Silicon wafer texturing device of heterojunction cell

Abstract

The silicon wafer texturing device comprises a texturing groove, a drying groove and a grating basket, the drying groove is provided with a plurality of blower nozzles, the blower nozzles are uniformly distributed on the inner wall of the drying groove, and the blower nozzles are connected with a blower device so as to carry out blast drying on the textured silicon wafer. A plurality of grid holes are uniformly formed in the side wall and the bottom of the grid lifting basket, a silicon wafer to be cleaned is suitable for being placed in the grid lifting basket, and a lifting point is arranged at the top of the grid lifting basket, so that the grid lifting basket is lifted into the texturing groove for texturing through a lifting device, and the grid lifting basket is lifted into the drying groove for drying after texturing is completed. According to the invention, the silicon wafer is placed in the texturing groove and the drying groove in a hoisting manner, so that personnel are prevented from being in direct contact with texturing treatment liquid, and the operation safety is improved. And by arranging the drying groove and the blower device, the textured silicon wafer can be directly put into the drying groove for blast drying, so that the drying efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of battery production, and in particular to a silicon wafer texturing device for a heterojunction battery. Background Art

[0002] Heterojunction cells are a type of solar cell that consists of p-type semiconductors and n-type semiconductors. Heterojunction cells have the characteristic of converting solar energy into electrical energy, so they are widely used in solar equipment such as solar panels, solar chargers, and solar street lights. In addition, heterojunction cells can also be used in electronic products such as wireless communications, computers, and smartphones.

[0003] In the manufacturing process of heterojunction cells, silicon wafer texturing is an essential process, which is used to form a uniform, small and dense velvet surface on the surface of the silicon wafer to increase the absorption of light. Since the texturing treatment liquid is toxic and can cause damage to the human body, it is necessary to avoid direct contact with the treatment liquid, and the silicon wafers need to be dried as soon as possible after soaking. In addition, in the conventional texturing process, a pile of silicon wafers are stacked in a grid basket and placed in a texturing tank for soaking. Although this operation is more efficient, it is difficult to fully texturize the surface of the silicon wafer because the silicon wafers are stacked and bonded together. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an embodiment of the present invention provides a silicon wafer texturing device for a heterojunction battery, which can improve the safety of operation.

[0005] An embodiment of the present invention proposes a silicon wafer texturing device for a heterojunction battery, comprising: a texturing tank, a drying tank and a grid basket, the texturing tank having an upper opening and a feed port, the feed port of the texturing tank being connected to a feed hopper so as to pass a treatment liquid into the texturing tank; the drying tank having an upper opening and an air blast port, a plurality of air blast ports being provided and evenly distributed on the inner wall of the drying tank, the air blast port being connected to an air blast device so as to blow air and dry the silicon wafers after texturing, the upper opening of the drying tank being openable and closable and connected to a cover body; the side walls and the bottom of the grid basket having a plurality of evenly distributed grid holes, the grid basket being suitable for placing silicon wafers to be cleaned, the top of the grid basket having a hanging point, so as to hang the grid basket into the texturing tank for texturing by a lifting device, and after the texturing is completed, the grid basket is hung into the drying tank for drying.

[0006] In some embodiments, four support seats are fixedly connected to the bottom of the drying tank to support the grille basket.

[0007] In some embodiments, the bottom of the drying tank is a conical bottom, a drain port is provided at the center of the conical bottom, and the support seat is fixedly connected to the conical bottom.

[0008] In some embodiments, the tuyere is connected to a high-pressure nozzle with an adjustable inclination angle.

[0009] In some embodiments, the texturing tank is connected to an ultrasonic oscillator.

[0010] In some embodiments, the drain port of the drying tank is connected to the collecting tank via a drain pipe, the collecting tank has a liquid outlet, and the liquid outlet of the collecting tank is connected to the feed hopper of the texturing tank via a circulation pipeline.

