Epoxy resin AB glue preparation device and method

Abstract

The invention discloses an epoxy resin AB glue preparation device and method, and belongs to the technical field of epoxy resin preparation. The epoxy resin AB glue preparation device comprises a preparation bin mechanism, a mixing mechanism is arranged in the preparation bin mechanism, and a heating mechanism is fixedly connected to the surface of the preparation bin mechanism. The device aims at solving the problem that in the prior art, when the weather is cold, the viscosity of epoxy resin AB glue is increased, and consequently the epoxy resin AB glue is difficult to mix evenly, and the achieved technical effect is that when the air temperature is low, through the arrangement of the heating mechanism, in the mixing process of the epoxy resin AB glue, the viscosity of the epoxy resin AB glue is increased; the heat of the cold end of the refrigerator is continuously transferred to the hot end through the semiconductor heater, so that the hot end of the heater heats the heat-conducting oil entering the heating cavity, and then under the action of the circulating pump, the heated heat-conducting oil flows along the circulating heating pipe to indirectly heat the epoxy resin AB glue in the bin body, so that the viscosity of the glue is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy resin preparation, and in particular to a device and method for preparing epoxy resin AB glue. Background Art

[0002] Epoxy resin AB glue is widely used in many fields such as electronics, aerospace, automobile manufacturing, and handicraft repair due to its excellent bonding performance, good chemical corrosion resistance, high strength, and dimensional stability after curing. However, the traditional preparation process of epoxy resin AB glue has many disadvantages.

[0003] At present, in the process of preparing epoxy resin AB glue, the epoxy resin AB glue is mostly stirred by a simple mechanical stirring method. However, when the weather is relatively cold, the viscosity of the epoxy resin AB glue increases, which makes it difficult to mix the epoxy resin AB glue evenly. At the same time, the bubbles in the glue after mixing are difficult to be discharged due to the high viscosity of the glue, which causes certain inconveniences in use. Summary of the invention

[0004] To this end, the present invention provides an epoxy resin AB glue preparation device and method to solve the problem in the prior art that the viscosity of the epoxy resin AB glue increases when the weather is relatively cold.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] According to a first aspect of the present invention, an epoxy resin AB glue preparation device comprises a preparation bin mechanism, a mixing mechanism is arranged inside the preparation bin mechanism, a heating mechanism is fixedly connected to the surface of the preparation bin mechanism, the heating mechanism comprises a heating bin, a heating chamber is arranged on one side of the inner cavity of the heating bin, a ventilation chamber is arranged on the other side of the inner cavity of the heating bin, a guide plate is fixedly connected to one side of the inner cavity of the heating chamber, a semiconductor heater is fixedly connected to the inner wall of the heating bin, a heater hot end is arranged on one side of the semiconductor heater, a heater cold end is arranged on the other side of the semiconductor heater, a connecting pipe is arranged on the top of the inner cavity of the heating chamber, a circulating pump is arranged inside the connecting pipe, one end of the connecting pipe is connected to a circulating heating pipe, one end of the circulating heating pipe is connected to the lower end of the inner cavity of the heating chamber through a pipeline, an air inlet slot is fixedly connected to the inner wall of the heating bin, a fan is arranged inside the air inlet slot.

[0007] Furthermore, the preparation bin mechanism comprises a bin body with a discharge pipe arranged at the bottom of the inner cavity, a bin cover is arranged at the top of the bin body, and the interior of the bin body overlaps with the surface of the circulating heating tube.

[0008] Furthermore, a lifting ear is fixedly connected to the top of the bin cover, a feed pipe is provided on the surface of the bin cover, and the surface of the bin body is fixedly connected to one side of the heating bin.

[0009] Furthermore, the mixing mechanism comprises a motor, the surface of the motor is fixedly connected to the top of the bin cover, and the surface of the motor shaft is fixedly connected to a stirring plate.

[0010] Furthermore, a circulation hole is opened on the surface of the stirring plate, and a rotating shaft is fixedly connected to the surface of the stirring plate.

