Display panel and display device

Abstract

The invention discloses a display panel and a display device, the display panel comprises a substrate, a plurality of light emitting devices, a first packaging layer and a second packaging layer, and the plurality of light emitting devices are arranged on one side of the substrate; the first packaging layer is arranged on one side of the substrate and at least covers the peripheral sides of the plurality of light-emitting devices; the second packaging layer is arranged on one side, far away from the substrate, of the first packaging layer and covers the plurality of light-emitting devices; at least one of the first encapsulation layer and the second encapsulation layer is doped with first scattering particles. The display effect can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] In traditional display panels, in order to protect the light-emitting devices, they usually need to be packaged. However, after the packaging is completed, there is a large refractive index difference between the surface of the packaging layer and the air interface, which causes the forward light emitted by the light-emitting device to be totally reflected, forming an optical waveguide, causing the amount of forward light to decrease, affecting the display effect.

[0003] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the invention

[0004] The purpose of the present application is to provide a display panel and a display device to improve the display effect.

[0005] To solve the above problems, the technical solution of this application is as follows:

[0006] In a first aspect, the present application proposes a display panel, comprising:

[0007] substrate;

[0008] A plurality of light emitting devices are arranged on one side of the substrate;

[0009] a first encapsulation layer, disposed on one side of the substrate and at least covering the peripheral sides of the plurality of light-emitting devices; and

[0010] A second encapsulation layer, provided on a side of the first encapsulation layer away from the substrate and covering the plurality of light-emitting devices;

[0011] At least one of the first encapsulation layer and the second encapsulation layer is doped with first scattering particles, and the first scattering particles are used to scatter light.

[0012] In an embodiment of the present application, the first encapsulation layer is doped with first scattering particles.

[0013] In an embodiment of the present application, the thickness of the first encapsulation layer is smaller than the thickness of the light emitting device.

[0014] In one embodiment of the present application, the second encapsulation layer includes:

[0015] A plurality of first encapsulation parts are provided between two adjacent light-emitting devices and are located on a side of the first encapsulation layer away from the substrate, the first encapsulation parts are connected to the first encapsulation layer, and a side of the first encapsulation parts away from the substrate is flush with a side of the light-emitting device away from the substrate;

[0016] The second packaging part is arranged on a side of the plurality of first packaging parts away from the substrate and connected to the plurality of first packaging parts. The second packaging part covers a side of the plurality of light-emitting devices away from the substrate.

[0017] In one embodiment of the present application, the first packaging part is doped with second scattering particles, the second scattering particles are used to scatter light, and the number of the second scattering particles in the first packaging part per unit volume is less than or equal to the number of the first scattering particles in the first packaging layer per unit volume.

[0018] In one embodiment of the present application, the second packaging part is doped with third scattering particles, and the third scattering particles are used to scatter light. The number of the third scattering particles in the unit volume of the second packaging part is less than or equal to the number of the second scattering particles in the unit volume of the first packaging part.

[0019] In an embodiment of the present application, the particle size of the third scattering particles is smaller than or equal to the particle size of the first scattering particles.

[0020] In one embodiment of the present application, the thickness of the first encapsulation layer is equal to the thickness of the light-emitting device, the side of the light-emitting device away from the substrate is flush with the side of the first encapsulation layer away from the substrate, and the second encapsulation layer covers the first encapsulation layer and the side of the plurality of light-emitting devices away from the substrate.

[0021] In one embodiment of the present application, the second encapsulation layer is doped with fourth scattering particles, the fourth scattering particles are used to scatter light, and the number of the fourth scattering particles in the second encapsulation layer per unit volume is less than or equal to the number of the first scattering particles in the first encapsulation layer per unit volume.

[0022] In an embodiment of the present application, the first encapsulation layer and the second encapsulation layer are integrally formed, and the first encapsulation layer and the second encapsulation layer are both doped with the first scattering particles.

[0023] In one embodiment of the present application, the thickness of the first encapsulation layer is greater than the thickness of the light-emitting device, the first encapsulation layer covers a plurality of the light-emitting devices, the second encapsulation layer is arranged on a side of the first encapsulation layer away from the light-emitting device, and the second encapsulation layer is doped with the first scattering particles.

[0024] In an embodiment of the present application, the display panel further comprises a light extraction structure, and the light extraction structure is disposed on a side of the second encapsulation layer away from the substrate, and one light extraction structure is disposed at least corresponding to one light-emitting device.

[0025] In one embodiment of the present application, the light emitting device includes a red light emitting device, a blue light emitting device and a green light emitting device;

[0026] One of the light extraction structures is arranged corresponding to three light emitting devices of different colors;

[0027] Among the three light-emitting devices of different colors corresponding to one of the light extraction structures, the orthographic projection of the red light-emitting device on the substrate, the orthographic projection of the green light-emitting device on the substrate, and the orthographic projection of the blue light-emitting device on the substrate are all located within the range of the orthographic projection of the corresponding light extraction structure on the substrate;

[0028] Wherein, the red light emitting device is located between the blue light emitting device and the green light emitting device.

[0029] In the second aspect, the present application proposes a display device, including a display panel, wherein the display panel includes a substrate, a plurality of light-emitting devices, a first encapsulation layer and a second encapsulation layer, wherein the plurality of light-emitting devices are arranged on one side of the substrate; the first encapsulation layer is arranged on one side of the substrate and at least covers the peripheral side of the plurality of light-emitting devices; the second encapsulation layer is arranged on a side of the first encapsulation layer away from the substrate and covers the plurality of light-emitting devices; at least one of the first encapsulation layer and the second encapsulation layer is doped with first scattering particles.

