A hybrid packaging structure for an integrated circuit chip

Abstract

The present invention discloses a hybrid packaging structure for an integrated circuit chip, which relates to the technical field of semiconductor chip packaging. It includes an outer packaging layer, and the outer packaging layer includes a bottom fixing plate layer. The inner wall of the bottom fixing plate layer is sleeved with a chip component. The chip component includes a chip body. The bottom end of the chip body is electrically connected with multiple groups of pins. A buffer pad is sleeved on the outer wall of the multiple groups of pins. A sealing sleeve is sleeved on the outer wall of the chip body and located below the buffer pad. In the present invention, when the radiator is installed on the main board, the metal seat of the radiator fits on the outer wall of the upper metal pressing cover and pushes the upper metal pressing cover to slide on the inner wall of the bottom fixing plate layer, so that the thermal conductive silicone grease inside the stock pocket flows between the copper foil layer and the convex strip, thereby enabling the heat generated by the chip body to be efficiently transferred to the radiator.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip packaging, and specifically to a hybrid packaging structure for integrated circuit chips. Background Art

[0002] An integrated circuit is a microelectronic device or component. An integrated circuit is fabricated using a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit on a small piece or a few small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a micro-structure with the required circuit functions. During the assembly process of integrated circuits, integrated circuits are usually assembled into cores through packaging processes. For example, electronic components such as CPUs in computers are relatively common integrated circuit chips.

[0003] A hybrid packaging structure for an integrated circuit chip disclosed in a prior patent (Publication No.: CN118431172B), belonging to the technical field of semiconductor processing, includes an upper packaging component and a lead frame. The upper packaging component includes an upper packaging board, a buffer pressing plate, and a limiting frame. The lead frame is connected with a limiting fixing plate and a chip, and further includes: a lower packaging component, the lower packaging component includes a lower packaging frame, and the lower packaging frame is connected with a one-way intake valve, a plugging strip, and a pressure sensor; a buffer component, the buffer component can absorb the stress generated by the chip and the lower packaging frame to avoid damage to both, and it reduces the damage to the chip caused by stress by absorbing the impact force during vibration of the lead frame, improving applicability; and can quickly inflate the inside of the airbag under specific circumstances to ensure the temporary buffer effect, thereby avoiding damage to the chip, lead frame, or packaging component due to failure to detect and discover in time during the working process, and reducing the maintenance cost.

[0004] However, the above technical solution still has certain defects. The above technical solution holds the chip body by an airbag, making it difficult for external heat to transfer to the chip, thereby reducing the risk of chip overheating damage. However, it ignores the large amount of heat generated during the operation of the chip itself. There is a gap between the chip body and the upper packaging board, resulting in the heat generated by the chip itself during operation being unable to be efficiently transferred to the radiator, leading to chip damage. Therefore, a hybrid packaging structure for an integrated circuit chip is proposed. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a hybrid packaging structure for an integrated circuit chip, which can efficiently transfer the heat generated by the chip body to the radiator, improving the service life and performance of the chip.

[0006] A hybrid packaging structure of an integrated circuit chip provided by an embodiment of the present invention includes an outer packaging layer, the outer packaging layer includes a bottom fixing plate layer, an inner wall of the bottom fixing plate layer is sleeved with a chip assembly, the chip assembly includes a chip body, a bottom end of the chip body is electrically connected with multiple groups of pins, an outer wall of the multiple groups of pins is sleeved with buffer pads, an outer wall of the chip body is sleeved with a sealing sleeve located below the buffer pads, the sealing sleeve is slidably sleeved on the outer wall of the multiple groups of pins, and a top end of the chip body is sleeved with a heat dissipation layer located inside the outer packaging layer;

[0007] The heat dissipation layer includes a sealing silica gel pad located inside the sealing sleeve, the sealing silica gel pad is attached to the top end of the chip body, a bottom end of the sealing silica gel pad is fixedly connected with multiple groups of convex strips, the multiple groups of convex strips respectively surround multiple cores of the chip body, the sealing silica gel pad is provided with grooves at the connection positions with the convex strips, a top end of the sealing silica gel pad is fixedly connected with a pressing strip, the pressing strip is located directly above the grooves, a top end of the sealing silica gel pad is fixedly connected with multiple groups of storage capsules, a side wall of each group of storage capsules is respectively communicated with a capillary tube, the capillary tube penetrates through the convex strip and extends above the chip body, and the multiple groups of storage capsules are filled with thermal conductive silicone grease.

