Optical coupler chip and packaging method of optical coupler chip

Abstract

The invention discloses an optocoupler chip and a packaging method of the optocoupler chip, and relates to the field of semiconductor electronic component packaging, and the optocoupler chip comprises a substrate and a plurality of photoelectric coupling modules arranged on the front surface of the substrate; the substrate is provided with a signal circuit through a copper-clad plate; the light receiving chip and the light emitting source are electrically connected to the signal circuit through lead bonding; the transparent isolator covers the light receiving chip and the light emitting source; the back surface of the substrate is provided with a plurality of electric connectors used for being electrically connected with an external circuit. According to the packaged optical coupling chip, the limitation of the number of pins, the arrangement position and the space design is avoided, the optical coupling chip can be more flexibly designed into various complex circuits matched with functions, the number of signal electric connectors can be more than 100 easily, more complex integrated packaging with other SOC chips is achieved, and the optical coupling chip is wide in application range, high in applicability and easy to popularize. The optical coupler chip production device can meet the production requirements of double-channel or multi-channel optical coupler chips, is small in size and occupied space, can be flexibly customized, and can meet the requirements of more application scenes.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor electronic component packaging, in particular to an optocoupler chip and a packaging method for the optocoupler chip. Background Art

[0002] The optocoupler chip is an integrated circuit chip that works based on the photoelectric principle and can realize the mutual conversion of electricity, light and electricity. The optocoupler transmits electrical signals using light as the medium. It has a good isolation effect on the input and output electrical signals and is widely used in various circuits.

[0003] Traditional optocoupler chips mostly adopt the packaging form of SOP small outline package, which packages the light source and light sensing chip into a single-channel optocoupler chip. For example, the patent document with patent number CN209487506U discloses an optocoupler chip SSR integrated circuit and a planar frame, which mainly includes a light-emitting component, a photoelectric receiving component and a metal circuit frame. The light-emitting component and the photoelectric receiving component are filled with silicone to achieve electrical insulation and light path. When the circuit is connected, the LED lamp emits light, and the photosensitive transistor triggers the internal control circuit to turn on when receiving light, thereby realizing the conduction of the entire circuit.

[0004] The current optocoupler chip packaging method uses a copper frame as a circuit carrier, and then installs the light-emitting diode and the light-receiving chip on the surface of the copper frame. The light-emitting diode and the light-receiving chip are respectively connected to the copper frame by welding with metal wires. After welding, the light-emitting diode and the light-receiving chip are plastic-sealed and filled with transparent resin glue. After filling, the pins of the copper frame are moved to 90 degrees through a mechanical mold to connect the pins to the external circuit and use the optocoupler chip.

[0005] Most optocoupler chip products packaged in this type of package are single-channel optocoupler chips. After the light-emitting element and the photoelectric receiving element are turned on, they can only be used for the control of a single circuit and cannot be applied to complex circuits with multiple channels. In addition, the pins of the light-emitting element and the photoelectric receiving element are respectively led out from the two sides of the chip after packaging. It is necessary to ensure electrical isolation between the pins and the welding of the pins. The size, number and arrangement of the pins are all limited, resulting in a small number of pins for each optocoupler chip, which cannot be used in highly integrated circuit boards. In addition, in order to meet the requirements of the light path, the silicone insulating ball between the light-emitting element and the photoelectric receiving element occupies a large volume, which makes the package volume of this type of traditional optocoupler chip products larger and cannot be used in smaller application spaces. Summary of the invention

[0006] The purpose of the present invention is to provide an optocoupler chip and a packaging method for an optocoupler chip to address the problem in the prior art that the number of pins and the arrangement positions of the light-emitting components and the photoelectric receiving components used for circuit connection are limited, and the components cannot be applied to multi-channel complex circuits or highly integrated complex circuits.

[0007] In order to achieve the above object, the technical solution adopted by the present invention is:

[0008] A photocoupler chip comprises: a substrate and a plurality of photoelectric coupling modules arranged on the front side of the substrate; the substrate is provided with a signal circuit through a copper-clad plate; the photoelectric coupling module comprises: a light receiving chip, a light source and a transparent isolator; the light receiving chip and the light source are both electrically connected to the signal circuit through wire bonding; the transparent isolator is coated on the light receiving chip and the light source; a plurality of electrical connectors matching the photoelectric coupling modules are provided on the back side of the substrate, and the electrical connectors are used to electrically connect to an external circuit.

