Energy converter and manufacturing method thereof

Abstract

The invention discloses a transducer and a manufacturing method thereof. The transducer comprises a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer and a third matching layer, the piezoelectric layer is arranged on one side of the conductive backing; the first matching layer is arranged on one side, far away from the conductive backing, of the piezoelectric layer; the second matching layer is arranged on the side, away from the piezoelectric layer, of the first matching layer, the material of the second matching layer is different from that of the first matching layer, and the second matching layer comprises graphite and epoxy resin; the third matching layer is arranged on the side, away from the first matching layer, of the second matching layer, and the material of the third matching layer is different from that of the second matching layer. By the adoption of the transducer, the problems that an existing transducer is poor in sensitivity and low in bandwidth are solved, and the transducer has the beneficial effects that the sensitivity is improved, and the bandwidth is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of transducers, and in particular to a transducer and a manufacturing method thereof. Background Art

[0002] Intravascular ultrasound (IVUS) refers to a medical imaging technology that combines non-invasive ultrasound technology with invasive catheter technology, using a special catheter with an ultrasound transducer connected to the end. The ultrasound transducer is used to convert electrical energy and ultrasonic energy, and the conversion of ultrasonic energy to electrical energy is the core component of the entire IVUS catheter.

[0003] Currently, most transducers used for intravascular ultrasound are of a single matching layer structure, in which only one conductive matching layer is pasted on the piezoelectric layer, and a signal line is led out on the conductive first matching layer or the piezoelectric layer. However, the transducer with a single matching layer structure has low acoustic utilization, poor sensitivity, and low bandwidth, which will affect the penetration depth and axial resolution of the intravascular ultrasound image. Summary of the invention

[0004] The invention provides a transducer and a manufacturing method thereof, so as to solve the problems of poor sensitivity and low bandwidth of the existing transducer.

[0005] In a first aspect, an embodiment of the present invention provides a transducer, the transducer comprising a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer, and a third matching layer;

[0006] The piezoelectric layer is disposed on one side of the conductive backing;

[0007] The first matching layer is disposed on a side of the piezoelectric layer away from the conductive backing;

[0008] The second matching layer is arranged on a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from the material of the first matching layer and the second matching layer comprises graphite and epoxy resin;

[0009] The third matching layer is disposed on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

[0010] Optionally, the mass of the graphite accounts for 50-90% of the mass of the second matching layer, and the mass of the epoxy resin accounts for 10-50% of the mass of the second matching layer.

[0011] Optionally, the conductive backing includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

[0012] Optionally, the mass of the silver powder accounts for 50-90% of the mass of the conductive backing, the mass of the hollow glass microspheres accounts for 1-20% of the mass of the conductive backing, the mass of the tungsten powder accounts for 1-20% of the mass of the conductive backing, and the mass of the epoxy resin accounts for 20-60% of the mass of the conductive backing.

[0013] Optionally, the first matching layer includes an aluminum film or an aluminum alloy film.

[0014] Optionally, the third matching layer includes polyparaxylene.

[0015] Optionally, the transducer further comprises a cable; the cable comprises a first conductor and a second conductor;

[0016] The third matching layer is provided with a via hole penetrating the third matching layer;

[0017] The first conductive line passes through the via hole and is electrically connected to the second matching layer;

[0018] The second conductive line is electrically connected to the conductive backing.

[0019] Optionally, the cable includes a coaxial cable or a twisted pair cable.

[0020] In a second aspect, an embodiment of the present invention provides a method for manufacturing a transducer, which is used to manufacture the transducer as described in any embodiment of the first aspect, wherein the transducer includes a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer, and a third matching layer;

[0021] The production method comprises:

[0022] preparing a conductive backing;

[0023] Prepare a piezoelectric layer, and adhere the piezoelectric layer to the conductive backing;

[0024] Prepare a first matching layer, and stick the first matching layer on a side of the piezoelectric layer away from the conductive backing;

[0025] Prepare a second matching layer, and stick the second matching layer to a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from that of the first matching layer and the second matching layer comprises graphite and epoxy resin;

[0026] A third matching layer is prepared on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

[0027] Optionally, the transducer further comprises a cable; the cable comprises a first conductor and a second conductor;

[0028] The production method further comprises:

[0029] preparing a via hole in the third matching layer that penetrates the third matching layer;

[0030] Passing the first wire through the via hole to electrically connect the first wire to the second matching layer;

[0031] The second lead is electrically connected to the conductive backing.

