Circuit boards and electronic devices

Abstract

The present disclosure provides a circuit board and an electronic device, and belongs to the technical field of electronics. The circuit board comprises a substrate and a first conductive layer, the first conductive layer is located on one side of the substrate, the first conductive layer comprises first conductive parts and first reinforcing parts which are distributed at intervals, the first conductive parts are used for transmitting current, the first reinforcing parts are floating, the first conductive parts and the first reinforcing parts are insulated from each other, and the first conductive parts and the first reinforcing parts are both located on one side of the substrate. The present disclosure can improve the strength of the circuit board and solve the problem that the circuit board is prone to cracks.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology, and in particular to a circuit board and an electronic device. Background Technology

[0002] Printed circuit boards (PCBs) serve as carriers for electronic components, enabling electrical connections between them, and are an essential component of electronic devices. PCBs typically include high-density interconnect (HDI) boards and integrated circuit (ICS) boards.

[0003] In related technologies, printed circuit boards typically include a substrate and conductive layers located on opposite sides of the substrate. The substrate is usually made of resin, which, due to its poor rigidity, is prone to cracking or even breaking upon impact. Summary of the Invention

[0004] This disclosure provides a circuit board and an electronic device that can improve the strength of the circuit board and alleviate the problem of circuit boards being prone to cracking. The technical solution is as follows:

[0005] This disclosure provides a circuit board, which includes a substrate and a first conductive layer. The first conductive layer is located on one side of the substrate. The first conductive layer includes a first conductive portion and a first reinforcing portion that are spaced apart. The first conductive portion is used to transmit current. The first reinforcing portion is floating. The first conductive portion and the first reinforcing portion are insulated from each other. Both the first conductive portion and the first reinforcing portion are located on one side of the substrate.

[0006] In one implementation of this disclosure, the circuit board has opposite first and second sides, with the first conductive portion and the first reinforcing portion both located on the first side; the circuit board further includes a second conductive layer, which includes spaced-apart second conductive portions and second reinforcing portions, the second conductive portions being used to transmit current, the second reinforcing portions being floating, the second conductive portions and the second reinforcing portions being insulated from each other, and both the second conductive portions and the second reinforcing portions being located on the second side.

[0007] In another implementation of the present disclosure, the orthographic projection of the first reinforcement portion on the second side surface and the orthographic projection of the second reinforcement portion on the second side surface may at most partially overlap.

[0008] In another implementation of the present disclosure, the first reinforcement and the second reinforcement each include a plurality of reinforcement blocks arranged at intervals.

[0009] In another implementation of the present disclosure, the shape of the orthographic projection of the reinforcing block on the first side is a polygon or a circle.

[0010] In another implementation of the present disclosure, a plurality of the enhancement blocks are arranged in an array on the same side, with the spacing between two adjacent enhancement blocks being 1016 μm to 1270 μm.

[0011] In another implementation of this disclosure, the maximum width of the reinforcing block is 508 μm to 1016 μm, and the width direction of the reinforcing block is parallel to the first side surface.

[0012] In another implementation of the embodiments of this disclosure, the substrate includes a photosensitive material layer or a resin layer.

[0013] In another implementation of this disclosure, the circuit board further includes a first insulating layer and a plurality of first connecting strips. The first insulating layer is located within the gaps of the first reinforcing portions and covers the first conductive portions. The plurality of first connecting strips are located on the surfaces of the first insulating layer and the first reinforcing portions away from the substrate. Any two adjacent first reinforcing portions correspond to one first connecting strip, and the two ends of each first connecting strip are respectively connected to the two adjacent first reinforcing portions. The circuit board further includes a second insulating layer and a plurality of second connecting strips. The second insulating layer is located within the gaps of the second reinforcing portions and covers the second conductive portions. The plurality of second connecting strips are located on the surfaces of the second insulating layer and the second reinforcing portions away from the substrate. Any two adjacent second reinforcing portions correspond to one second connecting strip, and the two ends of each second connecting strip are respectively connected to the two adjacent second reinforcing portions.

