Circuit substrate structure and manufacturing method thereof

Abstract

The invention discloses a circuit substrate structure and a manufacturing method thereof. The circuit substrate structure comprises a substrate, a solder resist connector, a support member and a chip. The substrate has a conductive structure. The solder resist connector is disposed on the substrate. The supporting piece is in contact with the solder resist combination piece, and the supporting piece is fixed on the substrate through the solder resist combination piece. The chip is arranged on the substrate, and the chip is electrically connected with the conductive structure.

Description

Technical Field

[0001] The present application relates to a circuit substrate structure and a manufacturing method thereof, and in particular to a circuit substrate structure using a solder resist material to fix a support member and a manufacturing method thereof. Background Art

[0002] In some packaging structures, the structural design makes the packaging structure have a larger volume. For example, a ceramic leaded chip carrier with pins or a vertical-cavity surface-emitting laser (VCSEL). Therefore, in such a packaging structure, a support member is usually provided on the substrate to support the stability of the structure or to raise the distance between the upper and lower substrates.

[0003] Generally speaking, the material of the support member is a non-conductive material (eg, an organic material). In addition to cost considerations, this can also avoid the possibility of circuit short circuits or other design difficulties.

[0004] In the prior art, adhesive is generally used to fix the support member on the substrate. However, the amount of adhesive applied is difficult to control, so there is a risk of excessive adhesive being easily adhered to the conductor or insufficient adhesive. In addition, after long-term use, the adhesive may age and negatively affect the reliability of the packaging structure.

[0005] Therefore, how to overcome the problems derived from the current use of adhesives to fix the support member through structural design improvements has become one of the important issues that the technical field wants to solve. Summary of the invention

[0006] The technical problem to be solved by the present application is to provide a circuit substrate structure and a manufacturing method thereof in view of the deficiencies of the prior art.

[0007] In order to solve the above technical problems, one of the technical solutions adopted in this application is to provide a circuit substrate structure. The circuit substrate structure includes a substrate, a solder resist combination, a support member and a chip. A conductive structure is arranged on the substrate. The solder resist combination is arranged on the substrate. The support member contacts the solder resist combination, and the support member is fixed to the substrate through the solder resist combination. The chip is arranged on the substrate, and the chip is electrically connected to the conductive structure.

[0008] In some embodiments, a bottom surface of the support member has a protrusion, the support member contacts the solder resist bonding member with the bottom surface, and the protrusion is embedded in the solder resist bonding member.

[0009] In some embodiments, the support member has a bottom surface and a top surface opposite to each other, the bottom surface is in contact with the solder resist bonding member, and an area of ​​the bottom surface is greater than an area of ​​the top surface.

[0010] In some embodiments, the support member is a non-conductive material.

[0011] In some embodiments, the material of the solder resist bonding element includes barium.

[0012] In some embodiments, no adhesive is included between the support and the substrate.

[0013] In order to solve the above-mentioned technical problems, another technical solution adopted in the present application is to provide a method for manufacturing a circuit substrate structure. The method for manufacturing a circuit substrate structure includes the following steps. Apply a solder resist material on a substrate having a conductive structure. Perform an exposure process on the solder resist material to divide the solder resist material into a retention area and a protection area. Set a support member on the solder resist material in the retention area so that the support member contacts the solder resist material. Perform a curing treatment, and the solder resist material in the retention area forms a solder resist bonding member, and the support member is fixed to the substrate through the solder resist bonding member. Perform a development process to remove the solder resist material in the protection area. Set a chip on the substrate, and the chip is electrically connected to the conductive structure.

[0014] In some embodiments, after the curing process, the solder resist material is transformed from a paste to a solid state, and then a development process is performed.

[0015] In some embodiments, after the curing process, a portion of the solder resist material in the remaining area forms a solder resist bonding member, and another portion of the solder resist material forms a solder resist protection member; wherein the solder resist protection member contacts the conductive structure.

[0016] One of the beneficial effects of the present application is that the circuit substrate structure and the manufacturing method thereof provided in the present application can improve the fixing effect of the support member on the substrate through the technical solutions of "the support member is in contact with the solder resist bonding member" and "the support member is fixed to the substrate through the solder resist bonding member", and can eliminate the use of adhesives.

