Chip double-sided liquid cooling heat dissipation system and assembly method

Abstract

The invention relates to the technical field of chip heat dissipation, in particular to a chip double-sided liquid cooling heat dissipation system which comprises a fixing mechanism, a chip and a substrate, the two sides of the chip are symmetrically, evenly and fixedly connected with a plurality of pins, and the chip is electrically connected with the substrate through the pins on the two sides. According to the invention, by simultaneously carrying out liquid cooling heat dissipation on the two surfaces of the chip, heat generated by the chip can be quickly and effectively removed, the heat dissipation requirement of the high-power-consumption chip is met, the chip is ensured to work in a stable temperature environment, the problem of heat dissipation of the high-power and multi-module chip is effectively solved, and the service life of the chip is prolonged. A large temperature difference caused by uneven heat dissipation of the upper surface and the lower surface of the chip is avoided, the overall temperature distribution of the chip is more uniform, stable performance of the chip is facilitated, the liquid leakage condition of the device is detected in real time through the liquid leakage detector, a liquid leakage signal is processed and then transmitted to the audible and visual alarm, and the device is convenient to use. And the audible and visual alarm sends out an audible and visual alarm signal, so that the use safety of the device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and in particular to a chip double-sided liquid cooling system and an assembly method. Background Art

[0002] With the rapid development of electronic technology, the performance of chips continues to improve, and their power consumption has also increased significantly. Most of the existing heat dissipation technologies use air cooling, liquid cooling, immersion and other methods to perform single-sided heat dissipation on chips. With the rapid development of semiconductor technology, chips show a trend of high integration, complexity and high frequency. Especially for the structure of multi-DIE chips and multi-module chips, when the power is large, the heat generated by the chip also increases, becoming a key factor hindering the improvement of chip performance and reliability. Therefore, single-sided heat dissipation technology is difficult to solve the heat dissipation problem of the above chip structure.

[0003] At present, liquid cooling technology is gradually being used, but most of the existing liquid cooling structures only cool one side of the chip. However, during the operation of the chip, not only a large amount of heat will be generated on the top, but also heat will accumulate in the bottom contact parts such as the circuit board due to the operation of electrical components and heat conduction. The single-sided liquid cooling method cannot effectively dissipate the heat at the bottom of the chip, resulting in limited overall heat dissipation efficiency of the chip, which in turn affects the performance and stability of the chip.

[0004] For example, the Chinese patent CN113594112B is "a stacked liquid cooling heat dissipation module structure for a double-sided chip". The structure is sequentially provided with three layers of board structure, each layer of the board structure is provided with a liquid cooling channel, and the chip is installed between the three layers of board to achieve double-sided heat dissipation of the chip.

[0005] Although the structure in the above technical solution can achieve heat dissipation on both sides of the chip, the excessive number of board layers will increase the thermal resistance layer, resulting in unsatisfactory heat dissipation effect. More importantly, the heat dissipation structure cannot achieve direct contact heat dissipation of the chip, and will still cause the temperature of the chip to be too high, thereby causing chip performance degradation or even damage.

[0006] In view of this, the present application proposes a chip double-sided liquid cooling system and assembly method. Summary of the invention

[0007] The purpose of the present invention is to provide a chip double-sided liquid cooling system and assembly method to solve the problems in the existing double-sided chip cooling technology that too many thermal resistance layers affect its heat dissipation effect and the chip temperature is too high due to poor chip heat dissipation effect, which leads to chip performance degradation or even damage.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A double-sided liquid cooling heat dissipation system for a chip comprises a fixing mechanism, a chip and a substrate, wherein two sides of the chip are symmetrically and evenly fixedly connected with a plurality of pins, and the chip is electrically connected to the substrate through the plurality of pins on both sides, and further comprises a cooling circulation mechanism, and the liquid cooling heat dissipation mechanism is symmetrically arranged on the upper and lower sides of the chip, and the liquid cooling heat dissipation mechanism comprises a fixing plate, a cover plate, a liquid inlet pipe and a liquid outlet pipe, the outer edge of the cover plate is fixedly connected with a sealing strip 1, the two ends of the cover plate are fixedly installed to the top end of the fixing plate, a cavity is provided inside the fixing plate, and two cooling grooves are symmetrically penetrated through the bottom of the fixing plate, one end of the liquid inlet pipe is symmetrically fixedly connected with two cooling pipes, one end of the two cooling pipes is fixedly connected with the two ends of the liquid outlet pipe, a sealing strip 2 is provided on the inner side of the cooling groove, and the top of the cooling groove The cover plate is fixedly connected to the bottom of the cooling tube, one end of the liquid inlet pipe and the liquid outlet pipe are fixedly connected to one end of the fixing plate, two ends of the bottom of the fixing plate are symmetrically and evenly penetrated with a plurality of connecting holes, and the top of the connecting hole is fixedly connected with a heat conducting plate, a liquid cooling plate is welded on one side of the heat conducting plate, and one end of the liquid cooling plate extends to the inside of the cooling tube, two ends of the top of the cover plate are symmetrically and evenly penetrated with a plurality of strip holes, the top of the heat conducting plate is penetrated with a strip hole extending to above the cover plate, the fixing mechanism is used to fix the chip, the substrate and the upper and lower liquid-cooling heat dissipation mechanisms, one end of the liquid inlet pipe and the liquid outlet pipe are fixedly connected to one end of the cooling circulation mechanism, and the cooling circulation mechanism is used to transport the cooling liquid to the liquid inlet pipe, and then cool the cooling liquid in the liquid outlet pipe for recycling.

