High-low voltage integrated sensor

Abstract

The invention provides a high and low pressure integrated sensor which comprises a shell, a high pressure sensing element, a low pressure sensing element and a connector capable of being electrically connected with an external circuit. The shell is provided with a first medium hole allowing an external high-pressure medium to flow to the high-pressure pressure sensing element and a second medium hole allowing an external low-pressure medium to flow to the low-pressure pressure sensing element, and the high-pressure pressure sensing element and the low-pressure pressure sensing element are both electrically connected with the connector. The high-pressure sensor and the low-pressure sensor are integrated, pressure detection of a high-pressure medium and pressure detection of a low-pressure medium can be carried out at the same time, and use is more convenient. The high-voltage sensor and the low-voltage sensor are integrated, the occupied space is small, the space utilization rate of a user side is improved, the use amount of parts such as a shell, a circuit board, a wire harness and an electrical connector is reduced, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure sensors, and in particular to a high-low pressure integrated sensor. Background Art

[0002] Sensor technology is one of the important technologies of modern measurement and automation systems. From production process control to modern technological life, almost every technology is inseparable from sensors. Ceramic capacitive pressure sensor is a common type of pressure sensor with a wide pressure range and a wide range of applications. It is widely used in automobiles, home appliances, industry and other fields. With the increasing demand for integrated and miniaturized pressure sensors, the application prospects of integrated integrated pressure sensors are becoming more and more broad.

[0003] At present, a high-pressure sensor is used to measure the pressure of a high-pressure medium, and a low-pressure sensor is used to measure the pressure of a low-pressure medium. This is inconvenient to use, occupies a lot of space, and has a high production cost. Therefore, it is necessary to design a high-low pressure integrated sensor that integrates the high-pressure sensor and the low-pressure sensor into one, which occupies a small space, has a low production cost, and can detect the pressure of the high-pressure medium and the pressure of the low-pressure medium at the same time. Summary of the invention

[0004] The purpose of the present invention is to overcome the defects of the prior art and provide a high and low pressure integrated sensor. The present invention at least solves some of the problems in the prior art.

[0005] The present invention is achieved in that:

[0006] The present invention provides a high-low pressure integrated sensor, comprising a shell, a high-pressure pressure sensing element, a low-pressure pressure sensing element, and a connector electrically connected to an external circuit. The connector and the shell enclose a receiving cavity. The shell is provided with a first medium hole for external high-pressure medium to flow to the high-pressure pressure sensing element, and a second medium hole for external low-pressure medium to flow to the low-pressure pressure sensing element. The high-pressure pressure sensing element and the low-pressure pressure sensing element are both electrically connected to the connector.

[0007] Furthermore, the high-low pressure integrated sensor also includes a circuit board, which is arranged in the accommodating cavity, and the high-pressure sensing element and the low-pressure sensing element are both electrically connected to the circuit board, and the circuit board is electrically connected to the connector.

[0008] Furthermore, the high and low pressure integrated sensor also includes a support member, and the support member and the circuit board are arranged in sequence in the receiving cavity along the direction from the shell to the connector. The support member is provided with a first receiving groove and a second receiving groove at one end facing the circuit board, the high-pressure pressure sensing element is located in the first receiving groove, and the low-pressure pressure sensing element is located in the second receiving groove. The support member is provided with a third medium hole for external high-pressure medium to flow to the high-pressure pressure sensing element, and a fourth medium hole for external low-pressure medium to flow to the low-pressure pressure sensing element, the first medium hole is connected to the third medium hole, and the second medium hole is connected to the fourth medium hole.

[0009] Furthermore, the connector is fixedly connected to the support member.

[0010] Furthermore, the high and low voltage integrated sensor also includes an electrical connector that facilitates electrical connection with an external circuit. The connector is provided with a plurality of pins, one end of the pins is electrically connected to the circuit board, and the other end of the pins is electrically connected to the electrical connector through a wiring harness.

[0011] Furthermore, the high and low pressure integrated sensor also includes a packaging shell, which is sleeved on an end of the connector away from the support member, and the welding point between the pin and the wiring harness is located in the packaging shell, and the packaging shell is filled with potting glue.

[0012] Furthermore, the packaging shell is fixed to the connector by snap-fitting.

[0013] Furthermore, the circuit board is a flexible circuit board, including a first partition board electrically connected to the connector, a second partition board electrically connected to the high-pressure pressure sensing element, and a third partition board electrically connected to the low-pressure pressure sensing element. The first partition board, the second partition board, and the third partition board are integrally formed, and the second partition board and the third partition board are both located below the first partition board.

