Detection assembly, electronic equipment and control method thereof

Abstract

The embodiment of the invention provides a detection assembly, electronic equipment and a control method thereof, relates to the field of electronics, and is used for improving the anti-counterfeiting capability of line recognition. In the detection assembly, an ultrasonic line acquisition module and a conductive layer serving as a biological electrode are fused with each other, so that one detection assembly has a biological characteristic signal and biological electric signal acquisition function. Whether fingerprint unlocking is carried out or not is judged through dual guarantee of the bio-electricity signal and the biological characteristic signal, and the anti-fake capacity of line recognition is improved.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a detection component, an electronic device and a control method thereof. Background Art

[0002] Biometric technology has been widely used in people's daily lives. Among them, human fingerprint information has become one of the mainstream identity recognition technologies in consumer electronics, smart homes, security and other fields due to its uniqueness, difficulty in obtaining and convenience of use.

[0003] The anti-counterfeiting ability of the fingerprint module is an important parameter to ensure the security of identity recognition. However, currently, those skilled in the art mainly focus on optimizing the performance structure of the fingerprint module to improve the fingerprint unlocking performance, and pay little attention to the anti-counterfeiting ability of the fingerprint module. Summary of the invention

[0004] The present application provides a detection component, an electronic device and a control method thereof, which are used to improve the anti-counterfeiting capability of pattern recognition.

[0005] In a first aspect of an embodiment of the present application, a detection component is provided, which is, for example, a detection component having both a biometric information function and a bioelectric signal collection function. The detection component includes an ultrasonic pattern collection module, a conductive layer, and a bioelectric signal collection module. The ultrasonic pattern collection module is used to generate biometric information, and the conductive layer is stacked on one side of the ultrasonic pattern collection module and connected to the ultrasonic pattern collection module. The bioelectric signal collection module is coupled to the conductive layer and is used to collect signals from the conductive layer.

[0006] The detection component provided in the embodiment of the present application integrates the ultrasonic pattern collection module and the conductive layer as a bioelectrode, so that one detection component has both the biometric signal and bioelectric signal collection functions. The dual protection of bioelectric signals and biometric signals is used to determine whether to perform fingerprint unlocking, thereby improving the anti-counterfeiting ability of pattern recognition. In addition, after the multifunctional detection component is applied to electronic equipment, the integration of electronic equipment can be improved and the hardware implementation cost can be reduced.

[0007] In a possible implementation, the thickness of the conductive layer is 0.35n*λ to 0.65n*λ, where λ is the wavelength of the conductive layer and n is a positive integer. By limiting the thickness of the conductive layer, the influence of the conductive layer on the ultrasonic signal in the ultrasonic texture acquisition module can be reduced, thereby improving the accuracy of texture acquisition.

[0008] In a possible implementation, the detection component further includes a connection layer, which is disposed between the ultrasonic pattern collection module and the conductive layer and is connected to the ultrasonic pattern collection module and the conductive layer, respectively. By providing the connection layer, on the one hand, it is easy to connect the ultrasonic pattern collection module and the conductive layer, and on the other hand, it is helpful for the conduction of ultrasonic waves.

[0009] In a possible implementation, the ultrasonic pattern acquisition module includes a substrate and a first electrode layer, a piezoelectric layer, and a second electrode layer stacked in sequence on the substrate; the connection layer is disposed between the conductive layer and the substrate. In this way, the substrate is directly connected to the conductive layer, which can improve the connection flatness and facilitate ultrasonic wave propagation.

[0010] In a possible implementation, the acoustic impedance of the connection layer is 0.7Z to 1.3Z. Wherein, Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the substrate connected to the connecting layer. By limiting the acoustic impedance range of the connecting layer, the connecting layer has excellent acoustic impedance matching characteristics, thereby improving the conduction effect of ultrasonic waves.

[0011] In a possible implementation, the ultrasonic pattern collection module includes a substrate and a first electrode layer, a piezoelectric layer, and a second electrode layer stacked in sequence on the substrate; the connecting layer is arranged between the conductive layer and the second electrode layer. In this way, the ultrasonic wave does not need to pass through the substrate, and the ultrasonic signal strength can be improved.

[0012] In a possible implementation, the acoustic impedance of the connection layer is 0.7Z to 1.3Z. Wherein, Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the second electrode layer connected to the connecting layer.

[0013] In a possible implementation, the ultrasonic texture collection module further includes an ultrasonic texture processing module coupled to the first electrode layer; the conductive layer and the first electrode layer are both coupled to the substrate, and the ultrasonic texture processing module and the bioelectric signal collection module are both disposed on the substrate. This is an implementation with a simple structure.

[0014] In a possible implementation, the detection component further includes a flexible circuit board, the first electrode layer is coupled to the flexible circuit board through the substrate, the conductive layer is coupled to the flexible circuit board, and the ultrasonic texture processing module and the bioelectric signal acquisition module are both arranged on the flexible circuit board. This is a simple implementation.

[0015] In a possible implementation, the ultrasonic texture processing module and the bioelectric signal acquisition module are integrated in the same integrated circuit. By integrating the ultrasonic texture processing module and the bioelectric signal acquisition module, it is helpful to reuse some circuits (such as storage part, amplifier, filter, etc.) of the ultrasonic texture processing module and the bioelectric signal acquisition module, so that the bioelectric signal and the biometric information have a more synchronized signal link, thereby improving the response speed of fingerprint recognition. In addition, partial circuit reuse can save the area and cost of the circuit in the detection component.

[0016] According to a second aspect of an embodiment of the present application, an electronic device is provided, the electronic device comprising: a processor and the detection component of any one of the first aspects, the detection component being coupled to the processor. According to the second aspect of an embodiment of the present application, the electronic device comprises the detection component of the first aspect, and its beneficial effects are the same as those of the detection component, which will not be described in detail here.

[0017] In a possible implementation, the electronic device further includes a frame; the frame includes an opening; the opening exposes the conductive layer of the detection component. In this way, the detection component and the frame can be assembled, which can reduce the material requirements for the frame.

[0018] In a possible implementation, the electronic device further includes a frame; the frame includes a first conductive portion stacked with the ultrasonic pattern acquisition module, and the first conductive portion serves as a conductive layer of the detection component. In this way, part of the frame structure can be reused as a conductive layer in the detection component, reducing the component structure.

[0019] In a possible implementation, the electronic device further includes a rear shell, the rear shell includes a second conductive portion stacked with the ultrasonic pattern acquisition module, and the second conductive portion serves as a conductive layer of the detection component. This is a structurally simple implementation. In this way, part of the structure of the rear shell can be reused as a conductive layer in the detection component, reducing the component structure.