[0010] Furthermore, the fixing mechanism includes a base, a liquid receiving box and a liquid leakage detector, the top of the liquid receiving box is fixedly connected to the bottom of the liquid leakage detector, and the bottom of the liquid receiving box is fixedly installed to one end of the base, one end of the liquid leakage detector is fixedly connected to an audible and visual alarm, four conduits are fixedly connected to the two ends of the top of the liquid receiving box, leakage holes are symmetrically opened at both ends of the cavity, and one end of the conduit is fixedly connected to the outside of the leakage hole.

[0011] Furthermore, two mounting seats are symmetrically fixedly installed at both ends of the top of the base, multiple holes are symmetrically opened at both ends of the mounting seats, and the outer sides of the holes are fixedly connected with mounting blocks, and multiple plug-in plates are symmetrically fixedly connected at both ends of the fixed plate, and one end of the plug-in plate is penetrated by a hole and fixedly connected to the mounting block.

[0012] Furthermore, a slot is provided on the inner side of the mounting seat, and two ends of the substrate are plugged into the inner side of the slot.

[0013] Furthermore, the cooling circulation mechanism includes a fixing seat, a sealing cover, a cooling pump, a radiator, a liquid guide pipe and a liquid return pipe. The interior of the fixing seat is fixedly connected to a storage tank, and the top of the fixing seat is fixedly connected to a controller.

[0014] Furthermore, the top of the storage tank is fixedly connected to the bottom of the sealing cover, and the bottom end of the storage tank is fixedly connected to a liquid exchange pipe, one side of the fixed seat is fixedly installed to the outside of the cooling pump, and the other side of the fixed seat is fixedly installed to the outside of the radiator.

[0015] Furthermore, one end of the cooling pump is fixedly connected to the top of the liquid extraction pipe, one end of the liquid extraction pipe is fixedly connected to the bottom end of the storage tank, and the other end of the liquid extraction pipe is fixedly connected to one end of the liquid guide pipe.

[0016] Furthermore, one end of the liquid return pipe is fixedly connected to one end of the radiator, and the other end of the liquid return pipe is fixedly connected to double-headed connecting pipe one, one end of the liquid guide pipe is fixedly connected to double-headed connecting pipe two, one end of the two liquid inlet pipes is fixedly connected to both ends of double-headed connecting pipe two, and one end of the two liquid outlet pipes is fixedly connected to both ends of double-headed connecting pipe one.

[0017] A method for assembling a chip double-sided liquid cooling system comprises the following steps:

[0018] S1. Fix the outer edges of the cover plates of the upper and lower liquid-cooling heat dissipation mechanisms to the top of the fixed plate through a sealing strip 1, insert the two ends of the base plate into the inner slots of the two mounting seats respectively, insert the two end plug-in plates of the lower liquid-cooling heat dissipation mechanism into the plug-in holes, place the chip at the top position of the lower liquid-cooling heat dissipation mechanism, and electrically connect the multiple pins on both sides of the chip to the base plate, then insert the two end plug-in plates of the upper liquid-cooling heat dissipation mechanism into the plug-in holes, and finally connect the upper and lower liquid-cooling heat dissipation mechanisms to the mounting block through bolts;

[0019] S2, respectively installing the two mounting seats at corresponding positions on the top of the base, fixing the upper and lower liquid cooling mechanisms, the chip and the substrate through a fixing mechanism, and connecting the multiple conduits with the multiple leakage holes;

[0020] S3, the two ends of the double-ended connecting tube 1 are connected to the two liquid outlet pipes, the two ends of the double-ended connecting tube 2 are connected to the two liquid inlet pipes, and the outer side of the cooling tube and one end of the heat conducting sheet are in contact with the upper and lower surfaces of the chip;

[0021] S4. The controller controls the cooling pump and the radiator to be turned on. The cooling pump delivers the coolant in the storage tank to the liquid inlet pipe through the liquid extraction pipe and the liquid guide pipe. The coolant in the liquid inlet pipe flows along the cooling pipe to the liquid outlet pipe, thereby taking away the heat generated by the chip. The coolant in the liquid outlet pipe returns to the radiator for cooling, and then flows back to the storage tank for recycling.

