Active adjustment method and device of camera, equipment and medium

Abstract

The invention relates to the technical field of camera assembly, and discloses an active adjustment method and device for a camera, equipment and a medium, and the method comprises the steps: carrying out the focusing, center and hole alignment of a first camera module, so as to achieve the active alignment, and obtaining a second camera module; carrying out screw curing and gap glue spraying treatment on the second camera module to obtain a third camera module; and baking the third camera module to obtain a target camera module. Three-point plane determination is achieved through hole alignment, hole alignment is adopted to replace AA glue for active alignment, after active alignment, the position fixed by a screw cannot be displaced or inclined, and the problem that inclination and dislocation occur between Lens and Cubic after AA glue is dried due to stress difference generated after the AA glue is dried under the conditions of different glue heights and glue widths is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of camera assembly, and in particular to a method, device, equipment and medium for actively adjusting a camera. Background Art

[0002] With the continuous development and upgrading of consumer products such as the Internet of Things, smart terminals and self-driving cars, the requirements for camera quality are increasing. In the field of automotive cameras, the traditional AA (Active Alignment) assembly method can no longer meet the higher precision and performance requirements. The traditional active adjustment method of the camera mainly includes centering, applying AA glue, AA process A lens, AA post-confirmation, AA glue, and drying AA glue. However, the stress difference generated by the AA glue after drying under different glue heights and glue widths will cause the lens (lens) and the cubic (lens and lens holder, or circuit board and base) to tilt and misalign after drying the AA glue. Summary of the invention

[0003] Based on this, it is necessary to actively adjust the camera in the existing technology. The stress difference generated by AA glue after drying under different glue heights and glue widths will cause technical problems such as tilt and misalignment between Lens and Cubic after drying AA glue. An active adjustment method, device, equipment and medium for the camera are proposed.

[0004] In a first aspect, a method for actively adjusting a camera is provided, the method comprising:

[0005] Focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module;

[0006] Performing screw curing and gap glue spraying processing on the second camera module to obtain a third camera module;

[0007] The third camera module is baked to obtain a target camera module.

[0008] Furthermore, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module includes:

[0009] The position of the photosensitive chip is adjusted along the Z direction to achieve Z-direction focusing of the first camera module.

[0010] Furthermore, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module also includes:

[0011] Based on the Chart, the center of the lens of the first camera module and the center of the photosensitive chip of the first camera module are aligned.

[0012] Furthermore, the lens of the first camera module and the photosensitive chip of the first camera module are fixed to the circuit board of the first camera module by screws;

[0013] The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module also includes:

[0014] Determining the tilt direction and tilt amount of the first camera module through the defocus curve;

[0015] Determining a screw compensation amount according to the tilt direction and the tilt amount;

[0016] If the screw compensation amount is outside the preset range, the first camera module is hole-aligned by adjusting the screw according to the screw compensation amount to compensate for the tilt between the lens and the photosensitive chip, and the step of determining the tilt direction and tilt amount of the first camera module through the defocus curve is jumped to be executed again;

[0017] If the screw compensation amount is within a preset range, the first camera module is used as the second camera module.

[0018] Furthermore, the step of performing screw curing and gap glue spraying on the second camera module to obtain the third camera module includes:

[0019] Dispensing glue on the back sides of the plurality of screws of the second camera module, and curing the glue on the back sides of the plurality of screws of the second camera module;

[0020] The gap of the second camera module used for active alignment is sprayed with glue.

[0021] Furthermore, the step of applying glue on the back side of the plurality of screws of the second camera module and curing the glue on the back side of the plurality of screws of the second camera module includes:

[0022] Apply UV glue or black glue on the back of the screws of the second camera module;

[0023] Get the parameters of the glue on the back of the screw as the first parameter;

[0024] According to the first parameter, curing the glue on the back side of the plurality of screws of the second camera module;

[0025] The step of spraying glue on the gap of the second camera module for active alignment includes: spraying black glue on the gap of the second camera module for active alignment.

[0026] Furthermore, the step of baking the third camera module to obtain a target camera module includes:

[0027] Obtaining the parameters of glue corresponding to the gap glue spraying process as the second parameter;

[0028] The third camera module is baked according to the second parameter to obtain the target camera module.

