Power supply system, power supply method and device, storage medium and electronic equipment

Abstract

The embodiment of the invention provides a power supply system, a power supply method and device, a storage medium and electronic equipment, and relates to the field of power supply.The power supply system comprises a case, N power supply sub-modules, a water inlet, a water outlet, an inlet water distributor and an outlet water distributor, and the N power supply sub-modules are distributed in the case in parallel; the water inlet is formed in the left side of the case, and the water outlet is formed in the right side of the case; cold water flows into the case through the water inlet and flows into each power supply sub-module through the water inlet water distributor; and hot water flowing out of each power supply sub-module is collected to the water outlet water distributor, and then uniformly flows out of the case through the water outlet through the water outlet water distributor. Through adoption of the scheme, the problem of poor power supply effect in related technologies is solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of power supply, and specifically, to a power supply system, a power supply method and device, a storage medium, and an electronic device. Background Art

[0002] With the rapid development of Internet technology, the performance of servers is constantly being optimized, which is accompanied by an increase in server power consumption and an increase in the carbon emissions of data centers. In order to reduce the carbon emissions of data centers, the heat dissipation method of server systems is gradually developing towards cold plate liquid cooling.

[0003] In the related art, air-cooled power supplies are often used for the use of cold plate liquid-cooled servers. On the one hand, this method will increase the overall noise and is not conducive to noise reduction; on the other hand, due to the heat dissipation requirements of the power supply, refrigeration and air conditioning are also required for cooling, which increases construction costs.

[0004] Therefore, due to the high noise and poor heat dissipation of the above-mentioned cold plate liquid cooling power supply system, there is a technical problem of poor power supply effect in the related technology. Summary of the invention

[0005] The embodiments of the present application provide a power supply system, a power supply method and device, a storage medium and an electronic device to at least solve the technical problem of poor power supply effect in the related art.

[0006] According to one embodiment of the present application, a power supply system is provided, including a chassis, N power sub-modules, a water inlet, a water outlet, a water inlet manifold, and a water outlet manifold, wherein the N power sub-modules are distributed in parallel within the chassis; the water inlet is located on the left side of the chassis, and the water outlet is located on the right side of the chassis; cold water flows into the chassis through the water inlet, and flows into each power sub-module through the water inlet manifold; hot water flowing out of each power sub-module is collected in the water outlet manifold, and then flows out of the chassis through the water outlet through the water outlet manifold.

[0007] As an optional solution, the power sub-module includes a water cooling interface, the water cooling interface includes a check valve, and the water cooling interface is respectively connected to the water inlet manifold and the water outlet manifold; the water inlet manifold is located on the left side of the power sub-module, and the water outlet manifold is located on the right side of the power sub-module; the heat generated by the power sub-module is dissipated through liquid flow.

[0008] As an optional solution, the upper housing of the power submodule serves as a cold plate of the power submodule, a conduit is embedded in the cold plate, and the conduit and the check valve are used to realize the flow of the liquid.

[0009] As an optional solution, the N power sub-modules share a rack collector, and the rack collector includes N interfaces with check valves, and the N interfaces are used to connect the N power sub-modules.

[0010] As an optional solution, when the power supply system is used for low-power power supply, the power supply size of the N power supply sub-modules is a first size; when the power supply system is used for high-power power supply, the power supply size of the N power supply sub-modules is a second size, and the second power supply size is larger than the first power supply size.

[0011] As an optional solution, the cold water is the liquid output by the cooling liquid distribution unit, and the modules in the power supply system share the cooling liquid distribution unit; the chassis supports blind insertion, and the size of the chassis is related to the power supply power requirement of the power supply system.

[0012] As an optional solution, the power supply system also includes a temperature sensor, a flow sensor, a pressure sensor, a control unit, a solenoid valve, a backup power submodule, and a liquid filtering device. The temperature sensor is used to monitor the temperature of the power submodule and the liquid temperature at the water inlet and the water outlet; the flow sensor is used to monitor the liquid flow flowing through the water inlet manifold and the water outlet manifold; the pressure sensor is used to monitor the liquid pressure at the water inlet and the water outlet; the control unit is connected to the temperature sensor, the flow sensor, and the pressure sensor, and is used to adjust the working state of the water inlet manifold and the water outlet manifold according to the monitoring data of the temperature sensor, the flow sensor, and the pressure sensor, including at least one of the following: controlling the cold water flow of the water inlet manifold, adjusting the hot water discharge rate of the water outlet manifold, and controlling the opening and closing state of the check valve; the solenoid valve is used to circulate the coolant The flow rate and direction of the liquid are controlled in the loop path to ensure that the cooling effect of each power submodule is balanced; the backup power submodule has the same electrical interface and water cooling interface as the power submodule, and is used to replace the power submodule when a failure occurs; the liquid filtering device is located between the water inlet and the water inlet manifold, and is used to filter impurities in the coolant entering the chassis; the power submodule also includes a heat pipe, a heat sink, a temperature control circuit, and a water cooling plate, and the heat pipe is used to improve the heat conduction efficiency inside the power submodule; the heat sink is in contact with the heat pipe and the heating element of the power submodule, and is used to increase the heat exchange area; the temperature control circuit is used to monitor the temperature of the power submodule and reduce the output power of the power submodule when the temperature is too high; the water cooling plate is installed in the upper casing of the power submodule, in contact with the heating element in the power submodule, and is used to directly conduct heat to the coolant.