[0017] To further understand the features and technical contents of the present application, please refer to the following detailed description and drawings of the present application. However, the drawings provided are only for reference and illustration and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic side view of the circuit substrate structure of the first embodiment of the present application.

[0019] Figures 2 to 6 Schematic diagram of the steps of the method for manufacturing the circuit substrate structure of the first embodiment of the present application.

[0020] Figure 7 It is a side view schematic diagram of a circuit substrate structure according to the second embodiment of the present application.

[0021] Figure 8 It is a side view schematic diagram of a circuit substrate structure according to the third embodiment of the present application.

[0022] Fig. 9 It is a side view schematic diagram of a circuit substrate structure according to a fourth embodiment of the present application.

[0023] Reference numerals:

[0024] 1: substrate; 10: through hole; 11: upper surface; 12: lower surface; 13: conductive structure; 2: solder resist material; 2A: retention area; 2B: protection area; 21: solder resist combination; 22: solder resist protection; 3: support member; 30: protrusion; 31: bottom surface; 32: top surface; 4: chip; 40: connector. DETAILED DESCRIPTION

[0025] The following is an explanation of the implementation methods of the "circuit substrate structure and its manufacturing method" disclosed in this application through specific specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the contents disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0026] In order to overcome the problems derived from the use of adhesives to set support members in the prior art, the present application provides a circuit substrate structure and a manufacturing method thereof that does not use adhesives. In the present application, the support member is fixed to the substrate by a solder resist material, and the solder resist material can replace the existing adhesive, thereby overcoming the problems derived from the use of adhesives in the past.

[0027] See also Figure 1 As shown, the circuit substrate structure of the present application includes: a substrate 1, a solder resist bonding member 21, a support member 3 and a chip 4.

[0028] The substrate 1 is used to support the solder resist bonding member 21 , the support member 3 and the chip 4 .

[0029] A patterned conductive structure 13 is disposed on the substrate 1. The conductive structure 13 can be selectively disposed on the upper surface 11, the lower surface 12 of the substrate 1, or disposed on both the upper surface 11 and the lower surface 12.

[0030] According to different structural designs, the substrate 1 may be formed with a through hole 10. Therefore, the conductive structure 13 may also be disposed in the through hole 10. In other words, the conductive structure 13 may be disposed through the upper surface 11 and the lower surface 12 of the substrate 1 to electrically connect the components on both sides of the substrate 1. For example, the chip 4 may be electrically connected to an external circuit through the conductive structure 13.

[0031] The substrate 1 can be a ceramic substrate, a resin substrate or a glass substrate. However, the material of the substrate 1 can be adjusted according to the requirements and is not limited thereto.

[0032] The arrangement of the solder resist bonding member 21 can fix the support member 3 on the substrate 1. Specifically, the solder resist bonding member 21 is arranged between the substrate 1 and the support member 3, and the solder resist bonding member 21 is in contact with the substrate 1 and the support member 3 respectively. The solder resist bonding member 21 of the present application can replace the adhesive (e.g., epoxy glue or charged glue) used on the market, that is, no adhesive is required between the support member 3 and the substrate 1.

[0033] The solder resist bonding member 21 is formed by a solder resist material. The solder resist material is in a paste state before solidification and has adhesiveness, so it can be used to fix the support member 3. For example, the solder resist material includes barium. Further, the solder resist material includes the following elements: carbon, oxygen, silicon, sulfur and barium, and may further include bromine. The solder resist bonding member 21 is formed by solidifying the solder resist material. Therefore, the material of the solder resist bonding member 21 includes barium. Further, the material of the solder resist bonding member 21 includes the following elements: carbon, oxygen, silicon, sulfur and barium, and may further include bromine.

[0034] The solder resist material referred to here can also be disposed on the substrate 1 to form a solder resist protection member 22. The solder resist protection member 22 can form a patterned structure on the substrate 1 (conductive structure 13) to conform to the overall design of the circuit substrate structure, or to prevent external moisture and oxygen from contacting the conductive structure 13.

[0035] Since the solder resist combination 21 and the solder resist protection 22 are both formed of solder resist material, they can be combined and arranged in the same step. In addition, the solder resist material is a material originally used in manufacturing the circuit substrate structure, and will not contaminate the surface treatment on the conductive structure 13.