[0011] Furthermore, a stirring blade is rotatably connected to the surface of the rotating shaft, and a scraping frame is fixedly connected to the surface of the rotating shaft of the motor.

[0012] Furthermore, a scraping rubber strip is fixedly connected to the surface of the scraping frame, and one side of the scraping rubber strip overlaps the inner wall of the bin body.

[0013] Furthermore, the bottom of the scraping frame is fixedly connected to a scraping rod, and the bottom of the scraping rod overlaps the bottom of the inner cavity of the bin body.

[0014] Furthermore, the method specifically includes the following steps:

[0015] S1: Add epoxy resin AB glue into the silo through the feed pipe. When the weather is cold, the heat in the cold end of the heater is transferred to the hot end of the heater through the semiconductor heater, and the heat transfer oil in the heating chamber is heated by the hot end of the heater. Then, under the action of the circulation pump, the heat transfer oil enters the circulation heating pipe along the connecting pipe, and indirectly heats the epoxy resin AB glue in the silo to reduce the viscosity of the epoxy resin AB glue.

[0016] S2: During the heating process, the fan continuously blows outside air to the surface of the cold end of the heater to heat it, reduce the temperature difference between the cold and hot ends, and improve the heating effect. Under the action of the motor, the stirring plate rotates in the bin to mix and stir the epoxy resin AB glue;

[0017] S3: During stirring, the epoxy resin AB glue flows through the flow hole, which can increase the cutting effect of the stirring plate on the epoxy resin AB glue, thereby enhancing the stirring effect. During the stirring process, the stirring blade rotates under the action of the resistance of the epoxy resin AB glue, which can further enhance the stirring effect and make the stirring more uniform. After the stirring is completed;

[0018] S4: The epoxy resin AB glue is discharged from the discharge pipe at the bottom of the bin body. During the discharge process, the motor drives the scraping frame and the scraping rod to rotate, and the scraping rubber strip is used to scrape the inner wall of the bin body, and the scraping rod is used to scrape the bottom of the inner cavity of the bin body to scrape off the epoxy resin AB glue sticking to the inner wall of the bin body.

[0019] The present invention has the following advantages: when the air temperature is low, through the setting of the heating mechanism, in the process of mixing the epoxy resin AB glue, the heat of the cold end of the refrigerator is continuously transferred to the hot end through the semiconductor heater, so that the hot end of the heater heats the heat transfer oil entering the heating chamber, and then under the action of the circulating pump, the heated heat transfer oil flows along the circulating heating pipe, indirectly heating the epoxy resin AB glue in the bin body, reducing the viscosity of the glue, making the mixing mechanism mix the epoxy resin AB glue more uniformly, and the bubbles entering the glue due to stirring are easier to discharge, making it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a front view of an epoxy resin AB glue preparation device and method provided by the present invention.

[0021] Figure 2 A side view of an epoxy resin AB glue preparation device and method provided by the present invention.

[0022] Figure 3 This is a decomposition diagram of an epoxy resin AB glue preparation device and method provided by the present invention.

[0023] Figure 4 A mixing mechanism diagram of an epoxy resin AB glue preparation device and method provided by the present invention.

[0024] Figure 5 This is an exploded view of the heating mechanism of an epoxy resin AB glue preparation device and method provided by the present invention.

[0025] Figure 6 The present invention provides an epoxy resin AB glue preparation device and method Figure 5 Enlarged view of point A.

