Polishing pad cutting device and cutting method

Abstract

The invention belongs to the technical field of cutting, and particularly relates to a polishing pad cutting device and method. The invention provides a polishing pad cutting device. The polishing pad cutting device comprises a positioning disc; the limiting ring is arranged on the outer wall of the positioning disc in a lifting and sleeving manner; the gasket is arranged on the surface of the positioning disc; a plurality of limiting grooves are formed in the inner wall of the limiting ring in the radial direction. When the cutting mechanism cuts the redundant part of the edge of the gasket, a plurality of protruding blocks corresponding to the limiting grooves are reserved on the outer wall of the gasket in the radial direction. The limiting ring moves upwards till the protruding block is inserted into the limiting groove, the limiting ring moves downwards reversely, the inner wall of the limiting groove extrudes the protruding block to deform downwards, and the gasket is limited in the radial direction; through cooperation of the limiting ring and the gasket, when the redundant part outside the gasket is cut, the protruding block is reserved so that the limiting ring can limit the gasket in the radial direction, and the stability of the gasket and the positioning disc in the polishing process is improved.

Description

Technical Field

[0001] The invention belongs to the field of cutting technology, and specifically relates to cutting through a workpiece, and more particularly to a polishing pad cutting device and a cutting method. Background Art

[0002] In the semiconductor silicon carbide substrate industry, in order to solve the surface roughness of silicon wafers, chemical mechanical polishing mechanism is often used to process wafers. The most common problem of wafer surface scratches is during the polishing process. If the edge of the polishing pad is not properly chamfered before polishing and there are angular burrs, it will contact the wafer surface during polishing, causing scratches on the wafer surface, affecting the wafer's first pass rate and production yield.

[0003] In the related art, the wafer polishing pad is generally larger than the polishing disk. After the polishing pad is applied to the surface of the polishing disk, the excess part needs to be cut off; the edges of the new polishing pad are manually polished and chamfered using a cutting mechanism; however, due to the unstable force and direction of the operator during the chamfering process, the edge of the new polishing pad will be offset relative to the polishing disk, resulting in occasional angular burrs on the edge of the new polishing pad, and the new polishing pad with burrs on the edge affects the wafer's one-time pass rate and production yield.

[0004] Therefore, how to prevent the polishing pad edge from being offset relative to the polishing plate during the chamfering process is a technical problem that urgently needs to be solved in the art.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The disclosed embodiments at least provide a polishing pad cutting device and a cutting method.

[0007] In a first aspect, an embodiment of the present disclosure provides a polishing pad cutting device, comprising: A limiting ring, the lifting sleeve of which is arranged on the outer wall of the positioning plate; A gasket, which is arranged on the surface of the positioning plate; The inner wall of the limiting ring is provided with a plurality of limiting grooves along the radial direction; When the cutting mechanism cuts the excess portion of the gasket edge, a plurality of protrusions corresponding to the limiting grooves are reserved radially on the outer wall of the gasket; The limiting ring moves upward until the protrusion is inserted into the limiting groove, and the limiting ring moves downward in the opposite direction, and the inner wall of the limiting groove squeezes the protrusion to deform downward to radially limit the gasket.

[0008] In an optional embodiment, the number of the protrusions is even, and every two protrusions are symmetrically arranged on the outer wall of the gasket, and the outer ends of the protrusions protrude from the positioning plate.

[0009] In an optional embodiment, the limiting grooves are an even number, and every two of the limiting grooves are symmetrically arranged on the inner wall of the limiting ring, and the limiting grooves face the gasket.

[0010] In an optional embodiment, a side wall of each of the limiting grooves away from the gasket is provided with a limiting block, and the side wall of the limiting block is inclined from top to bottom; When the limiting ring moves upward relative to the gasket, the limiting block pushes the protrusion upward to deform until the outer end of the protrusion abuts against the side wall of the limiting block; When the limiting ring moves downward in the reverse direction, the limiting block is suitable for stretching the protrusion to deform downward to limit the gasket radially.

[0011] In an optional embodiment, the thickness of the limiting ring is greater than the thickness of the gasket; The radial length of the limiting groove is not less than the radial length of the protrusion.

