PCB manufacturing method and PCB

Abstract

The invention relates to the technical field of printed circuit board manufacturing, in particular to a PCB manufacturing method and a PCB, and the PCB manufacturing method comprises the steps: providing a substrate which comprises a base material, the base material is provided with a connecting surface, and the connecting surface is provided with a circuit; arranging protective glue on the connecting surface, wherein the protective glue covers the connecting part of the circuit and the connecting surface; and performing micro-etching treatment on the surface, which is not covered by the protective glue, of the circuit. According to the PCB manufacturing method and the PCB provided by the invention, the problem that the signal transmission performance of the antenna circuit is poor after the antenna circuit is subjected to micro-etching processing in the related technology can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a PCB manufacturing method and a PCB. Background Art

[0002] With the rapid development of technology, there are more and more types of PCB (Printed Circuit Board), including high-frequency antenna PCB. The outer core board substrate of this type of PCB is generally PTFE (Polytetrafluoroethylene) material, and the copper foil used is rolled copper foil (RA). The rolled copper foil of high-frequency antenna PCB is generally low-roughness copper foil, which is made into antenna circuit through etching process, and the bonding force between low-roughness copper foil and substrate is relatively small.

[0003] In the related art, during the production process of the high-frequency antenna PCB, low-roughness copper foil such as rolled copper foil is used to form an antenna circuit through an etching process. In some processes after the circuit production is completed, such as the surface treatment process, it is also necessary to process the surface of the antenna circuit through a micro-etching process. However, after the antenna circuit is micro-etched, the signal transmission performance of the antenna circuit is poor. Summary of the invention

[0004] The present application provides a PCB manufacturing method and a PCB, which can improve the problem of poor signal transmission performance of the antenna line after micro-etching of the antenna line in the related art.

[0005] In a first aspect, an embodiment of the present application provides a PCB manufacturing method, comprising:

[0006] Providing a substrate, the substrate comprising a base material, the base material having a connection surface, and a circuit is arranged on the connection surface;

[0007] A protective glue is provided on the connection surface, wherein the protective glue covers the connection portion between the circuit and the connection surface;

[0008] The surface of the circuit not covered by the protective glue is micro-etched.

[0009] In some of the embodiments, before providing the protective glue on the connecting surface, a protective film is attached to the surface of the circuit facing away from the substrate; after providing the protective glue on the connecting surface and before micro-etching the surface of the circuit not covered by the protective glue, the protective film is removed.

[0010] In some embodiments, attaching a protective film on the surface of the circuit away from the substrate includes:

[0011] Providing a transfer film, the transfer film comprising a carrier film and the protective film disposed on the carrier film;

[0012] Attaching the protective film to the surface of the circuit away from the substrate through the carrier film;

[0013] The carrier film is removed.

[0014] In some of the embodiments, the circuit and the protective film are both provided in plurality and are provided in one-to-one correspondence.

[0015] In some embodiments, the protective film includes a film layer and an adhesive layer that are stacked, the adhesive layer is located between the film layer and the circuit, and the bonding force between the film layer and the adhesive layer is greater than the bonding force between the circuit and the adhesive layer.

[0016] In some embodiments, the film layer includes a handle portion, and the handle portion protrudes from the adhesive layer in a direction parallel to the connecting surface.

[0017] In some embodiments, the orthographic projection of the circuit on the connection surface is located inside the orthographic projection of the protection film on the connection surface.

[0018] In some embodiments, the height of the protective glue is lower than the height of the circuit.

[0019] In some embodiments, the protective adhesive is made of thermosetting adhesive or light-curing adhesive.

[0020] In a second aspect, an embodiment of the present application provides a PCB, which is processed by the PCB manufacturing method described in the first aspect.

[0021] The PCB manufacturing method provided in the embodiment of the present application has the beneficial effect that: since the substrate includes a base material, the base material has a connection surface, a circuit is arranged on the connection surface, and a protective glue is first arranged on the connection surface, the protective glue covers the connection part between the circuit and the connection surface, and then the surface of the circuit not covered by the protective glue is micro-etched, so the connection part between the circuit and the connection surface can be protected by the protective glue, and the micro-etching solution will not corrode the connection part between the circuit and the connection surface, which avoids the side of the circuit being separated from the connection surface and being in a suspended state to form signal noise, so that after the surface of the circuit not covered by the protective glue is micro-etched, the signal transmission performance of the circuit can be better.

