Heating device

Abstract

The invention provides a heating device, which can improve the heat dissipation efficiency of an electronic component with heat generating property. A heating device (10) is provided with: a circuit board (12); an electronic component (13) disposed on the circuit board (12); a housing (20) in which a housing space (29) for housing the circuit board (12) and a flow path (21) through which the heat medium flows are formed; and a heater (11) that is disposed in the flow path (21) and heats the heat medium, in which a plurality of wall sections constituting the housing space (29) are provided with contact wall sections (26) in which the electronic component (13) is in direct or indirect contact, and the contact wall sections (26) are in contact with the outside air.

Description

Technical Field

[0001] The present disclosure relates to a heating device. Background Art

[0002] As a heat medium heating device for a vehicle air conditioning device, a device described in Japanese Patent Gazette No. 2018-133300 (hereinafter referred to as Patent Document 1) has been known in the past. The heat medium heating device includes a housing in which a heat medium circulates, a PTC heater for heating the heat medium, and a control substrate for controlling the PTC heater. The housing includes a substrate accommodating portion for accommodating the control substrate. The control substrate includes electronic components. It is recorded that electronic components with heat generation such as IGBT (Insulated Gate Bipolar Transistor), FET (Field Effect Transistor) and other electronic components can be used in the electronic components.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1

[0006] Japanese Patent Publication No. 2018-133300 Summary of the invention

[0007] Problems to be solved by the invention

[0008] In the above structure, the electronic component is arranged in the space inside the substrate receiving portion and does not contact with any components other than the substrate body of the control substrate. Here, when a component having heat generation is used as the electronic component, the heat generated by the electronic component is transferred to the air inside the substrate receiving portion. In such a case, the electronic component cannot sufficiently release heat and overheats, and thus the electronic component may not function normally.

[0009] The present disclosure has been made based on the above-mentioned circumstances, and an object of the present disclosure is to provide a heating device capable of improving the heat dissipation efficiency of an electronic component having heat generation.

[0010] Technical solutions to solve problems

[0011] The heating device disclosed in the present invention comprises: a circuit substrate; an electronic component arranged on the circuit substrate; a housing, inside which is formed a storage space for accommodating the circuit substrate and a flow path for circulating a heat medium; and a heater, arranged on the flow path, for heating the heat medium, wherein a plurality of walls constituting the storage space comprises a contact wall portion for direct or indirect contact with the electronic component, and the contact wall portion is in contact with external air.

[0012] Effects of the Invention

[0013] According to the present disclosure, it is possible to provide a heating device capable of improving the heat dissipation efficiency of an electronic component having heat generation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is an exploded perspective view of the heating device according to the first embodiment.

[0015] Figure 2 It is a three-dimensional diagram of the heating device.

[0016] Figure 3 yes Figure 2 AA section view.

[0017] Figure 4 yes Figure 3 Magnified image of .

[0018] Figure 5 This is a perspective view of electronic components arranged on a circuit board.

[0019] Figure 6 It is a rear view of the heating device showing the arrangement of the electronic components in the contact wall portion.

[0020] Figure 7 is a cross-sectional view of a heating device according to Embodiment 2, which is similar to Embodiment 1. Figure 3 The corresponding figure. DETAILED DESCRIPTION

[0021] [Description of Embodiments of the Present Disclosure]

[0022] First, embodiments of the present disclosure will be described below.

[0023] [1] The heating device disclosed in the present invention comprises: a circuit substrate; an electronic component arranged on the circuit substrate; a housing having a storage space for accommodating the circuit substrate and a flow path for circulating a heat medium; and a heater arranged on the flow path for heating the heat medium, wherein a plurality of walls constituting the storage space have a contact wall portion for direct or indirect contact with the electronic component, and the contact wall portion is in contact with external air.

[0024] According to such a structure, the heat of the electronic component can be transferred to the outside air through the contact wall portion.