[0008] According to some embodiments of the present invention, a top end of the convex strip is fixedly connected with multiple groups of copper foil layers, the multiple groups of copper foil layers are respectively located above a core of a group of chip bodies, and the copper foil layer and the convex strip form a sealed cavity above the core of the chip body.

[0009] According to some embodiments of the present invention, the outer packaging layer further includes an upper metal pressing cover, the upper metal pressing cover is slidably sleeved on an inner wall of the bottom fixing plate layer near the top end, and a bottom end of the upper metal pressing cover is attached to a top end of the multiple groups of storage capsules.

[0010] According to some embodiments of the present invention, multiple groups of capsules are fixedly connected to an inner wall of the bottom fixing plate layer near the edge, a top end of the multiple groups of capsules is attached to a bottom end of the upper metal pressing cover, a bottom end of each group of capsules is respectively communicated with multiple groups of glue outlets, the glue outlets extend to an inner wall of the bottom fixing plate layer, and the bottom fixing plate layer is provided with openings at positions where the glue outlets are in contact.

[0011] According to some embodiments of the present invention, an inner wall of the glue outlet is communicated with an hourglass-shaped glue sleeve, the glue outlet is provided with a through hole at the connection position with the hourglass-shaped glue sleeve, and two groups of elastic pieces are fixedly connected to a side wall of the hourglass-shaped glue sleeve, and ends of the two groups of elastic pieces are fixedly connected to an inner wall of the glue outlet.

[0012] According to some embodiments of the present invention, multiple groups of external connection mechanisms are fixedly sleeved at a bottom end of the bottom fixing plate layer, and a top end of each group of external connection mechanisms is respectively attached to a bottom end of a group of pins.

[0013] According to some embodiments of the present invention, the external connection mechanism includes a metal sleeve, the metal sleeve is fixedly sleeved at the bottom end of the bottom fixing plate layer, the top end of the metal sleeve is attached to the bottom end of the pin, and a ceramic ring is fixedly sleeved at a position near the bottom end of the inner wall of the metal sleeve. The ceramic ring is made of a heat-insulating material.

[0014] According to some embodiments of the present invention, a conductive seat is slidably sleeved on the inner wall of the ceramic ring. The top end of the conductive seat extends to the inner wall of the metal sleeve. Two spring strips are fixedly connected to the top end of the conductive seat, and the top ends of the spring strips are fixedly connected to the top end of the metal sleeve.

[0015] According to some embodiments of the present invention, multiple sets of clamping jaws are fixedly connected to the top end of the conductive seat. Two carbon sheets are respectively fixedly connected to the ends of each set of clamping jaws. A conductive bar is slidably arranged between the two carbon sheets at the end of the same clamping jaw, and the conductive bar is fixedly connected to the inner wall of the metal sleeve.

[0016] In summary, the present invention mainly has the following beneficial effects:

[0017] 1. When the heat sink is installed on the main board in the present invention, the metal seat of the heat sink is attached to the outer wall of the upper metal cover, and the upper metal cover is pushed to slide on the inner wall of the bottom fixing plate layer, so that the thermal grease inside the stock pocket flows between the copper foil layer and the convex strip. As a result, the heat generated by the chip body can be efficiently transferred to the heat sink, and when the chip is not assembled on the main board, the thermal grease is located inside the stock pocket, avoiding the random flow of the thermal grease inside the packaging structure;

[0018] 2. After the chip is fixed on the main board in the present invention, when the heat sink is installed, the resin glue inside the capsule flows out from the glue outlet nozzle, and the resin glue is distributed at the edge of the bottom fixing plate layer, thereby fixedly connecting the edge of the bottom fixing plate layer and the main board together. The chip is not likely to become loose on the main board, and the connection between the conductive seat and the main board is sealed, thus avoiding the problem of solder joint oxidation and loosening in the later stage;

