An XY dual-drive platform

Abstract

This application relates to the field of wafer inspection equipment, and specifically discloses an XY dual-drive platform, which includes a sliding mechanism, comprising a base, a lower slide table, an upper slide table, a first linear motor and a second linear motor; an inspection mechanism; a fixing mechanism, provided in two groups, including an installation ring, an adsorption block, a vacuum pump and a driving component. The installation ring is arranged on the upper slide table, the adsorption block is slidably arranged on the installation ring, a cavity is arranged inside the adsorption block, an adsorption hole is formed in the adsorption block, and the adsorption block is communicated with the vacuum pump, so that the adsorption block can be adsorbed and fixed to the wafer under the action of negative pressure. The driving component is used to drive the adsorption block to slide; a gap for accommodating the wafer is arranged between the two fixing mechanisms. When one of the fixing mechanisms is fixedly connected to the wafer, the other fixing mechanism is arranged separately from the wafer. This application can inspect the edge part of the wafer, which helps to ensure the integrity of the inspection.

Description

Technical Field

[0001] This application relates to the field of wafer inspection equipment, and particularly to an XY dual-drive platform. Background Art

[0002] A wafer is a substrate material for manufacturing integrated circuits and other microelectronic devices, usually a circular thin slice made of high-purity single crystal silicon through processes such as cutting, grinding, and polishing. Defects on the wafer may cause a decline in the electrical performance of the device, so defect inspection is required after the wafer is manufactured.

[0003] Defect inspection of wafers is usually visual inspection. Visual inspection uses an optical imaging system to capture the microscopic features on the wafer surface and analyzes the image data through image processing algorithms to identify and classify various defects. During inspection, the wafer needs to be fixed on a dual-drive platform, and the dual-drive platform drives the wafer to slide horizontally; there are two inspection heads, which are respectively located on the upper and lower sides of the wafer, and the positions of the inspection heads are fixed for identifying surface defects of the wafer, so as to inspect the upper and lower surfaces of the wafer. When the dual-drive platform drives the wafer to move horizontally, the wafer can slide relative to the inspection heads, so as to realize the inspection of different positions of the wafer.

[0004] During defect inspection, the wafer needs to be fixed on the dual-drive platform. The fixing methods include clamping fixation and vacuum adsorption fixation. Since the thickness of the wafer is relatively thin, usually less than 1 mm, when clamping fixation is used, it is easy to cause extrusion to the wafer and make the wafer deformed, affecting the subsequent inspection results. When vacuum adsorption is used for fixation, the adsorbent will adsorb at the edge of the wafer, and the edge of the wafer is blocked, so that the edge of the wafer cannot be recognized by the inspection head, and it is difficult to inspect the edge of the wafer. A rough, pitted or broken wafer edge will cause surface contamination and may also cause the wafer to burst in the process chamber, thus affecting the overall quality and reliability of the wafer. Summary of the Invention

[0005] In order to facilitate the inspection of the edge of the wafer, this application provides an XY dual-drive platform.

[0006] The XY dual-drive platform provided by this application adopts the following technical solutions:

[0007] An XY dual-drive platform, comprising:

[0008] A sliding mechanism, including a base, a lower sliding table, an upper sliding table, a first linear motor, and a second linear motor. The lower sliding table is slidably connected to the base, the upper sliding table is slidably connected to the lower sliding table, the middle parts of the upper sliding table and the lower sliding table are both open, the first linear motor is used to drive the lower sliding table to slide, and the second linear motor is used to drive the upper sliding table to slide;

[0009] The detection mechanism includes an upper detection head and a lower detection head. The upper detection head is located above the upper sliding table, and the lower detection head is located below the upper sliding table. The detection ends of the upper detection head and the lower detection head both face the upper sliding table;

[0010] The fixing mechanism is provided with two groups. The fixing mechanism includes a mounting ring, an adsorption block, a vacuum pump, and a driving component. The mounting ring is arranged on the upper sliding table. The adsorption block is slidably arranged on the mounting ring. A plurality of adsorption blocks are provided and arranged in a circumferential array. A cavity is arranged inside the adsorption block. An adsorption hole is formed in the adsorption block. The cavity inside the adsorption block is communicated with the vacuum pump so that the adsorption block can be adsorbed and fixed to the wafer under the action of negative pressure. The driving component is used to drive a plurality of adsorption blocks to slide toward or away from the side close to the center of the array arrangement;

[0011] The two fixing mechanisms are arranged at intervals, and a gap for accommodating the wafer is arranged between the two fixing mechanisms. One of the fixing mechanisms is used for adsorbing and connecting with the top edge of the wafer, and the other fixing mechanism is used for adsorbing and connecting with the bottom edge of the wafer. When one of the fixing mechanisms is adsorbed and connected with the wafer, the other fixing mechanism is separated from the wafer.

