Concentric circle chip taking mode in chip packaging process

Abstract

The invention relates to a concentric circle chip taking mode in a chip packaging process, which comprises the following steps of: 1) feeding on a wafer table: putting a prepared wafer into a lifting frame, and automatically loading the wafer to the wafer table; the method comprises the following steps of (1) packaging a chip mounter on a concentric circle path, (2) scanning a bar code, (3) loading a map, (4) positioning and setting the circle center, (5) converting concentric circles, (6) taking concentric circles, and starting concentric circle taking after all the steps are completed. By means of the mode that the chip mounter takes the chips on the concentric circle path, dies with similar performance are packaged on the same module, and the final performance of the module is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of chip packaging, and relates to a concentric circle chip taking method in a chip packaging process. Background Art

[0002] After the fab is manufactured on the wafer, the die on the wafer will be tested. The dies that fail the test need to be marked. Some dies are directly marked with ink at the bad points. A more convenient way is to generate a map based on the test results, which shows the location of good die and bad die. Then the placement machine will skip the ink by identification, or skip the bad die by importing the map and looking at the difference between the good die and bad die codes in the map. Based on the above, the placement machine will take the die in a serpentine route. The trajectory of the serpentine route is as follows: Figure 1 shown.

[0003] However, there are differences in die performance on some wafers (such as Figure 2 As shown in the figure, the closer the color, the closer the performance), and they are distributed in concentric circles. During the packaging process, taking the wafers along a serpentine route will result in packaging dies with large performance differences on the same module, which will ultimately affect the module performance.

[0004] Therefore, a concentric circle chip taking method is designed in the chip packaging process to overcome the above problems. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a simple and efficient concentric circle chip picking method in the chip packaging process. The center of the circle and the center chip can be automatically determined by edge finding and positioning. If the supplier provides a map, the chip position can be located by reference points, and the center chip can be manually specified. After the center chip is confirmed, the chip picking trajectory is converted into concentric circles through the concentric circle function module. Figure 2 The trajectory is concentric circle sampling.

[0006] The present invention is implemented by the following technical solution: a concentric circle chip taking method in a chip packaging process, comprising the following steps: 1) Wafer loading: put the prepared wafer into the lifting frame and automatically load it onto the wafer table; 2) Barcode scanning; 3) Load the map; 4) Positioning and center setting; 5) Concentric circle conversion; 6) Concentric circle film taking: After completing the above steps, start concentric circle film taking.

[0007] As a preference, the step 2) is specifically as follows: A corresponding barcode is set on each wafer. The barcode is scanned to load the corresponding map and store wafer information. If there are remaining chips in the current production process, the barcode can be used to read the original memory when it is used again, so that the initial position of this wafer retrieval starts from the end position of the last time.

[0008] As a preferred embodiment, the specific judgment of step 3) is as follows: whether to load the map depends on whether the chip manufacturer provides a map file. Here, concentric circle chip acquisition can be performed regardless of whether a map file is provided.

[0009] As a preferred embodiment, the specific determination of step 4) is as follows: 1) If there is a map file, after loading the map file, obtain the accurate coordinates of all chips by positioning the reference points, and then use the mouse to specify a chip on the map as the center chip; 2) If there is no map file, locate by finding the edges, that is, find the three edges of the wafer, determine a circle based on the principle of defining a circle with three points, find its center, and identify a chip at the center as the center chip. If the chip is not identified at the center, you can find a chip closest to the center as the center chip by slightly moving it up, down, left, and right.

[0010] Preferably, the step 5) is specifically as follows: after confirming the center chip, a specific concentric circle film-taking trajectory is generated through a concentric circle conversion module, wherein the film-taking trajectory is automatically determined mainly according to the chip size and the center chip coordinates.

[0011] The beneficial effects of the present invention are as follows: The concentric circle chip picking method designed in the chip packaging process of the present invention allows the chip mounter to take chips along a concentric circle route, so that dies with relatively similar performance can be packaged on the same module, thereby improving the final performance of the module.

[0012] The present invention can automatically determine the center of the circle and the center chip by edge finding and positioning. If the supplier provides a map, the chip position can be located by reference point, and the center chip can be manually specified. After the center chip is confirmed, the chip picking trajectory is converted into concentric circles through the concentric circle function module. Figure 2 The trajectory is concentric circle sampling. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Take a track map for an existing serpentine route.

