Method and device for cleaning back surface of CIGS (copper indium gallium selenide) thin-film solar cell

Abstract

The invention belongs to the technical field of thin-film solar cells, and particularly discloses a CIGS thin-film solar cell back cleaning device which comprises a wiping mechanism and a positioning detection mechanism. The invention provides a method and a device for cleaning the back surface of a CIGS thin-film solar cell, which can quickly and stably clean the local part of the back surface of the CIGS thin-film solar cell and ensure the wiping integrity and the normal circulation of subsequent working sections, thereby realizing the effective supervision of quality control and the quality acceptance of products. In addition, the defects of traditional pressing block positioning, wiping paper dragging and other modes can be overcome, and the problems that a traditional cleaning mode is low in passing rate, poor in wiping effect, prone to repetition, high in clamp positioning fragment rate and the like are solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thin-film solar cells, and in particular relates to a method and a cleaning device for cleaning the back side of a copper indium gallium selenide thin-film solar cell. Background Art

[0002] As the global demand for renewable energy continues to increase, photovoltaic power generation is an inevitable trend in the long-term market development. Thin-film solar cells, with their thin-film structure and low manufacturing cost, good weak light resistance, customizability, and environmental friendliness, have shown unique technical advantages and greatly broadened their application scope. Thin-film solar energy is extremely suitable for BIPV (building integrated photovoltaics), including architectural design customization such as curved surfaces and irregular surfaces.

[0003] The working principle of the CIGS back side cleaning equipment is to use a motor to drive a roller to transmit a scrubbing cloth dipped in an acidic cleaning solution to wipe the back side of a standard chip at a fixed point, causing a chemical reaction that dissolves the surface material, thereby achieving a cleaning method for the back side.

[0004] Most of the copper indium gallium selenide back side cleaning equipment currently in use have problems such as paper curling, paper jamming, transmission offset, hidden cracks in the fixture positioning, and inadequate wiping action. As a result, secondary or multiple wiping behaviors, resistance measurement failures, and product component voltage resistance test failures frequently occur. Summary of the invention

[0005] The purpose of the present invention is to overcome the above problems existing in the prior art and provide a method and a cleaning device for cleaning the back side of a copper indium gallium selenide thin-film solar cell, which can quickly and stably clean the back side of a copper indium gallium selenide thin-film solar cell locally, ensure the completeness of the wiping and the normal flow of subsequent work sections, thereby achieving effective supervision of quality control and product quality acceptance; and can avoid the disadvantages of traditional methods such as pressing block positioning and dragging wiping paper, and solve the problems of low pass rate, poor wiping effect, easy repetition, and high fixture positioning fragmentation rate of traditional cleaning methods.

[0006] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0007] In a first aspect, the present invention provides a back side cleaning device for a copper indium gallium selenide thin film solar cell, comprising:

[0008] A wiping mechanism, wherein two wiping mechanisms are arranged opposite to each other, and the wiping mechanism comprises a scrubbing cloth roll, a discharging roller, a retracting roller, a motor, a cleaning liquid spraying assembly, and a roller scrubbing assembly. The two ends of the scrubbing cloth roll are respectively wound around the discharging roller and the retracting roller, and the motor is used to drive the retracting roller to rotate. The scrubbing cloth roll is located between the cleaning liquid spraying assembly and the roller scrubbing assembly, and a substrate to be processed is also arranged between the scrubbing cloth roll and the cleaning liquid spraying assembly.

[0009] The positioning detection mechanism is located between the two wiping mechanisms. The positioning detection mechanism includes two relatively arranged conveyor belts, a vacuum platform arranged between the two conveyor belts, a positioning sensor and a test resistance device. The conveyor belts are used for transmitting the substrate to be processed, and the positioning sensor is arranged between the two conveyor belts.

[0010] Furthermore, a cursor is provided on the retracting roller;

[0011] A photoelectric sensor is also provided above the scrubbing cloth roll.

[0012] Furthermore, the wiping mechanism also includes at least two tensioning rollers, and the tensioning rollers are located between the discharge roller and the retracting roller, and the outside of the tensioning roller is in close contact with the scrubbing cloth roll.

[0013] Furthermore, the cleaning liquid spraying assembly includes an acid spraying nozzle and a water spraying nozzle which are arranged opposite to each other.

[0014] Further, the roller scrubbing assembly comprises a scrubbing roller, a driving mechanism three and a lifting cylinder, wherein the driving mechanism three is used to drive the scrubbing roller to rotate;

[0015] The lifting cylinder is used to lift and lower the driving mechanism three.

