Chip packaging structure and packaging method thereof

Abstract

The invention relates to a chip packaging structure and a packaging method thereof, and relates to the technical field of chip packaging, the chip packaging structure comprises a packaging substrate, a metal shell and a chip body; the packaging substrate is fixedly connected with the metal shell through a structural adhesive to form a packaging cavity; the chip body is located in the packaging cavity, the chip body is arranged on the upper surface of the packaging substrate, and the upper surface of the chip body is connected with the metal shell through heat-conducting glue; the packaging method comprises the following steps: providing a packaging substrate; arranging a chip body on the upper surface of the packaging substrate, and welding the chip body by using vacuum welding equipment; and coating heat-conducting glue on the upper surface of the chip body, coating structural glue on the packaging substrate, and covering a metal shell to complete chip packaging. According to the invention, the electromagnetic shielding effect is realized on the basis of chip miniaturization.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip packaging structure and a packaging method thereof. Background Art

[0002] The traditional chip packaging structure uses plastic packaging, which completely seals the chip in plastic. The chip cannot sense the external temperature, humidity, gas, and air pressure, so the sensing device needs to be prepared separately. Moreover, plastic is an insulator and is not conductive, so it cannot achieve electrostatic shielding, so electrostatic shielding needs to be processed separately, such as adding an electromagnetic shielding metal shell to the overall structure of the chip package. The existing electromagnetic shielding metal shell is threadedly connected to the shielding base plate by bolts during installation.

[0003] However, the electromagnetic shielding metal shell is threadedly connected to the shielding bottom plate by bolts. The bolts are prone to loosening or rusting after long-term use, which makes the electromagnetic sealing of the overall structure insufficient and fails to achieve a good electromagnetic shielding effect. Summary of the invention

[0004] In order to solve the problem that the existing plastic packaging structure cannot achieve electromagnetic shielding on the basis of miniaturization, the present application provides a chip packaging structure and a packaging method thereof to improve the electromagnetic shielding effect of the chip packaging.

[0005] The present application provides a chip packaging structure and a packaging method thereof using the following technical solutions: A chip packaging structure includes a packaging substrate, a metal shell and a chip body; The packaging substrate and the metal shell are fixedly connected by structural adhesive to form a packaging cavity; The chip body is located in the packaging cavity, and the chip body is arranged on the upper surface of the packaging substrate. The upper surface of the chip body is connected to the metal shell through a heat-conducting adhesive.

[0006] Furthermore, a plurality of channels are provided on the top wall of the metal shell, and a heat transfer tube is embedded in each of the channels to form a cold plate heat exchanger; the heat transfer medium enters the heat transfer tube to absorb the heat of the chip body and then flows out, and then flows into the heat transfer tube again after heat exchange with an external cold source.

[0007] A chip packaging method comprises the following steps: providing a packaging substrate; A chip body is arranged on the upper surface of the packaging substrate, and the chip body is welded by using a vacuum welding device; The chip is packaged by coating the upper surface of the chip body with thermal conductive adhesive, coating the packaging substrate with structural adhesive, and covering the metal shell.

[0008] Furthermore, the vacuum welding equipment comprises: a rotating drum, an articulated seat, a bracket and a vacuum welding device, wherein the articulated seat and the bracket are fixedly arranged on the ground; The axis of the rotating drum is arranged horizontally and the two ends of the rotating drum are rotatably connected to the hinge seat. A plurality of bearing surfaces are arranged on the peripheral wall of the rotating drum. A supporting plate for placing a plurality of packaging structures is arranged on the bearing surface. A groove for placing the packaging substrate is opened on the supporting plate. A positioning ring is arranged on the supporting plate. The positioning ring and the groove enclose a positioning space for positioning the packaging structure. The vacuum welding device comprises a vacuum cover and a vacuum machine, both ends of the vacuum cover are rotatably connected to the bracket through a connecting arm group, the vacuum cover and the top surface of the supporting plate enclose a vacuum cavity, and a rotating assembly for rotating the rotating drum is provided at the end of the rotating drum; The vacuum cover and the vacuum machine are connected via a connecting pipe, a check valve is provided on the connecting pipe, the vacuum machine is used to provide a vacuum environment or an inert gas environment or a reducing gas environment for the vacuum cavity, and a heating device for heating the vacuum cavity is provided on the vacuum cover.

[0009] Furthermore, a connecting block is provided on the bottom surface of the supporting plate, and a first slot for inserting the connecting block is provided on each of the bearing surfaces.