[0012] By adopting the above technical solution, when the adsorption block in the lower fixing mechanism is fixedly connected to the bottom wall of the wafer, the adsorption block in the upper fixing mechanism is in a separated state from the wafer, and the upper adsorption block is located outside the wafer. Therefore, the upper adsorption block will not block the upper surface of the wafer, and the upper surface of the wafer can be visually detected by the upper detection head; similarly, when the upper adsorption block is fixedly connected to the top wall of the wafer, the lower adsorption block is located outside the wafer, and the lower surface of the wafer can be visually detected by the lower detection head. Therefore, while ensuring the fixing effect on the wafer, the edge of the wafer can be detected, thus ensuring the detection effect.

[0013] Optionally, the driving component includes a toothed ring, a connecting rope, a first motor, a gear, and a spring. The toothed ring is rotatably connected to the mounting ring. The connecting rope is fixedly connected between the adsorption block and the toothed ring so that the adsorption block can be driven to slide when the toothed ring rotates. The first motor is arranged on the mounting ring. The gear is connected to the end of the output shaft of the first motor. The gear meshes with the toothed ring. The spring is connected between the adsorption block and the mounting ring. The spring causes the adsorption block to have a tendency to slide toward the center of the toothed ring.

[0014] By adopting the above technical solution, the first motor drives the gear to rotate, which can make the ring gear rotate. The ring gear drives the adsorption block to slide outwards through the connecting rope. When the output shaft of the first motor rotates in the reverse direction, the spring can make the adsorption block slide inwards. Therefore, multiple adsorption blocks can slide outwards or inwards simultaneously. The sliding setting of the adsorption block facilitates avoiding the loading and unloading process of the wafer on one hand, and on the other hand, the sliding distance of the adsorption block can be adjusted as needed, so that the adsorption block can adsorb and fix wafers of different sizes, which helps to improve the applicability of the device.

[0015] Optionally, the mounting ring is slidably arranged on the upper sliding table. An elevating component is arranged on the upper sliding table. The elevating component includes a second motor and a lead screw. The second motor is fixedly arranged on the upper sliding table. The lead screw is connected to the end of the output shaft of the second motor. The lead screw is threadedly connected to the mounting ring.

[0016] By adopting the above technical solution, the second motor drives the lead screw to rotate, which can make the mounting ring slide, so as to realize the lifting drive of the adsorption block. Therefore, the adsorption block in a separated state from the wafer can first slide inwards along the horizontal direction, and then slide towards the side close to the wafer along the vertical direction, so as to adsorb and fix the wafer. It can avoid relative sliding when the adsorption block abuts against the wafer, thereby reducing the possibility of the adsorption block scratching the wafer.

[0017] Optionally, a light source is arranged on the base below the upper sliding table.

[0018] By adopting the above technical solution, the area below the upper sliding table can be illuminated, so as to ensure the visual inspection effect of the lower detection head on the wafer.

[0019] Optionally, a connecting ring is arranged on the base. A cavity is arranged inside the connecting ring. The connecting ring is sleeved outside the light source. An air inlet and an air outlet communicating with the internal cavity are arranged on the connecting ring. The air outlet is communicated with the cavity inside the adsorption block.

[0020] By adopting the above technical solution, when the vacuum pump evacuates the adsorption block, the air inside the connecting ring can also be pumped out, making the inside of the connecting ring in a negative pressure state. At this time, the outside air can flow into the connecting ring through the air inlet, so that the air in the connecting ring flows continuously, taking away the heat generated by the light source, which helps to accelerate the heat dissipation of the light source.

[0021] Optionally, a valve body is arranged between the air outlet and the adsorption block.

