Wafer detection method and wafer detection device

Abstract

The invention provides a wafer detection method and a wafer detection device, and belongs to the technical field of semiconductor manufacturing. The wafer detection device comprises a detection table; the plurality of push rods are arranged on the detection table and configured to bear wafers; the distance induction sensor is arranged between the surface of the detection table and the push rods and is configured to detect whether wafers are carried on the plurality of push rods or not; the controller is configured to receive detection data of the distance induction sensor and control the wafer to rotate when it is judged that the plurality of push rods bear the wafer according to the detection data; and the notch positioning sensor is configured to detect the notch of the wafer when the wafer is rotated. Whether the wafer is placed on the detection table or not can be detected before wafer notch detection, and waste of detection time is effectively prevented.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer detection method and a wafer detection device. Background Art

[0002] Related Technology In the semiconductor manufacturing process, the wafer needs to be placed on the inspection table for wafer notch detection. However, due to wafer size issues, poor teaching parameters, etc., the wafer position on the inspection table may be abnormal, which may easily lead to wafer fragments and waste of detection time. In addition, the wafer may be thrown out during the rotation of the inspection wafer, resulting in wafer fragments, contaminating the inspection equipment and causing the inspection equipment to shut down. In addition, the abnormal wafer position on the inspection table may also cause the inspection equipment to be unable to start the inspection normally, or the robot arm may be unable to transport the wafer normally after the inspection. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a wafer detection method and a wafer detection device, which can check whether the wafer is placed on the detection table before performing wafer notch detection, thereby effectively preventing the waste of detection time.

[0004] In order to achieve the above object, the technical solution adopted by the embodiment of the present invention is:

[0005] A wafer inspection device, comprising:

[0006] Testing bench;

[0007] A plurality of push rods disposed on the inspection table and configured to carry wafers;

[0008] A distance sensing sensor disposed between the surface of the inspection table and the push rods, configured to detect whether the plurality of push rods carry wafers;

[0009] A controller configured to receive detection data from the distance sensing sensor, and control the wafer to rotate when it is determined that the plurality of push rods carry wafers according to the detection data;

[0010] The notch positioning sensor is configured to detect the notch of the wafer when the wafer is rotated.

[0011] In some embodiments, the controller is configured to adjust the position of the wafer on the push rod when the notch positioning sensor does not detect the notch of the wafer.

[0012] In some embodiments, the wafer detection device further includes:

[0013] A pressure sensor disposed on the push rod;

[0014] The controller is configured to determine whether the position of the wafer on the push rod is offset according to the pressure data of the pressure sensor, and adjust the position of the wafer on the push rod according to the pressure data.

[0015] In some embodiments, the wafer detection device further includes:

[0016] An image sensor disposed above the inspection table, configured to obtain a profile of the wafer when it rotates;

[0017] The controller is configured to determine whether the position of the wafer on the push rod is offset according to the image data of the image sensor, and adjust the position of the wafer on the push rod according to the image data.

[0018] In some embodiments, the wafer detection device further includes:

[0019] A driving motor connected to the push rod;

[0020] The controller is configured to control the driving motor to drive the push rod to move when the position of the wafer on the push rod is offset.

[0021] In some embodiments, the wafer detection device further includes:

[0022] A container disposed on the detection table, wherein the plurality of push rods are located in the container;

[0023] A cover plate is arranged opposite to the container, the cover plate matches the opening shape of the container, and the cover plate is configured to move toward the direction approaching the container to cooperate with the opening to form a closed cavity; or to move toward the direction away from the container to open the cavity.

[0024] An embodiment of the present invention further provides a wafer detection method, which is used in the wafer detection device as described above, and the method includes:

[0025] receiving detection data from the distance sensing sensor, and determining whether wafers are carried on the plurality of push rods according to the detection data;

[0026] When it is determined according to the detection data that the plurality of push rods carry wafers, controlling the wafers to rotate;

[0027] When the wafer is rotating, a notch positioning sensor is used to detect the notch of the wafer.

[0028] In some embodiments, the method further comprises:

[0029] It is determined whether the position of the wafer on the push rod is offset according to the pressure data of the pressure sensor, and the position of the wafer on the push rod is adjusted according to the pressure data.

[0030] In some embodiments, the method further comprises:

[0031] It is determined whether the position of the wafer on the push rod is offset according to the image data of the image sensor, and the position of the wafer on the push rod is adjusted according to the image data.

[0032] In some embodiments, the method further comprises:

[0033] When the position of the wafer on the push rod is offset, the driving motor is controlled to drive the push rod to move, so as to adjust the position of the wafer on the push rod.

[0034] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores at least one instruction, and the at least one instruction is used to be executed by a processor to implement the above-mentioned wafer detection method.