[0022] The beneficial effects of the PCB provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the PCB manufacturing method provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 This is a flow chart of a PCB manufacturing method in one of the embodiments of the present application;

[0025] Figure 2 is a top view of a substrate in one of the embodiments of the present application;

[0026] Figure 3 yes Figure 2 A front view of the substrate shown;

[0027] Figure 4 is Figure 3 Schematic diagram of attaching a transfer film to a substrate shown;

[0028] Figure 5 yes Figure 4 A top view of the substrate and transfer film shown;

[0029] Figure 6 Yes Figure 4 A schematic diagram of the transfer film after the carrier film is removed;

[0030] Figure 7 is Figure 6 A schematic diagram of a substrate provided with a protective adhesive;

[0031] Figure 8 is Figure 6 A schematic diagram of another viewing angle when a protective adhesive is provided on the substrate shown;

[0032] Fig. 9 is Figure 6 A schematic diagram showing a substrate after a protective adhesive is provided thereon;

[0033] Fig.10 Yes Fig. 9 Schematic diagram of the protective film on the substrate shown;

[0034] Fig.11 Yes Fig.10 A schematic diagram of micro-etching the surface of the circuit of the substrate not covered by the protective glue;

[0035] Fig.12 It is a schematic diagram of the structure of the puzzle board in one of the embodiments of the present application.

[0036] The meanings of the marks in the figure are:

[0037] 1000, puzzle;

[0038] 100. Substrate;

[0039] 10. Base material;

[0040] 11. Connecting surface; 12. Alignment hole;

[0041] 20. Line;

[0042] 30. Protective film;

[0043] 31. membrane layer; 311. handle; 32. adhesive layer;

[0044] 40. Carrier film;

[0045] 50. Protective glue;

[0046] 60. Glue dispensing head. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0048] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0050] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0051] In order to illustrate the technical solution of the present application, a description is given below in conjunction with specific drawings and embodiments.

[0052] In the related art, during the production process of the high-frequency antenna PCB, low-roughness copper foil such as rolled copper foil is used to form an antenna circuit through an etching process. In some processes after the circuit production is completed, such as the surface treatment process, the antenna circuit needs to be processed by a micro-etching process. However, under the action of the micro-etching solution, the side of the antenna circuit is more easily corroded due to its weak bonding force with the substrate, causing the edge of the antenna circuit to be in a suspended state (the side suspension length of the antenna is generally required to be ≤12um, and the smaller the side suspension length, the better the signal transmission), resulting in signal noise. As a result, after the antenna circuit is micro-etched, the signal transmission performance of the antenna circuit is poor due to the large side suspension length of the antenna circuit.

[0053] In view of this, the present application provides a PCB manufacturing method and a PCB. Since the substrate includes a base material, the base material has a connection surface, a circuit is arranged on the connection surface, and a protective glue is first arranged on the connection surface, the protective glue covers the connection part between the circuit and the connection surface, and then the surface of the circuit not covered by the protective glue is micro-etched, so the connection part between the circuit and the connection surface can be protected by the protective glue, and the micro-etching solution will not corrode the connection part between the circuit and the connection surface, avoiding the side of the circuit from being separated from the connection surface and being in a suspended state to form signal noise, so that after the surface of the circuit not covered by the protective glue is micro-etched, the signal transmission performance of the circuit can be better.

[0054] Please refer to Figures 1 to 11 In a first aspect, an embodiment of the present application provides a PCB manufacturing method, comprising:

[0055] S100 : providing a substrate 100 , wherein the substrate 100 comprises a base material 10 , the base material 10 has a connection surface 11 , and a circuit 20 is arranged on the connection surface 11 .