[0022] By adopting the above technical solution, when the lower adsorption block is attached to the lower surface of the wafer, the adsorption block can be adsorbed and fixed to the lower surface of the wafer. At this time, the valve body is in the closed state, which helps to ensure the vacuum pumping effect on the adsorption block, thereby ensuring the adsorption and fixing effect on the wafer. When the lower adsorption block moves to the outside of the wafer, the valve body opens, and the vacuum pump can evacuate the inside of the connecting ring, so that the air inside the connecting ring flows to dissipate heat from the light source. Therefore, the setting of the connecting ring is not likely to affect the adsorption effect of the adsorption block.

[0023] Optionally, a rubber pad is provided on the adsorption block.

[0024] By adopting the above technical solution, the surface between the adsorption block and the wafer is in flexible contact, so that the adsorption block can avoid damaging the wafer.

[0025] Optionally, a groove is provided on the top surface of the base, and the first linear motor is disposed in the groove.

[0026] By adopting the above technical solution, the overall height of the device can be reduced, thereby reducing the occupied space.

[0027] Optionally, two second linear motors are provided and are respectively located on both sides of the lower sliding table, and the stator of the second linear motor is arranged vertically.

[0028] By adopting the above technical solution, the size of the lower sliding table in the front-rear direction is reduced, which helps to save space.

[0029] Optionally, the lower sliding table is made of marble.

[0030] By adopting the above technical solution, marble is a natural stone with excellent physical properties, which can effectively reduce the influence of the external environment on the lower sliding table, such as the deformation influence of temperature, humidity and other changes on the lower sliding table, so as to maintain long-term stability.

[0031] In summary, the present application includes the following beneficial technical effects:

[0032] 1. The two fixing mechanisms do not adsorb and fix the wafer at the same time. Therefore, when one of the fixing mechanisms fixes one side of the wafer, visual inspection can be performed on the other side of the wafer, so as to realize the detection of the edge part of the wafer, which helps to ensure the integrity of the detection.

[0033] 2. The adsorption block is slidably arranged, which can not only avoid the loading and unloading process of the wafer, but also adjust the sliding distance of the adsorption block according to needs, so that the device can adapt to wafers of different sizes and has a wider application range.

[0034] When the vacuum pump evacuates the interior of the adsorption block, it can also extract the air in the connecting ring. Under the negative pressure inside the connecting ring, the outside air flows into the connecting ring through the air inlet, and the air in the connecting ring keeps flowing, thereby taking away the heat generated by the light source and helping to accelerate the heat dissipation of the light source. Description of the Drawings

[0035] Figure 1 is the overall structural schematic diagram of the embodiment of the present application;

[0036] Figure 2 is the cross-sectional view of the embodiment of the present application;

[0037] Figure 3 is Figure 2 the enlarged schematic diagram of part A in

[0038] Figure 4 is the cross-sectional view of another perspective of the embodiment of the present application;

[0039] Figure 5 is Figure 4 the enlarged schematic diagram of part B in

[0040] Figure 6 is Figure 2 the enlarged schematic diagram of part C in

[0041] Reference Signs: 1, sliding mechanism; 11, base; 111, groove; 112, first guide rail; 12, lower sliding table; 121, first slider; 122, second guide rail; 13, upper sliding table; 131, second slider; 14, first linear motor; 15, second linear motor; 2, detection mechanism; 21, upper detection head; 22, lower detection head; 3, fixing mechanism; 31, mounting ring; 311, guide frame; 312, connecting block; 32, adsorption block; 321, adsorption hole; 33, driving assembly; 331, gear ring; 332, connecting rope; 333, first motor; 334, gear; 335, spring; 4, lifting assembly; 41, second motor; 42, lead screw; 43, guide rod; 5, light source; 6, connecting ring; 61, air inlet; 62, exhaust port; 7, valve body; 8, hose; 9, wafer. Detailed Description of the Embodiment

[0042] The following will Figures 1-6 further describe the present application in detail.

