Cooling system, cooling method and data center

Abstract

The invention relates to a cooling system, a cooling method and a data center. The cooling system comprises a primary cooling loop and a secondary cooling loop, wherein the secondary cooling loop comprises a liquid supply main pipe; the first circulating pump is arranged on the liquid supply main pipe; the liquid supply branch pipes are connected with the liquid supply main pipe; a plurality of heat dissipation pieces, each liquid supply branch pipe is provided with one heat dissipation piece, and the plurality of heat dissipation pieces are arranged in one-to-one correspondence with the plurality of servers and are used for cooling the corresponding servers; and one speed regulating pump is arranged on each liquid supply branch pipe. According to the embodiment of the invention, each liquid supply branch pipe is provided with the speed regulating pump, so that the rotating speed of the speed regulating pump on the corresponding liquid supply branch pipe can be adjusted according to the actual operation load of each server, and the sum of the power consumption of the first circulating pump and the power consumption of the speed regulating pumps is smaller than the power consumption of the circulating pumps of the cooling system in the related technology; therefore, energy consumption of the cooling system can be reduced, and the purpose of saving energy is achieved.

Description

Technical Field

[0001] The present application relates to the field of cooling technology, and in particular to a cooling system, a cooling method and a data center. Background Art

[0002] With the development of artificial intelligence and big data, the amount of computing in data centers has increased dramatically, and the power consumption of heat-generating components such as CPUs, GPUs, and hard disks in servers has also increased, which has made the traditional air cooling capacity insufficient. Based on this situation, liquid cooling has gradually become the development trend of server cooling.

[0003] At present, the cooling system of data centers using liquid cooling usually uses a circulating pump as the power source for liquid supply, and the circulating pump is the main energy-consuming component in the cooling system. The circulating pump in the cooling system of a data center in the related art usually supplies liquid based on the working condition that all servers are running at full load, which makes the circulating pump run at a higher power for a long time and consumes more energy. Therefore, it is necessary to consider how to reduce the energy consumption of the cooling system of the data center to make the cooling system more energy-efficient. Summary of the invention

[0004] Based on this, a cooling system, a cooling method and a data center are provided, aiming to reduce the energy consumption of the cooling system.

[0005] An embodiment of the first aspect of the present application proposes a cooling system, which includes a primary cooling circuit and a secondary cooling circuit, and the secondary cooling circuit includes: a liquid supply main pipe connected to the primary cooling circuit; a first circulation pump, arranged on the liquid supply main pipe; multiple liquid supply branches, connected to the liquid supply main pipe; multiple heat sinks, one heat sink is arranged on each of the liquid supply branches, and the multiple heat sinks are arranged in a one-to-one correspondence with multiple servers for cooling the corresponding servers; a liquid return main pipe, multiple liquid supply branches are connected to the liquid return main pipe, and the liquid return main pipe is connected to the primary cooling circuit; multiple speed regulating pumps, one speed regulating pump is arranged on each of the liquid supply branches.

[0006] In the cooling system of the embodiment of the present application, a speed regulating pump is provided on each liquid supply branch, and the speed regulating pump and the first circulating pump form a series relationship. When the pumps are connected in series, the pressure of the liquid outlet is the sum of the pressures of the two pumps. That is to say, after adding the speed regulating pump, the pressure of the liquid outlet of the first circulating pump alone can be reduced. In addition, the server is not always in full load operation. The embodiment of the present application is provided with a speed regulating pump on each liquid supply branch. In this way, the speed of the speed regulating pump on the corresponding liquid supply branch can be adjusted according to the actual operating load of each server, that is, when the actual operating load of the server on a certain liquid supply branch is lower than the full load, the actual speed of the speed regulating pump on the liquid supply branch can also be lowered. In this way, the sum of the power consumption of the first circulating pump and each speed regulating pump is less than the power consumption of the circulating pump of the cooling system (only the circulating pump is provided in the cooling system) in the related art, thereby reducing the energy consumption of the cooling system and achieving the purpose of energy saving.