[0022] Beneficial effects of the present invention:

[0023] 1. In the present invention, the upper and lower liquid-cooled heat dissipation mechanisms, the chip and the substrate are fixed by a fixing mechanism. The upper and lower liquid-cooled heat dissipation mechanisms are respectively fixed on the upper and lower surfaces of the chip, and the outer side of the cooling tube and one end of the heat conductive sheet are in contact with the upper and lower surfaces of the chip. The cooling liquid in the storage tank can be transported to the liquid inlet pipe by a cooling pump. The cooling liquid in the liquid inlet pipe flows along the two cooling tubes. After the cooling liquid in the cooling tube flows to the liquid outlet pipe, it returns to the radiator through the liquid return pipe for cooling. The cooling liquid after the radiator is cooled returns to the storage tank for recycling. Through the above structure, the cooling liquid can flow through two parallel cooling channels formed in the two cooling tubes to realize the cooling of the cooling liquid. Uniform flow in the flow channel, and several heat conducting sheets can conduct the heat on the chip surface upward and downward, thereby effectively taking away the heat generated by the top and bottom of the chip, realizing the recycling of the coolant. By simultaneously performing liquid cooling on both sides of the chip, the heat dissipation efficiency is greatly improved, and the heat generated by the chip can be quickly and effectively removed to meet the heat dissipation requirements of high-power chips, ensuring that the chip works in a stable temperature environment, effectively solving the heat dissipation problem of high-power, multi-module chips, and effectively avoiding the large temperature difference between the upper and lower surfaces of the chip due to uneven heat dissipation, making the overall temperature distribution of the chip more uniform, which is conducive to the stable performance of the chip and reduces the risk of failure caused by local overheating;

[0024] 2. In the present invention, by arranging a sealing strip 1 at the connection between the cover plate and the fixed plate, and arranging a sealing strip 2 at the connection between the cooling groove and the cooling pipe, the overall sealing property, later service life and stability of the device are made more stable. By arranging a liquid receiving box, a leakage detector, an audible and visual alarm and a conduit, when the coolant in the cooling pipe leaks, the leaked coolant flows into the liquid receiving box through the leakage hole and the conduit, and the leakage detector can detect the leakage of the device in real time, thereby transmitting the leakage signal to the audible and visual alarm after processing, and the audible and visual alarm sends out an audible and visual alarm signal to remind the staff that the device is leaking, thereby improving the safety of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0026] Figure 2 It is a schematic diagram of the top view of the structure of a double-sided liquid cooling and heat dissipation system for a chip according to the present invention;

[0027] Figure 3 It is a schematic structural diagram of a cooling circulation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0028] Figure 4 It is a front cross-sectional view of a cooling circulation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0029] Figure 5 It is a schematic diagram of the rear structure of a fixing mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0030] Figure 6 It is a structural schematic diagram of a liquid cooling and heat dissipation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0031] Figure 7 A schematic diagram of the top view of the liquid cooling and heat dissipation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0032] Figure 8 A schematic diagram of the internal structure of a liquid cooling and heat dissipation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0033] Fig. 9 An exploded view of a liquid cooling and heat dissipation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention;

[0034] Fig.10 It is a front cross-sectional view of a liquid cooling and heat dissipation mechanism of a chip double-sided liquid cooling and heat dissipation system of the present invention.