[0032] The technical solution of the embodiment of the present invention provides a transducer, which includes a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer and a third matching layer, wherein the piezoelectric layer is arranged on one side of the conductive backing, the first matching layer is arranged on the side of the piezoelectric layer away from the conductive backing, the second matching layer is arranged on the side of the first matching layer away from the piezoelectric layer, the material of the second matching layer is different from the material of the first matching layer and the second matching layer includes graphite and epoxy resin, and the third matching layer is arranged on the side of the second matching layer away from the first matching layer, and the material of the third matching layer is different from the material of the second matching layer. The present invention solves the problems of poor sensitivity and low bandwidth of the existing transducer by adopting the above-mentioned transducer, and has the beneficial effect of improving sensitivity and bandwidth.

[0033] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 A top view of a transducer provided by an embodiment of the present invention;

[0036] Figure 2 for Figure 1 A schematic cross-sectional view of a transducer along section line A-A';

[0037] Figure 3 for Figure 1 A schematic cross-sectional view of another transducer along the section line AA';

[0038] Figure 4 A schematic diagram of the structure of a transducer provided by an embodiment of the present invention;

[0039] Figure 5 A simulation diagram of acoustic performance of a transducer provided by an embodiment of the present invention;

[0040] Figure 6 A flow chart of a method for manufacturing a transducer provided by an embodiment of the present invention;

[0041] Figure 7 A flow chart of another method for manufacturing a transducer provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0043] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] Embodiment 1

[0045] Figure 1 A top view of a transducer provided by an embodiment of the present invention, Figure 2 for Figure 1 A schematic cross-sectional view of a transducer along the section line A-A', see Figure 1 and Figure 2 In a first aspect, an embodiment of the present invention provides a transducer, which includes a conductive backing 110 , a piezoelectric layer 120 , a first matching layer 130 , a second matching layer 140 and a third matching layer 150 .

[0046] Specifically, the piezoelectric layer 120 is disposed on one side of the conductive backing 110. The first matching layer 130 is disposed on the side of the piezoelectric layer 120 away from the conductive backing 110. The second matching layer 140 is disposed on the side of the first matching layer 130 away from the piezoelectric layer 120, wherein the material of the second matching layer 140 is different from that of the first matching layer 130 and the second matching layer 140 includes graphite and epoxy resin. The third matching layer 150 is disposed on the side of the second matching layer 140 away from the first matching layer 130, wherein the material of the third matching layer 150 is different from that of the second matching layer 140.

[0047] It should be noted that epoxy resin itself is insulating, and it can be conductive after adding conductive graphite. Compared with the matching layer composed of pure epoxy resin, the matching layer composed of graphite and epoxy resin is tougher and conductive. Compared with the matching layer composed of other epoxy resin composite materials, the matching layer composed of graphite and epoxy resin has higher conductivity, while maintaining the low density of the material, which can make the matching layer tougher. The acoustic impedance range of the second matching layer 140 composed of graphite and epoxy resin is 2 to 9 MRayls. Compared with the second matching layer composed of other compositions, the embodiment of the present invention adopts the second matching layer 140 composed of graphite and epoxy resin, which not only has good conductivity and toughness, but also can make the acoustic impedance of the transducer composed of the conductive backing 110, the piezoelectric layer 120, the first matching layer 130 and the third matching layer 150 more matched with the acoustic impedance of the measured object (human blood vessels), which is conducive to improving the sensitivity and bandwidth of the transducer.

[0048] On the basis of the above embodiment, the mass of graphite accounts for 50-90% of the mass of the second matching layer 140 , and the mass of epoxy resin accounts for 10-50% of the mass of the second matching layer 140 .

[0049] Exemplarily, by setting the mass proportion of graphite in the second matching layer 140 within the range of 50-90%, and setting the mass proportion of epoxy resin in the second matching layer 140 within the range of 10-50%, the acoustic impedance range of the second matching layer 140 can be maintained within 2-9 MRayls, and the conductivity of the second matching layer 140 is maintained.