[0025] [2] In the above [1], preferably, the contact wall portion has the largest area in contact with external air among the plurality of wall portions.

[0026] According to such a structure, the contact wall portion has the largest area in contact with the outside air among the plurality of wall portions, and thus the heat dissipation effect from the electronic component to the outside air can be further improved.

[0027] [3] In the above [1] or [2], preferably, the housing is configured to include the contact wall portion and a housing body to which the contact wall portion can be attached and detached.

[0028] According to such a configuration, the circuit board can be easily accommodated in the accommodation space in a state where the electronic component is in contact with the contact wall portion.

[0029] [4] In any one of the above [1] to [3], preferably, the contact wall portion includes a plurality of fins that come into contact with external air.

[0030] According to such a structure, the area of ​​the contact wall portion in contact with the outside air is increased by the plurality of fins, so that the heat dissipation effect from the electronic component to the outside air can be further improved.

[0031] [5] In any one of the above [1] to [4], preferably, the contact wall portion is formed of a metal heat sink.

[0032] According to such a structure, the heat dissipation property of the contact wall portion can be improved, and thus the heat dissipation effect from the electronic component to the outside air can be further improved.

[0033] [6] In any one of the above [1] to [5], preferably, the electronic component is in contact with a portion of the contact wall portion close to the center portion.

[0034] According to such a structure, compared with a case where the electronic component is in contact with the outer peripheral edge of the contact wall portion, the heat of the electronic component is more easily and evenly transferred to the entire contact wall portion, and the heat dissipation effect from the electronic component to the outside air can be further improved.

[0035] [Details of Embodiment 1 of the Present Disclosure]

[0036] Reference Figures 1 to 6 Embodiment 1 of the present disclosure is described. In addition, the present disclosure is not limited to these examples, but is shown in the claims, and is intended to include all changes within the meaning and scope equivalent to the claims. In the following description, for multiple identical components, sometimes only some of the components are marked with figure marks, and the figure marks of other components are omitted. In this specification, the positive direction of the Z axis is taken as the upward direction, the negative direction of the Z axis is taken as the downward direction, the positive direction of the X axis is taken as the front direction, and the positive direction of the Y axis is taken as the left direction to describe the structure of the heating device 10, but the actual use of the heating device 10 may also be a different configuration.

[0037] <Heating device>

[0038] The heating device 10 of this embodiment is a device for heating a liquid such as water (an example of a heat medium). The heating device 10 is provided in an electric vehicle (EV) for heating the vehicle interior and keeping the battery warm. Figure 3 As shown, the heating device 10 includes a heater 11 , a circuit board 12 , and a housing 20 that accommodates the heater 11 and the circuit board 12 .

[0039] <Heater>

[0040] The heater 11 of the present embodiment is a ceramic heater. The heater 11 includes a cylindrical member 11A and a heating resistor (not shown) buried inside the cylindrical member 11A. The cylindrical member 11A is mainly composed of a ceramic material such as alumina. The heating resistor is composed of a metal such as tungsten and has a meandering thin wire shape. The heating resistor generates heat by applying a voltage from a power supply device. The heater 11 can be manufactured, for example, by sandwiching a metal pattern that becomes a heating resistor between ceramic green sheets and winding it around a rod-shaped profile for firing. The heater 11 includes a flange portion 11B brazed to the outer peripheral surface of the cylindrical member 11A. The flange portion 11B is plate-shaped and annular. The flange portion 11B is arranged near the upper end of the cylindrical member 11A.

