A robot horizontal monitoring self-adjusting system

Abstract

The present application relates to the technical field of semiconductor equipment, more particularly, to a mechanical hand horizontal monitoring self-adjusting system.The self-adjusting system comprises a mechanical hand wafer bearing device for bearing wafers, an electronic horizontal monitoring device arranged on the mechanical hand wafer bearing device for monitoring the horizontal state of the mechanical hand wafer bearing device, a horizontal adjustment transmission plate for transmitting and adjusting the horizontal position of the mechanical hand wafer bearing device, and a horizontal self-adjusting device for adjusting the balance state of the horizontal adjustment transmission plate based on the feedback data of the electronic horizontal monitoring device to ensure that the mechanical hand wafer bearing device is in a horizontal state.The present application realizes automatic horizontal adjustment of the mechanical hand through the horizontal self-adjusting device, avoids the inaccuracy in the manual adjustment process, improves the accuracy and efficiency of horizontal monitoring and adjustment, and provides strong technical support for stable operation of the mechanical hand.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a mechanical hand horizontal monitoring self-adjusting system. BACKGROUND

[0002] In the vacuum transmission chamber of a semiconductor equipment, a vacuum mechanical hand is used for wafer transmission work. Whether the position of the wafer during the operation of the equipment is accurate, whether there is a deviation, and whether it is finally successfully transmitted to the target position have a decisive influence on the process result of the equipment.

[0003] The current vacuum mechanical hand monitors the position of the wafer through sensors on the chamber, but is limited to the transient data of the sensors when the wafer is transmitted into or out of the chamber on the mechanical hand. In the automatic wafer transmission process, if the wafer deviates, the system can only alarm according to the transient data, and lacks continuous operation data to assist in analysis.

[0004] With the continuous progress of semiconductor process technology, the accuracy requirement for the position of wafer transmission is increasing. Any position deviation may have a negative impact on the process result. If the mechanical hand level is not adjusted properly, it will cause the wafer to deviate during the transmission process or at the beginning / end of the transmission.

[0005] However, to solve the problem of the level of the mechanical hand, the vacuum chamber must be refilled to atmospheric pressure, and then the mechanical hand fingers must be manually adjusted. At present, the level adjustment of the mechanical hand, including the mechanical hand body and the fingers, depends on manual operation. After adjustment, the current level state can only be judged by an external level meter, which has the following problems:

[0006] 1) The error introduced by human operation is large, and improper adjustment often leads to mechanical hand wafer sliding problems;

[0007] 2) Continuous operation data cannot be obtained, and it cannot be ensured that the mechanical hand is always in the best level state;

[0008] 3) The machine recovery processing time is long, and even after manual adjustment, the mechanical hand may still have level problems during movement, which needs to be adjusted repeatedly, which affects the normal operation time of the equipment. SUMMARY

[0009] The purpose of the present application is to provide a mechanical hand horizontal monitoring self-adjusting system to solve the problem that the level state of the mechanical hand is difficult to monitor and adjust during wafer transmission in the prior art.

[0010] In order to achieve the above-mentioned purpose, the present application provides a mechanical hand horizontal monitoring self-adjusting system, which comprises a mechanical hand wafer bearing device, an electronic horizontal monitoring device, a horizontal adjustment transmission plate and a horizontal self-adjusting device:

[0011] The mechanical hand carries a wafer device for carrying a wafer;

[0012] The electronic level monitoring device is arranged on the mechanical hand wafer carrying device and is used for monitoring the level state of the mechanical hand wafer carrying device;

[0013] The horizontal adjustment transmission plate is connected with the mechanical hand wafer carrying device and the horizontal self-adjusting device respectively and is used for driving and adjusting the horizontal position of the mechanical hand wafer carrying device;

[0014] The horizontal self-adjusting device adjusts the balance state of the horizontal adjustment transmission plate based on the feedback data of the electronic level monitoring device to ensure that the mechanical hand wafer carrying device is in a horizontal state.

[0015] In some embodiments, the mechanical hand level monitoring self-adjusting system further comprises a control device connected with the electronic level monitoring device and the horizontal self-adjusting device respectively;

[0016] The control device receives the level state data fed back by the electronic level monitoring device and processes the data, and sends a control instruction to the horizontal self-adjusting device based on the processing result for horizontal adjustment.