[0020] According to a third aspect of an embodiment of the present application, a control method for an electronic device is provided. The electronic device includes an ultrasonic pattern acquisition module, a conductive layer, and a bioelectric signal acquisition module. The control method includes: the bioelectric signal acquisition module acquires the signal of the conductive layer to generate a bioelectric signal; the ultrasonic pattern acquisition module generates biometric information; and when both the biometric information and the bioelectric signal are successfully authenticated, an unlocking instruction is generated.

[0021] The control method of the electronic device provided in the embodiment of the application generates an unlocking instruction only when both the biometric information and the bioelectric signal are successfully authenticated. If the bioelectric signal is not successfully authenticated, the unlocking instruction will not be generated, and the electronic device will not have an unlocking operation. Living body recognition can be achieved, reducing the risk of fake fingers and other patterns directly unlocking the electronic device. Moreover. Since the ultrasonic wave is transmitted as a pressure signal in the laminate, and the bioelectric signal is an electrical signal, the two signals can be collected at the same time to ensure that the final unlocking time is within an acceptable range.

[0022] In one possible implementation, the bioelectric signal acquisition module acquires the signal of the conductive layer and generates the bioelectric signal, including: the bioelectric signal acquisition module receives a first instruction, acquires the signal of the conductive layer, and generates a bioelectric signal lasting a first duration; or the bioelectric signal acquisition module receives a second instruction, acquires the signal of the conductive layer, and generates a bioelectric signal lasting a second duration; wherein the first duration is greater than the second duration. Based on different application scenarios, electronic devices can acquire bioelectric signals of different durations to meet different requirements such as response speed or unlocking reliability.

[0023] In a possible implementation, the first duration is greater than or equal to the cycle length of the bioelectric signal, and the second duration is less than the cycle length of the bioelectric signal. This is an easy-to-implement approach. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0025] Figure 1B A schematic diagram of an application scenario of an electronic device provided in an embodiment of the present application;

[0026] Figure 2A and Figure 2B A schematic diagram of a fingerprint recognition method according to an embodiment of the present application;

[0027] Figure 2C A schematic diagram of the structure of an ultrasonic fingerprint detection component according to an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of a detection component provided in an embodiment of the present application;

[0029] Figure 4 and Figure 5 A schematic diagram of the structure of another detection component provided in an embodiment of the present application;

[0030] Figure 6 A schematic diagram of the structure of another detection component provided in an embodiment of the present application;

[0031] Figure 7 A schematic diagram of the structure of another detection component provided in an embodiment of the present application;

[0032] Figure 8 A schematic diagram of a frame assembly provided in an embodiment of the present application;

[0033] Fig. 9 A schematic diagram of another frame assembly provided in an embodiment of the present application;

[0034] Fig.10 A schematic rear view of an electronic device provided in an embodiment of the present application;

[0035] Fig.11 A schematic rear view of another electronic device provided in an embodiment of the present application;

[0036] Fig.12 A flow chart of a control method of an electronic device provided in an embodiment of the present application;

[0037] Fig.13 A waveform diagram of an ECG signal provided in an embodiment of the present application;

[0038] Fig.14 A flow chart of another control method of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0040] In the following, the terms "second", "first", etc. are used only for convenience of description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "second", "first", etc. may explicitly or implicitly include one or more of the feature. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0041] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" may be defined including but not limited to the orientation relative to the schematic placement of the components in the drawings. It should be understood that these directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to changes in the orientation of the components in the drawings.

[0042] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. In addition, the term "coupled" can be a direct electrical connection or an indirect electrical connection through an intermediate medium. The term "contact" can be a direct contact or an indirect contact through an intermediate medium.

[0043] In the embodiments of the present application, "and / or" describes the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B may be singular or plural. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0044] The embodiment of the present application provides an electronic device, which has a sensing detection function for a pressed object. For example, fingerprints, palm prints or handprints of hands can be detected. The electronic device is, for example, a portable or mobile device such as a consumer electronic product, a home electronic product, a car-mounted electronic product, etc. with a biometric detection function. Among them, consumer electronic products are terminal devices, mobile phones, tablet computers, laptops, desktop computers, e-readers, personal computers (PC), personal digital assistants (PDA), game devices, desktop displays, smart wearable products (for example, smart watches, smart watches, smart glasses, smart bracelets, smart jewelry, etc.), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, electronic databases, cars, bank ATMs, bank cards with fingerprint unlocking functions, etc. Home electronic products are such as smart door locks, televisions, remote controls, refrigerators, rechargeable small household appliances (such as soybean milk machines, sweeping robots), etc. The vehicle-mounted electronic products include vehicle-mounted navigation systems, vehicle-mounted high-density digital video discs (DVDs), etc. The electronic device may be an electronic device with a display function or an electronic device without a display function, which is not limited in the embodiments of the present application.

[0045] The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic device. For the convenience of explanation, the following embodiments are all illustrated by taking the electronic device as a mobile phone.

[0046] Figure 1A A schematic diagram of the structure of an electronic device provided in an embodiment of the present application, Figure 1B A schematic diagram of an application scenario of an electronic device provided in an embodiment of the present application.

[0047] Figure 1A FIG. 1 is a schematic diagram of an electronic device 10 according to an embodiment of the present application. Figure 1A As shown, the electronic device 10 mainly includes a cover plate 11, a touch screen 12, a frame 13 and a rear shell 14. The rear shell 14 and the touch screen 12 are respectively located on both sides of the frame 13, and the frame 13 and the touch screen 12 are arranged in the rear shell 14, the cover plate 11 is arranged on a side of the touch screen 12 away from the frame 13, and the display surface of the touch screen 12 faces the cover plate 11.

[0048] For example, the touch display screen 12 can be a low temperature polysilicon (LTPS) display screen, an active-matrix organic light emitting diode (AMOLED) display screen, a low temperature polycrystalline oxide (LTPO) display screen, a liquid crystal display (LCD), or a micro organic light emitting diode (micro LED) display screen. Of course, the embodiment of the present application does not limit the type of the touch display screen 12, and all display screens with a touch display function are applicable to the embodiment of the present application, and the above list is only a schematic.

[0049] On this basis, if Figure 1A As shown, the electronic device 10 further includes a texture recognition module 15, which is disposed on one side of the frame 13, and is used to provide a biometric feature recognition function for the electronic device 10. Figure 1B As shown, the user presses the pattern recognition module 15 with a finger to perform biometric recognition (eg, finger unlocking).