[0016] Furthermore, the positioning detection mechanism also includes a pressing block clamp, and two pressing block clamps are arranged opposite to each other, and the two conveyor belts are located between the two pressing block clamps.

[0017] Furthermore, the positioning detection mechanism also includes a positioning block, which is arranged between two conveyor belts. A driving mechanism 1 is provided at the bottom of the positioning block, and the driving mechanism 1 is used to drive the lifting and lowering of the positioning block.

[0018] Furthermore, vacuum suction cups are evenly distributed on the vacuum platform;

[0019] A second driving mechanism is provided at the bottom of the vacuum platform, and the second driving mechanism is used to drive the vacuum platform to rise and fall.

[0020] Furthermore, two cylinders are provided between the two wiping mechanisms, and output ends of the two cylinders are respectively connected to the two wiping mechanisms.

[0021] In a second aspect, the present invention provides a method for cleaning a back side cleaning device of a copper indium gallium selenide thin film solar cell, the method comprising the following steps:

[0022] S1. The two wiping mechanisms are opened under the action of the cylinder, and the motor drives the retracting roller to pull out the scrubbing cloth roll and place it under the cleaning liquid spraying assembly. The pure water sprayed by the water drip nozzle and the weak acid solution sprayed by the acid drip nozzle are respectively dripped onto the scrubbing cloth roll to form a circular area;

[0023] S2, the substrate to be processed is transported via a conveyor belt. After the positioning sensor receives that the position of the substrate to be processed has reached above the scrubbing cloth roll, the conveyor belt stops conveying, the positioning block is lifted, the vacuum platform rises, the vacuum platform absorbs the glass surface of the substrate to be processed, and the clamps on both sides press down to clamp and fix the substrate to be processed;

[0024] S3, the two wiping mechanisms are retracted inwards and moved to the bottom of the substrate to be processed under the action of the cylinder, the rising cylinder drives the scrubbing roller to lift the circular area on the scrubbing cloth roll upwards, and the driving mechanism three drives the scrubbing roller to rotate and wipe the small hole at the center of the edge of the substrate to be processed. After the wiping is completed, the rising cylinder retracts and the scrubbing roller falls to the origin position;

[0025] S4, the motor drives the retracting roller to pull the scrubbing cloth roll to rotate, and moves the dry cloth roll to the small hole at the center of the edge of the substrate to be processed. The rising cylinder drives the scrubbing roller to rise and lift up the dry scrubbing cloth roll to rotate and wipe. After wiping is completed, the rising cylinder retracts and the scrubbing roller falls to the origin position;

[0026] S5, the motor drives the retracting roller to pull the scrubbing cloth roll to rotate, and moves the cleaning cloth roll dripped with pure water to the small hole at the center of the edge of the substrate to be processed. The rising cylinder drives the scrubbing roller to raise the wiping head and lift the scrubbing cloth roll to repeat the previous wiping action. After the wiping is completed, the rising cylinder retracts and the scrubbing roller falls to the origin position;

[0027] S6, the motor drives the retracting roller to pull the scrubbing cloth roll to rotate, and moves the dry cloth roll to the small hole at the center of the edge of the substrate to be processed. The rising cylinder drives the scrubbing roller to rise and lift up the cleaning cloth roll to repeat the previous wiping action. After the wiping is completed, the rising cylinder retracts and the scrubbing roller falls to the origin position;

[0028] S7, the wiping mechanism opens outward under the action of the cylinder, the resistance testing device moves to the bottom of the small hole, the resistance testing device rises, and is close to the small hole at the center of the edge of the substrate to be processed after wiping to perform power-on detection, the resistance at the small hole at the center of the edge of the substrate to be processed after wiping is tested and the test result is output. After the test is completed, the resistance testing device falls to the origin;

[0029] S8. After the inspection is completed, the positioning block falls, the clamps on both sides open, the vacuum adsorption platform breaks the vacuum and descends, and the substrate to be processed after inspection falls on the conveyor belt and continues to the next process.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention provides a method and a cleaning device for cleaning the back side of a copper indium gallium selenide thin-film solar cell, which can quickly and stably clean the back side of a copper indium gallium selenide thin-film solar cell locally, ensure the completeness of wiping and the normal flow of subsequent work sections, thereby achieving effective supervision of quality control and product quality acceptance; and can avoid the drawbacks of traditional methods such as pressing block positioning and dragging wiping paper, and solve the problems of low pass rate, poor wiping effect, easy repetition, and high rate of fixture positioning fragmentation in traditional cleaning methods.

