Electronic device replacement method and device, electronic equipment and readable storage medium

Abstract

The invention discloses an electronic device replacement method and device, electronic equipment and a computer readable storage medium. The method comprises the steps of creating a plurality of electronic device schematic diagrams corresponding to electronic devices according to specification standards of the electronic devices; encoding the schematic diagrams of the electronic devices to obtain a plurality of encoding schematic diagrams corresponding to the electronic devices, and adding encoding modification permissions about the electronic devices; when the code modification permission is started, if a material replacement command is received, determining a target electronic device and a modified code of the target electronic device according to the material replacement command; and calling a target code schematic diagram corresponding to the modified code, and performing material replacement on the target electronic device by using the target code schematic diagram. By applying the technical scheme provided by the invention, the electronic device can be replaced more quickly and efficiently, and meanwhile, the quality of the replaced electronic device can be effectively ensured.

Description

Technical Field

[0001] The present application relates to the field of hardware technology, and in particular to a method for replacing an electronic component, and also to an electronic component replacement device, an electronic device, and a computer-readable storage medium. Background Art

[0002] With the rapid development of computer technology, the demand for electronic devices is increasing, and board key material BOM management (a method of structuring, managing and controlling the list of component parts of a product) and design requirements are crucial to enterprises.

[0003] BOM material control is managed by main materials and substitute materials. Designers use the main materials as the main selected materials for library construction and schematic (symbol) design. Substitute materials are used as backup materials without schematics and are managed in another way. When the main material is disabled and the substitute material is upgraded to the main material, the new main material needs to be reviewed and symbols created. Obviously, this will inevitably reduce the efficiency of electronic component replacement, thereby extending the project cycle. Although it is also possible to directly kick out the disabled main material by manually modifying the system BOM list to replace the new material number, this implementation method has certain design risks of defective rate.

[0004] Therefore, how to achieve faster and more efficient replacement of electronic components while ensuring the quality of the replaced electronic components is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the present application is to provide an electronic component replacement method, which can achieve faster and more efficient electronic component replacement, while effectively ensuring the quality of the replaced electronic components; another purpose of the present application is to provide an electronic component replacement device, electronic device, computer-readable storage medium and computer program product, all of which have the above-mentioned beneficial effects.

[0006] In a first aspect, the present application provides a method for replacing an electronic device, comprising:

[0007] Creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standards of the electronic device;

[0008] Encode each of the electronic device schematics to obtain a plurality of coded schematics corresponding to the electronic device, and add coding modification authority for the electronic device;

[0009] When the code modification authority is enabled, if a material replacement command is received, a target electronic device and a modified code of the target electronic device are determined according to the material replacement command;

[0010] The target coding schematic diagram corresponding to the modified coding is retrieved, and the target coding schematic diagram is used to perform material replacement on the target electronic device.

[0011] Optionally, creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standard of the electronic device includes:

[0012] Obtaining a packaging form of the electronic device; wherein the packaging form includes a surface mount form and a dual in-line package form;

[0013] The size of the electronic device is calculated according to the packaging form to obtain a plurality of electronic device schematics that meet the specification standards.

[0014] Optionally, when the electronic device is a pad and the packaging form is the surface mount form, the size of the electronic device is calculated according to the packaging form to obtain a plurality of electronic device schematics that meet the specification standard, including:

[0015] Determine the maximum width standard value, the maximum height standard value, the length evaluation threshold range, and the width evaluation threshold range of the pad according to the specification standard of the pad;

[0016] Calculate the length range of the pad according to the maximum width standard value, the maximum height standard value, and the length evaluation threshold range;

[0017] Calculating the width range of the pad according to the width evaluation threshold range and the length range;

[0018] Creating a plurality of pad schematics that meet the specification standard according to the length range and the width range of the pad;

[0019] Accordingly, the method further comprises:

[0020] Obtain the current packaging standard corresponding to the packaging form;

[0021] The pin distance between two adjacent pads on the circuit board is determined according to the current packaging standard.

[0022] Optionally, when the electronic device is a pad and the package form is the dual in-line package form, the size of the electronic device is calculated according to the package form to obtain a plurality of electronic device schematics that meet the specification standard, including:

[0023] Determining a diameter ratio threshold range of the pad according to the specification standard of the pad; wherein the diameter ratio is a ratio between the pad diameter and the pad inner hole diameter;

[0024] A plurality of pad schematics meeting the specification standard are created according to the diameter ratio threshold range.

[0025] Optionally, encoding each of the electronic device schematics to obtain a plurality of encoded schematics corresponding to the electronic device includes:

[0026] Performing signal consistency check on a plurality of electronic device schematics corresponding to the electronic device;

[0027] When the signal consistency check passes, encoding each electronic device schematic to obtain a plurality of encoded schematics corresponding to the electronic device;

[0028] When the signal consistency check fails, an abnormal prompt is output.