[0013] According to one embodiment of the present application, a power supply method is provided, comprising: using a power supply system to continuously supply power, wherein the power supply system includes N power sub-modules, and the N power sub-modules are distributed in parallel; in the process of using the power supply system to continuously supply power, if it is detected that a first power sub-module with a fault exists among the N power sub-modules, the first power sub-module is unplugged from a target interface, and a second power sub-module without a fault is reinserted at the target interface, wherein the N power sub-modules share a rack collector in the power supply system, and the rack collector includes N interfaces.

[0014] According to another embodiment of the present application, a power supply device is provided, comprising: a power supply unit for continuously supplying power using a power supply system, wherein the power supply system comprises N power sub-modules, and the N power sub-modules are distributed in parallel; a detection unit for, during the process of continuously supplying power using the power supply system, if a faulty first power sub-module is detected among the N power sub-modules, unplugging the first power sub-module from a target interface and reinserting a fault-free second power sub-module at the target interface, wherein the N power sub-modules share a rack collector in the power supply system, and the rack collector comprises N interfaces.

[0015] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when run.

[0016] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0017] According to another embodiment of the present application, a computer program product is provided, including a computer program, and when the computer program is executed by a processor, the steps of the method described in each embodiment of the present application are implemented.

[0018] Through the embodiment provided by the present application, a power supply system including a chassis, N power submodules, a water inlet, a water outlet, a water inlet manifold, and a water outlet manifold is provided, wherein the N power submodules are distributed in parallel in the chassis; the water inlet is located on the left side of the chassis, and the water outlet is located on the right side of the chassis; cold water flows into the chassis through the water inlet, and flows into each power submodule through the water inlet manifold; the hot water flowing out of each power submodule is collected in the water outlet manifold, and then flows out of the chassis through the water outlet manifold. On the one hand, each power submodule in the power supply system has cold water inlet on the left side and hot water outlet on the right side, and the heat generated by the power submodule is dissipated by liquid flow, and the heat dissipation does not require refrigeration, air conditioning or fans, thereby greatly reducing the generation of noise, thereby achieving the technical effect of improving the power supply effect. On the other hand, in the power supply system, N power submodules are distributed in parallel, and when a single power submodule fails, it can be directly replaced and maintained without affecting the operation of other power submodules, thereby also achieving the technical effect of improving power supply efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a hardware structure block diagram of a power supply system according to an embodiment of the present application;

[0020] Figure 2 is a schematic diagram of a power supply system according to an embodiment of the present application;

[0021] Figure 3 It is an overall structural diagram of a cold plate powershelf design supporting hot plugging according to an embodiment of the present application;

[0022] Figure 4 is a design diagram of a rack header according to an embodiment of the present application;

[0023] Figure 5 is a schematic diagram of a design of a medium-power power supply submodule according to an embodiment of the present application;

[0024] Figure 6 is a schematic diagram of a design of a high-power power supply submodule according to an embodiment of the present application;

[0025] Figure 7 is a flow chart of a power supply method according to an embodiment of the present application;

[0026] Figure 8 This is a 3D rendering of an internal heat dissipation design of a power submodule according to an embodiment of the present application;

[0027] Fig. 9 It is a principle design framework diagram of a power submodule design according to an embodiment of the present application;

[0028] Fig.10 It is a structural block diagram of a power supply device according to an embodiment of the present application. DETAILED DESCRIPTION

[0029] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] The system embodiments provided in the embodiments of the present application can be executed in a computer terminal or a similar computing device. Taking running on a computer terminal as an example, Figure 1 1 is a hardware structure block diagram of a computer terminal of a power supply system of an embodiment of the present application. Figure 1 As shown, the computer terminal may include one or more ( Figure 1 Only one is shown in the figure) a processor 102 (the processor 102 may include but is not limited to a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the above-mentioned computer terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It can be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above-mentioned computer terminal. Figure 1 More or fewer components as shown, or with Figure 1 Different configurations are shown.

[0032] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the system for determining the mapping relationship in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, realizing the above-mentioned system. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include a memory remotely arranged relative to the processor 102, and these remote memories may be connected to the computer terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0033] The transmission device 106 is used to receive or send data via a network. The specific example of the above network may include a wireless network provided by a communication provider of a computer terminal. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, referred to as NIC), which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0034] As an alternative, Figure 2 As shown, the power supply system includes a chassis 204, N power sub-modules 206, a water inlet 208, a water outlet 210, a water inlet manifold 212, and a water outlet manifold 214, wherein the N power sub-modules 206 are distributed in parallel in the chassis 204; the water inlet 208 is located on the left side of the chassis 204, and the water outlet 210 is located on the right side of the chassis 204; cold water flows into the chassis 204 through the water inlet 208, and flows into each power sub-module through the water inlet manifold 212; the hot water flowing out of each power sub-module is collected in the water outlet manifold 214, and then flows out of the chassis 204 through the water outlet 210 through the water outlet manifold 214.