[0014] Figure 2 It is a concentric circle film-taking trajectory diagram of the present invention.

[0015] Figure 3 It is a specific flow chart of the present invention. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to more clearly understand the objectives, technical solutions and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0017] In the description of the present invention, it is necessary to understand that the orientation or position relationship indicated by the terms such as "up", "down", "left", "right", "inside", "outside", "horizontal" and "vertical" is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0018] The present invention will be described in detail below with reference to the accompanying drawings: Figure 2-3 As shown, a concentric circle chip removal method in a chip packaging process includes the following steps: 1) Wafer loading: put the prepared wafer into the lifting frame and automatically load it onto the wafer table; 2) Barcode scanning; 3) Load the map; 4) Positioning and center setting; 5) Concentric circle conversion; 6) Concentric circle film taking: After completing the above steps, start concentric circle film taking.

[0019] The step 2) is specifically as follows: a corresponding barcode is set on each wafer, and the barcode is scanned to load the corresponding map and store wafer information. If there are remaining chips in the current production process, the original memory can be read through the barcode when it is used again, so that the initial position of this chip retrieval starts from the end position of the previous time.

[0020] More specifically, for example, if each module needs to mount 3 chips, the lower limit warning is set to <3. When there are less than 3 chips, the wafer is automatically replaced. Since it is necessary to know the number of remaining chips, this function can only be used when there is a map.

[0021] The specific judgment of step 3) is as follows: whether to load the map depends on whether the chip manufacturer provides a map file. Here, concentric circle chip acquisition can be performed regardless of whether a map file is provided.

[0022] The specific judgment of step 4) is as follows: 1) If there is a map file, after loading the map file, obtain the accurate coordinates of all chips by positioning the reference points, and then use the mouse to specify a chip on the map as the center chip; 2) If there is no map file, locate by finding the edges, that is, find the three edges of the wafer, determine a circle based on the principle of defining a circle with three points, find its center, and identify a chip at the center as the center chip. If the chip is not identified at the center, you can find a chip closest to the center as the center chip by slightly moving it up, down, left, and right.

[0023] The step 5) is specifically as follows: after confirming the center chip, a specific concentric circle film-taking trajectory is generated through the concentric circle conversion module. Here, the film-taking trajectory is automatically determined mainly according to the chip size and the center chip coordinates.

[0024] If the performance of some chips is uneven, but the wafer presents a concentric circle pattern, the concentric circle wafer picking function can be used to package chips with similar performance into the same module, thereby improving the performance of the module.

[0025] The specific embodiments described herein are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A concentric circle chip picking method in a chip packaging process, characterized in that: The steps include: 1) Wafer loading: put the prepared wafer into the lifting frame and automatically load it onto the wafer table; 2) Barcode scanning; 3) Load the map; 4) Positioning and center setting; 5) Concentric circle conversion; 6) Concentric circle film taking: After completing the above steps, start concentric circle film taking.

2. The concentric circle chip picking method in the chip packaging process according to claim 1, characterized in that: The step 2) is specifically as follows: A corresponding barcode is set on each wafer. The barcode is scanned to load the corresponding map and store wafer information. If there are remaining chips in the current production process, the barcode can be used to read the original memory when it is used again, so that the initial position of this wafer retrieval starts from the end position of the last time.

3. The concentric circle chip picking method in the chip packaging process according to claim 1, characterized in that: The specific judgment of step 3) is as follows: whether to load the map depends on whether the chip manufacturer provides a map file. Here, concentric circle chip acquisition can be performed regardless of whether a map file is provided.

4. The concentric circle chip picking method in the chip packaging process according to claim 1, characterized in that: The specific judgment of step 4) is as follows: 1) If there is a map file, after loading the map file, obtain the accurate coordinates of all chips by positioning the reference points, and then use the mouse to specify a chip on the map as the center chip; 2) If there is no map file, locate by finding the edges, that is, find the three edges of the wafer, determine a circle based on the principle of defining a circle with three points, find its center, and identify a chip at the center as the center chip. If the chip is not identified at the center, you can find a chip closest to the center as the center chip by slightly moving it up, down, left, and right.

5. The concentric circle chip picking method in the chip packaging process according to claim 1, characterized in that: The step 5) is specifically as follows: after confirming the center chip, a specific concentric circle film-taking trajectory is generated through the concentric circle conversion module. Here, the film-taking trajectory is automatically determined mainly according to the chip size and the center chip coordinates.

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