up method. The power of the first motor driving the belt roller to rotate is used to drive the first crankshaft to rotate through the synchronous belt transmission, driving multiple lifting rods to lift and lower back and forth, and using the multiple lifting rods to push up the demolding components in the rows of lower mold components, and using the fitting table to push up the plastic-encapsulated chips that have been plastic-encapsulated, thereby achieving safe and efficient demolding of the rows of plastic-encapsulated chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0024] Figure 2 It is a structural schematic diagram of the dust collection, glue injection and mold upper action of an embodiment of the present invention;

[0025] Figure 3 It is a partial structural cross-sectional view of the demoulding principle of an embodiment of the present invention;

[0026] Figure 4 for Figure 3 A magnified view of the structure at center A;

[0027] Figure 5 for Figure 4 A magnified view of the structure at point B.

[0028] Figure numerals: 1, frame; 2, first motor; 3, belt roller; 4, conveyor belt; 401, through hole; 5, connecting platform; 6, rotating shaft; 7, lower mold; 701, plastic sealing groove; 702, fitting groove; 703, slide groove; 8, fitting platform; 9, slide column; 10, thrust plate; 11, spring; 12, synchronous belt; 13, first crankshaft; 14, first connecting rod; 15, lifting rod; 16, guide plate; 17, dust suction cylinder; 171, piston cylinder; 172, dust suction pipe; 173, exhaust pipe 1. first one-way valve; 2. second one-way valve; 3. filter screen; 4. piston; 5. second connecting rod; 6. second crankshaft; 7. second motor; 8. screw rod; 9. first bevel gear; 10. second bevel gear; 11. mounting shaft; 12. third bevel gear; 13. fourth bevel gear; 14. lifting frame; 15. guide rod; 16. glue supply barrel; 17. glue injection head; 18. sealing plug; 191. first one-way valve; 192. second one-way valve; 20. filter screen; 21. piston; 22. second connecting rod; 23. second crankshaft; 24. second motor; 25. screw rod; 26. first bevel gear; 27. second bevel gear; 28. mounting shaft; 29. ​​third bevel gear; 30. fourth bevel gear; 31. lifting frame; 32. guide rod; 33. glue supply barrel; 34. glue injection head; 35. mounting rod; 36. fan blade structure; 37. upper mold; 38. support plate. DETAILED DESCRIPTION

[0029] Embodiment 1

[0030] like Figure 1-Figure 5 As shown, a chip production plastic packaging machine device proposed in this embodiment includes a conveyor belt mechanism, a lower mold mechanism and an upper ejection mechanism.

[0031] The conveyor belt mechanism includes a frame 1, two belt rollers 3 rotatably arranged on the frame 1, a conveyor belt 4 sleeved on the two belt rollers 3, and a first motor 2 arranged on the frame 1 and drivingly connected to one belt roller 3. The first motor 2 drives one belt roller 3 to rotate, and the belt roller 3 drives another belt roller 3 to rotate through the conveyor belt 4, so as to realize the circular movement of the conveyor belt 4. Multiple rows of through hole groups are equidistantly arranged on the conveyor belt 4 along the circular direction, and each row of through hole groups includes multiple through holes 401 equidistantly distributed along the width direction of the conveyor belt 4.

[0032] like Figure 3-Figure 5 As shown, the lower mold mechanism includes a plurality of lower mold assemblies distributed one by one at a plurality of through holes 401, and the lower mold assembly includes a connecting platform 5 disposed on the conveyor belt 4, a rotating shaft 6 rotatably disposed on the connecting platform 5, a lower mold 7 disposed on the rotating shaft 6 and having a plastic sealing groove 701, and a demoulding assembly disposed on the lower mold 7. The area where the connecting platform 5 and the conveyor belt 4 are connected is small and will not hinder the normal operation of the conveyor belt 4. When the connecting platform 5 is driven by the conveyor belt 4, the lower mold 7 is driven to move through the rotating shaft 6, and the plastic sealing groove 701 is used to place the chip for plastic sealing.

[0033] The bottom of the plastic sealing groove 701 has an interlocking groove 702, and the side surface of the lower mold 7 facing the conveyor belt 4 has a slide groove 703 facing the through hole 401, and a slideway is connected between the slide groove 703 and the interlocking groove 702. The demoulding component includes an interlocking platform 8 that matches the interlocking groove 702, a push plate 10 slidably set in the slide groove 703, a slide column 9 connected between the push plate 10 and the interlocking platform 8, and a spring 11 sleeved on the outer peripheral side of the slide column 9. The slide column 9 is slidably set at the slideway, and the two ends of the spring 11 are respectively connected to the bottom of the slide groove 703 and the push plate 10. When the chip is plastic-sealed by injection molding, the top surface of the interlocking platform 8 is flush with the bottom of the plastic sealing groove 701, and the chip can be plastic-sealed neatly.