[0014] Furthermore, the high-low pressure integrated sensor also includes a first copper tube for high-pressure medium to flow in and a second copper tube for low-pressure medium to flow in, the first copper tube and the second copper tube are both plugged into the end of the shell away from the connector, the first medium hole is connected to the first copper tube, and the second medium hole is connected to the second copper tube.

[0015] Furthermore, the housing and the connector are fixed by riveting.

[0016] The present invention has the following beneficial effects:

[0017] 1. The present invention provides a high-low pressure integrated sensor, which integrates a high-pressure sensor and a low-pressure sensor into one, and can simultaneously perform pressure detection of high-pressure media and pressure detection of low-pressure media, which is more convenient to use.

[0018] 2. The present invention provides a high-low pressure integrated sensor, which integrates a high-pressure sensor and a low-pressure sensor into one, occupies a small space, improves the space utilization rate at the user end, reduces the use of components such as housings, circuit boards, wiring harnesses, electrical connectors, and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 An exploded diagram of a high and low pressure integrated sensor provided in an embodiment of the present invention;

[0021] Figure 2 A cross-sectional view of a high-low pressure integrated sensor provided by an embodiment of the present invention;

[0022] Figure 3 A schematic diagram of a support member provided by an embodiment of the present invention;

[0023] Figure 4 A schematic diagram of a circuit board provided in an embodiment of the present invention.

[0024] In the figure: 1-copper tube; 2-shell; 3-first sealing member; 4-support member; 5-second sealing member; 6-high-pressure pressure sensing element; 7-low-pressure pressure sensing element; 8-circuit board; 9-connector; 10-encapsulation shell; 11-wiring harness; 12-electrical connector; 13-potting glue; 14-first medium hole; 15-second medium hole; 16-third medium hole; 17-fourth medium hole; 18-positioning protrusion. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present invention, unless otherwise specified, "several" means two or more.

[0028] like Figure 1-Figure 4 , an embodiment of the present invention provides a high-low pressure integrated sensor, including a housing 2, a high-pressure pressure sensing element 6, a low-pressure pressure sensing element 7, a support member 4, a circuit board 8, and a connector 9 that can be electrically connected to an external circuit, wherein the connector 9 and the housing 2 enclose a receiving cavity, the support member 4 and the circuit board 8 are sequentially arranged in the receiving cavity along the direction from the housing 2 to the connector 9, the support member 4 is provided with a first receiving groove and a second receiving groove at one end facing the circuit board 8, the high-pressure pressure sensing element 6 is located in the first receiving groove, the low-pressure pressure sensing element 7 is located in the second receiving groove, and the housing 2 is provided with a groove for external high-pressure medium to flow to the high-pressure pressure sensing element The support member 4 is provided with a first medium hole 14 for external low-pressure medium to flow to the low-pressure pressure sensing element 7, and a second medium hole 15 for external low-pressure medium to flow to the low-pressure pressure sensing element 7. The support member 4 is provided with a third medium hole 16 for external high-pressure medium to flow to the high-pressure pressure sensing element 6, and a fourth medium hole 17 for external low-pressure medium to flow to the low-pressure pressure sensing element 7. The first medium hole 14 is connected to the third medium hole 16 correspondingly, and the second medium hole 15 is connected to the fourth medium hole 17 correspondingly. The high-pressure pressure sensing element 6 and the low-pressure pressure sensing element 7 are both electrically connected to the circuit board 8 through a wiring harness, and transmit high-pressure medium pressure signals and low-pressure medium pressure signals to the circuit board 8 respectively. The circuit board 8 is electrically connected to the connector 9.

[0029] The present invention provides a high-low pressure integrated sensor, which integrates a high-pressure sensor and a low-pressure sensor into one, and can simultaneously perform pressure detection of a high-pressure medium and a low-pressure medium, which is more convenient to use.

[0030] The present invention provides a high-low pressure integrated sensor, which integrates a high-pressure sensor and a low-pressure sensor into one, occupies a small space, improves the space utilization rate at the user end, reduces the use of components such as housings, circuit boards, wiring harnesses, electrical connectors, and reduces costs.

[0031] like Figure 3 As shown, the end of the support member 4 facing away from the circuit board 8 is provided with a positioning protrusion 18, and the inner wall of the housing 2 is provided with a positioning groove that cooperates with the positioning protrusion 18. In this embodiment, the positioning protrusion is square, and the positioning groove is a square groove. The positioning protrusion 18 cooperates with the positioning groove in the housing 2 to fix the assembly orientation between the support member 4 and the housing 2, and prevents the problem of leakage caused by the misalignment of the medium holes of the housing 2 and the support member 4. Figure 3 As shown, the third medium hole 16 and the fourth medium hole 17 are respectively located on both sides of the positioning protrusion 18.