[0007] In some embodiments, the secondary cooling circuit further includes a plurality of controllers and a plurality of temperature sensors, the plurality of temperature sensors are arranged in a one-to-one correspondence with the plurality of servers, and the temperature sensors are used to measure the temperature of the heating element in the corresponding server; the plurality of controllers are arranged in a one-to-one correspondence with the plurality of sensors, the controllers are electrically connected to the corresponding temperature sensors, the plurality of controllers are also arranged in a one-to-one correspondence with the plurality of speed regulating pumps, the controllers are also electrically connected to the corresponding speed regulating pumps, and the controllers are configured to control the speed of the speed regulating pumps according to the temperature of the heating element in the server. In this embodiment, each temperature sensor corresponds to a server, and is used to obtain the temperature of the heating element in the corresponding server, and transmit the measured temperature information to the corresponding controller, and the controller can control the speed of the speed regulating pump on the corresponding liquid supply branch according to the temperature. In this way, the speed of each speed regulating pump can be matched with the operating conditions of the server on the liquid supply branch, thereby reducing the energy consumption of the cooling system to achieve the purpose of energy saving.

[0008] In some embodiments, the primary cooling circuit includes a cooling tower and a cooling liquid distribution unit connected to the cooling tower; the liquid supply main pipe and the liquid return main pipe are both connected to the cooling liquid distribution unit.

[0009] The cooling tower can be installed outdoors, and the coolant distribution unit can be installed indoors in the data center. The cooling tower can absorb the heat of the coolant and discharge the heat into the atmosphere, thereby reducing the temperature of the coolant in the primary cooling circuit. The coolant cooled by the cooling tower is transported to the coolant distribution unit, where it exchanges heat with the coolant in the secondary cooling circuit, thereby cooling the coolant in the secondary cooling circuit. The cooled coolant in the secondary cooling circuit is used to cool the server.

[0010] In some embodiments, the primary cooling circuit further includes a second circulation pump, and the cooling tower is connected to the coolant distribution unit via the second circulation pump. Thus, the coolant that has been cooled in the cooling tower can be transported to the coolant distribution unit under the driving action of the second circulation pump, so that the coolant that has been cooled can perform heat exchange with the coolant in the secondary cooling circuit in the coolant distribution unit.

[0011] An embodiment of the second aspect of the present application provides a data center, which includes the cooling system in any one of the above embodiments.

[0012] The data center in the embodiment of the present application is based on the same inventive concept as the cooling system in the above embodiment, and therefore, the data center can obtain all the beneficial effects of the above cooling system.

[0013] In some embodiments, the data center further comprises: a plurality of servers; a cabinet, wherein the plurality of servers are arranged in the cabinet, and the secondary cooling circuit is used to cool the plurality of servers. The servers are arranged in the cabinet, and the cabinet has dustproof, waterproof, anti-collision and other protective functions for the servers.

[0014] In some embodiments, there are multiple cabinets, and the multiple servers are arranged in the multiple cabinets. Such arrangement facilitates orderly storage of the servers in the data center. It is understandable that the coolant can be introduced into different cabinets through different liquid supply branches to facilitate cooling and heat dissipation of the servers in different cabinets.

[0015] An embodiment of the third aspect of the present application provides a cooling method, which is implemented based on the cooling system in any of the above embodiments. The cooling method includes:

[0016] The first circulation pump and the speed regulating pumps are used to provide cooling liquid to the heat sinks on the liquid supply branches. The speed of the speed regulating pumps on the corresponding liquid supply branches is controlled according to the temperature of the heating element in the server.

[0017] After the speed regulating pump is installed on each liquid supply branch pipe, the liquid outlet pressure of the first circulation pump can be reduced. In addition, the speed of the speed regulating pump on the corresponding liquid supply branch pipe can be adjusted according to the actual operating load of each server. In this way, the sum of the power consumption of the first circulation pump and each speed regulating pump is less than the power consumption of the circulation pump in the relevant cooling system (only the circulation pump is installed in the cooling system), thereby reducing the energy consumption of the cooling system and achieving the purpose of energy saving.