[0011] In some embodiments, the circulation pipeline is connected to a pump body.

[0012] In some embodiments, a connecting plate is arranged between the upper edge of the texturing tank and the upper edge of the drying tank. The height of the upper edge of the texturing tank is less than the height of the upper edge of the drying tank. The connecting plate is inclined downward toward one side of the texturing tank to collect the treatment liquid dripping during the process of moving the grid basket from the texturing tank to the drying tank.

[0013] In some embodiments, a plurality of placement racks are stacked in the grid basket, and each placement rack is suitable for placing a plurality of silicon wafers to be cleaned at intervals.

[0014] In some embodiments, the placement rack includes four mounting plates connected end to end to form a rectangular structure with openings at both ends. The interior of the placement rack has a placement cavity for placing silicon wafers. The inner wall of the placement rack has several groups of card slots for temporarily fixing silicon wafers. The silicon wafers are inserted and removed from the openings at both ends of the placement rack, and the bottom of the card slot is fixedly connected to a silicone pad. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings.

[0016] in:

[0017] Figure 1 It is a structural schematic diagram of a silicon wafer texturing device for a heterojunction battery in an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A schematic diagram of the structure of the grille basket;

[0019] Figure 3 for Figure 2 A schematic diagram of the structure of the grid basket in the state where no silicon wafer is installed;

[0020] Reference numerals:

[0021] 1. Feed hopper; 2. Velvet making trough; 3. Placement rack; 301. Mounting plate; 302. Silicone pad; 303. Card slot; 4. Ultrasonic oscillator; 5. Hanging point; 6. Connecting plate; 7. Cover; 8. Drying trough; 9. High-pressure nozzle; 10. Support seat; 11. Collecting trough; 12. Pump body; 13. Silicon wafer; 14. Grid basket. DETAILED DESCRIPTION

[0022] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0023] The silicon wafer texturing device for a heterojunction battery according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0024] like Figure 1-3 As shown, an embodiment of the present invention proposes a silicon wafer texturing device for a heterojunction battery, comprising: a texturing tank 2, a drying tank 8 and a grid basket 14, the texturing tank 2 having an upper opening and a feed port, the feed port of the texturing tank 2 being connected to the feed hopper 1, so as to pass the treatment liquid into the texturing tank 2; the drying tank 8 having an upper opening and an air blast port, a plurality of air blast ports being provided and evenly distributed on the inner wall of the drying tank 8, the air blast port being connected to the air blast device, so as to blow and dry the silicon wafer 13 after texturing, the upper opening of the drying tank 8 being openable and closable and connected to the cover body 7; the side wall and the bottom of the grid basket 14 having a plurality of evenly distributed grid holes, the grid basket 14 being suitable for placing the silicon wafer 13 to be cleaned, the top of the grid basket 14 having a hanging point 5, so as to hang the grid basket 14 into the texturing tank 2 for texturing through a lifting device, and after the texturing is completed, the grid basket 14 is hung into the drying tank 8 for drying.

[0025] The embodiment of the present invention provides a hanging point 5 on the grid lifting basket 14, and places the silicon wafer 13 into the texturing tank 2 and the drying tank 8 by lifting, thereby avoiding direct contact between personnel and the texturing treatment liquid and improving the safety of the operation. By providing the drying tank 8 and the blasting device, the silicon wafer 13 after texturing can be directly placed in the drying tank 8 for blast drying, thereby improving the drying efficiency.

[0026] By providing an openable and closable cover 7 on the drying tank 8, the temperature loss in the drying tank 8 can be reduced and the drying efficiency can be improved. When in use, after the grid basket 14 is placed in the drying tank 8 by using a lifting device, the hook of the lifting device is released and the cover 7 is buckled. When the drying is completed, the cover 7 is opened, and the hook of the lifting device is hooked with the hanging point 5 of the grid basket 14 again for lifting.