[0036] The color of the solder resist combination 21 is not limited and can be white, green or black. When the circuit substrate structure is applied to a light emitting device, a white solder resist combination 21 can be selected to achieve the effect of reflecting light. When the circuit substrate structure is applied to an optical radar, a black solder resist combination 21 can be selected to achieve the effect of absorbing light. Alternatively, a green solder resist combination 21 can also be used to maintain the consistency of the overall structure.

[0037] The support member 3 is disposed on the substrate 1 through the solder resist bonding member 21. The support member 3 can be disposed to increase the distance between the upper and lower substrates to accommodate the placement design of the components on the substrate 1. For the light-emitting device, the support member 3 can also provide a larger space to gather light and enhance the light-emitting effect of the light-emitting device.

[0038] The material of the support member 3 is a non-conductive material, such as ceramic, liquid crystal polymer or plastic (epoxy resin). The shape of the support member 3 is not limited to Figure 1 As shown in , the changed structure of the support member 3 will be described later.

[0039] The chip 4 is electrically connected to the conductive structure 21, so as to be electrically connected to an external circuit through the conductive structure 21. The chip 4 can be disposed on the substrate 1 through a connector 40. Specifically, the connector 40 can be a solder pad, a conductive adhesive, or a die-bonding adhesive, but the present application is not limited thereto.

[0040] In the method for manufacturing a circuit substrate structure, Figures 2 to 6 A schematic diagram of the steps for manufacturing a circuit substrate structure.

[0041] According to the structural design, one or more through holes 10 may be formed on the substrate 1, such as Figure 2 The through hole 10 connects the upper surface 11 and the lower surface 12 of the substrate 1. Therefore, through the direct plated copper (DPC) process, a conductive structure 13 penetrating the upper surface 11 and the lower surface 12 can be formed on the substrate 1. Figure 3 shown.

[0042] See also Figure 3 As shown, the conductive structure 13 is disposed in the through hole 10 and extends from the through hole 10 to the upper surface 11 and the lower surface 12 of the substrate 1. Therefore, the arrangement of the conductive structure 13 can electrically connect the components on both sides of the substrate 1.

[0043] The solder resist material 2 is coated on the upper surface 11 of the substrate 1 and completely covers the conductive structure 13. Next, a photomask is placed on the solder resist material 2, and the photomask has a portion that allows light to pass through and a portion that blocks light.

[0044] In the exposure process, a portion of the solder resist material 2 is exposed, and another portion of the solder resist material 2 is shielded by the photomask and is not exposed. That is, after the exposure process, the solder resist material 2 is divided into a retention area 2A and a protection area 2B corresponding to the pattern design on the photomask, such as Figure 4 shown.

[0045] Specifically, the solder resist material 2 in the remaining area 2A is exposed, so it will not be removed in the development process, and finally remains in the circuit substrate structure to form a solder resist combination 21 or a solder resist protection 22. The solder resist material 2 in the protection area 2B is not exposed, and can be temporarily set on the substrate 1 to protect the substrate 1 and prevent other components from contaminating the substrate 1, but the solder resist material 2 in the protection area 2B will be removed in the development process.

[0046] After the exposure process, the solder resist material 2 in the remaining area 2A can have different functions depending on the position. For example, the solder resist material 2 in contact with the support member 3 can be used as a solder resist binder 21 to fix the support member 3 on the substrate 1. The solder resist material 2 in contact with the conductive structure 13 can be used as a solder resist protector 22 to prevent the conductive structure 13 from being contaminated in other process steps. In addition, the solder resist binder 21 and the solder resist protector 22 can be set in the same step.

[0047] For example, when a photosensitive (mostly negative) solder resist material 2 is used, the solder resist material 2 in the remaining area 2A is irradiated with light so as to be cured in the subsequent steps to form a solder resist combination 21 or a solder resist protection 22. The solder resist material 2 in the protection area 2B is not irradiated with light, so it will be washed away by a developer in the subsequent steps.

[0048] However, the above content is only an example of the first embodiment, and does not limit the type of solder resist material. The solder resist material can also be a baked solder resist material. In addition, the design of the retention area 2A or the effect of setting the solder resist material is not limited by the above content. After the exposure process, only the solder resist combination 21 can be formed on the substrate 1, or the solder resist combination 21 and the solder resist protection member 22 can be formed on the substrate 1 at the same time.