[0014] This disclosure provides an electronic device, which includes a circuit board as described above.

[0015] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0016] The circuit board substrate provided in this embodiment has a first conductive layer on one side. The first conductive layer includes first conductive portions and first reinforcing portions spaced apart. The first conductive portions are used to transmit current, and the first reinforcing portions are floating, meaning they are not energized and are considered unused structures on the substrate, thus insulating the first conductive portions and the first reinforcing portions from each other. By providing the first reinforcing portion on one side of the substrate, the first reinforcing portion can absorb the impact force generated by the circuit board due to impact, thereby preventing the substrate from easily cracking and improving the rigidity and strength of the substrate.

[0017] Furthermore, both the first reinforcing portion and the first conductive portion are part of the first conductive layer, meaning that the first reinforcing portion and the first conductive portion are of the same layer structure. This allows the first reinforcing portion and the first conductive portion to be formed in a single patterning process during fabrication, thereby improving fabrication efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this disclosure;

[0020] Figure 2 This is a projection relationship diagram of an enhancement portion on a second side surface provided in an embodiment of this disclosure;

[0021] Figure 3 This is a projection relationship diagram of an enhancement portion on a second side surface provided in an embodiment of this disclosure;

[0022] Figure 4 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this disclosure.

[0023] The markings in the diagram are explained as follows:

[0024] 10. Substrate;

[0025] 11. First side surface; 12. Second side surface; 13. Through hole;

[0026] 20. First conductive layer;

[0027] 21. First conductive part; 22. First reinforcing part;

[0028] 30. Second conductive layer;

[0029] 31. Second conductive part; 32. Second reinforcing part;

[0030] 41. First insulating layer; 42. Second insulating layer;

[0031] 51. First connecting strip; 52. Second connecting strip;

[0032] 60. Reinforcing components. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0034] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0035] Figure 1 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this disclosure. For example... Figure 1 As shown, the circuit board includes a substrate 10 and a first conductive layer 20. The first conductive layer 20 is located on one side of the substrate 10 and includes a first conductive portion 21 and a first reinforcing portion 22 spaced apart.

[0036] The first conductive part 21 is used to transmit current, the first reinforcing part 22 is floating, the first conductive part 21 and the first reinforcing part 22 are insulated from each other, and both the first conductive part 21 and the first reinforcing part 22 are located on one side of the substrate 10.

[0037] In this embodiment of the present disclosure, the first reinforcement portion is floating, meaning that the first reinforcement portion is not energized and belongs to the empty area in the first conductive layer, and the first reinforcement portion is insulated from the first conductive portion.

[0038] The circuit board substrate provided in this embodiment has a first conductive layer on one side. The first conductive layer includes first conductive portions and first reinforcing portions spaced apart. The first conductive portions are used to transmit current, and the first reinforcing portions are floating, meaning they are not energized and are considered unused structures on the substrate, thus insulating the first conductive portions and the first reinforcing portions from each other. By providing the first reinforcing portion on one side of the substrate, the first reinforcing portion can absorb the impact force generated by the circuit board due to impact, thereby preventing the substrate from easily cracking and improving the rigidity and strength of the substrate.

[0039] Furthermore, both the first reinforcing portion and the first conductive portion are part of the first conductive layer, meaning that the first reinforcing portion and the first conductive portion are of the same layer structure. This allows the first reinforcing portion and the first conductive portion to be formed in a single patterning process during fabrication, thereby improving fabrication efficiency.

[0040] Optionally, such as Figure 1 As shown, the circuit board has a first side 11 and a second side 12 that are opposite to each other, and the first conductive part 21 and the first reinforcing part 22 are both located on the first side 11.

[0041] like Figure 1 As shown, the circuit board also includes a second conductive layer 30, which includes a second conductive portion 31 and a second reinforcing portion 32 spaced apart. The second conductive portion 31 is used to transmit current, and the second reinforcing portion 32 is floating. The second conductive portion 31 and the second reinforcing portion 32 are insulated from each other, and both the second conductive portion 31 and the second reinforcing portion 32 are located on the second side 12.