[0032] 2. The present invention provides a method and a cleaning device for cleaning the back side of a copper indium gallium selenide thin-film solar cell, which can effectively avoid the problems of hidden cracks and fragments of the substrate during the wiping process, and also eliminate the problems of paper jamming, paper roll displacement, transmission deviation, and inadequate wiping when recycling the roll paper. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0034] Figure 1 This is a structural front view of the back side cleaning device of a copper indium gallium selenide thin film solar cell provided by the present invention;

[0035] Figure 2 It is a top view of the structure of the back side cleaning device of the copper indium gallium selenide thin film solar cell provided by the present invention;

[0036] Figure 3 It is a structural front view of the cleaning device in the initial state preparation in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin-film solar cell provided by the present invention;

[0037] Figure 4 It is a structural top view of the cleaning device in the initial state preparation in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin-film solar cell provided by the present invention;

[0038] Figure 5 It is a structural front view of the cleaning device in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin-film solar cell provided by the present invention during the back side cleaning process of the substrate to be processed;

[0039] Figure 6It is a structural top view of the cleaning device in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin-film solar cell provided by the present invention during the back side cleaning process of the substrate to be processed;

[0040] Figure 7 It is a structural front view of the cleaning device in the resistance test in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin film solar cell provided by the present invention;

[0041] Figure 8 It is a top view of the structure of the cleaning device in the resistance test in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin film solar cell provided by the present invention;

[0042] Fig. 9 It is a structural front view of the cleaning device during the resetting process in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin-film solar cell provided by the present invention;

[0043] Fig.10 It is a structural top view of the cleaning device during the resetting process in the cleaning method of the back side cleaning device of the copper indium gallium selenide thin film solar cell provided by the present invention.

[0044] Among them, the accompanying drawings are marked as follows: 100, wiping mechanism; 200, positioning detection mechanism; 300, cleaning liquid spraying assembly; 1, motor; 2, photoelectric sensor; 3, scrubbing cloth roll; 4, acid spray nozzle; 5, water spray nozzle; 6, scrubbing roller; 7, test resistance device; 8, conveyor belt; 9, vacuum platform; 10, vacuum suction cup; 11, pressing block fixture; 12, discharge roller; 13, retracting roller; 14, positioning sensor; 15, positioning block; 16, tensioning roller; 17, substrate to be processed; 18, optical ruler. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] In the description of the present invention, it is necessary to understand that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0047] like Figure 1 to Figure 2As shown, the present invention provides a back side cleaning device for a copper indium gallium selenide thin film solar cell, comprising:

[0048] The wiping mechanism 100 is provided with two wiping mechanisms 100, and the wiping mechanism 100 comprises a scrubbing cloth roll 3, a discharging roller 12, a retracting roller 13, a motor 1, a cleaning liquid spraying assembly 300 and a roller scrubbing assembly. The two ends of the scrubbing cloth roll 3 are respectively wound around the discharging roller 12 and the retracting roller 13. The motor 1 is used to drive the retracting roller 13 to rotate. The scrubbing cloth roll 3 is located between the cleaning liquid spraying assembly 300 and the roller scrubbing assembly. A substrate 17 to be processed is also provided between the scrubbing cloth roll 3 and the cleaning liquid spraying assembly 300.

[0049] A positioning detection mechanism 200, which is located between the two wiping mechanisms 100, and includes two conveyor belts 8 arranged opposite to each other, a vacuum platform 9 arranged between the two conveyor belts 8, a positioning sensor 14 and a test resistor device 7. The conveyor belt 8 is used for transmitting the substrate 17 to be processed, and the positioning sensor 14 is arranged between the two conveyor belts 8;

[0050] Specifically, a positioning detection mechanism 200 is provided. In actual use, the conveyor belt 8 thereon is used to transport the substrate 17 to be processed. The substrate 17 to be processed is transported to the conveyor belt 8. The positioning sensor 14 is used to obtain the position of the substrate 17 to be processed. When the substrate 17 to be processed is transported to the wiping area of ​​the scrubbing cloth roll 3 via the conveyor belt 8, the conveyor belt 8 can stop conveying, and the substrate 17 to be processed is adsorbed and fixed via the vacuum platform 9.

