A new material cutting and processing device for silicon wafers

Abstract

The present invention relates to the technical field of building material cutting, and more specifically, to a device for cutting and processing new silicon wafer materials. The device comprises a base, a mounting frame, and a processing table. A cutting mechanism is mounted on the mounting frame. A pushing mechanism is provided on the top of the processing table. The pushing mechanism comprises at least a plurality of guide rods, and a clamping mechanism is slidably connected to each of the guide rods. The clamping mechanism comprises a plurality of fixing members, and a second spring is provided between two fixing members located on the same horizontal line. In the device for cutting and processing new silicon wafer materials, as the pushing mechanism pushes the silicon wafer toward the cutting mechanism, the fixing members on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing members approaching each other are used to clamp the two sides of the cutting line of the silicon wafer. The clamping mechanism can reduce stress generated within the silicon wafer. The cutting mechanism is used to cut the silicon wafer, which is fixed above and below and on both sides of the cutting line, into a fixed length.

Description

Technical Field

[0001] The present invention relates to the technical field of building material cutting, in particular to a silicon wafer new material cutting and processing device. Background Art

[0002] Solar photovoltaic tiles are a building material that combines the power generation capabilities of solar energy with those of traditional tiles. They typically integrate silicon solar cells with traditional tiles. These tiles not only provide traditional roof protection and shelter from the elements, but also generate electricity from the sun.

[0003] Silicon wafer cutting is a critical step in the production of solar photovoltaic tiles. To accommodate the design and installation requirements of different buildings, silicon wafers must be cut into a variety of sizes and specifications. However, the actual cutting process presents numerous challenges. First, the wafer fixing process presents a dilemma. If the fixing is too tight, residual stress will remain within the wafer, leading to serious quality issues such as cracking and warping, significantly shortening the wafer's lifespan and increasing production costs. This residual stress will gradually accumulate and release under subsequent use and environmental factors, ultimately causing the wafer to lose its original performance and structural integrity. On the other hand, if the fixing is too loose, the wafer will tilt during the cutting process, severely impacting the yield rate. Each tilted wafer is likely to become a defective product that fails to meet the quality standards of the solar photovoltaic tiles, resulting in significant waste and reduced production efficiency and economic benefits.

[0004] When securing a silicon wafer, existing silicon wafer cutting devices typically first place the wafer to be cut within a fixture, then clamp the wafer's top and bottom surfaces, as well as the two sides perpendicular to the cutting line. However, existing clamping mechanisms typically clamp the wafer using two adjacent fixtures. This method of securing the wafer creates stress concentration at the contact points between the wafer and the fixtures the moment they come into contact. For brittle materials like silicon wafers, these areas of stress concentration are prone to fracture, severely impacting the production schedule and quality control of solar photovoltaic tiles. This has become a technical bottleneck that urgently needs to be addressed in the development of the solar photovoltaic tile industry.

[0005] In view of this, we propose a new material cutting and processing device for silicon wafers to improve the deficiencies in the existing technology. Summary of the Invention

[0006] The purpose of the present invention is to provide a new material cutting and processing device for silicon wafers to solve the problems raised in the above background technology.

[0007] To achieve the above objectives, the present invention provides a new material cutting and processing device for silicon wafers, comprising a base, a mounting frame, and a processing table, wherein a cutting mechanism is mounted on the mounting frame, a pushing mechanism is provided on the top of the processing table, the pushing mechanism comprising at least a plurality of guide rods, a plurality of guide rods being slidably connected to a clamping mechanism, the clamping mechanism comprising a plurality of fixing members, and a second spring being provided between each of two fixing members located on the same horizontal line;

[0008] Among them, the clamping mechanism is used to fix the upper and lower sides of the silicon wafer to be cut, and a cutting channel is provided between the two fixing parts located on the same height plane. The pushing mechanism is used to push the silicon wafer fixed by the clamping mechanism on the upper and lower sides toward the cutting mechanism. In the process of the pushing mechanism pushing the silicon wafer toward the cutting mechanism, the fixing parts on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing parts close to each other are used to clamp the two sides of the cutting line of the silicon wafer. The clamping mechanism can reduce the stress generated inside the silicon wafer. The cutting mechanism is used to cut the silicon wafer fixed on the top and bottom and on both sides of the cutting line into a fixed length.