[0035] The beneficial effects of the present invention are:

[0036] In the present embodiment, before performing notch detection on the wafer, it is checked whether the wafer is placed on the detection table. After detecting that the wafer is placed on the detection table, the wafer is controlled to rotate for notch detection. This can effectively prevent waste of detection time; and can prevent the wafer from rotating when the position of the wafer is abnormal, thereby preventing the wafer from being fragmented. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 and Figure 2 A schematic diagram showing the structure of a wafer inspection device according to an embodiment of the present invention;

[0038] Figure 3 A schematic diagram showing a flow chart of a wafer inspection method according to an embodiment of the present invention.

[0039] Reference numerals

[0040] 1 Cover

[0041] 2 Cover position sensor

[0042] 3 Image Sensor

[0043] 4 Observation window

[0044] 5notch positioning sensor

[0045] 6 Pressure Sensor

[0046] 7. Testing table

[0047] 8 Distance sensor

[0048] 9 Wafer

[0049] 10. Drive Motor

[0050] 11. Putter

[0051] 12 Controllers DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0053] The present invention provides a wafer detection method and a wafer detection device, which can check whether a wafer is placed on a detection table before performing wafer notch detection, thereby effectively preventing waste of detection time.

[0054] An embodiment of the present invention provides a wafer inspection device, such as Figure 1 and Figure 2 include:

[0055] Testing station 7;

[0056] A plurality of push rods 11 disposed on the inspection table 7 and configured to carry the wafer 9;

[0057] A distance sensing sensor 8 disposed between the surface of the detection table 7 and the push rods 11 is configured to detect whether the plurality of push rods 11 carry wafers 9;

[0058] The controller 12 is configured to receive detection data of the distance sensing sensor 8, and when it is determined according to the detection data that the wafer 9 is carried on the plurality of push rods 11, control the wafer 9 to rotate;

[0059] The notch positioning sensor 5 is configured to detect the notch of the wafer 9 when the wafer 9 rotates.

[0060] In the present embodiment, before performing notch detection of wafer 9, check whether wafer 9 is placed on detection table 7, and then control wafer 9 to rotate after detecting that wafer 9 is placed on detection table 7 to perform notch detection, which can effectively prevent waste of detection time; and can prevent wafer 9 from rotating when the position of wafer 9 is abnormal, thereby preventing wafer 9 from being fragmented.

[0061] In this embodiment, the distance sensing sensor 8 is located between the surface of the detection table 7 and the push rod 11, and the position of the distance sensing sensor 8 can be set as needed. The distance sensing sensor 8 can emit a signal upward. If the push rod 11 carries a wafer 9 and the position of the wafer 9 does not show obvious abnormalities, the wafer 9 will reflect the signal emitted by the distance sensing sensor 8, so that the distance sensing sensor 8 can receive the reflected signal; if the push rod 11 does not carry a wafer 9 or the position of the wafer 9 shows obvious abnormalities, the signal emitted by the distance sensing sensor 8 will not be reflected, so that the distance sensing sensor 8 cannot receive the reflected signal. In the above manner, the controller 12 can determine whether a plurality of push rods 11 carry wafers 9 and whether the position of the wafer 9 shows obvious abnormalities based on the detection data of the distance sensing sensor 8.

[0062] After controlling the wafer 9 to rotate, the notch positioning sensor 5 can detect the notch of the wafer 9. If the notch positioning sensor 5 does not detect the notch of the wafer 9, the position of the wafer 9 may need to be adjusted. The controller 12 is configured to adjust the position of the wafer 9 on the push rod 11 when the notch positioning sensor 5 does not detect the notch of the wafer 9.

[0063] In some embodiments, Figure 2 As shown, the wafer detection device also includes:

[0064] A pressure sensor 6 disposed on the push rod 11;

[0065] The controller 12 is configured to determine whether the position of the wafer 9 on the push rod 11 is offset according to the pressure data of the pressure sensor 6 , and adjust the position of the wafer 9 on the push rod 11 according to the pressure data.

[0066] like Figure 2 As shown, a pressure sensor 6 is provided on each push rod 11. When the wafer 9 rotates, if the wafer 9 deviates toward one of the push rods 11, the centrifugal force of the wafer 9 on the push rod 11 is large, and the pressure value detected by the pressure sensor 6 on the push rod 11 will be greater than the pressure values ​​detected by the pressure sensors 6 on other push rods 11; if the wafer 9 does not deviate, the pressure values ​​detected by the pressure sensors 6 on all the push rods 11 are basically the same. Therefore, the pressure data of the pressure sensor 6 on the push rod 11 can be used to determine whether the position of the wafer 9 on the push rod 11 is deviated, and the deviated direction of the wafer 9 can also be determined.

