Die bonder with flipping mechanism

Abstract

The application relates to the technical field of die bonder, in particular to a die bonder with a turnover mechanism, which comprises a chip feeding mechanism, a dispensing mechanism, a product feeding mechanism and a chip feeding mechanism. The chip feeding mechanism is used for providing chips to be processed; the dispensing mechanism is used for dispensing the chips; the product feeding mechanism is used for storing the chips to be processed and the chips after being dispensed; the chip feeding mechanism comprises a driving module and a turnover module arranged on the driving module; at least two suction accessories are arranged on the turnover module; the turnover module is used for driving the suction accessories to turn over; the suction accessories are used for adsorbing the chips; and the driving module is used for driving the turnover module to move between the product feeding mechanism and the dispensing mechanism. The application has the effect of improving production efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of die bonding machines, and in particular to a die bonding machine with a flipping mechanism. Background Art

[0002] Currently, semiconductor chip manufacturing is driving ever-higher demands for precision and efficiency in chip processing. Dual-chip die bonding, a crucial process, directly impacts product quality and production efficiency, depending on its technical expertise and degree of automation. A die bonder, also known as a placement machine, is a key piece of equipment in the semiconductor packaging process. It precisely places cut chips onto a pre-determined substrate and secures them with adhesive. This process is crucial for ensuring the electrical connectivity and mechanical stability of semiconductor devices, as well as for subsequent packaging processes.

[0003] The primary functions of a die bonder include picking up, aligning, placing, and securing chips. During operation, the die bonder uses a high-precision vision system to identify and locate the chip and substrate. A robotic arm then accurately places the chip in the desired location on the substrate. A dispensing mechanism then applies glue to the substrate and affixes the chip. Some die bonders also feature heat or UV curing to ensure rapid adhesive curing, improving production efficiency.

[0004] In related technologies, a robotic arm, coupled with a vision system, is typically used to align and transfer the chips, which are then secured with glue using a dispensing mechanism. However, this approach is limited in terms of production efficiency by the robotic arm's movement speed and the vision system's processing speed, resulting in reduced production efficiency.

[0005] Therefore, there is an urgent need for a die bonding machine with a flipping mechanism. Summary of the Invention

[0006] In order to improve production efficiency, the present application provides a die bonding machine with a flipping mechanism.

[0007] The present application provides a die bonder with a flip mechanism, which adopts the following technical solution:

[0008] A die bonder with a flip mechanism, comprising:

[0009] A chip loading mechanism, used to provide chips to be processed;

[0010] A dispensing mechanism, used for dispensing glue on the chip;

[0011] Product feeding mechanism, used to store chips to be processed and chips after dispensing;

[0012] The chip feeding mechanism comprises a driving module and a turnover module arranged on the driving module, at least two suction members are arranged on the turnover module, the turnover module is used to drive the suction members to turn over, the suction members are used to adsorb chips, and the driving module is used to drive the turnover module to move between the product feeding mechanism and the glue dispensing mechanism.

[0013] By adopting the above technical scheme, when the chip needs to be fixed, the chip feeding mechanism is used to deliver a to-be-processed chip to a position close to the glue dispensing mechanism, and a suction member is used to adsorb the to-be-processed chip on the product feeding mechanism. Then, the driving module is started, the driving module drives the suction member to move through the turnover module, so as to deliver the chip adsorbed on the suction member to the glue dispensing mechanism, so that the glue dispensing mechanism can dispense glue on the chip. At this time, the chip feeding mechanism places another to-be-processed chip on the chip after glue dispensing, so that the two chips are bonded together. Then, the turnover module works, so that one suction member takes the bonded chip from the glue dispensing mechanism, and another suction member delivers the to-be-processed chip to the glue dispensing mechanism, thereby reducing the pause time in the glue dispensing process, and further improving the production efficiency. When the suction member takes the bonded chip from the glue dispensing mechanism, the driving module can drive the chip to move through the turnover module and the suction member, so as to place the chip after glue dispensing on the product feeding mechanism, thereby facilitating the fixed crystal operation on the chip.