[0051] In the wiping mechanism 100, the main body of the scrubbing cloth roll 3 is wound on the discharge roller 12, and the end of the scrubbing cloth roll 3 is fixed on the retracting roller 13. The retracting roller 13 can fix one end of the used scrubbing cloth roll 3 and rotate it for recovery under the drive of the motor 1;

[0052] Specifically, a wiping mechanism 100 is provided. During actual use, the cleaning liquid spraying assembly 300 sprays cleaning liquid onto the scrubbing cloth roll 3 for cleaning the substrate to be processed 17; the scrubbing cloth roll 3 sprayed with cleaning liquid is transferred to the bottom of the substrate to be processed 17, and is lifted by the roller scrubbing assembly to the processing area of ​​the substrate to be processed 17 (i.e., the small hole in the center of the edge of the substrate to be processed 17), and the processing area of ​​the substrate to be processed 17 is automatically cleaned by the rotation of the roller scrubbing assembly.

[0053] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the material of the scrubbing cloth roll 3, by mass percentage, includes the following raw materials: 50% polyester, 50% wood pulp, and the scrubbing cloth roll 3 when unfolded has a thickness of 0.3±0.2 mm and a width of 100±5 mm.

[0054] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, a cursor 18 is further provided on the retracting roller 13; a photoelectric sensor 2 is further provided above the scrubbing cloth roll 3;

[0055] The added cursor ruler 18 and photoelectric sensor 2 are based on the principle of light interference to measure the length or displacement of the scrubbing cloth roll 3. Specifically, the added cursor ruler 18 and photoelectric sensor 2 can control the cleaning cloth roll 3 to move a fixed distance after each scrubbing, thereby ensuring that the weak acid solution, pure water and dry scrubbing cloth roll 3 can accurately fall below the central hole of the substrate 17 to be cleaned; through this arrangement, the weak acid solution can accurately and effectively clean the central hole of the substrate 17 to be cleaned, reduce the short circuit phenomenon after the subsequent installation of the junction box, and improve the product yield.

[0056] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the wiping mechanism 100 further includes a plurality of tensioning rollers 16, the plurality of tensioning rollers 16 are located between the discharge roller 12 and the retracting roller 13, and the outside of the tensioning rollers 16 is in close contact with the scrubbing cloth roll 3; specifically, the number of the tensioning rollers 16 is not less than two;

[0057] Specifically, the tension roller 16 forms a conveying channel for the scrubbing cloth roll 3 between the retracting roller 13 and the discharging roller 12, so as to stabilize the conveying of the scrubbing cloth roll 3, thereby fixing the position and direction of the scrubbing cloth roll 3 during the wiping process;

[0058] The motor 1 drives the retracting roller 13 to rotate through the rotating mechanism, and a plurality of tensioning rollers 16 form a conveying channel for the scrubbing cloth roll 3 to pass through between the retracting roller and the discharging roller. The scrubbing cloth roll 3 in the conveying channel passes through the processing area of ​​the substrate 17 to be processed;

[0059] Furthermore, a plurality of tension rollers 16 are provided to prevent the scrubbing cloth roll 3 from rolling up, jamming, or deflecting during transmission.

[0060] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the cleaning liquid spraying assembly 300 includes an acid spraying nozzle 4 and a water spraying nozzle 5 which are arranged opposite to each other;

[0061] Specifically, the water spray nozzle 5 and the acid spray nozzle 4 are arranged from left to right along the conveying direction of the substrate 17 to be processed; in this position arrangement, during the conveying process of the substrate 17 to be processed, the substrate 17 to be processed is first scrubbed by the scrubbing cloth roll 3 with a weak acid solution, and then scrubbed by the scrubbing cloth roll 3 with a pure water liquid;

[0062] The acid spray nozzle 4 is used to spray acid onto the scrubbing cloth roll 3, and the water spray nozzle 5 is used to spray pure water onto the scrubbing cloth roll 3. In actual use, the acid spray nozzle 4 and the water spray nozzle 5 can be externally connected to an acid tank and a pure water tank, and the acid tank and the pure water tank are used to supply acid and water to the acid spray nozzle 4 and the water spray nozzle 5, respectively.

[0063] Specifically, the acid solution sprayed from the acid spray nozzle 4 to the scrubbing cloth roll 3 is a weak acid solution, including but not limited to weak acid cleaning solutions such as aminosulfonic acid, ammonium aminosulfonate, and hydrochloric acid.

[0064] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, a drip regulating valve is further provided on the acid spray nozzle 4 and the water spray nozzle 5 to control the amount and speed of liquid dripping into the scrubbing cloth roll 3 .