[0012] In an optional embodiment, a plurality of spiral columns are radially rotated on the outer wall of the limiting ring, the spiral columns penetrate the limiting ring, and the inner ends of the spiral columns abut against the outer wall of the positioning plate.

[0013] In an optional embodiment, the positioning plate; A limiting ring, the lifting sleeve of which is arranged on the outer wall of the positioning plate; A gasket, which is arranged on the surface of the positioning plate, and the outer diameter of the gasket is larger than that of the positioning plate; a cutting mechanism disposed above the gasket; Wherein, when the cutting mechanism moves downward to cut off the excess portion of the gasket edge, a plurality of protrusions are reserved radially on the outer wall of the gasket; The limiting ring moves upward until the protrusion is located on the inner wall of the limiting ring, and the limiting ring moves downward in the opposite direction to squeeze the protrusion downward to deform, so that each protrusion radially limits the gasket.

[0014] In an optional embodiment, the inner wall of the limiting ring is provided with a plurality of limiting grooves corresponding to the protrusions, the limiting grooves are an even number, and every two limiting grooves are symmetrically arranged.

[0015] In an optional embodiment, the number of the protrusions is even, and every two protrusions are symmetrically arranged on the outer wall of the gasket, and the outer ends of the protrusions protrude from the positioning plate.

[0016] In an optional embodiment, a side wall of each of the limiting grooves away from the gasket is provided with a limiting block, and the side wall of the limiting block is inclined from top to bottom; When the limiting ring moves upward relative to the gasket, the limiting block pushes the protrusion upward to deform until the outer end of the protrusion abuts against the side wall of the limiting block; When the limiting ring moves downward in the reverse direction, the limiting block is suitable for stretching the protrusion to deform downward to limit the gasket radially.

[0017] In an optional embodiment, the thickness of the limiting ring is greater than the thickness of the gasket; The radial length of the limiting groove is not less than the radial length of the protrusion.

[0018] In a second aspect, the present disclosure also provides a cutting method of a cutting mechanism, the cutting method comprising: When the cutting mechanism cuts off the excess portion of the gasket edge, a number of protrusions corresponding to the limiting grooves are reserved along the radial direction of the gasket outer wall; The limiting ring moves upward until the protrusion is inserted into the limiting groove, and the limiting ring moves downward in the opposite direction, and the inner wall of the limiting groove squeezes the protrusion to deform downward to radially limit the gasket.

[0019] The beneficial effect of the present invention is that a polishing pad cutting device and a cutting method, through the cooperation of a limit ring and a gasket, a cutting mechanism reserves a plurality of protrusions when cutting the excess part outside the gasket; and after the limit ring moves upward until the protrusion is inserted into the limit groove, the limit ring moves downward in the opposite direction to pull the protrusion downward to deform, so that the protrusion radially limits the gasket, and when the outer wall edge of the gasket is polished, the stability between the gasket and the positioning plate is improved.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0021] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A perspective view of a polishing pad cutting device provided in an embodiment of the present disclosure; Figure 2 A three-dimensional view of a gasket provided in an embodiment of the present disclosure after trimming; Figure 3 A sectional perspective view of a stop ring and a gasket provided in an embodiment of the present disclosure; Figure 4 A sectional front view of a stop ring and a gasket provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of a state in which a limit ring provided in an embodiment of the present disclosure moves upward relative to a gasket; Figure 6 A schematic diagram of a state where a protrusion provided in an embodiment of the present disclosure is inserted into a limiting groove; Figure 7 A schematic diagram of the state of a radial limiting gasket of a protrusion provided in an embodiment of the present disclosure; Figure 8 A front view of the positioning plate and cutting mechanism provided in an embodiment of the present disclosure.