[0029] Optionally, retrieving a target coding schematic diagram corresponding to the modified coding, and using the target coding schematic diagram to perform material replacement on the target electronic device, includes:

[0030] Retrieving the target coding schematic diagram corresponding to the modified code, and determining the target packaging form to which the target coding schematic diagram belongs;

[0031] The target coding schematic diagram is connected and drawn according to the target packaging form to achieve material replacement of the target electronic device.

[0032] Optionally, the code modification authority for the electronic device is added, including:

[0033] A coding setting attribute is added in the schematic design software, so as to set the coding modification authority of the electronic device through the coding setting attribute.

[0034] In a second aspect, the present application further discloses an electronic device replacement device, comprising:

[0035] A creation module, used for creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standards of the electronic device;

[0036] An encoding module, used for encoding each of the electronic device schematics, obtaining a plurality of encoding schematics corresponding to the electronic device, and adding a coding modification authority for the electronic device;

[0037] A determination module, configured to determine a target electronic device and a modified code of the target electronic device according to a material replacement command if a material replacement command is received when the code modification authority is enabled;

[0038] The material replacement module is used to retrieve the target coding schematic diagram corresponding to the modified code, and use the target coding schematic diagram to replace the material of the target electronic device.

[0039] In a third aspect, the present application further discloses an electronic device, comprising:

[0040] Memory for storing computer programs;

[0041] A processor is used to implement the steps of any one of the electronic component replacement methods described above when executing the computer program.

[0042] In a fourth aspect, the present application further discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any one of the electronic component replacement methods described above are implemented.

[0043] In a fifth aspect, the present invention further discloses a computer program product, including a computer program / instruction, which, when executed by a processor, implements the steps of any one of the electronic component replacement methods described above.

[0044] The present application provides an electronic component replacement method, comprising: creating multiple electronic component schematics corresponding to the electronic component according to the specification standards of the electronic component; encoding each of the electronic component schematics to obtain multiple coded schematics corresponding to the electronic component, and adding coding modification permissions for the electronic component; when the coding modification permissions are enabled, if a material replacement command is received, determining a target electronic component and a modified code of the target electronic component according to the material replacement command; retrieving a target coding schematic corresponding to the modified code, and using the target coding schematic to perform material replacement on the target electronic component.

[0045] By applying the technical solution provided in the present application, corresponding multiple electronic device schematics can be created in advance for any type of electronic device, and corresponding unique codes and code modification permissions can be added to achieve one electronic device corresponding to multiple coded schematics, so that the material replacement of the electronic device can be achieved by directly modifying the code. Moreover, during this replacement process, the system can automatically obtain relevant data of the new coded schematic to complete the replacement of the electronic device. There is no need for technical personnel to redesign the schematics for the replacement materials, and no manual operation is required. Obviously, the present technical solution can not only achieve faster and more efficient replacement of electronic devices, but also effectively ensure the quality of the replaced electronic devices.

[0046] In one embodiment of the present application, when designing an electronic device schematic for an electronic device, the specification standards and packaging forms of the electronic device can be specifically referred to to effectively ensure that each designed electronic device schematic meets its corresponding packaging form and specification standards, thereby further ensuring the accuracy of electronic device replacement and the quality of the replaced electronic device, and ensuring the quality of the circuit board to which the electronic device belongs.

[0047] The electronic component replacement device, electronic device, computer-readable storage medium and computer program product provided in this application also have the above-mentioned technical effects, and this application will not repeat them here. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the prior art and the embodiments of the present application, the drawings required for use in the description of the prior art and the embodiments of the present application are briefly introduced below. Of course, the drawings described below in relation to the embodiments of the present application are only part of the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work, and the obtained other drawings also belong to the protection scope of the present application.

[0049] Figure 1 A schematic diagram of a flow chart of an electronic device replacement method provided in this application;

[0050] Figure 2 A schematic diagram of an electronic device replacement provided for this application;

[0051] Figure 3 A schematic diagram of a flow chart of another electronic device replacement method provided in the present application;

[0052] Figure 4 A schematic diagram of the structure of an electronic device replacement device provided in this application;

[0053] Figure 5 A schematic diagram of the structure of an electronic device provided in this application. DETAILED DESCRIPTION

[0054] The core of the present application is to provide an electronic component replacement method, which can achieve faster and more efficient electronic component replacement, and at the same time can effectively ensure the quality of the replaced electronic components; another core of the present application is to provide an electronic component replacement device, electronic device, computer-readable storage medium and computer program product, all of which have the above-mentioned beneficial effects.