[0014] Optionally, the driving module comprises a Y-axis driving member and a Z-axis driving member, one end of the Y-axis driving member extends above the glue dispensing mechanism, the Z-axis driving member is arranged on the Y-axis driving member, the turnover module is arranged on the Z-axis driving member, the Y-axis driving member is used to drive the Z-axis driving member to move between the product feeding mechanism and the glue dispensing mechanism, and the Z-axis driving member is used to drive the turnover module to move up and down.

[0015] By adopting the above technical scheme, when the chip needs to be transferred, the Z-axis driving member is started first, the Z-axis driving member drives the turnover module to move up and down, so that the turnover module drives the suction member to move, so as to take the chip on the glue dispensing mechanism or the product feeding mechanism by using the suction member. Then, the Y-axis driving member is started, the Y-axis driving member drives the Z-axis driving member to move between the product feeding mechanism and the glue dispensing mechanism, the Z-axis driving member drives the turnover module and the suction member to move, so as to facilitate the transfer of the chip stored on the product feeding mechanism to the glue dispensing mechanism, and facilitate the transfer of the chip after glue dispensing on the glue dispensing mechanism to the product feeding mechanism.

[0016] Optionally, the turnover module comprises a turnover driving member and a support member, the turnover driving member is arranged on the Z-axis driving member, the support member is connected with the output end of the turnover driving member, and two suction members are arranged on the support member.

[0017] By adopting the above technical solution, the flipping drive part can drive the support part to rotate, and the support part can drive the two adsorption parts to rotate to realize the flipping of the two adsorption parts. Therefore, during the dispensing process, one adsorption part can be used to remove the bonded chip from the dispensing mechanism, and the other adsorption part can be used to transport the chip to be processed to the dispensing mechanism, which reduces the pause time in the dispensing process to a certain extent, thereby helping to improve production efficiency.

[0018] Optionally, the angle between the two adsorption members is 90 degrees.

[0019] By adopting the above technical solution, the angle between the two adsorption parts is 90 degrees. On the one hand, it makes it less likely for the two adsorption parts to interfere with each other during the process of storing and accessing chips. On the other hand, it makes the flipping path of the two adsorption parts more direct and efficient, reducing unnecessary movement to a certain extent, which is beneficial to improving the efficiency of the adsorption parts in storing and accessing chips, and further beneficial to improving overall production efficiency.

[0020] Optionally, the product feeding mechanism includes a support platform and a plurality of material trays arranged on the support platform, and the plurality of material trays are parallel to each other and tilted toward a direction close to the dispensing mechanism.

[0021] By adopting the above technical solution, the setting of several material trays can provide storage locations for chips, and the inclined setting of the material trays can reduce the possibility of the positions of the two chips being offset due to gravity when the glue is not cured, which is beneficial to improving the product yield.

[0022] Optionally, the inclination angle of the tray is 45 degrees.

[0023] Optionally, the glue dispensing mechanism includes a glue dispensing module, a glue supply module and a clamping module. The glue dispensing module, the glue supply module and the clamping module are distributed in sequence along the direction close to the driving module. The clamping module is used to clamp the chip, and the glue dispensing module is used to apply glue from the glue supply module to the chip clamped by the clamping module.

[0024] By adopting the above technical solution, when the chip needs to be glued, the clamping claw module can clamp the chip on the adsorption part and drive the chip to a position close to the glue dispensing module, so that the glue dispensing module can dispense glue from the glue supply module on the chip.

[0025] Optionally, the glue supply module includes a glue storage platform, a driving member and a glue scraper. An annular groove is provided on the glue storage platform, and glue is stored in the annular groove. The driving member is arranged on the glue storage platform, and the glue scraper is slidably inserted in the annular groove and connected to the driving member. The driving member is used to drive the glue scraper to move in the annular groove.

[0026] By adopting the above technical solution, the driving part can drive the scraper to move in the annular groove, so that the scraper can drive the glue to flow in the annular groove, which is beneficial to reduce the possibility of glue condensation in the annular groove, and then facilitate the glue dispensing module to take glue from the annular groove.

[0027] Optionally, the clamping claw module includes a rotating driving member and an adsorption clamp arranged on the rotating driving member, the rotating driving member is arranged between the product feeding mechanism and the glue supply module, the rotating driving member is used to drive the adsorption clamp to rotate, and the adsorption clamp is used to clamp the chip.