[0035] Optionally, in this embodiment, the power supply method can be applied to, but is not limited to, a cold plate powershelf (a power supply framework for a data center or server room) design scenario. In this design scenario, air-cooled power supply is often used in the related art. On the one hand, this method will increase the overall noise, which is not conducive to noise reduction; on the other hand, due to the heat dissipation requirements of the power supply, refrigeration and air conditioning are also required to cool down, increasing the construction cost. Therefore, due to the high noise and poor heat dissipation of the above-mentioned cold plate liquid-cooled power supply system, the related art has the defect of poor power supply effect.

[0036] For the above defects, the power supply system provided by this embodiment includes a chassis, N power submodules, a water inlet, a water outlet, a water inlet manifold, and a water outlet manifold, wherein each power submodule has cold water inlet on the left and hot water outlet on the right, and the heat generated by the power submodule is dissipated by liquid flow, and heat dissipation does not require refrigeration, air conditioning or fans, thereby greatly reducing the generation of noise, thereby achieving the technical effect of improving the power supply effect. On the other hand, in the power supply system, N power submodules are distributed in parallel. When a single power submodule fails, it can be directly replaced and maintained without affecting the operation of other power submodules, thereby also achieving the technical effect of improving power supply efficiency.

[0037] Optionally, in this embodiment, the power supply submodule (PSU, Power Supply Unit) is an important component of the power supply system, which can be used, but not limited to, to convert the input alternating current (AC) into direct current (DC) required by various components within the power supply system, providing a stable, reliable and efficient power supply.

[0038] Optionally, in this embodiment, the power submodule is designed to be hot-swappable, and the power module can be safely unplugged and plugged in during the operation of the server without shutting down the entire power supply system. It can be understood that this method improves the availability and maintenance efficiency of the power supply system. When a module fails, it can be quickly replaced, avoiding the shutdown of the entire power supply system.

[0039] Optionally, in this embodiment, unlike the traditional air-cooled power supply, the power submodule adopts liquid cooling. Through the cold plate design, the heat is taken away by the coolant through the conduit inside the cold plate, thereby effectively reducing the temperature of the power module, reducing the cooling demand, and reducing noise and operating costs.

[0040] Optionally, in this embodiment, the power submodule has a redundant design, that is, multiple power submodules work in parallel. It is understandable that if one power submodule fails, other power submodules can continue to supply power, ensuring the continuous operation of the power supply service, thereby improving the reliability and stability of the power supply system.

[0041] Optionally, in this embodiment, the cold water may be, but is not limited to, liquid output by a cooling liquid distribution unit (CDU), and may be, but is not limited to, used to evenly flow through components that require cooling, wherein the components that require cooling include N power submodules.

[0042] Optionally, in this embodiment, cold water can be driven by a pump to circulate in the chassis, but is not limited to, wherein the cold water flows into the chassis through the water inlet, and then flows into each power submodule through the water inlet manifold. In each power submodule, the cold water absorbs the heat from the power submodule, becomes hot water, and flows out of each power submodule, gathers in the water outlet manifold, and then flows out of the chassis through the water outlet.

[0043] It should be noted that, in the process of using cold water to dissipate heat for the power submodule, the temperature, flow rate and pressure of the cold water may be detected and adjusted, but is not limited to, to ensure the stability and efficiency of the power supply system.

[0044] As a further example, it can be, but is not limited to, real-time continuous temperature monitoring, recording the liquid temperature of the water inlet and outlet of each power submodule under different loads, and collecting liquid circulation speed and direction data. Based on the above liquid temperature, liquid circulation speed and direction data, the circulation path and flow rate of the liquid are intelligently adjusted to achieve a more uniform heat distribution. During high-load periods, it can be, but is not limited to, increasing the liquid flow through the high-power submodule to ensure temperature control of key components.

[0045] It should be noted that an algorithm can also be developed, but is not limited to, to adaptively adjust the liquid circulation parameters according to the real-time changes in the load. Regular system optimization is performed to fine-tune the liquid circulation parameters by analyzing long-term operating data to adapt to changes in the system operating mode.

[0046] Optionally, in this embodiment, in order to ensure the long-term stable operation of the liquid flow (circulation), regular inspection and maintenance may be performed, including but not limited to replacing cold water, cleaning components, checking the thermal conductivity of components, etc. In addition, the system may also be provided with a monitoring alarm mechanism, which may issue a warning in time to prevent equipment damage when abnormal conditions are detected (such as excessive temperature, insufficient flow).

[0047] To further illustrate, the operating status of each power submodule is monitored in real time, including but not limited to the voltage, current, temperature and liquid flow of the power submodule. Using big data analysis and machine learning technology, the operating status of the power submodule is deeply analyzed to identify potential failure modes. A model is established based on historical data to predict the failure probability of the power submodule and plan maintenance strategies in advance. When the analysis results show that a module may be about to fail, the system automatically issues an early warning notification. Based on the early warning information, preventive maintenance is arranged, such as replacing a power submodule that is about to fail or adjusting the cycle parameters to reduce the temperature of a specific power submodule.