[0055] In order to describe the technical solutions in the embodiments of the present application more clearly and completely, the technical solutions in the embodiments of the present application will be introduced below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0056] An embodiment of the present application provides a method for replacing an electronic component.

[0057] Please refer to Figure 1 , Figure 1 This is a flow chart of an electronic component replacement method provided in the present application. The electronic component replacement method may include the following S101 to S104.

[0058] S101: Creating a plurality of electronic device schematics corresponding to the electronic devices according to the specification standards of the electronic devices.

[0059] This step aims to create electronic device schematics. Specifically, for any type of electronic device, a schematic can be created according to its specifications. It should be noted that the multiple electronic device schematics created here must all meet the specifications of the electronic device, such as size (height, width, length, thickness, angle, error range, etc.) to effectively ensure product quality. For example, if the length standard of an electronic device is 10mm~12mm, then three electronic device schematics with lengths of 10mm, 11mm, and 12mm can be created for it.

[0060] In one embodiment of the present application, creating multiple electronic device schematics corresponding to the electronic device according to the specification standard of the electronic device may include:

[0061] Obtaining the packaging form of the electronic device; wherein the packaging form includes a surface mount form and a dual in-line package form;

[0062] Calculate the size of electronic devices according to the packaging form and obtain multiple electronic device schematics that meet the specification standards.

[0063] The embodiment of the present application provides a method for creating an electronic device schematic. Specifically, when designing an electronic device schematic for an electronic device, it can be implemented by referring to the specification standards and packaging forms of the electronic device, so as to effectively ensure that each electronic device schematic designed meets its corresponding packaging form and specification standards, thereby further ensuring the accuracy of electronic device replacement and the quality of the replaced electronic device, and ensuring the quality of the circuit board to which the electronic device belongs. Among them, the packaging forms of electronic devices include surface mount form (SMT, Surface Mount Technology) and dual in-line package form (DIP, Dual In-line Package). These two packaging forms are two common electronic device assembly methods in the electronic manufacturing industry. There are significant differences between the two in terms of structure, performance, process characteristics, and applicable scenarios.

[0064] Wherein, when the electronic device is a pad and the package form is a surface mount form, the size of the electronic device is calculated according to the package form to obtain multiple electronic device schematics that meet the specification standards, including: determining the maximum width standard value, maximum height standard value, length evaluation threshold range, and width evaluation threshold range of the pad according to the specification standards of the pad; calculating the length range of the pad according to the maximum width standard value, the maximum height standard value, and the length evaluation threshold range; calculating the width range of the pad according to the width evaluation threshold range and the length range; and creating multiple pad schematics that meet the specification standards according to the length range and the width range of the pad;

[0065] Correspondingly, the method also includes: acquiring a current packaging standard corresponding to the packaging form; and determining a pin distance between two adjacent pads on the circuit board according to the current packaging standard.

[0066] The embodiment of the present application provides a method for creating a schematic diagram of an electronic device in a surface mount form with a pad. As described above, the specification standards of electronic devices limit information such as their size. Similarly, the specification standards of pads also limit the size information of pads, such as the above-mentioned maximum width standard value (maximum width allowed), maximum height standard value (maximum height allowed), length evaluation threshold range, width evaluation threshold range (threshold variation range when calculating length and width), etc. On this basis, the length range and width range of the pad can be calculated by combining this information, so that a plurality of pad lengths that meet the length range and pad widths that meet the width range can be created. Pad schematic diagrams. Furthermore, combined with the pad packaging form in the current actual application scenario, that is, the current packaging standard corresponding to the surface mount form, such as the total package length, the pin distance between two adjacent pads on the circuit board can be calculated to facilitate the subsequent PCB packaging of the pad.

[0067] Among them, when the electronic device is a pad and the packaging form is a dual in-line packaging form, the size of the electronic device is calculated according to the packaging form to obtain multiple electronic device schematics that meet the specification standards, including: determining the diameter ratio threshold range of the pad according to the specification standards of the pad; wherein the diameter ratio is the ratio between the pad diameter and the pad inner hole diameter; and creating multiple pad schematics that meet the specification standards according to the diameter ratio threshold range.

[0068] The embodiment of the present application provides a method for creating a schematic diagram of an electronic device with a pad in a dual in-line package. Unlike the surface mount form, the pad size required to be calculated in the dual in-line package specifically includes the pad diameter and the pad inner hole diameter, and it is sufficient to ensure that the diameter ratio of the pad diameter to the pad inner hole diameter in each pad schematic meets the corresponding threshold range (diameter ratio threshold range). Similarly, the pad spacing design can be further implemented in combination with the pad packaging form in the current actual application scenario, so as to complete the subsequent PCB packaging of the pad.