[0035] In the figure: 1, fixing mechanism; 2, liquid cooling mechanism; 3, chip; 4, pin; 5, substrate; 6, cooling circulation mechanism; 11, base; 12, mounting seat; 13, mounting block; 14, liquid receiving box; 15, liquid leakage detector; 16, sound and light alarm; 17, catheter; 18, jack; 19, slot; 21, fixing plate; 22, cover plate; 23, sealing strip 1; 24, plug plate; 25, strip hole; 26, cavity; 27, liquid inlet pipe; 2 8. Liquid outlet pipe; 29. ​​Cooling pipe; 210. Cooling trough; 211. Connecting hole; 212. Liquid leakage hole; 213. Heat conducting plate; 214. Liquid cooling plate; 215. Sealing strip 2; 61. Fixing seat; 62. Controller; 63. Storage tank; 64. Sealing cover; 65. Cooling pump; 66. Radiator; 67. Liquid extraction pipe; 68. Liquid guide pipe; 69. Liquid return pipe; 610. Liquid exchange pipe; 611. Double-ended connecting pipe 1; 612. Double-ended connecting pipe 2. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] Example 1: Please refer to Figure 1 - Fig.10The present design proposes an implementation method, a double-sided liquid cooling and heat dissipation system for a chip, comprising a fixing mechanism 1, a chip 3 and a substrate 5, wherein a plurality of pins 4 are symmetrically and evenly fixedly connected on both sides of the chip 3, and the chip 3 is electrically connected to the substrate 5 through the plurality of pins 4 on both sides, and further comprises a cooling circulation mechanism 6, wherein liquid cooling and heat dissipation mechanisms 2 are symmetrically arranged on the upper and lower sides of the chip 3, and the liquid cooling and heat dissipation mechanisms 2 comprise a fixing plate 21, a cover plate 22, a liquid inlet pipe 27 and a liquid outlet pipe 28, wherein a sealing strip 23 is fixedly connected to the outer edge of the cover plate 22, and both ends of the cover plate 22 are fixedly installed with the top end of the fixing plate 21, and a cavity 26 is provided inside the fixing plate 21, and two cooling grooves 210 are symmetrically penetrated through the bottom of the fixing plate 21, and one end of the liquid inlet pipe 27 is symmetrically fixedly connected with two cooling pipes 29, and one end of the two cooling pipes 29 is fixedly connected with both ends of the liquid outlet pipe 28, and a sealing strip 215 is provided on the inner side of the cooling groove 210, and the cooling groove The top of 210 is fixedly connected to the bottom of the cooling tube 29, one end of the liquid inlet pipe 27 and the liquid outlet pipe 28 are fixedly connected to one end of the fixed plate 21, and a plurality of connecting holes 211 are symmetrically and evenly penetrated at both ends of the bottom of the fixed plate 21, and a heat conducting plate 213 is fixedly connected to the top of the connecting hole 211, and a liquid cooling plate 214 is welded to one side of the heat conducting plate 213, and one end of the liquid cooling plate 214 extends to the inside of the cooling tube 29, and a plurality of strip holes 25 are symmetrically and evenly penetrated at both ends of the top of the cover plate 22, and the strip hole 25 is penetrated at the top of the heat conducting plate 213 and extends to the top of the cover plate 22, and the fixing mechanism 1 is used to fix the chip 3, the substrate 5 and the upper and lower liquid cooling mechanisms 2, and one end of the liquid inlet pipe 27 and the liquid outlet pipe 28 are fixedly connected to one end of the cooling circulation mechanism 6, and the cooling circulation mechanism 6 is used to transport the cooling liquid to the liquid inlet pipe 27, and then cool the cooling liquid in the liquid outlet pipe 28 for recycling.

[0038] In this embodiment, the coolant can flow through two parallel cooling channels formed in the two cooling tubes 29 to achieve uniform flow of the coolant in the channels. At the same time, a number of heat conductive sheets 213 can conduct the heat on the surface of the chip 3 upward and downward. One end of the heat conductive sheet 213 extends to the outside of the strip hole 25. The heat generated by the chip 3 can be conducted to the outside of the device through the heat conductive sheet 213 on the one hand, and can be connected to the flowing coolant through the heat conductive sheet 213 and the liquid cooling sheet 214 on the other hand. The heat conductive sheet 213 and the liquid cooling sheet 214 are made of metal materials with high thermal conductivity, such as copper or aluminum, so as to effectively take away the heat generated at the top and bottom of the chip 3. By simultaneously performing liquid cooling on both sides of the chip 3, the heat generated by the chip 3 can be quickly and effectively removed, thereby meeting the heat dissipation requirements of the high-power chip 3.