[0034] The lifting mechanism is connected to a belt roller 3 and intermittently lifts multiple demoulding components arranged in a row. The lifting mechanism includes a first crankshaft 13 rotatably arranged on the frame 1, two synchronous pulleys coaxially connected to the first crankshaft 13 and a belt roller 3 respectively, a synchronous belt 12 meshingly sleeved on the two synchronous pulleys, a guide plate 16 horizontally arranged on the frame 1, and multiple groups of lifting components arranged side by side, the lifting components include a lifting rod 15 and a first connecting rod 14, the lifting rod 15 is vertically slidably arranged on the guide plate 16, one end of the first connecting rod 14 is eccentrically connected to the first crankshaft 13, and the other end of the first connecting rod 14 is connected to the bottom end of the lifting rod 15, and the lifting rod 15 passes through the through hole 401 and lifts the thrust plate 10. After the chip is plastic-sealed, the belt roller 3 realizes the rotation of the first crankshaft 13 through the synchronous belt drive, so that the lifting rod 15 can be lifted and lowered reciprocatingly. When the lifting rod 15 rises, it will pass through the through hole 401 and push the push plate 10, so that the fitting platform 8 moves up, and the fitting platform 8 pushes the plastic-sealed chip inside the plastic-sealing groove 701 to complete the demoulding. The distance between two adjacent rows of lower mold assemblies distributed horizontally is determined, and one lifting process of the lifting rod 15 corresponds to the process of a row of lower mold assemblies moving horizontally by the above distance, so that the lifting rod 15 can perform the upper demoulding process of the plastic-sealed chip on each row of lower mold assemblies.

[0035] The above chip production plastic packaging machine device plastic packaging method comprises the following steps:

[0036] S1, after the chip is plastic-sealed, the lower mold assembly is conveyed to the top of the lifting rod 15 by the conveyor belt 4;

[0037] S2, the belt roller 3 drives the first crankshaft 13 to rotate through the synchronous pulley and the synchronous belt 12, and the transmission is smooth. The first crankshaft 13 drives the lifting rod 15 to rise through the first connecting rod 14;

[0038] S3, the lifting rod 15 pushes up the push plate 10, and the push plate 10 drives the fitting platform 8 to move upward through the sliding column 9, the spring 11 is compressed, and the fitting platform 8 pushes the plastic-encapsulated chip upward to loosen the plastic-encapsulated chip from the lower mold 7 to achieve demoulding. When the lifting rod 15 pushes up the push plate 10, because the conveyor belt 4 is in motion, the lifting rod 15 will slide with the push plate 10. The lifting rod 15 will push up the push plate 10 in time and drop down to disengage, and will not interfere with the normal operation of the conveyor belt 4;

[0039] S4, the first crankshaft 13 continues to rotate, the lifting rod 15 moves downward, the spring 11 pushes the thrust plate 10 to move downward, and the engaging platform 8 moves downward again and engages in the engaging groove 702;

[0040] S5, looping through steps S1-S4, so as to use the lifting rod 15 to sequentially demold the plastic-encapsulated chips in other rows of lower mold assemblies.

[0041] This embodiment conveniently and safely demolds the plastic-encapsulated chip by pushing up. The power of the first motor 2 driving the belt roller 3 to rotate is used to drive the first crankshaft 13 to rotate through the synchronous belt transmission. The first crankshaft 13 drives the multiple lifting rods 15 to lift and lower reciprocate through the multiple first connecting rods 14. The multiple lifting rods 15 are used to push up the demolding components in the rows of lower mold components, and the plastic-encapsulated chips that have been plastic-encapsulated are pushed up by the fitting platform 8, so as to realize the safe demolding of the rows of plastic-encapsulated chips, and the demolding efficiency is high.