[0018] In some embodiments, the secondary cooling circuit further includes a plurality of controllers and a plurality of temperature sensors, the plurality of temperature sensors are arranged in a one-to-one correspondence with the plurality of servers, and the temperature sensors are used to measure the temperature of the heating elements in the corresponding servers; the plurality of controllers are arranged in a one-to-one correspondence with the plurality of sensors, the controllers are electrically connected to the corresponding temperature sensors, the plurality of controllers are also arranged in a one-to-one correspondence with the plurality of speed regulating pumps, and the controllers are also electrically connected to the corresponding speed regulating pumps;

[0019] The step of controlling the speed of the speed regulating pump on the corresponding liquid supply branch pipe according to the temperature of the heating element in the server comprises:

[0020] Acquiring the temperature of the heating element in the server by means of the temperature sensor;

[0021] The controller controls the speed of the speed-regulating pump according to the temperature of the heating element.

[0022] In this way, the rotation speed of each speed regulating pump can be matched with the operation status of the server on the liquid supply branch pipe, which is beneficial to reduce the energy consumption of the cooling system.

[0023] In some embodiments, the controller controls the speed of the speed regulating pump according to the temperature of the heating element, including:

[0024] When the temperature of the heating element is less than or equal to the first preset temperature, the controller controls the speed of the speed regulating pump to decrease, or shuts down the speed regulating pump;

[0025] When the temperature of the heating element is greater than or equal to the second preset temperature, the controller controls the speed of the speed regulating pump to increase, or makes the speed regulating pump run at full speed;

[0026] Wherein, the first preset temperature is lower than the second preset temperature.

[0027] When the temperature of the heating element in the server is less than or equal to the first preset temperature, it means that the heating element is currently at a more reasonable operating temperature. At this time, the coolant in the corresponding liquid supply branch does not need a large flow rate. Therefore, the speed of the speed regulating pump on the corresponding liquid supply branch can be reduced, or the speed regulating pump can be shut down, and the coolant can be provided only by the drive of the first circulation pump. When the temperature of the heating element in the server is greater than or equal to the second preset temperature, it means that the heating element is currently at a higher temperature state. At this time, the coolant in the corresponding liquid supply branch needs to have a larger flow rate to improve the cooling efficiency of the heating element. Therefore, the speed of the speed regulating pump on the corresponding liquid supply branch can be increased, or the speed regulating pump can be run at full speed so that the heating element can be cooled quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of a cooling system in one embodiment of the present application;

[0029] Figure 2 This is a connection diagram of a controller, a temperature sensor and a speed regulating pump in an embodiment of the present application;

[0030] Figure 3 It is a schematic structural diagram of a cooling system in another embodiment of the present application.

[0031] Reference numerals:

[0032] 10. Cooling system;

[0033] 100. Primary cooling circuit;

[0034] 110. Cooling tower; 120. Coolant distribution unit; 130. Second circulation pump;

[0035] 200, secondary cooling circuit;

[0036] 210, liquid supply main pipe; 220, first circulation pump; 230, liquid supply branch pipe; 240, heat sink; 250, speed regulating pump; 260, controller; 270, temperature sensor; 280, liquid return main pipe;

[0037] 20. Cabinet;

[0038] 30. Server. DETAILED DESCRIPTION

[0039] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0045] With the development of artificial intelligence and big data, the amount of computing in data centers has increased dramatically, and the power consumption of heat-generating components such as CPUs, GPUs, and hard disks in servers has also increased, which has made the traditional air cooling capacity insufficient. Based on this situation, liquid cooling has gradually become the development trend of server cooling.

[0046] At present, the cooling system of data centers using liquid cooling usually uses a circulating pump as the power source for liquid supply, and the circulating pump is the main energy-consuming component in the cooling system. The circulating pump in the cooling system of a data center in the related art usually supplies liquid based on the working condition that all servers are running at full load, which makes the circulating pump run at a higher power for a long time and consumes more energy. Therefore, it is necessary to consider how to reduce the energy consumption of the cooling system of the data center to make the cooling system more energy-efficient.

[0047] In order to solve the above-mentioned problems, an embodiment of the first aspect of the present application proposes a cooling system, aiming to reduce the energy consumption of the cooling system.