[0028] By adopting the above technical solution, the adsorption clamp can adsorb the chip, and the rotary drive can drive the adsorption clamp to rotate accurately to the specified position, which is conducive to improving the speed and consistency of chip placement.

[0029] Optionally, a frame is included, and the chip loading mechanism, the glue dispensing mechanism, the product feeding mechanism, and the chip feeding mechanism are respectively arranged on the frame.

[0030] By adopting the above technical solution, the chip loading mechanism, dispensing mechanism, product feeding mechanism and chip feeding mechanism are integrated on the rack, which is beneficial to improving the assembly efficiency of the overall equipment and facilitating smoother collaboration between the various mechanisms.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. Through the mutual cooperation of the chip loading mechanism, dispensing mechanism, product feeding mechanism, driving module, flip module and suction component, during the dispensing process, one suction component can remove the bonded chip from the dispensing mechanism, and the other suction component can transport the chip to be processed to the dispensing mechanism, thereby reducing the pause time during the dispensing process and thus helping to improve production efficiency;

[0033] 2. By tilting the tray, the possibility of the two chips shifting due to gravity when the glue is not cured is reduced to a certain extent, which is conducive to improving the product yield;

[0034] 3. Through the mutual cooperation of the glue storage platform, the driving part and the scraping part, the driving part can drive the scraping part to move in the annular groove, so that the scraping part can drive the glue to flow in the annular groove, thereby reducing the possibility of glue condensation in the annular groove, and making it easier for the dispensing module to take glue from the annular groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the overall structure of a die bonder with a flip mechanism in an embodiment of the present application.

[0036] Figure 2 It is a partial structural diagram of a die bonding machine with a flipping mechanism in an embodiment of the present application.

[0037] Figure 3 yes Figure 1 A partial enlarged view of point A in the middle.

[0038] Description of reference numerals:

[0039] 1. Rack; 11. Visual component; 2. Chip loading mechanism; 21. Crystal ring module; 22. Ejector module; 23. Swing arm module; 24. Calibration module; 25. Moving module; 3. Glue dispensing mechanism; 31. Glue dispensing module; 311. Glue dispensing drive; 312. Glue dispensing needle; 32. Glue supply module; 321. Glue storage table; 3211. Ring groove; 322. Drive; 323. Glue scraper; 33. Clamping jaw module; 331. Rotating drive; 332. Adsorption clamp; 4. Product feeding mechanism; 41. Support table; 42. Material tray; 5. Chip feeding mechanism; 51. Drive module; 511. Y-axis drive; 512. Z-axis drive; 52. Flipping module; 521. Flipping drive; 522. Support; 523. Adsorption. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-3 This application is described in further detail.

[0041] The embodiment of the present application discloses a die bonder with a flipping mechanism.

[0042] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] Reference Figure 1 The die bonder with a flip mechanism includes a frame 1, a chip loading mechanism 2, a glue dispensing mechanism 3, a product feeding mechanism 4, and a chip feeding mechanism 5. The chip loading mechanism 2, glue dispensing mechanism 3, product feeding mechanism 4, and chip feeding mechanism 5 are respectively mounted on the frame 1. The chip loading mechanism 2 is used to transport chips to be processed, the glue dispensing mechanism 3 is used to dispense glue on chips, the product feeding mechanism 4 is used to store chips, and the chip feeding mechanism 5 is used to transfer chips between the product feeding mechanism 4 and the glue dispensing mechanism 3.

[0044] When a chip needs to be bonded, the chip loading mechanism 2 transports the chip to be processed near the glue dispensing mechanism 3. The chip feeding mechanism 5 then transfers the chip from the product feeding mechanism 4 to the glue dispensing mechanism 3, where glue is applied to the chip. After the glue is applied, the chip loading mechanism 2 places another chip over the glued chip, bonding the two chips together. The chip feeding mechanism 5 then transfers the bonded chips to the product feeding mechanism 4 for temporary storage. Once the glue solidifies, the bonding process is complete.