[0030] In the present application, by doping the first scattering particles in the encapsulation layer of the display panel, the first scattering particles can scatter the total reflected light at the interface between the surface of the encapsulation layer and the air, change the emission direction of the light, thereby destroying the encapsulated total reflection light waveguide, improving the light emission angle of the total reflection light, improving the forward light emission efficiency, and improving the brightness, thereby improving the display effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of an embodiment of a display panel of the present application;

[0032] Figure 2 is a schematic diagram of another embodiment of a display panel of the present application;

[0033] Figure 3 is a schematic diagram of a first embodiment of a display panel of the present application;

[0034] Figure 4 is a partial light emission schematic diagram of an embodiment of a conventional display panel;

[0035] Figure 5 is a partial light emission schematic diagram of the first embodiment of the display panel of the present application;

[0036] Figure 6is a graph showing the relationship between normalized brightness and viewing angle for control group 1 in this application;

[0037] Figure 7 is a graph showing the relationship between normalized brightness and viewing angle for experimental group 1 in this application;

[0038] Figure 8 is a flow chart of a method for manufacturing a first embodiment of a display panel of the present application;

[0039] Figure 9A-9D is a schematic diagram of steps S11-S14 in a flowchart of a method for manufacturing a display panel according to a first embodiment of the present application;

[0040] Fig.10 is a schematic diagram of a second embodiment of a display panel of the present application;

[0041] Fig.11 is a schematic diagram of a third embodiment of a display panel of the present application;

[0042] Fig.12 is a schematic diagram of a fourth embodiment of a display panel of the present application;

[0043] Fig.13 is another schematic diagram of the fourth embodiment of the display panel of the present application;

[0044] Fig.14 is a schematic diagram of a fifth embodiment of the display panel of the present application;

[0045] Fig.15 is a partial light emission schematic diagram of a fifth embodiment of a display panel of the present application;

[0046] Fig.16 is a graph showing the relationship between normalized brightness and viewing angle for Experimental Group 2 in this application;

[0047] Fig.17 is a flow chart of a method for manufacturing a fifth embodiment of a display panel of the present application;

[0048] Figures 18A-18C is a schematic diagram of steps S51-S53 in a flowchart of a method for manufacturing a display panel according to a fifth embodiment of the present application;

[0049] Fig.19 is a schematic diagram of a sixth embodiment of a display panel of the present application;

[0050] Fig. 20 is a partial light emission schematic diagram of another embodiment of a conventional display panel;

[0051] Fig.21 is a partial light emission schematic diagram of a sixth embodiment of a display panel of the present application;

[0052] Fig. 22 is a graph showing the relationship between normalized brightness and viewing angle for control group 2 in this application;

[0053] Fig.23 is a graph showing the relationship between normalized brightness and viewing angle for Experimental Group 3 in this application;

[0054] Fig.24 is a flow chart of a method for manufacturing a sixth embodiment of a display panel of the present application;

[0055] Figure 25A-Figure 25D It is a schematic diagram of steps S61-S64 in a flowchart of a method for manufacturing a display panel of the sixth embodiment of the present application. DETAILED DESCRIPTION

[0056] The meanings of the terms used in this specification and claims correspond to the meanings commonly understood by those of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are only for the purpose of facilitating the description and understanding of this application, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0057] The present application proposes a display device, which may be a mobile phone, a tablet computer, an e-reader, an electronic display screen, a laptop computer, a mobile phone, an augmented reality (AR) or virtual reality (VR) device, a media player, a wearable device, a digital camera, a car navigation system, etc. The display device includes a display panel 100 .

[0058] The present application proposes a display panel 100, which may be a micro light emitting diode (MicroLight Emitting Diode, Micro LED) display panel 100, or a sub-millimeter light emitting diode (Mini Light Emitting Diode, Mini LED) display panel 100. The embodiments of the present application are described by taking the micro light emitting diode display panel 100 as an example.

[0059] See also Figure 1In the present application, the display panel 100 includes a substrate 10, a plurality of light-emitting devices 20, a first encapsulation layer 30, and a second encapsulation layer 40. The plurality of light-emitting devices 20 are disposed on one side of the substrate 10. The first encapsulation layer 30 is disposed on one side of the substrate 10 and at least covers the peripheral side of the plurality of light-emitting devices 20. The second encapsulation layer 40 is disposed on a side of the first encapsulation layer 30 away from the substrate 10 and covers the plurality of light-emitting devices 20. At least one of the first encapsulation layer 30 and the second encapsulation layer 40 is doped with first scattering particles P1, and the first scattering particles P1 are used to scatter light.

[0060] In the present application, by doping the first scattering particles P1 in the encapsulation layer of the display panel 100, the first scattering particles P1 can scatter the total reflected light at the interface between the surface of the encapsulation layer and the air, change the emission direction of the light, thereby destroying the encapsulated total reflection light waveguide, improving the light emission angle of the total reflection light, improving the forward light emission efficiency, and improving the brightness, thereby improving the display effect.

[0061] Optionally, the substrate 10 includes a substrate and a driving circuit layer disposed on one side of the substrate.

[0062] Optionally, the substrate is a hard substrate, and the material of the substrate includes glass.

[0063] Optionally, the substrate is a flexible substrate, and the material of the substrate includes polyimide.

[0064] Optionally, the driving circuit layer includes a plurality of thin film transistors.

[0065] Optionally, a plurality of light emitting devices 20 are arranged on a side of the driving circuit layer away from the substrate, and one light emitting device 20 is electrically connected to at least one thin film transistor.

[0066] Optionally, the display panel 100 further includes a light extraction structure 50. The light extraction structure 50 is disposed on a side of the second encapsulation layer 40 away from the substrate 10. The display panel 100 of the present application adopts a top emission mode. In order to extract the light emitted by the light-emitting device 20 to a greater extent and improve the light extraction efficiency of the display panel 100, the present application is provided with a light extraction structure 50 on one side of the second encapsulation layer 40, thereby improving the light extraction efficiency of the display panel 100 and improving the display effect.

[0067] Optionally, the light extraction structure 50 can be a convex lens, wherein the convex surface of the convex lens is arranged away from the substrate 10. Since the present application scatters the total reflected light of the encapsulation layer and the air interface through the first scattering particles P1, the scattered light has more light output angles. Since the light extraction structure 50 is a convex lens and the convex surface is arranged away from the substrate 10, the scattered light can be converged, the large-angle light output can be reduced, and the brightness of the front light output can be increased, thereby improving the display effect.

[0068] Optional, see Figure 1 , one light extraction structure 50 corresponds to at least one light emitting device 20 .

[0069] In one embodiment, one light extraction structure 50 corresponds to one light emitting device 20. At this time, each light extraction structure 50 can re-converge the light scattered by each light emitting device 20, thereby improving the light output of the entire surface of each light emitting device 20 and improving the overall light output efficiency of the display panel 100. However, the design of one light extraction structure 50 corresponding to one light emitting device 20 requires higher process accuracy. Because in the process of the display panel 100, the position of the light extraction structure 50 and the corresponding light emitting device 20 may be offset due to process errors.