[0010] Further, a material unloading device is arranged between the bracket and the rotating drum, the material unloading device comprises a bearing assembly and a transfer assembly, the bearing assembly comprises a transfer plate and a mounting frame, the mounting frame is connected to the bracket, two groups of first adjustment members for adjusting the level of the top wall of the transfer plate are arranged between the mounting frame and the transfer plate, a limit strip is arranged on the top wall of the transfer plate facing the rotating drum, the limit strip and the top wall of the transfer plate are enclosed to form a receiving space for placing the supporting plate, and a plurality of shock-absorbing strips are arranged in the receiving space; The first adjusting member includes a first cylinder and a second cylinder, the cylinder bodies of the first cylinder and the second cylinder are fixedly connected to the mounting frame, the piston rods of the first cylinder and the second cylinder are rotatably connected to the bottom of the transfer plate, and the first cylinder and the second cylinder are arranged along the width direction of the transfer plate.

[0011] Furthermore, two groups of second adjusting members for unloading the supporting plate on the transfer plate are provided on the transfer plate, and the two groups of second adjusting members are arranged along the length direction of the transfer plate, and each group of second adjusting members includes a U-shaped support frame and an electric cylinder, and the transfer plate is provided with a through groove for the two ends of the U-shaped support frame to pass through, and the electric cylinder is arranged between the U-shaped support frame and the bottom wall of the transfer plate, the cylinder body of the electric cylinder is fixedly connected to the transfer plate, and the piston rod of the electric cylinder is fixedly connected to the U-shaped support frame, and a number of ball bearings are arranged on the end walls of the U-shaped support frame at both ends, and the transfer assembly is arranged as a belt conveyor, and the top wall of the belt conveyor is flush with the horizontal top wall of the transfer plate.

[0012] Furthermore, the two ends of the vacuum hood are rotatably connected to the bracket through a group of connecting arm groups, each group of the connecting arm groups includes a first connecting rod and a second connecting rod, one end of the first connecting rod is rotatably connected to the bracket, the other end of the first connecting rod is rotatably connected to the end wall of the vacuum hood, one end of the second connecting rod is rotatably connected to the bracket, the other end of the second connecting rod is rotatably connected to the end wall of the vacuum hood, the first connecting rod and the second connecting rod have the same length and extend in parallel directions, a hydraulic cylinder is arranged between the first connecting rod and the bracket, a cylinder body of the hydraulic cylinder is hinged to the bracket, and a piston rod of the hydraulic cylinder is hinged to the first connecting rod.

[0013] Furthermore, a power part for controlling the rotation of the rotating drum is provided at one end of the rotating drum, and the power part includes a first gear, a second gear and a power motor, the first gear and the rotating shaft of the rotating drum are coaxially fixedly connected, the power motor and the articulated seat are fixedly connected, the second gear and the power motor are transmission-connected, and the first gear and the second gear are meshing.

[0014] Furthermore, a plurality of partitions are evenly arranged in the rotating drum, and two adjacent partitions and the rotating drum form a partition chamber, and the partition chamber corresponds to the bearing surface one-to-one. A limiting member for limiting the rotation angle of the rotating drum is provided at one end of the rotating drum, and the limiting member includes a sleeve coaxially connected to the rotating axis of the rotating drum, a plurality of plug plates and a third cylinder, and the plug plates correspond to the partition chamber one-to-one. The cylinder body of the third cylinder is fixedly connected to the hinge seat, and the piston rod of the third cylinder is fixedly connected to the sleeve.