[0024] In the figure: 1. Positioning plate; 2. Limiting ring; 20. Limiting groove; 21. Limiting block; 22. Screw column; 3. Gasket; 30. Bump; 4. Cutting mechanism. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0027] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0028] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0029] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0030] After research, it was found that the shortcomings of the prior art are: in the related technology, the polishing pad of a new chip is generally larger than the polishing disk. After the new polishing pad is applied to the surface of the polishing disk, the excess part needs to be cut off; the edges of the new polishing pad are manually polished and chamfered using a cutting mechanism; however, due to the unstable force and direction of the operator during the chamfering process, the edge of the new polishing pad will be offset relative to the polishing disk, resulting in occasional angular burrs on the edge of the new polishing pad, and the new polishing pad with burrs on the edge affects the one-time pass rate and production yield of the chip.

[0031] Therefore, how to solve the technical problem that the new polishing pad is offset relative to the polishing plate during the chamfering process of the edge of the new polishing pad is a technical problem that urgently needs to be solved in the field.

[0032] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0035] like Figures 1 to 8 As shown, at least some embodiments provide a polishing pad cutting device, including: a positioning disk 1, the positioning disk 1 described in this embodiment is a grinding disk; a limiting ring 2, the lifting sleeve of which is arranged on the outer wall of the positioning disk 1; the outer wall of the limiting ring 2 is provided with a plurality of spiral columns 22 along the radial rotation, the spiral columns 22 penetrate the limiting ring 2, and the inner ends of the spiral columns 22 abut against the outer wall of the positioning disk 1. Through the arrangement of the spiral columns 22, after the limiting ring 2 stops lifting and moving, the spiral columns 22 rotate circumferentially to limit the limiting ring 2 and fix it on the outer wall of the positioning disk 1. A gasket 3 is arranged on the surface of the positioning disk 1; the gasket 3 is a polishing pad, and when the gasket 3 is not cut, its outer diameter is larger than the outer diameter of the positioning disk 1. The inner wall of the limiting ring 2 is provided with a plurality of limiting grooves 20 in the radial direction; wherein, when the cutting mechanism 4 cuts the excess part of the edge of the gasket 3, a plurality of protrusions 30 corresponding to the limiting grooves 20 are reserved in the radial direction on the outer wall of the gasket 3; the limiting ring 2 moves upward until the protrusion 30 is inserted into the limiting groove 20, and the limiting ring 2 moves downward in the reverse direction, and the inner wall of the limiting groove 20 squeezes the protrusion 30 to deform downward, so as to limit the gasket 3 in the radial direction. Through the cooperation between the limiting ring 2 and the gasket 3, the cutting mechanism 4 reserves a plurality of protrusions 30 when cutting the excess part of the outer part of the gasket 3; and after the limiting ring 2 moves upward until the protrusion 30 is inserted into the limiting groove 20, the limiting ring 2 moves downward in the reverse direction to pull the protrusion 30 to deform downward, so that the protrusion 30 radially limits the gasket 3, and when the outer wall edge of the gasket 3 is polished, the stability between the gasket 3 and the positioning plate 1 is improved.

[0036] Reference Figure 2 The number of the protrusions 30 is even, and every two protrusions 30 are symmetrically arranged on the outer wall of the gasket 3, and the outer ends of the protrusions 30 protrude from the positioning plate 1. Preferably, the number of the protrusions 30 is four.

[0037] Reference Figure 1 The limiting grooves 20 are an even number, and every two limiting grooves 20 are symmetrically arranged on the inner wall of the limiting ring 2, and the limiting grooves 20 face the gasket 3. Preferably, there are four limiting grooves 20. One convex block 30 corresponds to one limiting groove 20, and the convex block 30 is suitable for being inserted into the limiting groove 20.

[0038] Reference Figure 3A limit block 21 is provided on the side wall of each limit groove 20 away from the gasket 3, and the side wall of the limit block 21 is inclined from top to bottom; when the limit ring 2 moves upward, the limit block 21 stretches the protrusion 30 to deform upward, and when the limit ring 2 moves downward, the limit block 21 stretches the protrusion 30 to deform downward.

[0039] Reference Figure 5 When the limiting ring 2 moves upward relative to the gasket 3, the limiting block 21 pushes the protrusion 30 to deform upward until the outer end of the protrusion 30 abuts against the side wall of the limiting block 21; at this time, the protrusion 30 is completely inserted into the limiting groove 20, and the limiting ring 2 stops moving upward. For the specific state, please refer to the attached Figure 6 , until the protrusion 30 recovers from the upward deformation state to the horizontal state.