[0041] <Circuit boards, electronic components>

[0042] like Figure 5 As shown, an electronic component 13 for controlling the output of the heater 11 is arranged on one surface (rear surface) of the circuit substrate 12. The electronic component 13 is, for example, a switching element such as FET or IGBT. The electronic component 13 has the characteristic of being easy to generate heat, and the heat generated is smaller than that of the heater 11, but it generates heat when energized. The electronic component 13 includes a main body 13A and a lead portion 13B electrically connected to the circuit substrate 12. The main body 13A is made of resin, and semiconductor elements and the like are buried inside. The lead portion 13B is arranged on the side of the main body 13A. In addition, the lead portion 13B can also be arranged on the bottom surface of the main body 13A (the surface facing the circuit substrate 12, the front surface). Although not shown in detail, leads 15 and 16 connected to the heater 11 are electrically connected to the circuit substrate 12 (see Figure 2 ), and wiring 17 connected to various measuring devices such as a thermometer 24 (refer to Figure 2 ).

[0043] <Housing>

[0044] like Figure 3 As shown, the housing 20 includes a flow path member 22 constituting a flow path 21 through which liquid flows, and a substrate housing portion 23 housing the circuit substrate 12. The flow path member 22 is made of resin. The heater 11 is disposed in the flow path 21.

[0045] like Figure 2As shown, the flow path component 22 includes a barrel portion 22A that is approximately cylindrical, a fixing component 22B mounted on the upper end of the barrel portion 22A, a bottom wall 22C that closes the lower end of the barrel portion 22A, and a cylindrical branch portion 22D that branches from the barrel portion 22A. The fixing component 22B is approximately cylindrical. An inlet 21A is formed in the fixing component 22B as one end of the flow path 21. A flange portion 22B1 is formed at the lower end of the fixing component 22B. The flange portion 22B1 is fixed to the barrel portion 22A by bolting in a manner that closes the opening of the upper end of the barrel portion 22A. In addition, as shown in FIG. Figure 3 As shown, the flange portion 22B1 presses the flange portion 11B of the heater 11 downward. As a result, the sealing component S1 disposed between the flange portion 11B of the heater 11 and the opening edge of the barrel 22A is compressed, and the flange portion 11B and the barrel 22A are sealed liquid-tightly. A pressing portion 22B2 that is stepped and expands outward is provided in the central portion in the up-down direction of the fixed component 22B. The pressing portion 22B2 presses the upper end portion of the cylindrical component 11A of the heater 11 via the sealing component S2. As a result, the inlet 21A is connected to the internal space 11A1 of the cylindrical component 11A, and the fixed component 22B and the cylindrical component 11A are sealed liquid-tightly.

[0046] The bottom wall 22C closes the opening of the lower end of the cylinder 22A via the sealing member S3. The branch portion 22D is formed integrally with the cylinder 22A. The branch portion 22D protrudes forward from a portion near the upper end of the cylinder 22A. The branch portion 22D is formed with a discharge port 21B as the other end of the flow path 21. Figure 2 As shown, a thermometer 24 for measuring the temperature of the liquid flowing in the vicinity of the discharge port 21B is provided at the branch portion 22D.

[0047] like Figure 3 As shown by the arrow, the liquid is introduced from the inlet 21A and passes downward through the internal space 11A1 of the heater 11. Thereafter, the liquid is discharged from the opening at the lower end of the cylindrical member 11A to the outside of the heater 11, and moves upward in the flow path 21 outside the heater 11. Furthermore, the liquid is discharged to the outside through the outlet 21B at a position near the upper end of the cylinder 22A.

[0048] like Figure 2 As shown, the fixing member 22B has box-shaped terminal accommodating portions 25 on both sides thereof. Terminals (not shown) are accommodated in the terminal accommodating portions 25. Although detailed description is omitted, the positive and negative electrodes of the heater 11 are electrically connected to the leads 15 and 16 via the terminals.

[0049] The substrate storage portion 23 is configured to have six wall portions and is in a rectangular parallelepiped shape. Figure 1As shown, the substrate storage portion 23 includes: a first wall portion 23A; a second wall portion 23B extending rearward from the upper end portion of the first wall portion 23A; a third wall portion 23C extending rearward from the lower end portion of the first wall portion 23A; a fourth wall portion 23D extending rearward from the left end portion of the first wall portion 23A; a fifth wall portion 23E extending rearward from the right end portion of the first wall portion 23A; and a contact wall portion 26 arranged opposite to the first wall portion 23A in the front-to-back direction. The second to fifth wall portions 23B to E are in the shape of a square cylinder. Figure 2 As shown, the first wall portion 23A extends from the rear end portion of the tube portion 22A in the left-right direction.