[0043] The embodiment of the present application discloses an XY dual-drive platform. Refer to Figure 1, The XY dual-drive platform includes a sliding mechanism 1, a detection mechanism 2, and a fixing mechanism 3. The sliding mechanism 1 includes a base 11, a lower sliding table 12, an upper sliding table 13, a first linear motor 14, and a second linear motor 15. The base 11 is horizontally arranged. The lower sliding table 12 is made of marble, and the upper sliding table 13 is made of aluminum alloy. The lower sliding table 12 is arranged above the base 11, and the upper sliding table 13 is arranged above the lower sliding table 12. Two first linear motors 14 are provided and arranged in parallel at intervals; a groove 111 is formed on the top surface of the base 11, the stator of the first linear motor 14 is fixedly connected to the bottom wall of the groove 111, the mover of the first linear motor 14 is slidably arranged in the stator, and the mover is fixedly connected to the bottom wall of the lower sliding table 12. Therefore, the first linear motor 14 can drive the lower sliding table 12 to slide horizontally. Two second linear motors 15 are provided and arranged in parallel at intervals. The stator of the second linear motor 15 is fixedly connected to the side wall of the lower sliding table 12, and the mover of the second linear motor 15 is fixedly connected to the bottom wall of the upper sliding table 13. Therefore, the second linear motor 15 can drive the upper sliding table 13 to slide horizontally, and the sliding direction of the upper sliding table 13 is perpendicular to the sliding direction of the lower sliding table 12. Openings are provided in the middle of both the upper sliding table 13 and the lower sliding table 12, so as to reduce the overall weight and thus reduce the load on the first linear motor 14 and the second linear motor 15.

[0044] Among them, the stator of the second linear motor 15 is vertically arranged, so as to reduce the width of the lower sliding table 12 and save more space.

[0045] A first guide rail 112 is fixedly connected to the top wall of the base 11, a first slider 121 is fixedly connected to the bottom wall of the lower sliding table 12, and the first slider 121 is slidably connected to the first guide rail 112. A second guide rail 122 is fixedly connected to the top wall of the lower sliding table 12, a second slider 131 is fixedly connected to the bottom wall of the upper sliding table 13, and the second slider 131 is slidably connected to the second guide rail 122. Therefore, it helps to improve the stability of the sliding process of the lower sliding table 12 and the upper sliding table 13.

[0046] Refer to Figure 2 , The detection mechanism 2 includes an upper detection head 21 and a lower detection head 22. The upper detection head 21 is located above the upper sliding table 13, the lower detection head 22 is located below the upper sliding table 13, and the detection ends of the upper detection head 21 and the lower detection head 22 face each other. Therefore, it can perform visual inspection on the upper and lower surfaces of the wafer 9 placed on the upper sliding table 13.

[0047] Refer to Figure 2 and Figure 3, There are two sets of fixing mechanisms 3, which are arranged at intervals in the vertical direction. The two fixing mechanisms 3 are respectively used to fix the upper and lower sides of the wafer 9. The fixing mechanism 3 includes an installation ring 31, an adsorption block 32, a vacuum pump and a driving component 33. The installation ring 31 is arranged on the upper sliding table 13. A guiding frame 311 is fixedly connected to the installation ring 31. There are four guiding frames 311, which are arranged in a circumferential array. A connecting block 312 is slidably arranged inside each guiding frame 311. There are four adsorption blocks 32, which correspond to the four connecting blocks 312 respectively. The adsorption block 32 is fixedly connected to the end of the corresponding connecting block 312. A cavity is arranged inside the adsorption block 32. Adsorption holes 321 are arranged on one side of the upper and lower groups of adsorption blocks 32 close to each other. The adsorption holes 321 communicate with the internal cavity of the adsorption block 32, and there are multiple adsorption holes 321. The internal cavity of the adsorption block 32 is communicated with the vacuum pump. Therefore, when the vacuum pump evacuates, a negative pressure can be generated inside the adsorption block 32, so as to adsorb and fix the surface of the wafer 9 at the adsorption holes 321 of the adsorption block 32.

[0048] Wherein, a rubber pad is arranged on one side of the adsorption block 32 close to the adsorption holes 321, and through holes corresponding to the adsorption holes 321 are arranged on the rubber pad. Therefore, the contact between the adsorption block 32 and the wafer 9 is flexible, which can avoid damaging the wafer 9.