[0070] Optionally, the orthographic projection of a light emitting device 20 on the substrate 10 is located within the range of the orthographic projection of a light extraction structure 50 on the substrate 10 .

[0071] In another embodiment, one light extraction structure 50 corresponds to two light emitting devices 20. Compared with the design in which one light extraction structure 50 corresponds to one light emitting device 20, the present embodiment has relatively lower requirements on process accuracy.

[0072] In yet another embodiment, see Figure 2 , one light extraction structure 50 corresponds to three light emitting devices 20. Compared with the previous two embodiments, the present embodiment has relatively lower requirements on process accuracy.

[0073] Optionally, the light emitting device 20 includes a red light emitting device 20R, a blue light emitting device 20B, and a green light emitting device 20G. Due to the influence of the light emitting material, in the micro light emitting diode, the light emitting efficiency of the red light emitting device 20R is lower than that of the blue light emitting device 20B, and the light emitting efficiency of the red light emitting device 20R is lower than that of the green light emitting device 20G.

[0074] Optional, see Figure 2 , one light extraction structure 50 is provided corresponding to three light emitting devices 20 of different colors. Among the three light emitting devices 20 of different colors corresponding to one light extraction structure 50, the orthographic projection of the red light emitting device 20R on the substrate 10, the orthographic projection of the green light emitting device 20G on the substrate 10, and the orthographic projection of the blue light emitting device 20B on the substrate 10 are all located within the range of the orthographic projection of the corresponding light extraction structure 50 on the substrate 10. Among them, the red light emitting device 20R is located between the blue light emitting device 20B and the green light emitting device 20G.

[0075] Since the red light emitting device 20R is located between the blue light emitting device 20B and the green light emitting device 20G, more lateral light or forward light with a large viewing angle of the red light emitting device 20R can be converged by the light extraction structure 50, thereby further improving the light extraction efficiency of the red light emitting device 20R, thereby improving the display effect of the display panel 100.

[0076] See also Figure 3 , in the first embodiment of the present application:

[0077] Optionally, the first encapsulation layer 30 is doped with first scattering particles P1.

[0078] See also Figure 4 The conventional display panel 100a includes a substrate 10a, a plurality of light emitting devices 20a disposed on one side of the substrate 10a, and an encapsulation layer 30a covering the light emitting devices 20a. However, there is a large refractive index difference between the encapsulation layer 30a and the air interface of the conventional display panel 100a, and part of the light emitted from the light emitting device 20a reaches the encapsulation layer 30a and the air interface and is totally reflected to form an optical waveguide, resulting in a decrease in the amount of light emitted in the forward direction.

[0079] See also Figure 5 In the first embodiment of the present application, the first packaging layer 30 covers the circumference of multiple light-emitting devices 20. After the light emitted by the light-emitting device 20 is totally reflected at the interface between the second packaging layer 40 and the air, part of the totally reflected light enters the first packaging layer 30. The first scattering particles P1 in the first packaging layer 30 scatter the totally reflected light and change the light emission direction of the totally reflected light, thereby destroying the packaged totally reflected optical waveguide, improving the light emission angle of the totally reflected light, increasing the forward light emission, and improving the forward light emission efficiency.

[0080] In order to further study the improvement of the forward light extraction efficiency by the first scattering particle P1, Figure 4 The conventional display panel 100a shown in FIG. 1 is used as a control group 1, and Figure 5 The display panel 100 of the first embodiment of the present application is shown as the experimental group 1. The difference between the control group 1 and the experimental group 1 is that the conventional display panel 100a of the control group 1 includes a plurality of light-emitting devices 20a arranged on one side of the substrate 10a and an encapsulation layer 30a covering the light-emitting devices 20a. The display panel 100 of the experimental group 1 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of the substrate 10, wherein the first encapsulation layer 30 is doped with first scattering particles P1. The same power voltage is input to the experimental group 1 and the control group 1, and the light output brightness at each viewing angle is normalized to obtain Figure 6 The normalized brightness and viewing angle of the control group 1 shown in FIG. Figure 7 A graph showing the relationship between normalized brightness and viewing angle for experimental group 1 is shown.

[0081] See also Figure 6 and Figure 7 From the comparison of the relationship between the normalized brightness and the viewing angle of the control group 1 and the experimental group 1, it can be seen that after the first scattering particles P1 are added to the first encapsulation layer 30, when the input power is constant, the forward light emission can be increased and the large viewing angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0082] Optionally, the first encapsulation layer 30 includes a first main material and first scattering particles P1 doped in the first main material.

[0083] Optionally, the first main material includes a transparent organic material. The transparent organic material may be an organic transparent photoresist, which may be an optically clear adhesive (OCA). The transparent organic material may also be a transparent resin. The transparent organic material may also be organic glass, which may be acrylic.

[0084] Optionally, the material of the first scattering particles P1 includes non-metallic oxides, which include at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0085] Optionally, the particle size of the first scattering particles P1 is in the range of 50 nanometers to 500 nanometers. The particle size of the first scattering particles P1 is one of 50 nanometers, 60 nanometers, 70 nanometers, 80 nanometers, 90 nanometers, 100 nanometers, 110 nanometers, 120 nanometers, 130 nanometers, 140 nanometers, 150 nanometers, 160 nanometers, 170 nanometers, 180 nanometers, 190 nanometers, 200 nanometers, 210 nanometers, 220 nanometers, 230 nanometers, 240 nanometers, 250 nanometers, 260 nanometers, 270 nanometers, 280 nanometers, 290 nanometers, 300 nanometers, 310 nanometers, 320 nanometers, 330 nanometers, 340 nanometers, 350 nanometers, 360 nanometers, 370 nanometers, 380 nanometers, 390 nanometers, 400 nanometers, 410 nanometers, 420 nanometers, 430 nanometers, 440 nanometers, 450 nanometers, 460 nanometers, 470 nanometers, 480 nanometers, 490 nanometers, and 500 nanometers.

[0086] Optionally, the thickness of the first encapsulation layer 30 is smaller than the thickness of the light emitting device 20 .

[0087] Optionally, the first scattering particles P1 are used to reflect light.

