A Micro OLED screen cleaning device and method

Abstract

The present invention relates to the field of Micro OLED screen cleaning technology, specifically a Micro OLED screen cleaning device, including a frame and a manipulator and a cleaning unit arranged on the frame, the manipulator is used to carry the chip to be cleaned to the cleaning unit, the cleaning unit includes a cleaning tank, a cleaning table arranged in the cleaning tank, a fixing device for fixing the chip is arranged on the cleaning table, the fixing device includes a fixing sheet made of rubber, the edge of the fixing sheet is fixed on the cleaning table, a fixing blind hole matching the chip size is opened in the middle position of the fixing sheet away from the cleaning table, an iron piece is arranged at the position corresponding to the fixing blind hole on the other side of the fixing sheet, and an electromagnet is installed on the end effector of the manipulator. The present invention allows the manipulator to use magnetic force to assist in quickly and accurately positioning and fixing the chip in the fixed blind hole on the cleaning table, while ensuring that the gaps around the chip are effectively closed to prevent the intrusion of impurities during the cleaning process, and effectively improve the quality of chip cleaning.

Description

Technical Field

[0001] The present invention relates to the technical field of Micro OLED screen cleaning, and in particular to a Micro OLED screen cleaning device and method. Background Art

[0002] With the development of micro-display technology, micro organic light-emitting diodes (Micro OLED) have been widely used in smart phones, wearable devices, AR / VR and other fields. Micro OLED has the advantages of small size, low power consumption, rich colors and fast response speed. In the production process of Micro OLED, the surface quality of the chip is very important because it directly affects the display effect and life. Therefore, cleaning the Micro OLED screen to ensure the cleanliness of the chip has become a key link in the production of micro-displays.

[0003] At present, the main cleaning technologies for Micro OLED screens include roller conveyor spray cleaning and tank cleaning. Roller conveyor cleaning: Fix a single chip on a conveyor belt, use a roller to clean the chip in a solution, and then proceed to the next process after drying. Tank cleaning is to immerse the chip in a cleaning solution, clean it by the fluidity of the solution, and then proceed to the subsequent process after drying. Regardless of which of the above cleaning methods is used, it is impossible to effectively control the flow direction of some impurity particles in the immersion solvent. Impurities may invade the slits between the silicon wafer and the glass, resulting in low product cleaning quality. For this reason, we provide a Micro OLED screen cleaning device and method. Summary of the invention

[0004] The object of the present invention is to provide a Micro OLED screen cleaning device and method to solve the problems raised in the above background technology.

[0005] The present invention is achieved through the following technical solutions:

[0006] According to one aspect of the present invention, there is provided a Micro OLED screen cleaning device, comprising a frame and a manipulator and a cleaning unit arranged on the frame, the manipulator is used to transport a chip to be cleaned to the cleaning unit, the cleaning unit comprises a cleaning tank and a cleaning table arranged in the cleaning tank, a fixing device for fixing the chip is arranged on the cleaning table, the fixing device comprises a fixing sheet made of rubber, an edge of the fixing sheet is fixed to the cleaning table, a fixing blind hole adapted to the size of the chip is opened in the middle position of one side of the fixing sheet away from the cleaning table, an iron piece is arranged at a position corresponding to the fixing blind hole on the other side of the fixing sheet, and an electromagnet is installed on the end effector of the manipulator.

[0007] Optionally, a cleaning swing arm and a drying swing arm are rotatably provided in the cleaning tank, a two-fluid nozzle is installed at the end of the cleaning swing arm, and a nitrogen nozzle is installed at the end of the drying swing arm.

[0008] Optionally, a mounting hole is formed through the cleaning table, and the edges of the fixing plate are fixed in the mounting hole by a fixing frame and a plurality of screws.