[0019] 3. When the upper metal cover is under pressure in the present invention, the liquid materials inside the capsule and the stock pocket flow out, thus playing a role in relieving the pressure to a certain extent. The conductive seat slides inside the ceramic ring, compressing the spring strips, so that the pressure exerted by the heat sink on the upper metal cover will not damage the chip. The ceramic ring insulates heat, and the contact area between the conductive seat and the metal sleeve is small. In addition, a buffer pad and a sealing sleeve are provided outside the chip body, so that the heat on the main board is not easily transferred to the chip body, avoiding the heat generated by other electronic components from being transferred to the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1Schematic diagram of the bottom structure of the encapsulation structure of the present invention;

[0021] Figure 2 Schematic diagram of the explosion structure of the sub-packaging structure of the present invention;

[0022] Figure 3 Schematic diagram of the bottom view structure of the heat dissipation layer of the present invention;

[0023] Figure 4 Schematic diagram of the top view structure of the heat dissipation layer of the present invention;

[0024] Figure 5 Schematic diagram of the cross-sectional structure of the encapsulation structure of the present invention;

[0025] Figure 6 Schematic diagram of the cross-sectional structure of the chip component of the present invention;

[0026] Figure 7 Schematic diagram of the cross-sectional structure of the external connection mechanism of the present invention;

[0027] Figure 8 Schematic diagram of the layer structure of the capsule and the bottom fixing plate of the present invention;

[0028] Figure 9 Schematic diagram of the cross-sectional structure of the capsule of the present invention;

[0029] Figure 10 Of the present invention Figure 9 Enlarged structure diagram at position A.

[0030] In the figure: 1. Outer encapsulation layer; 2. Heat dissipation layer; 3. External connection mechanism; 4. Chip component;

[0031] 101. Bottom fixing plate layer; 102. Upper metal pressing cover; 103. Capsule; 104. Glue outlet nozzle; 105. Through hole; 106. Hourglass-shaped rubber sleeve; 107. Elastic sheet;

[0032] 201. Sealing silica gel pad; 202. Convex strip; 203. Groove; 204. Pressing strip; 205. Copper foil layer; 206. Storage bladder; 207. Capillary tube;

[0033] 301. Metal sleeve; 302. Ceramic ring; 303. Conductive seat; 304. Claw; 305. Carbon sheet; 306. Conductive strip; 307. Spring strip;

[0034] 401. Chip body; 402. Pin; 403. Buffer pad; 404. Sealing sleeve. Detailed implementation manners

[0035] Examples of the embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0036] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0037] In the description of the present invention, the meaning of multiple groups is more than two. Understandings such as greater than, less than, exceeding, etc. do not include the present number, and understandings such as above, below, within, etc. include the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0038] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.

[0039] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments:

[0040] A hybrid packaging structure of an integrated circuit chip, as Figures 1 to 10 shown, includes an outer packaging layer 1. The outer packaging layer 1 includes a bottom fixing plate layer 101. A chip component 4 is sleeved on the inner wall of the bottom fixing plate layer 101. The chip component 4 includes a chip main body 401. A plurality of groups of pins 402 are electrically connected to the bottom end of the chip main body 401. A buffer pad 403 is sleeved on the outer wall of the plurality of groups of pins 402. A sealing sleeve 404 is sleeved on the outer wall of the chip main body 401 and is located below the buffer pad 403. The sealing sleeve 404 is slidably sleeved on the outer wall of the plurality of groups of pins 402. A heat dissipation layer 2 is sleeved on the top end of the chip main body 401 and is located inside the outer packaging layer 1;

[0041] The heat dissipation layer 2 includes a sealed silicone pad 201 located inside the seal 404. The sealed silicone pad 201 is attached to the top of the chip body 401. The bottom end of the sealed silicone pad 201 is fixedly connected with multiple groups of ridges 202. The multiple groups of ridges 202 respectively surround multiple cores of the chip body 401. A groove 203 is provided at the connection of the sealed silicone pad 201 and the ridges 202. The top end of the sealed silicone pad 201 is fixedly connected with a pressure strip 204. The pressure strip 204 is located directly above the groove 203. The top end of the sealed silicone pad 201 is fixedly connected with multiple groups of material storage sacs 206. A capillary 207 is communicated with the side wall of each group of material storage sacs 206. The capillary 207 penetrates through the ridge 202 and extends above the chip body 401. The multiple groups of material storage sacs 206 are filled with thermal grease. The top end of the ridge 202 is fixedly connected with multiple groups of copper foil layers 205. The multiple groups of copper foil layers 205 are respectively located above the cores of a group of chip bodies 401. The copper foil layer 205 and the ridge 202 form a sealed cavity above the core of the chip body 401.