[0026] In the figure: 11, bin body; 12, bin cover; 13, lifting ear; 14, feed pipe; 21, motor; 22, stirring plate; 23, flow hole; 24, rotating shaft; 25, stirring blade; 26, scraper frame; 27, scraper rubber strip; 28, scraper rod; 31, heating bin; 32, guide plate; 33, semiconductor heater; 34, hot end of heater; 35, cold end of heater; 36, connecting pipe; 37, circulation pump; 38, circulation heating pipe; 39, air inlet slot; 310, fan. DETAILED DESCRIPTION

[0027] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Example 1

[0029] like Figures 1 to 6 As shown, an epoxy resin AB glue preparation device in an embodiment of the first aspect of the present invention comprises a preparation bin mechanism, a mixing mechanism is arranged inside the preparation bin mechanism, a heating mechanism is fixedly connected to the surface of the preparation bin mechanism, the heating mechanism comprises a heating bin 31, a heating chamber is arranged on one side of the inner cavity of the heating bin 31, a ventilation chamber is arranged on the other side of the inner cavity of the heating bin 31, a guide plate 32 is fixedly connected to one side of the inner cavity of the heating chamber, a semiconductor heater 33 is fixedly connected to the inner wall of the heating bin 31, a heater hot end 34 is arranged on one side of the semiconductor heater 33, and a heater cold end 35 is arranged on the other side of the semiconductor heater 33, a connecting pipe 36 is arranged on the top of the inner cavity of the heating chamber, a circulating pump 37 is arranged inside the connecting pipe 36, one end of the connecting pipe 36 is connected to a circulating heating pipe 38, one end of the circulating heating pipe 38 is connected to the lower end of the inner cavity of the heating chamber through a pipeline, an air inlet slot 39 is fixedly connected to the inner wall of the heating bin 31, and a fan 310 is arranged inside the air inlet slot 39;

[0030] In the above embodiment, it should be noted that when preparing the epoxy resin AB glue, the epoxy resin AB glue is added into the silo 11 through the feed pipe 14. When the weather is relatively cold, the heat in the cold end 35 of the heater is transferred to the hot end 34 of the heater through the semiconductor heater 33, and the heat transfer oil in the heating chamber is heated by the hot end 34 of the heater. Then, under the action of the circulating pump 37, the heat transfer oil enters the circulating heating pipe 38 along the connecting pipe 36, and indirectly heats the epoxy resin AB glue in the silo 11 to reduce the viscosity of the epoxy resin AB glue. At the same time, during the heating process, the fan 310 continuously blows the outside air to the surface of the cold end 35 of the heater to heat it, thereby reducing the temperature difference between the cold and hot ends and improving the heating effect.

[0031] The technical effects achieved by the above embodiments are: reducing the viscosity of the epoxy resin AB glue, improving the mixing effect of the mixing mechanism on the epoxy resin AB glue, and making it easier to discharge the bubbles that enter the glue due to stirring.

[0032] Example 2

[0033] like Figures 1 to 6As shown, a device for preparing epoxy resin AB glue includes all the contents of Example 1. In addition, the preparation bin mechanism includes a bin body 11 with a discharge pipe arranged at the bottom of the inner cavity, a bin cover 12 is arranged on the top of the bin body 11, the interior of the bin body 11 overlaps the surface of the circulating heating tube 38, a lifting ear 13 is fixedly connected to the top of the bin cover 12, a feed pipe 14 is arranged on the surface of the bin cover 12, the surface of the bin body 11 is fixedly connected to one side of the heating bin 31, and the mixing mechanism includes a motor 21, the surface of the motor 21 is fixedly connected to the top of the bin cover 12, the surface of the motor 21 shaft is fixedly connected to a stirring plate 22, the surface of the stirring plate 22 is provided with a flow hole 23, and the surface of the stirring plate 22 is fixedly connected to a rotating shaft 24;

[0034] In the above embodiment, it should be noted that, under the action of the motor 21, the stirring plate 22 is rotated in the bin body 11 to mix and stir the epoxy resin AB glue. During the stirring, the epoxy resin AB glue flows through the flow hole 23;

[0035] The technical effect achieved by the above embodiment is: the cutting effect of the stirring plate 22 on the epoxy resin AB glue can be increased, thereby enhancing the stirring effect.