[0042] Embodiment 2

[0043] like Figure 1-Figure 5 As shown, a chip production plastic sealing machine device proposed in this embodiment, compared with the first embodiment, in this embodiment, it also includes a dust suction mechanism, a glue injection mechanism, an upper mold mechanism, and a driving mechanism for driving the dust suction mechanism to suction dust, and driving the glue injection mechanism and the upper mold mechanism to lift and lower. The dust suction mechanism, the glue injection mechanism and the upper mold mechanism correspond to three rows of adjacent lower mold assemblies distributed in sequence along the running direction of the conveyor belt 4, respectively. A support plate 38 for supporting the upper part of the conveyor belt 4 is horizontally arranged on the frame 1, and the support plate 38 is located below the dust suction mechanism, the glue injection mechanism and the upper mold mechanism. The chip to be plastic-sealed is pre-placed in the plastic sealing groove 701. When the lower mold assembly passes under the dust suction mechanism, it stops moving and performs dust suction treatment to ensure the cleanliness of the plastic sealing. When the lower mold assembly passes under the glue injection mechanism, it stops moving and glue is injected through the glue injection mechanism. When the lower mold assembly passes under the upper mold mechanism, it stops moving, and the mold closing and plastic sealing treatment is realized by moving the upper mold mechanism downward. The dust collection mechanism, glue injection mechanism and upper mold mechanism can perform dust removal, glue injection and mold sealing processing on the chip in an assembly line form.

[0044] like Figure 1 and Figure 2 As shown, the driving mechanism includes a second motor 24 arranged on the frame 1, a screw rod 25 arranged vertically and rotatably on the frame 1, a lifting frame 31 threadedly connected to the screw rod 25, a guide rod 32 arranged vertically on the frame 1 and slidably connected to the lifting frame 31, a second crankshaft 23 rotatably arranged on the frame 1, and a transmission mechanism that transmits and connects the screw rod 25 with the second crankshaft 23. The second motor 24 can drive the screw rod 25 to rotate, the screw rod 25 drives the lifting frame 31 to rise and fall, and the guide rod 32 guides the lifting frame 31 in the vertical direction. When the glue injection mechanism is injecting glue and the upper mold mechanism is closing the mold, the glue injection mechanism and the upper mold mechanism both move downward. The screw rod 25 can also drive the second crankshaft 23 to rotate through the transmission mechanism.

[0045] like Figure 2As shown, the transmission mechanism includes a first bevel gear 26 arranged on the screw rod 25, a mounting shaft 28 rotatably arranged on the frame 1, a second bevel gear 27 arranged on the mounting shaft 28 and meshingly connected with the first bevel gear 26, a third bevel gear 29 arranged on the mounting shaft 28, and a fourth bevel gear 30 arranged on the second crankshaft 23 and meshingly connected with the third bevel gear 29. The screw rod 25 drives the mounting shaft 28 to rotate through the first bevel gear 26 and the second bevel gear 27, and the mounting shaft 28 drives the second crankshaft 23 to rotate through the third bevel gear 29 and the fourth bevel gear 30. Regardless of the forward and reverse rotation of the screw rod 25, the rotation of the second crankshaft 23 can be achieved.

[0046] like Figure 1 and Figure 2 As shown, the dust collection mechanism includes a plurality of dust collection components arranged side by side and equidistantly along the width direction of the conveyor belt 4, the dust collection components include a dust collection cylinder 17 arranged on the frame 1, a sealing plug 18 sealed at the bottom end of the dust collection cylinder 17, a second connecting rod 22 eccentrically connected to the second crankshaft 23 at one end, and a piston 21 rotatably connected to the other end of the second connecting rod 22, the dust collection cylinder 17 includes a vertically distributed piston cylinder portion 171, a dust collection pipe portion 172 connected to the piston cylinder portion 171 and arranged in an inverted V shape, and an exhaust pipe portion 173 connected to the piston cylinder portion 171 and arranged in a V shape, the piston 21 is slidably arranged on the inner surface of the piston cylinder portion 171, the dust collection pipe portion 172 is provided with a first one-way valve 191 that is unidirectionally conductive to the piston cylinder portion 171, and the exhaust pipe portion 173 is provided with a second one-way valve 192 that is unidirectionally conductive to the outside. A dust-absorbing cotton is arranged on the top of the sealing plug 18, and the dust-absorbing cotton is used to absorb the dust entering the inner side of the piston cylinder 171. When the dust needs to be cleaned, the sealing plug 18 is removed and the dust attached to the dust-absorbing cotton is cleaned. The sealing plug 18 can be threadedly sealed with the bottom end of the piston cylinder 171.

[0047] When the second crankshaft 23 rotates, it can drive the piston 21 to slide up and down through the second connecting rod 22. When the piston 21 slides up, the second one-way valve 192 is closed, and the first one-way valve 191 is opened, and the dust on the lower mold assembly and the chip is adsorbed through the dust suction pipe 172, so that the dust enters the inner side of the piston cylinder 171 and is adsorbed by the dust suction cotton. When the piston 21 slides down, the first one-way valve 191 is closed, and the second one-way valve 192 is opened, and the air is exhausted upward through the exhaust pipe 173. A filter 20 is provided at the outer end of the exhaust pipe 173 to prevent debris in the outside air from entering the inner side of the dust suction cylinder 17.