[0017] In some embodiments, the mechanical hand wafer carrying device at least comprises a mechanical hand body and a mechanical hand finger:

[0018] The mechanical hand body is a hollow structure;

[0019] The mechanical hand finger is arranged on one side of the mechanical hand body and is used for placing a wafer;

[0020] The horizontal adjustment transmission plate is arranged in the hollow structure and is connected with the horizontal self-adjusting device at one end.

[0021] In some embodiments, the contact form of the mechanical hand finger with the wafer includes a back contact type and a slope line contact type.

[0022] In some embodiments, the mechanical hand finger is provided with a recess structure at a middle position.

[0023] In some embodiments, the horizontal self-adjusting device comprises a three-point support structure and a driving mechanism:

[0024] The number of the three-point support structure is two, and the installation position corresponds to the end of the balance adjustment transmission plate;

[0025] The three-point support structure is a triangularly distributed three-point needle, and the top is in contact with the balance adjustment transmission plate.

[0026] The driving mechanism is used for controlling part or all of the lift pins to lift or lower according to the received control instruction, so as to adjust the height of the horizontal adjustment transmission plate.

[0027] In some embodiments, the driving mechanism is a servo motor or a step motor.

[0028] In some embodiments, the electronic horizontal monitoring device comprises an inclination sensor arranged at a mechanical hand finger of the mechanical hand for carrying a wafer device, and used for detecting a horizontal state of the mechanical hand.

[0029] In some embodiments, the electronic horizontal monitoring device further comprises a micro-electro-mechanical system (MEMS) gyroscope sensor arranged at the mechanical hand finger of the mechanical hand for carrying the wafer device, and used for detecting an angular velocity of the mechanical hand.

[0030] In some embodiments, the control device adopts a Kalman filtering algorithm to process data fed back by the MEMS gyroscope sensor and the inclination sensor.

[0031] In some embodiments, the control device receives and stores data of a semiconductor device atmosphere and / or a vacuum chamber.

[0032] When the control device detects that a position deviation of the wafer is greater than a preset threshold, the control device performs offset alarm.

[0033] In some embodiments, the horizontal adjustment transmission plate has a bending strength of greater than 310 MPa and a thermal shock temperature of greater than 100 degrees Celsius.

[0034] In some embodiments, the horizontal adjustment transmission plate has a weight of not greater than 10% of a weight of the wafer.

[0035] The mechanical hand horizontal monitoring self-adjusting system can realize automatic horizontal adjustment of the mechanical hand through the horizontal self-adjusting device, avoids inaccurate problems in the manual adjustment process, improves the accuracy and efficiency of the horizontal monitoring adjustment, and provides strong technical support for stable operation of the mechanical hand. BRIEF DESCRIPTION OF DRAWINGS

[0036] The above and other features, properties, and advantages of the present application will become more apparent by the following description with reference to the accompanying drawings and embodiments, in which the same reference numerals are used throughout different views and indicate the same elements, and wherein:

[0037] Figure 1 A principle schematic diagram of a mechanical hand horizontal monitoring self-adjusting system according to an embodiment of the present application is disclosed;

[0038] Figure 2 A partial structure diagram of a mechanical hand horizontal monitoring self-adjusting system according to an embodiment of the present application is disclosed;

[0039] Figure 3a A schematic diagram of a horizontal self-adjusting device according to an embodiment of the present application is disclosed;

[0040] Figure 3b A schematic diagram of a horizontal self-adjusting device according to an embodiment of the present application is disclosed;

[0041] Figure 4 A schematic diagram of a horizontal self-adjusting device according to an embodiment of the present application is disclosed;

[0042] The meanings of the reference numerals in the drawings are as follows:

[0043] 10 wafer-carrying robot device;

[0044] 11 recessed structure;

[0045] 20 electronic level monitoring device;

[0046] 30 horizontal adjustment transmission plate;

[0047] 40 horizontal self-adjusting device;

[0048] 41 three-point support structure;

[0049] 42 driving mechanism. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0051] Figure 1 A schematic diagram of a horizontal self-adjusting device according to an embodiment of the present application is disclosed; Figure 1 A schematic diagram of a horizontal self-adjusting device according to an embodiment of the present application is disclosed;

[0052] The wafer-carrying robot device 10 at least includes a robot for carrying a wafer;

[0053] The electronic level monitoring device 20 is arranged on the wafer-carrying robot device 10 and is used for monitoring the horizontal state of the wafer-carrying robot device 10;

[0054] The horizontal adjustment transmission plate 30 is connected with the wafer-carrying robot device 10 and the horizontal self-adjusting device 40 respectively and is used for transmitting and adjusting the horizontal position of the wafer-carrying robot device 10;

[0055] The horizontal self-adjusting device 40 adjusts the balance state of the horizontal adjustment transmission plate 30 based on the feedback data of the electronic horizontal monitoring device 20, so as to ensure that the wafer device carried by the mechanical hand is in a horizontal state.