[0050] <Contact Wall>

[0051] like Figure 1 As shown, the first to fifth wall portions 23A to E constitute a box portion 27 that opens at the rear. The box portion 27 is made of resin and is formed integrally with the flow path component 22. In other words, the box portion 27 and the flow path component 22 constitute the housing body 28. The contact wall portion 26 is composed of a metal heat sink. For example, the contact wall portion 26 can also be made of aluminum. The contact wall portion 26 can be loaded and unloaded relative to the box portion 27 (housing body 28). In detail, the contact wall portion 26 is fixed to the box portion 27 by bolts. The box portion 27 and the contact wall portion 26 constitute a storage space 29 for accommodating the circuit substrate 12. An insulator 40 and an insulating heat conductor 50 are stacked on the contact wall portion 26 from the front. The second to fifth wall portions 23B to E and the contact wall portion 26 become part of the outer surface of the heating device 10 and are in contact with the external air.

[0052] The insulator 40 is plate-shaped. The insulator 40 is made of, for example, PE, PP, PVC, PS, PA6, PFA, PTFE, or fluorine-based resin. A rectangular through hole 41 is formed in the approximate center of the insulator 40. The insulator 40 is fixed to the contact wall 26 by, for example, bolt fastening.

[0053] The heat conductor 50 is in sheet form and is made of, for example, resin. The heat conductivity of the heat conductor 50 is 1.0×10 -4 cal / cm·sec·℃ or more. The heat conductor 50 has elasticity and can be deformed to restore its shape to a certain extent. That is, the deformation of the heat conductor 50 is different from plastic deformation. The heat conductor 50 is sandwiched between the contact wall portion 26 and the insulator 40 and fixed. The heat conductor 50 is formed into a rectangular shape slightly larger than the through hole 41 of the insulator 40. Figure 4 As shown, the outer edge of the heat conductor 50 is sandwiched between the hole edge of the through hole 41 and the contact wall portion 26. Thus, the heat conductor 50 is exposed to the circuit board 12 side through the through hole 41.

[0054] like Figure 3As shown in FIG. 1 , the circuit board 12 is disposed close to the contact wall portion 26 in the accommodation space 29. The circuit board 12 is fixed to the contact wall portion 26 by bolt fastening. Figure 4 As shown in FIG. 1 , the electronic component 13 is arranged in contact with the heat conductor 50. Specifically, the rear surface 13A1 of the main body 13A of the electronic component 13 is in contact with the front surface of the heat conductor 50 exposed on the circuit substrate 12 side via the through hole 41 of the insulator 40 in a pressed state. As a result, the heat generated from the electronic component 13 accompanying the control of the heater 11 can be transferred to the outside air through the heat conductor 50 and the contact wall portion 26. Therefore, the electronic component 13 can be cooled. In addition, since the heat conductor 50 is insulating, the discharge between the electronic component 13 and the contact wall portion 26 is suppressed.

[0055] Since the heat conductor 50 has elasticity, damage to the electronic component 13 can be suppressed even when the electronic component 13 is pressed against the heat conductor 50. In addition, by pressing the electronic component 13 against the heat conductor 50, the close contact between the heat conductor 50 and the electronic component 13 can be improved, and the heat dissipation effect from the electronic component 13 to the contact wall portion 26 can be improved.

[0056] The heating device 10 of the present embodiment is particularly suitable for use in cold regions where the outside temperature is low (for example, 0° C. or lower). When the heating device 10 is used in cold regions, the electronic components 13 can be cooled more efficiently.