[0050] In addition, those skilled in the art will appreciate that the structure of the electronic device 10 shown in the above-mentioned figures does not constitute a limitation on the electronic device 10, and the electronic device 10 may include more or fewer components than shown, or combine certain components, or arrange the components differently. For example, the electronic device 10 also includes printed circuit boards (PCB), batteries, cameras, microphones, speakers, radio frequency circuits, input units, sensors, audio circuits, wireless fidelity (WiFi) modules, power supplies, Bluetooth modules and other components, which will not be described in detail here.

[0051] Taking fingerprint recognition as an example, as users' demand for full-screen technology continues to grow, the technology of under-screen fingerprints is also developing. Currently, there are three main types of fingerprint technologies: capacitive fingerprint technology, optical fingerprint technology, and ultrasonic fingerprint technology.

[0052] Capacitive fingerprint technology cannot be used for under-screen unlocking, and the unlocking rate of wet fingers is low, and it cannot be used for underwater scene unlocking. Optical fingerprint technology has been greatly affected by the lower transmittance of screen technology evolution, and the unlocking performance is greatly affected. Folding screens cannot be used due to the presence of an opaque support layer. Ultrasonic fingerprint technology has the characteristics of not relying on screen transmittance, fast unlocking speed, wet hand and underwater finger unlocking, and three-dimensional (3D) anti-counterfeiting, and is gradually becoming a new choice for major electronic devices.

[0053] As a new form of technology, currently, technicians in this field mainly focus on optimizing the performance structure of fingerprint modules, and pay little attention to anti-counterfeiting in fingerprint recognition technology. However, although ultrasonic fingerprints have certain anti-counterfeiting capabilities, because ultrasonic waves are transmitted between layers many times and generally have multiple cycles, there will be surface fingerprint signals in the longer echo delay, and different depth information cannot be distinguished well, resulting in poor results only by identifying fingerprint information at different depths in the actual process. Therefore, it is necessary to improve the reliability of fingerprint information anti-counterfeiting.

[0054] Figure 2A and Figure 2B A schematic diagram of a fingerprint recognition method according to an embodiment of the present application.

[0055] In some technologies, such as Figure 2A As shown in the figure, when using the ultrasonic fingerprint module for fingerprint detection, the imaging results of different echo delays are used to collect echo signals in different time periods, and imaging information of different depths can be collected to achieve liveness recognition. Figure 2A As shown in Figure 1, although fake fingerprints can replicate the surface morphology of fingerprints, it is difficult to imitate the fingerprint information under the surface. When collecting imaging information at different depths, such as Figure 2A As shown in (a), (b), and (c) in Figure 1, the deeper the depth, the more blurred the fingerprint outline. Figure 2A As shown in (d) in the figure, the final synthesized image cannot obtain complete fingerprint image information.

[0056] However, different depths under the real finger epidermis still have different fingerprint image information, such as Figure 2B As shown in (a), (b), and (c), the deeper the depth, the shallower the fingerprint definition, but there is still complete fingerprint image information. Figure 2BAs shown in (d) in the figure, the final synthesized image can also obtain clear and complete fingerprint image information.

[0057] Therefore, the anti-counterfeiting judgment effect can be achieved by collecting different echo delay images and then synthesizing them. However, this method is complicated and the accuracy is not ideal.

[0058] Figure 2C A schematic diagram of the structure of an ultrasonic fingerprint detection component according to an embodiment of the present application.

[0059] In some technologies, such as Figure 2C As shown, the ultrasonic fingerprint recognition component includes an ultrasonic fingerprint detection unit and a liveness detection unit. The ultrasonic fingerprint detection unit is used to perform fingerprint detection. The liveness detection unit overlaps with the ultrasonic fingerprint detection unit and is used to perform liveness detection during the silent period of the ultrasonic fingerprint detection unit.

[0060] The liveness detection unit includes an insulating layer (not shown in the figure), a first touch electrode and a second touch electrode which are sequentially arranged above the ultrasonic fingerprint detection unit. A dielectric layer is arranged between the first touch electrode and the second touch electrode, and the first touch electrode and the second touch electrode form a capacitor structure. The silent period of the ultrasonic fingerprint detection unit can be used as the liveness detection time of the liveness detection unit. During this time, the ultrasonic fingerprint detection unit does not work, and a pulse signal is input by the second touch electrode, and the first touch electrode generates an induced charge under the action of the pulse signal. If the subject to be detected is a living body, since the living body can conduct electricity, a new capacitor structure can be formed between the subject to be detected and the second touch electrode, thereby reducing the capacitance between the first touch electrode and the second touch electrode, and the charge on the first touch electrode flows to the subject to be detected. Because the living body has a specific conductivity, the living body has a specific range of influence on the capacitance between the first touch electrode and the second touch electrode.

[0061] Therefore, when it is detected that the capacitance between the first touch electrode and the second touch electrode changes within the above-mentioned specific change range, it can be determined that the subject is a living body. However, this structure is complex and the accuracy is not ideal.

[0062] Figure 3 A schematic diagram of the structure of a detection component provided in an embodiment of the present application.

[0063] The present application embodiment provides a detection component 20, such as Figure 3 As shown, the detection component 20 includes an ultrasonic pattern acquisition module 21 , a conductive layer 22 and a bioelectric signal acquisition module 23 .

[0064] The conductive layer 22 is stacked on one side of the ultrasonic pattern collection module 21 and connected to the ultrasonic pattern collection module 21. For example, the conductive layer 22 and the ultrasonic pattern collection module 21 form a fixed connection component. For example, the conductive layer 22 is located on the surface of the detection component 20 for contacting the user.

[0065] For example, the conductive layer 22 is a single-layer structure. The single-layer conductive layer is used as a biological detection electrode, and the impedance of the entire detection path is low and the ability to resist external interference is strong.

[0066] Alternatively, for example, the conductive layer 22 is a multi-layer structure that is stacked. The multi-layer structure can protect the conductive layer 22 and improve signal quality.

[0067] The embodiment of the present application does not limit the material of the conductive layer 22. The material of the conductive layer 22 may be, for example, metal, conductive plastic doped with conductive material, conductive glass doped with conductive material, etc.

[0068] In some embodiments, the conductive layer 22 is a plate-shaped structure, and the conductive layer 22 covers the portion of the ultrasonic pattern collection module 21 that is connected to the conductive layer 22 .