[0042] During the process of computer assembly by the user, the entire integrated circuit chip is installed in the CPU socket on the motherboard. Then when the user installs the radiator, the radiator is fixed to the motherboard by bolts, so that the metal seat of the radiator presses on the outer wall of the upper metal cover 102, thereby pushing the upper metal cover 102 to slide on the inner wall of the bottom fixing plate layer 101, so that the upper metal cover 102 squeezes the material storage sac 206. At this time, the thermal grease inside the material storage sac 206 flows out from the inside of the capillary 207, so that the thermal grease flows to the outside of the chip body 401. At this time, the sealed space formed by the ridge 202 and the copper foil layer 205 is filled with thermal grease. Then as the upper metal cover 102 is further pressed down, the upper metal cover 102 pushes the pressure strip 204. The pressure strip 204 is located directly above the groove 203. So at this time, as the pressure strip 204 is pressed down, the groove 203 deforms, thereby squeezing the ridge 202 to closely fit around the outside of the core of the chip body 401, so that the thermal grease on the chip body 401 is blocked by the ridge 202 and the copper foil layer 205 and cannot flow randomly, preventing the thermal grease from flowing into other parts, thus avoiding the appearance of cavities in the space formed by the ridge 202 and the copper foil layer 205 that affect heat dissipation, and at this time the upper metal cover 102 is in close contact with the copper foil layer 205.

[0043] Please refer with emphasis to Figure 1 、 Figure 2 、 Figure 5 、 Figure 8 、 Figure 9 and Figure 10The outer packaging layer 1 further comprises an upper metal pressure cover 102, which is slidably sleeved on the inner wall of the bottom fixed plate layer 101 near the top, and the bottom end of the upper metal pressure cover 102 is attached to the top of multiple groups of storage capsules 206, and multiple groups of capsules 103 are fixedly connected to the inner wall of the bottom fixed plate layer 101 near the edge, and the tops of the multiple groups of capsules 103 are attached to the bottom end of the upper metal pressure cover 102, and the bottom end of each group of capsules 103 is respectively connected to multiple groups of glue nozzles 106. 4. The glue nozzle 104 extends to the inner wall of the bottom fixed plate layer 101, and the bottom fixed plate layer 101 is provided with an opening at the contact position with the glue nozzle 104. The inner wall of the glue nozzle 104 is connected with an hourglass-shaped rubber sleeve 106. The glue nozzle 104 is provided with a through hole 105 at the connection position with the hourglass-shaped rubber sleeve 106. The side wall of the hourglass-shaped rubber sleeve 106 is fixedly connected with two groups of elastic sheets 107, and the ends of the two groups of elastic sheets 107 are fixedly connected to the inner wall of the glue nozzle 104.

[0044] When the upper metal pressure cover 102 is pushed by the radiator, the upper metal pressure cover 102 squeezes the capsule 103, so that the pressure inside the capsule 103 increases, so that the resin glue inside the capsule 103 opens the hourglass-shaped rubber sleeve 106, and the two sets of elastic sheets 107 are bent. At this time, the resin glue passes through the hourglass-shaped rubber sleeve 106 and flows out of the through hole 105. Before the radiator is installed, the elastic force of the elastic sheet 107 closes the hourglass-shaped rubber sleeve 106, and the pressure of the resin glue inside the capsule 103 cannot open the hourglass-shaped rubber sleeve 106, so the resin glue cannot flow out from the opening, and then the resin glue flows to the surrounding of the bottom fixed plate layer 101 along the opening. , and part of the resin glue does not completely flow out inside the opening, so that the resin glue extends from the edge of the bottom fixed plate layer 101 to the inside of the opening, so that the resin glue has enough contact area with the bottom fixed plate layer 101 after solidification, and the connection between the conductive seat 303 and the mainboard is sealed, thereby preventing moisture in the outside air from causing oxidation corrosion to the welding point between the conductive seat 303 and the mainboard, making the chip and the mainboard connected more tightly, and when the radiator is disassembled later, it is not easy for the radiator to adhere to the CPU and cause the CPU to be forced to be pulled out of the CPU base, thereby avoiding damage to the mainboard and chip.