[0048] To further illustrate, an optional hot-swappable cold plate powershelf design overall structure diagram is as follows Figure 3As shown, it consists of a chassis frame, a power submodule, a water inlet, a water outlet, and a water distributor (including a water inlet distributor and a water outlet distributor). The water inlet is on the left side of the chassis, and the cold water from the CDU flows into the water inlet distributor through the water inlet, and then flows to each PSU through the water inlet distributor; the hot water flowing out of the PSU will be collected in the water outlet distributor, and will flow out of the chassis through the water outlet distributor through the water outlet distributor; in order to meet the needs of servers with different powers, the maximum refrigerant temperature supported by this design is 50°C.

[0049] Through the embodiments provided by the present application, each power submodule has cold water inlet on the left side and hot water outlet on the right side, and the heat generated by the power submodule is dissipated by liquid flow, and heat dissipation does not require refrigeration, air conditioning or fans, thereby greatly reducing the generation of noise, thereby achieving the technical effect of improving the power supply effect. On the other hand, in the power supply system, N power submodules are distributed in parallel. When a single power submodule fails, it can be directly replaced and maintained without affecting the operation of other power submodules, thereby also achieving the technical effect of improving power supply efficiency.

[0050] As an optional solution, the power sub-module includes a water cooling interface, the water cooling interface includes a check valve, and the water cooling interface is respectively connected to the water inlet manifold and the water outlet manifold; the water inlet manifold is located on the left side of the power sub-module, and the water outlet manifold is located on the right side of the power sub-module; the heat generated by the power sub-module is dissipated through liquid flow.

[0051] Optionally, in this embodiment, the check valve may be, but is not limited to, a valve that allows liquid to flow in only one direction and prevents reverse flow.

[0052] It should be noted that, in this embodiment, the check valve can also be used, but not limited to, to ensure that cold water does not leak out of the system when each power submodule is hot-swapped. When a power submodule is unplugged, the check valve can be immediately closed to prevent cold water from flowing back in the pipeline of the module, thereby avoiding leakage of cold water, ensuring the airtightness of the system and the continuity of cold water circulation, and improving the stability of the design.

[0053] It can be understood that in this embodiment, after cold water enters the chassis from the water inlet, it flows through the water inlet manifold, flows in from the left side of the power sub-module, becomes hot water after liquid flow, flows from the right side of the power sub-module, is collected by the water outlet manifold, and flows out of the chassis from the water outlet.

[0054] Through the embodiments provided by the present application, the heat generated by the power submodule is dissipated through the flow of liquid, and the heat dissipation does not require refrigeration, air conditioning or fans, thereby greatly reducing the generation of noise, thereby achieving the technical effect of improving the power supply effect. In addition, through the design of the check valve, it is possible to prevent the cold water from flowing backwards in the pipeline of the module, thereby avoiding the leakage of cold water, ensuring the airtightness of the system and the continuity of the cold water circulation, and improving the stability of the design.

[0055] As an optional solution, the upper housing of the power submodule serves as a cold plate of the power submodule, a conduit is embedded in the cold plate, and the conduit and the check valve are used to realize the flow of the liquid.

[0056] Optionally, in this embodiment, each power submodule has a water inlet on the left and a water outlet on the right, so that the heat generated by the power supply is taken away by liquid circulation.

[0057] Optionally, in this embodiment, the specific implementation method may be but is not limited to adopting a design scheme of a cold plate housing (the upper housing of the power submodule also serves as a cold plate of the power submodule), and the cold plate has a conduit embedded therein to achieve liquid flow.

[0058] It should be noted that each power submodule is connected to the water inlet manifold and the water outlet manifold respectively through a water cooling joint with a check valve. When a single power submodule fails, the power submodule can be directly unplugged for maintenance to improve the utilization rate of the entire power supply system. When a single power submodule is damaged, there is no need to replace the entire power supply system, only the damaged module needs to be replaced.

[0059] Through the embodiments provided in the present application, the upper casing of the power sub-module is also used as a cold plate of the power sub-module. A conduit is embedded in the cold plate to realize liquid flow, and heat dissipation does not require refrigeration air conditioning or fans, thereby greatly reducing the generation of noise, thereby achieving the technical effect of improving the power supply effect.

[0060] As an optional solution, the N power sub-modules share a rack collector, and the rack collector includes N interfaces with check valves, and the N interfaces are used to connect the N power sub-modules.

[0061] Optionally, in this embodiment, the shelf manifold may be, but is not limited to, a pipe system for distributing and collecting cold water, and is usually composed of two pipe networks, an inlet pipe network and an outlet pipe network.

[0062] To further illustrate, a design diagram of a rack header is shown in Figure 4 As shown, the rack collector includes N interfaces with check valves, and the N interfaces are used to connect N power sub-modules.

[0063] Optionally, in this embodiment, the rack header is responsible for evenly distributing cold water from the CDU (cooling liquid distribution unit) to the cold plates of each power submodule, while collecting the hot water after the heat dissipated by these modules, and then returning it to the CDU for cooling circulation, ensuring efficient use of liquid and effective removal of heat.