[0009] As a further improvement of the present technical solution, the cutting mechanism includes a turntable rotatably connected to the same side of the mounting frame, and the outer sleeves of the two turntables are provided with wire saws. The turntable is driven by a motor, and the motor is located on the side of the mounting frame away from the turntable, and one of the turntables is coaxially connected to the output shaft of the motor.

[0010] As a further improvement of the present technical solution, a cutting groove is provided on the top of the processing table, and the wire saw passes through the cutting groove, and the direction in which the wire saw passes through the wire saw is perpendicular to and upwards from the processing table.

[0011] As a further improvement of the present technical solution, the pushing mechanism also includes a first bracket and a second bracket fixedly connected to the top of the processing table, the four corners of the first bracket and the second bracket are slidably connected to a guide rod, a plurality of hydraulic rods are provided on the first bracket, and the fixed part of each hydraulic rod is fixedly connected to the first bracket, and a drive plate is provided between the first bracket and the second bracket, the drive plate is slidably connected to each guide rod, and the drive plate is fixedly connected to the movable part of each hydraulic rod.

[0012] As a further improvement of the present technical solution, the fixing part includes two limit plates slidably connected on the same vertical line, a number of limit rods are fixedly connected between the two limit plates, a pair of vertically distributed clamping arms are slidably connected to the several limit rods, a number of first springs are provided between each clamping arm and the adjacent limit plate, each first spring is sleeved on the outer periphery of the limit rod, and an adjustment rod is slidably connected between the two limit plates slidably connected to the same guide rod.

[0013] As a further improvement of the present technical solution, each of the second springs is sleeved on the periphery of the guide rod, the second spring is located between two adjacent limit plates on the same horizontal line, and the two ends of the second spring are fixedly connected to the two limit plates respectively.

[0014] As a further improvement of this technical solution, the friction coefficient of the limit plate close to the driving plate is greater than the friction coefficient of the limit plate far from the driving plate, and the friction between the driving plate and the guide rod is greater than the friction between the silicon wafer and the clamping arm.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. In this silicon wafer new material cutting and processing device, a clamping mechanism is set up to fix the upper and lower sides of the silicon wafer to be cut. A cutting channel is provided between two fixing parts located on the same height plane. The pushing mechanism is used to push the silicon wafer fixed by the clamping mechanism on the upper and lower sides toward the cutting mechanism.

[0017] 2. In this new silicon wafer material cutting and processing device, when the pushing mechanism pushes the silicon wafer close to the cutting mechanism, the fixing parts on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing parts close to each other are used to clamp the two sides of the cutting line of the silicon wafer. The clamping mechanism can reduce the stress generated inside the silicon wafer. The cutting mechanism is used to cut the silicon wafer fixed at the top and bottom and on both sides of the cutting line into a fixed length. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 A three-dimensional diagram of the cutting mechanism of the present invention;

[0020] Figure 3 It is a front view showing the positional relationship between the pushing mechanism and the clamping mechanism of the present invention;

[0021] Figure 4 It is a front view of the pushing mechanism of the present invention;

[0022] Figure 5 It is a front view of the clamping mechanism of the present invention;

[0023] Figure 6 It is a cutaway perspective view of the pushing mechanism and the clamping mechanism of the present invention;

[0024] Figure 7 It is a front view showing the positional relationship between the clamping mechanism and the second spring of the present invention.

[0025] The meaning of each number in the figure is:

[0026] 100, base; 110, mounting frame; 120, processing table;

[0027] 200, cutting mechanism; 210, turntable; 220, wire saw; 230, motor;

[0028] 300, pushing mechanism; 310, first bracket; 320, second bracket; 330, guide rod; 340, hydraulic rod; 350, driving plate;

[0029] 400, clamping mechanism; 410, limiting plate; 420, limiting rod; 430, clamping arm; 440, first spring;

[0030] 500. Second spring. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "several" means two or more, unless otherwise specifically defined.