[0049] See also Figure 5 As shown, the solder resist material 2 has not yet solidified after the exposure process, so the solder resist material 2 is in a paste state and has viscosity. Therefore, the support member 3 can be set on the solder resist bonding member 21 so that the support member 3 is in contact with the solder resist bonding member 21. It is particularly noted that in order to prevent the solder resist material 2 that is to form the solder resist bonding member 21 from being corroded during the development process, the solder resist material 2 still needs to be exposed.

[0050] After the support member 3 is provided, a curing treatment is performed, for example, the solder resist material 2 is baked at a high temperature. After the curing treatment, the solder resist material 2 is transformed from a paste to a solid state. A portion of the solder resist material 2 in the retention area 2A forms a solder resist bonding member 21, and another portion of the solder resist material 2 forms a solder resist protection member 22. The solder resist bonding member 2 fixes the support member 3 on the substrate 1.

[0051] Next, a developing process is performed to remove the solder resist material 2 in the protection area 2B. Figure 6The solder resist material 2 (ie, the solder resist combination member 21 and the solder resist protection member 22 ) in the remaining area 2A has been exposed, and thus will not be removed by the developing solution during the developing process.

[0052] After the development process, the chip 4 is placed on the substrate 1 so that the chip 4 is electrically connected to the conductive structure 13. Figure 1 Specifically, the chip 4 can be disposed on the substrate 1 through a connecting member 40, and the connecting member 40 can be a soldering pad, a conductive adhesive or a die-bonding adhesive, but the present application is not limited thereto.

[0053] In addition, the circuit substrate structure may further include an upper cover substrate, which is disposed on the support member 3. Specifically, the upper cover substrate may be fixed to the support member 3 by a connector, which may be an adhesive (e.g., epoxy glue). Since the connector will not contact the conductive structure 13, the connector is less restricted in the selection of components without contaminating the conductive structure 13. In addition, the upper cover substrate is not the main structure.

[0054] This application further designs the structure of the support member 3. Please refer to Figure 7 As shown, the support member 3 may have a protrusion 30, and the support member 3 contacts the solder resist bonding member 21 with the protrusion 30. The protrusion 30 can increase the contact area between the support member 3 and the solder resist material 2, thereby improving the bonding effect between the support member 3 and the solder resist bonding member 21. Specifically, the protrusion 30 is extended and protruded from the bottom surface 31 of the support member 3, and the protrusion 30 includes a plurality of fins. Before the curing process, the solder resist material 2 is still in a paste state. Therefore, when the support member 3 is set, the protrusion 30 can be embedded in the solder resist material 2.

[0055] See also Figure 8 As shown, in some embodiments, the support member 3 may have a structure that is wide at the bottom and narrow at the top. Specifically, the area of ​​the bottom surface 31 of the support member 3 is larger than the area of ​​the top surface 32 of the support member 3. The large bottom surface 31 can increase the contact area between the support member 3 and the solder resist material 2, thereby improving the bonding effect between the support member 3 and the solder resist bonding member 21. In addition, when the circuit substrate structure is applied to a light-emitting device, the structure of the support member 3 that is wide at the bottom and narrow at the top can help converge light to improve the light-emitting effect of the light-emitting device.

[0056] See also Fig. 9 As shown, in other embodiments, the support member 3 may have a structure that is wide at the bottom and narrow at the top, and the support member 3 has a protrusion 30 extending from the bottom surface 31 .

[0057] Experimental testing

[0058] according to Figure 1The circuit substrate structure shown in the figure was made into six identical samples to be tested (Example 1) using solder resist material (Model: PSR-4000G23KHP, whose components include carbon, hydrogen, oxygen and barium). In addition, a commercially available adhesive (Model: 240SB) was used to replace the solder resist bonding member in Example 1 to make six identical samples to be tested (Comparative Example 1).

[0059] The six samples to be tested in Example 1 and Comparative Example 1 were reflowed three times at 260° C. According to the JESD22-B117A standard method, a solder ball thrust machine was used to measure the maximum shear force (quantified result of bonding force) that the circuit substrate structure could withstand.

[0060] The measurement results of the maximum shear force of the samples to be tested are listed in Table 1, wherein the shear force ratio is the ratio of the maximum shear force that the circuit substrate structure in Example 1 can withstand to the maximum shear force that the circuit substrate structure in Comparative Example 1 can withstand.