[0056] Specifically, the substrate 100 may have completed at least one or more of the processing processes including cutting, inner layer circuit production, AOI (Automated Optical Inspection), OPE (Optical Punch Equipment) punching, browning, lamination, drilling, plasma, hole metallization, outer layer circuit, solder mask, characters, etc.

[0057] The substrate 10 can be made of PTFE material, and the circuit 20 can be made of rolled copper foil and etched. The circuit 20 can be used as a high-frequency antenna. One or more circuits 20 can be provided.

[0058] S200 : providing a protective adhesive 50 on the connection surface 11 , wherein the protective adhesive 50 covers the connection portion between the circuit 20 and the connection surface 11 .

[0059] Specifically, the protective glue 50 can be a heat-curing glue or a light-curing glue. The protective glue 50 can be firstly set on the connection surface 11 by dispensing, and then the protective glue 50 is cured. For example, an automatic dispensing machine can be used to automatically measure the expansion and contraction and compensate for the dispensing program. An empty run can be performed first. During the empty run, it can be confirmed under the condition of 10 times to 40 times magnification whether the empty run path will touch the line 20, and then the path can be manually adjusted under the condition of magnification. The fluidity of the protective glue 50 cannot be too large. Generally, the fluidity of the glue is 0.03mm-0.06mm. If it is too large, it will flow to other non-dispensing areas during dispensing. If the fluidity is too small, the protective glue 50 cannot completely cover the connection between the line 20 and the connection surface 11, that is, the connection between the line 20 and the connection surface 11 cannot be protected by the protective glue 50.

[0060] Part of the protective glue 50 may be located on the side of the circuit 20 , and part of the protective glue 50 may be located on the connecting surface 11 . The protective glue 50 may cover the corner where the circuit 20 and the connecting surface 11 are connected.

[0061] It should be noted that the protective glue 50 can be provided on the connection surface 11 after the outer layer circuit is manufactured, or after the solder resist, character and other processes are completed.

[0062] S300 : performing micro-etching on the surface of the circuit 20 that is not covered by the protective glue 50 .

[0063] Specifically, the substrate 100 may be placed in a micro-etching solution to perform micro-etching on the surface of the circuit 20 that is not covered by the protective glue 50 .

[0064] It is understandable that the micro-etching solution can be used to micro-etch the surface of the circuit 20 away from the substrate 10 and the side of the circuit 20 that is not covered by the protective glue 50. The first piece can be made first, and then the first piece can be sliced ​​to confirm whether there is corrosion at the connection between the circuit 20 and the connection surface 11. After it is confirmed, mass production can be carried out until packaging.

[0065] As can be seen from the above, in the PCB manufacturing method provided in the embodiment of the present application, since the substrate 100 includes a base material 10, the base material 10 has a connecting surface 11, and the circuit 20 is arranged on the connecting surface 11, and a protective glue 50 is first arranged on the connecting surface 11, the protective glue 50 covers the connecting portion between the circuit 20 and the connecting surface 11, and then the surface of the circuit 20 not covered by the protective glue 50 is micro-etched, so the connecting portion between the circuit 20 and the connecting surface 11 can be protected by the protective glue 50, and the micro-etching solution will not corrode the connecting portion between the circuit 20 and the connecting surface 11, thereby avoiding the side of the circuit 20 from being separated from the connecting surface 11 and being in a suspended state to form signal noise, so that after the surface of the circuit 20 not covered by the protective glue 50 is micro-etched, the signal transmission performance of the circuit 20 is better.

[0066] The PCB manufacturing method provided in the embodiment of the present application can be used in the manufacturing process of high-frequency antenna PCBs, such as the manufacturing process of all high-frequency antenna PCBs with antenna line spacing ≥ 0.25mm and surface copper thickness greater than 1oz, to ensure antenna quality without affecting antenna signal transmission.

[0067] Optionally, when multiple circuits 20 are provided, the dispensing head 60 can be selected according to the spacing of different circuits 20. Generally, a dispensing head 60 with an inner diameter of 0.025mm-0.1mm and an outer diameter 0.025mm-0.05mm larger than the inner diameter is selected. The outer diameter of the dispensing head 60 should be smaller than the spacing of the circuits 20, and the difference between the spacing of the circuits 20 and the outer diameter of the dispensing head 60 should be at least greater than 0.025mm-0.05mm to ensure that the dispensing head 60 does not directly contact the side wall of the circuit 20. The dispensing head 60 can be made of non-metallic material to avoid damaging the circuit 20 and the substrate 10.