[0034] In order to ensure that both sides of the silicon wafer can automatically adhere to the fixing mechanism (the clamping mechanism 400 described below, specifically the fixing members arranged at both ends of the cutting line of the silicon wafer to be cut) during the process of cutting the silicon wafer, the clamping mechanism 400 in the present invention is configured as fixing members respectively fixed on both sides of the silicon wafer to be cut. Figure 1As shown, the present embodiment aims to provide a new material cutting and processing device for silicon wafers, comprising a base 100, a mounting frame 110, and a processing table 120. A cutting mechanism 200 is mounted on the mounting frame 110. A pushing mechanism 300 is provided on the top of the processing table 120. The pushing mechanism 300 includes at least a plurality of guide rods 330. A clamping mechanism 400 is slidably connected to the plurality of guide rods 330. The clamping mechanism 400 includes a plurality of fixing members. A second spring 500 is provided between each of the two fixing members located on the same horizontal line.

[0035] Among them, the clamping mechanism 400 is used to fix the upper and lower sides of the silicon wafer to be cut, and a cutting channel is provided between the two fixing parts located on the same height plane. The pushing mechanism 300 is used to push the silicon wafer fixed by the clamping mechanism 400 on the upper and lower sides toward the cutting mechanism 200. In the process of the pushing mechanism 300 pushing the silicon wafer close to the cutting mechanism 200, the fixing parts on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line. The two fixing parts close to each other are used to clamp the two sides of the cutting line of the silicon wafer. The clamping mechanism 400 can reduce the stress generated inside the silicon wafer. The cutting mechanism 200 is used to cut the silicon wafer fixed on the top and bottom and on both sides of the cutting line into a fixed length.

[0036] Working Principle: The silicon wafer (a long, thin wafer) to be cut is inserted between two pairs of spaced-apart fixtures, with some space between the two sides of the wafer and the fixtures. The pushing mechanism 300 is then activated to drive the wafer toward the cutting mechanism 200. During this process, due to the difference in friction between the limiting plate 410 and the guide rod 330, and between the wafer and the clamping arms 430, the clamping arms 430 on either side of the wafer's cutting line first approach each other under the push of the driving plate 350, until the fixtures on both sides of the wafer are in close contact with both sides of the wafer.

[0037] When the two fixing parts approach each other, due to the difference in friction between the limit plate 410 and the guide rod 330 close to and away from the driving plate 350, and the friction between the limit plate 410 and the guide rod 330 away from the driving plate 350 is greater, in the initial stage of the two fixing parts approaching each other, the limit plate 410 away from the driving plate 350 remains stationary on the guide rod 330, and the limit plate 410 close to the driving plate 350 gradually approaches the limit plate 410 away from the driving plate 350. When the second spring 500 between the two limit plates 410 is compressed, a rebound force will be generated, thereby slowing down the speed at which the two limit plates 410 on the same guide rod 330 approach each other, until the silicon wafer is completely tightly attached to the fixing parts on both sides to form a clamping mechanism 400 as a whole. At this time, the pushing mechanism 300 continues to push the silicon wafer fixed on the top and bottom and both sides to approach the cutting mechanism 200, and the cutting mechanism 200 gradually cuts off the silicon wafer close to itself. After a section of the silicon wafer is cut, the pushing mechanism 300 drives the clamping mechanism 400 to reset, and then pushes the silicon wafer forward in a direction perpendicular to the cutting line. Then the above operation is repeated to continue cutting.

[0038] In order to cut the silicon wafer into the required length, such as Figure 2 As shown, the cutting mechanism 200 includes a turntable 210 rotatably connected to the same side of the mounting frame 110, and a wire saw 220 is provided on the outer periphery of the two turntables 210. The turntable 210 is driven by a motor 230, and the motor 230 is located on the side of the mounting frame 110 away from the turntable 210, and one of the turntables 210 is coaxially connected to the output shaft of the motor 230.

