Satellite-borne distributed double-laminated structure based on flexible PCB connection and installation method thereof

Abstract

The invention discloses a satellite-borne distributed double-lamination structure based on flexible PCB connection and an installation method thereof. The satellite-borne distributed double-lamination structure comprises the steps that a top heat dissipation layer is connected with a distributed PCB layer, a bottom PCB layer is connected with a bottom heat dissipation layer, and the distributed PCB layer is connected with the bottom PCB layer through a flexible connection PCB. According to the invention, flexible PCB connection is utilized, the problem of simple and reliable connection of different types of signals between layers of a satellite-borne double-laminated structure is solved, the problem of complex design of a heat dissipation structure caused by inconsistent heights of modules under a distributed double-layer design is also solved, and the method has the advantages of simplifying design, improving safe and reliable connection between layers, and improving the reliability of the heat dissipation structure. And the heat dissipation effect of each layer is optimized. The design has universality for the design of a double-laminated structure in the current satellite field, can solve the problems of inter-plate connection and heat dissipation in a narrow space in the design of a satellite system, provides effective support for improving the functional density of a satellite single machine / a subsystem / a whole satellite, and has important engineering application value.

Description

Technical Field

[0001] The invention relates to a satellite-borne distributed double-laminated structure based on flexible PCB connection and an installation method thereof, and belongs to the field of satellite system structure design. Background Art

[0002] With the continuous development of satellite technology, one of the development trends is miniaturization and lightweight, which inevitably brings huge challenges to the size, weight, power consumption, etc. of satellites. In order to achieve this goal, more and more satellites have broken the constraints of the subsystem concept in system structure design and started to use a single machine or even a single board to implement satellite system design, but this also brings up issues such as how to achieve interconnection between single boards and heat dissipation of high-power chips in a small space.

[0003] In the current mainstream design, connectors are used to solve the interconnection between single boards, but the interconnection in the form of connectors faces the following problems: 1) The signal transmission rate is limited, and the selection and cost of high-speed signal connectors need special consideration; 2) The power signal, high-speed signal and low-speed signal need to use different wire diameters and different forms of transmission lines, which are complicated; 3) If a wiring connector is used, the routing of the transmission line and the binding and fixing problems need to be considered, and the height of the upper and lower double connector bases is also a bottleneck for space compression; 4) If a plug-in connector is used, it will cause the height of each top surface of the layered PCB to be inconsistent, which will bring additional workload to the subsequent heat dissipation design. The use of flexible PCBs for interconnection between single boards, especially layered single boards, is a better solution to avoid the above problems.

[0004] The invention relates to a satellite-borne distributed double-layer structure design and installation method based on flexible PCB connection, which utilizes flexible PCB to realize interconnection between single boards under the double-layer structure design, and has the advantages of flexibility, simplicity, reliability, etc. Summary of the invention

[0005] The purpose of the present invention is to provide a satellite-borne distributed double-layer structure based on flexible PCB connection and an installation method thereof in view of the deficiencies in the prior art.

[0006] The object of the present invention is achieved by the following technical solutions: a satellite-borne distributed double-layer structure based on flexible PCB connection, the structure comprising a top heat dissipation layer, a distributed PCB board layer, a bottom PCB board layer, a bottom heat dissipation layer and a flexible connection PCB;

[0007] The distributed PCB board layer is modularly designed, and several distributed PCB board layers are connected to the top heat dissipation layer through the first boss; the bottom PCB board layer is connected to the bottom heat dissipation layer through the second boss; each distributed PCB board layer is connected to the bottom PCB board layer through a flexible connection PCB.

[0008] Furthermore, the top heat dissipation layer and the bottom heat dissipation layer are both made of aluminum alloy or titanium alloy to ensure heat dissipation.

[0009] Furthermore, the distributed PCB board layer expands the functions and performance of the distributed PCB layer through modular design.

[0010] Furthermore, thermal conductive silicone grease is applied on the first boss, and the distributed PCB board layer is connected to the top heat dissipation layer through the first mounting and fixing structure, so that the distributed PCB board layer is in close contact with the first boss through the thermal conductive silicone grease.

[0011] Furthermore, thermal conductive silicone grease is applied on the second boss, and the bottom PCB board layer and the bottom heat dissipation layer are connected through the second mounting and fixing structure, so that the bottom PCB board layer is in close contact with the second boss through the thermal conductive silicone grease.

[0012] On the other hand, the present invention provides a method for installing a satellite-borne distributed double-layer structure based on flexible PCB connection, characterized in that it includes the following steps:

[0013] 1) Connect the distributed PCB layer and the top heat dissipation layer;

[0014] 2) Connect the bottom PCB layer to the bottom heat dissipation layer;

[0015] 3) Connect the distributed PCB layer to the bottom PCB layer.