[0068] Among them, different dispensing speeds and glue output amounts can be selected according to the spacing and thickness of different circuits 20. The dispensing speed is generally 1mm / s-3mm / s, and the glue output amount is generally 0.5g / s-2g / s.

[0069] Please refer to Figures 2 to 6 In this embodiment, before the protective glue 50 is provided on the connection surface 11, the protective film 30 is attached to the surface of the circuit 20 facing away from the substrate 10; after the protective glue 50 is provided on the connection surface 11, and before the surface of the circuit 20 not covered by the protective glue 50 is micro-etched, the protective film 30 is removed.

[0070] By adopting the above solution, the surface of the circuit 20 away from the substrate 10 can be protected by the protective film 30 to prevent the protective glue 50 from contaminating the surface of the circuit 20 away from the substrate 10 when the protective glue 50 is provided on the connection surface 11 .

[0071] It is understandable that the protection film 30 may be bonded to the surface of the circuit 20 facing away from the substrate 10 .

[0072] Optionally, before the protective film 30 is attached to the surface of the circuit 20 facing away from the substrate 10, the surface of the circuit 20 can be cleaned and dried horizontally, and the drying temperature can be 80-90 degrees and the drying time can be 40s-60s.

[0073] Optionally, a protective film 30 is attached to the surface of the circuit 20 away from the substrate 10, including:

[0074] First, a transfer film is provided, wherein the transfer film includes a carrier film 40 and a protective film 30 disposed on the carrier film 40 .

[0075] Next, the protection film 30 is attached to the surface of the circuit 20 facing away from the substrate 10 through the carrier film 40 .

[0076] Specifically, multiple protective films 30 can be attached to the surface of multiple circuits 20 on a substrate 100 away from the substrate 10 through a carrier film 40 by vacuum low-temperature pressing, ensuring that the protective films 30 are tightly combined with the surface of the circuits 20 and there are no bubbles on the surface. The temperature of vacuum low-temperature pressing can be 80℃-100℃, the vacuum time can be 5s-10s, the vacuum degree requirement is ≥600mmHg, and the pressure can be 3kg / cm 2 -5kg / cm 2 .

[0077] Finally, the carrier film 40 is removed.

[0078] Specifically, the carrier film 40 may be removed manually.

[0079] With such configuration, the protective film 30 can be conveniently attached to the surface of the circuit 20 that is away from the substrate 10 .

[0080] It is understandable that the protective film 30 can be bonded to the carrier film 40. The protective film 30 can be first formed by laser cutting or mechanical punching, and then transferred to the surface of the substrate 100 by using a transfer film to improve the film sticking efficiency. The bonding force between the protective film 30 and the circuit 20 is greater than the bonding force between the protective film 30 and the carrier film 40. When multiple circuits 20 are provided, multiple protective films 30 can also be provided, and the circuits 20 and protective films 30 are provided one by one.

[0081] Among them, when the material of the protective glue 50 is a thermosetting glue, the protective glue 50 can be cured by natural cooling and curing after dispensing. The protective film 30 needs to be removed within 2 hours to 3 hours after dispensing. The protective glue 50 in this time range has been pre-cured and will not flow or stick to the protective film 30. If the residence time is too long, the protective glue 50 will stick to the protective film 30. If the residence time is too short, after the protective film 30 is removed, the glue will flow to the surface of the circuit 20. Finally, the protective glue 50 is left for 20 hours to 24 hours to cure naturally or by high-temperature baking.

[0082] After the protective glue 50 is cured, the connection between the circuit 20 and the connection surface 11 is completely protected. During normal surface treatment, the connection between the circuit 20 and the connection surface 11 will not be corroded by micro-etching solution, while ensuring the quality of the surface treatment.

[0083] It should be noted that when the material of the protective adhesive 50 is a light-curing adhesive, such as UV (Ultraviolet Curable) adhesive, the protective adhesive 50 needs to be cured by UV light.