[0039] The improvement is that: a cutting groove is opened on the top of the processing table 120, and the wire saw 220 passes through the cutting groove, and the direction of the wire saw 220 passing through the wire saw 220 is perpendicular to the processing table 120 and upward; after the power of the motor 230 is turned on, the motor 230 drives the turntable 210 coaxially connected to its own output shaft to rotate, and the turntable 210 drives the wire saw 220 on its periphery to rotate. Driven by the two turntables 210, the wire saw 220 continuously passes through the inside of the cutting groove. Under the push of the pushing mechanism 300, the silicon wafer passes through the wire saw 220, thereby cutting off the silicon wafer.

[0040] In order to provide a stable pushing amount for the silicon wafer during the cutting process, a pushing mechanism 300 is provided to push the silicon wafer toward the wire saw 220. Figure 3 and Figure 4In the figure, the pushing mechanism 300 also includes a first bracket 310 and a second bracket 320 fixedly connected to the top of the processing table 120. The four corners of the first bracket 310 and the second bracket 320 are slidably connected to a guide rod 330. A plurality of hydraulic rods 340 are provided on the first bracket 310. The fixed part of each hydraulic rod 340 is fixedly connected to the first bracket 310. A driving plate 350 is provided between the first bracket 310 and the second bracket 320. The driving plate 350 is slidably connected to each guide rod 330, and the driving plate 350 is fixedly connected to the movable part of each hydraulic rod 340.

[0041] The improvement is that after the silicon wafer to be cut is placed inside the clamping mechanism 400, the hydraulic rod 340 is started. The hydraulic rod 340 pushes the driving plate 350 to slide along the guide rod 330 through its movable part. The driving plate 350 drives the silicon wafer in the clamping mechanism 400 to approach the wire saw 220, thereby cutting the silicon wafer.

[0042] The silicon wafer fixation process presents a dilemma: if it is fixed too tightly, residual stress will remain within the wafer, leading to serious quality issues such as cracking and warping, significantly shortening the wafer's service life and increasing production costs. This residual stress will gradually accumulate and release under subsequent use and environmental factors, ultimately causing the wafer to lose its original performance and structural integrity. On the other hand, if the wafer is fixed too loosely, it will tilt during the cutting process, seriously affecting the yield rate. Currently, existing silicon wafer cutting devices typically place the wafer to be cut within a clamping mechanism 400, then clamp the wafer on both sides, as well as the sides perpendicular to the cutting line. However, existing clamping mechanisms 400 typically clamp the wafer using two adjacent fixtures (described below) to secure the two sides. This fixing method causes stress concentration at the contact point between the wafer and the fixture at the moment the fixture contacts the wafer. For brittle materials like silicon wafers, these stress-concentrated areas are prone to fracture. Therefore, the clamping mechanism 400 is configured as a fixing part fixed on both sides of the silicon wafer to be cut, and the difference in friction between the fixing part and the guide rod 330 and the friction between the silicon wafer and the clamping arm 430 is utilized to make the clamping process of the fixing part on the silicon wafer more "smooth".

[0043] like Figure 5-Figure 7As shown, the specific structure of the fixing member is disclosed below. The fixing member includes two limit plates 410 slidably connected to the same vertical line, a plurality of limit rods 420 are fixedly connected between the two limit plates 410, a pair of vertically distributed clamping arms 430 are slidably connected to the plurality of limit rods 420, and a plurality of first springs 440 are provided between each clamping arm 430 and the adjacent limit plate 410. Each first spring 440 is sleeved on the outer periphery of the limit rod 420, and an adjusting rod is slidably connected between the two limit plates 410 slidably connected to the same guide rod 330;

