Packaging structure with electromagnetic shielding and heat dissipation functions

Abstract

The invention relates to a packaging structure with both electromagnetic shielding and heat dissipation, and relates to the technical field of chip packaging, the packaging structure with both electromagnetic shielding and heat dissipation comprises a first substrate, a second substrate, a flip chip and a Faraday cage unit; the flip chip is arranged on the upper side of the first substrate, and the second substrate is arranged on the upper side of the first substrate and surrounds the flip chip; the Faraday cage unit is arranged on the upper side of the first substrate, and the flip chip is arranged in the Faraday cage unit. Visibly, the flip chip is arranged in the Faraday cage unit, and the flip chip is completely surrounded by the cage unit, so that electromagnetic signals can be shielded, and the flip chip is effectively prevented from being interfered by external electromagnetic interference or radiating interference signals outwards by the flip chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a packaging structure having both electromagnetic shielding and heat dissipation. Background Art

[0002] In the existing Flip Chip packaging structure, the chip is soldered to the substrate and then the entire chip is wrapped in plastic. Such a structure does not have the ability to resist external interference or shield the chip from radiating electromagnetic waves to the outside world. In addition, the large thermal resistance of plastic is not conducive to the heat dissipation of the chip. Summary of the invention

[0003] The present invention provides a packaging structure and a chip having both electromagnetic shielding and heat dissipation, so as to solve at least one technical problem in the above-mentioned background technology.

[0004] In a first aspect, the present invention provides a packaging structure having both electromagnetic shielding and heat dissipation, the packaging structure having both electromagnetic shielding and heat dissipation comprising a first substrate, a second substrate, a flip chip and a Faraday cage unit; the flip chip is arranged on the upper side of the first substrate, the second substrate is arranged on the upper side of the first substrate and surrounds the flip chip; the Faraday cage unit is arranged on the upper side of the first substrate, and the flip chip is arranged in the Faraday cage unit.

[0005] A further technical solution is that the second substrate is provided with a hollow area, and the flip chip is arranged in the hollow area.

[0006] A further technical solution is that the Faraday cage unit includes a grounding layer, and the grounding layer is one or more layers in the middle of the first substrate.

[0007] A further technical solution is that the Faraday cage unit further includes a heat sink, and the heat sink is arranged on the second substrate and the upper side of the flip chip.

[0008] A further technical solution is that the Faraday cage unit also includes a grounding hole, which is opened in the second substrate and filled with metal filler. The upper side of the grounding hole is connected to the heat sink, and the lower side of the grounding hole is connected to the grounding layer.

[0009] A further technical solution is that there are multiple grounding holes, and the multiple grounding holes are arranged around the flip chip.

[0010] A further technical solution is that the second substrate includes more than two metal layers, and the grounding hole is connected to the metal layer.

[0011] A further technical solution is that the packaging structure having both electromagnetic shielding and heat dissipation also includes a thermal pad, and the thermal pad is arranged between the heat sink and the flip chip.

[0012] A further technical solution is that the thickness of the flip chip is smaller than that of the second substrate, and the lower surface of the heat sink is in contact with the thermal pad and the second substrate.

[0013] In a second aspect, the present invention provides a chip packaging structure, wherein the chip packaging structure includes the packaging structure having both electromagnetic shielding and heat dissipation as described in the first aspect.

[0014] The above technical solution provided by the embodiment of the present invention has the following advantages compared with the prior art:

[0015] In an embodiment of the present invention, a packaging structure with both electromagnetic shielding and heat dissipation includes a first substrate, a second substrate, a flip chip, and a Faraday cage unit; the flip chip is arranged on the upper side of the first substrate, the second substrate is arranged on the upper side of the first substrate and surrounds the flip chip; the Faraday cage unit is arranged on the upper side of the first substrate, and the flip chip is arranged in the Faraday cage unit. It can be seen that by placing the flip chip in the Faraday cage unit, the flip chip is completely surrounded by the cage unit, so that the electromagnetic signal can be shielded, and the flip chip can be effectively prevented from being interfered by external electromagnetic interference or radiating interference signals outward. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 A schematic diagram of a packaging structure having both electromagnetic shielding and heat dissipation provided by an embodiment of the present invention;

[0020] Figure 2An exploded diagram of a packaging structure having both electromagnetic shielding and heat dissipation provided by an embodiment of the present invention.