[0088] In this embodiment, the first scattering particles P1 can not only scatter light, but also reflect light. Since the thickness of the first encapsulation layer 30 is less than that of the light emitting device 20, the light emitted by the light emitting device 20 toward the substrate 10 can be reflected without affecting the forward emission of the light emitting device 20, so that the reflected light can emit forward light, increase the amount of forward emitted light, and thus improve the display effect.

[0089] Optionally, corresponding to the first embodiment of this application, please refer to Figure 8 The present application also proposes a manufacturing method of the first embodiment of the display panel 100, comprising the following steps:

[0090] See also Fig. 9A , step S11: provide a substrate 10.

[0091] See also Fig. 9B , step S12: transferring a plurality of light-emitting devices 20 to one side of the substrate 10 , and bonding the light-emitting devices 20 to the substrate 10 .

[0092] See also Fig. 9C Step S13: forming a first encapsulation layer 30 on one side of the substrate 10 by spin coating or inkjet printing, wherein the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, and the first encapsulation layer 30 covers the peripheral sides of the plurality of light-emitting devices 20, and the first encapsulation layer 30 is doped with first scattering particles P1.

[0093] See also Fig.9D , step S14: forming a second encapsulation layer 40 on one side of the substrate 10 by spin coating or inkjet printing, the second encapsulation layer 40 is arranged on a side of the first encapsulation layer 30 away from the substrate 10 , and the second encapsulation layer 40 covers the plurality of light-emitting devices 20 .

[0094] See also Fig.10 , in the second embodiment of the present application:

[0095] In order to avoid redundancy, the second embodiment of the present application will describe parts different from the first embodiment of the present application.

[0096] The second embodiment of the present application is different from the first embodiment of the present application in that:

[0097] Optionally, the second encapsulation layer 40 includes a plurality of first encapsulation parts 41 and a second encapsulation part 42. The first encapsulation part 41 is disposed between two adjacent light-emitting devices 20 and is located on the side of the first encapsulation layer 30 away from the substrate 10. The first encapsulation part 41 is connected to the first encapsulation layer 30, and the side of the first encapsulation part 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10. The second encapsulation part 42 is disposed on the side of the plurality of first encapsulation parts 41 away from the substrate 10 and is connected to the plurality of first encapsulation parts 41. The second encapsulation part 42 covers the side of the plurality of light-emitting devices 20 away from the substrate 10.

[0098] Optionally, the second encapsulation layer 40 includes a second main material.

[0099] Optionally, the second main material includes a transparent organic material. The transparent organic material may be an organic transparent photoresist, which may be an optically clear adhesive (OCA). The transparent organic material may also be a transparent resin. The transparent organic material may also be organic glass, which may be acrylic.

[0100] In the second embodiment, the material of the second encapsulation layer 40 is an organic material with a leveling property. Since the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, the surface formed by the first encapsulation layer 30 and the light-emitting device 20 is uneven. The second encapsulation layer 40 is formed on the uneven surface. If the thickness of the second encapsulation layer 40 is thin, the flatness of the side of the second encapsulation layer 40 away from the substrate 10 cannot be guaranteed. The traditional processing method is to make the height of the encapsulation layer exceed the height of the light-emitting device 20 by more than 1.5 times, so that the thickness of the encapsulation layer is thicker, thereby improving the flatness of the upper surface of the encapsulation layer. However, this is not conducive to the development trend of miniaturization and thinning of the light-emitting device 20. In this embodiment, the first encapsulation part 41 and the second encapsulation part 42 of the second encapsulation layer 40 can be manufactured in steps. In the manufacturing step of the second encapsulation layer 40, the first encapsulation part 41 is first formed, and the side of the first encapsulation part 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10. Then, a second encapsulation part 42 is formed, and the second encapsulation part 42 is connected to the plurality of first encapsulation parts 41, and the second encapsulation part 42 covers the side of the plurality of light-emitting devices 20 away from the substrate 10. In this embodiment, since the surfaces of the first encapsulation part 41 and the light-emitting devices 20 are flat, the thickness of the second encapsulation part 42 can be reduced, so that the second encapsulation part 42 does not need to be thickened for the film layer above it, and the thickness of the display panel 100 is reduced, so that the display panel 100 is thinned and miniaturized, and the display effect is improved.

[0101] Optionally, the first packaging part 41 is doped with second scattering particles P2, and the second scattering particles P2 are used to scatter light. Doping the second scattering particles P2 in the first packaging part 41 can further destroy the packaged total reflection light waveguide, improve the light output angle of the total reflection light, improve the forward light output efficiency, and improve the brightness, thereby improving the display effect.

[0102] Optionally, the material of the second scattering particles P2 includes non-metallic oxides, which include at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0103] Optionally, the particle size of the second scattering particles P2 is in the range of 50 nanometers to 500 nanometers. The particle size of the second scattering particles P2 is one of 50 nanometers, 60 nanometers, 70 nanometers, 80 nanometers, 90 nanometers, 100 nanometers, 110 nanometers, 120 nanometers, 130 nanometers, 140 nanometers, 150 nanometers, 160 nanometers, 170 nanometers, 180 nanometers, 190 nanometers, 200 nanometers, 210 nanometers, 220 nanometers, 230 nanometers, 240 nanometers, 250 nanometers, 260 nanometers, 270 nanometers, 280 nanometers, 290 nanometers, 300 nanometers, 310 nanometers, 320 nanometers, 330 nanometers, 340 nanometers, 350 nanometers, 360 nanometers, 370 nanometers, 380 nanometers, 390 nanometers, 400 nanometers, 410 nanometers, 420 nanometers, 430 nanometers, 440 nanometers, 450 nanometers, 460 nanometers, 470 nanometers, 480 nanometers, 490 nanometers, and 500 nanometers.

[0104] Optionally, the number of the second scattering particles P2 in the first encapsulation part 41 per unit volume is less than or equal to the number of the first scattering particles P1 in the first encapsulation layer 30 per unit volume.

[0105] Among them, the numbers mentioned later in this application all refer to average numbers.

[0106] Since the second scattering particles P2 reflect or absorb part of the light, in order to reduce the impact on the display effect, the number of the second scattering particles P2 in the unit volume of the first encapsulation part 41 is relatively reduced to be less than or equal to the number of the first scattering particles P1 in the unit volume of the first encapsulation layer 30. In this way, the amount of forward light absorbed by the second scattering particles P2 can be reduced without affecting the light emitted from the substrate 10 side reflected by the first scattering particles P1 of the first encapsulation layer 30, thereby improving the forward light extraction efficiency and the display effect.