[0039] Example 2: Please refer to Figure 1 - Fig.10The present design proposes an implementation method, a double-sided liquid cooling system for a chip, wherein a fixing mechanism 1 comprises a base 11, a liquid receiving box 14 and a liquid leakage detector 15, wherein the top of the liquid receiving box 14 is fixedly connected to the bottom of the liquid leakage detector 15, and the bottom of the liquid receiving box 14 is fixedly installed to one end of the base 11, and one end of the liquid leakage detector 15 is fixedly connected to an audible and visual alarm 16, and four conduits 17 are fixedly connected to the top and the two ends of the liquid receiving box 14, and liquid leakage holes 212 are symmetrically opened at the two ends of the cavity 26, and one end of the conduit 17 is connected to the liquid leakage hole 2 The outer side of the base 12 is fixedly connected, two mounting seats 12 are symmetrically fixedly installed at both ends of the top of the base 11, and multiple plug holes 18 are symmetrically opened at both ends of the mounting seats 12, and the outer side of the plug holes 18 is fixedly connected with the mounting block 13, and multiple plug plates 24 are symmetrically fixedly connected at both ends of the fixing plate 21, and one end of the plug plate 24 is penetrated by the plug hole 18 and fixedly connected with the mounting block 13, and a slot 19 is opened on the inner side of the mounting seat 12, and the two ends of the substrate 5 are plugged into the inner side of the slot 19, and the cooling circulation mechanism 6 includes a fixing seat 61, a sealing cover 6 4. A cooling pump 65, a radiator 66, a liquid guide tube 68 and a liquid return tube 69. The interior of the fixed seat 61 is fixedly connected to a storage tank 63, and the top of the fixed seat 61 is fixedly connected to a controller 62. The top of the storage tank 63 is fixedly connected to the bottom of the sealing cover 64, and the bottom of the storage tank 63 is fixedly connected to a liquid replacement tube 610. One side of the fixed seat 61 is fixedly installed with the outside of the cooling pump 65, and the other side of the fixed seat 61 is fixedly installed with the outside of the radiator 66. One end of the cooling pump 65 is fixedly connected to the top of the liquid extraction tube 67. One end of the liquid extraction pipe 67 is fixedly connected to the bottom end of the storage tank 63, and the other end of the liquid extraction pipe 67 is fixedly connected to one end of the liquid guiding pipe 68, one end of the liquid return pipe 69 is fixedly connected to one end of the radiator 66, and the other end of the liquid return pipe 69 is fixedly connected to the double-headed connecting pipe 1 611, one end of the liquid guiding pipe 68 is fixedly connected to the double-headed connecting pipe 2 612, one end of the two liquid inlet pipes 27 is fixedly connected to both ends of the double-headed connecting pipe 2 612, and one end of the two liquid outlet pipes 28 is fixedly connected to both ends of the double-headed connecting pipe 1 611.

[0040] In this embodiment, by providing a sealing strip 23 at the connection between the cover plate 22 and the fixed plate 21, and providing a sealing strip 215 at the connection between the cooling groove 210 and the cooling pipe 29, the overall sealing property, later service life and stability of the device are made more stable. By providing a liquid receiving box 14, a leakage detector 15, an audible and visual alarm 16 and a conduit 17, when the coolant in the cooling pipe 29 leaks, the leaked coolant flows into the liquid receiving box 14 through the leakage hole 212 and the conduit 17. The leakage detector 15 can detect the leakage of the device in real time, thereby transmitting the leakage signal to the audible and visual alarm 16 after processing. The audible and visual alarm 16 sends out an audible and visual alarm signal to remind the staff that the device is leaking, thereby improving the safety of the device.

[0041] Example 3: Please refer to Figure 1 - Fig.10 , this design proposes an implementation method, a chip double-sided liquid cooling heat dissipation system assembly method, including the following steps:

[0042] S1. Fix the outer edges of the cover plates 22 of the upper and lower liquid-cooling heat dissipation mechanisms 2 to the top of the fixing plate 21 through the sealing strip 23, insert the two ends of the substrate 5 into the inner slots 19 of the two mounting seats 12 respectively, and then insert the two end plug-in plates 24 of the lower liquid-cooling heat dissipation mechanism 2 into the plug-in holes 18, place the chip 3 at the top position of the lower liquid-cooling heat dissipation mechanism 2, and electrically connect the multiple pins 4 on both sides of the chip 3 to the substrate 5, and then insert the two end plug-in plates 24 of the upper liquid-cooling heat dissipation mechanism 2 into the plug-in holes 18, and finally connect the upper and lower liquid-cooling heat dissipation mechanisms 2 to the mounting block 13 through bolts;

[0043] S2, respectively installing the two mounting seats 12 at corresponding positions on the top of the base 11, fixing the upper and lower liquid cooling mechanisms 2, the chip 3 and the substrate 5 through the fixing mechanism 1, and connecting the multiple conduits 17 with the multiple leakage holes 212;

