Cushion for wearable device

Abstract

The invention relates to a cushion of a wearable device. A soft cushion of a wearable device comprises an outer cover layer and an inner cushion. The outer cover layer comprises a first base material, a heat conduction material and a first heat storage material. The heat conduction material and the first heat storage material are distributed in the first base material. And the enthalpy value of the outer cover layer is less than or equal to 5J / g. The inner pad comprises a second base material and a second heat storage material. The second heat storage material is dispersed in the second base material. And the enthalpy value of the inner pad is greater than that of the outer cover layer. The difference value between the enthalpy value of the inner pad and the enthalpy value of the outer cover layer is larger than 45 J / g. The overall heat storage capacity of the soft cushion can be improved, heat energy in the soft cushion can be continuously dissipated in the direction away from the skin of a user, and then the comfort of the user wearing the wearable device for a long time is improved.

Description

Technical Field

[0001] The present application relates to the technical field of soft pads, and in particular to a soft pad for a wearable device. Background Art

[0002] With the continuous advancement of technology, the designs and styles of wearable devices (such as headphones, watches, etc.) have become more and more diverse. These wearable devices not only provide more possibilities in terms of function, but also bring more choices to users in terms of appearance and style. However, a common challenge comes with it, that is, how to maintain comfort when using these wearable devices.

[0003] Generally speaking, when a user wears a wearable device, the heat emitted by the human body tends to accumulate inside the device, thereby causing the temperature of the device to rise, which may adversely affect the user's comfort, especially when wearing the device for a long time.

[0004] To improve this problem, many manufacturers are committed to researching and developing solutions that can improve the heat dissipation performance of wearable devices. Summary of the invention

[0005] The present application provides a soft pad for a wearable device, which helps to dissipate the heat energy accumulated in the soft pad away from the user's skin by means of the matching of the thermal enthalpy values ​​of the outer cover layer and the inner pad.

[0006] The present application provides a soft pad for a wearable device, comprising:

[0007] The outer cover layer comprises:

[0008] a first substrate; and

[0009] A heat conductive material and a first heat storage material are dispersed in the first substrate, and the heat enthalpy of the outer cover layer is less than or equal to 5 J / g; and

[0010] Inner padding, including:

[0011] a second substrate; and

[0012] A second heat storage material is dispersed in the second substrate, wherein the thermal enthalpy of the inner pad is greater than that of the outer cover layer, and the difference between the thermal enthalpy of the inner pad and the thermal enthalpy of the outer cover layer is greater than 45 J / g.

[0013] In one embodiment, the thermally conductive material includes at least one of the following materials: graphene, alumina, silicon dioxide, polyol, and cold gel.

[0014] In one embodiment, the first heat storage material and the second heat storage material include phase change materials.

[0015] In one embodiment, the total weight percentage of the thermal conductive material and the first heat storage material in the outer cover layer is 30wt% to 40wt%.

[0016] In one embodiment, the total weight of the thermal conductive material and the first heat storage material is 100 parts by weight, the thermal conductive material accounts for 10 to 20 parts by weight, and the first heat storage material accounts for 80 to 90 parts by weight.

[0017] In one of the embodiments, the weight percentage of the second heat storage material in the inner pad is 20wt% to 40wt%.

[0018] In one embodiment, the cushion further comprises:

[0019] The heat radiation layer is located between the inner pad and the outer cover layer, and the thickness of the heat radiation layer is 0.1 mm to 0.3 mm.

[0020] In one embodiment, the heat radiation layer is bonded to the outer cover layer through an adhesive layer, and the heat radiation layer is against the inner pad.

[0021] In one embodiment, the thickness of the outer cover layer is 0.1 mm to 0.3 mm.

[0022] In one embodiment, the thermal conductivity of the outer cover layer is greater than the thermal conductivity of the inner pad.

[0023] In one embodiment, the heat storage coefficient of the inner pad is greater than the heat storage coefficient of the outer cover layer.