[0069] In some embodiments, the thickness of the conductive layer 22 is 0.35n*λ to 0.65n*λ. For example, the thickness of the conductive layer 22 is 0.35n*λ, 0.4n*λ, 0.45n*λ, 0.5n*λ, 0.55n*λ, 0.6n*λ or 0.65n*λ.

[0070] Wherein, λ is the wavelength of the conductive layer 22, λ=C1 / f, C1 is the sound velocity of the conductive layer 22, f is the operating frequency of the ultrasonic texture collection module 21, and n is a positive integer. After the material of the conductive layer 22 is determined, the sound velocity C1 of the conductive layer 22 is uniquely determined. After the structure of the ultrasonic texture collection module 21 is determined, the operating frequency f of the ultrasonic texture collection module 21 can be determined.

[0071] For example, the conductive layer 22 is a single-layer structure, and the thickness of the single-layer structure is in the range of 0.35n*λ to 0.65n*λ.

[0072] Or, for example, the conductive layer 22 is a multi-layer stacked structure, and the sum of the thicknesses of the multi-layer stacked structure is in the range of 0.35n*λ to 0.65n*λ. For example, the thickness-wavelength ratio of each layer in the multi-layer stacked structure can satisfy the value of d1 / λ1+d2 / λ2+...+di / λi in the range of 0.35n to 0.65n. Among them, d1 is the thickness of the first layer in the multi-layer stacked structure, and λ1 is the wavelength of the first layer in the multi-layer stacked structure. D2 is the thickness of the second layer in the multi-layer stacked structure, and λ2 is the wavelength of the second layer in the multi-layer stacked structure. di is the thickness of the i-th layer in the multi-layer stacked structure, and λi is the wavelength of the i-th layer in the multi-layer stacked structure. By limiting the thickness of the conductive layer 22, the influence of the conductive layer 22 on the ultrasonic signal in the ultrasonic texture acquisition module 21 can be reduced, thereby ensuring the accuracy of texture acquisition.

[0073] The bioelectric signal acquisition module 23 is coupled to the conductive layer 22 and is used to collect signals from the conductive layer 22. The bioelectric signal acquisition module 23 can acquire bioelectric signals representing the user's bio-information by collecting and processing the bioelectric information transmitted on the conductive layer 22. The embodiment of the present application does not limit the manner in which the bioelectric signal acquisition module 23 acquires bio-information by collecting signals from the conductive layer 22, and the structures in the related art can all be applied to the embodiment of the present application.

[0074] The bioelectric signal acquisition module 23 may include, for example, an analog front end (AFE). The bioelectric signal acquisition module 23 may acquire bioelectric signals such as blood pressure, heart rate, electrocardiogram, electromyography, and blood oxygen, so that users can better understand their body health information and help users maintain good health.

[0075] The ultrasonic pattern acquisition module 21 is used to generate biometric information. For example, the ultrasonic pattern acquisition module 21 generates biometric information based on the ultrasonic detection principle. The embodiment of the present application does not limit the structure of the ultrasonic pattern acquisition module 21, and the ultrasonic pattern acquisition modules in the related art are applicable to the embodiment of the present application. For example, the ultrasonic pattern acquisition module 21 can be used to detect user fingerprints and / or palm prints. For example, the ultrasonic pattern acquisition module 21 is an ultrasonic fingerprint recognition module, and the ultrasonic pattern acquisition module 21 identifies the user's identity by collecting the user's fingerprint information.

[0076] The detection component 20 provided in the embodiment of the present application integrates the ultrasonic pattern collection module 21 and the conductive layer 22 as a bioelectrode, so that one detection component 20 has both the biometric signal and bioelectric signal collection functions. The dual protection of bioelectric signals and biometric signals is used to determine whether to perform fingerprint unlocking, thereby improving the anti-counterfeiting ability of pattern recognition. In addition, after the multifunctional detection component 20 is applied to the electronic device 10, the integration of the electronic device 10 can be improved and the hardware implementation cost can be reduced.

[0077] Figure 4 and Figure 5 A schematic diagram of the structure of another detection component provided in an embodiment of the present application.

[0078] In some embodiments, Figure 4 As shown, the ultrasonic texture collection module 21 includes a substrate 211 , an ultrasonic texture processing module 215 , and a first electrode layer 212 , a piezoelectric layer 213 , and a second electrode layer 214 sequentially stacked on the substrate 211 .

[0079] The working process of the ultrasonic texture acquisition module 21 is divided into a transmitting (transmitter, TX) stage and a receiving (receiver, RX) stage. In the transmitting stage, the first electrode layer 212 receives a high-voltage pulse signal, and the second electrode layer 214 receives a fixed-level signal. The piezoelectric layer 213 is subjected to the static high voltage on the upper and lower sides, which is converted into a high-frequency mechanical vibration, i.e., ultrasonic waves. The ultrasonic waves are transmitted to the conductive layer 22 through each layer until they encounter a pressing object (such as a finger) on the surface of the conductive layer 22. Part of the ultrasonic waves are reflected by the pressing object, and a small part continues to propagate forward.

[0080] In the receiving stage, the reflected ultrasonic wave passes through each layer of the medium again and reaches the piezoelectric layer 213. The piezoelectric layer 213, which is already close to stillness, is driven by the reflected ultrasonic wave to vibrate at high frequency, and then the high-frequency vibration is converted into a high-frequency pulse electrical signal. This electrical signal is received by the first electrode layer 212 and then transmitted to the ultrasonic texture processing module 215. The different reflectivity of the ridges and valleys of the texture will cause a difference in the intensity of the reflected echo. Finally, through the processing of the pixel signal reading circuit and the ultrasonic texture processing module 215 (such as thickness algorithm processing), the texture image of the pressed object of ultrasonic imaging is obtained.

[0081] For example, the first electrode layer 212 includes a plurality of electrodes arranged in an array, and the second electrode layer 214 is a plate-shaped electrode. Alternatively, for example, the first electrode layer includes a plurality of electrodes arranged in an array, and the second electrode layer 214 includes a plurality of electrodes arranged in an array. The structure of the ultrasonic texture collection module 21 illustrated in the embodiment of the present application is only an illustration and is not limited in any way.

[0082] In some embodiments, Figure 4As shown, the connection layer 24 is arranged between the conductive layer 22 and the substrate 211, and the conductive layer 22 is arranged on the side of the substrate 211 away from the first electrode layer 212. Alternatively, it can be understood that the ultrasonic pattern collection module 21 is reversely attached to the conductive layer 22. In this way, the substrate 211 is directly connected to the conductive layer 22, which can improve the connection flatness and facilitate ultrasonic wave propagation.