[0029] In a second aspect, a device for actively adjusting a camera is provided, the system comprising:

[0030] An active adjustment module, used for focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module;

[0031] A curing module, used for performing screw curing and gap glue spraying on the second camera module to obtain a third camera module;

[0032] The finished product baking module is used to bake the third camera module to obtain a target camera module.

[0033] In a third aspect, an assembly device is provided, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the above-mentioned active adjustment method of the camera when executing the computer program.

[0034] In a fourth aspect, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the above-mentioned active adjustment method of the camera are implemented.

[0035] The active adjustment method, device, equipment and medium of the camera of the present application achieves active alignment by focusing, centering and hole aligning the first camera module to obtain the second camera module; the second camera module is subjected to screw curing and gap spraying to obtain the third camera module; the third camera module is baked to obtain the target camera module. The present application realizes three-point plane determination through hole alignment, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position after screw fixation will no longer be displaced or tilted, and the stress difference generated by AA glue after drying under different glue heights and widths will be avoided, which will cause tilt and misalignment between Lens and Cubic after drying AA glue. The yield rate of active alignment can be improved, and the quality of the camera module can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] in:

[0038] Figure 1 A diagram of an application environment of an active adjustment method of a camera in one embodiment;

[0039] Figure 2 is a flow chart of a method for actively adjusting a camera in one embodiment;

[0040] Figure 3 is a structural block diagram of an active adjustment device for a camera in one embodiment;

[0041] Figure 4 It is a structural block diagram of an assembly device in one embodiment;

[0042] Figure 5 This is the structural block diagram of the camera module;

[0043] Figure 6 for Figure 5 Another perspective structural diagram of the camera module;

[0044] Figure 7 for Figure 5 A schematic diagram of the exploded structure of a camera module;

[0045] Figure 8 for Figure 5 Another perspective structural diagram of the camera module. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] The active alignment of the camera (also called camera module) is to align the center of the lens with the center of the photosensitive chip on the circuit board, and the lens and the photosensitive chip are parallel. The existing active adjustment method of the camera is to align the center, apply AA glue, A lens during the AA process, confirm after AA, apply AA glue, and dry AA glue, so as to apply AA glue, then A lens, and finally dry AA glue. Among them, the six-axis motion platform is matched with the target card for tilt and horizontal alignment to achieve this.

[0048] AA glue usually refers to the glue used in the camera module manufacturing process, also known as AA process glue. AA glue plays a vital role in camera module manufacturing, mainly used for bonding lenses and bases, especially in vehicle-mounted camera modules.

[0049] The active adjustment method of the camera provided by the embodiment of the present invention can be applied in the following aspects: Figure 1 The application environment includes: an assembly device 1, a server 2, and a client 3, wherein the client 3 communicates with the server 2 through a network. The assembly device 1 is connected to the server 2 and the client 3 for communication. The server 2 is connected to the client 3 for communication.

[0050] Optionally, the server 2 is configured to: control the assembly device 1 to focus, center, and hole align the first camera module to achieve active alignment, and obtain the second camera module; control the assembly device 1 to perform screw curing and gap glue spraying on the second camera module to obtain the third camera module; control the assembly device 1 to bake the third camera module to obtain the target camera module. The present application realizes three-point plane determination through hole alignment, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position of the screws will no longer be displaced or tilted, and the stress difference generated by the AA glue after drying under different glue heights and widths will be avoided, which will cause the Lens and Cubic to tilt and misalign after drying the AA glue. The yield rate of active alignment can be improved, and the quality of the camera module can be improved.

[0051] The client 3 user obtains the basic data (such as model, camera parameters) of the first camera module input by the user number. The basic data of the first camera module is combined with the program file of the active adjustment method of the camera of the present application to control the assembly device 1 to actively align and assemble the first camera module.

[0052] See also Figure 4Optionally, the assembly device 1 includes: a memory 11, a processor 12, and a computer program stored in the memory 11 and executable on the processor 12. The processor 12 executes the computer program to implement the following steps: focusing, centering, and hole alignment of the first camera module to achieve active alignment to obtain a second camera module; performing screw curing and gap glue spraying on the second camera module to obtain a third camera module; and baking the third camera module to obtain a target camera module.

