Backboard assembly and computing device

Abstract

The invention provides a backboard assembly, which comprises a backboard with a first ventilation opening, the backboard is a printed circuit board with a first side and a second side which are opposite to each other, and the first side is provided with a hard disk interface; and the sound blocking plates are provided with second ventilation openings, are made of hard materials capable of preventing sound waves from passing through, and are arranged on the second side of the back plate at intervals. The invention further provides an operation device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of hard disks, and in particular to a backplane assembly and a computing device. Background Art

[0002] The performance of a hard disk (such as a mechanical hard disk) is affected by noise (such as the noise emitted by a cooling fan), but related technologies cannot effectively eliminate the noise and may cause problems such as chipping. Summary of the invention

[0003] The present disclosure provides a backplane assembly and a computing device.

[0004] In a first aspect, an embodiment of the present disclosure provides a backplane assembly, comprising:

[0005] A back plate with a first vent, wherein the back plate is a printed circuit board with a first side and a second side opposite to each other, and a hard disk interface is disposed on the first side;

[0006] A sound-blocking plate with a second vent is formed of a hard material capable of preventing sound waves from passing through, and the sound-blocking plate is arranged at intervals on the second side of the back plate.

[0007] In a second aspect, an embodiment of the present disclosure provides a computing device, comprising:

[0008] A back plate with a first vent, wherein the back plate is a printed circuit board with a first side and a second side opposite to each other, and a hard disk interface is disposed on the first side;

[0009] A hard disk connected to the hard disk interface;

[0010] A sound-blocking plate having a second vent, the sound-blocking plate being made of a hard material capable of preventing sound waves from passing through, and the sound-blocking plate being arranged at intervals on the second side of the back plate;

[0011] A heat dissipation fan is located on a side of the sound-absorbing plate away from the back plate.

[0012] In the embodiment of the present disclosure, a sound-proof plate (sound-proof structure) is added between the cooling fan and the hard disk. The sound-proof plate is made of a hard sound-proof material, does not have the problem of "debris falling", and can block noise. In particular, compared with soft materials, hard materials usually have a stronger blocking effect on high-frequency noise (such as frequency 6 to 8 kHz); therefore, the embodiment of the present disclosure can better eliminate the impact of the cooling fan noise on the hard disk, improve the performance of the hard disk, and will not cause other problems such as debris falling. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In the accompanying drawings of the embodiments of the present disclosure:

[0014] Figure 1A schematic diagram of the side structure of a computing device provided by an embodiment of the present disclosure;

[0015] Figure 2 A schematic diagram of the side structure of another computing device provided by an embodiment of the present disclosure;

[0016] Figure 3 A schematic structural diagram of a first side of a backplane of another computing device provided by an embodiment of the present disclosure;

[0017] Figure 4 A schematic diagram of the structure of the second side of a backplane of another computing device provided by an embodiment of the present disclosure;

[0018] Figure 5 A schematic structural diagram of a sound-absorbing board of another computing device provided by an embodiment of the present disclosure, close to the back panel side;

[0019] Figure 6 A schematic structural diagram of a sound-absorbing board of another computing device provided by an embodiment of the present disclosure, which is located away from the back panel;

[0020] Figure 7 A schematic diagram of the structure of one side of a soft sound absorbing material in another computing device provided by an embodiment of the present disclosure;

[0021] Figure 8 A schematic diagram of the structure of one side of a waveguide plate in another computing device provided in an embodiment of the present disclosure;

[0022] Fig. 9 A schematic diagram of the structure of one side of an additional sound-absorbing plate in another computing device provided in an embodiment of the present disclosure;

[0023] Fig.10 A schematic cross-sectional view of a backplane assembly provided in an embodiment of the present disclosure;

[0024] Fig.11 A schematic cross-sectional view of another backplane assembly provided in an embodiment of the present disclosure;

[0025] Fig.12 A schematic cross-sectional view of another backplane assembly provided in an embodiment of the present disclosure;

[0026] Fig.13 A schematic cross-sectional structural diagram of another backplane assembly provided in an embodiment of the present disclosure.