[0048] The glue injection mechanism includes a glue supply barrel 33 arranged on the lifting frame 31, a heating device arranged in the glue supply barrel 33, a plurality of glue injection heads 34 connected to the bottom of the glue supply barrel 33 in parallel and equidistantly along the width direction of the conveyor belt 4, a mounting rod 35 vertically arranged on the frame 1 and slidably connected to the top of the glue supply barrel 33, and a fan blade structure 36 arranged at the bottom end of the mounting rod 35 and located on the inner side of the glue supply barrel 33. When the glue injection mechanism moves downward, glue is injected into the plastic sealing groove 701 through the glue injection head 34, and the heating device is used to maintain the fluidity of the glue liquid inside the glue supply barrel 33. When the glue supply barrel 33 moves up and down, the fan blade structure 36 in a fixed position can play a certain stirring role to improve the uniformity of the glue liquid concentration distribution.

[0049] The upper mold mechanism includes a plurality of upper molds 37 equidistantly distributed side by side along the width direction of the conveyor belt 4. The upper mold 37 is adapted to the lower mold 7. When the upper mold 37 moves down to fit with the lower mold 7, the glue liquid can be molded and sealed to seal the chip in the glue liquid.

[0050] In this embodiment, the chip is subjected to dust removal, glue injection and mold sealing in an assembly line manner through a dust suction mechanism, a glue injection mechanism and an upper mold mechanism. After the plastic sealing is completed, a plastic-sealed chip is obtained, and then the plastic-sealed chip is safely and efficiently demolded through the upper push mechanism.

[0051] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip production laminating machine device, comprising a conveyor belt mechanism, the conveyor belt mechanism comprising a frame (1), two belt rollers (3) rotatably arranged on the frame (1), a conveyor belt (4) sleeved on the two belt rollers (3), and a first motor (2) arranged on the frame (1) and drivingly connected to one of the belt rollers (3), characterized in that: A plurality of rows of through hole groups are equidistantly arranged along a circular direction on the conveyor belt (4), and each row of through hole groups includes a plurality of through holes (401) equidistantly distributed along the width direction of the conveyor belt (4). The chip production plastic packaging machine device also includes: A lower mold mechanism, comprising a plurality of lower mold assemblies distributed one-to-one at a plurality of through holes (401), the lower mold assembly comprising a connecting platform (5) arranged on a conveyor belt (4), a rotating shaft (6) rotatably arranged on the connecting platform (5), a lower mold (7) arranged on the rotating shaft (6) and having a plastic sealing groove (701), and a demoulding assembly arranged on the lower mold (7); The lifting mechanism is connected to a belt roller (3) in a transmission manner and intermittently lifts up a plurality of demoulding components distributed in a row.

2. The chip production laminator device according to claim 1, characterized in that: The bottom of the plastic sealing groove (701) has an engaging groove (702), the side surface of the lower mold (7) facing the conveyor belt (4) has a slide groove (703) facing the through hole (401), and a slideway is connected between the slide groove (703) and the engaging groove (702). The demoulding component includes an engaging platform (8) matched with the engaging groove (702), a thrust plate (10) slidably arranged in the slide groove (703), a slide column (9) connected between the thrust plate (10) and the engaging platform (8), and a spring (11) sleeved on the outer peripheral side of the slide column (9), the slide column (9) is slidably arranged at the slideway, and the two ends of the spring (11) are respectively connected to the bottom of the slide groove (703) and the thrust plate (10).

3. The chip production laminator device according to claim 2, characterized in that: The lifting mechanism comprises a first crankshaft (13) rotatably arranged on a frame (1), two synchronous pulleys coaxially connected to the first crankshaft (13) and a belt roller (3), a synchronous belt (12) meshingly sleeved on the two synchronous pulleys, a guide plate (16) horizontally arranged on the frame (1), and a plurality of sets of lifting components arranged side by side, the lifting components comprising a lifting rod (15) and a first connecting rod (14), the lifting rod (15) being vertically slidably arranged on the guide plate (16), one end of the first connecting rod (14) being eccentrically rotatably connected to the first crankshaft (13), the other end of the first connecting rod (14) being rotatably connected to the bottom end of the lifting rod (15), the lifting rod (15) passing through a through hole (401) and lifting the thrust plate (10).