[0021] Description of Reference Numerals

[0022] The first substrate 10 , the second substrate 20 , the flip chip 30 , the hollow area 40 , the grounding layer 50 , the heat sink 60 , the thermal pad 70 , the glue 80 , and the grounding hole 90 . DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The disclosure below provides many different embodiments or examples to implement different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0025] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0026] See also Figure 1-Figure 2The embodiment of the present invention provides a packaging structure with both electromagnetic shielding and heat dissipation. The packaging structure with both electromagnetic shielding and heat dissipation has good electromagnetic shielding performance and heat dissipation performance, which prevents the flip chip 30 from being subjected to electromagnetic interference and ensures that the flip chip 30 can dissipate heat well. In order to achieve the above technical objectives, the packaging structure with both electromagnetic shielding and heat dissipation includes a first substrate 10, a second substrate 20, a flip chip 30 and a Faraday cage unit. Specifically, the structure is described as follows:

[0027] The flip chip 30 is disposed on the upper side of the first substrate 10. It can be understood that the flip chip 30 is mounted on the first substrate 10.

[0028] The second substrate 20 is disposed on the upper side of the first substrate 10 and surrounds the flip chip 30. The flip chip 30 may be disposed in a central region of the second substrate 20, which is not specifically limited in the present invention.

[0029] The Faraday cage unit is disposed on the upper side of the first substrate 10, and the flip chip 30 is disposed in the Faraday cage unit. The Faraday cage unit completely surrounds the flip chip 30, thereby providing good electromagnetic shielding performance.

[0030] In the embodiment of the present invention, the packaging structure with both electromagnetic shielding and heat dissipation includes a first substrate 10, a second substrate 20, a flip chip 30 and a Faraday cage unit; the flip chip 30 is arranged on the upper side of the first substrate 10, the second substrate 20 is arranged on the upper side of the first substrate 10 and surrounds the flip chip 30; the Faraday cage unit is arranged on the upper side of the first substrate 10, and the flip chip 30 is arranged in the Faraday cage unit. It can be seen that by placing the flip chip 30 in the Faraday cage unit, the flip chip 30 is completely surrounded by the cage unit, so that the electromagnetic signal can be shielded, and the flip chip 30 is effectively prevented from being interfered by external electromagnetic interference or radiating interference signals outward.

[0031] Further, in some embodiments, such as the present embodiment, the second substrate 20 is provided with a hollow area 40, and the flip chip 30 is provided in the hollow area 40. The hollow area 40 may be specifically located in the middle of the second substrate 20, and the hollow area 40 may be specifically in the shape of a square, which is not specifically limited in the embodiment of the present invention. The gap between the flip chip 30 and the second substrate 20 is filled with glue 80.

[0032] Furthermore, in some embodiments, such as the present embodiment, the Faraday cage unit includes a grounding layer 50, and the grounding layer 50 is one of the layers in the middle of the first substrate 10, and can be a single-layer complete plane, or multiple layers spliced ​​into a complete plane. The present invention does not limit which specific layer it is.

[0033] Specifically, the grounding layer 50 completely covers the upper surface of the first substrate 10 , and no uncovered area exists, thereby ensuring electromagnetic shielding performance. The grounding layer 50 is in contact with the second substrate 20 and the flip chip 30 .

[0034] Furthermore, the Faraday cage unit further includes a heat sink 60 , and the heat sink 60 is disposed on the upper side of the second substrate 20 and the flip chip 30 .

[0035] Specifically, the heat sink 60 covers the second substrate 20 and the upper side of the flip chip 30. The heat sink 60 is made of metal, which provides good heat dissipation performance on the one hand and good electromagnetic shielding performance on the other hand.

[0036] Furthermore, the Faraday cage unit also includes a grounding hole 90, which is opened in the second substrate 20 and filled with metal filler. The upper side of the grounding hole 90 is connected to the heat sink 60, and the lower side of the grounding hole 90 is connected to the grounding layer 50.