[0009] The optical coupling chip of the present invention comprises a substrate and a plurality of optical coupling modules arranged on the front side of the substrate, a signal circuit is arranged on the substrate, and a connection circuit required for the optical coupling module is integrated and designed. The light receiving chip and the light source are electrically connected to the signal circuit through wire bonding, and then are externally connected through the electrical connector of the signal circuit, thereby eliminating the traditional pin direct connection setting and pin extension design, avoiding the limitation of the number of pins, arrangement position and space design, and the electrical signal path of the optical coupling chip can be more flexibly designed into a variety of complex circuits adapted to the functions. The optical coupling chip has a wide range of uses and strong applicability; and the optical coupling module The number and position arrangement of the optoelectronic coupling modules and electrical connectors can be integrated on both sides of the substrate by designing the signal circuit of the copper-clad board substrate, so that the number and position arrangement of the optoelectronic coupling modules and electrical connectors are not limited by the packaging design. According to the requirements of multi-channel complex circuits, a multi-channel optocoupler chip formed by multiple optoelectronic coupling modules can be arranged, which can meet the production needs of dual-channel or multi-channel optocoupler chips. The functionality of the optoelectronic coupling chip is relatively strong. The number of optoelectronic coupling modules and electrical connectors can be highly integrated into hundreds on both sides of the substrate, which is suitable for highly integrated complex circuits, and has a small size and occupies a small space, a wider range of applicable scenarios, and a high degree of universality.

[0010] Preferably, in the optocoupler chip described in the present invention, each of the optoelectronic coupling modules includes a plurality of the light sources, and each of the light receiving chips corresponds to the plurality of the light sources.

[0011] As a preferred embodiment of the present invention, by arranging multiple light sources in each optoelectronic coupling module, each light source can be electrically connected to different control circuits through a signal circuit, and then multiple light sources can be used to connect or control a circuit at the end of a light receiving chip from multiple circuits, thereby realizing multi-end control or one-to-many circuit connection, and further realizing that the optocoupler chip is suitable for more complex circuits and has enhanced functionality.

[0012] Preferably, in the optocoupler chip described in the present invention, a light-proof encapsulation body is further provided on the outside of the transparent isolator; the light-proof encapsulation body is coated on the outside of the transparent isolator.

[0013] As a preferred solution of the present invention, the light-proof package can prevent external light from interfering with the internal light receiving chip, further improve the effectiveness of the optocoupler connection, reduce the probability of erroneous on and off, and further enhance the stability and safety of the use of the optocoupler chip.

[0014] Preferably, in the optocoupler chip described in the present invention, the upper surface of the light-proof packaging body is parallel to the plane of the substrate, and the exterior of the light-proof packaging body is square.

[0015] As a preferred solution of the present invention, by setting the upper surface of the opaque packaging body to be parallel to the plane of the substrate and the exterior to be square, it is possible to arrange arranged optoelectronic coupling modules on the side of the optocoupler chip, so that a plurality of vertically or horizontally arranged optoelectronic coupling modules can be combined more tightly and arranged more neatly, and further a plurality of optoelectronic coupling modules can be arranged in a limited space to realize optoelectronic coupling circuits with more channels, further facilitating integrated packaging and integrated use, and improving the performance of the optocoupler chip.

[0016] Preferably, in the optocoupler chip described in the present invention, the electrical connector is configured as a metal pad; and a plurality of the electrical connectors are linearly arrayed on the substrate.

[0017] As a preferred solution of the present invention, by setting the electrical connection head as a metal pad, when using the optocoupler chip, by electrically connecting the connection end of the external circuit board and the metal pad, it can be connected to the external circuit for use, further facilitating the integrated installation of the optocoupler chip.

[0018] Preferably, in the optocoupler chip described in the present invention, the electrical connector is configured as a solder pad contact point; the solder pad contact point is welded with a solder ball; and a plurality of the solder pad contact points are linearly arrayed on the substrate.

[0019] As a preferred embodiment of the present invention, the electrical connector is set as a solder pad contact point, and the solder pad contact point is welded with a tin ball to form a tin ball contact point. When the optocoupler chip is used and packaged, the tin ball contact point is welded to the electrical connection of the external integrated circuit to achieve fast and efficient integrated installation, thereby further enhancing the convenience and firmness of the optocoupler chip.