[0045] Reference Figure 1 The chip loading mechanism 2 includes a crystal ring module 21, an ejector pin module 22, a swing arm module 23, a calibration module 24, and a moving module 25. The crystal ring module 21, the ejector pin module 22, the swing arm module 23, and the moving module 25 are respectively mounted on the frame 1. The crystal ring module 21 is used to transfer and position the crystal ring. The ejector pin module 22 is located below the crystal ring module 21 and is used to lift the chip.

[0046] An XY-axis calibration platform is provided on the frame 1, and a calibration module 24 is mounted on the XY-axis calibration platform. The XY-axis calibration platform is used to move the calibration module 24 toward or away from the moving module 25. The calibration module 24 is used to calibrate the angle of the chip. In other embodiments, the XY-axis calibration platform may not be provided.

[0047] The swing arm module 23 is disposed between the crystal ring module 21 and the calibration module 24 , and is used to transfer the chip lifted by the ejector pin module 22 to the calibration module 24 , so that the calibration module 24 can calibrate the angle of the chip.

[0048] When the chip calibration is completed, the XY-axis calibration platform drives the calibration module 24 to approach the moving module 25 so that the moving module 25 can remove the chip from the calibration module 24 and transfer the chip to the dispensing mechanism 3 .

[0049] It should be noted that the specific structure and working principle of the crystal ring module 21, the ejector module 22, the swing arm module 23, the calibration module 24, the moving module 25 and the XY axis calibration table are conventional technical means for those skilled in the art, and therefore will not be elaborated in detail in the embodiments of this application.

[0050] Reference Figure 1 The dispensing mechanism 3 includes a dispensing module 31, a glue supply module 32 and a clamping module 33. The dispensing module 31, the glue supply module 32 and the clamping module 33 are sequentially distributed on the frame 1, and the clamping module 33 is arranged close to the product feeding mechanism 4.

[0051] The gripper module 33 includes a rotary drive member 331 and a suction gripper 332 mounted on the rotary drive member 331. The rotary drive member 331 is mounted on the frame 1 and positioned between the product feeding mechanism 4 and the adhesive supply module 32. In this embodiment, the rotary drive member 331 is a rotary motor, which facilitates the use of the rotary drive member 331 to drive the suction gripper 332 to rotate, thereby bringing the suction gripper 332 closer to the product feeding mechanism 4 or the adhesive supply module 32.

[0052] Reference Figure 1 and Figure 2 The glue supply module 32 includes a glue storage platform 321, a driving member 322 and a glue scraping member 323. The glue storage platform 321 is installed on the frame 1 and is located between the rotating driving member 331 and the glue dispensing module 31. The glue storage platform 321 is provided with an annular groove 3211 in which glue is stored.

[0053] The driving member 322 is fixedly connected to the glue storage platform 321, and the scraper 323 is slidably inserted into the annular groove 3211 and fixedly connected to the driving member 322. In this embodiment, the driving member 322 is a motor, so that the driving member 322 can easily drive the scraper 323 to move within the annular groove 3211, so that the scraper 323 drives the glue to flow within the annular groove 3211, thereby reducing the possibility of glue coagulation in the annular groove 3211.

[0054] Reference Figure 1 The dispensing module 31 includes a dispensing drive 311 and a dispensing needle 312 installed on the dispensing drive 311. The dispensing drive 311 can drive the dispensing needle 312 to move, so that the dispensing needle 312 is inserted into the annular groove 3211, and the dispensing needle 312 dispenses glue on the chip clamped on the adsorption clamp 332.

[0055] When the chip is clamped on the suction clamp 332, the rotary drive member 331 drives the suction clamp 332 to rotate, so that the suction clamp 332 moves the chip to a position close to the glue storage platform 321. At this time, the glue driver 311 works to drive the glue needle 312 to first insert into the annular groove 3211, so that the glue needle 312 is adhered to the glue needle 312, and then drives the glue needle 312 to move toward the suction clamp 332 so that the glue needle 312 can apply glue to the chip.

[0056] In this embodiment, two visual elements 11 are installed on the frame 1. One visual element 11 is set close to the calibration module 24 to assist the calibration module 24 in calibrating the angle of the chip. The other visual element 11 is set close to the dispensing drive 311 to monitor the operation of the dispensing module 31.