[0009] Optionally, the Micro OLED screen cleaning device also includes a conveying mechanism, a transport mechanism and a loading platform, the conveying mechanism includes a first conveyor, a second conveyor, a third conveyor and a fourth conveyor, the transport mechanism includes a first transport mechanism, a second transport mechanism and a third transport mechanism, the loading platform includes a first platform arranged within the working range of the second transport mechanism and a second platform arranged within the working range of the third transport mechanism, the front ends of the first platform and the second platform are both arranged within the working range of the manipulator, the tail end of the first platform and the tail end of the second platform and each conveyor in the conveying mechanism are placed within the working range of the first transport mechanism.

[0010] Optionally, the first transport mechanism includes a first linear module arranged along the X-axis, a second linear module arranged along the Y-axis, a third linear module arranged along the Z-axis, and a clamping mechanism, wherein the X-axis, Y-axis, and Z-axis are perpendicular to each other, the guide rail of the first linear module is fixedly connected to the frame, the guide rail of the second linear module is fixedly connected to the slider of the first linear module, the guide rail of the third linear module is fixedly connected to the slider of the second linear module, and the clamping mechanism is installed on the slider of the third linear module and is constructed to be able to grasp the tray for loading chips in a clamping manner.

[0011] Optionally, the clamping mechanism includes a rotating platform, a clamping cylinder and a clamping claw. The rotating platform is fixedly mounted on the slider of the third linear module. The cylinder body of the clamping cylinder is fixed to the output end of the rotating platform. The clamping cylinder has two opposite output ends, and the clamping claw is fixedly arranged on the two output ends.

[0012] Optionally, the first conveying mechanism and the second conveying mechanism have the same structure, the first conveying mechanism includes a fourth linear module arranged along the Y-axis, a fifth linear module arranged along the X-axis, and an adsorption device, the guide rail of the fourth linear module is fixed to the carrier, the guide rail of the fifth linear module is fixedly connected to the slider of the fourth linear module, the adsorption device is installed on the slider of the fifth linear module and is constructed to be able to grab the chip from the tray by adsorption.

[0013] Optionally, the adsorption device includes a first mounting frame and a first suction cup and a first alignment camera fixed on the first mounting frame, the first mounting frame is fixedly connected to the slider of the fifth linear module, and the first suction cup is mounted on the first mounting frame via a cylinder that can be extended along the Z-axis direction.

[0014] Optionally, a second mounting bracket is fixedly mounted on the end effector of the manipulator, a second alignment camera and two second suction cups are fixedly mounted on the second mounting bracket, the two second suction cups are arranged on both sides of the second alignment camera, and a magnet is respectively mounted on the back of the two second suction cups.

[0015] According to another aspect of the present invention, a cleaning method based on the above-mentioned Micro OLED screen cleaning device is provided.

[0016] Step S1: transporting uncleaned chip trays from a chip cutting process to a working area of ​​a first transport mechanism via a first conveyor.

[0017] Step S2: Using the first transport mechanism to move the tray from the first conveyor to the rear end of the first platform.

[0018] Step S3: Utilize the second transport mechanism to move the chip from the tray to the front end of the first carrier.

[0019] Step S4: The empty pallet is sent from the first transport mechanism to the third conveyor for transportation.

[0020] Step S5: The chip is picked up from the front end of the first carrier by a robot arm and placed in a cleaning tank for cleaning and drying.

[0021] Step S6: The cleaned and dried chip is moved to the front end of the second carrier by the robot.

[0022] Step S7: using the first transport mechanism to move the clean tray on the fourth conveyor to the rear end of the second platform.

[0023] Step S8: Using the third transport mechanism to move the cleaned and dried chips from the front end of the second carrier to the clean tray at the rear end.

[0024] Step S9: The tray containing the cleaned and dried chips is transported to the second conveyor by the first transport mechanism, and then transported to the downstream cleaning and testing process.