[0064] Optionally, in this embodiment, by integrating a check valve in the rack manifold, liquid leakage can be prevented when a power submodule is unplugged, thereby improving the stability and efficiency of the entire cooling system. The function of the check valve is to ensure that the coolant flows in the correct direction and prevent system failure caused by reverse flow.

[0065] Through the embodiments provided in the present application, by adopting a design scheme of a common rack manifold, the independent demand for liquid distribution and collection pipes of each power submodule can be reduced, thereby reducing design and manufacturing costs.

[0066] As an optional solution, when the power supply system is used for low-power power supply, the power supply size of the N power supply sub-modules is a first size; when the power supply system is used for high-power power supply, the power supply size of the N power supply sub-modules is a second size, and the second power supply size is larger than the first power supply size.

[0067] Optionally, in this embodiment, when the power supply system is used for low-power power supply, a medium-power segment PSU (power submodule) may be designed but is not limited to, and the power supply size of N power submodules is a first size, wherein the first size may be but is not limited to 68mm (width) * 600mm (length) * 40mm (height). To further illustrate, a design schematic diagram of a medium-power power submodule design is shown in FIG. Figure 5 shown.

[0068] Optionally, in this embodiment, when the power supply system is used for high-power power supply, a high-power segment PSU (power submodule) may be designed but is not limited to, and the power supply size of N power submodules is the second size, wherein the first size may be but is not limited to 139mm (width) * 600mm (length) * 40mm (height). To further illustrate, a design schematic diagram of a high-power power submodule design is shown in FIG. Figure 6 shown.

[0069] As an optional solution, the cold water is the liquid output by the cooling liquid distribution unit, and the modules in the power supply system share the cooling liquid distribution unit; the chassis supports blind insertion, and the size of the chassis is related to the power supply power requirement of the power supply system.

[0070] Optionally, in this embodiment, the original air-cooled power supply is replaced by a cold plate Powershelf, and the cold plate Powershelf shares a CDU (coolant distribution unit) with each node in the system. The heat of the Powershelf is removed by the liquid circulation control of the CDU, thereby realizing the integrated control of the CDU. Since the cold plate Powershelf adopts a cold plate heat dissipation method, heat dissipation no longer requires a fan, which greatly reduces the noise of the data center and realizes a zero-noise data center design. At the same time, a three-blind plug design is introduced, which is highly scalable and applicable.

[0071] Optionally, in this embodiment, the chassis design meets the design requirements of a 19-inch 1U cabinet, supports blind plug-in, and can be expanded according to power requirements.

[0072] As an optional solution, the power supply system also includes a temperature sensor, a flow sensor, a pressure sensor, a control unit, a solenoid valve, a backup power submodule, and a liquid filtering device. The temperature sensor is used to monitor the temperature of the power submodule and the liquid temperature at the water inlet and the water outlet; the flow sensor is used to monitor the liquid flow flowing through the water inlet manifold and the water outlet manifold; the pressure sensor is used to monitor the liquid pressure at the water inlet and the water outlet; the control unit is connected to the temperature sensor, the flow sensor, and the pressure sensor, and is used to monitor the liquid pressure at the water inlet and the water outlet according to the temperature sensor, the flow sensor, and the pressure sensor. The monitoring data adjusts the working state of the water inlet manifold and the water outlet manifold, including at least one of the following: controlling the cold water flow of the water inlet manifold, adjusting the hot water discharge rate of the water outlet manifold, and controlling the opening and closing state of the check valve; the solenoid valve is used to control the flow and direction of the liquid in the circulation path of the coolant to ensure that the cooling effect of each power submodule is balanced; the backup power submodule has the same electrical interface and water cooling interface as the power submodule, and is used to replace the power submodule when a failure occurs; the liquid filter device is located between the water inlet and the water inlet manifold, and is used to filter impurities in the coolant entering the chassis;

[0073] The power submodule also includes a heat pipe, a heat sink, a temperature control circuit, and a water cooling plate. The heat pipe is used to improve the heat conduction efficiency inside the power submodule; the heat sink is in contact with the heat pipe and the heating element of the power submodule to increase the heat exchange area; the temperature control circuit is used to monitor the temperature of the power submodule and reduce the output power of the power submodule when the temperature is too high; the water cooling plate is installed in the upper housing of the power submodule and in contact with the heating element in the power submodule to directly conduct heat to the coolant.

[0074] Optionally, in this embodiment, the power supply system includes one or more temperature sensors, which are used to monitor the temperature of the power submodule and the liquid temperature at the water inlet and the water outlet. The power supply system also includes one or more flow sensors, which are used to monitor the liquid flow through the water inlet manifold and the water outlet manifold. The power supply system also includes one or more pressure sensors, which are used to monitor the liquid pressure at the water inlet and the water outlet.

[0075] Optionally, in this embodiment, the power supply system includes one or more control units, which are connected to the temperature sensor, the flow sensor and the pressure sensor, and are used to adjust the working status of the water inlet manifold and the water outlet manifold according to the monitoring data of the temperature sensor, the flow sensor and the pressure sensor, including but not limited to controlling the cold water flow of the water inlet manifold, adjusting the hot water discharge rate of the water outlet manifold, and controlling the opening and closing state of the check valve.