[0027] In the embodiments of the present disclosure, the meanings of the reference numerals are as follows:

[0028] 1. Backplane; 11. First vent; 12. Hard disk interface; 2. Hard disk; 3. Sound-blocking board; 31. Second vent; 32. Hard disk device; 33. RAID interface; 4. Connector; 41. Plug-in interface; 51. Soft sound-absorbing material; 511. Gas channel; 52. Waveguide; 6. Cooling fan; 7. Additional sound-blocking board; 71. Third vent; 91. Central processing unit; 92. Ri ser card; 93. Power supply; 94. Casing. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the backplane assembly and computing device provided by the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0030] The present disclosure will be described more fully below with reference to the accompanying drawings, but the embodiments shown may be embodied in different forms, and the present disclosure should not be construed as being limited to the embodiments set forth below. On the contrary, the purpose of providing these embodiments is to make the present disclosure thorough and complete, and will enable those skilled in the art to fully understand the scope of the present disclosure.

[0031] The accompanying drawings of the embodiments of the present disclosure are used to provide a further understanding of the embodiments of the present disclosure, and constitute a part of the specification, and are used together with the detailed embodiments to explain the present disclosure, and do not constitute a limitation of the present disclosure. By describing the detailed embodiments with reference to the accompanying drawings, the above and other features and advantages will become more apparent to those skilled in the art.

[0032] The present disclosure may be described with reference to plan views and / or cross-sectional views by means of ideal schematic views of the present disclosure. Therefore, the exemplary illustrations may be modified according to manufacturing techniques and / or tolerances.

[0033] In the absence of conflict, the various embodiments of the present disclosure and the various features therein may be combined with each other.

[0034] The terms used in the present disclosure are only used to describe specific embodiments and are not intended to limit the present disclosure. The term "and / or" as used in the present disclosure includes any and all combinations of one or more related enumerated items. The singular forms "one" and "the" as used in the present disclosure are also intended to include plural forms, unless the context clearly indicates otherwise. The terms "including", "made of..." as used in the present disclosure specify the presence of the features, wholes, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or groups thereof.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by those of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning unless explicitly defined in this disclosure.

[0036] The present disclosure is not limited to the embodiments shown in the drawings, but includes modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings have schematic properties, and the shapes of the regions shown in the drawings illustrate the specific shapes of the regions of the elements, but are not intended to be limiting.

[0037] Many computing devices (such as servers) use hard disks as the main long-term storage medium.

[0038] For example, a mechanical hard disk (HDD) includes a head disk assembly (HAD) and a control circuit board (PCBA). When the hard disk is working, the magnetic head is lifted by the airflow brought out by the rotation of the disk. Under the command of the control circuit board, the head drive arm moves radially, so that the head read-write unit moves to the designated data track of the disk to write or read the corresponding data. Among them, the distance between the read-write unit and the disk is usually only 0.8nm±3σ (standard deviation), and the width of the data track on the disk is usually only 50nm±3σ, so a small disturbance will affect the performance of the hard disk, such as reducing the read-write speed (IOPS, Input / Output Operations Per Second). The cooling fan provided in the computing device will inevitably generate noise when it rotates, and this noise will affect the performance of the hard disk.

[0039] In some related technologies, in order to reduce the impact of noise on hard disk performance, soft sound-absorbing materials such as sound-absorbing cotton can be bonded in the gap between the hard disk and the cooling fan to absorb the noise emitted by the cooling fan as much as possible. Alternatively, a waveguide plate such as a honeycomb plate can be set between the hard disk and the cooling fan to reduce turbulence (eddy current) and reduce noise.

[0040] However, the most significant influence on hard disk performance is high-frequency noise with a frequency of 6 to 8 kHz, and the absorption effect of related technologies on high-frequency noise is relatively limited; in particular, as heat dissipation requirements increase, the speed of the cooling fan is also increasing, and the frequency of the noise it generates is also increasing accordingly. For example, when the speed of the cooling fan exceeds 20krpm, the noise it generates can reduce the IOPS of the hard disk by about 50%. Moreover, sound-absorbing cotton is "soft", so it may become loose and fall off after being disturbed by high-speed airflow for a long time, that is, it will age and fall off, and the fallen slag will block the air duct, reduce the heat dissipation effect, and even cause fire.