[0025] Compared with the prior art, the present invention provides a Micro OLED screen cleaning device and method, which has the following beneficial effects:

[0026] 1. The present invention provides a fixing sheet made of rubber and a corresponding iron piece and magnet structure in the Micro OLED screen cleaning device. This configuration allows the manipulator to use magnetic force to quickly and accurately position and fix the chip in the fixed blind hole on the cleaning table, while ensuring that the gaps around the chip are effectively closed to prevent the intrusion of impurities during the cleaning process, thereby effectively improving the quality of chip cleaning;

[0027] 2. The present invention provides a rotatable cleaning swing arm and a drying swing arm, which allows the two-fluid nozzle and the nitrogen nozzle to sequentially clean and dry the chip. At the same time, the rotation of the cleaning swing arm and the drying swing arm is arranged in the cleaning tank, which can provide sufficient operating space for the manipulator after the cleaning and drying are completed, facilitates the placement of the chip, and improves the overall operation convenience and production efficiency;

[0028] 3. The present invention realizes the function of fast installation and replacement of the fixing plate by setting a through installation hole on the cleaning table and using a fixing frame and screws to detachably fix the fixing plate on the cleaning table. At the same time, the through installation hole avoids the generation of negative pressure between the fixing plate and the surface of the cleaning table, ensuring that the middle part of the fixing plate can be normally arched upward to receive the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the structure of the cleaning unit of the present invention;

[0031] Figure 3 A schematic diagram showing the disassembly structure of the fixing plate of the present invention;

[0032] Figure 4 It is a structural schematic diagram of the fixing plate and the iron piece of the present invention;

[0033] Figure 5 It is a cross-sectional structural schematic diagram of a chip fixed state of the present invention;

[0034] Figure 6 It is a schematic diagram of the top view structure of the present invention;

[0035] Figure 7 For the present invention Figure 1 A schematic diagram of the enlarged structure at point A;

[0036] Figure 8 For the present invention Figure 1 A schematic diagram of the enlarged structure at B;

[0037] Fig. 9 It is a schematic structural diagram of the first carrier and the second transport mechanism of the present invention.

[0038] In the figure: 1, frame; 2, manipulator; 3, cleaning tank; 4, cleaning table; 5, fixing plate; 6, fixing frame; 7, screw; 8, fixing blind hole; 9, iron piece; 10, magnet; 11, rotating motor; 12, chip; 13, mounting hole; 14, cleaning swing arm; 15, two-fluid nozzle; 16, drying swing arm; 17, nitrogen nozzle; 18, first rotating cylinder; 19, second rotating cylinder; 20, first conveyor; 21, second conveyor; 22, third conveyor conveyor; 23, fourth conveyor; 24, first carrier; 25, second carrier; 26, first linear module; 27, second linear module; 28, third linear module; 29, fourth linear module; 30, fifth linear module; 31, rotating platform; 32, clamping cylinder; 33, clamping claw; 34, first mounting bracket; 35, second mounting bracket; 36, first suction cup; 37, second suction cup; 38, first alignment camera; 39, second alignment camera; 40, tray. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] Example: See Figures 1 to 9 According to one aspect of an embodiment of the present invention, a Micro OLED screen cleaning device is provided, comprising a frame 1, a manipulator 2 and a cleaning unit arranged on the frame 1, a plurality of cleaning units are provided, and the plurality of cleaning units are arranged within the working range of the manipulator 2, the manipulator 2 is used to carry a chip 12 to be cleaned to the cleaning unit, the cleaning unit comprises a cleaning tank 3, a cleaning table 4 arranged in the cleaning tank 3, a fixing device for fixing the chip 12 is arranged on the cleaning table 4, the fixing device comprises a fixing sheet 5 made of rubber, the edge of the fixing sheet 5 is fixed on the cleaning table 4, a fixing blind hole 8 adapted to the size of the chip 12 is opened in the middle position of one side of the fixing sheet 5 away from the cleaning table 4, an iron piece 9 is arranged at a position corresponding to the fixing blind hole 8 on the other side of the fixing sheet 5, and a magnet 10 is installed on the end effector of the manipulator 2.