[0083] For example, the detection component 20 further includes a connection layer 24, which is disposed between the ultrasonic texture collection module 21 and the conductive layer 22, and the connection layer 24 is respectively connected to the ultrasonic texture collection module 21 and the conductive layer 22. For example, the connection layer 24 is respectively connected to the substrate 211 and the conductive layer 22 to achieve the connection between the ultrasonic texture collection module 21 and the conductive layer 22.

[0084] The connection layer 24 may be an insulating connection layer, or a conductive connection layer. For example, the connection layer 24 is a glue layer, which is used to bond the ultrasonic pattern collection module 21 and the conductive layer 22 together.

[0085] In some embodiments, the acoustic impedance of the connection layer 24 is 0.7Z to 1.3Z. For example, the acoustic impedance of the connection layer 24 is 0.7Z, 0.8Z, 0.9Z, 1.0Z, 1.1Z, 1.2Z, or 1.3Z.

[0086] in, Z1 is the acoustic impedance of the conductive layer 22, and Z2 is the acoustic impedance of the film layer on the side of the connecting layer 24 away from the conductive layer 22. Z1 = ρ1*C1, ρ1 is the density of the conductive layer 22, and C1 is the acoustic velocity of the conductive layer 22. Z2 = ρ2*C3, ρ2 is the density of the film layer on the side of the connecting layer 24 away from the conductive layer 22, and C3 is the acoustic velocity of the film layer on the side of the connecting layer 24 away from the conductive layer 22. For example, Z2 is Figure 4 C is the acoustic impedance of the substrate 211 , ρ2 is the density of the substrate 211 , and C3 is the acoustic velocity of the substrate 211 .

[0087] By limiting the acoustic impedance range of the connection layer 24 , the connection layer 24 has excellent acoustic impedance matching characteristics, that is, the acoustic impedance of the connection layer 24 matches the acoustic impedance of the conductive layer 22 and the acoustic impedance of the substrate 211 , thereby improving the conduction effect of ultrasonic waves.

[0088] In other embodiments, Figure 5 As shown, the connection layer 24 is arranged between the conductive layer 22 and the second electrode layer 214, and the conductive layer 22 is arranged on the side of the second electrode layer 214 away from the piezoelectric layer 213. Alternatively, it can be understood that the ultrasonic pattern collection module 21 is directly attached to the conductive layer 22. In this way, the ultrasonic wave does not need to pass through the substrate 211, and the ultrasonic wave signal strength can be improved.

[0089] For example, the detection component 20 further includes a connection layer 24, which is disposed between the ultrasonic texture collection module 21 and the conductive layer 22, and the connection layer 24 is respectively connected to the ultrasonic texture collection module 21 and the conductive layer 22. For example, the connection layer 24 is respectively connected to the second electrode layer 214 and the conductive layer 22 to achieve the connection between the ultrasonic texture collection module 21 and the conductive layer 22.

[0090] in, Z1 is the acoustic impedance of the conductive layer 22, and Z2 is the acoustic impedance of the film layer on the side of the connecting layer 24 away from the conductive layer 22. Z2 = ρ2*C3, ρ2 is the density of the film layer on the side of the connecting layer 24 away from the conductive layer 22, and C3 is the acoustic velocity of the film layer on the side of the connecting layer 24 away from the conductive layer 22. For example, Z2 is Figure 5 ρ2 is the acoustic impedance of the second electrode layer 214 , ρ2 is the density of the second electrode layer 214 , and C3 is the acoustic velocity of the second electrode layer 214 .

[0091] By limiting the acoustic impedance range of the connection layer 24 , the connection layer 24 has excellent acoustic impedance matching characteristics, that is, the acoustic impedance of the connection layer 24 matches the acoustic impedance of the conductive layer 22 and the acoustic impedance of the second electrode layer 214 , thereby improving the conduction effect of ultrasonic waves.

[0092] In some embodiments, the ultrasonic texture acquisition module 21 also includes a plurality of pixel signal reading circuits, and the plurality of pixel signal reading circuits are coupled to the plurality of electrodes in the first conductive layer 212. After the pixel signal reading circuit reads the echo signal on the first conductive layer 212, it is transmitted to the ultrasonic texture processing module 215 for filtering, amplification, and other processing to obtain a bioelectric signal. The structure and relationship between the pixel signal reading circuit and the ultrasonic texture processing module 215 can refer to the description of the relevant technology and will not be repeated here. At this time, the ultrasonic texture processing module 215 can be coupled to the first electrode layer 212 through the pixel signal reading circuit, for example.

[0093] In some embodiments, the substrate 211 includes a plurality of pixel signal reading circuits arranged in an array, and the plurality of pixel signal reading circuits are correspondingly coupled to a plurality of electrodes in the first conductive layer 212. For example, the substrate 211 is a thin film transistor (TFT) substrate.

[0094] In some other embodiments, the substrate 211 is a carrier substrate such as a silicon substrate or a glass substrate provided with leads. A plurality of pixel signal reading circuits may be provided at other locations.

[0095] In some embodiments, Figure 5 As shown, the conductive layer 22 and the first electrode layer 212 are both coupled to the substrate 211 , and the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are both disposed on the substrate 211 .

[0096] For example, the conductive layer 22 is coupled to the substrate 211 through a wire, and the first electrode layer 212 is coupled to the substrate 211 through a pin on the substrate 211. At this time, the substrate 211 may include a plurality of pixel signal reading circuits arranged in an array, and the first electrode layer 212 is coupled to the pixel signal reading circuit on the substrate 211.

[0097] In some embodiments, the detection component 20 further includes a flexible printed circuit board (FPCB), which is coupled to the substrate 211. The ultrasonic texture processing module 215 collects and processes the ultrasonic texture signal to generate biometric information, and the bioelectric signal collection module 23 collects and processes the signal of the conductive layer 22 to generate a bioelectric signal. The biometric information and the bioelectric signal are transmitted to an external application processor (AP) through the FPCB.

[0098] Figure 6 A schematic diagram of the structure of another detection component provided in an embodiment of the present application.

[0099] In other embodiments, Figure 6 As shown, the detection component 20 also includes an FPCB, the first electrode layer 212 is coupled to the FPCB through the substrate 211, the conductive layer 22 is coupled to the FPCB, and the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are both arranged on the FPCB.

[0100] That is to say, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are no longer integrated in the substrate 211, but are externally arranged on the FPCB.