[0015] In summary, the present application includes at least one of the following beneficial technical effects: The metal shell and the packaging substrate are connected by structural adhesive to form a packaging cavity, and then the chip body is mounted inside the packaging cavity to solve the electromagnetic shielding problem of the plastic packaging structure and improve the electromagnetic shielding effect of the chip packaging structure; A heat transfer pipe is arranged on the top of the metal shell by opening a channel to achieve the effect of a cold plate heat exchanger and enhance the heat dissipation effect of the chip packaging structure; A new vacuum welding device is designed. When vacuum packaging chips, firstly, several packaging substrates with chips on the surface are placed in the groove, and the packaging substrates are positioned on the support plate by using the positioning ring, and then the support plate is placed on the bearing surface of the rotating drum, and the connecting block is inserted into the first slot to realize the positioning of the support plate, so as to facilitate the rapid replacement of the support plate, and when the bearing surface is driven by the rotating drum to rotate to the top, the third cylinder is started, and the vacuum cover is placed on the support plate by using the third cylinder, and the vacuum chamber is evacuated by using the vacuum machine, and the vacuum chamber is evacuated by using the heating wire, so as to achieve a good chip packaging effect; When unloading the chips that have been vacuum welded, the third cylinder is used to pull the plug plate on the sleeve out of the partition chamber, and the power motor is used to drive the rotating drum to rotate, and the bearing surface of the supporting plate for loading is rotated to the top. At this time, the processed supporting plate is rotated to the side of the rotating drum. At this time, the connecting block falls out of the first slot, and the first cylinder and the second cylinder are used to drive the transfer plate close to the rotating drum and parallel to the processed supporting plate, so that the supporting plate falls on the transfer plate, and then the first cylinder and the second cylinder are used to drive the transfer plate to keep it horizontal, start the electric cylinder, and use the U-shaped support frame far away from the end of the belt conveyor to penetrate the groove. The depth is greater than the depth of the U-shaped support frame close to the end of the belt conveyor to penetrate the groove to realize the sliding movement of the supporting plate from the transfer plate to the belt conveyor, thereby realizing automatic unloading of the chips that have been welded, which is beneficial to improving the processing efficiency of the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of a chip packaging structure in an embodiment of the present application.

[0017] Figure 2 This is a schematic diagram of the overall structure of a chip packaging structure in an embodiment of the present application.

[0018] Figure 3 It is a cross-sectional view of a chip packaging structure in an embodiment of the present application.

[0019] Figure 4 This is a schematic diagram of the overall structure of a chip packaging vacuum welding device in an embodiment of the present application.

[0020] Figure 5 It is a schematic diagram of the overall structure of the support plate in the embodiment of the present application.

[0021] Figure 6 It is a schematic diagram of the overall structure of the heating device used in the embodiment of the present application.

[0022] Figure 7It is a schematic diagram of the overall structure of the first adjusting member in the embodiment of the present application.

[0023] Figure 8 It is a schematic diagram of the overall structure of the second adjusting member in the embodiment of the present application.

[0024] Description of the accompanying drawings: 1. rotating drum; 2. bracket; 3. vacuum welding device; 31. vacuum cover; 32. vacuum machine; 4. connecting arm group; 41. first connecting rod; 42. second connecting rod; 5. heating device; 51. heating wire; 6. rotating assembly; 7. unloading device; 71. bearing assembly; 711. transfer plate; 712. mounting frame; 72. transfer assembly; 721. belt conveyor; 8. limiter; 81. sleeve; 82. plug plate; 83. third cylinder; 9. hinge seat; 10. bearing surface; 11. supporting plate; 12. partition; 13. partition chamber; 14. connecting Through pipe; 15, check valve; 16, hydraulic cylinder; 17, groove; 18, positioning ring; 20, first slot; 21, first adjusting member; 211, first cylinder; 212, second cylinder; 22, second adjusting member; 221, U-shaped support frame; 222, electric cylinder; 23, limit strip; 24, accommodating space; 25, shock-absorbing strip; 26, through groove; 27, ball; 28, power part; 281, first gear; 282, second gear; 283, power motor; 29, packaging substrate; 30, metal shell; 33, chip body; 34, thermal conductive adhesive; 35, structural adhesive. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-8 This application is described in further detail.

[0026] The embodiment of the present application discloses a chip packaging structure and a packaging method thereof.

[0027] Reference Figure 1 , Figure 2 as well as Figure 3 A chip packaging structure includes a packaging substrate 29, a metal shell 30 and a chip body 33; the packaging substrate 29 and the metal shell 30 are fixedly connected by a structural adhesive 35 to form a packaging cavity; the chip body 33 is located in the packaging cavity, and the chip body 33 is arranged on the upper surface of the packaging substrate 29, and the upper surface of the chip body 33 is connected to the metal shell 30 by a thermal conductive adhesive 34.

[0028] The top wall of the metal shell 30 is provided with a plurality of channels, each of which is embedded with a heat transfer tube to form a cold plate heat exchanger; the heat transfer medium enters the heat transfer tube to absorb the heat of the chip body 33 and then flows out, and then flows into the heat transfer tube again after heat exchange with an external cold source.