[0041] First, refer to Figures 1 to 13 , an embodiment of the present disclosure provides a backplane assembly.

[0042] The backplane assembly of the embodiment of the present disclosure is used in a computing device, and specifically is used to connect a hard disk 2 in the computing device.

[0043] The computing device is a device with data processing capabilities, such as a server, etc., and the hard disk 2 is a storage medium used for long-term data storage in the computing device, which can specifically be in the form of a mechanical hard disk (HDD).

[0044] Reference Fig.10 , the backplane assembly of the embodiment of the present disclosure comprises: a backplane 1 having a first vent 11, the backplane 1 being a printed circuit board having a first side and a second side opposite to each other, and a hard disk interface 12 being provided on the first side;

[0045] The sound-proof plate 3 has a second vent 31 . The sound-proof plate 3 is made of a hard material that can prevent sound waves from passing through. The sound-proof plate 3 is spaced apart on the second side of the back plate 1 and is fixed relative to the back plate 1 .

[0046] Reference Fig.10 The “back panel assembly” of the embodiment of the present disclosure includes a back panel 1 and a sound-proof panel 3 .

[0047] The backplane 1 is also called "plug backplane", "hard disk backplane", etc. Figure 1 , Figure 3 One side (first side) of each backplane 1 is provided with one or more hard disk interfaces 12 (such as SATA / SAS interfaces, etc.) for inserting hard disks 2, so that one or more hard disks 2 can be plugged in and connected; at the same time, the backplane 1 is in the form of a printed circuit board (PCB, Print Circuit Board) with leads, and can be connected to the mainboard through a flat cable, etc., so as to realize the connection between the hard disk 2 and the mainboard.

[0048] Reference Figure 3 , Figure 4 The back plate 1 is also provided with one or more first ventilation openings 11 .

[0049] Reference Figure 1 In the computing device, one or more cooling fans 6 can be arranged on the side (second side) of the backplane 1 away from the hard disk 2. The cooling fan 6 can drive the air flow around the hard disk 2 through the first ventilation port 11 to take away the heat of the hard disk 2, reduce the ambient temperature, and achieve heat dissipation of the hard disk 2.

[0050] The specific direction of the airflow generated by the cooling fan 6 is varied, as long as it can cause the air to flow through the first vent 11. Figure 2 The cooling fan 6 can be arranged between the central processing unit (CPU) 91 and the back plate 1, with a distance of 5 to 10 cm from the back plate 1, and is used to blow air to the central processing unit 91 (refer to Figure 2 The cooling fan 6 “inhales air” from the side of the back plate 1 to drive the gas to flow through the first vent 11.

[0051] It should be understood that the specific number, form, etc. of the hard disk 2, the first vent 11, and the cooling fan 6 in the embodiment of the present disclosure are various.

[0052] For example, refer to Figure 1 Each backplane 1 may have multiple hard disk interfaces 12 and connect multiple hard disks 2, and these hard disks 2 may form a disk array (RAID, Redundant Arrays of Independent Disks); for example, referring to Figure 3 Each hard disk 2 may correspond to a first vent 11, and the first vent 11 may be arranged beside the hard disk interface 12 of the corresponding hard disk 2; for example, referring to Figure 1 There may also be multiple cooling fans 6 forming a “fan row group”, wherein each cooling fan 6 corresponds to one or more first ventilation openings 11 .

[0053] Reference Figure 1 In the back panel assembly of the embodiment of the present disclosure, a "sound-proof plate 3" is provided on the second side of the back panel 1. The sound-proof plate 3 is spaced apart from and opposite to the back panel 1. For example, the size of the sound-proof plate 3 can be the same as that of the back panel 1, and is completely "opposite" to the back panel 1.

[0054] At the same time, refer to Figure 5 , Figure 6 , one or more second vents 31 are provided on the sound insulation plate 3; and the cooling fan 6 in the computing device is also arranged on the side of the sound insulation plate 3 away from the hard disk 2 (or the cooling fan 6 is arranged on the side of the back panel assembly away from the hard disk 2), so the airflow generated by the cooling fan 6 can flow through the first vent 11 and the second vent 31.