[0061] Table 1

[0062]

[0063]

[0064] From the results in Table 1, it can be seen that the solder resist material used in the present application can replace the existing adhesive, and the solder resist bonding member 21 formed by the solder resist material can fix the support member 3 on the substrate 1. Moreover, the solder resist bonding member 21 has a better bonding effect than the adhesive.

[0065] Specifically, the maximum shear force that the support member 3 can withstand on the substrate 1 is greater than 10 kg, and preferably, the maximum shear force that the support member 3 can withstand on the substrate 1 is 11 kg to 19 kg. Compared with the method of fixing the support member 3 with an adhesive, the method of fixing the support member 3 with the solder resist bonding member 21 can withstand a greater shear force.

[0066] In addition to a better bonding effect, the use of solder resist material to form the solder resist bonding member 21 can also achieve the effect of simplifying the steps. In the process of manufacturing the circuit substrate structure, the solder resist bonding member 21 and the solder resist protection member 22 can be set simultaneously in the exposure process to achieve the effect of fixing the support member 3 (solder resist bonding member 21) and protecting the conductive structure 13 (solder resist protection member 22). In addition, the elimination of the adhesive can not only simplify the process, but also avoid the problem derived from the difficulty in controlling the amount of adhesive applied through the development process.

[0067] Advantageous Effects of Embodiments

[0068] One of the beneficial effects of the present application is that the circuit substrate structure and the manufacturing method thereof provided in the present application can improve the fixing effect of the support member 3 on the substrate 1 through the technical solutions of "the support member is in contact with the solder resist bonding member" and "the support member is fixed to the substrate through the solder resist bonding member", and can eliminate the use of adhesives.

[0069] The contents disclosed above are only preferred feasible embodiments of the present application, and are not intended to limit the protection scope of the claims of the present application. Therefore, all equivalent technical changes made using the contents of the present application specification and drawings are included in the protection scope of the claims of the present application.

Claims

1. A circuit substrate structure, characterized in that: include: a substrate having a conductive structure; a solder resist combination member, the solder resist combination member being disposed on the substrate; a supporting member, the supporting member is in contact with the solder resist combining member, and the supporting member is fixed on the substrate through the solder resist combining member; as well as A chip is disposed on the substrate and is electrically connected to the conductive structure.

2. The circuit substrate structure according to claim 1, characterized in that: A bottom surface of the support member has a protrusion, the support member contacts the solder resist bonding member with the bottom surface, and the protrusion is embedded in the solder resist bonding member.

3. The circuit substrate structure according to claim 1, characterized in that: The support member has a bottom surface and a top surface opposite to each other, the bottom surface is in contact with the solder resist bonding member, and the area of ​​the bottom surface is greater than the area of ​​the top surface.

4. The circuit substrate structure according to claim 3, characterized in that: The bottom surface of the support member has a protrusion, and the protrusion is embedded in the solder resist bonding member.

5. The circuit substrate structure according to claim 1, characterized in that: The support member is a non-conductive material.

6. The circuit substrate structure according to claim 1, characterized in that: The material of the solder resist bonding member includes barium element.

7. The circuit substrate structure according to claim 1, characterized in that: No adhesive is included between the support member and the substrate.

8. A method for manufacturing a circuit substrate structure, characterized in that: include: Applying a solder resist material on a substrate having a conductive structure; Performing an exposure process on the solder resist material to divide the solder resist material into a retention area and a protection area; disposing a support member on the solder resist material in the retention area so that the support member is in contact with the solder resist material; Performing a curing process, the solder resist material in the retention area forms a solder resist bonding piece, and the support member is fixed on the substrate through the solder resist bonding piece; Performing a development process to remove the solder resist material in the protection area; as well as A chip is arranged on the substrate, and the chip is electrically connected to the conductive structure.

9. The manufacturing method according to claim 8, characterized in that: After the curing process, the solder resist material is transformed from a paste to a solid state, and then the development process is performed.

10. The manufacturing method according to claim 8, characterized in that: After the curing treatment, a portion of the solder resist material in the retained area forms the solder resist combination member, and another portion of the solder resist material forms a solder resist protection member; wherein the solder resist protection member contacts the conductive structure.

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