[0037] Specifically, there are a plurality of grounding holes 90 , and the plurality of grounding holes 90 are disposed around the flip chip 30 .

[0038] The grounding hole 90 serves as a fence of the Faraday cage unit. The grounding hole 90 is filled with metal fillers. The upper side of the grounding hole 90 is connected to the heat sink 60, and the lower side of the grounding hole 90 is connected to the grounding layer 50, thereby achieving good electromagnetic shielding.

[0039] Furthermore, in some embodiments, such as the present embodiment, the second substrate 20 includes more than two metal layers, and the grounding hole 90 is connected to the metal layer.

[0040] Specifically, the number of metal layers exceeds two layers, for example, it may be 3 or 4 layers, etc., which is not specifically limited in the present invention. By connecting the grounding hole 90 to the metal layer, the electromagnetic shielding performance can be further improved.

[0041] Furthermore, in some embodiments, such as the present embodiment, the packaging structure having both electromagnetic shielding and heat dissipation functions further includes a thermal pad 70 , and the thermal pad 70 is disposed between the heat sink 60 and the flip chip 30 .

[0042] The heat generated by the flip chip 30 can be quickly transferred to the heat sink 60 via the thermal pad 70 , thereby greatly improving the heat dissipation performance of the flip chip 30 .

[0043] Furthermore, in some embodiments, such as the present embodiment, the thickness of the flip chip 30 is smaller than that of the second substrate 20 , and the lower surface of the heat sink 60 is in contact with the thermal pad 70 and the second substrate 20 .

[0044] Specifically, the thickness of the flip chip 30 is less than that of the second substrate 20, so that the thermal pad 70 can be placed between the heat sink 60 and the flip chip 30. The lower surface of the heat sink 60 is in contact with the thermal pad 70 and the second substrate 20, thereby achieving good heat dissipation. The thickness of the thermal pad 70 can be equal to the thickness difference between the second substrate 20 and the flip chip 30; or the thickness of the thermal pad 70 can be slightly greater than the thickness difference between the second substrate 20 and the flip chip 30, so that the thermal pad 70 can be in a slightly compressed state, thereby improving the heat transfer performance.

[0045] An embodiment of the present invention provides a chip packaging structure, wherein the chip includes the packaging structure having both electromagnetic shielding and heat dissipation functions provided by any of the above embodiments.

[0046] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0052] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0053] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A packaging structure with both electromagnetic shielding and heat dissipation, characterized in that: The packaging structure with both electromagnetic shielding and heat dissipation includes a first substrate, a second substrate, a flip chip and a Faraday cage unit; the flip chip is arranged on the upper side of the first substrate, the second substrate is arranged on the upper side of the first substrate and surrounds the flip chip; the Faraday cage unit is arranged on the upper side of the first substrate, and the flip chip is arranged in the Faraday cage unit.

2. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 1, characterized in that: The second substrate is provided with a hollow area, and the flip chip is arranged in the hollow area.

3. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 2, characterized in that: The Faraday cage unit includes a grounding layer, and the grounding layer is one or more layers in the middle of the first substrate.

4. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 3, characterized in that: The Faraday cage unit further includes a heat sink, which is disposed on the second substrate and an upper side of the flip chip.

5. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 4, characterized in that: The Faraday cage unit further includes a grounding hole, which is opened in the second substrate and filled with metal filler. The upper side of the grounding hole is connected to the heat sink, and the lower side of the grounding hole is connected to the grounding layer.

6. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 5, characterized in that: There are multiple grounding holes, and the multiple grounding holes are arranged around the flip chip.

7. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 6, characterized in that: The second substrate includes more than two metal layers, and the grounding holes are connected to the metal layers.

8. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 4, characterized in that: The packaging structure with both electromagnetic shielding and heat dissipation also includes a thermal pad, which is arranged between the heat sink and the flip chip.

9. The packaging structure with both electromagnetic shielding and heat dissipation according to claim 8, characterized in that: The thickness of the flip chip is smaller than that of the second substrate, and the lower surface of the heat sink is in contact with the thermal pad and the second substrate.

10. A chip packaging structure, characterized in that: The chip includes a packaging structure having both electromagnetic shielding and heat dissipation as described in any one of claims 1 to 9.

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