[0036] Example 3

[0037] like Figures 1 to 6 As shown, an epoxy resin AB glue preparation device includes all the contents of Example 2, in addition, a stirring blade 25 is rotatably connected to the surface of the rotating shaft 24, a scraping frame 26 is fixedly connected to the surface of the rotating shaft of the motor 21, a scraping rubber strip 27 is fixedly connected to the surface of the scraping frame 26, one side of the scraping rubber strip 27 overlaps the inner wall of the bin body 11, the bottom of the scraping frame 26 is fixedly connected to the scraping rod 28, and the bottom of the scraping rod 28 overlaps the bottom of the inner cavity of the bin body 11;

[0038] In the above embodiment, it should be noted that during the stirring process, the stirring blade 25 rotates under the action of the resistance of the epoxy resin AB glue, which can further enhance the stirring effect and make the stirring more uniform. After the stirring is completed, the epoxy resin AB glue is discharged from the discharge pipe at the bottom of the bin body 11. During the discharging process, the motor 21 drives the scraping frame 26 and the scraping rod 28 to rotate, and the scraping rubber strip 27 is used to scrape the inner wall of the bin body 11, and the scraping rod 28 scrapes the bottom of the inner cavity of the bin body 11 to scrape off the epoxy resin AB glue sticking to the inner wall of the bin body 11.

[0039] The technical effect achieved by the above embodiment is: making the material discharge more thorough and more convenient to use.

[0040] Working principle: When preparing epoxy resin AB glue, add epoxy resin AB glue into the warehouse body 11 through the feeding pipe 14. When the weather is relatively cold, the heat in the cold end 35 of the heater is transferred to the hot end 34 of the heater through the semiconductor heater 33. The heat transfer oil in the heating chamber is heated by the hot end 34 of the heater. Then, under the action of the circulating pump 37, the heat transfer oil enters the circulating heating pipe 38 along the connecting pipe 36 to indirectly heat the epoxy resin AB glue in the warehouse body 11 and reduce the viscosity of the epoxy resin AB glue. At the same time, during the heating process, the outside air is continuously blown to the surface of the cold end 35 of the heater through the fan 310 to heat it, reduce the temperature difference between the cold and hot ends, and improve the heating effect. Under the action of the motor 21, the stirring plate 22 is moved in the warehouse. The epoxy resin AB glue is mixed and stirred by the motor 21. During stirring, the epoxy resin AB glue flows through the flow hole 23, which can increase the cutting effect of the stirring plate 22 on the epoxy resin AB glue, thereby enhancing the stirring effect. During the stirring process, the stirring blade 25 rotates under the action of the resistance of the epoxy resin AB glue, which can further enhance the stirring effect and make the stirring more uniform. After the stirring is completed, the epoxy resin AB glue is discharged from the discharge pipe at the bottom of the bin body 11. During the discharging process, the motor 21 drives the scraping frame 26 and the scraping rod 28 to rotate, and the inner wall of the bin body 11 is scraped by the scraping rubber strip 27, and the scraping rod 28 scrapes the bottom of the inner cavity of the bin body 11 to scrape off the epoxy resin AB glue sticking to the inner wall of the bin body 11, so that the discharge is more thorough and easier to use.

Claims

1. An epoxy resin AB glue preparation device, characterized in that: The invention comprises a preparation bin mechanism, wherein a mixing mechanism is arranged inside the preparation bin mechanism, a heating mechanism is fixedly connected to the surface of the preparation bin mechanism, the heating mechanism comprises a heating bin (31), a heating chamber is arranged on one side of the inner cavity of the heating bin (31), a ventilation chamber is arranged on the other side of the inner cavity of the heating bin (31), a guide plate (32) is fixedly connected to one side of the inner cavity of the heating chamber, a semiconductor heater (33) is fixedly connected to the inner wall of the heating bin (31), and a heater hot end (33) is arranged on one side of the semiconductor heater (33). 34), a heater cold end (35) is provided on the other side of the semiconductor heater (33), a connecting pipe (36) is provided at the top of the inner cavity of the heating chamber, a circulating pump (37) is provided inside the connecting pipe (36), one end of the connecting pipe (36) is connected to a circulating heating pipe (38), one end of the circulating heating pipe (38) is connected to the lower end of the inner cavity of the heating chamber through a pipeline, an air inlet groove (39) is fixedly connected to the inner wall of the heating chamber (31), and a fan (310) is provided inside the air inlet groove (39).