[0048] like Figure 1 As shown, the cooling system 10 in the embodiment of the present application includes a primary cooling circuit 100 and a secondary cooling circuit 200. The secondary cooling circuit 200 includes a liquid supply main pipe 210, a first circulation pump 220, a plurality of liquid supply branch pipes 230, a plurality of heat sinks 240, a liquid return main pipe 280 and a plurality of speed regulating pumps 250. The liquid supply main pipe 210 is connected to the primary cooling circuit 100, the first circulation pump 220 is arranged on the liquid supply main pipe 210, a plurality of liquid supply branch pipes 230 are connected to the liquid supply main pipe 210, a heat sink 240 is arranged on each liquid supply branch pipe 230, and the plurality of heat sinks 240 are arranged one by one with a plurality of servers 30 for cooling the corresponding servers 30. The plurality of liquid supply branch pipes 230 are connected to the liquid return main pipe 280, the liquid return main pipe 280 is connected to the primary cooling circuit 100, and a speed regulating pump 250 is arranged on each liquid supply branch pipe 230.

[0049] The coolant in the primary cooling circuit 100 circulates in the primary cooling circuit 100, and the coolant in the secondary cooling circuit 200 circulates in the secondary cooling circuit 200. The coolant in the secondary cooling circuit 200 can exchange heat with the coolant in the primary cooling circuit 100. That is, the coolant in the primary cooling circuit 100 can be used to cool the coolant in the secondary cooling circuit 200, and the cooled coolant in the secondary cooling circuit 200 can cool the server 30 in the data center. Specifically, in the secondary cooling circuit 200, the coolant enters each liquid supply branch pipe 230 through the liquid supply main pipe 210, and then enters the heat sink 240 through each liquid supply branch pipe 230. The heat sink 240 exchanges heat with the server 30, provides cooling to the server 30, and takes away the heat of the server 30 through the flow of the coolant. The coolant flowing out of each heat sink 240 is collected to the liquid return main pipe 280 through the liquid supply branch pipe 230. Thus, the circulation process of the coolant in the secondary cooling circuit 200 is completed.

[0050] The heat sink 240 is a structure that can dissipate heat using a coolant. For example, the heat sink may be a liquid cooling plate.

[0051] The circulation pump in the related art supplies liquid based on the assumption that multiple servers are running at full load. Assuming that in this case, the flow resistance overcome by the circulation pump is P1, the circulation pump needs to continuously output the maximum liquid supply flow Q1 at the working pressure of P1. The power consumption of the circulation pump can be expressed as in, is the efficiency of the circulation pump.

[0052] In the cooling system 10 in the embodiment of the present application, a speed regulating pump 250 is provided on each liquid supply branch pipe 230, and the speed regulating pump 250 and the first circulation pump 220 are in series connection. When the pumps are connected in series, the pressure of the liquid outlet is the sum of the liquid outlet pressures of the two pumps alone. Assuming that the liquid outlet pressure of the speed regulating pump 250 at full rotation is ΔP, and the liquid outlet pressure of the first circulation pump 220 is P2, when P2+ΔP=P1, the liquid supply of the server 30 under full load operation can be met.

[0053] That is to say, after adding the speed regulating pump 250, the liquid outlet pressure of the first circulation pump 220 alone can be reduced (the liquid outlet pressure P2 is less than P1). In addition, the server 30 is not always in full load operation. After a lot of research, it is found that the normal load of the server in the actual data center is about 40% to 60%. The embodiment of the present application is provided with a speed regulating pump 250 on each liquid supply branch 230. In this way, the speed of the speed regulating pump 250 on the corresponding liquid supply branch 230 can be adjusted according to the actual operation load of each server 30, that is, when the actual operation load of the server 30 on a certain liquid supply branch 230 is lower than the full load, the actual speed of the speed regulating pump 250 on the liquid supply branch 230 can also be reduced. In this way, the sum of the power consumption of the first circulation pump 220 and each speed regulating pump 250 is less than the power consumption of the circulation pump of the cooling system 10 (only the circulation pump is provided in the cooling system 10) in the related art, thereby reducing the energy consumption of the cooling system 10 and achieving the purpose of energy saving.