[0067] In this embodiment, Figure 2 As shown, the wafer detection device may further include:

[0068] The image sensor 3 disposed above the detection platform 7 is configured to obtain the profile of the wafer 9 when it rotates;

[0069] The controller 12 is configured to determine whether the position of the wafer 9 on the push rod 11 is offset according to the image data of the image sensor 3 , and adjust the position of the wafer 9 on the push rod 11 according to the image data.

[0070] When the wafer 9 rotates, the image sensor 3 can obtain the contour of the wafer 9 during rotation, and then determine the center of the wafer 9; by comparing the center position of the wafer 9 with the position of the push rod 11, it can be determined whether the position of the wafer 9 on the push rod 11 is offset, and the offset direction of the wafer 9 can also be determined.

[0071] In this embodiment, the image data of the image sensor 3 or the pressure data of the pressure sensor 6 can be used to determine whether the position of the wafer 9 on the push rod 11 is offset. The two methods can also be combined to jointly determine whether the position of the wafer 9 on the push rod 11 is offset.

[0072] In some embodiments, Figure 2 As shown, the wafer detection device also includes:

[0073] A driving motor 10 connected to the push rod 11;

[0074] The controller 12 is configured to control the driving motor 10 to drive the push rod 11 to move when the position of the wafer 9 on the push rod 11 is offset.

[0075] In some embodiments, Figure 1 As shown, the wafer detection device also includes:

[0076] A container is disposed on the detection table 7, wherein the plurality of push rods 11 are located in the container;

[0077] A cover plate 1 is arranged opposite to the container, and the cover plate 1 matches the opening shape of the container. The cover plate 1 is configured to move toward the container to cooperate with the opening to form a closed cavity; or to move away from the container to open the cavity.

[0078] When the position of wafer 9 is offset, if wafer 9 is controlled to rotate, wafer 9 may be broken into pieces and may also contaminate other structures. In order to avoid the difficulty in handling the fragments after the detection and the contamination of other structures, the container can be closed by the cover plate 1, and the cavity can be closed when the notch detection starts.

[0079] The embodiment of the present invention further provides a wafer detection method, which is used for the wafer detection device as described above. Figure 3 As shown, the method includes:

[0080] Step 101: receiving detection data from the distance sensing sensor, and determining whether the plurality of push rods carry wafers according to the detection data;

[0081] Step 102: When it is determined according to the detection data that the plurality of push rods carry wafers, controlling the wafers to rotate;

[0082] Step 103: When the wafer is rotating, use a notch positioning sensor to detect the notch of the wafer.

[0083] In the present embodiment, before performing notch detection of wafer 9, check whether wafer 9 is placed on detection table 7, and then control wafer 9 to rotate after detecting that wafer 9 is placed on detection table 7 to perform notch detection, which can effectively prevent waste of detection time; and can prevent wafer 9 from rotating when the position of wafer 9 is abnormal, thereby preventing wafer 9 from being fragmented.

[0084] In a specific example, Figure 1-Figure 2 As shown, the wafer detection device of this embodiment includes a detection table 7, a container arranged on the detection table 7, a plurality of push rods 11 located in the container for carrying wafers 9, a distance sensing sensor 8, a notch positioning sensor 5, and a cover plate 1 arranged opposite to the container. In addition, the wafer detection device is also provided with a cover plate position positioning sensor 2, which can detect the position of the cover plate 1. An observation window 4 is also provided on the container, through which the condition of the wafer 9 can be observed. In addition, the wafer detection device also includes an image sensor 3, which can obtain images of the wafer 9 and the push rod 11; a pressure sensor 6 is provided on the push rod 11, and the push rod 11 is connected to the drive motor 10, and the drive motor 10 can drive the push rod 11 to move.

[0085] Every time when the robot arm transfers the wafer 9 to the inspection table 7 and places it in the container on the inspection table 7, the cover 1 descends to close the cavity. The distance sensing sensor 8 begins to detect whether there is a wafer 9 at the current position. If the distance sensing sensor 8 sends out detection data within the set time, and the controller 12 determines that there is a wafer 9 at the current position based on the detection data, the wafer 9 is controlled to start rotating; if the controller 12 determines that there is no wafer 9 at the current position based on the detection data, a command is sent to stop the operation of the equipment, and manual inspection is required to determine whether the equipment has broken wafer 9. After the wafer 9 rotates, the notch positioning sensor 5 detects the notch of the wafer 9. If a notch is detected when detecting the notch of the wafer 9, the cover 1 rises and the robot arm takes out the wafer 9. If the notch of the wafer 9 cannot be detected, the pressure sensor 6 on the push rod 11 transmits the centrifugal force in each direction as pressure data to the controller 12, and the controller 12 calculates the position information of the wafer 9 according to the pressure data of the pressure sensor 6, and determines whether the position of the wafer 9 on the push rod 11 is offset. If offset occurs, the controller 12 controls the drive motor 10 to drive the push rod 11 to push the wafer 9 to the calculated position; and / or, the image sensor 3 obtains the contour of the wafer 9 when rotating as image data, and the controller 12 calculates the position information of the wafer 9 according to the image data of the image sensor 3, and determines whether the position of the wafer 9 on the push rod 11 is offset. When the position of the wafer 9 on the push rod 11 is offset, the drive motor 10 is controlled to drive the push rod 11 to move, adjust the position of the wafer 9 on the push rod 11, and the drive motor 10 drives the push rod 11 to push the wafer 9 to the calculated position. After that, the wafer 9 rotates again to detect the notch of the wafer 9. Repeat the above operation until the notch of the wafer 9 is detected.