[0045] Please refer to Figure 1 , Figure 2 , Figure 5 and Figure 7, a plurality of external connection mechanisms 3 are fixedly sleeved at the bottom end of the bottom fixing plate layer 101. The top ends of each group of the external connection mechanisms 3 are respectively attached to the bottom ends of a group of pins 402. The external connection mechanism 3 includes a metal sleeve 301. The metal sleeve 301 is fixedly sleeved at the bottom end of the bottom fixing plate layer 101. The top end of the metal sleeve 301 is attached to the bottom end of the pin 402. A ceramic ring 302 is fixedly sleeved at a position near the bottom end of the inner wall of the metal sleeve 301. The ceramic ring 302 is made of a heat-insulating material. A conductive seat 303 is slidably sleeved on the inner wall of the ceramic ring 302. The top end of the conductive seat 303 extends into the inner wall of the metal sleeve 301. Two spring strips 307 are fixedly connected to the top end of the conductive seat 303. The top ends of the spring strips 307 are fixedly connected to the top end of the metal sleeve 301. A plurality of clamping jaws 304 are fixedly connected to the top end of the conductive seat 303. Two carbon sheets 305 are respectively fixedly connected to the ends of each group of the clamping jaws 304. A conductive bar 306 is slidably arranged between the two carbon sheets 305 at the end of the same clamping jaw 304. The conductive bar 306 is fixedly connected to the inner wall of the metal sleeve 301.

[0046] When installing the radiator, the pressure received by the entire packaging structure causes the liquid materials inside the capsule 103 and the storage capsule 206 to flow out, thus playing a role in relieving pressure to a certain extent. At the same time, the conductive seat 303 also slides relative to the ceramic ring 302 under the action of the downward pressure, causing the conductive seat 303 to drive the clamping jaws 304 to slide inside the metal sleeve 301, so that relative sliding occurs between the carbon sheets 305 and the conductive bar 306. The carbon sheets 305 have excellent electrical conductivity, so the conductive seat 303 still maintains electrical connection with the metal sleeve 301. The spring strips 307 are compressed by the conductive seat 303, thus avoiding the pressure applied by the heat dissipation exceeding the bearing limit of the conductive seat 303 and preventing phenomena such as bending of the conductive seat 303. The heat-insulating ability of the ceramic ring 302 and the connection of the conductive seat 303 to the metal sleeve 301 through the carbon sheets 305 with a small area make the heat received by the conductive seat 303 not easily transferred to the outer packaging layer 1, avoiding the heat generated by other electronic components from being transferred to the chip body 401, playing a protective role for the entire chip and extending the service life of the chip.

[0047] When in use, when the heat sink is installed on the motherboard, the metal seat of the heat sink fits against the outer wall of the upper metal cover 102, and pushes the upper metal cover 102 to slide on the inner wall of the bottom fixing plate layer 101, so that the thermal grease inside the material storage bag 206 flows between the copper foil layer 205 and the rib 202. Thus, the heat generated by the chip body 401 can be efficiently transferred to the heat sink, and when the chip is not assembled on the motherboard, the thermal grease is located inside the material storage bag 206, avoiding the random flow of the thermal grease inside the packaging structure. The parts not involved in this device are the same as or can be implemented by the prior art.