[0101] For example, the conductive layer 22 is coupled to the FPCB through a wire, and the first electrode layer 212 is coupled to the FPCB through a conductive structure on the substrate 211. In this case, only leads may be provided on the substrate 211, and the first electrode layer 212 is indirectly coupled to the FPCB through the leads. A plurality of pixel signal reading circuits arranged in an array may also be provided on the substrate 211, and the first electrode layer 212 is indirectly coupled to the FPCB through the pixel signal reading circuit.

[0102] Setting the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 on the FPCB helps the ultrasonic texture processing module 215 to be close to the first electrode layer 212 and the bioelectric signal acquisition module 23 to be close to the conductive layer 22, thereby improving the accuracy of data reading.

[0103] In some embodiments, Figure 6As shown, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are separately arranged, and the two are not integrated or shared. This can reduce process changes and is easy to implement.

[0104] Figure 7 A schematic diagram of the structure of another detection component provided in an embodiment of the present application.

[0105] In other embodiments, Figure 7 As shown, the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are integrated in the same integrated circuit (IC).

[0106] The IC can be in the form of a bare chip, a packaged chip, or an integrated circuit module. The embodiment of the present application does not limit this, as long as the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23 are integrated together.

[0107] For example, Figure 7 As shown, the IC can be disposed on the FPCB. Alternatively, the exemplary IC can also be disposed on the substrate 211.

[0108] By integrating the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23, it is helpful to realize the reuse of some circuits (such as storage part, amplifier, filter, etc.) of the ultrasonic texture processing module 215 and the bioelectric signal acquisition module 23, so that the bioelectric signal and the biometric information have a more synchronized signal link, and the response speed of fingerprint recognition is improved. In addition, partial circuit reuse can save the area and cost of the circuit in the detection component 20.

[0109] After the detection component 20 provided in the embodiment of the present application is applied to the electronic device 10 provided in the embodiment of the present application, the detection component 20 can be coupled to the processor, and the processor judges and processes the signal output by the detection component 20 to finally determine whether to unlock.

[0110] Figure 8 A schematic diagram of a frame assembly provided in an embodiment of the present application.

[0111] In some embodiments, Figure 8 As shown, the frame 13 in the electronic device 10 includes a first opening, and the first opening exposes part or all of the conductive layer 22 in the detection component 20. Alternatively, it can be understood that the size of the first opening can be greater than, equal to, or less than the size of the conductive layer 22.

[0112] The detection component 20 is assembled with the frame 13 as an independent button. The detection component 20 can be convex relative to the frame 13, the detection component 20 can also be concave relative to the frame 13, and the detection component 20 can also be flush with the frame 13.

[0113] The material of the frame 13 can be any material such as conductive material, insulating material, semiconductor material, etc. The frame structures in the related art are applicable to the embodiments of the present application.

[0114] Of course, the detection component 20 may also be integrated into the electronic device 10 in other ways, as long as the user can touch the conductive layer 22 .

[0115] The frame 13 may further include a third opening, and the third opening exposes a volume key or other function key of the electronic device 10, so that the user can press and control the volume, etc. The detection component 20 and the volume key may be located on the same side of the frame 13, or the detection component 20 and the volume key may be located on different sides of the frame 13.

[0116] Fig. 9 A schematic diagram of another frame assembly provided in an embodiment of the present application.

[0117] In other embodiments, Fig. 9 As shown, the frame 13 does not include a first opening exposing the detection component 20 , and the frame 13 includes a first conductive portion 131 , which is stacked correspondingly to the ultrasonic pattern acquisition module 21 , and the first conductive portion 131 serves as a conductive layer 22 of the detection component 20 .

[0118] The ultrasonic pattern collection module 21 is placed inside the frame 13, and the frame 13 includes a first conductive part 131 and the rest. The first conductive part 131 ensures conductivity, and the rest may or may not have conductivity. For example, the material of the frame 13 may be a conductive material, and the first conductive part 131 and the rest may both have conductivity. Or, for example, the material of the frame 13 is an insulating material (such as plastic), and the first conductive part 131 is formed by doping the insulating material.

[0119] Fig.10 A schematic rear view of an electronic device provided in an embodiment of the present application.

[0120] In some embodiments, Fig.10 As shown, the electronic device 10 further includes a rear shell 14 , and the rear shell 14 includes a second opening, and the second opening exposes part or all of the conductive layer 22 in the detection component 20 .

[0121] The detection component 20 is assembled with the rear shell 14 as an independent button. The detection component 20 can be convex relative to the rear shell 14 , the detection component 20 can also be concave relative to the rear shell 14 , and the detection component 20 can also be flush with the rear shell 14 .

[0122] The material of the rear shell 14 can be any material such as conductive material, insulating material, semiconductor material, etc. The frame structure in the related art is applicable to the embodiments of the present application.

[0123] The rear shell 14 may further include a camera hole, through which the rear structures of the electronic device 10 such as a camera are exposed. Fig.10 The structure and layout of the camera hole are only for illustration and are not intended to be limiting. The cameras in the electronic device 10 include, for example, a telephoto camera, a short-focus camera, and a periscope camera.

[0124] Fig.11 A schematic rear view of another electronic device provided in an embodiment of the present application.

[0125] In other embodiments, Fig.11 As shown, the electronic device 10 further includes a rear shell 14 , which includes a second conductive portion 141 , which is stacked corresponding to the ultrasonic pattern acquisition module 21 , and serves as a conductive layer 22 of the detection component 20 .

[0126] The ultrasonic pattern acquisition module 21 is placed on the inner side of the rear shell 14, and the rear shell 14 includes a second conductive part 141 and the rest. The second conductive part 141 ensures conductivity, and the rest may or may not have conductivity. For example, the material of the rear shell 14 may be a conductive material, and the second conductive part 141 and the rest are both conductive. Or for example, the material of the rear shell 14 is an insulating material (such as a polymer material), the second conductive part 141 is a conductive structure, and the rest is an insulating structure. The second conductive part 141 may be formed by doping an insulating material, or the second conductive part 141 may be formed by replacing the material in the corresponding area.

[0127] Fig.12 A flow chart of a control method for an electronic device provided in an embodiment of the present application.

[0128] The embodiment of the present application further provides a control method for an electronic device, where the electronic device 10 includes the above-mentioned detection component 20 .