[0044] S3, both ends of the double-ended connecting tube 1 611 are connected to the two liquid outlet pipes 28, both ends of the double-ended connecting tube 2 612 are connected to the two liquid inlet pipes 27, and the outer side of the cooling tube 29 and one end of the heat conducting sheet 213 are in contact with the upper and lower surfaces of the chip 3;

[0045] S4. The controller 62 controls the cooling pump 65 and the radiator 66 to be turned on. The cooling pump 65 transports the coolant in the storage tank 63 to the liquid inlet pipe 27 through the liquid extraction pipe 67 and the liquid guide pipe 68. The coolant in the liquid inlet pipe 27 flows along the cooling pipe 29 to the liquid outlet pipe 28, thereby taking away the heat generated by the chip 3. The coolant in the liquid outlet pipe 28 returns to the radiator 66 for cooling, and then flows back to the storage tank 63 for recycling.

[0046] In the present invention, the outer edges of the cover plates 22 of the upper and lower liquid-cooled heat dissipation mechanisms 2 are fixed to the top of the fixed plate 21 through a sealing strip 23, and the upper and lower liquid-cooled heat dissipation mechanisms 2, the chip 3 and the substrate 5 are fixed through the fixing mechanism 1, so that the upper and lower liquid-cooled heat dissipation mechanisms 2 of the chip 3 maintain a stable position. The fixing mechanism 1 can use an insulating material with a certain thermal conductivity, such as ceramics or specific polymer materials, etc., on the one hand to prevent the chip 3 and the fixing mechanism 1 from being electrically short-circuited, and on the other hand to assist in conducting part of the heat of the chip 3. A plurality of conduits 17 are connected to a plurality of leakage holes 212, and both ends of the double-headed connecting tube 1 611 are connected to the two liquid outlet pipes 28, and both ends of the double-headed connecting tube 2 612 are connected to the two liquid inlet pipes 27. At this time, the upper and lower liquid-cooled heat dissipation mechanisms 2 are respectively fixed to the upper and lower surfaces of the chip 3, and the outer side of the cooling tube 29 and one end of the heat conductive sheet 213 are in contact with the upper and lower surfaces of the chip 3;

[0047] After the device is fixed, when the chip 3 is working, heat will be generated on the upper and lower surfaces. The cooling pump 65 and the radiator 66 are turned on by the controller 62. The cooling pump 65 can transport the coolant in the storage tank 63 to the liquid inlet pipe 27 through the liquid extraction pipe 67 and the liquid guide pipe 68. The coolant in the liquid inlet pipe 27 flows along the two cooling pipes 29. After the coolant in the cooling pipe 29 flows to the liquid outlet pipe 28, the coolant in the liquid outlet pipe 28 returns to the radiator 66 through the liquid return pipe 69 for cooling. The coolant after cooling by the radiator 66 returns to the storage tank 63 for recycling; through the above structure, the coolant can flow through two parallel cooling channels formed in the two cooling tubes 29 to achieve uniform flow of the coolant in the channels, and at the same time, a plurality of heat conducting sheets 213 can transfer the heat on the surface of the chip 3 upward and downward, and one end of the heat conducting sheet 213 extends to the outside of the strip hole 25. On the one hand, the heat generated by the chip 3 can be transferred to the outside of the device through the heat conducting sheet 213, and on the other hand, it can be connected to the flowing coolant through the heat conducting sheet 213 and the liquid cooling sheet 214. The heat conducting sheet 213 and the liquid cooling sheet 214 are connected to the flowing coolant. A metal material with high thermal conductivity, such as copper or aluminum, is used to effectively remove the heat generated at the top and bottom of the chip 3. The material of the fixing plate 21 and the cooling tube 29 can be selected from a metal material with high thermal conductivity, such as copper or aluminum, to improve the heat conduction efficiency. After the heat is removed, it is cooled by the radiator 66 and then flows back to the storage tank 63 to prepare for the next round of cyclic heat dissipation process, so as to realize the recycling of the coolant. By simultaneously performing liquid cooling on both sides of the chip 3, the heat dissipation efficiency is greatly improved, and the heat generated by the chip 3 can be quickly and effectively removed to meet the heat dissipation requirements of the high-power chip 3, ensuring that the chip 3 works in a stable temperature environment, effectively solving the heat dissipation problem of the high-power, multi-module chip 3, and effectively avoiding the large temperature difference caused by uneven heat dissipation on the upper and lower surfaces of the chip 3, so that the overall temperature distribution of the chip 3 is more uniform, which is conducive to the stable performance of the chip 3 and reduces the risk of failure caused by local overheating. The heat dissipation structure of the present invention can be adjusted and adapted accordingly according to chips 3 of different types and sizes, has strong versatility, and can be widely used in various chip 3 devices that require efficient heat dissipation;