[0056] Further, the mechanical hand horizontal monitoring self-adjusting system further comprises a control device connected with the electronic horizontal monitoring device 20 and the horizontal self-adjusting device 40 respectively.

[0057] The control device receives the horizontal state data fed back by the electronic horizontal monitoring device 20 for processing, and sends an adjusting instruction to the horizontal self-adjusting device 40 for horizontal adjustment based on the processing result.

[0058] In the embodiment, the control device is a host computer, which can be realized in the form of an industrial computer.

[0059] The mechanical hand horizontal monitoring self-adjusting system provided by the application is helpful to avoid the inaccuracy in the manual adjustment process, and can realize horizontal adjustment through the horizontal self-adjusting device when the horizontal state of the mechanical hand changes in the long-term operation of the mechanical hand or under the action of external force.

[0060] The following will describe in detail each core component of the mechanical hand horizontal monitoring self-adjusting system provided by the application.

[0061] Specifically, the wafer device carried by the mechanical hand 10 is the basic part of the whole system, and is mainly used for fixing and carrying the wafer.

[0062] The wafer device carried by the mechanical hand 10 at least comprises a mechanical hand body and a mechanical hand finger.

[0063] The mechanical hand body is a hollow structure.

[0064] The mechanical hand finger is arranged on one side of the mechanical hand body, and is used for placing the wafer.

[0065] Generally, the mechanical hand finger is made of ceramic material.

[0066] According to different contact modes with the wafer, the mechanical hand finger can be divided into two types of back point contact type and slope line contact type.

[0067] The finger design of the back point contact type is mainly to realize accurate grabbing and stable support of the wafer by point contact on the back of the wafer. The advantage of this contact mode is that the contact area is small, which can reduce the damage to the wafer surface, and is suitable for occasions with high requirements for the wafer surface quality.

[0068] The slope line contact type finger design is a line contact on the edge or slope of the wafer. In this way, the robot can better disperse the contact pressure and reduce local stress concentration, thereby improving the stability and safety of grabbing. This contact method is suitable for situations where the wafer size is large or a larger contact area is needed to provide sufficient support force.

[0069] Both the back point contact type and the slope line contact type have their own advantages, and can be selected and optimized according to the actual application scenario and the characteristics of the wafer.

[0070] In addition, a recess structure 11 is provided in the middle position of the robot finger, so that when the wafer is placed, the wafer support device on the target position of the wafer can be effectively avoided, thereby improving the accuracy and safety of placement.

[0071] Specifically, the electronic level monitoring device 20 is used to monitor the level state of the wafer device 10 carried by the robot.

[0072] In this embodiment, the electronic level monitoring device 20 includes an inclination sensor installed on the finger part of the robot arm carrying the wafer device to detect the level state of the robot.

[0073] When the inclination sensor is in a static state, there is no acceleration effect in the lateral and vertical directions, and only the gravitational acceleration acts on the sensor. At this time, the angle between the gravitational vertical axis and the sensitive axis of the acceleration sensor is the inclination angle.

[0074] The inclination sensor is an acceleration chip, which is usually used for static or quasi-static measurement. Once there is external acceleration, the acceleration value measured by the acceleration chip will contain the external acceleration component, resulting in inaccurate calculation of the inclination angle.

[0075] Therefore, preferably, the electronic level monitoring device should also include a micro-electro-mechanical system gyro sensor, also installed on the finger part of the robot arm carrying the wafer device, for detecting the angular velocity of the robot.

[0076] The micro-electro-mechanical system gyro sensor usually uses a MEMS gyro chip. The inclination sensor measures the acceleration of three axes, while the MEMS gyro chip measures the angular acceleration of three axes. Therefore, such a sensor product containing an inclination sensor and a micro-electro-mechanical system gyro sensor is also called a 6-axis or VG (vertical gyro) sensor.

[0077] In this embodiment, the control device reads the level state data of the electronic level monitoring device 20 in real time for data collection and storage, and uses big data technology for problem analysis and problem warning.

[0078] For MEMS gyro sensor and tilt sensor, the control device adopts advanced Kalman filtering algorithm to process the data fed back by the MEMS gyro sensor and the tilt sensor, so as to improve the accuracy and reliability of the data.