[0057] Reference Figure 1The product feeding mechanism 4 includes a support platform 41 and a material tray 42. The support platform 41 is mounted on the frame 1, and the material tray 42 is mounted on the support platform 41. The material tray 42 is tilted toward the suction clamp 332. In other embodiments, multiple material trays 42 can be provided, and the multiple material trays 42 can be arranged parallel to each other.

[0058] In this embodiment, the inclination angle of the tray 42 is 45 degrees, so that when two chips are glued together and placed on the tray 42, the two chips are not easily offset under the action of gravity due to uncured glue, which is beneficial to improving the product yield.

[0059] Reference Figure 1 The chip feeding mechanism 5 includes a driving module 51 and a flipping module 52. The driving module 51 is mounted on the frame 1 and is located beside the support platform 41. The driving module 51 can drive the flipping module 52 to move between the material tray 42 and the adsorption clamp 332.

[0060] The drive module 51 includes a Y-axis drive 511 and a Z-axis drive 512. One end of the Y-axis drive 511 extends above the suction clamp 332. The Z-axis drive 512 is slidably connected to the Y-axis drive 511, enabling the Y-axis drive 511 to drive the Z-axis drive 512 to move between the material tray 42 and the suction clamp 332. The flip module 52 is mounted on the Z-axis drive 512, allowing it to be driven up and down by the Z-axis drive 512.

[0061] Reference Figure 1 and Figure 3 The flip module 52 includes a flip driver 521 and a support member 522. The flip driver 521 is mounted on the Z-axis driver 512, and the support member 522 is fixedly connected to the output end of the flip driver 521. In this embodiment, the flip driver 521 is a motor, so that the flip driver 521 can drive the support member 522 to flip.

[0062] At least two adsorption members 523 are mounted on the support member 522, and the adsorption members 523 are used to adsorb the chip. In this embodiment, two adsorption members 523 are provided.

[0063] When the chip on the tray 42 needs to be transferred to the adsorption clamp 332, the Y-axis drive 511 and the Z-axis drive 512 are first started to move the flip drive 521 to a position close to the tray 42, and then a suction member 523 is used to remove the chip to be processed stored on the tray 42. At this time, there is no chip adsorbed on the other adsorption member 523. Then, the Y-axis drive 511 and the Z-axis drive 512 drive the flip drive 521 to move to a position close to the adsorption clamp 332, and use the adsorption member 523 that does not adsorb the chip to remove the chip on the adsorption clamp 332, and then start the flip drive 521 to drive the two adsorption members 523 to flip through the support member 522, so that the other adsorption member 523 transports the chip to be processed to the adsorption clamp 332, and the adsorption clamp 332 clamps the chip to be processed, thereby completing the transfer of the chip.

[0064] Reference Figure 3 In this embodiment, the support member 522 is L-shaped, and the angle between the two adsorption members 523 is 90 degrees. On the one hand, it makes it difficult for the two adsorption members 523 to interfere with each other during the process of accessing the chip. On the other hand, it makes the flipping path of the two adsorption members 523 more direct and efficient, reducing unnecessary movement to a certain extent, which is beneficial to improving the efficiency of the adsorption members 523 in accessing the chip, and thus is beneficial to improving the overall production efficiency.

[0065] The implementation principle of a die bonding machine with a flipping mechanism in the embodiment of the present application is as follows: when it is necessary to perform a die bonding operation on two chips, the ejector module 22 lifts the chip, and the swing arm module 23 transfers the chip lifted by the ejector module 22 to the calibration module 24. After the calibration module 24 calibrates the angle of the chip, the moving module 25 removes the chip from the calibration module 24 and transfers it to a position close to the adsorption clamp 332. At the same time, the Y-axis drive 511 and the Z-axis drive 512 work to drive the flipping drive 521 to move first to a position close to the material tray 42, and then to a position close to the adsorption clamp 332. During this process, an adsorption component 523 removes the chip to be processed stored on the material tray 42 and transfers the chip to be processed to the adsorption clamp 332, so that the adsorption clamp 332 can clamp the chip.

[0066] Next, the rotary drive 331 rotates the suction clamp 332, causing it to move the chip closer to the glue reservoir 321. At this point, the glue driver 311 activates, driving the glue needle 312 to apply glue to the chip. The mobile module 25 then places another chip over the glued chip, bonding the two chips together.