[0029] The metal shell 30 is connected to the packaging substrate 29 through the structural adhesive 35 to form a packaging cavity, and then the chip body 33 is mounted inside the packaging cavity to solve the electromagnetic shielding problem of the plastic packaging structure and improve the electromagnetic shielding effect of the chip body 33 packaging structure.

[0030] A heat transfer pipe is arranged on the top of the metal shell 30 by opening a channel to achieve the effect of a cold plate heat exchanger, thereby enhancing the heat dissipation effect of the chip body 33 packaging structure.

[0031] When packaging the chip body 33, a packaging substrate 29 is provided; A chip body 33 is arranged on the upper surface of the packaging substrate 29; the chip body 33 is welded by using a vacuum welding device; A thermal conductive adhesive 34 is coated on the upper surface of the chip body 33 , a structural adhesive 35 is coated on the packaging substrate 29 , and the metal shell 30 is covered to complete the chip body packaging.

[0032] Reference Figure 4 and Figure 5 The chip packaging vacuum welding equipment includes a rotating drum 1, an articulated seat 9, a bracket 2 and a vacuum welding device 3 arranged on the ground. The bracket 2 and the articulated seat 9 are fixedly arranged on the ground. The axis of the rotating drum 1 is arranged horizontally and both ends of the rotating drum 1 are rotatably connected to the articulated seat 9. A plurality of bearing surfaces 10 are arranged on the peripheral wall of the rotating drum 1. In this embodiment, the cross-section of the rotating drum 1 is a regular hexagon, and six bearing surfaces 10 are evenly arranged. A supporting plate 11 for placing five chips is arranged on the top bearing surface 10. Six partitions 12 are evenly arranged in the rotating drum 1. The six partitions 12 are fixedly connected to the rotating axis of the rotating drum 1. Two adjacent partitions 12 and the rotating drum 1 enclose a partition chamber 13, and the partition chamber 13 corresponds to the bearing surface 10 one by one.

[0033] Reference Figure 4 and Figure 6The vacuum welding device 3 includes a vacuum cover 31 and a vacuum machine 32. Both ends of the vacuum cover 31 are rotatably connected to the bracket 2 through the connecting arm group 4. The vacuum cover 31 and the vacuum machine 32 are connected through a connecting pipe 14. The connecting pipe 14 is provided with a check valve 15. The vacuum cover 31 and the top surface of the supporting plate 11 are enclosed to form a vacuum cavity. The vacuum machine 32 is used to evacuate the vacuum cavity. The vacuum cover 31 is provided with a heating device 5 for heating the vacuum cavity. The heating device 5 includes a heating wire 51 arranged on the inner wall of the vacuum cover 31. Each group of connecting arm groups 4 each includes a first connecting rod 41 and a second connecting rod 42, one end of the first connecting rod 41 is rotatably connected to the bracket 2, the other end of the first connecting rod 41 is rotatably connected to the end wall of the vacuum cover 31, one end of the second connecting rod 42 is rotatably connected to the bracket 2, the other end of the second connecting rod 42 is rotatably connected to the end wall of the vacuum cover 31, the first connecting rod 41 and the second connecting rod 42 have the same length and extend in parallel directions, a hydraulic cylinder 16 is provided between the first connecting rod 41 and the bracket 2, a cylinder body of the hydraulic cylinder 16 is hinged to the bracket 2, and a piston rod of the hydraulic cylinder 16 is hinged to the first connecting rod 41.

[0034] Reference Figure 4 and Figure 5 A rotating assembly 6 for rotating the drum 1 is provided at the end of the drum 1 , and a feeding device 7 is provided between the bracket 2 and the drum 1 .

[0035] The supporting plates 11 on different bearing surfaces 10 are rotated to the top by using the rotating component 6, and the chips on the supporting plates 11 are packaged and welded by using the vacuum welding device 3, which is beneficial to achieving a good packaging effect. After the packaging and welding are completed, the rotating drum 1 is rotated to replace the bearing surface 10 on the top surface, which is beneficial to improving the welding efficiency. At this time, the supporting plate 11 after the welding process falls from the hexagonal rotating drum 1, and the unloading component is used to transport and unload the supporting plate 11, which is beneficial to improving the unloading efficiency and improving the production capacity and efficiency.