[0053] The assembly equipment 1 also includes a focusing component, a centering component, a hole alignment component, a baking component, a glue dispensing component, and a glue spraying component. The processor 12 is connected to the focusing component, the centering component, the hole alignment component, the baking component, the glue dispensing component, and the glue spraying component in communication. The focusing component is used to focus the camera module. The centering component is used to center the camera module. The hole alignment component is used to align the holes of the camera module. The baking component is used for high-temperature baking during screw curing and high-temperature baking of the third camera module. The glue dispensing component is used to dispense glue on the screws of the camera module. The glue spraying component is used to spray glue on the gap of the camera module for active alignment. The specific structures of the focusing component, the centering component, the hole alignment component, the baking component, the glue dispensing component, and the glue spraying component can be selected from the existing technology and will not be repeated here.

[0054] The client 3 may be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, and portable wearable devices. The server 2 may be implemented using an industrial computer, an independent server, or a server cluster consisting of multiple servers.

[0055] The present invention is described in detail below through specific embodiments.

[0056] See also Figure 2 As shown, Figure 2 A flowchart of a method for actively adjusting a camera provided by an embodiment of the present invention includes the following steps:

[0057] S1: focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module;

[0058] The first camera module is a camera module that needs to be actively aligned. It is understandable that before the active alignment, the first camera module has been processed by the lighting process.

[0059] Please participate Figures 5 to 8 The camera module includes: a lens 61, a lens holder 62, a photosensitive chip 63 and a circuit board 64. The photosensitive chip 63 is arranged on the circuit board 64. The circuit board can be a flexible circuit board (FPC) or a printed circuit board (PCB).

[0060] First, place the camera module on the workbench, then control the focusing component of the assembly equipment 1 to focus on the first camera module, control the centering component of the assembly equipment 1 to center the first camera module, and control the hole alignment component of the assembly equipment 1 to align the holes of the first camera module. When the center of the lens of the first camera module is aligned with the center of the photosensitive chip on the circuit board and the lens and the photosensitive chip are parallel, use the first camera module as the second camera module.

[0061] Hole alignment means that a plurality of holes 661 (ie, screw holes) are provided on the circuit board, and a plurality of screws (one screw is installed in each hole) are used to achieve the plane determination. Figure 6 , for hole alignment, that is, three holes 661 (that is, screw holes) are set on the circuit board 64, and three screws 662 (one screw is installed in each hole) are used to realize three-point determination of the plane. The prior art realizes this by using a six-axis motion platform with a target chart to perform tilt and horizontal alignment.

[0062] Optional, from Figure 7 and Figure 8 It can be seen that the screw 662 enters the hole 661 of the circuit board 64 from the side of the circuit board 64 away from the lens 61 .

[0063] It is understandable that when performing focusing, centering, and hole alignment to achieve active alignment, focus is performed first, and then translation, rotation, and tilt are achieved through centering and hole alignment, thereby achieving active alignment of the first camera module. In other words, focusing, centering, and hole alignment are basically performed synchronously, and each alignment operation in focusing, centering, and hole alignment can be performed at least 0 times. For example, focusing is performed once, centering is performed twice, and hole alignment is performed 3 times.

[0064] S2: performing screw curing and gap glue spraying processing on the second camera module to obtain a third camera module;

[0065] Specifically, the assembly equipment is controlled to glue and cure the screws used for hole alignment in the second camera module, and then glue is sprayed on the gaps required for focusing, centering, and hole alignment (adjustable space during active alignment) to obtain the third camera module.

[0066] S3: baking the third camera module to obtain a target camera module.

[0067] Specifically, the third camera module is baked at a high temperature, and the baked third camera module is used as the target camera module.

[0068] In this embodiment, the first camera module is focused, centered, and hole-aligned to achieve active alignment, thereby obtaining a second camera module; the second camera module is screw-cured and gap-sprayed to obtain a third camera module; the third camera module is baked to obtain a target camera module. This application uses hole alignment to achieve three-point plane determination, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position of the screws after fixing will no longer be displaced or tilted, and the stress difference generated by the AA glue after drying under different glue heights and widths will be avoided, which will cause the problem of tilt and misalignment between the Lens and the Cubic after drying the AA glue. This can improve the yield rate of active alignment and the quality of the camera module.

[0069] In one embodiment, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module includes:

[0070] S11: Adjust the position of the photosensitive chip along the Z direction to achieve Z-direction focusing of the first camera module.