[0067] Finally, the rotary drive 331 drives the suction clamp 332 to rotate close to the tray 42. One suction member 523 removes the two bonded chips from the suction clamp 332, and the other suction member 523 transfers the new chip to be processed to the suction clamp 332. The Y-axis drive 511 and Z-axis drive 512 then move the flip drive 521 close to the tray 42, allowing the suction member 523 to place the two bonded chips on the tray 42, thus completing the die bonding operation for the two chips.

[0068] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A die bonder with a flip mechanism, characterized in that: include: A chip loading mechanism (2) is used to provide chips to be processed; A dispensing mechanism (3), used for dispensing glue on the chip; A product feeding mechanism (4) includes a support platform (41) and a plurality of material trays (42) arranged on the support platform (41), wherein the plurality of material trays (42) are parallel to each other and tilted in a direction close to the dispensing mechanism (3), and the tilt angle of the material trays (42) is 45 degrees. The material trays (42) are used to store chips to be processed and chips after dispensing; The chip feeding mechanism (5) comprises a driving module (51) and a flipping module (52) arranged on the driving module (51), wherein at least two adsorption members (523) are arranged on the flipping module (52), the flipping module (52) is used to drive the adsorption members (523) to flip, the adsorption members (523) are used to adsorb chips, and the driving module (51) is used to drive the flipping module (52) to move between the product feeding mechanism (4) and the dispensing mechanism (3).

2. The die bonder with a flip mechanism according to claim 1, characterized in that: The driving module (51) includes a Y-axis driving member (511) and a Z-axis driving member (512), one end of the Y-axis driving member (511) extends above the dispensing mechanism (3), the Z-axis driving member (512) is arranged on the Y-axis driving member (511), and the flip module (52) is arranged on the Z-axis driving member (512), the Y-axis driving member (511) is used to drive the Z-axis driving member (512) to move between the product feeding mechanism (4) and the dispensing mechanism (3), and the Z-axis driving member (512) is used to drive the flip module (52) to move up and down.

3. The die bonder with a flip mechanism according to claim 2, characterized in that: The flip module (52) comprises a flip driving component (521) and a support component (522), wherein the flip driving component (521) is arranged on the Z-axis driving component (512), and the support component (522) is connected to the output end of the flip driving component (521). Two adsorption components (523) are provided, and the two adsorption components (523) are respectively arranged on the support component (522).

4. The die bonder with a flip mechanism according to claim 3, characterized in that: The angle between the two adsorption members (523) is 90 degrees.

5. The die bonder with a flip mechanism according to claim 1, characterized in that: The dispensing mechanism (3) includes a dispensing module (31), a glue supply module (32) and a clamping module (33). The dispensing module (31), the glue supply module (32) and the clamping module (33) are sequentially distributed in a direction close to the driving module (51). The clamping module (33) is used to clamp the chip, and the dispensing module (31) is used to apply glue from the glue supply module (32) to the chip clamped by the clamping module (33).

6. The die bonder with a flip mechanism according to claim 5, characterized in that: The glue supply module (32) comprises a glue storage platform (321), a driving member (322) and a glue scraping member (323); an annular groove (3211) is provided on the glue storage platform (321); glue is stored in the annular groove (3211); the driving member (322) is arranged on the glue storage platform (321); the glue scraping member (323) is slidably inserted in the annular groove (3211) and connected to the driving member (322); the driving member (322) is used to drive the glue scraping member (323) to move in the annular groove (3211).

7. The die bonder with a flip mechanism according to claim 5, characterized in that: The clamping claw module (33) includes a rotating driving member (331) and an adsorption clamping claw (332) arranged on the rotating driving member (331), wherein the rotating driving member (331) is arranged between the product feeding mechanism (4) and the glue supply module (32), and the rotating driving member (331) is used to drive the adsorption clamping claw (332) to rotate, and the adsorption clamping claw (332) is used to clamp the chip.

8. The die bonder with a flip mechanism according to claim 1, characterized in that: It comprises a frame (1), wherein the chip loading mechanism (2), the glue dispensing mechanism (3), the product feeding mechanism (4), and the chip feeding mechanism (5) are respectively arranged on the frame (1).

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