[0049] Refer to Figure 2 , Figure 4 and Figure 5 , The driving component 33 is used to drive the adsorption block 32 to slide. The driving component 33 includes a gear ring 331, a connecting rope 332, a first motor 333, a gear 334 and a spring 335. The gear ring 331 is rotatably connected to the installation ring 31. There are four connecting ropes 332, which correspond to the four connecting blocks 312 respectively; the connecting rope 332 is a flexible rope body and has no elasticity. One end of the connecting rope 332 is located in the guiding frame 311 and is fixedly connected to the end of the connecting block 312; the other end of the connecting rope 332 is fixedly connected to the inner wall of the gear ring 331. The first motor 333 is fixedly connected to the installation ring 31, and the output shaft of the first motor 333 is coaxially fixedly connected to the gear 334. The gear 334 meshes with the teeth outside the gear ring 331. Therefore, when the first motor 333 drives the gear 334 to rotate, the gear ring 331 can be rotated. The gear ring 331 can drive the connecting block 312 to slide through the connecting rope 332, so that the multiple adsorption blocks 32 slide towards the side away from each other. There are four springs 335, which correspond to the four connecting blocks 312 respectively. The springs 335 are located in the guiding frame 311. The springs 335 are fixedly connected between the connecting block 312 and the inner wall of the guiding frame 311. The springs 335 are in a compressed state. Therefore, the springs 335 make the connecting block 312 tend to slide towards the outside of the guiding frame 311. Therefore, under the driving action of the first motor 333 and the reset action of the spring 335, the multiple adsorption blocks 32 can move away from or close to each other.

[0050] Two sets of fixing mechanisms 3 are respectively located on the upper and lower sides of the wafer 9. When the fixing mechanism 3 below the wafer 9 adsorbs and fixes the lower surface of the wafer 9, the fixing mechanism 3 above the wafer 9 and the wafer 9 are in a separated state. Therefore, the upper surface of the wafer 9 can be detected at this time. After the detection of the upper surface of the wafer 9 is completed, the fixing mechanism 3 above the wafer 9 is then made to adsorb and fix the upper surface of the wafer 9, and then the fixing mechanism 3 below the wafer 9 is separated from the lower surface of the wafer 9. At this time, the lower surface of the wafer 9 can be detected. Therefore, while ensuring the fixing effect on the wafer 9, the detection of the edge of the wafer 9 can be realized, which helps to ensure the detection effect.

[0051] Refer to Figure 1 , further, both mounting rings 31 are vertically slidably arranged on the upper sliding table 13, and a lifting component 4 for driving the mounting ring 31 to slide is arranged on the upper sliding table 13. There are two sets of lifting components 4, corresponding to the two mounting rings 31 respectively. The lifting component 4 includes a second motor 41 and a lead screw 42. The second motor 41 is fixedly connected to the upper sliding table 13, and the lead screw 42 is coaxially fixedly connected to the end of the output shaft of the second motor 41. A guide rod 43 is also fixedly connected to the upper sliding table 13. Both sides of the mounting ring 31 are fixedly connected with bumps, one of which is threadedly connected to the lead screw 42, and the other is slidably connected to the guide rod 43. Therefore, when the second motor 41 drives the lead screw 42 to rotate, the mounting ring 31 can slide in the vertical direction, so that the adsorption block 32 slides toward or away from the wafer 9, avoiding scratching the surface of the wafer 9 when the adsorption block 32 slides horizontally.

[0052] Refer to Figure 2 , in order to ensure the detection effect of the lower detection head 22 on the lower surface of the wafer 9, a light source 5 is arranged below the upper sliding table 13. The light source 5 is an LED lamp. Therefore, the light source 5 can illuminate the area below the wafer 9, which helps to enhance the recognition effect.

[0053] Refer to Figure 2 and Figure 6 , a connecting ring 6 is also arranged on the base 11, and a cavity is arranged inside the connecting ring 6. The connecting ring 6 covers the outside of the main body of the light source 5. An air inlet 61 and an air outlet 62 communicating with the internal cavity are arranged on the connecting ring 6. A hose 8 is fixedly connected to the air outlet 62, and one end of the hose 8 far from the air outlet 62 is fixedly connected to one of the adsorption blocks 32 in the lower fixing mechanism 3, and the hose 8 communicates with the cavity inside the adsorption block 32. Therefore, when the inside of the adsorption block 32 is evacuated, the air inside the connecting ring 6 can also be pumped out. At this time, the outside air can flow into the connecting ring 6 through the air inlet 61. Therefore, the air in the connecting ring 6 can flow continuously, thereby taking out the heat of the light source 5, which helps to enhance the heat dissipation effect of the light source 5 and avoid the temperature of the light source 5 being too high.