[0065] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the roller scrubbing assembly includes a scrubbing roller 6, a driving mechanism three and a lifting cylinder, and the driving mechanism three is used to drive the scrubbing roller 6 to rotate;

[0066] The lifting cylinder is used to lift the driving mechanism 3, thereby driving the scrubbing roller 6 to rise and fall;

[0067] Specifically, the driving mechanism three can be a gear belt mechanism, more specifically, the gear belt mechanism includes two pulleys and a belt wound around the outside of the two pulleys, wherein a driving motor is provided on one of the pulleys for driving the rotation of one of the pulleys, one end of the scrubbing roller 6 can be installed on one of the pulleys, and the other end of the scrubbing roller 6 is used to wipe the to-be-processed area of ​​the to-be-processed substrate 17 (i.e., the small hole at the center of the edge of the to-be-processed substrate 17), and the driving motor drives the pulley to rotate, thereby driving the rotation of the scrubbing roller 6;

[0068] One end of the scrubbing roller 6 away from the belt pulley is a wiping head.

[0069] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, a test device lifting cylinder is provided below the resistance test device 7 , and the test device lifting cylinder is used for lifting and lowering the resistance test device 7 .

[0070] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the positioning detection mechanism 200 further includes a pressing block clamp 11, two pressing block clamps 11 are provided opposite to each other, and the two conveyor belts 8 are located between the two pressing block clamps 11;

[0071] The two pressing block clamps 11 are used to clamp the edges of the substrate 17 to be processed after it is positioned. Specifically, a driving mechanism can be provided at the bottom of the two pressing block clamps 11, and a lifting mechanism is provided on the driving mechanism. The lifting mechanism is used to lift and lower the driving mechanism, thereby driving the lifting and lowering of the pressing block clamps 11. The driving mechanism is used to push the pressing block clamps 11 to move forward and backward, so that the pressing block clamps 11 can clamp the side of the substrate 17 to be processed, thereby fixing the edge of the substrate 17 to be processed, that is, the edge of the entire substrate 17 to be processed is in a clamped state.

[0072] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, the positioning detection mechanism 200 further includes a positioning block 15, the positioning block 15 is disposed between the two conveyor belts 8, and a driving mechanism 1 is disposed at the bottom of the positioning block 15, the driving mechanism 1 is used to drive the lifting of the positioning block 15;

[0073] During the transmission of the substrate 17 to be processed on the conveyor belt 8, the positioning sensor 14 is used to obtain the position of the substrate 17 to be processed. After the substrate 17 to be processed is transmitted to the wiping area of ​​the scrubbing cloth roll 3 via the conveyor belt 8, the conveyor belt 8 can stop conveying. The positioning block 15 can be used to position the substrate 17 to be processed on the conveyor belt 8, and can also be used to block the substrate 17 to be processed from moving forward.

[0074] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, vacuum suction cups 10 are evenly distributed on the vacuum platform 9;

[0075] A second driving mechanism is provided at the bottom of the vacuum platform 9, and the second driving mechanism is used to drive the vacuum platform 9 to rise and fall; after the vacuum platform 9 is raised, its height can be consistent with the height of the pressing block fixture 11;

[0076] The vacuum platform 9 is used for initially adsorbing and fixing the substrate 17 to be processed, and the vacuum suction cup 10 adsorbs the substrate 17 to be processed, which are both existing technologies and will not be described in detail here.

[0077] like Figure 1 to Figure 2 As shown, in some embodiments of the present invention, two cylinders are provided between the two wiping mechanisms 100, and the output ends of the two cylinders are connected to the two wiping mechanisms 100 respectively;

[0078] Specifically, the two cylinders can be located below the vacuum platform 9, and the two cylinders are placed opposite to each other, that is, the output ends of the two cylinders are far away from each other; because the output ends of the two cylinders are respectively connected to the two wiping mechanisms 100, the two wiping mechanisms 100 can be moved back and forth, and when the substrate 17 to be processed is transmitted to the conveyor belt 8, the transmission of the substrate 17 to be processed is not affected. After the substrate 17 to be processed is transmitted to the wiping area of ​​the scrubbing cloth roll 3, the two wiping mechanisms 100 can be moved to the bottom of the substrate 17 to be processed, and the area to be processed on the substrate 17 to be processed (that is, the small hole in the center of the edge of the substrate 17 to be processed) is cleaned.