[0041] In the above scheme, the chip 12 to be cleaned is placed within the working range of the manipulator 2. The manipulator 2 first moves the chip 12 to be cleaned to the top of the fixed blind hole 8 of the cleaning table 4. The magnet 10 attracts the iron piece 9 to move upward, driving the middle part of the fixed plate 5 to bulge upward, so that the opening of the fixed blind hole 8 is expanded. The expansion of the opening of the fixed blind hole 8 makes it easier for the manipulator 2 to place the chip 12 therein. After the manipulator 2 leaves, the fixed plate 5 returns to its original position due to elastic force, and the opening of the fixed blind hole 8 is reduced, tightly clamping the chip 12 around. This clamping method can not only fix the chip 12 on the cleaning table 4, but also close the gap around the chip 12 to prevent impurities from invading, thereby improving the cleaning effect and cleaning quality.

[0042] In order to ensure smooth expansion of the opening of the fixing blind hole 8 , in this exemplary embodiment, the size of the iron piece 9 is set to be consistent with the size of the fixing plate 5 , and the vertical projections of the iron piece 9 and the fixing plate 5 coincide with each other.

[0043] In this exemplary embodiment, a cleaning swing arm 14 and a drying swing arm 16 are rotatably provided in the cleaning tank 3. Preferably, the cleaning swing arm 14 and the drying swing arm 16 are driven to rotate by the first rotary cylinder 18 and the second rotary cylinder 19, respectively. A two-fluid nozzle 15 is installed at the end of the cleaning swing arm 14, and a nitrogen nozzle 17 is installed at the end of the drying swing arm 16. In specific implementation, the first rotary cylinder 18 drives the swing of the cleaning swing arm 14 to move the two-fluid nozzle 15 to the top of the cleaning table 4, and the two-fluid nozzle 15 is used to spray the liquid medicine or ultrapure water mixed with nitrogen onto the surface of the chip 12 to achieve the purpose of cleaning the surface of the chip 12. After cleaning is completed, the second rotary cylinder 19 drives the swing of the drying swing arm 16 to move the nitrogen nozzle 17 to the top of the cleaning table 4, and the nitrogen nozzle 17 is used to spray nitrogen onto the surface of the cleaned chip 12 to achieve the purpose of drying. Moreover, since the cleaning swing arm 14 and the drying swing arm 16 are both rotatably arranged in the cleaning tank 3, after cleaning and drying are completed, an operating space for the robot 2 to grab the chip 12 can be reserved above the cleaning table 4, providing convenience for taking and placing the chip 12.

[0044] In order to improve the cleaning efficiency and drying effect, in this exemplary embodiment, a rotating motor 11 is installed at the bottom of the cleaning tank 3, and the output end of the rotating motor 11 extends into the cleaning tank 3 and is fixedly connected to the bottom of the cleaning table 4. A plurality of fixing plates 5 are provided on the cleaning table 4, and the plurality of fixing plates 5 are arranged around the rotation axis of the cleaning table 4. During cleaning, the rotating motor 11 drives the cleaning table 4 to rotate, and the two-fluid spray head 15 moves to the rotation track of the fixing plate 5, thereby spraying and cleaning the chips 12 fixed by the plurality of fixing plates 5. After cleaning is completed, the nitrogen spray head 17 is moved to the rotation track of the fixing plate 5, and the chips 12 are quickly dried by centrifugal force and nitrogen.

[0045] In this exemplary embodiment, a mounting hole 13 is provided through the washing table 4, and the edges of the fixing plate 5 are fixed in the mounting hole 13 by a fixing frame 6 and a plurality of screws 7. The edges of the fixing plate 5 can be detachably fixed to the washing table 4 by the cooperation of the fixing frame 6 and the screws 7, which facilitates the subsequent removal and replacement of the fixing plate 5. By providing the through mounting hole 13 for mounting the fixing plate 5 on the washing table 4, it is possible to prevent the generation of negative pressure between the fixing plate 5 and the upper surface of the washing table 4, so as not to affect the upward arching action of the middle part of the fixing plate 5, thereby ensuring the normal use of the fixing plate 5.