[0048] By providing a sealing strip 1 23 at the connection between the cover plate 22 and the fixing plate 21, and providing a sealing strip 215 at the connection between the cooling groove 210 and the cooling pipe 29, the overall sealing and stability of the device are further improved, and the overall sealing and subsequent service life and stability of the device are more stable;

[0049] At the same time, by setting up a liquid receiving box 14, a leakage detector 15, an audible and visual alarm 16 and a conduit 17, one end of the conduit 17 is connected to the leakage hole 212. When the coolant in the cooling tube 29 leaks, the leaked coolant flows into the liquid receiving box 14 through the leakage hole 212 and the conduit 17. The leakage detector 15 can detect the leakage of the device in real time, and then transmit the leakage signal to the audible and visual alarm 16 after processing. The audible and visual alarm 16 sends out an audible and visual alarm signal to remind the staff that the device is leaking, thereby improving the safety of the device.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip double-sided liquid cooling system, comprising a fixing mechanism (1), a chip (3) and a substrate (5), wherein two sides of the chip (3) are symmetrically and evenly fixedly connected with a plurality of pins (4), and the chip (3) is electrically connected to the substrate (5) through the plurality of pins (4) on both sides, characterized in that: The invention also comprises a cooling circulation mechanism (6), wherein the upper and lower sides of the chip (3) are symmetrically provided with liquid cooling mechanisms (2), wherein the liquid cooling mechanisms (2) comprise a fixing plate (21), a cover plate (22), a liquid inlet pipe (27) and a liquid outlet pipe (28), wherein the outer edge of the cover plate (22) is fixedly connected with a sealing strip (23), the two ends of the cover plate (22) are fixedly mounted on the top of the fixing plate (21), the fixing plate (21) is provided with a cavity (26), and the fixing plate (21) is provided with a plurality of sealing strips (23). Two cooling grooves (210) are symmetrically formed through the bottom of the cooling groove (21), one end of the liquid inlet pipe (27) is symmetrically fixedly connected to two cooling pipes (29), one end of the two cooling pipes (29) is fixedly connected to the two ends of the liquid outlet pipe (28), a sealing strip 2 (215) is arranged on the inner side of the cooling groove (210), and the top of the cooling groove (210) is fixedly connected to the bottom of the cooling pipe (29), one end of the liquid inlet pipe (27) and the liquid outlet pipe (28) are both connected to the fixed plate ( The fixing plate (21) is fixedly connected to one end thereof, a plurality of connection holes (211) are symmetrically and evenly opened at both ends of the bottom of the fixing plate (21), and a heat conducting plate (213) is fixedly connected to the top of the connection hole (211), a liquid cooling plate (214) is welded to one side of the heat conducting plate (213), and one end of the liquid cooling plate (214) extends to the inside of the cooling pipe (29), a plurality of strip holes (25) are symmetrically and evenly opened at both ends of the top of the cover plate (22), and the heat conducting plate ( A strip hole (25) is formed at the top of the cover plate (213) and extends to the top of the cover plate (22). The fixing mechanism (1) is used to fix the chip (3), the substrate (5) and the upper and lower liquid cooling mechanisms (2). One end of the liquid inlet pipe (27) and the liquid outlet pipe (28) are fixedly connected to one end of the cooling circulation mechanism (6). The cooling circulation mechanism (6) is used to transport the cooling liquid to the liquid inlet pipe (27), and then cool the cooling liquid in the liquid outlet pipe (28) for recycling.

2. The chip double-sided liquid cooling heat dissipation system according to claim 1, characterized in that: The fixing mechanism (1) comprises a base (11), a liquid receiving box (14) and a liquid leakage detector (15); the top of the liquid receiving box (14) is fixedly connected to the bottom of the liquid leakage detector (15), and the bottom of the liquid receiving box (14) is fixedly installed to one end of the base (11); one end of the liquid leakage detector (15) is fixedly connected to an audible and visual alarm (16); four conduits (17) are fixedly connected to the two ends of the top of the liquid receiving box (14); liquid leakage holes (212) are symmetrically provided at the two ends of the cavity (26); and one end of the conduit (17) is fixedly connected to the outside of the liquid leakage hole (212).