[0086] In this embodiment, when the robot arm moves the wafer 9 to the inspection table 7, the cover 1 is opened, and when the notch inspection begins, the cover 1 is closed. This can avoid difficult-to-handle fragments after inspection and can also avoid contamination of other structures.

[0087] An embodiment of the present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores at least one instruction, and the at least one instruction is used to be executed by a processor to implement the above-mentioned wafer detection method.

[0088] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the embodiments of the present application can be implemented with hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein the communication media include any media that facilitates the transmission of a computer program from one place to another. The storage medium can be any available medium that a general or special-purpose computer can access.

[0089] It should be noted that each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the product embodiments.

[0090] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0091] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A wafer inspection device, characterized in that: include: Testing bench; A plurality of push rods disposed on the inspection table and configured to carry wafers; A distance sensing sensor disposed between the surface of the inspection table and the push rods, configured to detect whether the plurality of push rods carry wafers; A controller configured to receive detection data from the distance sensing sensor, and control the wafer to rotate when it is determined that the plurality of push rods carry wafers according to the detection data; The notch positioning sensor is configured to detect the notch of the wafer when the wafer is rotated.

2. The wafer inspection device according to claim 1, characterized in that: The controller is configured to adjust the position of the wafer on the push rod when the notch positioning sensor does not detect the notch of the wafer.

3. The wafer inspection device according to claim 2, characterized in that: The wafer detection device also includes: A pressure sensor disposed on the push rod; The controller is configured to determine whether the position of the wafer on the push rod is offset according to the pressure data of the pressure sensor, and adjust the position of the wafer on the push rod according to the pressure data.

4. The wafer inspection device according to claim 2, characterized in that: The wafer detection device also includes: An image sensor disposed above the inspection table, configured to obtain a profile of the wafer when it rotates; The controller is configured to determine whether the position of the wafer on the push rod is offset according to the image data of the image sensor, and adjust the position of the wafer on the push rod according to the image data.

5. The wafer inspection device according to claim 3 or 4, characterized in that: The wafer detection device also includes: A driving motor connected to the push rod; The controller is configured to control the driving motor to drive the push rod to move when the position of the wafer on the push rod is offset.

6. The wafer inspection device according to claim 1, characterized in that: The wafer detection device also includes: A container disposed on the detection table, wherein the plurality of push rods are located in the container; A cover plate is arranged opposite to the container, the cover plate matches the opening shape of the container, and the cover plate is configured to move toward the direction approaching the container to cooperate with the opening to form a closed cavity; or to move toward the direction away from the container to open the cavity.

7. A wafer detection method, characterized in that: For use in a wafer inspection device as claimed in any one of claims 1 to 6, the method comprising: receiving detection data from the distance sensing sensor, and determining whether wafers are carried on the plurality of push rods according to the detection data; When it is determined according to the detection data that the plurality of push rods carry wafers, controlling the wafers to rotate; When the wafer is rotating, a notch positioning sensor is used to detect the notch of the wafer.

8. The wafer detection method according to claim 7, characterized in that: Applied to the wafer detection device according to claim 3, the method further comprises: It is determined whether the position of the wafer on the push rod is offset according to the pressure data of the pressure sensor, and the position of the wafer on the push rod is adjusted according to the pressure data.

9. The wafer detection method according to claim 7, characterized in that: Applied to the wafer detection device according to claim 4, the method further comprises: It is determined whether the position of the wafer on the push rod is offset according to the image data of the image sensor, and the position of the wafer on the push rod is adjusted according to the image data.

10. The wafer detection method according to claim 7, characterized in that: The method further comprises: When the position of the wafer on the push rod is offset, the driving motor is controlled to drive the push rod to move, so as to adjust the position of the wafer on the push rod.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores at least one instruction, and the at least one instruction is used to be executed by a processor to implement the wafer detection method according to any one of claims 7 to 9.

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