[0036] Reference Figure 5 A limiting member 8 for limiting the rotation angle of the rotating drum 1 is provided at one end of the rotating drum 1. The limiting member 8 includes a sleeve 81 coaxially connected to the rotating axis of the rotating drum 1, a plurality of plug plates 82 and a third cylinder 83. The plug plates 82 correspond to the partition chambers 13 one by one. The cylinder body of the third cylinder 83 is fixedly connected to the hinge seat 9, and the piston rod of the third cylinder 83 is fixedly connected to the sleeve 81.

[0037] When the carrying surface 10 rotates to the top driven by the rotating drum 1, the third cylinder 83 is started, the vacuum cover 31 is placed on the supporting plate 11 by the third cylinder 83, the vacuum chamber is evacuated by the vacuum machine 32, and the vacuum chamber is evacuated by the heating wire 51 to achieve a good chip packaging effect, which is conducive to achieving uniform heating of the area inside the vacuum chamber.

[0038] Reference Figure 5 A groove 17 for placing the chip is provided on the support plate 11, and a positioning ring 18 is provided on the support plate 11. The positioning ring 18 and the groove 17 together form a positioning space for positioning the chip; a connecting block is provided on the bottom surface of the support plate 11. In the present embodiment, the connecting block is configured as a rectangular protrusion, and each bearing surface 10 is provided with a first slot 20 for inserting the connecting block.

[0039] When positioning a number of chips and substrates on the support plate 11, a number of packaging substrates and chips are placed in the groove 17, solder is placed between the packaging substrates and the chips, and the packaging substrates are pressed and positioned on the support plate 11 using the positioning ring 18. The support plate 11 is placed on the bearing surface 10 of the drum 1, and the connecting block is inserted into the first slot 20 to achieve positioning of the support plate 11, which facilitates the rapid replacement of the support plate 11.

[0040] Reference Figure 6 and Figure 7 The unloading device 7 includes a bearing component 71 and a transfer component 72. The bearing component 71 includes a transfer plate 711 and a mounting frame 712. The mounting frame 712 is connected to the bracket 2. Two groups of first adjustment members 21 for adjusting the level of the top wall of the transfer plate 711 are arranged between the mounting frame 712 and the transfer plate 711. A limiting strip 23 is arranged on the top wall of the transfer plate 711 facing the rotating drum 1. The limiting strip 23 and the top wall of the transfer plate 711 are enclosed to form a receiving space 24 for placing the supporting plate 11. A plurality of shock-absorbing strips 25 are arranged in the receiving space 24.

[0041] The first adjusting member 21 includes a first cylinder 211 and a second cylinder 212, the cylinder bodies of the first cylinder 211 and the second cylinder 212 are fixedly connected to the mounting frame 712, the piston rods of the first cylinder 211 and the second cylinder 212 are rotatably connected to the bottom of the transfer plate 711, and the first cylinder 211 and the second cylinder 212 are arranged along the width direction of the transfer plate 711.

[0042] Reference Figure 6 , Figure 7 and Figure 8Two groups of second adjusting members 22 for unloading the supporting plate 11 on the transfer plate 711 are provided on the transfer plate 711, and the two groups of second adjusting members 22 are arranged along the length direction of the transfer plate 711, and each group of second adjusting members 22 includes a U-shaped support frame 221 and an electric cylinder 222. The transfer plate 711 is provided with a through groove 26 for the two ends of the U-shaped support frame 221 to pass through, and the electric cylinder 222 is arranged between the U-shaped support frame 221 and the bottom wall of the transfer plate 711, and the cylinder body of the electric cylinder 222 is fixedly connected to the transfer plate 711, and the piston rod of the electric cylinder 222 is fixedly connected to the U-shaped support frame 221, and a plurality of ball bearings 27 are arranged on the end walls of the U-shaped support frame 221 at both ends. The transfer assembly 72 is arranged as a belt conveyor 721, and the top wall of the belt conveyor 721 is flush with the top wall of the horizontal transfer plate 711.

[0043] Reference Figure 5 A power member 28 for controlling the rotation of the drum 1 is provided at one end of the drum 1. The power member 28 includes a first gear 281, a second gear 282 and a power motor 283. The first gear 281 is coaxially fixedly connected to the rotating shaft of the drum 1, the power motor 283 is fixedly connected to the hinge seat 9, the second gear 282 is transmission-connected to the power motor 283, and the first gear 281 and the second gear 282 are meshed.