[0071] Specifically, by controlling the assembly equipment, the position of the photosensitive chip is moved up and down along the Z direction to adjust the Z direction focus. The Z direction focus can be adjusted by the high-precision motor in the assembly equipment to find the best position. When the photosensitive chip is in the best position, the resolution of the four corners of the camera module will be balanced.

[0072] In one embodiment, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module further includes:

[0073] S12: Based on the Chart, align the center of the lens of the first camera module and the center of the photosensitive chip of the first camera module.

[0074] Chart, also known as chart card, is used as a reference.

[0075] Specifically, the center of the lens of the first camera module and the center of the photosensitive chip of the first camera module are aligned by assembling equipment using the center position of the Chart.

[0076] In one embodiment, the lens of the first camera module and the photosensitive chip of the first camera module are fixed to the circuit board of the first camera module by screws;

[0077] Fixing the lens of the first camera module and the photosensitive chip of the first camera module can be achieved by locking screws. Each of the multiple screws corresponds to a screw hole, that is, there are multiple screw holes, and the hole alignment is achieved by the cooperation of multiple screws and multiple screw holes. Through the cooperation of the screws and the screw holes, the lens of the first camera module and the photosensitive chip of the first camera module are locked to the bottom of the circuit board. Preferably, the number of screws is three, and each of the screws corresponds to a screw hole, that is, there are three screw holes in total, and the hole alignment is achieved by the cooperation of the screws and the three screw holes. Through the cooperation of the screws and the three screw holes, the lens of the first camera module and the photosensitive chip of the first camera module are locked to the bottom of the circuit board.

[0078] After active alignment, the locking of the screws can directly fix the position of the photosensitive chip relative to the lens, ensuring that the relative position after active alignment is not affected by other factors, thereby ensuring the quality of the camera module.

[0079] The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module also includes:

[0080] S13: determining a tilt direction and a tilt amount of the first camera module according to a defocus curve;

[0081] The defocus curve is a tool for evaluating the visual acuity of multifocal or accommodative artificial lenses at different distances. By adding lenses of different diopters in front of the eyes to cause visual defocus, the visual needs at different distances are simulated. The curve drawn with the diopters of the lenses as the horizontal axis and the visual acuity as the vertical axis is the defocus curve.

[0082] Specifically, the defocus curve is used to determine the tilt direction and the tilt amount of the first camera module in each tilt direction. The specific determination method can be selected from the existing technology and will not be elaborated here.

[0083] The tilt direction is: tilt in the X direction or tilt in the Y direction.

[0084] S14: determining a screw compensation amount according to the tilt direction and the tilt amount;

[0085] Specifically, the X-direction compensation amount and the Y-direction compensation amount are decomposed according to the tilt direction and the tilt amount, and the decomposed X-direction compensation amount and the Y-direction compensation amount are used as the screw compensation amount.

[0086] S15: If the screw compensation amount is outside the preset range, the first camera module is hole-aligned by adjusting the screw according to the screw compensation amount to compensate for the tilt between the lens and the photosensitive chip, and the step of determining the tilt direction and tilt amount of the first camera module through the defocus curve is performed again;

[0087] Specifically, if the screw compensation amount is outside the preset range, it means that the active alignment does not meet the requirements and needs to be adjusted. Therefore, the assembly equipment is controlled to control the inclination of the photosensitive chip of the first camera module by adjusting the screws according to the screw compensation amount to compensate for the inclination between the lens and the photosensitive chip. After the adjustment is completed, jump to step S13 and execute again.

[0088] S16: If the screw compensation amount is within a preset range, the first camera module is used as the second camera module.

[0089] Specifically, if the screw compensation amount is within a preset range, it means that the active alignment has met the requirements and does not need to be adjusted. Therefore, the first camera module is used as the second camera module.

[0090] In this embodiment, the plane is determined by hole alignment, and hole alignment is used instead of AA glue for active alignment. After active alignment, the position after screw fixation will no longer be displaced or tilted, and the stress difference generated by AA glue after drying under different glue heights and glue widths will be avoided, which will cause the problem of tilt and misalignment between the Lens and the Cub ic after drying the AA glue. The yield rate of active alignment can be improved, and the quality of the camera module can be improved.