[0079] Kalman filtering algorithm is a recursive filtering method based on statistical model, which gradually approaches the real state value through continuous prediction and update, so as to realize the optimization processing of sensor data. This method performs well in processing noise and uncertainty in dynamic systems, and is widely used in MEMS. Through the processing of Kalman filtering algorithm, the control device can better understand and respond to the dynamic behavior of the system, so as to improve the performance and stability of the whole system.

[0080] Specifically, the horizontal adjustment transmission plate 30 is used to drive and adjust the horizontal position of the wafer device 10 carried by the manipulator.

[0081] Since the inside of the manipulator body is a hollow structure, the horizontal adjustment transmission plate 30 is arranged in the hollow structure, one end of which is connected with the horizontal self-adjusting device 40, which adjusts the horizontal state of the manipulator through physical means to ensure that the wafer always remains in the horizontal plane.

[0082] The horizontal adjustment transmission plate 30 drives and adjusts the wafer device 10 carried by the manipulator based on the force of the horizontal self-adjusting device, and the horizontal adjustment transmission plate 30 needs to meet certain strength standards to avoid deformation, and its weight should be controlled within a certain range to avoid adversely affecting the performance of the manipulator.

[0083] Generally, the weight of the horizontal adjustment transmission plate 30 is not greater than 10% of the weight of the wafer.

[0084] For example, the thickness standard of the wafer is 750 microns, and the weight is about 125 grams. When the manipulator adjusts the parameters, it should cover the fluctuation range of 10% of the weight of the wafer. Therefore, when the weight of the horizontal adjustment transmission plate 30 is within 12.5 grams, the parameters of the manipulator do not need to be modified. If the weight exceeds this range, the parameters need to be adjusted according to the actual situation.

[0085] In terms of strength requirements, the bending strength of the horizontal adjustment transmission plate 30 should be more than 310 megapascals.

[0086] In addition, since the horizontal adjustment transmission plate 30 will be affected by temperature changes, its thermal shock temperature is above 100 degrees Celsius.

[0087] The horizontal self-adjusting device 40 in the present application adjusts the position or angle of the horizontal adjustment transmission plate 30 to adjust the levelness of the manipulator fingers, and verifies the adjustment result through the electronic level monitoring device 20.

[0088] More specifically, Figure 3a The principle diagram of the horizontal self-adjusting device according to an embodiment of the present application is disclosed, as shown in Figures 1 to 3a The horizontal self-adjusting device 40, as shown, comprises a three-point supporting structure 41 and a driving mechanism 42:

[0089] The three-point supporting structure 41 is in the number of two, and the installation position corresponds to the end of the balance adjustment transmission plate 30.

[0090] The three-point supporting structure 41 is a triangularly distributed three-point needle, and the top of the point needle is in contact with the balance adjustment transmission plate 30.

[0091] The horizontal self-adjusting device 40 adjusts the balance of the balance adjustment transmission plate 30, ensures the balance state of the mechanical hand finger, and ensures that the wafer is kept horizontal on the finger.

[0092] The horizontal self-adjusting device 40 adjusts the balance adjustment transmission plate 30 by driving the three-point supporting structure 41, and finally realizes the horizontal adjustment of the mechanical hand.

[0093] Figure 3b The internal structure diagram of the horizontal self-adjusting device in an embodiment of the present application is shown, as shown in Figure 3b The driving mechanism 42 is used to control the lifting action of part or all of the three-point needles according to the received control instruction, so as to adjust the height of the balance adjustment transmission plate 30.

[0094] The three-point supporting structure 41 comprises three-point needles, which can be uniformly controlled by a point straight plate, or each point needle is controlled by the driving mechanism 42. The height of each point needle is adjusted by the whole adjustment or independent adjustment, and then the levelness of the balance adjustment transmission plate 30 is adjusted, and finally the horizontal adjustment of the mechanical hand finger is realized.

[0095] In the embodiment, the driving mechanism 42 can be realized by a servo motor or a stepping motor.

[0096] The three-point supporting structures 41 on the left and right sides respectively adjust the horizontal position of the two mechanical hands, and the electronic horizontal monitoring device 20 is used to confirm the adjustment result, and once the horizontal data meets the requirements, the adjustment process is stopped.

[0097] The mechanical arm horizontal monitoring automatic adjusting system provided by the present application records the horizontal data through the sensor of the electronic horizontal monitoring device 20 during the wafer transmission process of the mechanical hand, obtains the horizontal data of the mechanical hand in operation, and transmits the data to the control device for data processing and storage. When the horizontal of the mechanical hand finger is slightly deviated, the data can be automatically adjusted according to the stored data.