[0042] In this embodiment of the present disclosure, the second reinforcement portion being floating means that the second reinforcement portion is not energized, belongs to the empty area in the second conductive layer, and is insulated from the second conductive portion.

[0043] The circuit board substrate 10 provided in this embodiment has a first conductive layer 20 on its first side 11 and a second conductive layer 30 on its second side 12. The second conductive layer 30 includes second conductive portions 31 and second reinforcing portions 32 spaced apart, both located on the second side 12. By providing the second reinforcing portions 32 on the second side 12 of the substrate 10, the second reinforcing portions 32 can distribute the impact force generated by the impact on the circuit board, thereby preventing the substrate 10 from easily cracking and improving the rigidity and strength of the location of the second side 12 of the substrate 10. By providing conductive layers on both sides of the substrate and using reinforcing portions in the conductive layers to enhance the strength and rigidity of both sides of the substrate, the stability of the substrate is improved.

[0044] Furthermore, the second reinforcing portion 32 and the second conductive portion 31 both belong to a portion of the second conductive layer 30, that is, the second reinforcing portion 32 and the second conductive portion 31 are of the same layer structure. In this way, during the preparation and processing, the second reinforcing portion 32 and the second conductive portion 31 can be formed by a single patterning process, thereby improving the preparation efficiency.

[0045] Optionally, the orthographic projection of the first reinforcement 22 on the second side surface 12 and the orthographic projection of the second reinforcement 32 on the second side surface 12 may at most partially overlap.

[0046] Among them, two orthographic projections with at most partial overlap means that the two orthographic projections have partially overlapping regions, or that the two orthographic projections do not overlap at all.

[0047] In one implementation, Figure 2 This is a projection diagram of a reinforcement portion on the second side surface 12 provided in an embodiment of this disclosure. (See diagram below.) Figure 2 As shown, both the first reinforcing part 22 and the second reinforcing part 32 are rectangular, and the corners of the first reinforcing part 22 coincide with the corners of the second reinforcing part 32.

[0048] In another implementation, the orthographic projection of the first reinforcement 22 on the second side 12 is outside the orthographic projection of the second reinforcement 32 on the second side 12, that is, the two orthographic projections do not overlap.

[0049] In the above implementation, complementary reinforcement is achieved by ensuring that most of the reinforcing portions located on the first side 11 and the second side 12 are not opposite each other. Specifically, a first reinforcing portion 22 is provided in a portion of the first side 11 to reinforce that portion, and a second reinforcing portion 32 is provided in a portion of the second side 12 to reinforce that portion. The reinforced areas on the first side 11 and the second side 12 are complementary, meaning the combined reinforced areas can cover an entire side of the substrate 10. This effectively protects the side of the substrate 10 while reducing the number of reinforcing portions on the side of the substrate 10, thus reserving more space on the side of the substrate 10 for forming conductive portions.

[0050] Optionally, such as Figure 2 As shown, the first reinforcing part 22 and the second reinforcing part 32 each include a plurality of reinforcing blocks arranged at intervals.

[0051] In this embodiment of the disclosure, the reinforcement block can also be a dummy electrode. A dummy electrode is a region in the conductive layer that is not used for conducting electricity. That is, the dummy electrode is not energized during the use of the circuit board and belongs to the free area in the conductive layer.

[0052] The first reinforcing part 22 and the second reinforcing part 32 are configured as plate-shaped reinforcing blocks, and the reinforcing blocks are arranged at intervals to form a sufficient number of gaps. Since the conductive layer of the conductive part is used for current transmission circuits, the arrangement of the reinforcing blocks at intervals to form a sufficient number of gaps is beneficial for the conductive part to be arranged on the side of the substrate 10.

[0053] Optionally, the shape of the orthographic projection of the reinforcing block on the first side 11 is a polygon or a circle.

