Grinding method and device, electronic equipment and storage medium

Abstract

The invention discloses a grinding method and device, electronic equipment and a storage medium. The method comprises the steps that a preset grinding file of a to-be-ground object is obtained, wherein the preset grinding file comprises the initial thickness and the target thickness of the to-be-ground object; under the condition that it is determined that the current grinding operation can be executed, the stage target thickness of each grinding stage point is reversely calculated according to the initial thickness, the target thickness and a preset grinding amount parameter; and grinding the to-be-ground object according to the stage target thickness of each grinding stage point. According to the technical scheme, the manual dependence is reduced, the modification complexity is reduced to a certain extent, and the modification accuracy is improved.

Description

Technical Field

[0001] The present invention relates to the field of grinding technology, and in particular to a grinding method, a grinding device, an electronic device and a storage medium. Background Art

[0002] If the target thickness of each stage of the grinding formula is modified manually, problems are likely to occur (such as the target thickness of the previous grinding stage is smaller than the target thickness of the next grinding stage), and the changes are large. Therefore, manual modification is prone to complex modifications and errors. Summary of the invention

[0003] The present invention provides a grinding method, device, electronic device and storage medium to solve the problem that the target thickness is easily complicated and prone to errors in the manual modification stage, reduce manual dependence, reduce the complexity of modification to a certain extent and improve the accuracy of modification.

[0004] According to one aspect of the present invention, there is provided a grinding method, the method comprising:

[0005] Acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0006] When it is determined that the current grinding operation is executable, reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter;

[0007] The object to be ground is ground according to the stage target thickness at each grinding stage point.

[0008] According to another aspect of the present invention, there is provided a grinding device, the device comprising:

[0009] A grinding file acquisition module, used to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0010] a stage target thickness calculation module, for reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and a preset grinding amount parameter when determining that the current grinding operation is executable;

[0011] The grinding operation execution module is used to grind the object to be ground according to the stage target thickness of each grinding stage point.

[0012] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0013] at least one processor; and

[0014] a memory communicatively connected to the at least one processor; wherein,

[0015] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the grinding method described in any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to implement the grinding method described in any embodiment of the present invention when executed by a processor.

[0017] The technical solution of the embodiment of the present invention is to obtain a preset grinding file of the object to be ground, wherein the preset grinding file includes the initial thickness and target thickness of the object to be ground; when it is determined that the current grinding operation is executable, the stage target thickness of each grinding stage point is reversely calculated according to the initial thickness, the target thickness and the preset grinding amount parameters; the object to be ground is ground according to the stage target thickness of each grinding stage point, and a technical means of automatically reversely calculating the stage target thickness is adopted, which solves the problem of the prior art that manual modification of the stage target thickness is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0018] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A flow chart of a grinding method provided in Embodiment 1 of the present invention;

[0021] Figure 2 A schematic diagram of setting a grinding amount parameter provided in the first embodiment of the present invention;

[0022] Figure 3 A schematic diagram of the application process of a grinding method is provided for this embodiment;

[0023] Figure 4 A schematic structural diagram of a grinding device provided in Embodiment 2 of the present invention;

[0024] Figure 5 It is a schematic diagram of the structure of an electronic device for implementing the grinding method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] Embodiment 1

[0028] Figure 1 This is a flow chart of a grinding method provided in the first embodiment of the present invention. This embodiment is applicable to the case of grinding an object to be ground. The method can be performed by a grinding device. The grinding device can be implemented in the form of hardware and / or software. The grinding device can be configured in the controller of the grinding device. Figure 1 As shown, the method includes:

[0029] S110, obtaining a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground.

[0030] Among them, the object to be ground may refer to an industrial component that needs to be ground. The preset grinding file may be a file containing a grinding recipe pre-designed for the object to be ground, and the grinding recipe may refer to a grinding plan. The initial thickness of the object to be ground may refer to the original thickness of the object to be ground before the grinding operation is performed. The target thickness of the object to be ground may refer to the final thickness of the object to be ground after all grinding operations are performed according to the grinding requirements. Exemplarily, the current grinding requirement is to grind object 1 from 1000um to 500um, then 1000um is the initial thickness of object 1, and 500um is the target thickness of object 1.

[0031] In this embodiment, before the grinding operation is planned for the object to be ground, a grinding file designed in advance for the object to be ground can be loaded first, and the initial thickness and target thickness of the current object to be ground can be read from the grinding file.

[0032] S120. When it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameters.