[0107] Optionally, the particle size of the second scattering particles P2 is smaller than the particle size of the first scattering particles P1, so that the amount of forward light absorbed or reflected by the second scattering particles P2 can be reduced without affecting the light emitted from the side of the substrate 10 reflected by the first scattering particles P1 of the first encapsulation layer 30, thereby improving the forward light output efficiency and improving the display effect.

[0108] Optionally, corresponding to the second embodiment of the present application, the present application further proposes a manufacturing method of the second embodiment of the display panel 100, comprising the following steps:

[0109] Step S21: providing a substrate 10.

[0110] Step S22 : transferring a plurality of light emitting devices 20 to one side of the substrate 10 , and bonding the light emitting devices 20 to the substrate 10 .

[0111] Step S23: forming a first encapsulation layer 30 on one side of the substrate 10 by spin coating or inkjet printing, wherein the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, and the first encapsulation layer 30 covers the circumference of the plurality of light-emitting devices 20, and the first encapsulation layer 30 is doped with first scattering particles P1.

[0112] Step S24: forming a first packaging part 41 on one side of the substrate 10 by spin coating or inkjet printing, the first packaging part 41 is arranged on the side of the first packaging layer 30 away from the substrate 10, the side of the first packaging part 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10, the first packaging part 41 is doped with second scattering particles P2, and the number of second scattering particles P2 in the first packaging part 41 per unit volume is less than or equal to the number of first scattering particles P1 in the first packaging layer 30 per unit volume.

[0113] Step S25: A second packaging part 42 is formed on one side of the substrate 10 by spin coating or inkjet printing, the second packaging part 42 is connected to multiple first packaging parts 41, the second packaging part 42 covers one side of multiple light-emitting devices 20 away from the substrate 10, and the first packaging part 41 and the second packaging part 42 form a second packaging layer 40.

[0114] See also Fig.11 , in the third embodiment of the present application:

[0115] In order to avoid redundancy, the third embodiment of the present application will describe parts different from those of the first embodiment of the present application.

[0116] The third embodiment of the present application is different from the first embodiment of the present application in that:

[0117] Optionally, the second packaging part 42 is doped with third scattering particles P3, and the third scattering particles P3 are used to scatter light. Doping the third scattering particles P3 in the second packaging part 42 can further destroy the packaged total reflection light waveguide, improve the light output angle of the total reflection light, improve the forward light output efficiency, and improve the brightness, thereby improving the display effect.

[0118] Optionally, the material of the third scattering particles P3 includes non-metallic oxides, which include at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0119] Optionally, the particle size of the third scattering particles P3 is in the range of 50 nanometers to 500 nanometers. The particle size of the third scattering particles P3 is one of 50 nanometers, 60 nanometers, 70 nanometers, 80 nanometers, 90 nanometers, 100 nanometers, 110 nanometers, 120 nanometers, 130 nanometers, 140 nanometers, 150 nanometers, 160 nanometers, 170 nanometers, 180 nanometers, 190 nanometers, 200 nanometers, 210 nanometers, 220 nanometers, 230 nanometers, 240 nanometers, 250 nanometers, 260 nanometers, 270 nanometers, 280 nanometers, 290 nanometers, 300 nanometers, 310 nanometers, 320 nanometers, 330 nanometers, 340 nanometers, 350 nanometers, 360 nanometers, 370 nanometers, 380 nanometers, 390 nanometers, 400 nanometers, 410 nanometers, 420 nanometers, 430 nanometers, 440 nanometers, 450 nanometers, 460 nanometers, 470 nanometers, 480 nanometers, 490 nanometers, and 500 nanometers.

[0120] Optionally, the number of the third scattering particles P3 in the second encapsulation part 42 per unit volume is less than or equal to the number of the second scattering particles P2 in the first encapsulation part 41 per unit volume.

[0121] Since the third scattering particles P3 will reflect or absorb part of the light, the third scattering particles P3 are located on the light-emitting front side of the light-emitting device 20, and the second scattering particles P2 are located on the side of the light-emitting device 20. If the number of the third scattering particles P3 is too large, the forward light emission will be weakened, affecting the display effect. In order to reduce the impact on the display effect, the number of the third scattering particles P3 in the second packaging part 42 per unit volume will be relatively reduced, so that it is less than or equal to the number of the first scattering particles P1 in the first packaging layer 30 per unit volume. In this way, the scattering effect of the total reflection luminescence and the improvement of the forward light emission effect can be taken into account, and the amount of the forward light emitted by the third scattering particles P3 is reduced, thereby improving the forward light emission efficiency and improving the display effect.

[0122] Optionally, the second scattering particles P2 are used to adjust part of the lateral light emission of the light-emitting device to forward light emission through reflection. Similarly, the second scattering particles P2 are located on the side of the light-emitting device 20, and the number of the second scattering particles P2 in the first packaging part 41 per unit volume is relatively increased, so that part of the lateral light emission of the light-emitting device 20 can be adjusted to forward light emission, thereby improving the forward light emission efficiency, reducing the light emission at a large viewing angle, and improving the display effect.

[0123] Optionally, the particle size of the third scattering particles P3 is smaller than or equal to the particle size of the first scattering particles P1.

[0124] Optionally, the particle size of the third scattering particles P3 is smaller than that of the first scattering particles P1, thereby reducing the amount of forward light absorbed or reflected by the third scattering particles P3 without affecting the scattering effect of the third scattering particles P3 on the totally reflected light, thereby improving the forward light output efficiency and the display effect.

[0125] Optionally, corresponding to the third embodiment of the present application, the present application further proposes a manufacturing method of the third embodiment of the display panel 100, comprising the following steps:

[0126] Step S31: providing a substrate 10.

[0127] Step S32 : transferring a plurality of light emitting devices 20 to one side of the substrate 10 , and bonding the light emitting devices 20 to the substrate 10 .

[0128] Step S33: forming a first encapsulation layer 30 on one side of the substrate 10 by spin coating or inkjet printing, wherein the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, and the first encapsulation layer 30 covers the circumference of the plurality of light-emitting devices 20, and the first encapsulation layer 30 is doped with first scattering particles P1.