[0054] For example, such as Figure 2 As shown, the shape of the orthographic projection of the reinforcing block on the first side 11 is a square.

[0055] For example, Figure 3 This is a projection diagram of a reinforcement portion on a second side surface provided in an embodiment of this disclosure. For example... Figure 3As shown, the shape of the orthographic projection of the reinforcing block on the first side 11 is circular.

[0056] Compared to a square, a circular reinforcing block occupies a smaller area for the same width. Therefore, making the reinforcing block circular allows for more space to be allocated to the conductive parts.

[0057] Optionally, such as Figure 2 , 3 As shown, multiple reinforcement blocks are arranged in an array on the same side, with the spacing H between two adjacent reinforcement blocks ranging from 1016 μm to 1270 μm.

[0058] In this embodiment of the disclosure, the spacing between two adjacent reinforcing blocks refers to the distance between the two nearest sides of the two reinforcing blocks in the arrangement direction of the two reinforcing blocks, that is, the minimum spacing between the two reinforcing blocks.

[0059] For example, such as Figure 2 As shown, the spacing between two adjacent reinforcing blocks is the spacing between the opposite sides of two square reinforcing blocks.

[0060] In some other embodiments, the spacing between two adjacent reinforcing blocks may also refer to the distance between the two farthest points on the two reinforcing blocks in the arrangement direction of the two reinforcing blocks, that is, the maximum spacing between the two reinforcing blocks.

[0061] In some other implementations, the spacing between two adjacent reinforcement blocks can also refer to the average of the maximum and minimum spacing in the arrangement direction of the two reinforcement blocks, that is, the average spacing between the two reinforcement blocks.

[0062] In the above implementation, setting the spacing between two adjacent reinforcing blocks within this range can avoid the spacing between the two reinforcing blocks being too narrow, which would not provide sufficient space for the conductive parts, and can also avoid the spacing between the reinforcing blocks being too large, which would not be able to fully improve the lateral strength of the substrate 10.

[0063] For example, the spacing between two adjacent reinforcement blocks is 1100 μm.

[0064] Optionally, the maximum width L of the reinforcing block is 508 μm to 1016 μm, and the width direction of the reinforcing block is parallel to the first side 11.

[0065] For example, when the enhancement block is rectangular, the maximum width of the enhancement block is the length of the diagonal of the rectangle.

[0066] For example, when the reinforcement block is circular, the maximum width of the reinforcement block is the diameter of the circle.

[0067] By setting the maximum width of the reinforcing block within the above range, it is possible to avoid setting the width of the reinforcing block too small, resulting in a small area of ​​the reinforcing block attached to the side of the substrate 10, which would fail to adequately protect the substrate 10.

[0068] For example, the maximum width of the enhancement block is 1000 μm.

[0069] Optionally, the thickness of the substrate 10 is no greater than 100 μm. By controlling the thickness of the substrate 10 to be below 100 μm, the thickness of the circuit board can be effectively reduced, the amount of materials used in the fabrication of the circuit board can be reduced, and the circuit board can be made lighter.

[0070] For example, the thickness of the substrate 10 is 50 μm.

[0071] Optionally, the thickness of the first conductive layer 20 is no greater than 100 μm. By controlling the thickness of the first conductive layer 20 to be below 100 μm, the thickness of the circuit board can be effectively reduced, the amount of materials used in the fabrication of the circuit board can be reduced, and the circuit board can be made lighter. At the same time, the thinner conductive layer in the circuit board is beneficial for heat dissipation and improves the reliability of the circuit board.

[0072] For example, the thickness of the first conductive layer 20 can be 30 μm.

[0073] Optionally, the thickness of the second conductive layer 30 is no greater than 100 μm. By controlling the thickness of the second conductive layer 30 to be below 100 μm, the thickness of the circuit board can be effectively reduced, the amount of materials used in the fabrication of the circuit board can be reduced, and the circuit board can be made lighter. At the same time, the thinner conductive layer in the circuit board is beneficial for heat dissipation and improves the reliability of the circuit board.