2. The epoxy resin AB glue preparation device according to claim 1, characterized in that: The preparation bin mechanism comprises a bin body (11) with a discharge pipe arranged at the bottom of the inner cavity, a bin cover (12) is arranged at the top of the bin body (11), and the interior of the bin body (11) overlaps with the surface of the circulating heating pipe (38).

3. The epoxy resin AB glue preparation device according to claim 2, characterized in that: A lifting ear (13) is fixedly connected to the top of the bin cover (12), a feed pipe (14) is provided on the surface of the bin cover (12), and the surface of the bin body (11) is fixedly connected to one side of the heating bin (31).

4. The epoxy resin AB glue preparation device according to claim 1, characterized in that: The mixing mechanism comprises a motor (21), the surface of the motor (21) is fixedly connected to the top of the bin cover (12), and the surface of the rotating shaft of the motor (21) is fixedly connected to a stirring plate (22).

5. The epoxy resin AB glue preparation device according to claim 4, characterized in that: A circulation hole (23) is provided on the surface of the stirring plate (22), and a rotating shaft (24) is fixedly connected to the surface of the stirring plate (22).

6. The epoxy resin AB glue preparation device according to claim 5, characterized in that: The surface of the rotating shaft (24) is rotatably connected to a stirring blade (25), and the surface of the rotating shaft of the motor (21) is fixedly connected to a scraping frame (26).

7. The epoxy resin AB glue preparation device according to claim 6, characterized in that: A scraping rubber strip (27) is fixedly connected to the surface of the scraping frame (26), and one side of the scraping rubber strip (27) overlaps the inner wall of the bin body (11).

8. The epoxy resin AB glue preparation device according to claim 7, characterized in that: The bottom of the scraping frame (26) is fixedly connected to a scraping rod (28), and the bottom of the scraping rod (28) overlaps the bottom of the inner cavity of the bin body (11).

9. A method for preparing epoxy resin AB glue using the epoxy resin AB glue preparation device as claimed in claim 8, characterized in that: The specific steps include: S1: adding epoxy resin AB glue into the bin (11) through the feed pipe (14); when the weather is relatively cold, transferring the heat in the cold end (35) of the heater to the hot end (34) of the heater through the semiconductor heater (33); heating the heat transfer oil in the heating chamber through the hot end (34); and then, under the action of the circulation pump (37), allowing the heat transfer oil to flow along the connecting pipe (36) into the circulation heating pipe (38), thereby indirectly heating the epoxy resin AB glue in the bin (11) and reducing the viscosity of the epoxy resin AB glue; S2: During the heating process, the fan (310) continuously blows outside air toward the surface of the cold end (35) of the heater to heat it, thereby reducing the temperature difference between the cold and hot ends and improving the heating effect. Under the action of the motor (21), the stirring plate (22) rotates in the bin (11) to mix and stir the epoxy resin AB glue; S3: During stirring, the epoxy resin AB glue flows through the flow hole (23), which can increase the cutting effect of the stirring plate (22) on the epoxy resin AB glue, thereby enhancing the stirring effect. During the stirring process, the stirring blade (25) rotates under the action of the resistance of the epoxy resin AB glue, which can further enhance the stirring effect and make the stirring more uniform. After the stirring is completed; S4: The epoxy resin AB glue is discharged from the discharge pipe at the bottom of the bin body (1). During the discharge process, the motor (21) drives the scraping frame (26) and the scraping rod (28) to rotate, and the scraping rubber strip (27) is used to scrape the inner wall of the bin body (11). The scraping rod (28) scrapes the bottom of the inner cavity of the bin body (11), and the epoxy resin AB glue adhering to the inner wall of the bin body (11) is scraped off.

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