[0129] like Fig.12 As shown, a control method of an electronic device includes:

[0130] The bioelectric signal acquisition module 23 collects the signal of the conductive layer 22 to generate a bioelectric signal. Bioelectric signals include, for example, electrocardiogram (ECG) signals. ECG signals are electrical signals generated by placing electrodes on the chest to measure the electrical activity of the heart. On the one hand, these electrical signals are recorded and used to assess the health of the heart. On the other hand, these signals can be used to determine whether a living body is alive. Liveness recognition is an effective method in fingerprint anti-counterfeiting. By detecting human live information, such as heart rate, impedance, ECG and other characteristic signals, it is possible to detect whether the pressed fingerprint belongs to a living body. Among them, ECG, as a conventional bioelectric signal, can be effectively combined with ultrasonic fingerprints to achieve a higher fingerprint experience and security protection.

[0131] The bioelectric signal acquisition module 23 may adopt a bioelectric signal acquisition method in the related art according to the way in which the bioelectrodes generate bioelectric signals, which is not limited in the embodiment of the present application.

[0132] Fig.13 A waveform diagram of an ECG signal provided in an embodiment of the present application.

[0133] like Fig.13 As shown, the ECG signal is usually a periodic waveform, consisting of a P wave, a QRS complex, a T wave, and a U wave. The P wave represents the contraction of the atrium, the QRS complex represents the contraction of the ventricle, the T wave represents the relaxation of the ventricle, and the U wave represents the ventricular successor potential. Based on different application scenarios, the bioelectric signal acquisition module 23 collects bioelectric signals of different lengths. For example, the bioelectric signal acquisition module 23 can collect bioelectric signals of a complete cycle, and the bioelectric signal acquisition module 23 can also collect bioelectric signals of an incomplete cycle.

[0134] Fig.14 A flow chart of another control method of an electronic device provided in an embodiment of the present application.

[0135] In some embodiments, Fig.14 As shown, the bioelectric signal acquisition module 23 receives the first instruction, acquires the signal of the conductive layer 22, and generates a bioelectric signal lasting a first duration.

[0136] For example, the current electronic device 10 is in a scenario with high security requirements, and the system on chip (SOC) sends a first instruction to the bioelectric signal acquisition module 23. The bioelectric signal acquisition module 23 receives the first instruction, and the bioelectric signal acquisition module 23 collects the signal of the conductive layer 22 to generate a complete cycle of bioelectric signals. At this time, the complete bioelectric signal is collected, and whether there is living body information is determined based on the complete bioelectric signal. Depending on the application scenario, one or more complete cycles of bioelectric signals can be used. That is, the first duration of the bioelectric signal can be one or more cycles.

[0137] For some scenarios with high security requirements such as payment, banking, and personal highly sensitive privacy information, the accuracy of the test results can be improved by detecting the bioelectric signals of the complete cycle.

[0138] In some other embodiments, the bioelectric signal acquisition module 23 receives the second instruction, acquires the signal of the conductive layer 22, and generates a bioelectric signal lasting for a second duration, wherein the first duration is greater than the second duration.

[0139] For example, the current electronic device 10 is in a conventional unlocking scenario, and the SOC sends a second instruction to the bioelectric signal acquisition module 23. The bioelectric signal acquisition module 23 receives the second instruction, and the bioelectric signal acquisition module 23 collects the signal of the conductive layer 22 to generate a bioelectric signal of an incomplete cycle. At this time, only part of the bioelectric signal is collected, and whether there is living body information is determined based on the part of the bioelectric signal. That is, the first duration of the bioelectric signal is less than one cycle.

[0140] Generally, the ECG signal cycle is 800ms, and the fingerprint unlocking time is generally 200ms. Under normal circumstances, if a complete ECG cycle is collected, the unlocking time will be seriously affected. Therefore, partial ECG signals can be collected to improve the response speed of fingerprint unlocking.

[0141] Based on different application scenarios, the electronic device 10 can collect bioelectric signals of different durations to meet different requirements such as response speed or unlocking reliability. In different application scenarios, the bioelectric signal collection module 23 receives different instructions and does not receive the first instruction and the second instruction at the same time.

[0142] like Fig.12 As shown, the control method of the electronic device also includes: the ultrasonic pattern acquisition module 21 generates biometric information, wherein the method for the ultrasonic pattern acquisition module 21 to generate biometric information can adopt ultrasonic technology in related technologies, which is not limited in the embodiments of the present application.

[0143] There is no restriction on the order between the step of the ultrasonic pattern acquisition module 21 generating the biometric information and the step of the bioelectric signal acquisition module 23 generating the bioelectric signal, and the two can be performed simultaneously or one after the other.

[0144] In some embodiments, Fig.12 As shown, before the ultrasonic pattern acquisition module 21 generates biometric information, the control method further includes: determining whether the bioelectric signal is successfully authenticated, and only when the bioelectric signal is successfully authenticated, the ultrasonic pattern acquisition module 21 collects the biometric information. If the bioelectric signal is not successfully authenticated, the ultrasonic pattern acquisition module 21 does not collect the biometric information.

[0145] Determining whether the bioelectric signal is successfully authenticated is equivalent to the process of eliminating fake fingers. After excluding fake fingers, fingerprint recognition is performed, which can further reduce the power consumption of the electronic device 10.

[0146] If both the biometric information and the bioelectric signal are successfully authenticated, an unlock instruction is generated. If the biometric information is not successfully authenticated, the unlocking is completed regardless of whether the bioelectric signal is successfully authenticated. If the bioelectric signal is not successfully authenticated, the unlocking is completed regardless of whether the biometric information is successfully authenticated.

[0147] For example, when a finger contacts the ultrasonic pattern acquisition module 21 and attempts to unlock the electronic device 10, the bioelectric signal acquisition module 23 simultaneously starts detecting the electrocardiogram characteristics. The unlocking instruction will be generated only when the biometric information generated by the ultrasonic pattern acquisition module 21 is successfully authenticated and the bioelectric signal generated by the bioelectric signal acquisition module 23 is also successfully authenticated. The unlocking instruction will not be generated if the biometric information collected by the ultrasonic pattern acquisition module 21 is successfully authenticated and the bioelectric signal generated by the bioelectric signal acquisition module 23 is not successfully authenticated. The unlocking instruction will not be generated if the bioelectric signal generated by the bioelectric signal acquisition module 23 is successfully authenticated and the biometric information generated by the ultrasonic pattern acquisition module 21 is not successfully authenticated.

[0148] For example, the texture image generated by the ultrasonic texture acquisition module 21 is compared with the pre-stored template library image to determine whether they match. If they match, it is determined that the biometric information generated by the ultrasonic texture acquisition module 21 is successfully authenticated. If they do not match, it is determined that the biometric information generated by the ultrasonic texture acquisition module 21 is not successfully authenticated.