[0074] For example, the thickness of the second conductive layer 30 can be 30 μm.

[0075] Optionally, the substrate 10 includes a photosensitive material layer or a resin layer.

[0076] In some implementations, the substrate 10 can be a photosensitive material layer. Since the first conductive layer 20 located on the first side 11 and the second conductive layer 30 located on the second side 12 of the substrate 10 need to be connected, through holes 13 are usually formed on the substrate 10 to connect the first side 11 and the second side 12, so that the first circuit board and the second circuit board can be connected through the through holes 13.

[0077] Since the through-hole 13 can be formed directly on the photosensitive material layer through exposure and development, without the need for lamination, mechanical drilling and laser drilling, the process of opening through-hole 13 on the substrate 10 can be effectively simplified, and the fabrication efficiency of the circuit board can be improved.

[0078] For example, the photosensitive material layer is 50 μm to 100 μm.

[0079] Optionally, the cross-sectional shape of the through hole 13 is circular, polygonal, elliptical, or an irregular closed shape.

[0080] For example, the cross-sectional shape of the through hole 13 is triangular. In this way, the cross-section of the portion of the first conductive part 21 located inside the through hole 13 is also triangular. Under the constraint of the side wall of the through hole 13, the portion of the first conductive part 21 inside the through hole 13 is less likely to rotate or loosen within the through hole 13.

[0081] For example, the cross-sectional shape of the through hole 13 is rectangular. Compared to a triangle, setting the shape of the through hole 13 to be rectangular results in a larger area for the same maximum length. Therefore, setting the shape of the through hole 13 to be rectangular allows more material to be filled into the through hole 13 for the fabrication of the first conductive part 21, which is beneficial for the transmission of current from the first conductive part 21 to the second conductive part 31.

[0082] For example, the cross-sectional shape of the through hole 13 is circular. The sidewalls of the circular through hole 13 are curved. Compared with the polygonal through hole 13, the sidewalls of the polygonal through hole 13 have bends, and the material of the first conductive part 21 is not easy to fill the bends during the deposition process. However, the sidewalls of the circular through hole 13 are smoother. When the first conductive part 21 is deposited in the through hole 13, the material of the first conductive part 21 is more likely to fill all corners of the through hole 13, thereby improving the connection reliability of the first conductive part 21 and the second conductive part 31.

[0083] In some implementations, the substrate 10 may be a resin layer.

[0084] For example, substrate 10 may be an epoxy resin layer.

[0085] When the substrate 10 is made of resin, the resin layer can provide support for the first conductive layer 20 and the second conductive layer 30. When drilling holes in the substrate 10, the resin material can also reduce the resistance of the drilling process.

[0086] Optionally, the substrate 10 is a resin layer, and the resin layer is filled with glass fiber.

[0087] By filling the resin layer with glass fiber, the strength of the resin layer can be effectively enhanced, thereby improving the impact resistance of the resin layer.

[0088] In some other implementations, the substrate 10 may include a first resin layer, a glass fiber layer, and a second resin layer stacked sequentially. That is, a composite layer is formed by sandwiching a glass fiber layer between two resin layers.

[0089] Compared to filling the resin layer with glass fiber, inserting a whole layer of glass fiber directly in the middle of the resin layer can greatly improve the strength of the substrate 10 and make the substrate 10 less prone to cracking under impact.

[0090] For example, the substrate 10 may include a plurality of resin layers and a plurality of glass fiber layers stacked alternately.

[0091] The number of resin layers and glass fiber layers can be determined according to the required thickness of the substrate 10.

[0092] In this implementation, multiple glass fiber layers can be inserted into the resin layer, and each glass fiber layer is provided with a resin layer as a support layer for the glass fiber layer, so that the distribution of glass fiber layers in the thickness direction of the substrate 10 is more uniform, thereby ensuring that the strength of each area of ​​the substrate 10 is consistent and improving the impact resistance of the substrate 10.