[0044] Specifically, when placing a silicon wafer, the clamping arms 430 on the same limiting rod 420 are pushed to slide along the limiting rod 420, separating the two clamping arms 430. The two clamping arms 430 compress the first springs 440 connected to them. After the silicon wafer is placed, the pushing force on the two clamping arms 430 is removed, and the two clamping arms 430 return to their original positions under the restoring force of the first springs 440, thereby clamping the upper and lower sides of the silicon wafer between the two clamping arms 430. At this point, there is still some distance between the two sides of the silicon wafer and the limiting rod 420. Due to the difference in friction between the limiting plate 410 and the guide rod 330 and the friction between the silicon wafer and the clamping arms 430, the driving plate 350 pushes the clamping arms 430 on both sides of the silicon wafer's cutting line toward each other. This is until the fixing members on both sides of the silicon wafer are firmly attached to the two sides of the silicon wafer. Only then will the silicon wafer, secured by the limiting rods 420 on both sides of the cutting line, follow the clamping mechanism 400 as a whole and move toward the wire saw 220. This clamping method uses friction difference, and the clamping force on the silicon wafer gradually increases, which makes the stress inside the silicon wafer more evenly distributed and reduces stress concentration.

[0045] In order to prevent the limiting rods 420 on both sides from approaching each other too quickly when the fixing members on both sides of the silicon wafer approach each other, so that the silicon wafer is pinched off and the fracture of the silicon wafer is uneven, such as Figure 6 and Figure 7 As shown, each second spring 500 is sleeved on the outer periphery of the guide rod 330, and the second spring 500 is located between two adjacent limit plates 410 on the same horizontal line. The two ends of the second spring 500 are fixedly connected to the two limit plates 410 respectively. The friction coefficient of the limit plate 410 close to the driving plate 350 is greater than the friction coefficient of the limit plate 410 away from the driving plate 350, and the friction force between the driving plate 350 and the guide rod 330 is greater than the friction force between the silicon wafer and the clamping arm 430.

[0046] The second spring 500 between the two limit plates 410 will generate a rebound force when it is compressed, thereby slowing down the speed at which the two limit plates 410 on the same guide rod 330 approach each other, and preventing the two fixed parts from approaching each other too quickly and breaking the silicon wafer. Until the silicon wafer is completely abutted against the two side fixtures, forming a complete clamping mechanism 400, the hydraulic rod 340, by pushing the drive plate 350, continues to push the wafer, both above and below, toward the wire saw 220. The wire saw 220 gradually cuts the wafer as it approaches. After a section of the wafer is cut, the hydraulic rod 340, via the drive plate 350, resets the fixtures. The wafer is then pushed forward perpendicular to the cutting line, and the above process is repeated to continue cutting.

[0047] In summary, the working principle of the present invention is as follows:

[0048] First, the silicon wafer to be cut (long thin slice) is inserted between the clamping arms 430 in the two pairs of spaced-apart fixing members. At this time, there is still a gap between the side surfaces of the silicon wafer to be cut and the limiting rods 420 on both sides.

[0049] Then the hydraulic rod 340 is started to drive the silicon wafer toward the wire saw 220. During this process, due to the difference in friction between the limit plate 410 and the guide rod 330 and the friction between the silicon wafer and the clamping arm 430, the clamping arms 430 on both sides of the silicon wafer cutting line are pushed by the driving plate 350. First, the clamping arms 430 on both sides of the silicon wafer cutting line approach each other until the fixing parts on both sides of the silicon wafer are tightly attached to both sides of the silicon wafer. The silicon wafer fixed by the limit rod 420 on both sides of the cutting line will follow the clamping mechanism 400 as a whole and approach the wire saw 220.

[0050] In the process of the two fixing parts approaching each other, due to the difference in friction between the limit plate 410 and the guide rod 330 close to and away from the driving plate 350, and the friction between the limit plate 410 and the guide rod 330 away from the driving plate 350 is greater, so in the initial stage of the two fixing parts approaching each other, the limit plate 410 away from the driving plate 350 remains stationary on the guide rod 330, and the limit plate 410 close to the driving plate 350 gradually approaches the limit plate 410 away from the driving plate 350. When the second spring 500 between the two limit plates 410 is compressed, a rebound force will be generated, thereby slowing down the speed at which the two limit plates 410 on the same guide rod 330 approach each other, until the silicon wafer is completely tightly attached to the fixing parts on both sides to form a clamping mechanism 400 as a whole. At this time, the hydraulic rod 340 continues to push the silicon wafer fixed on the top and bottom and both sides to approach the wire saw 220, and the rotating wire saw 220 gradually cuts off the silicon wafer close to itself. After a section of the silicon wafer is cut, the hydraulic rod 340 drives the clamping mechanism 400 to reset, and then pushes the silicon wafer forward in a direction perpendicular to the cutting line. Then the above operation is repeated to continue cutting the next section.