[0069] S102: Encode the schematic diagrams of each electronic device to obtain multiple encoded schematic diagrams corresponding to the electronic devices, and add coding modification authority for the electronic devices.

[0070] This step aims to realize the coding design and coding authority setting of electronic device schematics. For any type of electronic device, after creating multiple corresponding electronic device schematics, you can design a coding for each electronic device schematic, which is essentially to set a unique identifier. For example, if three electronic device schematics are created for a certain electronic device, you can add identifiers of code A, code B, and code C to each electronic device schematic, so as to obtain a coding schematic corresponding to each electronic device schematic.

[0071] Furthermore, it is also possible to add code modification permissions for the electrical device. That is to say, by modifying the code, the schematic diagram of the electronic device can be switched. For example, if the current coding schematic is the coding A schematic, the coding A schematic can be switched to the coding B schematic by entering the coding B, thus realizing the replacement of the electronic device.

[0072] Among them, adding the code modification authority for the electronic device may include: adding a code setting attribute in the schematic design software to set the code modification authority of the electronic device through the code setting attribute. It is understandable that the schematic design of the electronic device is implemented by the corresponding schematic design software, therefore, the code setting attribute can be directly added in the schematic design software, and the code modification authority can be added to the code setting attribute, thereby realizing the switching of the electronic device based on the code modification through the code setting attribute.

[0073] In one embodiment of the present application, encoding each electronic device schematic to obtain multiple encoded schematics corresponding to the electronic device may include:

[0074] Performing signal consistency check on multiple electronic device schematics corresponding to the electronic device;

[0075] When the signal consistency check passes, the schematic diagram of each electronic device is encoded to obtain multiple encoded schematic diagrams corresponding to the electronic device;

[0076] When the signal consistency check fails, an abnormal prompt is output.

[0077] In order to effectively ensure product quality, when coding and designing each electronic device schematic, it is also necessary to perform signal consistency check on multiple electronic device schematics corresponding to the same electronic device to ensure that the signals of multiple electronic device schematics corresponding to the same electronic device are consistent. It should be noted that signal consistency here can specifically include signal function, signal input and output direction, etc. Furthermore, when the signal consistency check of multiple electronic device schematics corresponding to the same electronic device fails, a corresponding abnormal prompt can be output to remind the technician that there is an error in the currently created electronic device schematic, so as to facilitate the redrawing of the electronic device schematic.

[0078] In a possible implementation, after encoding each electronic device schematic, obtaining multiple coded schematics corresponding to the electronic device, and adding coding modification permissions for the electronic device, the method may also include: adding association attributes between the electronic device schematic and the PCB packaging form in the schematic design software.

[0079] It can be seen that in the embodiment of the present application, in order to ensure the unity of the schematic design and the PCB package, the association attributes between the electronic device schematic and the PCB package form can also be added in the schematic design software to achieve the association between the electronic device schematic and the PCB package, thereby ensuring accurate replacement of electronic devices.

[0080] S103: When the code modification authority is enabled, if a material replacement command is received, a target electronic component and a modified code of the target electronic component are determined according to the material replacement command.

[0081] S104: Retrieve the target coding schematic diagram corresponding to the modified coding, and use the target coding schematic diagram to perform material replacement on the target electronic device.

[0082] As described above, after the coding design of the electronic device schematic and the coding authority setting are implemented, the schematic switching of the electronic device can be achieved by modifying the coding. On this basis, when the coding modification authority is turned on, if a material replacement command is received, the modified coding can be obtained according to the material replacement command, so that the schematic of the current electronic device (i.e., the target electronic device) is switched to the electronic device schematic corresponding to the modified coding (i.e., the target coding schematic), thereby achieving the replacement of the electronic device.

[0083] In one embodiment of the present application, retrieving a target coding schematic diagram corresponding to the modified coding, and using the target coding schematic diagram to perform material replacement on the target electronic device may include:

[0084] Retrieve the target coding schematic diagram corresponding to the modified coding, and determine the target packaging form to which the target coding schematic diagram belongs;

[0085] Connect and draw the target coding schematic according to the target packaging form to achieve material replacement of the target electronic device.

[0086] The embodiment of the present application provides a method for replacing a target electronic device based on a target coding schematic diagram. It is understandable that the replacement of electronic devices is essentially to replace abnormal electronic devices on a circuit board with normal electronic devices. Therefore, after completing the replacement of the electronic device, the circuit board circuit should be reconnected. Based on this, after obtaining the target coding schematic diagram corresponding to the modified code, the target coding schematic diagram can be further connected and drawn according to the actual packaging form of the target electronic device (i.e., the target packaging form), thereby realizing the material replacement of the target electronic device in a true sense.