[0093] Optionally, such as Figure 3 As shown, the circuit board also includes a first insulating layer 41 and a plurality of first connecting strips 51. The first insulating layer 41 is located in the gap of the first reinforcing part 22 and covers the first conductive part 21. The plurality of first connecting strips 51 are located on the surface of the first insulating layer 41 and the first reinforcing part 22 away from the substrate 10. Any two adjacent first reinforcing parts 22 correspond to one first connecting strip 51. The two ends of each first connecting strip 51 are respectively connected to the two adjacent first reinforcing parts 22.

[0094] By filling the gaps in the first reinforcing portions 22 with a first insulating layer 41, the first reinforcing portions 22 and the first conductive portions 21 are isolated, preventing current from flowing from the first conductive portions 21 to the first reinforcing portions 22. Simultaneously, the first connecting strip 51 can overlap the first insulating layer 41, that is, span the first conductive portions 21 to connect the two first reinforcing portions 22 located on either side of the first conductive portions 21. In this way, by providing multiple first connecting strips 51 connecting adjacent first conductive portions, all the first reinforcing portions 22 are connected together, forming a mesh structure.

[0095] When the circuit board generates heat during operation, the first reinforcement 22 at any position on the substrate 10 can absorb the heat. Since the first reinforcement 22 is connected by the first connecting strip 51, the heat can be transferred to any area of ​​the mesh structure through the first connecting strip 51, which is beneficial for conducting heat to the edge of the circuit board and improving the heat dissipation effect of the circuit board.

[0096] like Figure 3As shown, the circuit board also includes a second insulating layer 42 and a plurality of second connecting strips 52. The second insulating layer 42 is located within the gap of the second reinforcing portion 32 and covers the second conductive portion 31. The plurality of second connecting strips 52 are located on the surfaces of the second insulating layer 42 and the second reinforcing portion 32 away from the substrate 10. Any two adjacent second reinforcing portions 32 correspond to one second connecting strip 52, and the two ends of each second connecting strip 52 are respectively connected to the two adjacent second reinforcing portions 32.

[0097] By filling the gaps in the second reinforcing portions 32 with a second insulating layer 42, the second reinforcing portions 32 and the second conductive portion 31 are isolated, preventing current from flowing from the second conductive portion 31 to the first reinforcing portion 22. Simultaneously, the provided second connecting strip 52 can overlap the second insulating layer 42, that is, span across the second conductive portion 31 to connect the two second reinforcing portions 32 located on either side of the second conductive portion 31. In this way, by providing multiple second connecting strips 52 connecting adjacent second conductive portions, all the second reinforcing portions 32 are connected together, forming a mesh structure.

[0098] When the circuit board generates heat during operation, the second reinforcement 32 at any position on the substrate 10 can absorb the heat. Since the second reinforcement 32 is connected by the second connecting strip 52, the heat can be transferred to any area of ​​the mesh structure through the second connecting strip 52, which is beneficial for conducting heat to the edge of the circuit board and improving the heat dissipation effect of the circuit board.

[0099] Optionally, Figure 4 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this disclosure. For example... Figure 4 As shown, the substrate 10 has a through hole 13 that connects the first conductive part 21 and the second conductive part 31.

[0100] Optionally, such as Figure 4 As shown, the circuit board also includes a reinforcement 60 located within the through hole 13.

[0101] The stiffness of the reinforcing member 60 is higher than that of the substrate 10. Thus, by setting the reinforcing member 60 in the through hole 13, the weakening of the substrate 10 caused by the opening of the through hole 13 can be effectively compensated, thereby improving the reliability of the circuit board.

[0102] For example, the reinforcement 60 may be an insulating material, such as a ceramic component.

[0103] Optionally, the first conductive portion 21 located within the through hole 13 covers the reinforcing member 60, and the ratio of the volume of the first conductive portion 21 within the through hole 13 to the volume of the reinforcing member 60 is not less than 2 / 3. This avoids the reinforcing member 60 occupying a large space in the through hole 13, resulting in less material for the first conductive portion 21 within the through hole 13, which is not conducive to improving the connection reliability of the first conductive portion 21 and the second conductive portion 31.