[0050] On the basis of the above embodiment, the conductive backing 110 includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

[0051] It should be noted that the transducer needs to have a positive electrode and a negative electrode. The transducer can only work when an electrical signal is applied to the positive and negative electrodes. Usually, the negative electrode in the transducer is the conductive backing 110. Therefore, to ensure the normal operation of the transducer, its conductive backing 110 needs to be conductive. It can be understood that the higher the conductivity of the conductive backing 110, the more stable the transducer works. Compared with the conductive backing composed of glass balls, tungsten powder and epoxy resin, the conductive backing 110 used in the embodiment of the present invention is composed of silver powder, hollow glass microspheres, tungsten powder and epoxy resin. The conductivity of silver powder is relatively strong. Adding silver powder to the conductive backing 110 is conducive to improving the conductivity of the conductive backing 110.

[0052] Based on the above embodiment, the mass of silver powder accounts for 50-90% of the mass of the conductive backing 110, the mass of hollow glass microspheres accounts for 1-20% of the mass of the conductive backing 110, the mass of tungsten powder accounts for 1-20% of the mass of the conductive backing 110, and the mass of epoxy resin accounts for 20-60% of the mass of the conductive backing 110.

[0053] Exemplarily, by setting the mass proportion of silver powder in the conductive backing 110 within the range of 50-90%, setting the mass proportion of hollow glass microspheres in the conductive backing 110 within the range of 1-20%, setting the mass proportion of tungsten powder in the conductive backing 110 within the range of 1-20%, and setting the mass proportion of epoxy resin in the conductive backing 110 within the range of 20-60%, not only the conductivity of the conductive backing 110 can be improved, but also the acoustic impedance range of the conductive backing 110 can be maintained within 3-8 MRayls, thereby making the acoustic impedance of the transducer composed of the second matching layer 140, the conductive backing 110, the piezoelectric layer 120, the first matching layer 130 and the third matching layer 150 more matched with the acoustic impedance of the object to be measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0054] On the basis of the above embodiment, the first matching layer 130 includes an aluminum film or an aluminum alloy film.

[0055] Exemplarily, the acoustic impedance of the first matching layer 130 composed of an aluminum film or an aluminum alloy film is in the range of 10 to 17 MRayls, which can make the acoustic impedance of the transducer composed of the conductive backing 110, the second matching layer 140, the piezoelectric layer 120 and the third matching layer 150 more matched with the acoustic impedance of the object being measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0056] Based on the above embodiment, the third matching layer 150 includes polyparaxylene.

[0057] Exemplarily, the acoustic impedance of the third matching layer 150 composed of polyparaxylene is about 2.89 MRayls, which can make the acoustic impedance of the transducer composed of the conductive backing 110, the first matching layer 130, the second matching layer 140 and the piezoelectric layer 120 more matched with the acoustic impedance of the object being measured (human blood vessels), which is beneficial to improving the sensitivity and bandwidth of the transducer.

[0058] Based on the above embodiments, Figure 4 A schematic diagram of a structure of a transducer provided in an embodiment of the present invention, referring to Figure 4 The transducer further comprises a cable 160 . The cable 160 comprises a first conductor 161 and a second conductor 162 .

[0059] Specifically, the third matching layer 150 is provided with a via hole 151 penetrating the third matching layer 150 . The first wire 161 passes through the via hole 151 and is electrically connected to the second matching layer 140 . The second wire 162 is electrically connected to the conductive backing 110 .

[0060] It should be noted that the transducer needs to have a positive electrode and a negative electrode. The transducer can only work when electrical signals are applied to the positive and negative electrodes. Usually, the negative electrode in the transducer is the side of the conductive backing 110 away from the piezoelectric layer 120, and the positive electrode is the side of the piezoelectric layer 120 away from the conductive backing 110. Since the first matching layer 130 and the second matching layer 140 in the embodiment of the present invention are both conductive, for the convenience of manufacturing, the side of the second matching layer 140 away from the first matching layer 130 can be used as the positive electrode of the transducer and electrically connected to the first wire 161 that provides the positive electrical signal. Because a third matching layer 150 made of polyparaxylene is also provided on the side of the second matching layer 140 away from the first matching layer 130, and the third matching layer 150 is not conductive, in order to electrically connect the first conductive wire 161 of the cable 160 with the second matching layer 140, it is necessary to open a via hole 151 on the third matching layer 150 to expose the second matching layer 140. The first conductive wire 161 can pass through the via hole 151 to be electrically connected to the second matching layer 140, and the second conductive wire 162 for providing a negative electrical signal is electrically connected to the conductive backing 110.