[0024] In one embodiment, the inner pad is placed in the outer cover layer.

[0025] In one embodiment, the second substrate is a porous elastomer structure, and the second heat storage material is dispersed in the porous elastomer.

[0026] In one embodiment, the outer cover layer includes a heat absorbing surface and a heat dissipating surface. When a user wears the wearable device, the heat dissipating surface is exposed to the outside air, and the heat absorbing surface contacts the skin of the user.

[0027] In one of the embodiments, the thermal enthalpy of the outer cover layer is 1.3-5 J / g, and the thermal enthalpy of the inner pad is greater than 80 J / g.

[0028] The difference between the thermal enthalpy value of the inner pad and the thermal enthalpy value of the outer cover layer of the above-mentioned wearable device cushion is greater than 45 J / g, which helps to improve the overall heat storage capacity of the cushion and allows the heat energy in the cushion to continuously dissipate away from the user's skin, thereby improving the user's comfort when wearing the wearable device for a long time. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a front view schematic diagram of a wearable device according to an embodiment of the present application.

[0030] Figure 2 is a cross-sectional schematic diagram of a soft pad of a wearable device according to an embodiment of the present application.

[0031] Figure 3 is a schematic diagram of a wearable device worn on a user according to an embodiment of the present application.

[0032] Figure 4A 1 is a temperature variation curve of the first detection position of the soft pad of the wearable device according to the comparative example, the first embodiment and the second embodiment of the present application.

[0033] Figure 4B 1 is a temperature variation curve of the second detection position of the soft pad of the wearable device according to the comparative example, the first embodiment and the second embodiment of the present application. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0035] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0040] Figure 1 is a front view schematic diagram of a wearable device 1 according to an embodiment of the present application. Figure 1 In this embodiment, the wearable device 1 is a headset, and the wearable device 1 includes a cushion 10 configured to contact the periphery of the user's ear. Figure 1In some embodiments, the cushion 10 is used as a cushion for headphones, but the present application is not limited thereto. In other embodiments, the cushion 10 can be disposed in other types of wearable devices and arranged at a location that contacts the user. In some embodiments, the wearable device is, for example, a smart watch, smart glasses, a virtual reality device, a smart ring, etc.

[0041] Figure 2 is a cross-sectional schematic diagram of a soft pad 10 for a wearable device according to an embodiment of the present application. For example, Figure 2 The cushion 10 is suitable for Figure 1 Wearable device 1. Please refer to Figure 2 The cushion 10 includes an outer cover layer 100 and an inner cushion 300. In some embodiments, the cushion 10 further includes a heat radiation layer 200.

[0042] The outer cover layer 100 includes a first substrate (not shown separately), a heat conductive material (not shown separately) and a first heat storage material (not shown separately). The heat conductive material and the first heat storage material are dispersed in the first substrate.

[0043] In some embodiments, the outer cover layer 100 is artificial leather, and the first substrate includes a polymer material. For example, the material of the first substrate includes polyurethane (PU), polyvinyl chloride (PVC), polyester (PE), Oxford fabric, or other suitable materials or combinations thereof.

[0044] In some embodiments, the thermally conductive material includes graphene, alumina, silica, polyol, cryogel, or other suitable materials or combinations of the foregoing.

[0045] In some embodiments, the first heat storage material includes phase change materials (PCM), such as paraffin, fatty acid, salt hydrate or other suitable materials or a combination of the foregoing materials.

[0046] In some embodiments, the thermal conductivity of the thermally conductive material in the outer cover layer 100 is greater than the thermal conductivity of the first heat storage material in the outer cover layer 100 .

[0047] In some embodiments, the thermal enthalpy value of the first heat storage material in the outer cover layer 100 is greater than the thermal enthalpy value of the thermal conductive material in the outer cover layer 100 .

[0048] In some embodiments, the total weight percentage of the heat conductive material and the first heat storage material in the outer cover layer 100 is 30 wt % to 40 wt %.