[0046] In this exemplary embodiment, the Micro OLED screen cleaning device further includes a conveying mechanism, a transport mechanism and a carrier, the conveying mechanism includes a first conveyor 20, a second conveyor 21, a third conveyor 22 and a fourth conveyor 23, the transport mechanism includes a first transport mechanism, a second transport mechanism and a third transport mechanism, the carrier includes a first carrier 24 provided within the working range of the second transport mechanism and a second carrier 25 provided within the working range of the third transport mechanism, the front ends of the first carrier 24 and the second carrier 25 are both provided within the working range of the manipulator 2, the tail end of the first carrier 24 and the tail end of the second carrier 25 and each conveyor in the conveying mechanism are placed within the working range of the first transport mechanism. Specifically, the first conveyor 20, the second conveyor 21, the third conveyor 22 and the fourth conveyor 23 are all belt conveyors, and in specific implementation, the first conveyor 20 transports the tray 40 carrying the uncleaned chip 12 generated by the upstream process (chip 12 cutting process) to the working area of ​​the first transport mechanism. Subsequently, the first transport mechanism moves the tray 40 from the first conveyor 20 to the tail end of the first carrier 24. The second transport mechanism then moves the chip 12 from the tray 40 to the front end of the first carrier 24. The empty tray 40 is then transported to the third conveyor 22 by the first transport mechanism. At the same time, the robot 2 grabs the chip 12 from the front end of the first carrier 24 and puts it into the cleaning tank 3 for cleaning and drying. The processed chip 12 is moved to the front end of the second carrier 25 by the same robot 2. In addition, the first transport mechanism moves the clean tray 40 on the fourth conveyor 23 to the tail end of the second carrier 25. The third transport mechanism then moves the cleaned and dried chip 12 from the front end of the second carrier 25 to the clean tray 40 at the tail end. Finally, the tray 40 containing the cleaned and dried chips 12 is transported to the second conveyor 21 by the first transport mechanism, and then transported to the downstream process (cleaning and testing process). This process ensures the continuity and efficiency of the process from cutting to testing of the chip 12, while reducing manual intervention during the operation and improving the intelligence level of the cleaning device.

[0047] In this exemplary embodiment, the first transport mechanism includes a first linear module 26 arranged along the X axis, a second linear module 27 arranged along the Y axis, a third linear module 28 arranged along the Z axis, and a clamping mechanism. The X axis, the Y axis, and the Z axis are perpendicular to each other. The guide rail of the first linear module 26 is fixedly connected to the frame 1, the guide rail of the second linear module 27 is fixedly connected to the slider of the first linear module 26, the guide rail of the third linear module 28 is fixedly connected to the slider of the second linear module 27, and the clamping mechanism is installed on the slider of the third linear module 28 and is configured to be able to clamp and grasp the tray 40 for loading the chip 12. In this way, the first transport mechanism can move arbitrarily in the three-dimensional space constructed by the X axis, the Y axis, and the Z axis, so as to realize the transport of the tray 40 between the first conveyor 20 and the tail end of the first platform 24, between the third conveyor 22 and the tail end of the first platform 24, between the third conveyor 22 and the tail end of the second platform 25, and between the second conveyor 21 and the tail end of the second platform 25. Of course, as long as the pallet 40 can be transported between the conveyor and the carrier platform, there is no particular limitation on the specific structural form of the first transport mechanism.

[0048] Preferably, the clamping mechanism includes a rotating platform 31, a clamping cylinder 32 and a clamping claw 33. The rotating platform 31 is fixedly mounted on the slider of the third linear module 28. The cylinder body of the clamping cylinder 32 is fixed to the output end of the rotating platform 31. The clamping cylinder 32 has two opposite output ends, and the clamping claw 33 is fixedly arranged on the two output ends. The rotating platform 31 is used to drive the clamping cylinder 32 and the clamping claw 33 to rotate in the horizontal direction to adjust the position of the clamping claw 33. The clamping cylinder 32 is used to drive the two clamping claws 33 to move closer or farther to achieve the clamping of the tray 40.