[0055] Meanwhile, the sound-proof plate 3 is made of a hard material, and the hard material can prevent noise from passing through, so if the noise generated by the cooling fan 6 is to be transmitted to the hard disk 2 , it will be blocked by the sound-proof plate 3 .

[0056] It should be understood that the thickness of the back panel 1 and the sound-blocking plate 3, as well as the distance between the back panel 1 and the sound-blocking plate 3 in the embodiment of the present disclosure should not be too large, so as to ensure that, without increasing the overall size of the computing device, sufficient air mixing space can be left between the sound-blocking plate 3 and the cooling fan 6 after the back panel assembly is installed in the computing device.

[0057] In the embodiment of the present disclosure, a sound-proof plate 3 (sound-proof structure) is added between the cooling fan 6 and the hard disk 2. The sound-proof plate 3 is a hard sound-proof material, does not have the problem of "debris falling", and can block noise. In particular, compared with soft materials, hard materials usually have a stronger blocking effect on high-frequency (such as frequency 6 to 8 kHz) noise; therefore, the embodiment of the present disclosure can better eliminate the impact of the cooling fan 6 noise on the hard disk 2, improve the performance of the hard disk 2, and will not cause other problems such as debris falling.

[0058] In some embodiments, the sound-absorbing plate 3 is made of a hard sound-absorbing material.

[0059] As one mode of the embodiment of the present disclosure, the above sound-absorbing plate 3 may specifically adopt a material that can "absorb" noise (especially high-frequency noise), so that it can absorb the noise and prevent the noise from being reflected and affecting other devices.

[0060] It should be understood that it is also feasible if the sound-absorbing plate 3 is made of a sound-reflecting material that can reflect noise.

[0061] In some embodiments, the sound-absorbing board 3 is a printed circuit board.

[0062] As one mode of the embodiment of the present disclosure, the sound-absorbing board 3 can also be in the form of a printed circuit board (PCB), because the technology of the printed circuit board is mature, the cost is low, and it matches well with the computing equipment, and its main body is usually composed of polymer materials such as glass fiber composite boards, and it itself has a good ability to absorb noise (especially high-frequency noise).

[0063] In some embodiments, the sound insulation board 3 is connected to the backboard 1 via a connector 4 , and a hard disk drive component 32 is disposed on the sound insulation board 3 .

[0064] In some related technologies, some electronic components that provide auxiliary functions for the hard disk operation, namely "hard disk drive components" may be set on the printed circuit board serving as the "backplane"; and these hard disk drive components may emit heat during operation. Excessive heat will affect the hard disk performance and even cause the hard disk to overheat.

[0065] For this reason, when the sound-proof board 3 is in the form of a printed circuit board on which electronic components can be arranged, as one embodiment of the present disclosure, referring to Figure 4 , Figure 5 , plug-in interfaces 41 may be provided on opposite sides of the sound-proof plate 3 and the back plate 1, and refer to Fig.11 , use a connector 4 (such as a flat cable) to connect the two plug-in interfaces 41 respectively, that is, the sound-blocking board 3 and the backplane 1 are connected to each other (power connection and communication connection); then, the "original" hard disk drive component 32 on the backplane 1 can be partially or completely "moved" to the sound-blocking board 3, that is, the backplane 1 and the sound-blocking board 3 of the embodiment of the present disclosure can share the function of the "original backplane", or both of them are "backplanes".

[0066] It can be seen that compared with the back plate 1, the distance between the sound insulation plate 3 and the hard disk 2 is farther, so the devices arranged on the sound insulation plate 3 are also farther away from the hard disk 2 than the devices arranged on the back plate 1. Therefore, the above method is equivalent to setting part of the heat source (hard disk drive device 32) away from the hard disk 2, thereby reducing the ambient temperature near the hard disk 2, avoiding overheating of the hard disk 2, and further improving the performance of the hard disk 2.