[0033] The preset grinding amount parameter may refer to a grinding amount parameter value set for a certain grinding stage on the grinding device. Figure 2 The grinding operation may include coarse grinding and fine grinding, wherein the coarse grinding operation may include the grinding amount of the P1-P2 stage and the grinding amount of the p2-P3 stage, and the fine grinding operation may include the grinding amount of the P1-P2 stage, the grinding amount of the p2-P3 stage, and the total grinding amount of the fine grinding stage. Figure 2 The grinding amount of the P1-P2 stage of the medium-coarse grinding operation is 50um, the grinding amount of the P2-P3 stage is 30um, the grinding amount of the P1-P2 stage of the fine grinding operation is 15um, the grinding amount of the P2-P3 stage is 8um, and the total grinding amount of the fine grinding stage is 30um can be preset grinding amount parameters. Each grinding stage point can be the starting time point and the ending time point of the grinding stage, refer to Figure 2 , P1, P2, and P3 are the grinding stage points. The stage target thickness can refer to the thickness of the object to be ground at the end time of the grinding stage, for example Figure 2 In the rough grinding operation, the thickness of the object to be ground corresponding to the P2 stage point is the stage target thickness of the P1-P2 stage, and the thickness of the object to be ground corresponding to the P3 stage point is the stage target thickness of the P2-P3 stage.

[0034] Since the grinding parameters cannot be completely limited in the actual grinding process, such as the stage before the PI stage point, the preset grinding amount parameters involved in this embodiment can be part of the grinding amount parameters in the complete grinding process. In order to meet the grinding requirements of the target thickness after the grinding is completed, the stage target thickness of each grinding stage point can be reversely calculated when it is determined that the current grinding operation corresponding to the current preset grinding file and the preset grinding amount parameters is executable, so as to perform grinding according to the stage target thickness.

[0035] In one case, determining that the current grinding operation is executable may include: determining a theoretical total grinding amount of the object to be ground based on an initial thickness and a target thickness; calculating an actual planned stage grinding amount based on preset grinding amount parameters, and determining an actual planned total grinding amount of the object to be ground based on the actual planned stage grinding amount; and determining that the current grinding operation of the object to be ground is executable when the theoretical total grinding amount is greater than or equal to the actual planned total grinding amount.

[0036] The theoretical grinding amount may refer to the total grinding amount of the object to be ground corresponding to the grinding requirement, that is, the theoretical grinding amount may be determined by the difference between the initial thickness and the target thickness of the object to be ground. The actual planned stage grinding amount may refer to the planned grinding amount of the rough grinding stage and the planned grinding amount of the fine grinding stage. The actual planned total grinding amount may refer to the sum of the planned grinding amount of the rough grinding stage and the planned grinding amount of the fine grinding stage.

[0037] For example, the initial thickness of the object to be ground is 1000um, and the target thickness is 500um. The theoretical total grinding amount is 500um. Figure 2 The planned grinding amount in the rough grinding stage can be 50+30=80um, and the planned grinding amount in the fine grinding stage can be 30um. The actual planned total grinding amount can refer to 80+30=110um. In this case, the theoretical total grinding amount > the actual planned total grinding amount. Therefore, the actual grinding plan is executable, and it can be determined that the current grinding operation of the object to be ground is executable.

[0038] Based on the above situation, the method may further include, when the theoretical total grinding amount is less than the actual planned total grinding amount, determining that the current grinding operation of the object to be ground is executable.

[0039] For example, if the initial thickness of the object to be ground is 1000um and the target thickness is 900um, the theoretical total grinding amount is 100um. Figure 2 The actual planned total grinding amount is 110um. In this case, the theoretical total grinding amount < the actual planned total grinding amount. If grinding is performed according to the actual planned total grinding amount, the target thickness of the object to be ground will be less than 900um. Therefore, the actual grinding plan is not executable, and it can be determined that the current grinding operation of the object to be ground is not executable.

[0040] In another case, determining that the current grinding operation is executable may include: calculating the grinding amount of the specified stage of fine grinding based on the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters; and determining that the current grinding operation of the object to be ground is executable when the grinding amount of the specified stage of fine grinding is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameters.

[0041] refer to Figure 2 The grinding amount of the third stage of fine grinding can refer to the grinding amount of 8um in the P2-P3 stage, the grinding amount of the second stage of fine grinding can refer to the grinding amount of 15um in the P1-P2 stage, and the grinding amount of the specified stage of fine grinding can refer to 15+8=23um. In this case, 23um<30um, then the grinding amount of the specified stage of fine grinding is less than the total grinding amount of the fine grinding operation, and the remaining grinding space can be reserved for the stage between the fine grinding points P1. Therefore, the grinding operation in this case is executable, and it can be determined that the current grinding operation of the object to be ground is executable.

[0042] Based on the above another situation, it may also include that when the grinding amount in the specified stage of fine grinding is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.

[0043] For example, if Figure 2 The grinding amount in the specified stage of medium fine grinding is 15+8=23um, and the total grinding amount of the fine grinding operation is 20um. At this time, 23um>20um. The grinding operation in this case is not executable, so it can be determined that the current grinding operation of the object to be ground is not executable.