[0016] Furthermore, in step 1), the first boss of the top heat dissipation layer is coated with thermal grease, and is respectively connected and fixed to the distributed PCB board layer through a first mounting and fixing structure; in step 2), the second boss of the bottom heat dissipation layer is coated with thermal grease, and is connected and fixed to the bottom PCB board layer through a second mounting and fixing structure; in step 3), the distributed PCB board layer is connected to the bottom PCB board layer using a flexible connection PCB.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1) The satellite-borne distributed double-layer structure design of the flexible PCB connection adopted in the present invention solves the problem of different signals having different requirements on wire diameter and connector form by designing different line widths of PCB, realizes the integrated transmission of various required signals, and has the advantages of flexible customization, simplicity and effectiveness;

[0019] 2) The satellite-borne distributed double-layer structure design connected by flexible PCB adopted in the present invention can realize more reliable high-speed signal interconnection between double-layer boards under the premise of low cost and convenient design by using PCB design;

[0020] 3) The satellite-borne distributed double-layer structure design and installation method connected with a flexible PCB adopted in the present invention utilizes the flexible characteristics of the flexible PCB and the current installation method to solve the complex structural design caused by the height inconsistency of the top of the distributed layer PCB under the distributed double-layer structure design, simplify the design, facilitate installation, and ensure effective heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of a satellite-borne distributed double-layer structure based on flexible PCB connection.

[0023] Figure 2 It is a method for installing a satellite-borne distributed double-stack structure based on flexible PCB connection.

[0024] Figure 3 The present invention is a schematic diagram of an implementation example of a distributed PCB board layer of a satellite-borne four-module distributed double-layer structure based on flexible PCB connection. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific implementation examples described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] The following is a detailed description of an application example of a satellite-borne distributed dual-stack structure design and installation method based on flexible PCB connection:

[0027] The satellite-borne distributed double-layer structure based on flexible PCB connection designed by the present invention is as follows Figure 1As shown, it includes a top heat dissipation layer 1, a distributed PCB board layer 2, a bottom PCB board layer 3, a bottom heat dissipation layer 4, a flexible connection PCB5, a first mounting and fixing structure 6 and a second mounting and fixing structure 7; the top heat dissipation layer 1 (including four first bosses 8) and the bottom heat dissipation layer 4 (according to the number of heat dissipation chips required by the bottom PCB, it can include several second bosses 9, and the present invention is designed as one for example) can be processed with good heat dissipation materials to ensure heat dissipation, and the distributed PCB board layer 2 adopts four modules as an example (including a first distributed PCB board layer 2-1, a second distributed PCB board layer 2-2, a third distributed PCB board layer 2-3 and a fourth distributed PCB board layer 2-4) to expand the functions and performances of the distributed PCB layer, such as increasing the computing power and storage capacity of the system, and the bottom PCB board layer 3 adopts a whole board design, so four flexible connection PCB5 are used to realize the connection between the four modules of the distributed PCB board layer 2 and the bottom PCB board layer 3, and the first mounting and fixing structure 6 and the second mounting and fixing structure 7 can be implemented in the form of pad columns, screws, nuts and gaskets. The connection method of each part is as follows: the top heat dissipation layer 1 and the distributed PCB board layers 2 of the four modules are closely contacted with thermal conductive silicone grease through four first bosses 8, and are respectively connected through the first mounting and fixing structure 6; the bottom PCB board layer 3 and the bottom heat dissipation layer 4 are closely contacted with thermal conductive silicone grease through the second boss 9, and are connected through the second mounting and fixing structure 7; the distributed PCB board layers 2 of the four modules are respectively connected with the bottom PCB board layer 3 using four flexible connection PCBs 5.

[0028] The installation method of the satellite-borne distributed double-layer structure based on flexible PCB connection, the installation steps are as follows:

[0029] Step 1): Apply thermal grease to the four first bosses 8 of the top heat dissipation layer, and connect and fix them to the distributed PCB board layers 2 of the four modules through the first mounting and fixing structure 6;

[0030] Step 2): Apply thermal grease to the second boss 9 of the bottom heat dissipation layer, and connect and fix it to the bottom PCB board layer 3 through the second mounting and fixing structure 7;

[0031] Step 3): Use four flexible connection PCBs 5 to connect the distributed PCB layers 2 of the four modules with the bottom PCB layer 3.