[0067] It should be understood that which hard disk drive components 32 are disposed on the sound insulation board 3 can be selected according to needs. For example, hard disk drive components 32 with large heat dissipation such as chips (such as SAS expansion chips) can be preferentially disposed on the sound insulation board 3, that is, the "main" heat source is kept away from the hard disk 2.

[0068] It should be understood that the above connector 4 at least realizes the power connection and communication connection between the sound-proof plate 3 and the back plate 1, and the sound-proof plate 3 and the back plate 1 can also be mechanically connected (physically fixed), and the specific methods are also various. For example, if the connector 4 is a soft device such as a flat cable, the sound-proof plate 3 and the back plate 1 can be fixed by additional screws; and if the connector 4 is a rigid device, it also has the function of fixing the sound-proof plate 3 and the back plate 1 relatively.

[0069] In some embodiments, the hard disk drive component 32 is disposed on a side of the sound insulation plate 3 facing away from the back plate 1 .

[0070] Further, see Figure 6 The hard disk drive component 32 (such as a chip) "moved" to the sound insulation board 3 can be located on the side of the sound insulation board 3 away from the back plate 1. In this way, the hard disk drive component 32 is farther away from the hard disk 2 and closer to the cooling fan 6, which can achieve a better heat dissipation effect.

[0071] It should be understood that the various structures can be arranged on which side of the back plate 1 and the sound-proof plate 3 according to the needs. Figure 3 , in order to connect the hard disk 2, the hard disk interface 12 should be provided on the first side of the backplane 1; and referring to Figure 4 , Figure 5, in order to achieve mutual connection, the plug-in interface 41 should be respectively arranged on the second side of the back plate 1 and the side of the sound-proof plate 3 facing the back plate 1 (i.e., the opposite sides of the back plate 1 and the sound-proof plate 3); and in order to reduce the influence of heat on the hard disk 2, if there is still a hard disk drive device 32 on the back plate 1, it can be arranged on its second side (the side away from the hard disk 2); and referring to Figure 6 To facilitate connection with the mainboard (such as connecting to the mainboard via a flat cable), a RAID interface 33 for leading out hard disk signals is also provided on the side of the sound-proof plate 3 facing away from the back plate 1 .

[0072] It should be understood that the sound-absorbing board 3 in the embodiment of the present disclosure may not be a printed circuit board, but a simple sound-absorbing board or sound-reflecting board without electrical function, which is only combined with the backboard 1 to form a backboard assembly.

[0073] In some embodiments, the back panel assembly of the disclosed embodiment further includes: a soft sound absorbing material 51 sandwiched between the sound-blocking plate 3 and the back panel 1 , and a gas channel 511 connecting the first vent 11 and the second vent 31 is provided in the soft sound absorbing material 51 .

[0074] Reference Figure 2 As one method of the embodiment of the present disclosure, a soft sound absorbing material 51 such as sound absorbing cotton can be "sandwiched" between the sound-absorbing plate 3 and the back plate 1; wherein, referring to Figure 7 , Fig.11 The soft sound-absorbing material 51 as a whole can be a "big plate" with the same size as the back plate 1 (sound-absorbing plate 3), but the position corresponding to the first ventilation port 11 and the second ventilation port 31 is a gas channel 511 so that the gas can flow between the first ventilation port 11 and the second ventilation port 31.

[0075] Generally speaking, the soft sound-absorbing material 51 has a good absorption capacity for low-frequency (such as frequency less than 5kHz) noise. Therefore, by setting the soft sound-absorbing material 51 and the sound-proof plate 3 (including the back plate 1), good absorption of full-band (including low-frequency and high-frequency) noise can be achieved, further improving the noise reduction effect; at the same time, since the soft sound-absorbing material 51 is "sandwiched" between the back plate 1 and the sound-proof plate 3, it is well fixed and is not prone to loosening, falling off, and other problems.

[0076] In some embodiments, a waveguide plate 52 is disposed at the first ventilation opening 11 and / or at the second ventilation opening 31 .

[0077] Reference Fig.11 As one mode of the embodiment of the present disclosure, a waveguide plate 52 in the form of a honeycomb plate or the like is provided at least at the above vents, so that the gas flowing through the vents needs to pass through the waveguide structure in the waveguide plate 52, which can reduce turbulence and reduce noise.