[0048] Although the embodiments of the present invention have been shown and described, the specific embodiments are only interpretations of the present invention and not limitations thereof. The specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art can make modifications, substitutions and variations that do not contribute creatively to the embodiments according to needs, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. A hybrid packaging structure for an integrated circuit chip, comprising an outer packaging layer (1), characterized in that: The outer encapsulation layer (1) includes a bottom fixing plate layer (101). The inner wall of the bottom fixing plate layer (101) is sleeved with a chip assembly (4). The chip assembly (4) includes a chip body (401). The bottom end of the chip body (401) is electrically connected with multiple groups of pins (402). A buffer pad (403) is sleeved on the outer wall of the multiple groups of pins (402). A sealing sleeve (404) is sleeved on the outer wall of the chip body (401) and is located below the buffer pad (403). The sealing sleeve (404) is slidably sleeved on the outer wall of the multiple groups of pins (402). A heat dissipation layer (2) is sleeved on the top end of the chip body (401) and is located inside the outer encapsulation layer (1). The heat dissipation layer (2) includes a sealing silica gel pad (201) located inside the sealing sleeve (404). The sealing silica gel pad (201) is attached to the top end of the chip body (401). The bottom end of the sealing silica gel pad (201) is fixedly connected with multiple groups of ridges (202). The multiple groups of ridges (202) respectively surround multiple cores of the chip body (401). A groove (203) is arranged at the connection position of the sealing silica gel pad (201) and the ridges (202). A pressing strip (204) is fixedly connected to the top end of the sealing silica gel pad (201). The pressing strip (204) is located directly above the groove (203). The top end of the sealing silica gel pad (201) is fixedly connected with multiple groups of storage capsules (206). Each group of storage capsules (206) is communicated with a capillary tube (207) on the side wall. The capillary tube (207) penetrates through the ridge (202) and extends above the chip body (401). The multiple groups of storage capsules (206) are filled with thermal grease. The outer encapsulation layer (1) further includes an upper metal pressing cover (102). The upper metal pressing cover (102) is slidably sleeved on the inner wall of the bottom fixing plate layer (101) at the top position. The bottom end of the upper metal pressing cover (102) is attached to the top ends of the multiple groups of storage capsules (206).

2. The hybrid packaging structure of the integrated circuit chip according to claim 1, wherein: The top ends of the ridges (202) are fixedly connected with multiple groups of copper foil layers (205). The multiple groups of copper foil layers (205) are respectively located above the cores of a group of chip bodies (401). The copper foil layer (205) and the ridge (202) form a sealed cavity above the core of the chip body (401).

3. The hybrid packaging structure of the integrated circuit chip according to claim 1, wherein: Multiple groups of capsules (103) are fixedly connected to the inner wall of the bottom fixing plate layer (101) near the edge. The top ends of the multiple groups of capsules (103) are attached to the bottom end of the upper metal pressing cover (102). Each group of capsules (103) is respectively communicated with multiple groups of glue outlets (104). The glue outlets (104) extend to the inner wall of the bottom fixing plate layer (101). The bottom fixing plate layer (101) is provided with an opening at the position where it contacts the glue outlet (104).

4. The hybrid packaging structure of the integrated circuit chip according to claim 3, wherein: The inner wall of the glue outlet nozzle (104) is connected to an hourglass-shaped glue sleeve (106). A through hole (105) is provided at the connection between the glue outlet nozzle (104) and the hourglass-shaped glue sleeve (106). Two groups of elastic pieces (107) are fixedly connected to the side wall of the hourglass-shaped glue sleeve (106), and the ends of the two groups of elastic pieces (107) are fixedly connected to the inner wall of the glue outlet nozzle (104).

5. The hybrid packaging structure of the integrated circuit chip according to claim 1, wherein: A plurality of external connection mechanisms (3) are fixedly sleeved at the bottom end of the bottom fixing plate layer (101), and the top ends of each group of external connection mechanisms (3) are respectively attached to the bottom end of a group of pins (402).

6. The hybrid packaging structure of the integrated circuit chip according to claim 5, wherein: The external connection mechanism (3) includes a metal sleeve (301). The metal sleeve (301) is fixedly sleeved at the bottom end of the bottom fixing plate layer (101). The top end of the metal sleeve (301) is attached to the bottom end of the pin (402). A ceramic ring (302) is fixedly sleeved at a position near the bottom end of the inner wall of the metal sleeve (301), and the ceramic ring (302) is made of a heat-insulating material.

7. The hybrid packaging structure of the integrated circuit chip according to claim 6, characterized in that: A conductive seat (303) is slidably sleeved on the inner wall of the ceramic ring (302). The top end of the conductive seat (303) extends to the inner wall of the metal sleeve (301). Two groups of spring strips (307) are fixedly connected to the top end of the conductive seat (303), and the top ends of the spring strips (307) are fixedly connected to the top end of the metal sleeve (301).

8. The hybrid packaging structure of the integrated circuit chip according to claim 7, characterized in that: A plurality of clamping jaws (304) are fixedly connected to the top end of the conductive seat (303). Two groups of carbon sheets (305) are respectively fixedly connected to the ends of each group of clamping jaws (304). A conductive bar (306) is slidably arranged between the two groups of carbon sheets (305) at the end of the same clamping jaw (304), and the conductive bar (306) is fixedly connected to the inner wall of the metal sleeve (301).

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