[0084] Optionally, a plurality of circuits 20 and protective films 30 are provided and the two are provided in a one-to-one correspondence.

[0085] With such a configuration, a plurality of protective films 30 can be attached at one time by using a transfer film, which is highly efficient.

[0086] Please refer to Fig.12 In one embodiment, a substrate 100 is provided, the substrate 100 includes a base material 10 , the base material 10 has a connection surface 11 , and a plurality of circuits 20 are arranged on the connection surface 11 , including: providing a panel 1000 , the panel 1000 includes a plurality of substrates 100 .

[0087] A protective film 30 is attached to the surface of the circuit 20 away from the substrate 10, including:

[0088] First, a plurality of transfer films are provided. The transfer films are arranged one-to-one corresponding to the substrate 100 . The transfer films include a carrier film 40 and a plurality of protective films 30 arranged on the carrier film 40 . The protective films 30 are arranged one-to-one corresponding to the circuits 20 .

[0089] Next, a plurality of protective films 30 are attached to a surface of a plurality of circuits 20 on a substrate 100 away from the base material 10 through a carrier film 40 .

[0090] Finally, the carrier film 40 is removed.

[0091] By adopting the above solution, the attachment efficiency of the protection film 30 can be improved, and the alignment accuracy of the protection film 30 and the circuit 20 can be ensured.

[0092] It is understandable that the transfer film and the substrate 100 can be aligned through the alignment holes 12 drilled on the substrate 100, and the positioning accuracy is within 0.025 mm.

[0093] Please refer to Figure 4 and Figure 6 In this embodiment, the protective film 30 includes a film layer 31 and an adhesive layer 32 which are stacked, the adhesive layer 32 is located between the film layer 31 and the circuit 20, and the bonding force between the film layer 31 and the adhesive layer 32 is greater than the bonding force between the circuit 20 and the adhesive layer 32.

[0094] By adopting the above solution, the entire protective film 30 can be removed from the circuit 20 by removing the film layer 31 , thereby preventing the glue layer 32 from remaining on the circuit 20 .

[0095] Optionally, the film layer 31 includes a handle portion 311 , and the handle portion 311 protrudes from the adhesive layer 32 in a direction parallel to the connecting surface 11 .

[0096] With such a configuration, the entire protective film 30 can be easily removed from the circuit 20 through the handle portion 311 .

[0097] It should be noted that the handle 311 is not connected to the adhesive layer 32 and is not sticky. The handle 311 may be 10 mm to 20 mm long and 8 mm to 10 mm wide, so that it is easy to remove the protective film 30.

[0098] The film layer 31, the adhesive layer 32 and the carrier film 40 are all films that can withstand a certain high temperature (temperature 180 degrees can withstand ≥30min) and do not melt or deform. The protective film 30 can be a PI (Polyimide Film) film, the film layer 31 can be a PI layer, the adhesive layer 32 can be the back adhesive of the PI film (including more than 95% acrylic acid), and the carrier film 40 can be a PET (Polyester Film) film or a PVC (Polyvinylchlorid) film. The thickness of the adhesive layer 32 can be 3um-5um, the thickness of the film layer 31 can be 5um-10um, and the thickness of the carrier film 40 can be 30um-50um.

[0099] For example, the PET film can be firstly back-glued and then pre-dried, and then a layer of protective film 30 is attached to the PET film, and laser engraved according to the expansion and contraction coefficient of the circuit 20 (the protective film 30 is engraved, but the PET film is not engraved), and then the waste is discharged (only the protective film 30 corresponding to the circuit 20 is retained, and the other parts are removed). At this time, the transfer film is ready, and holes can be used for positioning between the transfer film and the substrate 100.

[0100] Optionally, the orthographic projection of the circuit 20 on the connection surface 11 is located inside the orthographic projection of the protection film 30 on the connection surface 11 .

[0101] Such an arrangement can ensure that the protective film 30 completely covers the surface of the circuit 20 facing away from the connecting surface 11 .