[0129] Step S34: forming a first packaging part 41 on one side of the substrate 10 by spin coating or inkjet printing, the first packaging part 41 is arranged on the side of the first packaging layer 30 away from the substrate 10, the side of the first packaging part 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10, the first packaging part 41 is doped with second scattering particles P2, and the number of second scattering particles P2 in the first packaging part 41 per unit volume is less than or equal to the number of first scattering particles P1 in the first packaging layer 30 per unit volume.

[0130] Step S35: forming a second packaging part 42 on one side of the substrate 10 by spin coating or inkjet printing, the second packaging part 42 is connected to the plurality of first packaging parts 41, the second packaging part 42 covers the side of the plurality of light-emitting devices 20 away from the substrate 10, the first packaging part 41 and the second packaging part 42 form a second packaging layer 40, the second packaging part 42 is doped with third scattering particles P3, and the number of the third scattering particles P3 per unit volume of the second packaging part 42 is less than or equal to the number of the second scattering particles P2 per unit volume of the first packaging part 41.

[0131] See also Fig.12 , in the fourth embodiment of the present application:

[0132] In order to avoid redundancy, the fourth embodiment of the present application will describe the parts different from the first embodiment of the present application.

[0133] The fourth embodiment of the present application is different from the first embodiment of the present application in that:

[0134] Optionally, the thickness of the first encapsulation layer 30 is equal to the thickness of the light emitting device 20. The side of the light emitting device 20 away from the substrate 10 is flush with the side of the first encapsulation layer 30 away from the substrate 10. The second encapsulation layer 40 covers the first encapsulation layer 30 and the side of the plurality of light emitting devices 20 away from the substrate 10.

[0135] Compared with the third embodiment, the fourth embodiment improves the flatness of the upper surface of the first encapsulation layer 30 by making the thickness of the first encapsulation layer 30 equal to the thickness of the light-emitting device 20, thereby reducing a step in the process of preparing the first encapsulation part 41 for improving the flatness, thereby improving the production efficiency of the display panel 100 and reducing the production cost.

[0136] Optional, see Fig.13 The second encapsulation layer 40 is doped with fourth scattering particles P4, which are used to scatter light. The number of fourth scattering particles P4 per unit volume of the second encapsulation layer 40 is less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30.

[0137] Optionally, the particle size of the fourth scattering particles P4 is in the range of 50 nanometers to 500 nanometers. The particle size of the fourth scattering particles P4 is one of 50 nanometers, 60 nanometers, 70 nanometers, 80 nanometers, 90 nanometers, 100 nanometers, 110 nanometers, 120 nanometers, 130 nanometers, 140 nanometers, 150 nanometers, 160 nanometers, 170 nanometers, 180 nanometers, 190 nanometers, 200 nanometers, 210 nanometers, 220 nanometers, 230 nanometers, 240 nanometers, 250 nanometers, 260 nanometers, 270 nanometers, 280 nanometers, 290 nanometers, 300 nanometers, 310 nanometers, 320 nanometers, 330 nanometers, 340 nanometers, 350 nanometers, 360 nanometers, 370 nanometers, 380 nanometers, 390 nanometers, 400 nanometers, 410 nanometers, 420 nanometers, 430 nanometers, 440 nanometers, 450 nanometers, 460 nanometers, 470 nanometers, 480 nanometers, 490 nanometers, and 500 nanometers.

[0138] In the fourth embodiment, the number of first scattering particles P1 in the first encapsulation layer 30 per unit volume is relatively large, and the first scattering particles P1 can not only scatter light, but also reflect light. Increasing the number of first scattering particles P1 per unit volume of the first encapsulation layer 30 can make the first scattering particles P1 reflect the light emitted by the light-emitting device 20 toward the substrate 10 side, so that the reflected light can emit light in the forward direction, increase the amount of light emitted in the forward direction, and thus improve the display effect.

[0139] In the fourth embodiment, the number of the fourth scattering particles P4 in the second encapsulation layer 40 per unit volume is relatively small. Although the fourth scattering particles P4 can scatter the total reflected light, since part of the fourth scattering particles P4 are located on the light-emitting front side of the light-emitting device 20, if the number of the fourth scattering particles P4 is too large, the forward light emission will be weakened, affecting the display effect. In order to reduce the impact on the display effect, the number of the fourth scattering particles P4 in the second encapsulation layer 40 per unit volume will be relatively reduced to be less than or equal to the number of the first scattering particles P1 in the first encapsulation layer 30 per unit volume. In this way, the scattering effect of the total reflected light and the improvement of the forward light emission effect can be taken into account, and the amount of the forward light emitted by the fourth scattering particles P4 is reduced. The amount of absorption or reflection of the fourth scattering particles P4, thereby improving the forward light emission efficiency, improves the display effect.

[0140] Optionally, corresponding to the fourth embodiment of the present application, the present application further proposes a manufacturing method of the fourth embodiment of the display panel 100, comprising the following steps:

[0141] Step S41: providing a substrate 10.

[0142] Step S42 : transferring a plurality of light emitting devices 20 to one side of the substrate 10 , and bonding the light emitting devices 20 to the substrate 10 .

[0143] Step S43: forming a first encapsulation layer 30 on one side of the substrate 10 by spin coating or inkjet printing, wherein the thickness of the first encapsulation layer 30 is equal to the thickness of the light-emitting device 20, and the side of the light-emitting device 20 away from the substrate 10 is flush with the side of the first encapsulation layer 30 away from the substrate 10, and the first encapsulation layer 30 is doped with first scattering particles P1.

[0144] Step S44: forming a second encapsulation layer 40 on one side of the substrate 10 by spin coating or inkjet printing, the second encapsulation layer 40 covers the first encapsulation layer 30 and a side of the plurality of light-emitting devices 20 away from the substrate 10, the second encapsulation layer 40 is doped with fourth scattering particles P4, and the number of fourth scattering particles P4 per unit volume of the second encapsulation layer 40 is less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30.

[0145] See also Fig.14 , in the fifth embodiment of the present application:

[0146] In order to avoid redundancy, the fifth embodiment of the present application will describe the parts different from the first embodiment of the present application.

[0147] The fifth embodiment of the present application is different from the fourth embodiment of the present application in that:

[0148] Optionally, the first encapsulation layer 30 and the second encapsulation layer 40 are integrally formed, and the first encapsulation layer 30 and the second encapsulation layer 40 are both doped with the first scattering particles P1 .