[0049] In this exemplary embodiment, the first transport mechanism and the second transport mechanism have the same structure. The first transport mechanism includes a fourth linear module 29 arranged along the Y axis, a fifth linear module 30 arranged along the X axis, and an adsorption device. The guide rail of the fourth linear module 29 is fixed to the carrier, the guide rail of the fifth linear module 30 is fixedly connected to the slider of the fourth linear module 29, and the adsorption device is installed on the slider of the fifth linear module 30 and is configured to be able to grab the chip 12 from the tray 40 by adsorption. In this way, the second transport mechanism can transport the unwashed chip 12 between the front end and the rear end of the first carrier 24, and the third transport mechanism can transport the cleaned and dried chip 12 between the front end and the rear end of the second carrier 25. Of course, as long as it can realize the transport of the chip 12 in the tray 40 at the rear end of the first carrier 24 to the front end of the first carrier 24 and the transport of the chip 12 at the front end of the second carrier 25 to the tray 40 at the rear end of the second carrier 25, there is no particular limitation on the specific structural form of the second transport mechanism and the third transport mechanism.

[0050] Preferably, the adsorption device includes a first mounting frame 34, a first suction cup 36 fixed on the first mounting frame 34, and a first alignment camera 38. The first mounting frame 34 is fixedly connected to the slider of the fifth linear module 30, and the first suction cup 36 is mounted on the first mounting frame 34 through a cylinder that can be retracted along the Z-axis direction. The function of the first alignment camera 38 is to determine the position of the tray 40 and instruct the fourth linear module 29, the fifth linear module 30, and the cylinder used to drive the first suction cup 36 to move along the Z-axis direction to improve the grasping accuracy, thereby completing the grasping of the chip 12.

[0051] Preferably, a second mounting frame 35 is fixedly mounted on the end effector of the manipulator 2, and a second alignment camera 39 and two second suction cups 37 are fixedly mounted on the second mounting frame 35. The two second suction cups 37 are arranged on both sides of the second alignment camera 39, and a magnet 10 is installed on the back of each of the two second suction cups 37. The first alignment camera 38 is used to determine the position of the chip 12 and instruct the manipulator 2 to move to improve the grasping accuracy. The two second suction cups 37 are used to absorb and grasp the chip 12 before cleaning and the chip 12 after cleaning, respectively, to prevent the chip 12 after cleaning from being contaminated.

[0052] According to another aspect of an embodiment of the present invention, a cleaning method based on the above-mentioned Micro OLED screen cleaning device is provided.

[0053] Step S1: The first conveyor 20 transports the tray 40 of uncleaned chips 12 from the chip 12 cutting process to the working area of ​​the first transport mechanism.

[0054] Step S2 : using the first transport mechanism to move the tray 40 from the first conveyor 20 to the rear end of the first platform 24 .

[0055] Step S3 : Using the second transport mechanism to move the chip 12 from the tray 40 to the front end of the first stage 24 .

[0056] Step S4: The empty pallet 40 is sent by the first transport mechanism to the third conveyor 22 for transportation.

[0057] Step S5: The robot arm 2 picks up the chip 12 from the front end of the first carrier 24 and puts it into the cleaning tank 3 for cleaning and drying.

[0058] Step S6: The cleaned and dried chip 12 is moved to the front end of the second stage 25 by the robot arm 2 .

[0059] Step S7 : using the first transport mechanism to move the clean tray 40 on the fourth conveyor 23 to the rear end of the second platform 25 .

[0060] Step S8: Using the third transport mechanism, the cleaned and dried chips 12 are moved from the front end of the second carrier 25 to the clean tray 40 at the rear end.

[0061] Step S9: The tray 40 containing the cleaned and dried chips 12 is transported to the second conveyor 21 by the first transport mechanism, and then transported to the downstream cleaning and testing process.