[0032] like Figure 2 As shown, a first sealing groove and a second sealing groove are provided on the inner wall of the shell 2, and the first sealing groove and the second sealing groove are respectively located on both sides of the positioning groove. The first sealing groove is arranged around the first medium hole 14, and the second sealing groove is arranged around the second medium hole 15. The first sealing groove and the second sealing groove are both provided with a first sealing member 3.

[0033] like Figure 2 As shown, the first receiving groove and the second receiving groove of the support member 4 are both provided with a second sealing member 5, and the second sealing member 5 is provided on the side of the high-pressure sensing element 6 and the low-pressure sensing element 7 away from the circuit board 8. Figure 2-Figure 3 The first seal 3 and the second seal 5 ensure that the external medium can only enter the pressure sensing ends of the high pressure sensing element 6 and the low pressure sensing element 7 after entering the sensor, and will not overflow to the electrical connection part of the sensor.

[0034] like Figure 2 As shown, the side of the high-pressure pressure sensing element 6 away from the circuit board 8 is the sensing end of the high-pressure pressure sensing element 6, and the external high-pressure medium flows to the sensing end of the high-pressure pressure sensing element 6 through the first medium hole 14 and the third medium hole 16; the side of the low-pressure pressure sensing element 7 away from the circuit board 8 is the sensing end of the low-pressure pressure sensing element 7, and the external high-pressure medium flows to the sensing end of the low-pressure pressure sensing element 7 through the second medium hole 15 and the fourth medium hole 17.

[0035] like Figure 2As shown, the high-pressure pressure sensing element 6 and the low-pressure pressure sensing element 7 are both arranged in the receiving groove of the support member 4, and the structure is more compact, which reduces the overall size of the sensor, and the pressure sensing end of the pressure sensing element is in contact with the second sealing member 5, and the second sealing member 5 is made of rubber material. In the process of the high-pressure pressure sensing element 6, the low-pressure pressure sensing element 7 and the second sealing member 5 being squeezed to form a sealing force, the pressure sensing ends of the high-pressure pressure sensing element 6 and the low-pressure pressure sensing element 7 will not be affected, and the product accuracy will not be offset. In this embodiment, the cross-section of the second sealing member 5 is rectangular, and the rectangular sealing ring has the advantages of good stability and strong anti-extrusion performance, and the high-pressure pressure sensing element 6 and the low-pressure pressure sensing element 7 can be placed stably.

[0036] like Figure 1-Figure 3 As shown, in this embodiment, the connector 9 is fixedly connected with the support member 4, and the connector 9 and the support member 4 are installed in the housing 2 as a whole. Figure 3 As shown, the support member 4 is designed with two limit structures, which can cooperate with the guide buckle of the connector 9 to combine the connector 9, the circuit board 8, the low-pressure pressure sensing element 7, the high-pressure pressure sensing element 6 and the support member 4 into a whole, which is convenient and efficient to assemble.

[0037] like Figure 2 As shown, in this embodiment, the housing 2 and the connector 9 are fixed by riveting. Figure 2 As shown, the connector 9 is provided with an inner cavity for accommodating the circuit board 8 on one side facing the support member 4 .

[0038] like Figure 1-Figure 2 As shown, in this embodiment, the high and low pressure integrated sensor also includes an electrical connector 12 for facilitating electrical connection with an external circuit. The connector 9 is provided with a plurality of pins, one end of the pins is electrically connected to the circuit board 8, and the other end of the pins is electrically connected to the electrical connector 12 through a wiring harness 11 to transmit the pressure signal of the high-pressure medium and the pressure signal of the low-pressure medium.

[0039] like Figure 1-Figure 2 As shown, the high and low pressure integrated sensor also includes a packaging shell 10, which is sleeved on the end of the connector 9 away from the support member 4, and the welding point between the pin and the wiring harness 11 is located in the packaging shell 10. The packaging shell 10 is filled with potting glue 13, and the potting glue 13 wraps the welding point between the pin and the wiring harness 11 to prevent external water vapor from affecting the transmission of electrical signals and improve product stability.

[0040] In this embodiment, the packaging shell 10 is fixed to the connector 9 by snapping.