[0078] In some embodiments, the waveguide plate 52 is located between the sound-absorbing plate 3 and the back plate 1 .

[0079] As a method of an embodiment of the present disclosure, in order to save space and make the design regular, the waveguide plate 52 can also be arranged between the sound-absorbing plate 3 and the back plate 1.

[0080] The specific configuration of the waveguide plate 52 is varied, as shown in FIG. Fig.11 , Fig.13 , the waveguide plate 52 and the soft sound absorbing material 51 are different "layers"; or, refer to Fig.12 , the waveguide plate 52 and the soft sound absorbing material 51 are arranged in the “same layer”, or it can be understood that the waveguide plate 52 is arranged in the gas channel 511 of the soft sound absorbing material 51.

[0081] It should be understood that when the soft sound absorbing material 51 , the waveguide plate 52 , and the connector 4 are disposed between the back plate 1 and the sound-blocking plate 3 , the soft sound absorbing material 51 and the waveguide plate 52 should also have holes for the connector 4 to pass through.

[0082] It should be understood that the above description only indicates that there should be a waveguide plate 52 at the vent, but does not mean that the waveguide plate 52 is "only located" at the vent.

[0083] For example, refer to Figure 8 , Fig.11 The waveguide plate 52 may also be a "large plate" having the same size as the back plate 1 (sound-absorbing plate 3); or, Fig.12 , the waveguide plate 52 is a "small block" located only at the ventilation opening.

[0084] It should be understood that the waveguide plate 52 is not limited to being disposed between the back plate 1 and the sound-absorbing plate 3. For example, the waveguide plate 52 may also be disposed on the side of the back plate 1 and the sound-absorbing plate 3 that are away from each other; or, the waveguide plate 52 may also be "filled" at the first vent 11 and in the second vent 31.

[0085] It should be understood that in the back panel assembly of the embodiment of the present disclosure, the specific connection methods of the back panel 1, the sound-absorbing plate 3, the soft sound-absorbing material 51, the waveguide plate 52 and other structures are various.

[0086] For example, see Figure 7 , a soft sound absorbing material 51 in the form of a "large plate" of the same size as the back plate 1 (sound-absorbing plate 3) is used, and a gas channel 511 is prefabricated thereon, and then compared with the reference Figure 8 The waveguide plates 52 in the form of a "large plate" pressed together are called a composite structure, and then the composite structure is clamped between the sound-absorbing plate 3 and the back plate 1, and wrapped at the outer edge with tape, metal mesh, etc. to better prevent the soft sound-absorbing material 51 from aging and falling off.

[0087] For another example, the soft sound absorbing material 51, the waveguide plate 52, etc. may be prefabricated on one side of the back plate 1 (or the sound-proof plate 3), and then the sound-proof plate 3 (or the back plate 1) may be connected thereto by means of the connector 4, screws, etc.

[0088] For another example, the back plate 1, the sound-blocking plate 3, the soft sound-absorbing material 51, the waveguide plate 52, etc. may be directly integrally formed into a "sandwich plate".

[0089] In some embodiments, the second vents 31 correspond one-to-one with the first vents 11; along a direction perpendicular to the back panel 1, the corresponding first vents 11 are aligned with the second vents 31; or, along a direction perpendicular to the back panel 1, the corresponding first vents 11 are staggered with the second vents 31.

[0090] As one embodiment of the present disclosure, refer to Figure 3 , Figure 5 The first ventilation openings 11 on the back plate 1 and the second ventilation openings 31 on the sound-proof plate 3 may correspond one to one, that is, the gas mainly flows between the corresponding first ventilation openings 11 and second ventilation openings 31 .

[0091] In this case, as one embodiment of the present disclosure, refer to Fig.11 , Fig.12 The corresponding first vents 11 and second vents 31 can be completely "aligned", so that the gas can flow "directly" between the corresponding first vents 11 and second vents 31, with small flow resistance, fast flow rate and good heat dissipation effect.