[0062] Working principle: The first conveyor 20 conveys the tray 40 containing uncleaned chips 12 generated by the upstream process (chip 12 cutting process) to the working area of ​​the first conveying mechanism, and then the first conveying mechanism moves the tray 40 from the first conveyor 20 to the tail end of the first carrier 24, and then the second conveying mechanism moves the chip 12 from the tray 40 to the front end of the first carrier 24. The empty tray 40 is sent to the third conveyor 22 by the first conveying mechanism for removal. At the same time, the robot 2 grabs the chip 12 from the front end of the first carrier 24 and puts it into the cleaning tank 3 for cleaning and drying. During the cleaning and drying process, the robot 2 transports the chip 12 to be cleaned to the top of the fixed blind hole 8 of the carrier, and the magnet 10 attracts the iron piece 9 to move upward, driving the middle part of the fixing plate 5 to bulge upward, so that The opening of the fixed blind hole 8 is enlarged to facilitate the robot 2 to place the chip 12 therein. After the robot 2 leaves, the fixed plate 5 returns to its original position due to elastic force, and the opening of the fixed blind hole 8 is reduced, tightly clamping the chip 12 around and closing the gap to prevent impurities from invading, thereby improving the cleaning effect and quality. The processed chip 12 is moved to the front end of the second carrier 25 by the same robot 2. At the same time, the first conveying mechanism moves the clean tray 40 on the fourth conveyor 23 to the rear end of the second carrier 25, and then the third conveying mechanism moves the cleaned and dried chip 12 from the front end of the second carrier 25 to the clean tray 40 at the rear end. Finally, the tray 40 with the cleaned and dried chips 12 is sent to the second conveyor 21 by the first conveying mechanism, and then transported to the downstream process (cleaning and inspection process).

[0063] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A Micro OLED screen cleaning device, characterized in that: The invention comprises a frame (1), a manipulator (2) and a cleaning unit arranged on the frame (1), the manipulator (2) being used to carry a chip (12) to be cleaned to the cleaning unit, the cleaning unit comprising a cleaning tank (3) and a cleaning table (4) arranged in the cleaning tank (3), a fixing device for fixing the chip (12) being arranged on the cleaning table (4), the fixing device comprising a fixing sheet (5) made of rubber, the edge of the fixing sheet (5) being fixed on the cleaning table (4), a mounting hole (13) being provided through the cleaning table (4), the fixing sheet (5) being fixed in the mounting hole (13), a fixing blind hole (8) matching the size of the chip (12) being provided in the middle position of a side of the fixing sheet (5) facing away from the cleaning table (4), an iron piece (9) being provided on the other side of the fixing sheet (5) at a position corresponding to the fixing blind hole (8), and an electromagnet (10) being installed on the end effector of the manipulator (2).

2. The Micro OLED screen cleaning device according to claim 1, characterized in that: A cleaning swing arm (14) and a drying swing arm (16) are rotatably arranged in the cleaning tank (3); a two-fluid nozzle (15) is installed at the end of the cleaning swing arm (14), and a nitrogen nozzle (17) is installed at the end of the drying swing arm (16).

3. The Micro OLED screen cleaning device according to claim 1, characterized in that: The edges of the fixing plate (5) are fixed in the mounting hole (13) via a fixing frame (6) and a plurality of screws (7).

4. The Micro OLED screen cleaning device according to claim 1, characterized in that: It also includes a conveying mechanism, a handling mechanism and a loading platform, wherein the conveying mechanism includes a first conveyor (20), a second conveyor (21), a third conveyor (22) and a fourth conveyor (23), the handling mechanism includes a first handling mechanism, a second handling mechanism and a third handling mechanism, and the loading platform includes a first loading platform (24) arranged within the working range of the second handling mechanism and a second loading platform (25) arranged within the working range of the third handling mechanism, the front ends of the first loading platform (24) and the second loading platform (25) are both arranged within the working range of the robot (2), and the rear end of the first loading platform (24) and the rear end of the second loading platform (25) as well as each conveyor in the conveying mechanism are placed within the working range of the first handling mechanism.