[0054] In some embodiments, Figure 1 , Figure 2 As shown, the secondary cooling circuit 200 further includes a plurality of controllers 260 and a plurality of temperature sensors 270, and the plurality of temperature sensors 270 are arranged in a one-to-one correspondence with the plurality of servers 30, and the temperature sensors 270 are used to measure the temperature of the heating element in the corresponding server 30. The plurality of controllers 260 are arranged in a one-to-one correspondence with the plurality of sensors, and the controllers 260 are electrically connected to the corresponding temperature sensors 270. The plurality of controllers 260 are also arranged in a one-to-one correspondence with the plurality of speed regulating pumps 250, and the controllers 260 are also electrically connected to the corresponding speed regulating pumps 250, and the controllers 260 are configured to control the speed of the speed regulating pumps 250 according to the temperature of the heating element in the server 30.

[0055] The heating element in the server 30 refers to a component that generates heat when working, such as a CPU, a GPU, or a hard disk. When there is only one heating element in the server 30, the temperature sensor 270 measures the heating element, that is, the temperature sensor 270 only measures the temperature of the heating element. When there are multiple heating elements in the server 30, one of the heating elements can be selected as the measurement object. For example, a heating element with the highest heat generation or a heating element with the most core function, such as a CPU, can be selected as the measurement object.

[0056] In this embodiment, a plurality of controllers 260 and a plurality of temperature sensors 270 are further provided in the secondary cooling loop 200. Each temperature sensor 270 corresponds to a server 30 and is used to obtain the temperature of the heating element in the corresponding server 30 and transmit the measured temperature information to the corresponding controller 260. The controller 260 can control the speed of the speed regulating pump 250 on the corresponding liquid supply branch pipe 230 according to the temperature. For example, when the temperature of the heating element is high, the speed regulating pump 250 can be controlled to increase the speed, and when the temperature of the heating element is low, the speed regulating pump 250 can be controlled to reduce the speed. In this way, the speed of each speed regulating pump 250 can be matched with the operating conditions of the server 30 on the liquid supply branch pipe 230, thereby reducing the energy consumption of the cooling system 10 to achieve the purpose of energy saving.

[0057] In some embodiments, Figure 1 As shown, the primary cooling circuit 100 includes a cooling tower 110 and a cooling liquid distribution unit 120 connected to the cooling tower 110 , and a liquid supply main pipe 210 and a liquid return main pipe 280 are both connected to the cooling liquid distribution unit 120 .

[0058] The cooling tower 110 can be arranged outdoors, and the cooling liquid distribution unit 120 can be arranged indoors in the data center. The cooling tower 110 can absorb the heat of the cooling liquid and discharge the heat into the atmosphere, thereby reducing the temperature of the cooling liquid in the primary cooling loop 100. The cooling liquid cooled by the cooling tower 110 is transported to the cooling liquid distribution unit 120, and heat is exchanged with the cooling liquid in the secondary cooling loop 200 in the cooling liquid distribution unit 120, thereby cooling the cooling liquid in the secondary cooling loop 200. The cooled cooling liquid in the secondary cooling loop 200 is used to cool the server 30.

[0059] In some embodiments, the primary cooling circuit 100 further includes a second circulation pump 130, and the cooling tower 110 is connected to the cooling liquid distribution unit 120 via the second circulation pump 130. Thus, the cooling liquid in the cooling tower 110 that has been subjected to temperature reduction treatment can be transported to the cooling liquid distribution unit 120 under the driving action of the second circulation pump 130, so that the cooling liquid that has been subjected to temperature reduction treatment can be heat exchanged with the cooling liquid in the secondary cooling circuit 200 in the cooling liquid distribution unit 120.

[0060] An embodiment of the second aspect of the present application provides a data center, which includes the cooling system 10 in any of the above embodiments.

[0061] The data center in the embodiment of the present application is based on the same inventive concept as the cooling system 10 in the above embodiment. Therefore, the data center can obtain all the beneficial effects of the above cooling system 10.

[0062] In some embodiments, the data center further includes a plurality of servers 30 and a cabinet 20, wherein the plurality of servers 30 are arranged in the cabinet 20, and the secondary cooling circuit 200 is used to cool the plurality of servers 30. The server 30 is arranged in the cabinet 20, and the cabinet 20 has dustproof, waterproof, anti-collision and other protective effects on the server 30.