[0092] Alternatively, as another embodiment of the present disclosure, reference may also be made to Fig.13 The corresponding first vents 11 and second vents 31 are "offset" by a certain position, so the gas flowing between the corresponding first vents 11 and second vents 31 needs to "turn", so that the transmission path of the noise is longer and more effective noise absorption can be achieved.

[0093] In some embodiments, the back panel assembly also includes at least one additional sound-blocking plate 7 having a third vent 71, the additional sound-blocking plate 7 is made of a hard material that can prevent sound waves from passing through, and is located on the side of the sound-blocking plate 3 facing away from the back panel 1; the number of the additional sound-blocking plate 7 is one, and they are spaced apart on the side of the sound-blocking plate 3 facing away from the back panel 1; or, the number of the additional sound-blocking plates 7 is multiple, and they are spaced apart in sequence on the side of the sound-blocking plate 3 facing away from the back panel 1; the cooling fan 6 is located on the side of the additional sound-blocking plate 7 that is farthest from the back panel 1 and faces away from the back panel 1.

[0094] Reference Figure 2As one embodiment of the present disclosure, the back panel assembly may further be provided with one or more "additional sound-blocking panels 7 (at this time, the cooling fan 6 in the computing device should also be located on the side of all the additional sound-blocking panels 7 away from the hard disk)" on the side of the sound-blocking panel 3 away from the back panel 1, so as to better block noise; wherein, the additional sound-blocking panels 7 are also made of a hard material that can prevent sound waves from passing through, and refer to Fig. 9 A vent (third vent 71) is also provided to enable gas flow.

[0095] It should be understood that the additional sound-proofing plate 7 may also conform to the various characteristics of the above sound-proofing plate 3. For example, the additional sound-proofing plate 7 may also be in the form of a printed circuit board (PCB), and a hard disk drive device 32 may also be provided thereon and connected to the sound-proofing plate 3 or the back plate 1; for another example, a soft sound-absorbing material 51 may also be provided between the additional sound-proofing plate 7 and the sound-proofing plate 3 (or between two adjacent additional sound-proofing plates 7); for another example, a waveguide plate 52 may also be provided at the third vent 71; for another example, the third vent 71 may also correspond to the second vent 31 one by one, etc., which will not be described in detail here.

[0096] Second, refer to Figures 1 to 13 , an embodiment of the present disclosure provides a computing device.

[0097] The computing device of the embodiment of the present disclosure is a device with data processing capability, such as a server.

[0098] However, it should be understood that the specific form of the computing device in the embodiments of the present disclosure is not limited thereto, and it may also be other forms such as a personal computer (PC).

[0099] Reference Figure 1 , the computing device of the embodiment of the present disclosure includes:

[0100] A back plate 1 having a first vent 11, wherein the back plate 1 is a printed circuit board having a first side and a second side opposite to each other, and a hard disk interface 12 is provided on the first side;

[0101] A hard disk 2 connected to the hard disk interface 12;

[0102] A sound-blocking plate 3 having a second vent 31, the sound-blocking plate 3 being made of a hard material capable of preventing sound waves from passing through, and the sound-blocking plate 3 being arranged at intervals on the second side of the back plate 1;

[0103] The cooling fan 6 is located on a side of the sound-absorbing plate 3 that is away from the back plate 1 .

[0104] Reference Figure 1 The computing device of the embodiment of the present disclosure has a hard disk 2 connected to a backplane 1.

[0105] That is, a back plate 1 and a sound-proof plate 3 meeting the above requirements can be provided in the computing device, so as to better eliminate the influence of the noise of the cooling fan 6 on the hard disk 2, improve the performance of the hard disk 2, and ensure that other problems such as slag will not be caused.

[0106] It should be understood that the above back panel 1 and the sound-absorbing panel 3 can be first formed into a "back panel assembly" and then arranged in the computing device, that is, the computing device can include any back panel assembly of the embodiments of the present disclosure.

[0107] Alternatively, the separate back plate 1 and the sound-proof plate 3 may be directly disposed in the computing device, that is, the back plate 1 and the sound-proof plate 3 in the computing device may not constitute a "back plate assembly".