[0044] In an optional embodiment, reverse calculating the stage target thickness of each grinding stage point based on the initial thickness, the target thickness and the preset grinding amount parameters can include: reverse calculating the stage target thickness of the fourth stage point of the fine grinding operation, the stage target thickness of the third stage point, the stage target thickness of the second stage point, the stage target thickness of the first stage point and the grinding amount of the first stage of fine grinding based on the initial thickness, the target thickness and the total grinding amount of the fine grinding operation, the third stage grinding amount of the fine grinding and the second stage grinding amount of the fine grinding in the preset grinding amount parameters; reverse calculating the stage target thickness of the fourth stage point of the rough grinding operation, the stage target thickness of the third stage point, the stage target thickness of the second stage point and the grinding amount of the first stage of rough grinding based on the stage target thickness of the first stage point in the fine grinding operation, the third stage grinding amount of rough grinding and the second stage grinding amount of rough grinding in the preset grinding amount parameters.

[0045] In this embodiment, reference Figure 2For example, the initial thickness of the object to be ground is 1000um, and the target thickness is 500um. The target thickness of the fine grinding operation P3 stage point can be determined as 500um according to the target thickness. The target thickness of the P2 stage point can be further determined as 508um based on the third stage grinding amount of fine grinding. The target thickness of the P1 stage point can be determined as 523um based on the second stage grinding amount of fine grinding. The target thickness of the first stage grinding amount of fine grinding (i.e., the fine grinding stage before the P1 stage point) can be determined as 7um based on the total grinding amount of the fine grinding operation. The target thickness of the first stage grinding point (P0 stage point) is 530um.

[0046] refer to Figure 2 According to the target thickness of the fine grinding PO stage point, the stage target thickness of the rough grinding P3 stage point is determined to be 530um, and further combined with the rough grinding third stage grinding amount, the stage target thickness of the rough grinding P2 stage point is determined to be 560um, and further combined with the rough grinding second stage grinding amount, the stage target thickness of the rough grinding P1 stage point is determined to be 610um, and further combined with the initial thickness of the object to be ground, the rough grinding first stage grinding amount (i.e., the rough grinding stage before the rough grinding PI point) is determined to be 390um.

[0047] S130, grinding the object to be ground according to the target thickness of each grinding stage point.

[0048] In this embodiment, the object to be ground can be ground according to the stage target thickness, the first stage grinding amount of rough grinding and the first stage grinding amount of fine grinding at each grinding stage point in the above examples.

[0049] Optionally, when it is determined that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and a preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

[0050] In order to enable those skilled in the art to better understand the grinding method of this embodiment, Figure 3 A schematic diagram of the application process of a grinding method is provided for this embodiment. The grinding file is loaded to determine whether the grinding amount and the initial thickness and target thickness of the object to be ground are legal (i.e., whether they are executable). If legal, the stage target thickness of each stage point can be reversely calculated, and the calculated stage target thickness can be displayed on the interface of the grinding device, and the grinding operation can be performed according to the stage target thickness; if illegal, it can be marked as unable to grind, and the grinding file can be switched back to determine whether it is legal. After marking that grinding is impossible, the grinding amount, initial thickness or target thickness can be modified and determined whether it is legal.

[0051] The technical solution of the present embodiment is to obtain a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; when it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameters; grind the object to be ground according to the stage target thickness of each grinding stage point, and adopt a technical means of automatically reversely calculating the stage target thickness, thereby solving the problem of the prior art that manual modification of the stage target thickness is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0052] Embodiment 2

[0053] Figure 4 This is a schematic diagram of the structure of a grinding device provided in the second embodiment of the present invention. Figure 3 As shown, the device includes: a grinding file acquisition module 210, a stage target thickness calculation module 220 and a grinding operation execution module 230. Among them:

[0054] A grinding file acquisition module 210, for acquiring a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0055] The stage target thickness calculation module 220 is used to reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter when determining that the current grinding operation is executable;

[0056] The grinding operation execution module 230 is used to grind the object to be ground according to the stage target thickness of each grinding stage point.

[0057] The technical solution of the present embodiment is to obtain a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; when it is determined that the current grinding operation is executable, reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameters; grind the object to be ground according to the stage target thickness of each grinding stage point, and adopt a technical means of automatically reversely calculating the stage target thickness, thereby solving the problem of the prior art that manual modification of the stage target thickness is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0058] Optionally, the stage target thickness calculation module 220 includes a first executable judgment unit, which is used to:

[0059] Determining a theoretical total grinding amount of the object to be ground according to the initial thickness and the target thickness;

[0060] Calculating the actual planned stage grinding amount according to the preset grinding amount parameter, and determining the actual planned total grinding amount of the object to be ground according to the actual planned stage grinding amount;

[0061] In a case where the theoretical total grinding amount is greater than or equal to the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

[0062] Optionally, the stage target thickness calculation module 220 further includes a first unexecutable judgment unit, which is used to:

[0063] In a case where the theoretical total grinding amount is less than the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

[0064] Optionally, the stage target thickness calculation module 220 includes a second executable judgment unit, which is used to:

[0065] Calculating the grinding amount of a specified stage of fine grinding according to the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters;

[0066] When the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is executable.