[0054] Further, a valve body 7 is provided between the hose 8 and the exhaust port 62. The valve body 7 is a stop valve and can control the on-off of the hose 8. In other embodiments, it can also be other types of valves, such as a ball valve or a gate valve. Thus, when the adsorption block 32 in the lower fixing mechanism 3 adsorbs and fixes the lower surface of the wafer 9, the valve body 7 is in the closed state. At this time, it is possible to better evacuate the inside of the adsorption block 32, thereby ensuring the adsorption and fixing effect of the adsorption block 32. When the adsorption block 32 in the lower fixing mechanism 3 separates from the wafer 9, the valve body 7 is then opened, so that the air in the connecting ring 6 continuously flows, accelerating the heat dissipation of the light source 5.

[0055] The output shafts of the first motor 333 and the second motor 41 in this embodiment both have self-locking ability, that is, after the motors stop running, the external force cannot cause the output shafts of the motors to rotate.

[0056] The implementation principle of an XY dual-drive platform in an embodiment of the present application is as follows: In the initial state, the distance between the four adsorption blocks 32 in the lower fixing mechanism 3 is small, and the distance between the four adsorption blocks 32 in the upper fixing mechanism 3 is large. First, move the wafer 9 above the adsorption block 32, and then move the wafer 9 downward. During the downward movement of the wafer 9, it will not contact the upper adsorption block 32 until the bottom wall of the wafer 9 abuts against the tops of the four adsorption blocks 32 below. Then, under the action of a vacuum pump, the inside of the adsorption block 32 can be in a negative pressure state, and the lower surface of the wafer 9 is adsorbed and fixed on the top of the lower adsorption block 32. Then, under the cooperation of the first linear motor 14 and the second linear motor 15, the lower sliding table 12 and the upper sliding table 13 can slide horizontally, so that the wafer 9 slides, adjusting the position of the wafer 9 relative to the upper detection head 21, and visually detecting the upper surface of the wafer 9 through the upper detection head 21.

[0057] After the visual inspection of the upper surface of the wafer 9 is completed, the lower adsorption block 32 stops adsorbing the wafer 9, and the wafer 9 stays on the top surface of the lower adsorption block 32. The first motor 333 in the upper fixing mechanism 3 is started, so that the gear 334 rotates, and the gear 334 drives the toothed ring 331 to rotate. The spring 335 causes the connecting block 312 and the adsorption block 32 to slide outward to the outside of the guide frame 311 until the adsorption block 32 slides above the edge position of the wafer 9. Then the second motor 41 is started, driving the lead screw 42 to rotate, so that the upper mounting ring 31 slides downward until the bottom of the adsorption block 32 on the upper mounting ring 31 fits against the upper surface of the wafer 9. Then the adsorption block 32 is adsorbed and fixed to the upper surface of the wafer 9 under the action of negative pressure. The lower adsorption block 32 then slides downward and then slides outward until it slides outside the wafer 9, so as to avoid the lower adsorption block 32 blocking the lower surface of the wafer 9. At this time, the lower surface of the wafer 9 can be visually detected through the lower detection head 22.

[0058] After the lower adsorption block 32 slides to the outside of the wafer 9, the vacuum pump is turned on again, and the valve body 7 is opened. At this time, the air inside the connecting ring 6 can be pumped out by the vacuum pump, and the outside air flows into the connecting ring 6 through the air inlet 61, thereby taking away the heat generated when the light source 5 emits light, which helps to accelerate the heat dissipation of the light source 5. When the lower adsorption block 32 slides inward again, the vacuum pump is turned off, and the valve body 7 is closed, so as to ensure the vacuum pumping effect inside the adsorption block 32 and help to ensure the adsorption and fixation effect on the wafer 9.