[0079] like Figures 1 to 10 As shown, the present invention also provides a cleaning method for a copper indium gallium selenide thin film solar cell back side cleaning device, using the copper indium gallium selenide thin film solar cell back side cleaning device to clean a substrate 17 to be processed. Specifically, the cleaning method comprises the following steps:

[0080] S1. Initial state preparation

[0081] like Figure 3 to Figure 4 As shown, the two wiping mechanisms 100 are opened under the action of the cylinder, the motor 1 drives the retracting roller 13 to pull out the scrubbing cloth roll 3 and place it under the cleaning liquid spraying assembly 300, and the pure water sprayed by the water spray nozzle 5 and the weak acid solution sprayed by the acid spray nozzle 4 are respectively dripped onto the scrubbing cloth roll 3 to form a circular area;

[0082] Specifically, Figure 3 This is a front view of the two wiping mechanisms 100 opened under the action of the cylinder in the initial state. Figure 4 is a top view of the two wiping mechanisms 100 opened under the action of the cylinder in the initial state, and a top view of the two wiping mechanisms 100 opened under the action of the cylinder;

[0083] The motor 1 drives the retracting roller 13 to pull out the scrubbing cloth roll 3 and place it under the cleaning liquid spraying assembly 300. Under the action of the compressed air in the air pipe, the pure water sprayed by the water spray nozzle 5 and the weak acid (5% aminosulfonic acid, etc.) solution sprayed by the acid spray nozzle 4 are respectively dripped onto the scrubbing cloth roll 3. After dripping, a circular area appears on the scrubbing cloth roll. The drip regulating valve can control the area of ​​the circular area after dripping to be 125-175mm 2 The amount of weak acid (5% aminosulfonic acid, etc.) solution and pure water used is between 0 and 25 ml, depending on the actual wiping effect. The current setting value is 15 ml.

[0084] S2. Cleaning the back of the substrate to be processed

[0085] like Figures 5 and 6 As shown, step S2 is specifically as follows:

[0086] S21, the substrate 17 to be processed is transported via the conveyor belt 8, and after the positioning sensor 14 receives the position of the substrate 17 to be processed reaching above the scrubbing cloth roll 3, the conveyor belt 8 stops conveying, the positioning block 15 is lifted, the vacuum platform 9 rises, the vacuum platform 10 absorbs the glass surface of the substrate 17 to be processed, and the block clamps 11 on both sides press down to clamp and fix the substrate 17 to be processed;

[0087] S22, the two wiping mechanisms 100 are retracted inwards and moved to the bottom of the substrate 17 to be processed under the action of the cylinder, the ascending cylinder drives the scrubbing roller 6 to lift the circular area on the scrubbing cloth roll 3 upwards, and the driving mechanism 3 drives the scrubbing roller 6 to rotate and wipe the small hole at the center of the edge of the substrate 17 to be processed. After the wiping is completed, the ascending cylinder retracts and the scrubbing roller 6 falls to the origin position;

[0088] Specifically, the pressure between the scrubbing roller 6 and the surface of the substrate 17 to be processed is between 1 and 25N when the scrubbing roller 6 rises, and the current setting value is 15N. During a single wiping process, the scrubbing roller 6 rotates 4 circles, and the number of scrubbing circles can be increased or decreased according to the actual cleaning situation;

[0089] S23, the motor 1 drives the retracting roller 13, pulls the scrubbing cloth roll 3 to rotate, moves the dry cloth roll to the small hole at the edge of the substrate 17 to be processed, and the rising cylinder drives the scrubbing roller 6 to rise and lift up the dry scrubbing cloth roll 3 to rotate and wipe. After wiping is completed, the rising cylinder retracts and the scrubbing roller 6 falls to the original position;

[0090] S24, the motor 1 drives the retracting roller 13, pulls the scrubbing cloth roll 3 to rotate, moves the cleaning cloth roll dripped with pure water to the small hole at the edge of the substrate 17 to be processed, and the rising cylinder drives the scrubbing roller 6 to raise the wiping head and lift up the scrubbing cloth roll 3 to repeat the previous wiping action. After the wiping is completed, the rising cylinder shrinks and the scrubbing roller 6 falls to the original position;

[0091] S25, the motor 1 drives the retracting roller 13, pulls the scrubbing cloth roll 3 to rotate, moves the dry cloth roll to the small hole at the edge of the substrate 17 to be processed, and the lifting cylinder drives the scrubbing roller 6 to rise and lift up the cleaning cloth roll to repeat the previous wiping action. After the wiping is completed, the lifting cylinder retracts and the scrubbing roller 6 falls to the original position;

[0092] In step S25, the optical ruler 18 and the photoelectric sensor 2 added to the wiping mechanism 100 can control the cleaning cloth roll 3 to move a fixed distance after each wiping. Specifically, the center positions of the dripped acid solution and the aqueous solution are 20 cm apart, and the cleaning cloth roll 3 moves 10 cm after wiping, ensuring that the dripped acid solution, the dripped pure water and the dry cleaning cloth roll 3 can accurately fall below the central hole of the substrate 17 to be cleaned;