[0040] Reference Figure 7 When the limiting ring 2 moves downward in the reverse direction, the limiting block 21 is suitable for stretching the protrusion 30 to deform downward to radially limit the gasket 3. The limiting ring 2 moves downward to a level lower than the gasket 3. At this time, each protrusion 30 is pushed downward by the limiting block 21 to deform. The four protrusions 30 are suitable for radially limiting the gasket 3 from four directions to improve the stability between the gasket 3 and the positioning plate 1; after the gasket 3 is radially limited by each protrusion 30, the cutting mechanism 4 is convenient for chamfering and deburring the outer wall of the gasket 3, and the gasket 3 will not be offset relative to the positioning plate 1.

[0041] Reference Figure 4 , the thickness of the limiting ring 2 is greater than the thickness of the gasket 3 ; the radial length of the limiting groove 20 is not less than the radial length of the protrusion 30 .

[0042] Reference Figure 8 Some embodiments provide a polishing pad cutting device, including: a positioning plate 1; a limiting ring 2, a lifting sleeve of which is arranged on the outer wall of the positioning plate 1; a gasket 3, which is arranged on the surface of the positioning plate 1, and the outer diameter of the gasket 3 is larger than the positioning plate 1; a cutting mechanism 4, which is arranged above the gasket 3; wherein, when the cutting mechanism 4 moves downward to cut the excess part of the edge of the gasket 3, a plurality of protrusions 30 are reserved radially on the outer wall of the gasket 3; the limiting ring 2 moves upward until the protrusion 30 is located on the inner wall of the limiting ring 2, and the limiting ring 2 moves downward in the opposite direction to squeeze the protrusion 30 to deform downward, so that each protrusion 30 radially limits the gasket 3.

[0043] Some embodiments provide a cutting method of a cutting mechanism, the cutting method comprising: when the cutting mechanism 4 cuts off the excess portion of the edge of the gasket 3, a plurality of protrusions 30 corresponding to the limiting groove 20 are radially reserved on the outer wall of the gasket 3; the limiting ring 2 moves upward until the protrusion 30 is inserted into the limiting groove 20, and the limiting ring 2 moves downward in the opposite direction, and the inner wall of the limiting groove 20 squeezes the protrusion 30 to deform downward, so as to radially limit the gasket 3.

[0044] To summarize, after the gasket 3 is fixed on the positioning disk 1, the cutting mechanism 4 moves downward to cut off the excess parts around the gasket 3, so that the outer diameter of the cut gasket 3 is consistent with the outer diameter of the positioning disk 1, and after the cutting is completed, four protrusions 30 are retained on the outer wall of the gasket 3; the limiting ring 2 moves upward until the protrusion 30 is inserted into the limiting groove 20, and the limiting ring 2 moves downward in the opposite direction until the protrusion 30 is squeezed and deformed by the limiting block 21. Each protrusion 30 is suitable for radially limiting the gasket 3, thereby improving the stability between the gasket 3 and the positioning disk 1. When the cutting mechanism 4 chamfers and deburrs the outer wall of the edge of the gasket 3, the gasket 3 is prevented from shifting relative to the positioning disk 1, thereby improving the chamfering and deburring effect.

[0045] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0047] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A polishing pad cutting device, characterized in that: include: Positioning plate (1); A limiting ring (2), the lifting sleeve of which is arranged on the outer wall of the positioning plate (1); A gasket (3) arranged on the surface of the positioning plate (1); The inner wall of the limiting ring (2) is provided with a plurality of limiting grooves (20) along the radial direction; When the cutting mechanism (4) cuts off the excess portion of the edge of the gasket (3), a plurality of protrusions (30) corresponding to the limiting grooves (20) are reserved radially on the outer wall of the gasket (3); The limiting ring (2) moves upward until the protrusion (30) is embedded in the limiting groove (20), and the limiting ring (2) moves downward in the opposite direction, and the inner wall of the limiting groove (20) stretches the protrusion (30) to deform downward, thereby radially limiting the gasket (3).