5. The Micro OLED screen cleaning device according to claim 4, characterized in that: The first transport mechanism comprises a first linear module (26) arranged along the X-axis, a second linear module (27) arranged along the Y-axis, a third linear module (28) arranged along the Z-axis, and a clamping mechanism, wherein the X-axis, the Y-axis, and the Z-axis are perpendicular to each other, the guide rail of the first linear module (26) is fixedly connected to the frame (1), the guide rail of the second linear module (27) is fixedly connected to the slider of the first linear module (26), the guide rail of the third linear module (28) is fixedly connected to the slider of the second linear module (27), and the clamping mechanism is installed on the slider of the third linear module (28) and is constructed to be able to grasp the tray (40) for mounting the chip (12) in a clamping manner.

6. The Micro OLED screen cleaning device according to claim 5, characterized in that: The clamping mechanism comprises a rotating platform (31), a clamping cylinder (32) and a clamping claw (33); the rotating platform (31) is fixedly mounted on a slider of the third linear module (28); a cylinder body of the clamping cylinder (32) is fixed to an output end of the rotating platform (31); the clamping cylinder (32) has two opposite output ends, and the clamping claw (33) is fixedly arranged on both output ends.

7. The Micro OLED screen cleaning device according to claim 5, characterized in that: The first transport mechanism and the second transport mechanism have the same structure. The first transport mechanism comprises a fourth linear module (29) arranged along the Y axis, a fifth linear module (30) arranged along the X axis, and an adsorption device. The guide rail of the fourth linear module (29) is fixed to the carrier, the guide rail of the fifth linear module (30) is fixedly connected to the slider of the fourth linear module (29), and the adsorption device is installed on the slider of the fifth linear module (30) and is constructed to be able to grab the chip (12) from the tray (40) by adsorption.

8. The Micro OLED screen cleaning device according to claim 7, characterized in that: The adsorption device comprises a first mounting frame (34), a first suction cup (36) and a first alignment camera (38) fixed on the first mounting frame (34); the first mounting frame (34) is fixedly connected to a slider of the fifth linear module (30); the first suction cup (36) is mounted on the first mounting frame (34) via a cylinder that is retractable along the Z-axis direction.

9. The Micro OLED screen cleaning device according to any one of claims 4 to 8, characterized in that: A second mounting frame (35) is fixedly mounted on the end effector of the manipulator (2); a second alignment camera (39) and two second suction cups (37) are fixedly mounted on the second mounting frame (35); the two second suction cups (37) are arranged on both sides of the second alignment camera (39); and one magnet (10) is respectively mounted on the back side of the two second suction cups (37).

10. A cleaning method for the Micro OLED screen cleaning device according to any one of claims 1 to 9, characterized in that: Step S1: transporting a tray (40) of uncleaned chips (12) from a chip (12) cutting process to a working area of ​​a first transport mechanism via a first conveyor (20); Step S2: using a first transport mechanism to move the tray (40) from the first conveyor (20) to the rear end of the first platform (24); Step S3: using a second transport mechanism to move the chip (12) from the tray (40) to the front end of the first carrier (24); Step S4: the empty pallet (40) is transported from the first transport mechanism to the third conveyor (22); Step S5: picking up the chip (12) from the front end of the first carrier (24) by the robot (2) and placing it in the cleaning tank (3) for cleaning and drying; Step S6: moving the cleaned and dried chip (12) by the robot (2) to the front end of the second carrier (25); Step S7: using the first transport mechanism to move the clean tray (40) on the fourth conveyor (23) to the rear end of the second platform (25); Step S8: using a third transport mechanism to move the cleaned and dried chip (12) from the front end of the second carrier (25) to the clean tray (40) at the rear end; Step S9: The tray (40) containing the cleaned and dried chips (12) is transported to the second conveyor (21) by the first transport mechanism, and then transported to the downstream cleaning and testing process.

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