[0020] To achieve the purpose of the present invention, the present invention also provides a packaging method for an optical coupling chip, comprising the following steps:

[0021] S1. Design the substrate according to the circuit requirements of the light source and the light receiving chip so that the signal circuit of the substrate meets the requirements of the required circuit; and set a first wire bonding contact point and a second wire bonding contact point corresponding to the light source and the light receiving chip respectively on the front side of the substrate;

[0022] S2. Through chip welding process, the light source and the light receiving chip are mounted on the front side of the substrate with glue or adhesive film;

[0023] S3, using a wire bonding process to connect the light source and the light receiving chip to the first wire bonding point and the second wire bonding point respectively using metal wires;

[0024] S4, filling the melted transparent insulating material on the front side of the substrate and covering each of the photoelectric coupling modules through a plastic encapsulation process, and then injection molding the transparent resin through pressure to form a transparent isolator;

[0025] S5. Through a plastic encapsulation process, the melted black insulating material is wrapped around the outside of the transparent isolation body and molded to form an opaque packaging body.

[0026] The packaging method of the optocoupler chip described in the present invention can design a matching substrate according to the model of the light source and the model of the light receiving chip after determining the number of channels of the optocoupler chip; the substrate can be made of a double-layer board or a multi-layer board to realize a multi-layer copper clad board stacking design, with flexible wiring, and the chip position can be flexibly arranged, for example, a left-right symmetrical or up-down symmetrical layout, to realize dual-channel or multi-channel optocoupler chip packaging; through the chip welding process and the wire bonding process, the light source and the light receiving chip are fixed and the electrical signal is connected to the signal circuit of the substrate, so that the light source and the light receiving chip are firmly connected and packaged and fixed, and the packaging method is convenient and reliable; through the plastic sealing process, a transparent isolator and an opaque packaging body are plastic-sealed in each optocoupler module, the transmittance of the transparent isolator can reach more than 90%, and it has strong electrical insulation performance for the light source and the light receiving chip, the plastic sealing method has good molding, and the compactness of the transparent isolator and the opaque packaging body is enhanced, thereby improving the performance of the optocoupler chip.

[0027] Preferably, the packaging method of the optical coupler chip of the invention further comprises the following steps:

[0028] S6. Through the ball planting process, after the solder ball is adhered with flux, it is placed on the pad contact point on the back side of the substrate; through high-temperature reflow soldering, the solder ball is soldered to the surface of the substrate.

[0029] As a preferred embodiment of the present invention, the solder balls can be soldered to the contact points on the back of the substrate through the above-mentioned solder ball soldering process, and then the solder balls can be soldered to the surface of the substrate through high-temperature reflow soldering, thereby realizing an optocoupler chip packaged as a solder ball contact point, enhancing the convenience and firmness of the connection of the optocoupler chip during use, reducing the risk of poor contact or disconnection, and improving the performance of the optocoupler chip.

[0030] Preferably, in the packaging method of the optical coupling chip of the invention, the forming of the transparent isolator and the opaque packaging body specifically comprises the following steps:

[0031] Through pressure extrusion or mold forming process, the upper surface of the transparent spacer forms a plane parallel to the substrate, and the exterior of the transparent spacer and the opaque packaging body are formed into a square.

[0032] As a preferred embodiment of the present invention, a transparent insulator or opaque packaging body with a fixed and regular shape can be produced through a plastic encapsulation process of extrusion or mold molding, and the upper surface of the transparent insulator can be further formed into a plane parallel to the substrate, which is convenient for molding and packaging and has a better molding effect.

[0033] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0034] 1. The optical coupling chip avoids the limitation of the number of pins, arrangement position and space design. The electrical signal path of the optical coupling chip can be more flexibly designed into a variety of complex circuits adapted to the functions. The number of signal electrical connectors can easily exceed 100, and more complex integrated packaging can be achieved with other SOC chips. The optical coupling chip has a wide range of uses and strong applicability.

[0035] 2. The number and position arrangement of the optocoupler chip, optocoupler module, and electrical connector are not limited by the packaging design. According to the requirements of complex multi-channel circuits, a multi-channel optocoupler chip formed by multiple optocoupler modules can be arranged to meet the production needs of dual-channel or multi-channel optocoupler chips. The volume and occupied space are small, the packaged product is small, can be flexibly customized, can meet the needs of more application scenarios, and has a wider range of applicable scenarios and high universality.