[0049] In some embodiments, the total weight of the thermal conductive material and the first heat storage material is 100 parts by weight, the thermal conductive material accounts for 10 to 20 parts by weight, and the first heat storage material accounts for 80 to 90 parts by weight.

[0050] In some embodiments, the heat enthalpy value of the outer cover layer 100 is less than 5 J / g by adding a heat conductive material and a first heat storage material into the outer cover layer 100. For example, the heat enthalpy value of the outer cover layer 100 is 1.3 J / g to 5 J / g.

[0051] In this embodiment, adding a heat-conducting material to the outer cover layer 100 helps to transfer heat energy along the parallel direction (i.e., the horizontal direction) of the outer cover layer 100. On the other hand, adding a first heat storage material to the outer cover layer 100 helps to conduct heat energy to the inner pad 300 along the vertical direction perpendicular to the surface of the outer cover layer 100. In order to ensure the performance of the wearable device, the thermal enthalpy value of the outer cover layer 100 needs to be controlled within 5 J / g. This is because if too much first heat storage material (such as PCM) is added, the structure of the outer cover layer 100 may become hard, causing the outer cover layer 100 to crack or become brittle under a higher temperature process.

[0052] In some embodiments, the thickness t1 of the outer cover layer 100 is 0.1 mm to 0.3 mm.

[0053] The outer cover layer 100 is disposed on the outer side of the inner pad 300. For example, the outer cover layer 100 surrounds the inner pad 300, and the inner pad 300 is accommodated in the outer cover layer 100. In some embodiments, the outer cover layer 100 completely surrounds or partially surrounds the inner pad 300.

[0054] The inner pad 300 includes a second substrate (not shown separately) and a second heat storage material (not shown separately). The second heat storage material is dispersed in the second substrate.

[0055] In some embodiments, the second substrate is a porous elastomeric structure. For example, the material of the second substrate includes inert foam, polyurethane elastomer, natural sponge, polyethylene foam elastomer, ethylene-vinyl acetate (EVA) elastomer, silicone elastomer, polypropylene elastomer or other suitable materials or combinations of the foregoing materials.

[0056] In some embodiments, the second heat storage material comprises a phase change material (PCM), such as paraffin, fatty acid, salt hydrate or other suitable material or combination of the foregoing materials. The second heat storage material in the inner pad 300 is the same as or different from the first heat storage material in the outer cover layer 100.

[0057] In some embodiments, the weight percentage of the second heat storage material in the inner pad 300 is 20 wt % to 40 wt %.

[0058] In some embodiments, by adding a second heat storage material into the inner pad 300 , the thermal enthalpy value of the inner pad 300 is made greater than the thermal enthalpy value of the outer cover layer 100 .

[0059] In some embodiments, the difference between the enthalpy of the inner pad 300 and the enthalpy of the outer cover layer 100 is greater than 45 J / g. In some embodiments, the enthalpy of the inner pad 300 is greater than or equal to 50 J / g, preferably greater than or equal to 80 J / g. For example, the enthalpy of the inner pad 300 is 50 J / g to 200 J / g, 70 J / g to 180 J / g, 80 J / g to 160 J / g, 90 J / g to 150 J / g, or other suitable ranges.

[0060] In some embodiments, the thermal conductivity of the outer cover layer 100 is greater than that of the inner pad 300 , thereby allowing heat to be preferably conducted along the horizontal direction on the outer cover layer 100 .

[0061] In some embodiments, the heat storage coefficient of the inner pad 300 is greater than the heat storage coefficient of the outer cover layer 100, thereby enabling the inner pad 300 to have better heat storage capacity and heat regulation capacity.

[0062] The heat radiation layer 200 is located between the inner pad 300 and the outer cover layer 100. In some embodiments, the heat radiation layer 200 includes a breathable material or a porous material. For example, the heat radiation layer 200 includes a knitted fabric or other suitable materials.