2. The polishing pad cutting device according to claim 1, characterized in that: The protrusions (30) are an even number, and every two protrusions (30) are symmetrically arranged on the outer wall of the gasket (3), and the outer ends of the protrusions (30) protrude from the positioning plate (1); The limiting grooves (20) are an even number, and every two of the limiting grooves (20) are symmetrically arranged on the inner wall of the limiting ring (2), and the limiting grooves (20) face the gasket (3).

3. The polishing pad cutting device according to claim 2, characterized in that: A limiting block (21) is provided on the side wall of each limiting groove (20) away from the gasket (3), and the side wall of the limiting block (21) is inclined from top to bottom; When the limiting ring (2) moves upward relative to the gasket (3), the limiting block (21) pushes the protrusion (30) to deform upward until the outer end of the protrusion (30) abuts against the side wall of the limiting block (21); When the limiting ring (2) moves downward in the reverse direction, the limiting block (21) is adapted to stretch the protrusion (30) to deform downward, thereby limiting the gasket (3) in the radial direction.

4. The polishing pad cutting device according to claim 1, wherein: The thickness of the limiting ring (2) is greater than the thickness of the gasket (3); The radial length of the limiting groove (20) is not less than the radial length of the protrusion (30).

5. The polishing pad cutting device according to claim 1, wherein: The outer wall of the limiting ring (2) is provided with a plurality of spiral columns (22) which are rotated radially. The spiral columns (22) penetrate the limiting ring (2), and the inner ends of the spiral columns (22) abut against the outer wall of the positioning plate (1).

6. A polishing pad cutting device, characterized in that: include: Positioning plate (1); A limiting ring (2), the lifting sleeve of which is arranged on the outer wall of the positioning plate (1); A gasket (3) arranged on the surface of the positioning plate (1), wherein the outer diameter of the gasket (3) is greater than that of the positioning plate (1); A cutting mechanism (4) is arranged above the gasket (3) When the cutting mechanism (4) moves downward to cut off the excess edge portion of the gasket (3) beyond the positioning plate (1), a plurality of protrusions (30) are reserved radially on the outer wall of the gasket (3); The limiting ring (2) moves upward until the protrusion (30) is embedded in the inner wall of the limiting ring (2), and the limiting ring (2) moves downward in the opposite direction to stretch the protrusion (30) to deform downward, so that each protrusion (30) radially limits the gasket (3).

7. The polishing pad cutting device according to claim 6, characterized in that: The inner wall of the limiting ring (2) is provided with a plurality of limiting grooves (20) corresponding to the protrusions (30), the limiting grooves (20) are an even number, and every two limiting grooves (20) are symmetrically arranged.

8. The polishing pad cutting device according to claim 7, wherein: A limiting block (21) is provided on the side wall of each limiting groove (20) away from the gasket (3), and the side wall of the limiting block (21) is inclined from top to bottom; When the limiting ring (2) moves upward relative to the gasket (3), the limiting block (21) pushes the protrusion (30) to deform upward until the outer end of the protrusion (30) abuts against the side wall of the limiting block (21); When the limiting ring (2) moves downward in the reverse direction, the limiting block (21) is suitable for stretching the protrusion (30) to deform downward to form the gasket (3).

9. The polishing pad cutting device according to claim 8, characterized in that: The thickness of the limiting ring (2) is greater than the thickness of the gasket (3); The radial length of the limiting groove (20) is not less than the radial length of the protrusion (30).

10. A cutting method of a cutting mechanism, characterized in that: Using the polishing pad cutting device according to any one of claims 1 to 9, the cutting method comprises: When the cutting mechanism (4) cuts off the excess portion of the edge of the gasket (3), a plurality of protrusions (30) corresponding to the limiting grooves (20) are reserved radially on the outer wall of the gasket (3); The limiting ring (2) moves upward until the protrusion (30) is inserted into the limiting groove (20), and the limiting ring (2) moves downward in the opposite direction, and the inner wall of the limiting groove (20) squeezes the protrusion (30) to deform downward, thereby radially limiting the gasket (3).

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