[0036] 3. The packaging method of the optocoupler chip can be highly integrated, and the packaging method is convenient and reliable, thereby improving the performance of the optocoupler chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a vertical cross-sectional schematic diagram of the optical coupling chip of the present invention;

[0038] Figure 2 is a front schematic diagram of a substrate of the present invention;

[0039] Figure 3 It is a schematic diagram of a state in which a light source and a light receiving chip are arranged on a substrate of the present invention;

[0040] Figure 4 It is a schematic diagram of the state in which the light source and the light receiving chip of the present invention are welded to the substrate;

[0041] Figure 5 It is a schematic top view of the state where the optical coupling chip of the present invention is provided with a light-proof packaging body;

[0042] Figure 6 is a schematic diagram a of the back side of the substrate of the present invention;

[0043] Figure 7 is a schematic diagram b of the back side of the substrate of the present invention;

[0044] Icons: 1. Substrate; 11. First welding wire contact point; 12. Second welding wire contact point; 13. Metal wire; 2. Photoelectric coupling module; 21. Light receiving chip; 22. Light source; 23. Transparent insulator; 3. Electrical connector; 31. Metal pad; 32. Solder ball; 4. Optical-opaque package. DETAILED DESCRIPTION

[0045] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0046] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0047] Embodiment 1:

[0048] refer to Figures 1 to 7 As shown, this embodiment provides an optocoupler chip, including: a substrate 1 and a plurality of optocoupler modules 2 arranged on the front side of the substrate 1; the substrate 1 is provided with a signal circuit through a copper-clad plate; the optocoupler module 2 includes: a light receiving chip 21, a light source 22 and a transparent insulator 23; the light receiving chip 21 and the light source 22 are both electrically connected to the signal circuit through wire bonding; the transparent insulator 23 is coated on the light receiving chip 21 and the light source 22; a plurality of electrical connectors 3 matching the optocoupler modules 2 are provided on the back side of the substrate 1, and the electrical connectors 3 are used to electrically connect to an external circuit.

[0049] It should be noted that the substrate 1 described in the present invention is understood to be a conventional integrated circuit substrate 1, and a signal circuit can be set through a copper clad plate. Figure 2 As shown in the schematic diagram of the front side of the substrate 1, a signal circuit is formed inside the substrate 1 through a copper-clad plate, a first welding wire contact point 11 and a second welding wire contact point 12 are formed on the front side of the substrate 1, and a light source 22 and a light receiving chip 21 are respectively connected to the first welding wire contact point 11 and the second welding wire contact point 12 through a metal wire 13, so that the light source 22 and the light receiving chip 21 are respectively connected to the signal circuit of the substrate 1; the photoelectric coupling module 2 is understood to be capable of realizing the conversion of optical and electrical connections according to a photoelectric sensor, for example, in the present invention, as long as the light source 22 emits light, a light channel is formed through the transparent isolator 23, and after the light receiving chip 21 receives the light, it can respond to the circuit connected to one end of the light receiving chip 21 to be turned on, thereby realizing photoelectric coupling.

[0050] The transparent insulator 23 described in the present invention is understood to be a molded object made of transparent and insulating materials. Specifically, in the present invention, transparent resin is used as the material of the transparent insulator 23. The transparent resin can be melted at about 175°C, and then the transparent resin is filled in the optical coupling module through injection molding or plastic sealing process, and cooled and molded to form the transparent insulator 23; the isolation is understood to be insulating isolation, which is used to electrically isolate the light source 22 and the light receiving chip 21; more specifically, in the present invention, the transparent resin portion contains silicon dioxide, and the filling thickness is 0.5mm. The use of transparent resin of this thickness can, on the one hand, achieve the insulating isolation effect while satisfying the light propagation channel. The light source wavelength of 650nm can achieve a light transmittance of more than 90%, and on the other hand it is not too thick to affect the overall integrated assembly of the optical coupling chip.

[0051] The front side described in the present invention is understood as the side used to encapsulate the light source 22 and the light receiving chip 21, and the back side is understood as the side of the substrate 1 facing away from the light source 22 and the light receiving chip 21; the matching is understood as a matching signal circuit according to the specific design of the optocoupler control circuit, which can be achieved by a common circuit board design. The special thing is that the position and arrangement of the light source 22 and the light receiving chip 21 of the substrate 1 on the substrate 1 are different from the traditional optocoupler chip structure.