[0044] When unloading the packaged chips, the third cylinder 83 is used to pull the insert plate 82 on the sleeve 81 out of the partition chamber 13, and the power motor 283 is used to drive the drum 1 to rotate, and the bearing surface 10 with the supporting plate 11 is rotated to the top. At this time, the processed supporting plate 11 is rotated to the side of the drum 1. At this time, the connecting block falls out of the first slot 20, and the first cylinder 211 and the second cylinder 212 are used to drive the transfer plate 711 close to the drum 1 and parallel to the processed supporting plate 11, so that the supporting plate 11 falls out. It falls on the transfer plate 711, and then the first cylinder 211 and the second cylinder 212 are used to drive the transfer plate 711 to remain horizontal, and the electric cylinder 222 is started. The depth of the U-shaped support frame 221 at one end away from the belt conveyor 721 passing through the groove 26 is greater than the depth of the U-shaped support frame 221 at one end close to the belt conveyor 721 passing through the groove 26, so that the support plate 11 slides from the transfer plate 711 to the belt conveyor 721, thereby realizing automatic unloading of the welded chips, which is beneficial to improving the processing efficiency of the chips.

[0045] The implementation principle of a chip packaging structure and its packaging method in an embodiment of the present application is: the metal shell 30 is connected to the packaging substrate 29 through the structural adhesive 35 to form a packaging cavity, and then the chip body 33 is mounted inside the packaging cavity to solve the electromagnetic shielding problem of the plastic packaging structure and improve the electromagnetic shielding effect of the chip body 33 packaging structure.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A chip packaging structure, characterized in that: It comprises a packaging substrate (29), a metal shell (30) and a chip body (33); The packaging substrate (29) and the metal shell (30) are fixedly connected via a structural adhesive (35) to form a packaging cavity; The chip body (33) is located in the packaging cavity, and the chip body (33) is arranged on the upper surface of the packaging substrate (29), and the upper surface of the chip body (33) is connected to the metal shell (30) via a heat-conducting adhesive (34).

2. A chip packaging structure as claimed in claim 1, characterized in that: The top wall of the metal shell (30) is provided with a plurality of channels, each of which is embedded with a heat transfer tube to form a cold plate heat exchanger; the heat transfer medium enters the heat transfer tube to absorb the heat of the chip body (33) and then flows out, and then flows into the heat transfer tube again after heat exchange with an external cold source.

3. A chip packaging method, characterized in that: The steps include: Providing a packaging substrate (29); A chip body (33) is arranged on the upper surface of the packaging substrate (29), and the chip body (33) is welded using vacuum welding equipment; A heat-conducting adhesive (34) is coated on the upper surface of the chip body (33), a structural adhesive (35) is coated on the packaging substrate (29), and the metal shell (30) is covered to complete chip packaging.

4. A chip packaging method as claimed in claim 3, characterized in that: The vacuum welding equipment comprises: a rotating drum (1), an articulated seat (9), a bracket (2) and a vacuum welding device (3), wherein the articulated seat (9) and the bracket (2) are fixedly arranged on the ground; The axis of the rotating drum (1) is arranged horizontally and the two ends of the rotating drum (1) are rotatably connected to the hinge seat (9); a plurality of bearing surfaces (10) are arranged on the peripheral wall of the rotating drum (1); a supporting plate (11) for placing a plurality of packaging structures is arranged on the bearing surface (10); a groove (17) for placing the packaging substrate (29) is opened on the supporting plate (11); a positioning ring (18) is arranged on the supporting plate (11); the positioning ring (18) and the groove (17) enclose a positioning space for positioning the packaging structure; The vacuum welding device (3) comprises a vacuum cover (31) and a vacuum machine (32); both ends of the vacuum cover (31) are rotatably connected to the bracket (2) via a connecting arm group (4); the vacuum cover (31) and the top surface of the supporting plate (11) enclose a vacuum cavity; and a rotating assembly (6) for rotating the rotating cylinder (1) is provided at the end of the rotating cylinder (1); The vacuum cover (31) and the vacuum machine (32) are connected via a connecting pipe (14), a check valve (15) is provided on the connecting pipe (14), the vacuum machine (32) is used to provide a vacuum environment or an inert gas environment or a reducing gas environment for the vacuum cavity, and the vacuum cover (31) is provided with a heating device (5) for heating the vacuum cavity.

5. A chip packaging method according to claim 4, characterized in that: The bottom surface of the supporting plate (11) is provided with a connecting block, and each of the bearing surfaces (10) is provided with a first slot (20) for inserting the connecting block.