[0059] The above are the optional embodiments of the present application, and do not limit the protection scope of the present application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. An XY dual-drive platform, characterized in that: include: The sliding mechanism (1) comprises a base (11), a lower slide (12), an upper slide (13), a first linear motor (14) and a second linear motor (15), wherein the lower slide (12) is slidably connected to the base (11), the upper slide (13) is slidably connected to the lower slide (12), the middle parts of the upper slide (13) and the lower slide (12) are both open, the first linear motor (14) is used to drive the lower slide (12) to slide, and the second linear motor (15) is used to drive the upper slide (13) to slide; The detection mechanism (2) comprises an upper detection head (21) and a lower detection head (22), wherein the upper detection head (21) is located above the upper slide (13), and the lower detection head (22) is located below the upper slide (13), and the detection ends of the upper detection head (21) and the lower detection head (22) are both facing the upper slide (13); A fixing mechanism (3), wherein the fixing mechanism (3) is provided with two groups, the fixing mechanism (3) comprising a mounting ring (31), an adsorption block (32), a vacuum pump and a driving component (33), the mounting ring (31) being provided on an upper slide table (13), the adsorption block (32) being slidably provided on the mounting ring (31), a plurality of the adsorption blocks (32) being provided and arranged in a circular array, a cavity being provided inside the adsorption block (32), an adsorption hole (321) being provided on the adsorption block (32), the cavity inside the adsorption block (32) being connected to the vacuum pump so that the adsorption block (32) can be adsorbed and fixed to the wafer (9) under the action of negative pressure, and the driving component (33) being used to drive the plurality of adsorption blocks (32) to slide toward a side close to or away from the center of the array arrangement; The two fixing mechanisms (3) are arranged at intervals, and a gap for accommodating the wafer (9) is provided between the two fixing mechanisms (3). One of the fixing mechanisms (3) is used to be adsorbed and connected to the top edge of the wafer (9), and the other fixing mechanism (3) is used to be adsorbed and connected to the bottom edge of the wafer (9). When one of the fixing mechanisms (3) is adsorbed and connected to the wafer (9), the other fixing mechanism (3) is separated from the wafer (9).

2. An XY dual-drive platform according to claim 1, characterized in that: The driving assembly (33) comprises a ring gear (331), a connecting rope (332), a first motor (333), a gear (334) and a spring (335); the ring gear (331) is rotatably connected to the mounting ring (31); the connecting rope (332) is fixedly connected between the adsorption block (32) and the ring gear (331), so that when the ring gear (331) rotates, it can drive the adsorption block (32) to slide; the first motor (333) is arranged on the mounting ring (31); the gear (334) is connected to the end of the output shaft of the first motor (333); the gear (334) is meshed with the ring gear (331); the spring (335) is connected between the adsorption block (32) and the mounting ring (31); the spring (335) causes the adsorption block (32) to have a tendency to slide toward the center of the ring gear (331).

3. An XY dual-drive platform according to claim 1, characterized in that: The mounting ring (31) is slidably arranged on the upper slide (13); a lifting assembly (4) is arranged on the upper slide (13); the lifting assembly (4) comprises a second motor (41) and a screw rod (42); the second motor (41) is fixedly arranged on the upper slide (13); the screw rod (42) is connected to the end of the output shaft of the second motor (41); and the screw rod (42) is threadedly connected to the mounting ring (31).

4. The XY dual-drive platform according to claim 1, characterized in that: A light source (5) is arranged on the base (11) below the upper slide platform (13).

5. The XY dual-drive platform according to claim 4, characterized in that: The base (11) is provided with a connecting ring (6), a cavity is provided inside the connecting ring (6), the connecting ring (6) is sleeved on the outside of the light source (5), the connecting ring (6) is provided with an air inlet (61) and an air outlet (62) which are communicated with the internal cavity, and the air outlet (62) is communicated with the cavity inside the adsorption block (32).

6. An XY dual-drive platform according to claim 5, characterized in that: A valve body (7) is provided between the exhaust port (62) and the adsorption block (32).

7. The XY dual-drive platform according to claim 1, characterized in that: A rubber pad is provided on the adsorption block (32).

8. The XY dual-drive platform according to claim 1, characterized in that: A groove (111) is provided on the top surface of the base (11), and the first linear motor (14) is arranged in the groove (111).

9. The XY dual-drive platform according to claim 1, characterized in that: Two second linear motors (15) are provided and are respectively located on both sides of the lower slide platform (12); the stator of the second linear motor (15) is arranged vertically.

10. The XY dual-drive platform according to claim 1, characterized in that: The lower slide platform (12) is made of marble.

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