[0052] It should be noted that the light source 22 is understood to be an object that can emit light after being powered on. Specifically, the light source 22 in the present invention can be an LED lamp. Figure 1 Each photoelectric coupling module 2 includes a plurality of light sources 22, and each light receiving chip 21 corresponds to the plurality of light sources 22. Figure 3 and Figure 4As shown, in each optoelectronic coupling module 2, at least four light sources 22 are arranged around each light receiving chip 21, and then when the light receiving chip 21 receives light from any light source 22, optoelectronic coupling can be realized, and multi-end to one-end control of complex circuit on-off or signal response control can be achieved.

[0053] Specifically, refer to Figure 1 and Figure 5 As shown, a light-proof encapsulation body 4 is also provided outside the transparent isolator 23; the light-proof encapsulation body 4 is coated on the outside of the transparent isolator 23; it should be noted that the light-proof encapsulation body 4 is understood as an object that external light cannot pass through the encapsulation body and enter the inside of the transparent isolator 23. Specifically, the present invention uses black resin, which is coated on the outside of the transparent isolator 23 through a plastic encapsulation process, and a light-proof isolator is formed after molding to achieve light-proof plastic encapsulation, which can prevent external light from interfering with the internal light receiving chip 21. More specifically, the upper surface of the light-proof encapsulation body 4 is parallel to the plane of the substrate 1, and the outside of the light-proof encapsulation body 4 is square.

[0054] It should be noted that the electrical connector 3 described in the present invention is understood as a metal connector for connecting an external circuit. Figure 6 As shown, the back side of the substrate 1 of the present invention can be set to different electrical connectors 3 according to different packaging requirements, and the electrical connectors 3 are set to metal pads 31; multiple electrical connectors 3 are arranged in a linear array on the substrate 1; specifically, refer to Figure 7 As shown, it can also be set as a pad contact point; the pad contact point is welded with a solder ball 32; and a plurality of pad contact points are linearly arrayed on the substrate 1.

[0055] Embodiment 2:

[0056] On the basis of Example 1, this embodiment provides a packaging method for an optical coupling chip, which can package the optical coupling chip described in Example 1, and includes the following steps:

[0057] S1. According to the requirements of the required circuits of the light source 22 and the light receiving chip 21, the substrate 1 is designed so that the signal circuit of the substrate 1 meets the requirements of the required circuits; a first welding wire contact point 11 and a second welding wire contact point 12 corresponding to the light source 22 and the light receiving chip 21 are arranged on the front side of the substrate 1;

[0058] S2, through the chip welding process, the light source 22 and the light receiving chip 21 are mounted on the front side of the substrate 1 with glue or adhesive film;

[0059] S3, using a wire bonding process to connect the light source 22 and the light receiving chip 21 to the first wire bonding point 11 and the second wire bonding point 12 respectively using a metal wire 13;

[0060] S4, filling the melted transparent insulating material on the front side of the substrate 1 and covering each photoelectric coupling module 2 through a plastic encapsulation process, and then injection molding the transparent resin through pressure to form a transparent isolation body 23;

[0061] S5. Through a plastic encapsulation process, the melted black insulating material is wrapped around the outside of the transparent isolation body 23 and molded to form an opaque packaging body 4.

[0062] In the present invention, the substrate 1 is understood to be a common copper-clad resin substrate 1, which can be obtained by using a manufacturing process similar to a PCB board; the signal circuit in the present invention meets the requirements of the required circuit of the optocoupler module 2, and can be made into a circuit board that meets the requirements; for specific reference Figure 2-Figure 4 As shown, a first welding wire contact point 11 and a second welding wire contact point 12 are set on the front side of the circuit board. The first welding wire contact point 11 and the second welding wire contact point 12 are connected to the internal signal circuit when designing the circuit board, and are respectively welded to the metal conductive connection points of the light source 22 and the light receiving chip 21 on the outside, so that the electrical signal can be connected to the light source 22 and the light receiving chip 21.

[0063] Specifically, the forming of the transparent insulator 23 and the opaque packaging body 4 includes the following steps: through pressure extrusion or mold forming process, the upper surface of the transparent insulator 23 is formed into a plane parallel to the substrate 1, and the exterior of the transparent insulator 23 and the opaque packaging body 4 is formed into a square.