4. The chip production laminator device according to claim 1, characterized in that: It also includes a dust suction mechanism, a glue injection mechanism, an upper mold mechanism, and a driving mechanism for driving the dust suction mechanism to suction dust and driving the glue injection mechanism and the upper mold mechanism to lift and lower. The dust suction mechanism, the glue injection mechanism and the upper mold mechanism correspond to three rows of adjacent lower mold assemblies sequentially distributed along the running direction of the conveyor belt (4). A support plate (38) for supporting the upper part of the conveyor belt (4) is horizontally arranged on the frame (1), and the support plate (38) is located below the dust suction mechanism, the glue injection mechanism and the upper mold mechanism.

5. The chip production laminator device according to claim 4, characterized in that: The driving mechanism comprises a second motor (24) arranged on the frame (1), a screw rod (25) arranged vertically and rotatably on the frame (1), a lifting frame (31) threadedly connected to the screw rod (25), a guide rod (32) arranged vertically on the frame (1) and slidably connected to the lifting frame (31), a second crankshaft (23) rotatably arranged on the frame (1), and a transmission mechanism that transmission-connects the screw rod (25) and the second crankshaft (23).

6. The chip production laminator device according to claim 5, characterized in that: The dust collection mechanism comprises a plurality of dust collection components arranged side by side and at equal distances along the width direction of the conveyor belt (4), the dust collection components comprising a dust collection cylinder (17) arranged on a frame (1), a sealing plug (18) sealingly arranged at the bottom end of the dust collection cylinder (17), a second connecting rod (22) eccentrically rotatably connected to a second crankshaft (23) at one end, and a piston (21) rotatably connected to the other end of the second connecting rod (22), the dust collection cylinder (17) comprising a vertically distributed piston cylinder portion (171), a piston cylinder portion (171) connected to the piston cylinder portion (171) and in an inverted V-shaped The dust suction pipe part (172) is provided with a cloth and the exhaust pipe part (173) is connected with the piston cylinder part (171) and is distributed in a V shape. The piston (21) is slidably arranged on the inner surface of the piston cylinder part (171). The dust suction pipe part (172) is provided with a first one-way valve (191) which is unidirectionally connected to the piston cylinder part (171). The exhaust pipe part (173) is provided with a second one-way valve (192) which is unidirectionally connected to the outside. The outer end of the exhaust pipe part (173) is provided with a filter screen (20). The top of the sealing plug (18) is provided with dust suction cotton.

7. The chip production laminator device according to claim 5, characterized in that: The glue injection mechanism comprises a glue supply barrel (33) arranged on a lifting frame (31), a heating device arranged in the glue supply barrel (33), a plurality of glue injection heads (34) arranged side by side and equidistantly connected to the bottom of the glue supply barrel (33) along the width direction of the conveyor belt (4), a mounting rod (35) vertically arranged on the frame (1) and slidably connected to the top of the glue supply barrel (33), and a fan blade structure (36) arranged at the bottom end of the mounting rod (35) and located on the inner side of the glue supply barrel (33).

8. The chip production laminator device according to claim 5, characterized in that: The upper die mechanism comprises a plurality of upper dies (37) which are arranged side by side and equidistantly distributed along the width direction of the conveyor belt (4); the upper dies (37) are adapted to the lower die (7).

9. A chip production plastic packaging method, implemented by using the chip production plastic packaging machine device according to claim 3, characterized in that: The method comprises the following steps: S1, after the chip is plastic-sealed, the lower mold assembly is conveyed to the top of the lifting rod (15) via a conveyor belt (4); S2, the belt roller (3) drives the first crankshaft (13) to rotate through the synchronous pulley and the synchronous belt (12), and the first crankshaft (13) drives the lifting rod (15) to rise through the first connecting rod (14); S3, the lifting rod (15) pushes up the push plate (10), the push plate (10) drives the embedding platform (8) to move upward through the sliding column (9), the spring (11) is compressed, and the embedding platform (8) pushes the plastic-encapsulated chip upward, so that the plastic-encapsulated chip is loosened from the lower mold (7), thereby achieving demoulding; S4, the first crankshaft (13) continues to rotate, the lifting rod (15) moves downward, the spring (11) pushes the thrust plate (10) to move downward, and the engaging platform (8) moves downward again and engages in the engaging groove (702); S5, looping through steps S1-S4, so as to use the lifting rod (15) to sequentially demould the plastic-encapsulated chips in other rows of lower mold assemblies.

Images