[0076] Optionally, in this embodiment, the power supply system includes one or more solenoid valves, which are used to control the flow rate and direction of liquid in the circulation path of the coolant to ensure balanced cooling effect of each power submodule.

[0077] Optionally, in this embodiment, the power supply system includes one or more backup power sub-modules, which have the same electrical interface and water cooling interface as the power sub-module and are used to quickly replace the power sub-module when a failure occurs, thereby ensuring the continuity and reliability of the power supply system.

[0078] Optionally, in this embodiment, the power supply system includes one or more liquid filtering devices, which are located between the water inlet and the water inlet manifold, and are used to filter impurities in the coolant entering the chassis, ensure the cleanliness of the coolant, and extend the service life of the power sub-module and the coolant distribution unit.

[0079] Optionally, in this embodiment, the power submodule further includes one or more heat pipes, and the heat pipes are used to improve the heat conduction efficiency inside the power submodule.

[0080] Optionally, in this embodiment, the power submodule further includes one or more heat sinks, which are in contact with the heat pipe and the heating element of the power submodule to increase the heat exchange area and improve the heat dissipation effect.

[0081] Optionally, in this embodiment, the power submodule also includes one or more temperature control circuits, which are used to monitor the temperature of the power submodule and reduce the output power of the power submodule when the temperature is too high to prevent the power submodule from being damaged due to overheating.

[0082] Optionally, in this embodiment, the power submodule also includes one or more water cooling plates, which are installed in the upper housing of the power submodule and contact the heating elements in the power submodule to directly conduct heat to the coolant to improve heat dissipation efficiency.

[0083] It should be noted that the electrical interface and water cooling interface of the power submodule are designed to comply with hot-swap standards to ensure that the electrical connection and water cooling cycle of the power supply system are not affected when the power submodule is replaced.

[0084] As an alternative, Figure 7 As shown, the power supply method includes:

[0085] S702, continuously supplying power using a power supply system, wherein the power supply system includes N power submodules, and the N power submodules are distributed in parallel;

[0086] S704. During continuous power supply using the power supply system, if a faulty first power submodule is detected among the N power submodules, the first power submodule is unplugged from the target interface, and a non-faulty second power submodule is reinserted at the target interface, wherein the N power submodules share a rack collector in the power supply system, and the rack collector includes N interfaces.

[0087] Optionally, in this embodiment, the power supply system can be but is not limited to the power supply system described above in this application including a chassis, N power sub-modules, a water inlet, a water outlet, a water inlet manifold, and a water outlet manifold, and the specific contents are not repeated here.

[0088] Optionally, in this embodiment, during the process of continuous power supply using the power supply system, if a faulty first power submodule is detected among the N power submodules, the first power submodule is unplugged from the target interface and a fault-free second power submodule is reinserted into the target interface.

[0089] Through the embodiments provided in the present application, when a single power sub-module fails, the power sub-module can be directly unplugged for maintenance to improve the utilization rate of the entire power supply system. When a single power sub-module is damaged, there is no need to replace the entire power supply system, only the damaged module needs to be replaced.

[0090] As an optional solution, the above power supply method is applied in a cold plate Powershelf (power supply framework) design scenario that supports hot plugging of modules. In this scenario, with the rapid development of Internet technology, the performance of servers is constantly being optimized, accompanied by an increase in server power consumption and an increase in the carbon emissions of data centers. In order to reduce the carbon emissions of data centers, the heat dissipation method of server systems is gradually developing towards cold plate liquid cooling and immersion liquid cooling. Among them, the immersion heat dissipation method is affected by the cost, stability and environmental protection of the coolant, and its promotion and application is relatively slow. The cold plate heat dissipation method has natural advantages in terms of cost, stability and environmental protection, and is increasingly valued by people.

[0091] The cold plate liquid cooling servers currently launched are generally equipped with a CDU (coolant distribution unit) for a whole cabinet. Multiple servers in the same cabinet share a CDU, which removes the heat in the server through the CDU. Compared with air-cooled servers, it reduces the power consumption of system fans. There are currently two main power supply solutions for cold plate liquid cooling servers, namely distributed and centralized. Distributed power supply is to equip each server with a power supply, and centralized power supply is to power the entire cabinet through the Power Shelf. Regardless of distributed power supply or centralized power supply, the current power supply is mainly air-cooled power supply.

[0092] However, using air-cooled power supplies will, on the one hand, increase the noise of the entire data center, which is not conducive to noise reduction in the data center. On the other hand, due to the heat dissipation requirements of the power supply, the data center also requires refrigeration and air conditioning for cooling, which will increase the construction cost of the data center.

[0093] In view of the above defects, this embodiment proposes a cold plate Power shelf design that supports hot plugging of modules. The original air-cooled power supply is replaced by a cold plate Power shelf. The cold plate Power shelf shares the CDU with each node in the system, and the heat of the Power shelf is taken away by the liquid circulation control of the CDU to realize the integrated control of the CDU. Since the cold plate Power shelf adopts the cold plate heat dissipation method, the heat dissipation no longer requires a fan, which greatly reduces the noise of the data center and realizes the zero-noise data center design. At the same time, the three-blind plug design is introduced, which is highly popularizable and applicable.