[0091] In one embodiment, the step of performing screw curing and gap glue spraying on the second camera module to obtain the third camera module includes:

[0092] S21: applying glue on the back sides of the plurality of screws of the second camera module, and curing the glue on the back sides of the plurality of screws of the second camera module;

[0093] Specifically, the assembly equipment is controlled to dispense glue on the back of the screws used for hole alignment of the second camera module, and then the glue on the back of the plurality of screws of the second camera module is cured by high temperature.

[0094] It is understandable that when applying glue on the back side of the multiple screws of the second camera module, the glue needs to cover the entire back side of the screws.

[0095] S22: performing glue spraying on the gap of the second camera module for active alignment.

[0096] Specifically, the assembly equipment is controlled to perform glue spraying on the gap of the second camera module for active alignment. It is understandable that the glue spraying needs to fill the entire gap.

[0097] There is a gap reserved between the circuit board and the Cubic. This gap is the space for active alignment. After the active alignment is completed, it needs to be filled with black glue, otherwise the camera module will leak light.

[0098] In this embodiment, glue is dispensed on the back side of multiple screws of the second camera module, the glue on the back side of the multiple screws of the second camera module is cured, and the gap of the second camera module used for active alignment is sprayed with glue, thereby achieving the curing of all spaces required for active alignment, providing support for maintaining the results of active alignment; the whole process uses AA glue to avoid the stress difference generated by the AA glue after drying under different glue heights and glue widths, which will cause tilting and misalignment between the Lens and the Cubic after drying the AA glue, thereby improving the yield rate of active alignment and improving the quality of the camera module.

[0099] In one embodiment, the step of applying glue on the back side of the plurality of screws of the second camera module and curing the glue on the back side of the plurality of screws of the second camera module includes:

[0100] S211: Apply UV glue or black glue on the back side of the screws of the second camera module;

[0101] UV glue (shadowless glue) is an adhesive that can only be cured by ultraviolet light and is widely used in the bonding of various transparent materials.

[0102] Black glue usually refers to silicone glue or cyanoacrylate. Silicone glue is a commonly used glue. Its main components include deacetic acid type and deacrylic type. It is often used for bonding glass, ceramics, metal and other building materials. It has the advantages of good adhesion, waterproof and moisture-proof, and good weather resistance. Silicone glue comes in a variety of colors, the most common ones are black, gray and white. Cyanoacrylate is a black glue made by thickening and adding carbon powder. It does not contain solvents and heavy metals and is non-toxic.

[0103] S212: Obtaining parameters of glue on the back of the screw as the first parameter;

[0104] The first parameter includes the corresponding relationship between the thickness of the glue, the temperature required for curing, and the time required for curing.

[0105] S213: curing glue on the back sides of the plurality of screws of the second camera module according to the first parameter;

[0106] Specifically, according to the first parameter, the assembly equipment is controlled to cure the glue on the back of the plurality of screws of the second camera module.

[0107] The step of spraying glue on the gap of the second camera module for active alignment comprises:

[0108] S221: Spraying black glue on the gap of the second camera module for active alignment.

[0109] The whole process of this embodiment uses AA glue to avoid the stress difference generated by the AA glue after drying under different glue heights and glue widths, which will cause the problem of tilt and misalignment between the Lens and the Cub ic after drying the AA glue, thereby improving the yield rate of active alignment and the quality of the camera module; according to the first parameter, the glue on the back of the multiple screws of the second camera module is cured, so that the curing process is carried out according to the actual situation of the glue on the back of the screws, the quality of the curing process is improved, and then the quality of the target camera module is improved.

[0110] In one embodiment, the step of baking the third camera module to obtain a target camera module includes:

[0111] S31: Obtaining a parameter of glue corresponding to the gap glue spraying process as a second parameter;

[0112] The second parameter includes the corresponding relationship between the thickness of the glue, the temperature required for curing, and the time required for curing.

[0113] S32: baking the third camera module according to the second parameter to obtain the target camera module.

[0114] Specifically, according to the second parameter, the assembly equipment is controlled to perform high-temperature baking on the third camera module, and the baked third camera module is used as the target camera module.

[0115] It can be understood that baking the third camera module mainly bakes the glue sprayed onto the third camera module by the gap spraying process.