[0149] Compared with the fourth embodiment, the fifth embodiment reduces one process step by integrally forming the first encapsulation layer 30 and the second encapsulation layer 40 , thereby improving the production efficiency of the display panel 100 and reducing the production cost without affecting the flatness.

[0150] Optionally, the sum of the thickness of the first encapsulation layer 30 and the thickness of the second encapsulation layer 40 is greater than the thickness of the light emitting device 20 .

[0151] Optionally, when the sum of the thickness of the first encapsulation layer 30 and the thickness of the second encapsulation layer 40 is greater than 1.5 times the thickness of the light emitting device 20 , the flatness of the film layer above the display panel 100 can be ensured.

[0152] See also Fig.15After the light emitted by the light emitting device 20 is totally reflected at the interface between the second packaging layer 40 and the air, part of the totally reflected light enters the first packaging layer 30 or the second packaging layer 40, and the first scattering particles P1 in the first packaging layer 30 or the second packaging layer 40 scatter the totally reflected light, changing the light emission direction of the totally reflected light, thereby destroying the packaged totally reflected optical waveguide, improving the light emission angle of the totally reflected light, increasing the forward light emission, and improving the forward light emission efficiency.

[0153] In order to further study the improvement of the forward light extraction efficiency by the first scattering particle P1, Figure 4 The conventional display panel 100a shown in FIG. 1 is used as a control group 1, and Fig.15 The display panel 100 of the fifth embodiment of the present application is shown as the experimental group 2. The difference between the control group 1 and the experimental group 2 is that the traditional display panel 100a of the control group 1 includes a plurality of light-emitting devices 20a arranged on one side of the substrate 10a and an encapsulation layer 30a covering the light-emitting devices 20a. The display panel 100 of the experimental group 2 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of the substrate 10, wherein the first encapsulation layer 30 and the second encapsulation layer 40 are both doped with first scattering particles P1. The same power voltage is input to the experimental group 2 and the control group 1, and the light output brightness at each viewing angle is normalized to obtain the following: Figure 6 The normalized brightness and viewing angle of the control group 1 shown in FIG. Fig.16 The relationship between normalized brightness and viewing angle for experimental group 2 is shown.

[0154] See also Figure 6 and Fig.16 From the comparison of the relationship between the normalized brightness and the viewing angle of the control group 1 and the experimental group 2, it can be seen that after adding the first scattering particles P1 to the first encapsulation layer 30 and the second encapsulation layer 40, when the input power is constant, the forward light emission can be increased and the large viewing angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0155] From the comparison of the relationship between the normalized brightness and the viewing angle of the experimental group 1 and the experimental group 2, it can be seen that, under the premise of adding the first scattering particles P1 in the first encapsulation layer 30, after continuing to add the first scattering particles P1 in the second encapsulation layer 40, when the input power is constant, the forward light emission can be further improved, and the large viewing angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0156] Optionally, corresponding to the fifth embodiment of the present application, please refer to Fig.17 The present application also proposes a fifth method for manufacturing the display panel 100, comprising the following steps:

[0157] See also Fig.18A , step S51: provide a substrate 10.

[0158] See also Fig.18B , step S52 : transferring a plurality of light emitting devices 20 to one side of the substrate 10 , and bonding the light emitting devices 20 to the substrate 10 .

[0159] See also Fig.18C , step S53: forming a first encapsulation layer 30 and a second encapsulation layer 40 on one side of the substrate 10 by spin coating or inkjet printing, the first encapsulation layer 30 and the second encapsulation layer 40 are integrally formed, the first encapsulation layer 30 covers the peripheral side of the plurality of light-emitting devices 20, the second encapsulation layer 40 is arranged on a side of the first encapsulation layer 30 away from the substrate 10, the second encapsulation layer 40 covers the plurality of light-emitting devices 20, and the first encapsulation layer 30 and the second encapsulation layer 40 are both doped with first scattering particles P1.

[0160] See also Fig.19 , in the sixth embodiment of the present application:

[0161] In order to avoid redundancy, the sixth embodiment of the present application will describe the parts that are different from the first embodiment of the present application.

[0162] The sixth embodiment of the present application is different from the first embodiment of the present application in that:

[0163] Optionally, the thickness of the first encapsulation layer 30 is greater than the thickness of the light emitting device 20. The first encapsulation layer 30 covers a plurality of light emitting devices 20. The second encapsulation layer 40 is disposed on a side of the first encapsulation layer 30 away from the light emitting device 20. The second encapsulation layer 40 is doped with first scattering particles P1.

[0164] See also Fig. 20 The conventional display panel 100a includes a substrate 10a, a plurality of light emitting devices 20a disposed on one side of the substrate 10a, and a first encapsulation layer 30a and a second encapsulation layer 40a covering the light emitting devices 20a, wherein the thickness of the first encapsulation layer 30a is greater than that of the light emitting devices 20a. However, there is a large difference in refractive index between the second encapsulation layer 40a and the air interface of the conventional display panel 100a, and part of the light emitted from the light emitting device 20a will be totally reflected when reaching the interface between the second encapsulation layer 40a and the air, forming an optical waveguide, resulting in a decrease in the amount of light emitted in the forward direction.

[0165] See also Fig.21In the sixth embodiment of the present application, the first encapsulation layer 30 covers a plurality of light-emitting devices 20, and the second encapsulation layer 40 is disposed on a side of the first encapsulation layer 30 away from the light-emitting devices 20. After the light emitted by the light-emitting device 20 is totally reflected at the interface between the second encapsulation layer 40 and the air, part of the totally reflected light is emitted to the surface of the first scattering particles P1 of the second encapsulation layer 40, and the first scattering particles P1 in the second encapsulation layer 40 scatter the totally reflected light, changing the light-emitting direction of the totally reflected light, thereby destroying the encapsulated totally reflected light waveguide, improving the light-emitting angle of the totally reflected light, increasing the forward light emission, and improving the forward light emission efficiency.