[0064] The packaging method of the optical coupling chip of the present invention further includes the following steps: S6, through the ball planting process, after the solder ball 32 is adhered with flux, it is placed on the pad contact point on the back of the substrate 1; through high-temperature reflow soldering, the solder ball 32 is soldered to the surface of the substrate 1. It should be noted that the high-temperature reflow soldering is understood to be able to solder the solder ball 32 to the surface of the substrate 1 under certain high-temperature melting technical conditions, for example, at a high temperature of about 245°C, the solder ball 32 is melted and then soldered to the surface of the substrate 1.

[0065] It should be noted that the ball planting process is understood as the ball planting process in the ball grid array packaging technology. In the present invention, if the package is an electrical connector 3 in the form of a metal pad 31, a grid array packaging process is adopted, and the electrical connector 3 needs to be set as a metal pad 31 on the back of the substrate 1, and step S6 is not required to complete the packaging of the optocoupler chip.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An optical coupler chip, characterized in that: include: A substrate (1) and a plurality of photoelectric coupling modules (2) arranged on the front side of the substrate (1); The substrate (1) is provided with a signal circuit through a copper-clad plate; The photoelectric coupling module (2) comprises: a light receiving chip (21), a light source (22) and a transparent isolator (23); the light receiving chip (21) and the light source (22) are both electrically connected to the signal circuit through wire bonding; the transparent isolator (23) is coated on the light receiving chip (21) and the light source (22); and a plurality of electrical connectors (3) matching the photoelectric coupling module (2) are provided on the back of the substrate (1), and the electrical connectors (3) are used to electrically connect to an external circuit.

2. The optical coupler chip according to claim 1, characterized in that: Each of the photoelectric coupling modules (2) comprises a plurality of the light sources (22), and each of the light receiving chips (21) corresponds to the plurality of the light sources (22).

3. The optical coupler chip according to claim 1, characterized in that: A light-proof encapsulation body (4) is also arranged outside the transparent isolating body (23); the light-proof encapsulation body (4) is coated on the outside of the transparent isolating body (23).

4. The optical coupler chip according to claim 3, characterized in that: The upper surface of the light-proof packaging body (4) is in a plane parallel to the substrate (1), and the exterior of the light-proof packaging body (4) is in a square shape.

5. The optical coupler chip according to any one of claims 1 to 4, characterized in that: The electrical connector (3) is configured as a metal pad (31); a plurality of the electrical connectors (3) are arranged in a linear array on the substrate (1).

6. The optical coupler chip according to any one of claims 1 to 4, characterized in that: The electrical connector (3) is configured as a solder pad contact point; a solder ball (32) is soldered to the solder pad contact point; and a plurality of the solder pad contact points are linearly arrayed on the substrate (1).

7. A packaging method for an optical coupler chip, characterized in that: The method for packaging the optical coupler chip according to any one of claims 1 to 6 comprises the following steps: S1. Designing the substrate (1) according to the circuit requirements of the light source (22) and the light receiving chip (21) so that the signal circuit of the substrate (1) meets the requirements of the required circuit; arranging a first welding wire contact point (11) and a second welding wire contact point (12) corresponding to the light source (22) and the light receiving chip (21) on the front side of the substrate (1); S2, using a chip welding process, attaching the light source (22) and the light receiving chip (21) to the front side of the substrate (1) using glue or adhesive film; S3, using a wire bonding process to connect the light source (22) and the light receiving chip (21) to the first wire bonding contact point and the second wire bonding contact point (12) respectively using a metal wire (13); S4, using a plastic encapsulation process, filling the front surface of the substrate (1) with melted transparent insulating material, and covering each of the photoelectric coupling modules (2), and then injection molding the transparent resin by pressure to form a transparent isolation body (23); S5. Through a plastic encapsulation process, the melted black insulating material is wrapped around the outside of the transparent isolation body (23) and molded to form a light-proof packaging body (4).

8. The method for packaging an optical coupling chip according to claim 7, characterized in that: The following steps are also included: S6. Through a ball planting process, the solder ball (32) is coated with soldering flux and then placed on a solder pad contact point on the back side of the substrate (1); and the solder ball (32) is soldered to the surface of the substrate (1) through high-temperature reflow soldering.

9. The method for packaging an optical coupling chip according to claim 7, characterized in that: The forming of the transparent isolating body (23) and the light-impermeable encapsulating body (4) specifically comprises the following steps: By means of pressure extrusion or mold forming technology, the upper surface of the transparent isolator (23) forms a plane parallel to the substrate (1), so that the exterior of the transparent isolator (23) and the light-proof packaging body (4) are formed into a square shape.

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