6. A chip packaging method according to claim 4, characterized in that: A material unloading device (7) is arranged between the support (2) and the rotating drum (1), the material unloading device (7) comprising a bearing assembly (71) and a transfer assembly (72), the bearing assembly (71) comprising a transfer plate (711) and a mounting frame (712), the mounting frame (712) being connected to the support (2), two groups of first adjustment members (21) for adjusting the level of the top wall of the transfer plate (711) being arranged between the mounting frame (712) and the transfer plate (711), a limiting strip (23) being arranged on the top wall of the transfer plate (711) facing the rotating drum (1), the limiting strip (23) and the top wall of the transfer plate (711) enclosing to form a receiving space (24) for placing the supporting plate (11), a plurality of shock-absorbing strips (25) being arranged in the receiving space (24); The first adjusting member (21) comprises a first cylinder (211) and a second cylinder (212); the cylinder bodies of the first cylinder (211) and the second cylinder (212) are fixedly connected to the mounting frame (712); the piston rods of the first cylinder (211) and the second cylinder (212) are rotatably connected to the bottom of the transfer plate (711); and the first cylinder (211) and the second cylinder (212) are arranged along the width direction of the transfer plate (711).

7. A chip packaging method according to claim 6, characterized in that: The transfer plate (711) is provided with two groups of second adjusting members (22) for unloading the support plate (11) on the transfer plate (711). The two groups of second adjusting members (22) are arranged along the length direction of the transfer plate (711). Each group of second adjusting members (22) includes a U-shaped support frame (221) and an electric cylinder (222). The transfer plate (711) is provided with through grooves (26) for the two ends of the U-shaped support frame (221) to pass through. The electric cylinder (222) is arranged on the U-shaped support frame (221). The cylinder body of the electric cylinder (222) and the transfer plate (711) are fixedly connected between the support frame (221) and the bottom wall of the transfer plate (711), the piston rod of the electric cylinder (222) and the U-shaped support frame (221) are fixedly connected, and a plurality of balls (27) are arranged on both end walls of the U-shaped support frame (221). The transfer assembly (72) is arranged as a belt conveyor (721), and the top wall of the belt conveyor (721) is flush with the top wall of the horizontal transfer plate (711).

8. A chip packaging method according to claim 4, characterized in that: The two ends of the vacuum cover (31) are rotatably connected to the bracket (2) via a group of connecting arm groups (4), each group of the connecting arm groups (4) comprises a first connecting rod (41) and a second connecting rod (42); one end of the first connecting rod (41) is rotatably connected to the bracket (2), the other end of the first connecting rod (41) is rotatably connected to the end wall of the vacuum cover (31); one end of the second connecting rod (42) is rotatably connected to the bracket (2), the other end of the second connecting rod (42) is rotatably connected to the end wall of the vacuum cover (31); the first connecting rod (41) and the second connecting rod (42) are of the same length and extend in parallel directions; a hydraulic cylinder (16) is provided between the first connecting rod (41) and the bracket (2); a cylinder body of the hydraulic cylinder (16) is hinged to the bracket (2), and a piston rod of the hydraulic cylinder (16) is hinged to the first connecting rod (41).

9. A chip packaging method according to claim 4, characterized in that: A power member (28) for controlling the rotation of the rotating drum (1) is provided at one end of the rotating drum (1), and the power member (28) comprises a first gear (281), a second gear (282) and a power motor (283), the first gear (281) and the rotating shaft of the rotating drum (1) are coaxially fixedly connected, the power motor (283) and the hinge seat (9) are fixedly connected, the second gear (282) and the power motor (283) are transmission-connected, and the first gear (281) and the second gear (282) are meshed.

10. A chip packaging method according to claim 4, characterized in that: A plurality of partitions (12) are evenly arranged in the rotating drum (1), and two adjacent partitions (12) and the rotating drum (1) enclose a partition chamber (13), and the partition chamber (13) corresponds to the bearing surface (10) one by one. A limiting member (8) for limiting the rotation angle of the rotating drum (1) is arranged at one end of the rotating drum (1), and the limiting member (8) comprises a sleeve (81) coaxially connected to the rotation axis of the rotating drum (1), a plurality of plug plates (82) and a third cylinder (83), and the plug plates (82) correspond to the partition chamber (13) one by one. The cylinder body of the third cylinder (83) is fixedly connected to the hinge seat (9), and the piston rod of the third cylinder (83) is fixedly connected to the sleeve (81).

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