[0108] It should be understood that in the computing device of the embodiment of the present disclosure, regardless of whether the back plate 1 and the sound-blocking plate 3 constitute the form of a back plate assembly, they can conform to the characteristics of the corresponding structure in the back plate assembly of the embodiment of the present disclosure. For example, the sound-blocking plate 3 can also be in the form of a printed circuit board (PCB), and a hard disk drive device 32 can also be provided thereon and connected to the back plate 1; for another example, a soft sound-absorbing material 51 can also be provided between the sound-blocking plate 3 and the back plate 1; for another example, a waveguide plate 52 can also be provided at the vent; for another example, the first vent 11 and the second vent 31 can also correspond one to one; for another example, the computing device can also include an additional sound-blocking plate 7, etc., which will not be described in detail here.

[0109] It should be understood that reference Figure 2 In addition to the above structures, the computing device of the embodiment of the present disclosure may also have other devices, such as a motherboard, a central processing unit 91, an adapter card (such as a Riser card) 92, a power supply (PSU) 93, a housing 94, other fans, etc., which will not be described in detail here. The present disclosure has disclosed example embodiments, and although specific terms are used, they are only used and should only be interpreted as general illustrative meanings, and are not used for limiting purposes. In some instances, it is obvious to those skilled in the art that, unless otherwise expressly stated, the features, characteristics and / or elements described in conjunction with a particular embodiment may be used alone, or may be used in combination with the features, characteristics and / or elements described in conjunction with other embodiments. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A backplane assembly, wherein: include: A back plate with a first vent, wherein the back plate is a printed circuit board with a first side and a second side opposite to each other, and a hard disk interface is disposed on the first side; A sound-blocking plate with a second vent is formed of a hard material capable of preventing sound waves from passing through, and the sound-blocking plate is arranged at intervals on the second side of the back plate.

2. The back plate assembly according to claim 1, wherein: The sound-absorbing plate is made of hard sound-absorbing material.

3. The back plate assembly according to claim 1, wherein: The sound-proof board is a printed circuit board.

4. The back plate assembly according to claim 3, wherein: The sound-proof plate is connected to the back plate via a connector, and a hard disk drive component is arranged on the sound-proof plate.

5. The back plate assembly according to claim 4, wherein: The hard disk drive component is arranged on a side of the sound-absorbing plate away from the back plate.

6. The back plate assembly according to claim 1, wherein: Also includes: A soft sound absorbing material is sandwiched between the sound-absorbing plate and the back plate, wherein a gas passage connecting the first vent and the second vent is provided in the soft sound absorbing material.

7. The back plate assembly according to claim 1, wherein: A waveguide plate is provided at the first vent and / or at the second vent.

8. The back plate assembly according to claim 7, wherein: The waveguide plate is located between the sound-absorbing plate and the back plate.

9. The back plate assembly according to claim 1, wherein: The second vents correspond one-to-one to the first vents; Along a direction perpendicular to the back plate, the corresponding first vents are aligned with the second vents; or, Along a direction perpendicular to the back plate, the corresponding first vents and the second vents are arranged alternately.

10. The back plate assembly according to claim 1, wherein: It also includes at least one additional sound-blocking plate having a third vent, wherein the additional sound-blocking plate is made of a hard material capable of preventing sound waves from passing through, and is located on a side of the sound-blocking plate away from the back plate; The number of the additional sound-absorbing plate is one, and the additional sound-absorbing plate is arranged at intervals on a side of the sound-absorbing plate away from the back plate; or, The number of the additional sound-absorbing panels is plural, and the additional sound-absorbing panels are sequentially and spaced apart on a side of the sound-absorbing panel away from the back panel.

11. A computing device, wherein: include: A backplane with a first vent, wherein the backplane is a printed circuit board with a first side and a second side opposite to each other, wherein a hard disk interface is disposed on the first side; A hard disk connected to the hard disk interface; A sound-blocking plate having a second vent, the sound-blocking plate being made of a hard material capable of preventing sound waves from passing through, and the sound-blocking plate being arranged at intervals on the second side of the back plate; A heat dissipation fan is located on a side of the sound-absorbing plate away from the back plate.

Images