[0116] This embodiment obtains the target camera module by baking the third camera module according to the second parameter, thereby baking the glue sprayed onto the third camera module during the gap spraying process, thereby improving the baking quality and further improving the quality of the target camera module.

[0117] See also Figure 3 As shown, in one embodiment, a device for actively adjusting a camera is provided, and the system includes:

[0118] An active adjustment module 801 is used to focus, center, and align the holes of the first camera module to achieve active alignment to obtain a second camera module;

[0119] A curing module 802 is used to perform screw curing and gap glue spraying on the second camera module to obtain a third camera module;

[0120] The finished product baking module 803 is used to bake the third camera module to obtain a target camera module.

[0121] In this embodiment, the first camera module is focused, centered, and hole-aligned to achieve active alignment, thereby obtaining a second camera module; the second camera module is screw-cured and gap-sprayed to obtain a third camera module; the third camera module is baked to obtain a target camera module. This application achieves three-point plane determination through hole alignment, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position after screw fixation will no longer be displaced or tilted, and the stress difference generated by AA glue after drying under different glue heights and glue widths will be avoided, which will cause the problem of tilt and misalignment between Lens and Cub ic after drying AA glue, thereby improving the yield rate of active alignment and the quality of the camera module.

[0122] In one embodiment, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module in the active adjustment module 801 includes:

[0123] The position of the photosensitive chip is adjusted along the Z direction to achieve Z-direction focusing of the first camera module.

[0124] In one embodiment, the step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module in the active adjustment module 801 further includes:

[0125] Based on the Chart, the center of the lens of the first camera module and the center of the photosensitive chip of the first camera module are aligned.

[0126] In one embodiment, the lens of the first camera module and the photosensitive chip of the first camera module are fixed to the circuit board of the first camera module by screws;

[0127] The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module in the active adjustment module 801 further includes:

[0128] Determining the tilt direction and tilt amount of the first camera module through the defocus curve;

[0129] Determining a screw compensation amount according to the tilt direction and the tilt amount;

[0130] If the screw compensation amount is outside the preset range, the first camera module is hole-aligned by adjusting the screw according to the screw compensation amount to compensate for the tilt between the lens and the photosensitive chip, and the step of determining the tilt direction and tilt amount of the first camera module through the defocus curve is jumped to be executed again;

[0131] If the screw compensation amount is within a preset range, the first camera module is used as the second camera module.

[0132] In one embodiment, the step of performing screw curing and gap glue spraying on the second camera module in the curing module 802 to obtain the third camera module includes:

[0133] Dispensing glue on the back sides of the plurality of screws of the second camera module, and curing the glue on the back sides of the plurality of screws of the second camera module;

[0134] The gap of the second camera module used for active alignment is sprayed with glue.

[0135] In one embodiment, the step of applying glue on the back side of the plurality of screws of the second camera module and curing the glue on the back side of the plurality of screws of the second camera module in the curing module 802 includes:

[0136] Apply UV glue or black glue on the back of the screws of the second camera module;

[0137] Get the parameters of the glue on the back of the screw as the first parameter;

[0138] According to the first parameter, curing the glue on the back side of the plurality of screws of the second camera module;

[0139] The step of spraying glue on the gap of the second camera module for active alignment includes: spraying black glue on the gap of the second camera module for active alignment.

[0140] In one embodiment, the step of baking the third camera module to obtain the target camera module in the finished product baking module 803 includes:

[0141] Obtaining the parameters of glue corresponding to the gap glue spraying process as the second parameter;

[0142] The third camera module is baked according to the second parameter to obtain the target camera module.

[0143] In one embodiment, an assembly device is provided, the assembly device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program:

[0144] Focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module;

[0145] Performing screw curing and gap glue spraying processing on the second camera module to obtain a third camera module;

[0146] The third camera module is baked to obtain a target camera module.

[0147] In this embodiment, the first camera module is focused, centered, and hole-aligned to achieve active alignment, thereby obtaining a second camera module; the second camera module is screw-cured and gap-sprayed to obtain a third camera module; the third camera module is baked to obtain a target camera module. This application uses hole alignment to achieve three-point plane determination, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position of the screws after fixing will no longer be displaced or tilted, and the stress difference generated by the AA glue after drying under different glue heights and widths will be avoided, which will cause the problem of tilt and misalignment between the Lens and the Cubic after drying the AA glue. This can improve the yield rate of active alignment and the quality of the camera module.