[0087] It can be seen that the electronic component replacement method provided in the embodiment of the present application can pre-create multiple corresponding electronic component schematics for any type of electronic component, and add corresponding unique codes and code modification permissions to achieve one electronic device corresponding to multiple coded schematics, so that the material replacement of the electronic component can be achieved by directly modifying the code. Moreover, during this replacement process, the system can automatically obtain relevant data of the new coded schematic to complete the replacement of the electronic component. There is no need for technical personnel to re-design the schematics for the replacement material, and no manual operation is required. Obviously, the present technical solution can not only achieve faster and more efficient replacement of electronic components, but also effectively ensure the quality of the replaced electronic components.

[0088] Based on the above embodiments, the embodiment of the present application provides another method for replacing an electronic component.

[0089] Please refer to Figure 2 and Figure 3 , Figure 2A schematic diagram of electronic device replacement provided in this application, Figure 3 This is a flow chart of another method for replacing an electronic device provided in this application, and its implementation process is as follows:

[0090] 1. One-to-many design to meet PCB packaging:

[0091] In order to effectively meet the one-to-many design of PCB packaging, it is necessary to clarify the correspondence between PCB packaging design forms and electronic devices. This correspondence needs to be based on the physical size of the electronic device, the number of pins, the order of pin arrangement, the size of the pads, the spacing between the pads, the height of the device, and the electrical characteristics. Specifically, relevant data can be input through the program so that the program can use these data to perform a reasonable packaging design evaluation, thereby achieving a PCB packaging form compatible with multiple electronic devices with similar characteristics, that is, multiple electronic devices can use the same PCB packaging form.

[0092] 1. PCB packaging classification symbols are distinguished according to the type of electronic devices, which is convenient for distinguishing electronic devices and accurately identifying PCB layout (printed circuit board), so that errors are not likely to occur when associating schematic symbols. Among them, the classification attributes can be written into the program through the program, and the classification can be controlled by the program, as follows:

[0093] (1) IC: U*

[0094] (2) Resistance: R*

[0095] (3) Capacitance: C*

[0096] (4) Inductance: L*

[0097] (5) Diode: D*

[0098] (6) Triode transistor, MOS tube: Q*

[0099] (7) XTAL (Crystal, Oscillator): Y*

[0100] …

[0101] 2. Use the program to combine the specification sheet of the selected electronic device (used to record its specification standards), the package type to be created, and the specific package size pins and other specifications to establish a PCB package that meets the one-to-many design. Among them, the size of the electronic device, the pad size, the spacing and the height, etc., must be guaranteed to be within the specifications of all specifications. Enter the relevant data in the program and calculate it through the calculation formula to ensure that the size is within the error range of 0.2-0.3mm, the spacing is the same, or the small entity falls completely on the pad without offset. These situations all need to meet the one-to-many compatible design requirements.

[0102] (1) Calculation of pad size under SMT packaging:

[0103] Pad length X: X=Wmax+2 / 3×Hmax+8mil;

[0104] Pad width Y: when X<50mil, Y=X; when X≥50mil, Y=X+(61~0)mil;

[0105] The pad edge distance R or the total package length G is selected according to the component size and welding requirements.

[0106] Among them, Wmax represents the maximum width standard value, and Hmax represents the maximum height standard value.

[0107] The electronic device entities need to ensure compatibility based on the design method. For example, there are slight differences between the electronic device entities that are alternatives to each other. The average value of the difference between 3.6×2.5 with a tolerance of 0.2 and 3.7×2.6 with a tolerance of 0.15 needs to be checked to see if it meets the tolerance range allowed by multiple specifications. At the same time, combined with the matching degree of the 3D software, appropriate matching sizes that are compatible with multiple or two are obtained.

[0108] (2) Calculation of pad size under DIP package form:

[0109] Inner hole with diameter less than 0.4mm: D / d=0.6~1;

[0110] Inner hole with diameter greater than 2mm: D / d=1.5~2;

[0111] Where D is the pad diameter and d is the inner hole diameter.

[0112] In addition, the optimal size calculation can be further achieved by combining the aperture compensation calculation formula ((positive tolerance - negative tolerance) / 2 + compensation coefficient).

[0113] 2. One-to-many design to meet the needs of electronic device schematics:

[0114] On the basis that the PCB package meets the one-to-many design requirements, due to the relationship between the PCB package and the schematic symbol, the class and RefDes Prefix attributes must be consistent. This attribute is the quantity code displayed on the schematic symbol and the PCB package. That is, the PCB package meets the one-to-many compatible design, and the schematic symbol also needs to meet the one-to-many compatible design.