[0098] Figure 4 The control principle diagram of the mechanical hand horizontal monitoring self-adjusting system according to an embodiment of the present application is disclosed, as shown in Figure 4 The control device receives and stores the wafer transfer data of the atmosphere and / or vacuum chamber of the semiconductor equipment.

[0099] When the control device detects that the position deviation of the wafer is greater than a preset threshold, the control device performs offset alarm.

[0100] The wafer transfer data is mainly used to monitor the position of the wafer during the wafer transfer process, so as to prevent the wafer position deviation from being too large to cause wafer breakage or affect the process processing result during the wafer transfer process.

[0101] The control device judges and issues an offset alarm according to the collected wafer transfer data, so as to avoid the position deviation from being too large to affect the process result or cause wafer damage.

[0102] The dynamic data monitored by the electronic horizontal monitoring device 20 in real time, including the instantaneous position data of the wafer obtained by the tilt sensor, is also stored in the control device, and the control device collects data at a set time interval (the time can be set).

[0103] The control device records the horizontal data of the mechanical hand during the transmission process of the mechanical hand, and the horizontal data monitoring can timely find out whether the mechanical hand has problems such as deformation and jitter.

[0104] The mechanical hand includes rotation, stretching, Z-axis lifting and other actions, the control device can collect the data of the tilt sensor every second, synchronously record the specific action at the time, and then combine the original wafer position center offset data, i.e. AWC (automatic wafer control system) data, to perform overall fitting, and then perform mechanical hand finger horizontal adjustment through the adjusting device.

[0105] When the wafer position offset alarm is detected, the control device checks whether there is an abnormality in the horizontal state data fed back by the electronic horizontal monitoring device, and if there is an abnormality, the horizontal self-adjusting device issues a corresponding control instruction based on the horizontal deviation result to perform a horizontal adjustment operation.

[0106] When the wafer transfer alarm occurs, the horizontal data monitored during the wafer transfer process can be used to determine whether the wafer offset is related to the horizontal of the mechanical hand. If it is related, the specific time and the condition of the machine can be determined according to the recorded data.

[0107] When the horizontality of the mechanical arm is problematic, the control device determines whether the horizontality of the mechanical arm needs to be adjusted according to the horizontality data recorded during transmission and the wafer position data recorded in real time. If adjustment is needed, the control device issues a control instruction and records the time of the control instruction through the data recorded by the tilt angle sensor, and performs self-adjustment through the lifting of the left and right pins driven by the motor. At the same time, corresponding data collection is performed according to the control instruction.

[0108] Further, the control device can perform big data algorithm analysis based on the stored data, predict possible faults in advance, and notify the operator for maintenance through a pre-warning mechanism.

[0109] It should be emphasized that the mechanical arm horizontal monitoring and self-adjusting system proposed in the present application has a certain adjustment range. When the horizontality deviation of the mechanical arm is too large, coarse adjustment is needed to meet the basic level requirement, and then fine adjustment is performed through the self-adjusting system, or when a small deviation occurs after running for a period of time, corresponding adjustment is performed through the self-adjusting system.

[0110] The mechanical arm horizontal monitoring and self-adjusting system provided by the present application has the following beneficial effects:

[0111] 1) Compared with the prior art, the horizontal data is measured by manually placing a mechanical level block during machine maintenance. The present application monitors the horizontal data of the mechanical arm through an electronic level detection device and uploads it to the control device, which not only improves the accuracy and efficiency of horizontal monitoring, but also realizes long-term data storage and real-time monitoring, providing strong technical support for the stable operation of the mechanical arm.

[0112] 2) Compared with the manual horizontal adjustment of the prior art, the present application realizes small-range horizontal self-adjustment of the mechanical arm, thereby ensuring that the mechanical arm always maintains the best working state, greatly reducing the workload of manual adjustment, improving the accuracy and efficiency of adjustment, and further improving the overall performance and reliability of the mechanical arm.

[0113] Although the above methods are illustrated and described as a series of actions for the sake of simplicity of explanation, it should be understood and appreciated that the methods are not limited by the order of the actions, because according to one or more embodiments, some actions can occur in a different order and / or concurrently with other actions illustrated and described herein or not illustrated and described herein but can be understood by those skilled in the art.