[0063] In some embodiments, there are multiple cabinets 20, and multiple servers 30 are arranged in multiple cabinets 20. Such arrangement facilitates orderly storage of servers in the data center. It is understandable that the coolant can be introduced into different cabinets 20 through different liquid supply branches 230, so as to cool and dissipate heat for the servers in different cabinets 20.

[0064] The embodiment of the third aspect of the present application proposes a cooling method, which is implemented based on the cooling system 10 in any of the above embodiments. The cooling method includes:

[0065] The first circulation pump 220 and the speed regulating pumps 250 provide cooling liquid to the heat sink 240 on each liquid supply branch pipe 230 , and the rotation speed of the speed regulating pump 250 on the corresponding liquid supply branch pipe 230 is controlled according to the temperature of the heating element in the server 30 .

[0066] After the speed regulating pump 250 is arranged on each liquid supply branch pipe 230, the liquid outlet pressure of the first circulation pump 220 alone can be reduced. In addition, the speed of the speed regulating pump 250 on the corresponding liquid supply branch pipe 230 can be adjusted according to the actual operating load of each server 30. In this way, the sum of the power consumption of the first circulation pump 220 and each speed regulating pump 250 is less than the power consumption of the circulation pump in the relevant cooling system 10 (only the circulation pump is arranged in the cooling system 10), thereby reducing the energy consumption of the cooling system 10 and achieving the purpose of energy saving.

[0067] In some embodiments, the secondary cooling loop 200 further includes a plurality of controllers 260 and a plurality of temperature sensors 270. The plurality of temperature sensors 270 are arranged in one-to-one correspondence with the plurality of servers 30, and the temperature sensors 270 are used to measure the temperature of the heating element in the corresponding server 30; the plurality of controllers 260 are arranged in one-to-one correspondence with the plurality of sensors, and the controllers 260 are electrically connected to the corresponding temperature sensors 270; the plurality of controllers 260 are also arranged in one-to-one correspondence with the plurality of speed regulating pumps 250, and the controllers 260 are also electrically connected to the corresponding speed regulating pumps 250;

[0068] According to the temperature of the heating element in the server 30, the speed of the speed regulating pump 250 on the corresponding liquid supply branch pipe 230 is controlled, including:

[0069] Acquiring the temperature of the heating element in the server 30 through the temperature sensor 270;

[0070] The controller 260 controls the speed of the speed-adjustable pump 250 according to the temperature of the heating element.

[0071] In this way, the rotation speed of each speed regulating pump 250 can be matched with the operation status of the server 30 on the liquid supply branch pipe 230 , thereby facilitating reducing the energy consumption of the cooling system 10 .

[0072] Furthermore, the controller 260 controls the speed of the speed-adjustable pump 250 according to the temperature of the heating element, including:

[0073] When the temperature of the heating element is less than or equal to the first preset temperature, the speed of the speed regulating pump 250 is controlled to decrease, or the speed regulating pump 250 is shut down;

[0074] When the temperature of the heating element is greater than or equal to the second preset temperature, the speed of the speed regulating pump 250 is controlled to increase, or the speed regulating pump 250 is operated at full speed;

[0075] Wherein, the first preset temperature is lower than the second preset temperature.

[0076] When the temperature of the heating element in the server 30 is less than or equal to the first preset temperature, it means that the heating element is currently at a more reasonable operating temperature. At this time, the coolant in the corresponding liquid supply branch does not require a larger flow rate. Therefore, the speed of the speed regulating pump 250 on the corresponding liquid supply branch can be reduced, or the speed regulating pump 250 can be shut down, and only the first circulation pump 220 can be driven to provide coolant.

[0077] When the temperature of the heating element in the server 30 is greater than or equal to the second preset temperature, it means that the heating element is currently in a relatively high temperature state. At this time, the coolant in the corresponding liquid supply branch pipe needs to have a larger flow rate to improve the cooling efficiency of the heating element. Therefore, the speed of the speed regulating pump 250 on the corresponding liquid supply branch pipe can be increased, or the speed regulating pump 250 can be operated at full speed to allow the heating element to cool down quickly.

[0078] It is understandable that the specific values ​​of the first preset temperature and the second preset temperature can be set as needed, and the present application does not impose any limitation on this.