[0149] For example, by comparing the bioelectric signal with a preset bioelectric signal, if the matching degree meets the preset value, it is determined that the bioelectric signal generated by the bioelectric signal acquisition module 23 is successfully authenticated.

[0150] If the fake finger contact detection component 20 constructed with a rubber model is used, the collected bioelectric signal is an abnormal bioelectric signal, the bioelectric signal is significantly different from the preset bioelectric signal, and the bioelectric signal is not successfully authenticated. Then, even if the biometric information collected by the ultrasonic pattern acquisition module 21 is successfully authenticated, the electronic device 10 will not be unlocked.

[0151] The control method of the electronic device provided in the embodiment of the application generates an unlocking instruction only when both the biometric information and the bioelectric signal are successfully authenticated. If the bioelectric signal is not successfully authenticated, the unlocking instruction will not be generated, and the electronic device 10 will not have an unlocking operation. Living body recognition can be achieved, reducing the risk of fake fingers and other patterns directly unlocking the electronic device 10. Moreover. Since the ultrasonic wave is transmitted as a pressure signal in the laminate, and the bioelectric signal is an electrical signal, the two signals can be collected at the same time to ensure that the final unlocking time is within an acceptable range.

[0152] In some embodiments, before the ultrasonic pattern acquisition module 21 acquires biometric information and the bioelectric signal acquisition module 23 generates a bioelectric signal, the control method further includes: determining whether the user touches the conductive layer 22 .

[0153] When the user touches the conductive layer 22, the ultrasonic pattern collection module 21 generates biometric information. When the user does not touch the conductive layer 22, the ultrasonic pattern collection module 21 does not generate biometric information.

[0154] When the user touches the conductive layer 22, the bioelectric signal acquisition module 23 acquires the signal of the conductive layer 22 to generate a bioelectric signal. When the user does not touch the conductive layer 22, the bioelectric signal acquisition module 23 does not generate a bioelectric signal.

[0155] For example, the ultrasonic pattern collection module 21 can collect signals to determine whether the user touches the conductive layer 22. Or, for example, pressure change detection, capacitance change detection, etc. can be used to determine whether the user touches the conductive layer 22. All solutions in the related art that can determine whether the user touches the conductive layer 22 are applicable to the embodiments of the present application.

[0156] Before collecting the biometric information and bioelectric signals, it is detected whether the user touches the conductive layer 22. After determining that the user touches the conductive layer 22, the biometric information and bioelectric signals are collected. If the user does not touch the conductive layer 22, the biometric information and bioelectric signals are not collected, which can reduce the power consumption of the electronic device 10.

[0157] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A detection component, characterized in that: The detection component comprises: Ultrasonic pattern collection module, used to generate biometric information; A conductive layer, stacked on one side of the ultrasonic pattern collection module and connected to the ultrasonic pattern collection module; The bioelectric signal acquisition module is coupled to the conductive layer and is used to acquire the signal of the conductive layer.

2. The detection component according to claim 1, characterized in that: The thickness of the conductive layer is 0.35n*λ to 0.65n*λ, wherein λ is the wavelength of the conductive layer and n is a positive integer.

3. The detection component according to claim 1 or 2, characterized in that: The detection component also includes a connection layer, which is arranged between the ultrasonic pattern collection module and the conductive layer and is connected to the ultrasonic pattern collection module and the conductive layer respectively.

4. The detection component according to claim 3, characterized in that: The ultrasonic pattern collection module comprises a substrate and a first electrode layer, a piezoelectric layer and a second electrode layer sequentially stacked on the substrate; The connecting layer is arranged between the conductive layer and the substrate; or, The connection layer is disposed between the conductive layer and the second electrode layer.

5. The detection component according to claim 4, characterized in that: The acoustic impedance of the connecting layer is 0.7Z to 1.3Z, Wherein, Z1 is the acoustic impedance of the conductive layer, and Z2 is the acoustic impedance of the substrate or the second electrode layer connected to the connecting layer.

6. The detection component according to claim 5, characterized in that: The ultrasonic texture collection module also includes an ultrasonic texture processing module coupled to the first electrode layer; The conductive layer and the first electrode layer are both coupled to the substrate, and the ultrasonic texture processing module and the bioelectric signal acquisition module are both arranged on the substrate; or, The detection component also includes a flexible circuit board, the first electrode layer is coupled to the flexible circuit board through the substrate, the conductive layer is coupled to the flexible circuit board, and the ultrasonic texture processing module and the bioelectric signal acquisition module are both arranged on the flexible circuit board.

7. The detection component according to claim 6, characterized in that: The ultrasonic texture processing module and the bioelectric signal acquisition module are integrated in the same integrated circuit.

8. An electronic device, characterized in that: The electronic device comprises: processor; A detection component, wherein the detection component comprises the detection component according to any one of claims 1 to 7, and the detection component is coupled to the processor.

9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a frame; the frame comprises an opening; the opening exposes the conductive layer of the detection component.

10. The electronic device according to claim 8, characterized in that: The electronic device also includes a frame; the frame includes a first conductive part stacked with the ultrasonic pattern acquisition module, and the first conductive part serves as a conductive layer of the detection component.

11. The electronic device according to claim 8, characterized in that: The electronic device further comprises a rear shell, wherein the rear shell comprises a second conductive part stacked with the ultrasonic pattern acquisition module, and the second conductive part serves as a conductive layer of the detection component.

12. A method for controlling an electronic device, characterized in that: The electronic device comprises an ultrasonic pattern collection module, a conductive layer and a bioelectric signal collection module; The control method comprises: The bioelectric signal acquisition module acquires the signal of the conductive layer to generate a bioelectric signal; The ultrasonic pattern collection module generates biometric information; When both the biometric information and the bioelectric signal are authenticated successfully, an unlocking instruction is generated.

13. The control method according to claim 12, characterized in that: The bioelectric signal acquisition module acquires the signal of the conductive layer to generate a bioelectric signal, including: The bioelectric signal acquisition module receives the first instruction, acquires the signal of the conductive layer, and generates the bioelectric signal lasting for a first time period; or, The bioelectric signal acquisition module receives the second instruction, acquires the signal of the conductive layer, and generates the bioelectric signal lasting for a second time period; The first duration is greater than the second duration.

14. The control method according to claim 13, characterized in that: The first duration is greater than or equal to the cycle length of the bioelectric signal, and the second duration is less than the cycle length of the bioelectric signal.

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