[0067] Optionally, the stage target thickness calculation module 220 further includes a second unexecutable judgment unit, which is used to:

[0068] In a case where the grinding amount in the specified fine grinding stage is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.

[0069] Optionally, the stage target thickness calculation module 220 may be specifically used for:

[0070] According to the initial thickness, the target thickness and the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters, reversely calculate the stage target thickness at the fourth stage point of the fine grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, the stage target thickness at the first stage point and the grinding amount of the first stage of fine grinding;

[0071] According to the stage target thickness at the first stage point in the fine grinding operation, the third stage grinding amount of rough grinding, and the second stage grinding amount of rough grinding in the preset grinding amount parameters, the stage target thickness at the fourth stage point of the rough grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, and the first stage grinding amount of rough grinding are reversely calculated.

[0072] Optionally, the grinding device further includes an operation return execution module, which is used to:

[0073] In the case of determining that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and the preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

[0074] The grinding device provided in the embodiment of the present invention can execute the grinding method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0075] Embodiment 3

[0076] Figure 5 A schematic diagram of the structure of an electronic device 300 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0077] like Figure 5 As shown, the electronic device 300 includes at least one processor 301, and a memory connected to the at least one processor 301, such as a read-only memory (ROM) 302, a random access memory (RAM) 303, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 301 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 302 or the computer program loaded from the storage unit 308 to the random access memory (RAM) 303. In the RAM 303, various programs and data required for the operation of the electronic device 300 can also be stored. The processor 301, the ROM 302, and the RAM 303 are connected to each other via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0078] A number of components in the electronic device 300 are connected to the I / O interface 305, including: an input unit 306, such as a keyboard, a mouse, etc.; an output unit 307, such as various types of displays, speakers, etc.; a storage unit 308, such as a disk, an optical disk, etc.; and a communication unit 309, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 309 allows the electronic device 300 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0079] The processor 301 may be a variety of general and / or dedicated processing components with processing and computing capabilities. Some examples of the processor 301 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 301 performs the various methods and processes described above, such as a grinding method.

[0080] In some embodiments, the grinding method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 308. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 300 via the ROM 302 and / or the communication unit 309. When the computer program is loaded into the RAM 303 and executed by the processor 301, one or more steps of the grinding method described above may be performed. Alternatively, in other embodiments, the processor 301 may be configured to perform the grinding method in any other appropriate manner (e.g., by means of firmware).

[0081] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0082] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0083] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0084] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0085] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0086] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0087] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0088] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A grinding method, characterized in that: include: Acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; When it is determined that the current grinding operation is executable, reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter; The object to be ground is ground according to the stage target thickness at each grinding stage point.

2. The method according to claim 1, characterized in that Determine that the current grinding operation is executable, including: Determining a theoretical total grinding amount of the object to be ground according to the initial thickness and the target thickness; Calculating the actual planned stage grinding amount according to the preset grinding amount parameter, and determining the actual planned total grinding amount of the object to be ground according to the actual planned stage grinding amount; In a case where the theoretical total grinding amount is greater than or equal to the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

3. The method according to claim 2, characterized in that Also includes: In a case where the theoretical total grinding amount is less than the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

4. The method according to claim 1, characterized in that: Determine that the current grinding operation is executable, including: Calculating the grinding amount of a specified stage of fine grinding according to the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters; When the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is executable.

5. The method according to claim 4, characterized in that Also includes: In a case where the grinding amount in the specified fine grinding stage is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.

6. The method according to claim 1, characterized in that Reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter, including: According to the initial thickness, the target thickness and the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters, reversely calculate the stage target thickness at the fourth stage point of the fine grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, the stage target thickness at the first stage point and the grinding amount of the first stage of fine grinding; According to the stage target thickness at the first stage point in the fine grinding operation, the third stage grinding amount of rough grinding, and the second stage grinding amount of rough grinding in the preset grinding amount parameters, the stage target thickness at the fourth stage point of the rough grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, and the first stage grinding amount of rough grinding are reversely calculated.

7. The method according to claim 3 or 5, characterized in that: Also includes: In the case of determining that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and the preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

8. A grinding device, characterized in that: include: A grinding file acquisition module, used to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; a stage target thickness calculation module, for reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and a preset grinding amount parameter when determining that the current grinding operation is executable; The grinding operation execution module is used to grind the object to be ground according to the stage target thickness of each grinding stage point.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the grinding method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the grinding method according to any one of claims 1 to 7 when executed.

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