[0094] Specifically, a cold plate Power shelf design that supports hot swapping of modules, such as Figure 3As shown in the figure, the system uses 6 power submodules in parallel to form a 5+1 power supply mode. A single power submodule supports a maximum of 6kw, which can achieve a maximum power output of 36kw within a 1U height, ensuring the stable and reliable operation of the cold plate server. Furthermore, it supports hot swapping of power submodules, which can facilitate update and maintenance when a single submodule fails. Compared with traditional cold plate power applications, it is more flexible and reliable.

[0095] Optionally, a cold plate Power shelf design that supports hot-swappable modules is composed of a chassis frame, a power submodule, a water inlet, a water outlet, a water distributor and a PSU. The water inlet is on the left side of the chassis, and the cold water from the CDU flows into the water inlet manifold through the water inlet, and then flows to each PSU through the water inlet manifold; the hot water flowing out of the PSU will be collected in the water outlet manifold, and will flow out of the chassis through the water outlet manifold through the water outlet manifold; to meet the needs of servers with different power, the maximum refrigerant temperature supported by this design is 50°C.

[0096] Optionally, the chassis design may be, but is not limited to, meeting the design requirements of a 19-inch 1U cabinet, supporting blind plugging, and may be expanded based on power requirements.

[0097] Optionally, each power submodule has a water inlet on the left and a water outlet on the right, and the heat generated by the power supply is taken away by liquid circulation. The specific implementation method may be, but is not limited to, a design scheme using a cold plate housing (the upper housing of the power supply also serves as the cold plate of the power supply), with a conduit embedded in the cold plate to achieve liquid flow. Each power submodule is connected to the water inlet manifold and the water outlet manifold respectively through a water-cooled joint with a check valve. When a single power supply fails, the power module can be directly unplugged for maintenance, which can improve the utilization rate of the entire Power shelf. When a single module is damaged, there is no need to replace the entire Power shelf, only the damaged module needs to be replaced.

[0098] Optionally, Figure 5 This is a mid-power PSU design with a power supply size of 68mm (width) * 600mm (length) * 40mm (height). This solution can be used for low-power cabinets. Figure 6 This is a high-power PS U design solution. The power supply size is 139mm (width) * 600mm (length) * 40mm (height). This solution can be used for cabinets with higher power.

[0099] Optionally, the internal heat dissipation considerations of the power submodule involve common mode inductors, PFC inductors, PFC MOS, PFC diodes, LLC primary MOS, LLC secondary MOS, LLC resonant inductors and LLC resonant transformers. For EMI filter inductors and PFC inductors, heat is transferred to the power supply housing by injecting glue, and PFC MOS, PFC diodes, LLC primary MOS, LLC secondary MOS, LLC resonant inductors and LLC resonant transformers transfer heat to the housing through thermal conductive sheets. The heat of the housing is transferred through the water circulation of the cold plate. To further illustrate, a 3D rendering of the internal heat dissipation design of a power submodule design is shown below: Figure 8 shown.

[0100] Optionally, the rated output power of the power submodule is 5kw-10KW, and the design architecture of Interleaved Totem PFC+FBLLC is adopted. The module also adopts a dual-input design and realizes input redundancy through internal multi-channel relay control. For further example, the principle design framework diagram of a power submodule design is as follows Fig. 9 shown.

[0101] Optionally, a design scheme in which multiple power modules share the shelf manifold can effectively reduce the design cost; the manifold is designed with a connector with a check valve, so that when the power module is unplugged, liquid will not leak out, thereby improving the stability of the design.

[0102] Through the embodiments provided in the present application, the existing cold plate liquid cooling server power supply design can be improved, and the original air-cooled power supply can be replaced by a cold plate Power shelf. The cold plate Power shelf shares the CDU with each node in the system, and the heat of the Power shelf is taken away by the liquid circulation control of the CDU to achieve integrated control of the CDU. Since the cold plate Powershelf adopts a cold plate heat dissipation method, heat dissipation no longer requires a fan, which greatly reduces the noise of the data center and realizes a zero-noise data center design.

[0103] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0104] In this embodiment, a power supply device is also provided, which is used to implement the above-mentioned embodiments and preferred implementation modes, and the descriptions that have been made will not be repeated. As used below, the term "module" can implement a combination of software and / or hardware of a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0105] Fig.10 is a structural block diagram of a power supply device according to an embodiment of the present application, such as Fig.10 As shown, the device comprises:

[0106] A power supply unit 1002, used to continuously supply power using a power supply system, wherein the power supply system includes N power submodules, and the N power submodules are distributed in parallel;

[0107] The detection unit 1004 is used for, during the process of continuous power supply using the power supply system, if it is detected that a faulty first power submodule exists among the N power submodules, unplugging the first power submodule from the target interface and reinserting a normal second power submodule at the target interface, wherein the N power submodules share a rack collector in the power supply system, and the rack collector includes N interfaces.

[0108] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0109] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0110] It should be noted that the above modules can be implemented by software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0111] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above method embodiments when running.

[0112] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk.