[0104] In this embodiment of the disclosure, the reinforcement on the circuit board may be located only on a portion of the substrate surface. For example... Figure 4 As shown, the left side of the substrate has dummy metal retained during the fabrication of the conductive layer. This dummy metal serves as a reinforcement and can be used to enhance the strength of the substrate surface. The right side of the substrate does not retain dummy metal, allowing for a larger area to be used to fabricate the conductive layer.

[0105] In some other implementations, the reinforcements on the circuit board can also be located across the entire surface of the substrate to maximize the strength of the substrate surface.

[0106] This disclosure provides an electronic device, which includes a circuit board as described above.

[0107] For example, the electronic device can be any electronic device including a circuit board, such as a server, mobile phone, computer, television, game console, or electronic watch.

[0108] The above is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A circuit board, characterized by, The circuit board comprises a substrate (10) and a first conductive layer (20) located on one side of the substrate (10), the first conductive layer (20) comprises first conductive parts (21) and first reinforcing parts (22), the first conductive parts (21) are used for transmitting current, the first reinforcing parts (22) are floating, the first conductive parts (21) and the first reinforcing parts (22) are insulated from each other, and the first conductive parts (21) and the first reinforcing parts (22) are located on one side of the substrate (10). The circuit board has opposite first and second sides (11, 12), and the first conductive parts (21) and the first reinforcing parts (22) are located on the first side (11). The circuit board further comprises a second conductive layer (30) comprising second conductive parts (31) and second reinforcing parts (32), the second conductive parts (31) are used for transmitting current, the second reinforcing parts (32) are floating, the second conductive parts (31) and the second reinforcing parts (32) are insulated from each other, and the second conductive parts (31) and the second reinforcing parts (32) are located on the second side (12). The first and second reinforcing parts (22, 32) each comprise a plurality of reinforcing blocks arranged at intervals, the reinforcing blocks are plate-shaped, the reinforcing blocks are idle electrodes in the first conductive layer that are not used for conduction, and the reinforcing blocks are arranged in any area on opposite sides of the substrate (10). The circuit board further comprises a first insulating layer (41) located in the gaps of the first reinforcing parts (22) and covering the first conductive parts (21), and a plurality of first connecting strips (51) located on the surfaces of the first insulating layer (41) and the first reinforcing parts (22) away from the substrate (10), any two adjacent first reinforcing parts (22) correspond to one first connecting strip (51), and the two ends of each first connecting strip (51) are connected to the corresponding adjacent first reinforcing parts (22). The circuit board further comprises a second insulating layer (42) located in the gaps of the second reinforcing parts (32) and covering the second conductive parts (31), and a plurality of second connecting strips (52) located on the surfaces of the second insulating layer (42) and the second reinforcing parts (32) away from the substrate (10), any two adjacent second reinforcing parts (32) correspond to one second connecting strip (52), and the two ends of each second connecting strip (52) are connected to the corresponding adjacent second reinforcing parts (32).

2. The circuit board of claim 1, wherein The first reinforcing parts (22) on the second side (12) are at most partially overlapped with the second reinforcing parts (32) on the second side (12) in orthographic projection.

3. The circuit board of claim 1, wherein The shape of the orthographic projection of the reinforcing blocks on the first side (11) is a polygon or a circle.

4. The circuit board of claim 1, wherein The plurality of reinforcing block arrays are arranged on the same side, and the distance between two adjacent reinforcing blocks is 1016 μm to 1270 μm.

5. The circuit board of claim 1, wherein The maximum width of the reinforcing block is 508 μm to 1016 μm, and the width direction of the reinforcing block is parallel to the first side face (11).

6. The circuit board according to any one of claims 1 to 5, characterized by The substrate (10) comprises a photosensitive material layer or a resin layer.

7. An electronic device, comprising: The electronic device comprises the circuit board according to any one of claims 1 to 6.

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