[0115] When creating and using symbols in the software Properties, open the software to create a new Cell category to create a new symbol file. The style of the schematic symbol can clearly represent the functions and input / output relationships of all symbol signals. Furthermore, when creating a schematic symbol, you can add the corresponding attribute part_number in the software. Through the software program, the part_number attribute can be set to allow editing permissions to modify A code to B code, so as to automatically obtain the modified code information.

[0116] 1. Create a new symbol file in the Cell option of the schematic symbol and distinguish them according to the function, performance and type of the electronic components;

[0117] 2. During the Cell option creation process, evaluate whether there are differences in schematic signals of the same specification based on the selected main materials and alternative materials. If there are no differences, create symbols and add attributes. It should be noted that one schematic symbol corresponds to multiple material codes. At the same time, all material codes must be obtained during creation and the editability must be controlled.

[0118] 3. Attribute association between electronic device schematics and PCB packages:

[0119] Both the PCB package and the schematic symbol have been designed one-to-many through the software. At this time, add the associated attribute JEDEC_TYPE (electronic device package) between the two in the software Properties to facilitate the association of the PCB package and the schematic symbol.

[0120] On this basis, according to the design requirements, click on the schematic symbol, right-click to pop up a drop-down menu in the development program, and select date symbol number in the program. The attribute part_number is the electronic device code. Therefore, designers can modify the code according to the situation to achieve free selection of main materials.

[0121] Based on the implementation process of the above electronic device replacement method, an example of a method is as follows:

[0122] When modifying the design drawing and adjusting the material of the drawing, directly click the image and right-click to display the attribute information, and modify the associated attribute PART_NUMBER according to the coding control requirements to replace the material. By modifying the material code, the program-associated system automatically updates the information of this material without modifying the drawing. Layout directly updates the latest information based on the modified information of the schematic diagram. The drawing information does not change, and only the latest virtual attributes are updated.

[0123] It can be seen that the electronic component replacement method provided in the embodiment of the present application can pre-create multiple corresponding electronic component schematics for any type of electronic component, and add corresponding unique codes and code modification permissions to achieve one electronic device corresponding to multiple coded schematics, so that the material replacement of the electronic component can be achieved by directly modifying the code. Moreover, during this replacement process, the system can automatically obtain relevant data of the new coded schematic to complete the replacement of the electronic component. There is no need for technical personnel to re-design the schematics for the replacement material, and no manual operation is required. Obviously, the present technical solution can not only achieve faster and more efficient replacement of electronic components, but also effectively ensure the quality of the replaced electronic components.

[0124] An embodiment of the present application provides an electronic component replacement device.

[0125] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device replacement device provided in the present application. The electronic device replacement device may include:

[0126] A creation module 1, used for creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standard of the electronic device;

[0127] Coding module 2, used to encode the schematic diagrams of each electronic device, obtain multiple coded schematic diagrams corresponding to the electronic device, and add coding modification authority for the electronic device;

[0128] Determination module 3, for determining the target electronic device and the modified code of the target electronic device according to the material replacement command if a material replacement command is received when the code modification authority is enabled;

[0129] The material replacement module 4 is used to retrieve the target coding schematic diagram corresponding to the modified coding, and use the target coding schematic diagram to replace the material of the target electronic device.

[0130] It can be seen that the electronic component replacement device provided in the embodiment of the present application can pre-create multiple corresponding electronic component schematics for any type of electronic component, and add corresponding unique codes and code modification permissions to achieve one electronic component corresponding to multiple coded schematics, so that the material replacement of the electronic component can be achieved by directly modifying the code. Moreover, during this replacement process, the system can automatically obtain relevant data of the new coded schematic to complete the replacement of the electronic component. There is no need for technical personnel to re-design the schematics for the replacement material, and no manual operation is required. Obviously, this technical solution can not only achieve faster and more efficient replacement of electronic components, but also effectively ensure the quality of the replaced electronic components.

[0131] In one embodiment of the present application, the creation module 1 may include:

[0132] An acquisition unit is used to acquire the packaging form of the electronic device; wherein the packaging form includes a surface mount form and a dual in-line package form;

[0133] The calculation unit is used to calculate the size of the electronic device according to the packaging form, and obtain multiple electronic device schematics that meet the specification standards.

[0134] In one embodiment of the present application, when the electronic device is a pad and the packaging form is a surface mount form, the above-mentioned calculation unit can be specifically used to determine the maximum width standard value, the maximum height standard value, the length evaluation threshold range, and the width evaluation threshold range of the pad according to the specification standard of the pad; calculate the length range of the pad according to the maximum width standard value, the maximum height standard value, and the length evaluation threshold range; calculate the width range of the pad according to the width evaluation threshold range and the length range; create multiple pad schematics that meet the specification standards according to the length range and width range of the pad;

[0135] Correspondingly, the creation module 1 may further include a packaging calculation unit for acquiring a current packaging standard corresponding to the packaging form; and determining a pin distance between two adjacent pads on the circuit board according to the current packaging standard.