[0113] An embodiment of the present application further provides an electronic device, including a memory and a processor, wherein a computer program is stored in the memory, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0114] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0115] An embodiment of the present application further provides a computer program product, comprising a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program product, and when the computer program is executed by a processor, the steps of the method described in each embodiment of the present application are implemented.

[0116] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail herein.

[0117] Obviously, those skilled in the art should understand that the above modules or steps of the present application can be implemented by a general computing device, they can be concentrated on a single computing device, or distributed on a network composed of multiple computing devices, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be executed in a different order from that herein, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0118] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A power supply system, comprising a chassis, N power submodules, a water inlet, a water outlet, a water inlet manifold, and a water outlet manifold, characterized in that: The N power submodules are distributed in parallel in the chassis; The water inlet is located on the left side of the chassis, and the water outlet is located on the right side of the chassis; Cold water flows into the chassis through the water inlet, and flows into each power submodule through the water inlet manifold; The hot water flowing out from each power submodule is collected in the water outlet manifold, and then flows out of the chassis through the water outlet through the water outlet manifold.

2. The power supply system according to claim 1, characterized in that: The power submodule comprises a water cooling interface, the water cooling interface comprises a check valve, and the water cooling interface is respectively connected to the water inlet manifold and the water outlet manifold; The water inlet manifold is located on the left side of the power submodule, and the water outlet manifold is located on the right side of the power submodule; The heat generated by the power submodule is dissipated through the flow of liquid.

3. The power supply system according to claim 2, characterized in that: The upper housing of the power submodule serves as a cold plate of the power submodule, a conduit is embedded in the cold plate, and the conduit and the check valve are used to realize the flow of the liquid.

4. The power supply system according to claim 1, characterized in that: The N power submodules share a rack collector, and the rack collector includes N interfaces with check valves, and the N interfaces are used to connect the N power submodules.

5. The power supply system according to claim 1, characterized in that: When the power supply system is used for low-power power supply, the power supply size of the N power submodules is a first size; When the power supply system is used for high-power power supply, the power supply size of the N power supply submodules is a second size, and the second power supply size is larger than the first power supply size.

6. The power supply system according to claim 1, characterized in that: The cold water is the liquid output by the cooling liquid distribution unit, and each module in the power supply system shares the cooling liquid distribution unit; The chassis supports blind insertion, and the size of the chassis is associated with the power supply requirement of the power supply system.

7. The power supply system according to claim 1, characterized in that: The power supply system further includes a temperature sensor, a flow sensor, a pressure sensor, a control unit, a solenoid valve, a backup power submodule, and a liquid filtering device. The temperature sensor is used to monitor the temperature of the power submodule and the liquid temperature at the water inlet and the water outlet; the flow sensor is used to monitor the liquid flow through the water inlet manifold and the water outlet manifold; the pressure sensor is used to monitor the liquid pressure at the water inlet and the water outlet; The control unit is connected to the temperature sensor, the flow sensor and the pressure sensor, and is used to adjust the working state of the water inlet manifold and the water outlet manifold according to the monitoring data of the temperature sensor, the flow sensor and the pressure sensor, including at least one of the following: controlling the cold water flow of the water inlet manifold, adjusting the hot water discharge rate of the water outlet manifold, and controlling the opening and closing state of the check valve; The solenoid valve is used to control the flow rate and direction of the liquid in the circulation path of the coolant to ensure a balanced cooling effect for each of the power submodules; The backup power submodule has the same electrical interface and water cooling interface as the power submodule, and is used to replace the power submodule when a failure occurs; The liquid filtering device is located between the water inlet and the water inlet manifold, and is used to filter impurities in the coolant entering the chassis; The power submodule also includes a heat pipe, a heat sink, a temperature control circuit, and a water cooling plate. The heat pipe is used to improve the heat conduction efficiency inside the power submodule; The heat sink is in contact with the heat pipe and the heating element of the power submodule to increase the heat exchange area; The temperature control circuit is used to monitor the temperature of the power submodule and reduce the output power of the power submodule when the temperature is too high; The water cooling plate is installed in the upper housing of the power submodule and contacts the heating element in the power submodule, so as to directly conduct the heat to the cooling liquid.

8. A power supply method, characterized in that: include: Using a power supply system to continuously supply power, wherein the power supply system includes N power submodules, and the N power submodules are distributed in parallel; During continuous power supply using the power supply system, when it is detected that a faulty first power submodule exists among the N power submodules, the first power submodule is unplugged from the target interface, and a fault-free second power submodule is reinserted at the target interface, wherein the N power submodules share a rack collector in the power supply system, and the rack collector includes N interfaces.

9. A power supply device, characterized in that: include: A power supply unit, used to continuously supply power using a power supply system, wherein the power supply system includes N power submodules, and the N power submodules are distributed in parallel; A detection unit is used for, when a faulty first power submodule is detected among the N power submodules during continuous power supply using the power supply system, unplugging the first power submodule from a target interface and reinserting a fault-free second power submodule at the target interface, wherein the N power submodules share a rack collector in the power supply system, and the rack collector includes N interfaces.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program implements the steps of the method described in claim 8 when executed by a processor.

11. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method described in claim 8 are implemented.

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