[0061] It should be noted that the embodiment of the present invention does not limit the shape of the via hole 151, which can be Figure 1 The circular hole shown may also be a square hole, a polygonal hole, etc., and those skilled in the art can set them according to actual needs.

[0062] For example, Figure 3 for Figure 1 A schematic cross-sectional view of another transducer along the section line A-A', see Figure 3 and Figure 4, the transducer in the embodiment of the present invention further includes an insulating layer 170, a shell 180 and a rotating wire 190. The outer surface of the transducer body is provided with an insulating layer 170 except for the side of the conductive backing 110 away from the piezoelectric layer 120 and the side of the third matching layer 150 away from the second matching layer 140. As a feasible embodiment, the insulating layer 170 can be composed of polyparaxylene, which is the same as the composition of the third matching layer 150, so the insulating layer 170 can be prepared together with the second matching layer 150. The transducer body is arranged in the shell 180, and the cable 160 is arranged in the rotating wire 190. As a feasible embodiment, the rotating wire 190 can be a rotating spring. The shell 180 and the rotating wire 190 are fixedly connected and can be electrically connected to each other. The side of the conductive backing 110 away from the piezoelectric layer 120 is electrically connected to the shell 180 through a conductive silver paste, and the second wire 162 for providing a negative electrical signal is electrically connected to the rotating wire 190, thereby realizing the electrical connection between the second wire 162 and the conductive backing 110.

[0063] Figure 5 A simulation diagram of the acoustic performance of a transducer provided in an embodiment of the present invention, Figure 5 The horizontal axis in the figure represents the design frequency of the transducer, the vertical axis on the left refers to the transducer's transmit / receive voltage ratio Vo / Vi, and the vertical axis on the right refers to the transducer's dB and the transmit / receive voltage ratio Vo / Vi after Fourier transform. Figure 5 When the transducer in the embodiment of the present invention takes 50M as the design frequency, uses an aluminum film as the first matching layer 130, a graphite epoxy mixture as the second matching layer 140, and Parylene as the third matching layer 150, the -6dB bandwidth is 82.52%, and the -20dB bandwidth is 112.59%, which has very high sensitivity and bandwidth.

[0064] Based on the above embodiment, the cable 160 includes a coaxial cable or a twisted pair cable.

[0065] Figure 4 The cable 160 using twisted pair cable is used as an example for explanation. It can be understood that the cable 160 can also use coaxial cable. Due to the differences in manufacturing and structure of coaxial cable and twisted pair cable, the characteristic impedance of coaxial cable is more stable compared to twisted pair cable. Therefore, the use of coaxial cable is beneficial to improving the accuracy of intravascular ultrasound detection.

[0066] Embodiment 2

[0067] The embodiment of the present invention provides a method for manufacturing a transducer, which is used to manufacture the transducer described in any embodiment of the present invention, referring to Figure 1 The transducer in the embodiment of the present invention includes a conductive backing 110 , a piezoelectric layer 120 , a first matching layer 130 , a second matching layer 140 and a third matching layer 150 . Figure 6A flowchart of a method for manufacturing a transducer provided in an embodiment of the present invention, referring to Figure 6 The manufacturing method of the transducer in the embodiment of the present invention includes:

[0068] S210, preparing a conductive backing.

[0069] Exemplary, reference Figure 2 The conductive backing 110 includes silver powder, hollow glass microspheres, tungsten powder and epoxy resin, wherein the mass proportion of the silver powder in the conductive backing 110 is set in the range of 50-90%, the mass proportion of the hollow glass microspheres is set in the range of 1-20%, the mass proportion of the tungsten powder is set in the range of 1-20%, the mass proportion of the epoxy resin is set in the range of 20-60%, and the acoustic impedance of the conductive backing 110 is in the range of 3-8 MRayls. The technicians can adjust the ratio of the silver powder, hollow glass microspheres, tungsten powder and epoxy resin in the conductive backing 110 according to the actual acoustic impedance requirements.

[0070] S220, preparing a piezoelectric layer, and pasting the piezoelectric layer onto a conductive backing.