[0063] The thickness t2 of the heat radiation layer 200 is 0.1 mm to 0.3 mm.

[0064] In some embodiments, the heat radiation layer 200 is bonded to the outer cover layer 100 through an adhesive layer (not shown separately), and the heat radiation layer 200 is against the inner pad 300. In other words, the heat radiation layer 200 may not be directly bonded to the inner pad 300. In other embodiments, the heat radiation layer 200 is further bonded to the inner pad 300 through another adhesive layer.

[0065] In this embodiment, the outer cover layer 100 includes a heat absorbing surface 102 and a heat dissipating surface 104. Specifically, when a user wears the wearable device, the heat dissipating surface 104 of the outer cover layer 100 is exposed to the outside air, and the heat absorbing surface 102 of the outer cover layer 100 contacts the user's skin. Figure 2 As shown, heat enters the cushion 10 from the heat absorbing surface 102 along the heat absorbing direction D1 , and then the heat is conducted to the heat dissipating surface 104 and leaves the cushion 10 along the heat dissipating direction D2 .

[0066] In this embodiment, the design of the thermal enthalpy value of the outer cover layer 100 and the thermal enthalpy value of the inner pad 300 helps to generate a temperature difference between the outer cover layer 100 and the inner pad 300, thereby promoting heat transfer in the heat radiation layer 200. In addition, since heat has the characteristic of transferring from high temperature to low temperature, the heat in the soft pad 10 can be driven to the heat dissipation surface 104 exposed to the outside air and leave the soft pad 10 from the heat dissipation surface 104.

[0067] Figure 3 is a schematic diagram of a wearable device worn on a user according to an embodiment of the present application. Figure 3 In this embodiment, the wearable device is, for example, an earphone, and the soft pad 10 of the wearable device is disposed around the ear of the user.

[0068] Figure 4A 1 is a temperature variation curve of the first detection position of the soft pad of the wearable device according to the comparative example, the first embodiment and the second embodiment of the present application (corresponding to the curves numbered 0, 1 and 2 respectively). Figure 4B is a temperature variation curve of the second detection position of the soft pad of the wearable device according to the comparative example, the first embodiment and the second embodiment of the present application (corresponding to the curves labeled 0, 1 and 2, respectively). Figure 3 The temperature changes of the first detection position 11 and the second detection position 12 on the cushion 10 are tested, and the results are as follows: Figure 4A and Figure 4B The first detection position 11 is located at the place where the outer cover layer contacts the user's skin, and the second detection position 12 is located at the heat radiation layer.

[0069] exist Figure 4A and Figure 4B In the present invention, the soft pads of the comparative example, the first embodiment and the second embodiment all include an outer cover layer, a heat radiation layer and an inner pad.

[0070] In the comparative example, the outer cover layer does not contain the heat conductive material and the first heat storage material (ie, only includes the first substrate).

[0071] In the first embodiment and the second embodiment, the outer cover layer includes a heat conductive material and a first heat storage material dispersed in the first substrate, and the thermal enthalpy value of the outer cover layer is controlled to be less than or equal to 5 J / g.

[0072] In the first and second embodiments, the difference between the thermal enthalpy of the inner pad and the thermal enthalpy of the outer cover layer is greater than 45 J / g. Specifically, the thermal enthalpy of the inner pad of the first embodiment is 50 J / g, while the thermal enthalpy of the inner pad of the second embodiment is 80 J / g.

[0073] Depend on Figure 4A and Figure 4BIt can be seen that, in the initial wearing condition, the soft pads of the first embodiment and the second embodiment are higher than the inner pads of the comparative example in terms of surface temperature (temperature at the first detection position, such as Figure 4A ) or the internal temperature (the temperature of the second detection position, such as Figure 4B As shown in FIG. 1 , the surface temperature of the cushion of the first embodiment and the second embodiment (the temperature of the first detection position, as shown in FIG. 1 ) can not only be increased slowly, but also, when worn for a long time, the surface temperature (the temperature of the first detection position, as shown in FIG. 1 ) of the cushion of the first embodiment and the second embodiment can be increased slowly. Figure 4A ) or the internal temperature (the temperature of the second detection position, such as Figure 4B As shown), the temperature of the inner pad can be maintained at a lower temperature than that of the comparative example, and can be continuously and stably controlled within the comfortable range for the human body.