[0041] In this embodiment, the circuit board 8 is a flexible circuit board, including a first partition board electrically connected to the pin, a second partition board electrically connected to the high-pressure sensing element 6, and a third partition board electrically connected to the low-pressure sensing element 7. The first partition board, the second partition board, and the third partition board are integrally formed, and the second partition board and the third partition board are both located below the first partition board. Figure 4 As shown, in this embodiment, the first partition plate, the second partition plate, and the third partition plate are all circular plate structures. The present invention uses a flexible circuit board to simultaneously process and transmit the high-voltage signal detected by the high-voltage pressure sensing element 6 and the low-voltage signal detected by the low-voltage pressure sensing element 7. The flexible circuit board is made of PI material, has high reliability, excellent flexibility, high wiring density, light weight, thin thickness, and good bending characteristics. During the assembly process, the connection parts can be bent at will without affecting the performance.

[0042] like Figure 1-Figure 2 As shown, the high-low pressure integrated sensor further includes a first copper tube for high-pressure medium to flow in and a second copper tube for low-pressure medium to flow in. The first copper tube and the second copper tube are both plugged into the end of the housing 2 away from the connector 9. The first medium hole 14 is connected to the first copper tube, and the second medium hole 15 is connected to the second copper tube. Figure 1-Figure 2 As shown, one end of the shell 2 is an open cavity structure, and the other end of the shell 2 is a flat structure with two grooves connected to the two copper tubes 1.

[0043] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0044] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high and low pressure integrated sensor, characterized in that: It includes a shell, a high-pressure pressure sensing element, a low-pressure pressure sensing element, and a connector that can be electrically connected to an external circuit. The connector and the shell enclose a receiving cavity. The shell is provided with a first medium hole for external high-pressure medium to flow to the high-pressure pressure sensing element, and a second medium hole for external low-pressure medium to flow to the low-pressure pressure sensing element. The high-pressure pressure sensing element and the low-pressure pressure sensing element are both electrically connected to the connector.

2. The high and low pressure integrated sensor according to claim 1, characterized in that: It also includes a circuit board, which is arranged in the receiving cavity. The high-pressure sensing element and the low-pressure sensing element are both electrically connected to the circuit board, and the circuit board is electrically connected to the connector.

3. The high and low pressure integrated sensor according to claim 2, characterized in that: It also includes a support member, and the support member and the circuit board are arranged in sequence in the receiving cavity along the direction from the shell to the connector. The support member is provided with a first receiving groove and a second receiving groove at one end facing the circuit board, the high-pressure pressure sensing element is located in the first receiving groove, and the low-pressure pressure sensing element is located in the second receiving groove. The support member is provided with a third medium hole for external high-pressure medium to flow to the high-pressure pressure sensing element and a fourth medium hole for external low-pressure medium to flow to the low-pressure pressure sensing element, the first medium hole is connected to the third medium hole, and the second medium hole is connected to the fourth medium hole.

4. The high and low pressure integrated sensor as claimed in claim 3, characterized in that: The connector is clamped and fixed to the support member.

5. The high and low pressure integrated sensor as claimed in claim 3, characterized in that: It also includes an electrical connector that is convenient for electrical connection with an external circuit. The connector is provided with a plurality of pins, one end of the pins is electrically connected to the circuit board, and the other end of the pins is electrically connected to the electrical connector through a wiring harness.

6. The high and low pressure integrated sensor according to claim 5, characterized in that: It also includes a packaging shell, which is sleeved on one end of the connector away from the support member, the welding point between the pin and the wiring harness is located in the packaging shell, and the packaging shell is filled with potting glue.

7. The high and low pressure integrated sensor according to claim 6, characterized in that: The packaging shell is fixedly connected with the connector.

8. The high and low pressure integrated sensor according to claim 2, characterized in that: The circuit board is a flexible circuit board, including a first partition board electrically connected to a connector, a second partition board electrically connected to a high-pressure pressure sensing element, and a third partition board electrically connected to a low-pressure pressure sensing element. The first partition board, the second partition board, and the third partition board are integrally formed, and the second partition board and the third partition board are both located below the first partition board.

9. The high and low pressure integrated sensor according to claim 1, characterized in that: It also includes a first copper tube for high-pressure medium to flow in and a second copper tube for low-pressure medium to flow in. The first copper tube and the second copper tube are both plugged into an end of the shell away from the connector. The first medium hole is connected to the first copper tube, and the second medium hole is connected to the second copper tube.

10. The high and low pressure integrated sensor according to claim 1, characterized in that: The housing and the connector are fixed by riveting.

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