[0071] Exemplary, reference Figure 2 The piezoelectric layer 120 includes a piezoelectric material, wherein the piezoelectric material includes piezoelectric ceramics, lead magnesium niobate-lead titanate (PMN-PT) or lead indium niobate-lead magnesium niobate-lead titanate (PMN-PMN-PT). The acoustic impedance range of the piezoelectric layer 120 is 30 to 36 MRayls. Technicians can adjust the type of piezoelectric material in the piezoelectric layer 120 according to actual acoustic impedance requirements.

[0072] Exemplary, reference Figure 2 The piezoelectric layer 120 can be adhered to the conductive backing 110 by using epoxy resin. It should be noted that when the epoxy resin used is 5 μm or less, it will not affect the conductivity of the piezoelectric layer 120 and the conductive backing 110.

[0073] S230 , preparing a first matching layer, and pasting the first matching layer on a side of the piezoelectric layer away from the conductive backing.

[0074] Exemplary, reference Figure 2 The acoustic impedance of the first matching layer 130 composed of an aluminum film or an aluminum alloy film is in the range of 10 to 17 MRayls. The technicians can adjust the type of material in the first matching layer 130 according to the actual acoustic impedance requirements.

[0075] S240, preparing a second matching layer, and pasting the second matching layer on a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from that of the first matching layer and the second matching layer comprises graphite and epoxy resin.

[0076] Exemplary, reference Figure 2 The mass proportion of graphite in the second matching layer 140 is set in the range of 50-90%, the mass proportion of epoxy resin is set in the range of 10-50%, and the acoustic impedance range of the second matching layer 140 is maintained in the range of 2-9 MRayls. The technicians can adjust the ratio of graphite and epoxy resin in the second matching layer 140 according to the actual acoustic impedance requirements.

[0077] S250 , preparing a third matching layer on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

[0078] Exemplary, reference Figure 2 , polyparaxylene liquid is sprayed on the surface of the second matching layer 140 away from the first matching layer 130 to form a third matching layer 150. The acoustic impedance of the third matching layer 150 composed of polyparaxylene is about 2.89 MRayls. The acoustic impedance of the transducer composed of the third matching layer 150, the conductive backing 110, the first matching layer 130, the second matching layer 140 and the piezoelectric layer 120 is more matched with the acoustic impedance of the measured object (human blood vessel), which is conducive to improving the sensitivity and bandwidth of the transducer.

[0079] On the basis of the above embodiments, on the basis of the above embodiments, refer to Figure 4 The transducer further includes a cable 160 , and the cable 160 includes a first conductor 161 and a second conductor 162 . Figure 7 A flowchart of another method for manufacturing a transducer provided in an embodiment of the present invention, Figure 7 The embodiment shown enriches the process of the method for manufacturing the transducer, refer to Figure 7 The manufacturing method of the transducer in the embodiment of the present invention includes:

[0080] S310, preparing a conductive backing.

[0081] S320, preparing a piezoelectric layer, and pasting the piezoelectric layer onto a conductive backing.

[0082] S330 , preparing a first matching layer, and pasting the first matching layer on a side of the piezoelectric layer away from the conductive backing.

[0083] S340, preparing a second matching layer, and pasting the second matching layer on a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from that of the first matching layer and the second matching layer comprises graphite and epoxy resin.

[0084] S350 , preparing a third matching layer on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

[0085] S360 , preparing a via hole penetrating the third matching layer in the third matching layer.

[0086] Exemplary, reference Figure 4 Since a third matching layer 150 made of polyparaxylene is disposed on a side of the second matching layer 140 away from the first matching layer 130 and the third matching layer 150 is not conductive, in order to electrically connect the first wire 161 of the cable 160 with the second matching layer 140 , a via hole 151 is required to be opened on the third matching layer 150 to expose the conductive second matching layer 140 .

[0087] S370 , pass the first wire through the via hole to electrically connect the first wire to the second matching layer.

[0088] S380, electrically connecting the second conductive wire to the conductive backing.

[0089] Exemplary, reference Figure 4 The first wire 161 for providing a positive electrical signal can pass through the via 151 and be electrically connected to the second matching layer 140 , while the second wire 162 for providing a negative electrical signal is electrically connected to the conductive backing 110 .