[0114] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" are not specifically singular and may include plural forms. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0115] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein can be implemented as electronic hardware, computer software, or a combination of both. To clearly illustrate this interchangeability between hardware and software, the various illustrative components, blocks, modules, circuits, and steps are described above in a generalized manner in their functional form. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art may implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as departing from the scope of the invention.

[0116] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," and "bottom" are used interchangeably.

[0117] The orientation or positional relationship indicated by terms such as "inner", "clockwise", and "counterclockwise" is based on the orientation or positional relationship shown in the accompanying drawings and is only for the purpose of facilitating the description of the present invention and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0118] The above embodiments are provided for those skilled in the art to implement or use the present invention. Those skilled in the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope that conforms to the innovative features mentioned in the claims.

Claims

1. A robot horizontal monitoring self-adjusting system, characterized by, The mechanical hand carries wafer device, electronic level monitoring device, horizontal adjustment transmission plate and horizontal self-adjusting device are included: The mechanical hand carries wafer device is used for carrying wafer; The electronic level monitoring device is arranged on the mechanical hand carries wafer device and is used for monitoring the horizontal state of the mechanical hand carries wafer device; The horizontal adjustment transmission plate is connected with the mechanical hand carries wafer device and the horizontal self-adjusting device respectively and is used for transmission and adjustment of the horizontal position of the mechanical hand carries wafer device; The horizontal self-adjusting device adjusts the balance state of the horizontal adjustment transmission plate based on the feedback data of the electronic level monitoring device to ensure that the mechanical hand carries wafer device is in the horizontal state; The horizontal self-adjusting device includes three-point support structure and driving mechanism: The number of the three-point support structure is two, and the installation position corresponds to the end of the horizontal adjustment transmission plate; The three-point support structure is three triangular needles, and the top is in contact with the horizontal adjustment transmission plate; The driving mechanism is used for controlling part or all of the needles to lift to adjust the height of the horizontal adjustment transmission plate according to the received control instruction.

2. The robotic arm horizontal monitoring self-adjusting system of claim 1, wherein, The control device is connected with the electronic level monitoring device and the horizontal self-adjusting device respectively; The control device receives the horizontal state data fed back by the electronic level monitoring device and processes, and sends the control instruction to the horizontal self-adjusting device for horizontal adjustment based on the processing result.

3. The robotic arm horizontal monitoring self-adjusting system of claim 1, wherein, The mechanical hand carries wafer device includes at least mechanical hand body and mechanical hand finger: The mechanical hand body is a hollow structure; The mechanical hand finger is arranged on one side of the mechanical hand body and is used for placing wafer; The horizontal adjustment transmission plate is arranged in the hollow structure and is connected with the horizontal self-adjusting device at one end.

4. The robot level monitoring self-adjusting system of claim 3, wherein, The contact form of the mechanical hand finger with the wafer includes back contact type and slope line contact type.

5. The robot level monitoring self-adjusting system of claim 3, wherein, The mechanical hand finger is provided with recess structure at the middle position.

6. The robotic arm horizontal monitoring self-adjusting system of claim 1, wherein, The driving mechanism is servo motor or step motor.

7. The robotic arm horizontal monitoring self-adjusting system of claim 2, wherein, The electronic level monitoring device includes inclination sensor arranged at the mechanical hand finger of the mechanical hand carries wafer device and is used for detecting the horizontal state of the mechanical hand.

8. The robotic arm horizontal monitoring self-adjusting system of claim 7, wherein, The electronic level monitoring device also includes micro-electro-mechanical system gyro sensor arranged at the mechanical hand finger of the mechanical hand carries wafer device and is used for detecting the angular velocity of the mechanical hand.

9. The robotic arm horizontal monitoring self-adjusting system of claim 8, wherein, The control device adopts Kalman filtering algorithm to process the data fed back by the micro-electro-mechanical system gyro sensor and the inclination sensor.

10. The robotic arm horizontal monitoring self-adjusting system of claim 2, wherein, The control device receives and stores the wafer data of the semiconductor equipment atmosphere and / or vacuum chamber; When the control device detects that the position deviation of the wafer is greater than the preset threshold value, the control device performs deviation alarm.

11. The robotic arm horizontal monitoring self-adjusting system of claim 1, wherein, The bending strength of the horizontal adjustment transmission plate is above 310Mpa, and the thermal shock temperature is above 100 degrees Celsius.

12. The robotic arm horizontal monitoring self-adjusting system of claim 1, wherein, The weight of the horizontal adjustment transmission plate is not greater than 10% of the weight of the wafer.

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