[0051] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A new material cutting and processing device for silicon wafers, comprising a base (100), a mounting frame (110) and a processing table (120), characterized in that: A cutting mechanism (200) is installed on the mounting frame (110), and a pushing mechanism (300) is provided on the top of the processing table (120). The pushing mechanism (300) includes at least a plurality of guide rods (330), and a clamping mechanism (400) is slidably connected to the plurality of guide rods (330). The clamping mechanism (400) includes a plurality of fixing members, and a second spring (500) is provided between each of the two fixing members located on the same horizontal line. The clamping mechanism (400) is used to fix the upper and lower surfaces of the silicon wafer to be cut, a cutting channel is provided between the two fixing members located on the same height plane, the pushing mechanism (300) is used to push the silicon wafer fixed by the clamping mechanism (400) on the upper and lower surfaces toward the cutting mechanism (200), and in the process of the pushing mechanism (300) pushing the silicon wafer toward the cutting mechanism (200), the fixing members on both sides of the silicon wafer to be cut automatically approach the silicon wafer along the cutting line, the two fixing members approaching each other are used to clamp both sides of the cutting line of the silicon wafer, the clamping mechanism (400) can reduce the stress generated inside the silicon wafer, and the cutting mechanism (200) is used to cut the silicon wafer fixed on the upper and lower sides and both sides of the cutting line into a fixed length; The fixing member includes two limit plates (410) slidably connected on the same vertical line, a plurality of limit rods (420) are fixedly connected between the two limit plates (410), a pair of vertically distributed clamping arms (430) are slidably connected to the plurality of limit rods (420), a plurality of first springs (440) are provided between each clamping arm (430) and the adjacent limit plate (410), each first spring (440) is sleeved on the periphery of the limit rod (420), and an adjusting rod is slidably connected between the two limit plates (410) slidably connected to the same guide rod (330); Each second spring (500) is sleeved on the outer periphery of the guide rod (330), the second spring (500) is located between two adjacent limit plates (410) on the same horizontal line, and both ends of the second spring (500) are fixedly connected to the two limit plates (410) respectively; The friction coefficient of the limiting plate (410) close to the driving plate (350) is greater than the friction coefficient of the limiting plate (410) away from the driving plate (350), and the friction force between the driving plate (350) and the guide rod (330) is greater than the friction force between the silicon wafer and the clamping arm (430); The pushing mechanism (300) further comprises a first bracket (310) and a second bracket (320) fixedly connected to the top of the processing table (120), wherein the four corners of the first bracket (310) and the second bracket (320) are slidably connected to a guide rod (330), and the first bracket (310) is provided with a plurality of hydraulic rods (340), wherein the fixed portion of each hydraulic rod (340) is fixedly connected to the first bracket (310), and a driving plate (350) is provided between the first bracket (310) and the second bracket (320), wherein the driving plate (350) is slidably connected to each guide rod (330), and the driving plate (350) is fixedly connected to the movable portion of each hydraulic rod (340).

2. The silicon wafer new material cutting and processing device according to claim 1, characterized in that: The cutting mechanism (200) comprises a turntable (210) rotatably connected to the same side of the mounting frame (110), a wire saw (220) being provided on the outer periphery of the two turntables (210), the turntables (210) being driven by a motor (230), the motor (230) being located on a side of the mounting frame (110) away from the turntables (210), and one of the turntables (210) being coaxially connected to an output shaft of the motor (230).

3. The silicon wafer new material cutting and processing device according to claim 2, characterized in that: A cutting groove is provided on the top of the processing table (120), and the wire saw (220) passes through the cutting groove. The direction in which the wire saw (220) passes through the wire saw (220) is perpendicular to the processing table (120) and upward.

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