[0093] In step S2, the cleaning process of the wiping mechanism 100 for the central hole of the substrate 17 to be cleaned is as follows: Figures 5 and 6 As shown, during this process, the rising cylinder drives the scrubbing roller 6 to raise the wiping head and lift up the scrubbing cloth roll 3 to achieve cleaning of the central small hole of the substrate 17 to be cleaned;

[0094] S3, resistance test

[0095] like Figures 7 and 8 As shown, the wiping mechanism 100 opens outwards under the action of the cylinder, the resistance testing device 7 moves to the bottom of the small hole, the resistance testing device 7 rises, and is close to the small hole at the center of the edge of the substrate to be processed 17 after wiping to perform power-on detection, and the resistance at the small hole at the center of the edge of the substrate to be processed 17 after wiping is tested and the test result is output. After the test is completed, the resistance testing device 7 falls to the origin;

[0096] In step S3, if the resistance value is less than 120MΩ after the first wipe, a second wipe will be performed, and the unqualified machine will stop and alarm. After the test is completed, the resistance test device 7 falls to the origin;

[0097] Specifically, the process of using the resistance testing device 7 to test the resistance of the small hole at the edge of the substrate 17 to be processed is as follows: Figures 7 and 8 As shown, in this process, the resistance testing device 7 moves to the bottom of the small hole, and is close to the small hole at the edge of the substrate to be processed 17 after wiping to perform power-on detection, and the resistance at the small hole at the edge of the substrate to be processed 17 after wiping is tested and the test result is output;

[0098] S4, Reset

[0099] like Figures 9 and 10 As shown, after the inspection is completed, the positioning block 15 falls, the clamps 11 on both sides are opened, the vacuum adsorption platform 9 breaks the vacuum and descends, and the substrate 17 to be processed after inspection falls on the conveyor belt 8 and continues to be transferred to the next process;

[0100] In step S4, after the inspection, the substrate 17 to be processed is continuously transported via the conveyor belt 8. Figures 9 and 10 As shown;

[0101] Specifically, the cleaning method further includes step S5, which is as follows:

[0102] S5, after the platform processing is completed, wait for a new substrate 17 to be cleaned to enter the above-mentioned cycle.

[0103] The present invention provides a method and device for cleaning the back side of a copper indium gallium selenide thin-film solar cell, which can quickly and stably clean the back side of a standard chip, ensuring the completeness of wiping and the normal flow of subsequent work sections, thereby achieving effective supervision of quality control and product quality acceptance. It can also effectively avoid the problems of hidden cracks and fragments of the substrate during the wiping process, and also eliminate the problems of paper jams, paper rolls, transmission deviation, and inadequate wiping when recycling the roll paper.

[0104] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0105] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. A back cleaning device for a copper indium gallium selenide thin film solar cell, characterized in that: include: A wiping mechanism (100), wherein two wiping mechanisms (100) are arranged opposite to each other, and the wiping mechanism (100) comprises a scrubbing cloth roll (3), a discharge roller (12), a retracting roller (13), a motor (1), a cleaning liquid spraying assembly (300), and a roller scrubbing assembly, wherein two ends of the scrubbing cloth roll (3) are respectively wound around the discharge roller (12) and the retracting roller (13), and the motor (1) is used to drive the retracting roller (13) to rotate, the scrubbing cloth roll (3) is located between the cleaning liquid spraying assembly (300) and the roller scrubbing assembly, and a substrate (17) to be processed is also arranged between the scrubbing cloth roll (3) and the cleaning liquid spraying assembly (300); A positioning detection mechanism (200) is located between two wiping mechanisms (100), and comprises two conveyor belts (8) arranged opposite to each other, a vacuum platform (9) arranged between the two conveyor belts (8), a positioning sensor (14), and a test resistor device (7), wherein the conveyor belt (8) is used for transmitting a substrate (17) to be processed, and the positioning sensor (14) is arranged between the two conveyor belts (8).

2. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The retracting roller (13) is also provided with a cursor (18); A photoelectric sensor (2) is also provided above the scrubbing cloth roll (3).

3. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The wiping mechanism (100) further comprises at least two tensioning rollers (16), and the tensioning rollers (16) are located between the discharge roller (12) and the retracting roller (13), and the outside of the tensioning rollers (16) is in close contact with the scrubbing cloth roll (3).

4. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The cleaning liquid spraying assembly (300) comprises an acid spraying nozzle (4) and a water spraying nozzle (5) which are arranged opposite to each other.

5. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The roller scrubbing assembly comprises a scrubbing roller (6), a driving mechanism three and a lifting cylinder, wherein the driving mechanism three is used to drive the scrubbing roller (6) to rotate; The lifting cylinder is used to lift and lower the driving mechanism three.

6. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The positioning detection mechanism (200) further comprises a pressing block clamp (11), wherein two pressing block clamps (11) are arranged opposite to each other, and the two conveyor belts (8) are located between the two pressing block clamps (11).

7. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The positioning detection mechanism (200) further comprises a positioning block (15), wherein the positioning block (15) is arranged between the two conveyor belts (8), and a driving mechanism 1 is arranged at the bottom of the positioning block (15), wherein the driving mechanism 1 is used to drive the positioning block (15) to rise and fall.

8. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: The vacuum platform (9) is evenly distributed with vacuum suction cups (10); A second driving mechanism is provided at the bottom of the vacuum platform (9), and the second driving mechanism is used to drive the vacuum platform (9) to rise and fall.

9. The back side cleaning device of a copper indium gallium selenide thin film solar cell according to claim 1, characterized in that: Two cylinders are arranged between the two wiping mechanisms (100), and the output ends of the two cylinders are respectively connected to the two wiping mechanisms (100).

10. A cleaning method for a back side cleaning device of a copper indium gallium selenide thin film solar cell according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: S1, the two wiping mechanisms (100) are opened under the action of the cylinder, the motor (1) drives the retracting roller (13) to pull out the scrubbing cloth roll (3) and place it under the cleaning liquid spraying assembly (300), and the pure water sprayed by the water spray nozzle (5) and the weak acid solution sprayed by the acid spray nozzle (4) are respectively dripped onto the scrubbing cloth roll (3), forming a circular area; S2, the substrate (17) to be processed is transported via the conveyor belt (8), and after the positioning sensor (14) receives the position of the substrate (17) to be processed and reaches above the scrubbing cloth roll (3), the conveyor belt (8) stops transporting, the positioning block (15) is lifted, the vacuum platform (9) rises, the vacuum platform (10) absorbs the glass surface of the substrate (17) to be processed, and the block clamps (11) on both sides press down to clamp and fix the substrate (17) to be processed; S3, the two wiping mechanisms (100) are retracted and moved inwardly to the bottom of the substrate to be processed (17) under the action of the cylinder, the ascending cylinder drives the scrubbing roller (6) to lift the circular area on the scrubbing cloth roll (3) upward, and the driving mechanism three drives the scrubbing roller (6) to rotate and wipe the small hole at the center of the edge of the substrate to be processed (17). After the wiping is completed, the ascending cylinder retracts and the scrubbing roller (6) falls to the origin position; S4, the motor (1) drives the retracting roller (13), pulls the scrubbing cloth roll (3) to rotate, moves the dry cloth roll to the small hole at the center of the edge of the substrate (17) to be processed, and the lifting cylinder drives the scrubbing roller (6) to rise and lift up the dry scrubbing cloth roll (3) to rotate and wipe. After wiping is completed, the lifting cylinder retracts and the scrubbing roller (6) falls to the original position; S5, the motor (1) drives the retracting roller (13), pulls the scrubbing cloth roll (3) to rotate, moves the cleaning cloth roll dripped with pure water to the small hole at the center of the edge of the substrate (17) to be processed, and the rising cylinder drives the scrubbing roller (6) to raise the wiping head and lift up the scrubbing cloth roll (3) to repeat the previous wiping action. After the wiping is completed, the rising cylinder retracts and the scrubbing roller (6) falls to the original position; S6, the motor (1) drives the retracting roller (13), pulls the scrubbing cloth roll (3) to rotate, moves the dry cloth roll to the small hole at the edge of the substrate (17) to be processed, and the lifting cylinder drives the scrubbing roller (6) to rise and lift up the cleaning cloth roll to repeat the previous wiping action. After the wiping is completed, the lifting cylinder retracts and the scrubbing roller (6) falls to the original position; S7, the wiping mechanism (100) opens outward under the action of the cylinder, the resistance testing device (7) moves to the bottom of the small hole, the resistance testing device (7) rises, and is placed close to the small hole at the center of the edge of the substrate to be processed (17) after wiping to perform power-on detection, the resistance at the small hole at the center of the edge of the substrate to be processed (17) after wiping is tested, and the test result is output. After the test is completed, the resistance testing device (7) falls to the origin; S8. After the inspection is completed, the positioning block (15) falls down, the clamps (11) on both sides open, the vacuum adsorption platform (9) breaks the vacuum and descends, and the substrate to be processed (17) after inspection falls on the conveyor belt (8) and continues to be transferred to the next process.

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