[0136] In one embodiment of the present application, when the electronic device is a pad and the package form is a dual in-line package form, the above-mentioned calculation unit can be specifically used to determine the diameter ratio threshold range of the pad according to the specification standard of the pad; wherein the diameter ratio is the ratio between the pad diameter and the pad inner hole diameter; and create multiple pad schematics that meet the specification standard according to the diameter ratio threshold range.

[0137] In one embodiment of the present application, the above-mentioned encoding module 2 can be specifically used to perform signal consistency verification on multiple electronic device schematics corresponding to the electronic device; when the signal consistency verification passes, each electronic device schematic is encoded to obtain multiple encoded schematics corresponding to the electronic device; when the signal consistency verification fails, an abnormal prompt is output.

[0138] In one embodiment of the present application, the above-mentioned material replacement module 4 can be specifically used to retrieve the target coding schematic corresponding to the modified coding, determine the target packaging form to which the target coding schematic belongs; connect and draw the target coding schematic according to the target packaging form to realize the material replacement of the target electronic device.

[0139] In one embodiment of the present application, the above-mentioned encoding module 2 can be specifically used to add encoding setting attributes in schematic design software, so as to set the encoding modification authority of the electronic device through the encoding setting attributes.

[0140] For an introduction to the device provided in the embodiments of the present application, please refer to the above method embodiments, and the present application will not elaborate on them here.

[0141] An embodiment of the present application provides an electronic device.

[0142] Please refer to Figure 5 , Figure 5 This is a schematic diagram of the structure of an electronic device provided in this application, and the electronic device may include:

[0143] A memory 11, used for storing computer programs;

[0144] The processor 10 can implement the steps of any of the above-mentioned electronic component replacement methods when executing a computer program.

[0145] like Figure 5 , which is a schematic diagram of the composition structure of an electronic device, the electronic device may include: a processor 10, a memory 11, a communication interface 12 and a communication bus 13. The processor 10, the memory 11 and the communication interface 12 all communicate with each other through the communication bus 13.

[0146] In the embodiment of the present application, the processor 10 may be a central processing unit (CPU), an application specific integrated circuit, a digital signal processor, a field programmable gate array or other programmable logic devices, etc.

[0147] The processor 10 may call a program stored in the memory 11. Specifically, the processor 10 may execute operations in an embodiment of the electronic component replacement method.

[0148] The memory 11 is used to store one or more programs, which may include program codes, and the program codes include computer operation instructions. In the embodiment of the present application, the memory 11 at least stores programs for implementing the following functions:

[0149] Creating multiple electronic device schematics corresponding to the electronic devices according to the specification standards of the electronic devices;

[0150] Encode the schematic diagrams of each electronic device, obtain multiple coded schematic diagrams corresponding to the electronic device, and add the coding modification authority for the electronic device;

[0151] When the code modification authority is enabled, if a material change command is received, the target electronic device and the modified code of the target electronic device are determined according to the material change command;

[0152] Retrieve the target coding schematic diagram corresponding to the modified coding, and use the target coding schematic diagram to perform material replacement on the target electronic device.

[0153] In a possible implementation, the memory 11 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application required for at least one function, etc.; the data storage area may store data created during use.

[0154] In addition, the memory 11 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device or other volatile solid-state storage device.

[0155] The communication interface 12 may be an interface of a communication module, and is used to connect to other devices or systems.

[0156] Of course, it should be noted that Figure 5 The structure shown does not constitute a limitation on the electronic device in the embodiment of the present application. In actual applications, the electronic device may include Figure 5 More or fewer components than shown, or combinations of certain components.

[0157] An embodiment of the present application provides a computer-readable storage medium.

[0158] The computer-readable storage medium provided in the embodiment of the present application stores a computer program, and when the computer program is executed by a processor, the steps of any of the above-mentioned electronic component replacement methods can be implemented.

[0159] Among them, the computer-readable storage medium can be any available medium that can be stored in a computer or a data storage device such as a server or data center that includes one or more available media integrated. For example, it can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape, etc.), an optical medium (such as a DVD) or a semiconductor medium (such as a solid-state hard disk) and other media that can store computer program codes.

[0160] For an introduction to the computer-readable storage medium provided in the embodiments of the present application, please refer to the above method embodiments, and the present application will not elaborate on them here.

[0161] An embodiment of the present application provides a computer program product.

[0162] The computer program product provided in the embodiment of the present application includes a computer program / instruction, and when the computer program / instruction is executed by a processor, the steps of any of the above-mentioned electronic component replacement methods can be implemented.