[0148] In one embodiment, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0149] Focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module;

[0150] Performing screw curing and gap glue spraying processing on the second camera module to obtain a third camera module;

[0151] The third camera module is baked to obtain a target camera module.

[0152] In this embodiment, the first camera module is focused, centered, and hole-aligned to achieve active alignment, thereby obtaining a second camera module; the second camera module is screw-cured and gap-sprayed to obtain a third camera module; the third camera module is baked to obtain a target camera module. This application uses hole alignment to achieve three-point plane determination, and uses hole alignment instead of AA glue for active alignment. After active alignment, the position of the screws after fixing will no longer be displaced or tilted, and the stress difference generated by the AA glue after drying under different glue heights and widths will be avoided, which will cause the problem of tilt and misalignment between the Lens and the Cubic after drying the AA glue. This can improve the yield rate of active alignment and the quality of the camera module.

[0153] It should be noted that the above functions or steps that can be implemented by the computer-readable storage medium or computer device can refer to the relevant descriptions on the server 2 side and the client 3 side in the aforementioned method embodiment. To avoid repetition, they will not be described one by one here.

[0154] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing related hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0155] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0156] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for actively adjusting a camera, characterized in that: The method comprises: Focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain a second camera module; Performing screw curing and gap glue spraying processing on the second camera module to obtain a third camera module; The third camera module is baked to obtain a target camera module.

2. The active adjustment method of a camera according to claim 1, characterized in that: The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module includes: The position of the photosensitive chip is adjusted along the Z direction to achieve Z-direction focusing of the first camera module.

3. The active adjustment method of a camera according to claim 1, characterized in that: The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module also includes: Based on the Chart, the center of the lens of the first camera module and the center of the photosensitive chip of the first camera module are aligned.

4. The active adjustment method of a camera according to claim 1, characterized in that: The lens of the first camera module and the photosensitive chip of the first camera module are fixed to the circuit board of the first camera module by screws; The step of focusing, centering, and hole aligning the first camera module to achieve active alignment to obtain the second camera module also includes: Determining the tilt direction and tilt amount of the first camera module through the defocus curve; Determining a screw compensation amount according to the tilt direction and the tilt amount; If the screw compensation amount is outside the preset range, the first camera module is hole-aligned by adjusting the screw according to the screw compensation amount to compensate for the tilt between the lens and the photosensitive chip, and the step of determining the tilt direction and tilt amount of the first camera module through the defocus curve is jumped to be executed again; If the screw compensation amount is within a preset range, the first camera module is used as the second camera module.

5. The active adjustment method of a camera according to claim 4, characterized in that: The step of performing screw curing and gap glue spraying on the second camera module to obtain the third camera module includes: Dispensing glue on the back sides of the plurality of screws of the second camera module, and curing the glue on the back sides of the plurality of screws of the second camera module; The gap of the second camera module used for active alignment is sprayed with glue.

6. The active adjustment method of a camera according to claim 5, characterized in that: The step of applying glue on the back side of the plurality of screws of the second camera module and curing the glue on the back side of the plurality of screws of the second camera module comprises: Apply UV glue or black glue on the back of the screws of the second camera module; Get the parameters of the glue on the back of the screw as the first parameter; According to the first parameter, curing the glue on the back side of the plurality of screws of the second camera module; The step of spraying glue on the gap of the second camera module for active alignment includes: spraying black glue on the gap of the second camera module for active alignment.

7. The active adjustment method of a camera according to claim 1, characterized in that: The step of baking the third camera module to obtain a target camera module includes: Obtaining the parameters of glue corresponding to the gap glue spraying process as the second parameter; The third camera module is baked according to the second parameter to obtain the target camera module.

8. An active adjustment device for a camera, characterized in that: The device comprises: An active adjustment module, used for focusing, centering, and hole alignment of the first camera module to achieve active alignment to obtain a second camera module; A curing module, used for performing screw curing and gap glue spraying on the second camera module to obtain a third camera module; The finished product baking module is used to bake the third camera module to obtain a target camera module.

9. An assembly device, characterized in that: The assembly device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the active adjustment method of the camera as described in any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the active adjustment method of the camera as claimed in any one of claims 1 to 7 are implemented.

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