3. The chip double-sided liquid cooling heat dissipation system according to claim 2, characterized in that: Two mounting seats (12) are symmetrically fixedly installed at both ends of the top of the base (11); a plurality of insertion holes (18) are symmetrically penetrated at both ends of the mounting seats (12); and the outer sides of the insertion holes (18) are fixedly connected to mounting blocks (13); a plurality of plugging plates (24) are symmetrically fixedly connected at both ends of the fixing plate (21); and one end of the plugging plate (24) is penetrated by the insertion hole (18) and fixedly connected to the mounting block (13).

4. The chip double-sided liquid cooling heat dissipation system according to claim 3, characterized in that: A slot (19) is provided on the inner side of the mounting seat (12), and two ends of the base plate (5) are plugged into the inner side of the slot (19).

5. The chip double-sided liquid cooling heat dissipation system according to claim 1, characterized in that: The cooling circulation mechanism (6) comprises a fixed seat (61), a sealing cover (64), a cooling pump (65), a radiator (66), a liquid guide pipe (68) and a liquid return pipe (69); a storage tank (63) is fixedly connected to the interior of the fixed seat (61), and a controller (62) is fixedly connected to the top of the fixed seat (61).

6. The chip double-sided liquid cooling heat dissipation system according to claim 5, characterized in that: The top of the storage tank (63) is fixedly connected to the bottom of the sealing cover (64), and the bottom end of the storage tank (63) is fixedly connected to a liquid exchange pipe (610), one side of the fixed seat (61) is fixedly installed to the outside of the cooling pump (65), and the other side of the fixed seat (61) is fixedly installed to the outside of the radiator (66).

7. The chip double-sided liquid cooling heat dissipation system according to claim 6, characterized in that: One end of the cooling pump (65) is fixedly connected to the top end of the liquid extraction pipe (67), one end of the liquid extraction pipe (67) is fixedly connected to the bottom end of the storage tank (63), and the other end of the liquid extraction pipe (67) is fixedly connected to one end of the liquid guide pipe (68).

8. The chip double-sided liquid cooling heat dissipation system according to claim 6, characterized in that: One end of the liquid return pipe (69) is fixedly connected to one end of the radiator (66), and the other end of the liquid return pipe (69) is fixedly connected to a double-ended connecting pipe (611). One end of the liquid guide pipe (68) is fixedly connected to a double-ended connecting pipe (612). One end of the two liquid inlet pipes (27) is fixedly connected to both ends of the double-ended connecting pipe (612). One end of the two liquid outlet pipes (28) is fixedly connected to both ends of the double-ended connecting pipe (611).

9. An assembly method for a chip double-sided liquid cooling and heat dissipation system, applicable to the chip double-sided liquid cooling and heat dissipation system according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. The outer edges of the cover plates (22) of the upper and lower liquid cooling and heat dissipation mechanisms (2) are fixed to the top of the fixed plate (21) by means of a sealing strip (23), the two ends of the base plate (5) are respectively inserted into the inner slots (19) of the two mounting seats (12), and then the two end plug-in plates (24) of the lower end liquid cooling and heat dissipation mechanism (2) are inserted into the insertion holes (18), the chip (3) is placed at the top position of the lower end liquid cooling and heat dissipation mechanism (2), and the multiple pins (4) on both sides of the chip (3) are electrically connected to the base plate (5), and then the two end plug-in plates (24) of the upper end liquid cooling and heat dissipation mechanism (2) are inserted into the insertion holes (18), and finally the upper and lower liquid cooling and heat dissipation mechanisms (2) are connected to the mounting block (13) by means of bolts; S2, respectively installing two mounting seats (12) at corresponding positions on the top of the base (11), fixing the upper and lower liquid cooling mechanisms (2), the chip (3) and the substrate (5) through the fixing mechanism (1), and connecting the plurality of conduits (17) to the plurality of liquid leakage holes (212); S3, the two ends of the double-ended connecting tube 1 (611) are connected to the two liquid outlet pipes (28), the two ends of the double-ended connecting tube 2 (612) are connected to the two liquid inlet pipes (27), and the outer side of the cooling tube (29) and one end of the heat conducting plate (213) are in contact with the upper and lower surfaces of the chip (3); S4. The controller (62) controls the cooling pump (65) and the radiator (66) to start. The cooling pump (65) delivers the cooling liquid in the storage tank (63) to the liquid inlet pipe (27) through the liquid extraction pipe (67) and the liquid guide pipe (68). The cooling liquid in the liquid inlet pipe (27) flows along the cooling pipe (29) to the liquid outlet pipe (28), thereby taking away the heat generated by the chip (3). The cooling liquid in the liquid outlet pipe (28) returns to the radiator (66) for cooling, and then flows back to the storage tank (63) for recycling.

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