[0163] Specifically, in the above embodiments, all or part of them can be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of them can be implemented in the form of a computer program product.

[0164] Among them, the computer program product may include one or more computer programs / instructions, and when the computer program / instructions are loaded and executed on a computer, the process or function described in the embodiment of the present application may be generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. Computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, computer instructions may be transmitted from one website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line, etc.) or wireless (e.g., infrared, wireless, microwave, etc.) means.

[0165] For an introduction to the computer program product provided in the embodiments of the present application, please refer to the above method embodiments, and the present application will not elaborate on them here.

[0166] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0167] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0168] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0169] The technical solution provided by the present application is described in detail above. The principle and implementation method of the present application are described in detail using specific examples herein, and the description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the present application.

Claims

1. A method for replacing an electronic device, characterized in that: include: Creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standards of the electronic device; Encode each of the electronic device schematics to obtain a plurality of coded schematics corresponding to the electronic device, and add coding modification authority for the electronic device; When the code modification authority is enabled, if a material replacement command is received, a target electronic device and a modified code of the target electronic device are determined according to the material replacement command; The target coding schematic diagram corresponding to the modified coding is retrieved, and the target coding schematic diagram is used to perform material replacement on the target electronic device.

2. The electronic device replacement method according to claim 1, characterized in that: Creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standards of the electronic device, including: Obtaining a packaging form of the electronic device; wherein the packaging form includes a surface mount form and a dual in-line package form; The size of the electronic device is calculated according to the packaging form to obtain a plurality of electronic device schematics that meet the specification standards.

3. The electronic device replacement method according to claim 2, characterized in that: When the electronic device is a pad and the package form is the surface mount form, the size of the electronic device is calculated according to the package form to obtain a plurality of electronic device schematics that meet the specification standard, including: Determine the maximum width standard value, the maximum height standard value, the length evaluation threshold range, and the width evaluation threshold range of the pad according to the specification standard of the pad; Calculate the length range of the pad according to the maximum width standard value, the maximum height standard value, and the length evaluation threshold range; Calculating the width range of the pad according to the width evaluation threshold range and the length range; Creating a plurality of pad schematics that meet the specification standard according to the length range and the width range of the pad; Accordingly, the method further comprises: Obtain the current packaging standard corresponding to the packaging form; The pin distance between two adjacent pads on the circuit board is determined according to the current packaging standard.

4. The electronic device replacement method according to claim 2, characterized in that: When the electronic device is a pad and the package form is the dual in-line package form, the size of the electronic device is calculated according to the package form to obtain a plurality of electronic device schematics that meet the specification standard, including: Determining a diameter ratio threshold range of the pad according to the specification standard of the pad; wherein the diameter ratio is a ratio between the pad diameter and the pad inner hole diameter; A plurality of pad schematics meeting the specification standard are created according to the diameter ratio threshold range.

5. The electronic device replacement method according to claim 1, characterized in that: Encoding each of the electronic device schematics to obtain a plurality of coded schematics corresponding to the electronic device, including: Performing signal consistency check on a plurality of electronic device schematics corresponding to the electronic device; When the signal consistency check passes, encoding each electronic device schematic to obtain a plurality of encoded schematics corresponding to the electronic device; When the signal consistency check fails, an abnormal prompt is output.

6. The electronic device replacement method according to claim 1, characterized in that: Retrieving a target coding schematic diagram corresponding to the modified coding, and using the target coding schematic diagram to perform material replacement on the target electronic device, including: Retrieving the target coding schematic diagram corresponding to the modified code, and determining the target packaging form to which the target coding schematic diagram belongs; The target coding schematic diagram is connected and drawn according to the target packaging form to achieve material replacement of the target electronic device.

7. The electronic device replacement method according to claim 1, characterized in that: Add the authority to modify the code of the electronic device, including: A coding setting attribute is added in the schematic design software, so as to set the coding modification authority of the electronic device through the coding setting attribute.

8. An electronic device replacement device, characterized in that: include: A creation module, used for creating a plurality of electronic device schematics corresponding to the electronic device according to the specification standards of the electronic device; An encoding module, used for encoding each of the electronic device schematics, obtaining a plurality of encoding schematics corresponding to the electronic device, and adding a coding modification authority for the electronic device; A determination module, configured to determine a target electronic device and a modified code of the target electronic device according to a material replacement command if a material replacement command is received when the code modification authority is enabled; The material replacement module is used to retrieve the target coding schematic diagram corresponding to the modified code, and use the target coding schematic diagram to replace the material of the target electronic device.

9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the electronic component replacement method as described in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the electronic component replacement method according to any one of claims 1 to 7 are implemented.

Images