[0057] like Figure 1 As shown, the contact wall portion 26 has the largest area in contact with the outside air among the six wall portions. Therefore, compared with the case where the contact wall portion is provided on other wall portions unlike the present embodiment, the heat of the electronic component 13 can be released to the outside air more efficiently.

[0058] like Figure 6 As shown, in the present embodiment, the electronic component 13 is in contact with the portion CP near the center of the contact wall portion 26. Here, the portion CP near the center refers to, for example, a portion whose distance from the center to the outer periphery of the contact wall portion 26 is less than 0.6D. Since the electronic component 13 is in contact with the portion CP near the center of the contact wall portion 26, the heat of the electronic component 13 is easily and evenly transferred to the entire contact wall portion 26, compared with the case where the electronic component 13 is in contact with the outer periphery of the contact wall portion 26 (the portion other than the portion CP near the center). As a result, the heat dissipation effect from the electronic component 13 to the outside air can be further improved.

[0059] <Effects of Implementation Method 1>

[0060] (1-1) The heating device 10 of embodiment 1 comprises: a circuit substrate 12; an electronic component 13, which is arranged on the circuit substrate 12; a housing 20, in which a housing space 29 for accommodating the circuit substrate 12 and a flow path 21 for circulating a heat medium are formed; and a heater 11, which is arranged on the flow path 21 and heats the heat medium, wherein a plurality of wall portions constituting the housing space 29 include a contact wall portion 26 with which the electronic component 13 indirectly contacts, and the contact wall portion 26 contacts the external air.

[0061] According to such a structure, the heat of the electronic component 13 can be transferred to the outside air through the contact wall portion 26 .

[0062] (1-2) In Embodiment 1, the contact wall portion 26 has the largest area in contact with the outside air among the plurality of wall portions.

[0063] According to such a structure, the contact wall portion 26 has the largest area in contact with the outside air among the plurality of wall portions, and thus the heat dissipation effect from the electronic component 13 to the outside air can be further improved.

[0064] (1-3) In Embodiment 1, the housing 20 is configured to include the contact wall portion 26 and the housing body 28 to which the contact wall portion 26 can be attached and detached.

[0065] According to such a structure, the circuit board 12 can be easily accommodated in the accommodation space 29 in a state where the electronic component 13 is in contact with the contact wall portion 26 .

[0066] (1-4) In Embodiment 1, the contact wall portion 26 is formed of a metal heat dissipation plate.

[0067] According to such a structure, the heat dissipation of the contact wall portion 26 can be improved, and thus the heat dissipation effect from the electronic component 13 to the outside air can be further improved.

[0068] (1-5) In Embodiment 1, the electronic component 13 is in contact with the portion CP close to the center portion of the contact wall portion 26 .

[0069] According to this structure, compared with a case where electronic component 13 contacts the outer peripheral edge of contact wall portion 26 , heat from electronic component 13 is more easily and evenly transferred to the entire contact wall portion 26 , thereby further improving the heat dissipation effect from electronic component 13 to the outside air.

[0070] [Details of Embodiment 2 of the Present Disclosure]

[0071] Reference Figure 7Embodiment 2 of the present disclosure will be described. Heating device 110 of Embodiment 2 is configured similarly to heating device 10 of Embodiment 1 except for the structure of contact wall portion 126. Hereinafter, the same reference numerals are given to the same components as those of Embodiment 1, and description thereof will be omitted.

[0072] The housing 120 of the second embodiment includes a flow path component 22 and a substrate housing portion 123. The substrate housing portion 123 is constructed in the same manner as the first embodiment except for the contact wall portion 126. The contact wall portion 126 has a plurality of fins 126A on the outer surface in contact with the external air. The fins 126A are in the shape of a thin plate and protrude from the outer surface of the contact wall portion 126. The fins 126A extend in the left-right direction and are flat in the up-down direction. The plurality of fins 126A are arranged in the up-down direction. By providing the fins 126A on the contact wall portion 126, the surface area of ​​the contact wall portion 126 in contact with the external air can be increased. Therefore, the heat dissipation effect from the contact wall portion 126 to the external air can be improved. Therefore, the electronic component 13 can be effectively cooled.