[0090] Based on the above embodiments, continue to refer to Figure 4 , the transducer in the embodiment of the present invention further includes an insulating layer 170, a shell 180 and a rotating wire 190. Therefore, the manufacturing method of the transducer in the embodiment of the present invention further includes: preparing an insulating layer 170 on the outer surface of the transducer body except for the side of the conductive backing 110 away from the piezoelectric layer 120 and the side of the third matching layer 150 away from the second matching layer 140, wherein the insulating layer 170 can be composed of polyparaxylene, which has the same composition as the third matching layer 150, so the insulating layer 170 can be prepared together with the third matching layer 150, and illustratively, the polyparaxylene liquid is sprayed on the outer surface of the transducer body except for the side of the conductive backing 110 away from the piezoelectric layer 120 to form the third matching layer 150 and the insulating layer 170. The manufacturing method of the transducer also includes: setting the transducer body in the shell 180, setting the cable 160 in the rotating wire 190, and fixing the shell 180 and the rotating wire 190 so that they can be electrically connected to each other. For example, the rotating wire 190 can be a rotating spring and the shell 180 can be a metal shell.

[0091] Exemplary, reference Figure 4 S380, electrically connecting the second wire to the conductive backing includes: electrically connecting the side of the conductive backing 110 away from the piezoelectric layer 120 to the shell 180 through conductive silver paste, and electrically connecting the second wire 162 to the rotating wire 190, thereby achieving electrical connection between the second wire 162 and the conductive backing 110.

[0092] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A transducer, characterized in that: including a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer, and a third matching layer; The piezoelectric layer is disposed on one side of the conductive backing; The first matching layer is disposed on a side of the piezoelectric layer away from the conductive backing; The second matching layer is arranged on a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from the material of the first matching layer and the second matching layer comprises graphite and epoxy resin; The third matching layer is disposed on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

2. The transducer according to claim 1, characterized in that The mass of the graphite accounts for 50-90% of the mass of the second matching layer, and the mass of the epoxy resin accounts for 10-50% of the mass of the second matching layer.

3. The transducer according to claim 1, characterized in that The conductive backing comprises silver powder, hollow glass microspheres, tungsten powder and epoxy resin.

4. The transducer according to claim 3, characterized in that The mass of the silver powder accounts for 50-90% of the mass of the conductive backing, the mass of the hollow glass microspheres accounts for 1-20% of the mass of the conductive backing, the mass of the tungsten powder accounts for 1-20% of the mass of the conductive backing, and the mass of the epoxy resin accounts for 20-60% of the mass of the conductive backing.

5. The transducer according to claim 1, characterized in that: The first matching layer includes an aluminum film or an aluminum alloy film.

6. The transducer according to claim 1, characterized in that The third matching layer includes parylene.

7. The transducer according to claim 1, characterized in that The transducer further comprises a cable; the cable comprises a first conductor and a second conductor; The third matching layer is provided with a via hole penetrating the third matching layer; The first conductive line passes through the via hole and is electrically connected to the second matching layer; The second conductive line is electrically connected to the conductive backing.

8. The transducer according to claim 7, characterized in that The cable includes a coaxial cable or a twisted pair cable.

9. A method for manufacturing a transducer, used for manufacturing the transducer according to any one of claims 1 to 8, characterized in that: The transducer includes a conductive backing, a piezoelectric layer, a first matching layer, a second matching layer, and a third matching layer; The production method comprises: preparing a conductive backing; Prepare a piezoelectric layer, and adhere the piezoelectric layer to the conductive backing; Prepare a first matching layer, and stick the first matching layer on a side of the piezoelectric layer away from the conductive backing; Prepare a second matching layer, and stick the second matching layer to a side of the first matching layer away from the piezoelectric layer, wherein the material of the second matching layer is different from that of the first matching layer and the second matching layer comprises graphite and epoxy resin; A third matching layer is prepared on a side of the second matching layer away from the first matching layer, wherein a material of the third matching layer is different from a material of the second matching layer.

10. The manufacturing method according to claim 9, characterized in that: The transducer further comprises a cable; the cable comprises a first conductor and a second conductor; The production method further comprises: preparing a via hole in the third matching layer that penetrates the third matching layer; Passing the first wire through the via hole to electrically connect the first wire to the second matching layer; The second lead is electrically connected to the conductive backing.

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