[0079] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A cooling system, characterized in that: The invention comprises a primary cooling circuit and a secondary cooling circuit, wherein the secondary cooling circuit comprises: A liquid supply main pipe connected to the primary cooling circuit; A first circulation pump is arranged on the liquid supply main pipe; A plurality of liquid supply branch pipes connected to the liquid supply main pipe; A plurality of heat sinks, one heat sink is disposed on each of the liquid supply branches, and the plurality of heat sinks are disposed in one-to-one correspondence with the plurality of servers for cooling the corresponding servers; A liquid return main pipe, a plurality of liquid supply branch pipes are connected to the liquid return main pipe, and the liquid return main pipe is connected to the primary cooling circuit; A plurality of speed regulating pumps are provided, and one speed regulating pump is provided on each of the liquid supply branch pipes.

2. The cooling system according to claim 1, characterized in that: The secondary cooling circuit further includes a plurality of controllers and a plurality of temperature sensors, wherein the plurality of temperature sensors are arranged in a one-to-one correspondence with the plurality of servers, and the temperature sensors are used to measure the temperature of the heating elements in the corresponding servers; The multiple controllers are arranged in a one-to-one correspondence with the multiple sensors, and the controllers are electrically connected to the corresponding temperature sensors. The multiple controllers are also arranged in a one-to-one correspondence with the multiple speed regulating pumps, and the controllers are also electrically connected to the corresponding speed regulating pumps. The controllers are configured to control the speed of the speed regulating pump according to the temperature of the heating element in the server.

3. The cooling system according to claim 1, characterized in that: The primary cooling circuit includes a cooling tower and a coolant distribution unit connected to the cooling tower; The liquid supply main pipe and the liquid return main pipe are both connected to the coolant distribution unit.

4. The cooling system according to claim 3, characterized in that: The primary cooling circuit further includes a second circulation pump, and the cooling tower is connected to the coolant distribution unit via the second circulation pump.

5. A data center, characterized in that: Comprising a cooling system as claimed in any one of claims 1 to 4.

6. The data center according to claim 5, characterized in that: Also includes: Multiple servers; A cabinet, wherein the plurality of servers are arranged in the cabinet, and the secondary cooling circuit is used for cooling the plurality of servers.

7. The data center according to claim 6, characterized in that: There are multiple cabinets, and the multiple servers are arranged in the multiple cabinets.

8. A cooling method, implemented based on the cooling system according to any one of claims 1 to 4, characterized in that: The cooling method comprises: Providing cooling liquid to the heat sink on each of the liquid supply branches through the first circulation pump and each of the speed regulating pumps; The speed of the speed regulating pump on the corresponding liquid supply branch pipe is controlled according to the temperature of the heating element in the server.

9. The cooling method according to claim 8, characterized in that: The secondary cooling circuit further includes a plurality of controllers and a plurality of temperature sensors, wherein the plurality of temperature sensors are arranged in a one-to-one correspondence with the plurality of servers, and the temperature sensors are used to measure the temperature of the heating elements in the corresponding servers; The multiple controllers are arranged in one-to-one correspondence with the multiple sensors, and the controllers are electrically connected to the corresponding temperature sensors. The multiple controllers are also arranged in one-to-one correspondence with the multiple speed regulating pumps, and the controllers are also electrically connected to the corresponding speed regulating pumps; The step of controlling the speed of the speed regulating pump on the corresponding liquid supply branch pipe according to the temperature of the heating element in the server comprises: Acquiring the temperature of the heating element in the server by means of the temperature sensor; The controller controls the speed of the speed-regulating pump according to the temperature of the heating element.

10. The cooling method according to claim 9, characterized in that: The controller controls the speed of the speed regulating pump according to the temperature of the heating element, including: When the temperature of the heating element is less than or equal to the first preset temperature, the controller controls the speed of the speed regulating pump to decrease, or shuts down the speed regulating pump; When the temperature of the heating element is greater than or equal to the second preset temperature, the controller controls the speed of the speed regulating pump to increase, or makes the speed regulating pump run at full speed; Wherein, the first preset temperature is lower than the second preset temperature.

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