[0032] The satellite-borne distributed double-laminated structure design connected by the flexible PCB adopted by the present invention can solve the problem of inconsistent requirements of different signals on wire diameter and connector form by designing different line widths of PCB during PCB layout and wiring, realize the integrated transmission of various required signals, and have the advantages of flexible customization, simplicity and effectiveness; the high-speed signal interconnection between double-layer boards can be realized under the premise of low cost and convenient design by using PCB design; the satellite-borne distributed double-laminated structure installation method connected by the flexible PCB adopts the flexible characteristics of the flexible PCB and the current installation method to solve the complex structural design caused by the height inconsistency of the top of the distributed layer PCB under the distributed double-layer structure design, simplify the design, and facilitate installation, while ensuring effective heat dissipation. The design of the present invention is universal to the double-laminated structure design in the current satellite field, can solve the problems of board connection and heat dissipation in a narrow space in the satellite system design, and provide effective support for improving the functional density of satellite stand-alone / subsystem / whole satellite, and has important engineering application value.

[0033] The above description of the disclosed example enables the professional and technical personnel in the field to implement or use the present invention. Various modifications to this example will be obvious to the professional and technical personnel in the field. What is defined in this article is only the application example of the design and installation method of the satellite-borne distributed double-layer structure connected by the flexible PCB of the present invention, but the number of modules of the distributed PCB is not limited to 2 and 4 mentioned in the article, and only the modification of the number should fall within the protection scope of the corresponding claims of the present invention; the form of the bottom PCB layer is not limited to a whole piece, and the number of bottom bosses is not limited to 1, and it can also be a multi-module distributed form. The modification of the number of other modules and the number of bosses should also fall within the protection scope of the corresponding claims of the present invention; each layer uses conventional materials, the heat dissipation layer uses different metals, and the PCB layer uses different materials, which should also fall within the protection scope of the corresponding claims of the present invention; the top and the bottom are only distinguished for the convenience of description, not a strict definition, and the replacement of the top and the bottom should also fall within the protection scope of the corresponding claims of the present invention. Therefore, the present invention will not be limited to the example shown in this article, but should conform to the widest range consistent with the principles disclosed in this article.

Claims

1. A satellite-borne distributed double-layer structure based on flexible PCB connection, characterized in that: The structure includes a top heat dissipation layer, a distributed PCB board layer, a bottom PCB board layer, a bottom heat dissipation layer and a flexible connection PCB; The distributed PCB board layer is modularly designed, and several distributed PCB board layers are connected to the top heat dissipation layer through the first boss; the bottom PCB board layer is connected to the bottom heat dissipation layer through the second boss; each distributed PCB board layer is connected to the bottom PCB board layer through a flexible connection PCB.

2. The satellite-borne distributed double-layer structure based on flexible PCB connection according to claim 1 is characterized in that: The top heat dissipation layer and the bottom heat dissipation layer are both made of aluminum alloy or titanium alloy to ensure heat dissipation.

3. The satellite-borne distributed double-layer structure based on flexible PCB connection according to claim 1 is characterized in that: The distributed PCB board layer expands the functions and performance of the distributed PCB layer through modular design.

4. The satellite-borne distributed double-layer structure based on flexible PCB connection according to claim 1 is characterized in that: Thermal conductive silicone grease is applied on the first boss, and the distributed PCB board layer is connected to the top heat dissipation layer through the first mounting fixing structure, so that the distributed PCB board layer is in close contact with the first boss through the thermal conductive silicone grease.

5. The satellite-borne distributed double-layer structure based on flexible PCB connection according to claim 1 is characterized in that: Thermal conductive silicone grease is applied on the second boss, and the bottom PCB board layer and the bottom heat dissipation layer are connected through the second mounting fixing structure, so that the bottom PCB board layer is in close contact with the second boss through the thermal conductive silicone grease.

6. A method for installing a satellite-borne distributed double-layer structure based on flexible PCB connection according to any one of claims 1 to 5, characterized in that: The following steps are involved: 1) Connect the distributed PCB layer and the top heat dissipation layer; 2) Connect the bottom PCB layer to the bottom heat dissipation layer; 3) Connect the distributed PCB layer to the bottom PCB layer.

7. The installation method of the satellite-borne distributed double-layer structure based on flexible PCB connection according to claim 6 is characterized in that: In step 1), the first boss of the top heat dissipation layer is coated with thermal grease, and is connected and fixed to the distributed PCB board layer through a first mounting and fixing structure; in step 2), the second boss of the bottom heat dissipation layer is coated with thermal grease, and is connected and fixed to the bottom PCB board layer through a second mounting and fixing structure; in step 3), the distributed PCB board layer is connected to the bottom PCB board layer using a flexible connection PCB.

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