[0166] In order to further study the improvement of the forward light extraction efficiency by the first scattering particle P1, Fig. 20 The conventional display panel 100a shown in FIG. 1 is used as the control group 2, and Fig.21 The display panel 100 of the sixth embodiment of the present application is shown as the experimental group 3. The difference between the control group 2 and the experimental group 3 is that the traditional display panel 100a of the control group 2 includes a plurality of light-emitting devices 20a arranged on one side of the substrate 10a and a first encapsulation layer 30a and a second encapsulation layer 40a covering the light-emitting devices 20a, and the thickness of the first encapsulation layer 30a is greater than the thickness of the light-emitting device 20a. The display panel 100 of the experimental group 3 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of the substrate 10, and the thickness of the first encapsulation layer 30 is greater than the thickness of the light-emitting device 20, wherein the second encapsulation layer 40 is doped with first scattering particles P1. The same power voltage is input to the experimental group 2 and the control group 3, and the light output brightness at each viewing angle is normalized to obtain the following Fig. 22 The relationship between the normalized brightness and viewing angle of the control group 2 shown in FIG. Fig.23 The relationship between normalized brightness and viewing angle for experimental group 3 is shown.

[0167] See also Fig. 22 and Fig.23 From the comparison of the relationship between the normalized brightness and the viewing angle of the control group 2 and the experimental group 3, it can be seen that after the first scattering particles P1 are added to the second encapsulation layer 40, when the input power is constant, the forward light emission can be increased and the large viewing angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0168] Optionally, corresponding to the sixth embodiment of the present application, please refer to Fig.24 The present application also proposes a sixth method for manufacturing the display panel 100, comprising the following steps:

[0169] See also Fig.25A , step S61: provide a substrate 10.

[0170] See also Fig.25B, step S62 : transferring a plurality of light emitting devices 20 to one side of the substrate 10 , and bonding the light emitting devices 20 to the substrate 10 .

[0171] See also Fig.25C , step S63 : forming a first encapsulation layer 30 on one side of the substrate 10 by spin coating or inkjet printing, the thickness of the first encapsulation layer 30 is greater than the thickness of the light emitting device 20 , and the first encapsulation layer 30 covers the plurality of light emitting devices 20 .

[0172] See also Fig.25D , step S64: forming a second encapsulation layer 40 on one side of the substrate 10 by spin coating or inkjet printing, the second encapsulation layer 40 is arranged on a side of the first encapsulation layer 30 away from the substrate 10, and the second encapsulation layer 40 is doped with first scattering particles P1.

[0173] The above is a detailed description of the specific implementation of the present application. The above implementation disclosed in the present application is only the preferred implementation of the present application. For ordinary technicians in this field, many modifications and improvements can be made without departing from the concept of the present application. These modifications and improvements all fall within the scope of protection defined by the claims of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A plurality of light emitting devices are arranged on one side of the substrate; A first encapsulation layer is provided on one side of the substrate and at least covers the peripheral sides of the plurality of light-emitting devices; as well as A second encapsulation layer, provided on a side of the first encapsulation layer away from the substrate and covering the plurality of light-emitting devices; At least one of the first encapsulation layer and the second encapsulation layer is doped with first scattering particles, and the first scattering particles are used to scatter light.

2. The display panel according to claim 1, wherein: The first encapsulation layer is doped with first scattering particles.

3. The display panel according to claim 2, wherein: The thickness of the first encapsulation layer is smaller than the thickness of the light emitting device.

4. The display panel according to claim 3, wherein: The second encapsulation layer comprises: A plurality of first encapsulation parts are provided between two adjacent light-emitting devices and are located on a side of the first encapsulation layer away from the substrate, the first encapsulation parts are connected to the first encapsulation layer, and a side of the first encapsulation parts away from the substrate is flush with a side of the light-emitting device away from the substrate; The second packaging part is arranged on a side of the plurality of first packaging parts away from the substrate and connected to the plurality of first packaging parts. The second packaging part covers a side of the plurality of light-emitting devices away from the substrate.

5. The display panel according to claim 4, wherein: The first packaging part is doped with second scattering particles, the second scattering particles are used to scatter light, and the number of the second scattering particles in a unit volume of the first packaging part is less than or equal to the number of the first scattering particles in a unit volume of the first packaging layer.

6. The display panel according to claim 5, wherein: The second packaging part is doped with third scattering particles, and the third scattering particles are used to scatter light. The number of the third scattering particles in a unit volume of the second packaging part is less than or equal to the number of the second scattering particles in a unit volume of the first packaging part.

7. The display panel according to claim 6, wherein: The particle size of the third scattering particles is smaller than or equal to the particle size of the first scattering particles.

8. The display panel according to claim 2, wherein: The thickness of the first encapsulation layer is equal to the thickness of the light emitting device, the side of the light emitting device away from the substrate is flush with the side of the first encapsulation layer away from the substrate, and the second encapsulation layer covers the first encapsulation layer and the side of the plurality of light emitting devices away from the substrate.

9. The display panel according to claim 8, wherein: The second encapsulation layer is doped with fourth scattering particles, the fourth scattering particles are used to scatter light, and the number of the fourth scattering particles in a unit volume of the second encapsulation layer is less than or equal to the number of the first scattering particles in a unit volume of the first encapsulation layer.

10. The display panel according to claim 1, wherein: The first encapsulation layer and the second encapsulation layer are integrally formed, and the first encapsulation layer and the second encapsulation layer are both doped with the first scattering particles.

11. The display panel according to claim 1, wherein: The thickness of the first encapsulation layer is greater than the thickness of the light-emitting device, the first encapsulation layer covers a plurality of the light-emitting devices, the second encapsulation layer is arranged on a side of the first encapsulation layer away from the light-emitting device, and the second encapsulation layer is doped with the first scattering particles.

12. The display panel according to any one of claims 1 to 11, characterized in that: The display panel further includes a light extraction structure, which is disposed on a side of the second encapsulation layer away from the substrate, and one light extraction structure is disposed at least corresponding to one light emitting device.

13. The display panel according to claim 12, wherein: The light emitting devices include a red light emitting device, a blue light emitting device and a green light emitting device; One of the light extraction structures is arranged corresponding to three light emitting devices of different colors; Among the three light-emitting devices of different colors corresponding to one of the light extraction structures, the orthographic projection of the red light-emitting device on the substrate, the orthographic projection of the green light-emitting device on the substrate, and the orthographic projection of the blue light-emitting device on the substrate are all located within the range of the orthographic projection of the corresponding light extraction structure on the substrate; Wherein, the red light emitting device is located between the blue light emitting device and the green light emitting device.

14. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 13.

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