[0073] <Effects of Implementation Method 2>

[0074] (2-1) In the heating device 110 according to the second embodiment, the contact wall portion 126 includes the plurality of fins 126A that come into contact with the outside air.

[0075] According to such a structure, the area of ​​the contact wall portion 126 in contact with the outside air is increased by the plurality of fins 126A, so that the heat dissipation effect from the electronic component 13 to the outside air can be further improved.

[0076] <Other Implementation Methods>

[0077] (1) In the above-mentioned first and second embodiments, the heater 11 is a ceramic heater, but the heater may be a PTC heater or a sheath heater.

[0078] (2) In the above-mentioned Embodiments 1 and 2, the heater 11 has a cylindrical shape, but the shape of the heater can be changed as appropriate.

[0079] (3) In the above-mentioned first and second embodiments, the heat conductor 50 has elasticity. However, for example, the heat conductor may not have elasticity but may be plastically deformed.

[0080] (4) In the above-mentioned first and second embodiments, the contact wall portions 26 and 126 are made of metal, but the contact wall portions may not be made of metal. The contact wall portions may be made of ceramics or resin, for example.

[0081] (5) In the first and second embodiments, the electronic component 13 is in indirect contact with the contact wall 26 or 126 via the heat conductor 50 . However, for example, if the contact wall is insulating, the electronic component may be in direct contact with the contact wall.

[0082] (6) In the above-described first and second embodiments, the insulator 40 is provided between the circuit board 12 and the contact wall portions 26 and 126 . However, for example, when the contact wall portions are insulating, the insulator may be omitted.

[0083] Description of Reference Numerals

[0084] 10, 110…Heating device

[0085] 11 ... heater, 11A1 ... internal space, 11A ... cylindrical member, 11B ... flange portion

[0086] 12 ... circuit board, 13 ... electronic component, 13A ... main body, 13A1 ... rear surface, 13B ... lead portion, 15, 16 ... lead, 17 ... wiring

[0087] 20, 120 ... housing, 21 ... flow path, 21A ... inlet, 21B ... outlet, 22 ... flow path component, 22A ... barrel, 22B ... fixing component, 22B1 ... flange, 22B2 ... pressing portion, 22C ... bottom wall, 22D ... branch portion, 23, 123 ... substrate storage portion, 23A ... first wall portion, 23B ... second wall portion, 23C ... third wall portion, 23D ... fourth wall portion, 23E ... fifth wall portion, 24 ... thermometer, 25 ... terminal storage portion, 26, 126 ... contact wall portion, 27 ... box portion, 28 ... housing body, 29 ... storage space

[0088] 40…insulator, 41…through hole

[0089] 50…Heat conductor

[0090] CP…Part of the contact wall near the center

[0091] S1, S2, S3, S4…Seal parts

[0092] 126A…Fin

Claims

1. A heating device comprising: Circuit board; Electronic components, arranged on the circuit substrate; a housing having a receiving space for receiving the circuit substrate and a flow path for circulating a heating medium; and A heater is disposed in the flow path to heat the heat medium, wherein: The plurality of walls constituting the housing space include contact walls with which the electronic components can directly or indirectly contact. The contact wall portion is in contact with external air.

2. The heating device according to claim 1, wherein: The contact wall portion has the largest area in contact with external air among the plurality of wall portions.

3. The heating device according to claim 1 or 2, wherein: The housing includes the contact wall portion and a housing body to which the contact wall portion can be attached and detached.

4. The heating device according to claim 1 or 2, wherein: The contact wall portion includes a plurality of fins that come into contact with external air.

5. The heating device according to claim 1 or 2, wherein: The contact wall portion is formed of a metal heat sink plate.

6. The heating device according to claim 1 or 2, wherein: The electronic component is in contact with a portion of the contact wall portion close to the central portion.

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