[0074] In summary, in the soft pad of the wearable device of the present application, the difference between the thermal enthalpy value of the inner pad and the thermal enthalpy value of the outer cover layer is greater than 45 J / g, which helps to improve the overall heat storage capacity of the soft pad and allows the heat energy in the soft pad to continuously dissipate away from the user's skin, thereby improving the user's comfort when wearing the wearable device for a long time.

[0075] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A soft pad for a wearable device, characterized in that: include: The outer cover layer comprises: a first substrate; and A heat conductive material and a first heat storage material are dispersed in the first substrate, and the heat enthalpy of the outer cover layer is less than or equal to 5 J / g; and Inner padding, including: a second substrate; and A second heat storage material is dispersed in the second substrate, wherein the thermal enthalpy of the inner pad is greater than that of the outer cover layer, and the difference between the thermal enthalpy of the inner pad and the thermal enthalpy of the outer cover layer is greater than 45 J / g.

2. The soft pad for a wearable device according to claim 1, characterized in that: The thermally conductive material includes at least one of the following materials: graphene, alumina, silicon dioxide, polyol, and cold gel.

3. The soft pad for a wearable device according to claim 1, characterized in that: The first heat storage material and the second heat storage material include phase change materials.

4. The soft pad for a wearable device according to claim 1, characterized in that: The total weight percentage of the heat conductive material and the first heat storage material in the outer cover layer is 30wt% to 40wt%.

5. The soft pad for a wearable device according to claim 1, characterized in that: Taking the total weight of the heat-conducting material and the first heat storage material as 100 parts by weight, the heat-conducting material accounts for 10 to 20 parts by weight, and the first heat storage material accounts for 80 to 90 parts by weight.

6. The soft pad for a wearable device according to claim 1, characterized in that: The weight percentage of the second heat storage material in the inner pad is 20wt% to 40wt%.

7. The soft pad for a wearable device according to claim 1, characterized in that: The cushion also includes: The heat radiation layer is located between the inner pad and the outer cover layer, and the thickness of the heat radiation layer is 0.1 mm to 0.3 mm.

8. The soft pad for the wearable device according to claim 7, characterized in that: The heat radiation layer is bonded to the outer cover layer through the bonding layer, and the heat radiation layer is against the inner pad.

9. The soft pad for a wearable device according to claim 1, characterized in that: The thickness of the outer cover layer is 0.1 mm to 0.3 mm.

10. The soft pad for a wearable device according to claim 1, characterized in that: The outer cover layer has a thermal conductivity greater than the inner pad.

11. The soft pad for a wearable device according to claim 1, characterized in that: The heat storage coefficient of the inner pad is greater than the heat storage coefficient of the outer cover layer.

12. The soft pad for a wearable device according to claim 11, characterized in that: The inner pad is accommodated in the outer cover layer.

13. The soft pad for a wearable device according to claim 1, characterized in that: The second substrate is a porous elastic body structure, and the second heat storage material is dispersed in the porous elastic body.

14. The soft pad for a wearable device according to claim 1, characterized in that: The outer cover layer includes a heat absorbing surface and a heat dissipating surface. When a user wears the wearable device, the heat dissipating surface is exposed to the outside air, and the heat absorbing surface contacts the skin of the user.

15. The soft pad for a wearable device according to claim 1, characterized in that: The thermal enthalpy of the outer cover layer is 1.3-5 J / g, and the thermal enthalpy of the inner pad is greater than 80 J / g.

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