[0102] For example, the distance between the edge of the protection film 30 inside the orthographic projection of the connection surface 11 and the orthographic projection of the circuit 20 on the connection surface 11 is 0.05 mm-0.10 mm, so as to ensure that the protection film 30 completely covers the circuit 20 .

[0103] Optionally, the height of the protective glue 50 is lower than the height of the circuit 20 .

[0104] Such a configuration can protect the connection between the circuit 20 and the connection surface 11 by the protective glue 50 while reducing the impact of the protective glue 50 on the circuit 20 and preventing the protective glue 50 from flowing to the surface of the circuit 20 away from the connection surface 11 .

[0105] In this embodiment, the material of the protective adhesive 50 is thermosetting adhesive or light-curing adhesive.

[0106] With such configuration, the connection portion between the circuit 20 and the connection surface 11 can be well protected by the protective adhesive 50 , and the cost is low.

[0107] For example, the thermosetting adhesive may include a mixture of epoxy resin, acrylic acid, and a curing agent, etc. The light-curing adhesive may include UV adhesive, etc.

[0108] In a second aspect, an embodiment of the present application provides a PCB, which is processed by the PCB manufacturing method of the first aspect.

[0109] In the PCB provided in the embodiment of the present application, since the substrate 100 includes a base material 10, the base material 10 has a connection surface 11, and the circuit 20 is arranged on the connection surface 11, and a protective glue 50 is first arranged on the connection surface 11, the protective glue 50 covers the connection part between the circuit 20 and the connection surface 11, and then the surface of the circuit 20 not covered by the protective glue 50 is micro-etched, so the connection part between the circuit 20 and the connection surface 11 can be protected by the protective glue 50, and the micro-etching solution will not corrode the connection part between the circuit 20 and the connection surface 11, which avoids the side of the circuit 20 from being separated from the connection surface 11 and being in a suspended state to form signal noise, so that after the surface of the circuit 20 not covered by the protective glue 50 is micro-etched, the signal transmission performance of the circuit 20 is better.

[0110] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A PCB manufacturing method, characterized in that: include: Providing a substrate, the substrate comprising a base material, the base material having a connection surface, and a circuit is arranged on the connection surface; A protective glue is provided on the connection surface, wherein the protective glue covers the connection portion between the circuit and the connection surface; The surface of the circuit not covered by the protective glue is micro-etched.

2. The PCB manufacturing method according to claim 1, characterized in that: Before providing the protective glue on the connection surface, a protective film is attached to the surface of the circuit away from the substrate; after providing the protective glue on the connection surface and before micro-etching the surface of the circuit not covered by the protective glue, the protective film is removed.

3. The PCB manufacturing method according to claim 2, characterized in that: The step of attaching a protective film to the surface of the circuit away from the substrate comprises: Providing a transfer film, the transfer film comprising a carrier film and the protective film disposed on the carrier film; Attaching the protective film to the surface of the circuit away from the substrate through the carrier film; The carrier film is removed.

4. The PCB manufacturing method according to claim 3, characterized in that: The circuit and the protective film are both provided in plurality and are arranged in one-to-one correspondence.

5. The PCB manufacturing method according to claim 2, characterized in that: The protective film includes a film layer and an adhesive layer which are stacked, the adhesive layer is located between the film layer and the circuit, and the bonding force between the film layer and the adhesive layer is greater than the bonding force between the circuit and the adhesive layer.

6. The PCB manufacturing method according to claim 5, characterized in that: The film layer includes a handle portion, and the handle portion protrudes from the adhesive layer in a direction parallel to the connecting surface.

7. The PCB manufacturing method according to claim 2, characterized in that: The orthographic projection of the circuit on the connection surface is located inside the orthographic projection of the protection film on the connection surface.

8. The PCB manufacturing method according to any one of claims 1 to 7, characterized in that: The height of the protective glue is lower than the height of the circuit.

9. The PCB manufacturing method according to any one of claims 1 to 7, characterized in that: The material of the protective adhesive is thermosetting adhesive or light-curing adhesive.

10. A PCB, characterized in that: The PCB is manufactured by the PCB manufacturing method according to any one of claims 1 to 9.

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