[0027] It should be noted that the embodiment of the present invention can adopt a flow operation, and the texturing tank 2 and the drying tank 8 can be used at the same time.

[0028] In some embodiments, Figure 1 As shown, four support seats 10 are fixedly connected to the bottom of the drying tank 8 to support the grid basket 14.

[0029] In some embodiments, Figure 1 As shown, the bottom of the drying tank 8 is a conical bottom, a drain port is provided at the center of the conical bottom, and the support seat 10 is fixedly connected to the conical bottom, so as to facilitate timely discharge of the blown-off treatment liquid.

[0030] In some embodiments, Figure 1 As shown, the blast port is connected to a high-pressure nozzle 9 with an adjustable inclination angle. The silicon wafers 13 in the grid basket 14 can be dried by blasting from multiple angles to improve the drying efficiency.

[0031] In some embodiments, Figure 1 As shown, the texturing tank 2 is connected to an ultrasonic oscillator 4. By means of oscillation, the processing liquid is quickly brought into contact with the silicon wafer 13 in the texturing tank 2, thereby improving the texturing efficiency.

[0032] In some embodiments, Figure 1 As shown, the drain port of the drying tank 8 is connected to the collecting tank 11 through a drain pipe. The collecting tank 11 has a liquid outlet. The liquid outlet of the collecting tank 11 is connected to the feed hopper 1 of the texturing tank 2 through a circulation pipeline. The collected treatment liquid can be recycled.

[0033] In some embodiments, Figure 1 As shown, the circulating pipeline is connected to a pump body 12 to provide a power source for the recovered treated liquid to be passed into the feed hopper 1.

[0034] In some embodiments, Figure 1 As shown, a connecting plate 6 is arranged between the upper edge of the texturing tank 2 and the upper edge of the drying tank 8. The height of the upper edge of the texturing tank 2 is smaller than the height of the upper edge of the drying tank 8. The connecting plate 6 is tilted downward on one side toward the texturing tank 2 to collect the treatment liquid dripping from the grid basket 14 during the process of moving from the texturing tank 2 to the drying tank 8.

[0035] Furthermore, one end of the connecting plate 6 is fixedly connected to the drying tank 8, and the other end of the connecting plate 6 is located above the texturing tank 2 and extends into the texturing tank 2 for a short distance, so that the dripping treatment liquid can slide into the texturing tank 2 through the inclined connecting plate 6. Baffles are provided on the front and rear sides of the connecting plate 6 to prevent the treatment liquid from flowing onto the ground or other equipment.

[0036] In some embodiments, Figure 1As shown, a plurality of racks 3 are stacked in the grid basket 14, and each rack 3 is suitable for placing a plurality of silicon wafers 13 to be cleaned at intervals. The silicon wafers 13 can be spaced apart, which is more convenient for full texturing, and the racks 3 can be used to facilitate taking and placing in the grid basket 14, preventing the silicon wafers 13 from wearing each other.

[0037] Furthermore, the silicon wafers 13 in a single placement rack 3 are arranged parallel to each other.

[0038] In some embodiments, Figure 2 , 3 As shown, the placement rack 3 includes four mounting plates 301 connected end to end to form a rectangular structure with two ends open. The placement rack 3 has a placement cavity for placing the silicon wafer 13. The inner wall of the placement rack 3 has a plurality of groups of card slots 303 for temporarily fixing the silicon wafer 13. The silicon wafer 13 is inserted and removed from the openings at both ends of the placement rack 3. The bottom of the card slot 303 is fixedly connected to the silicone pad 302. The opposite sides of the silicon wafer 13 are clamped in the placement rack 3 to prevent the silicon wafer 13 from falling off the placement rack 3 during the texturing process.

[0039] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0044] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A silicon wafer texturing device for heterojunction cells, characterized in that: include: A texturing tank, wherein the texturing tank has an upper opening and a feed port, and the feed port of the texturing tank is connected to a feed hopper to pass the treatment liquid into the texturing tank; A drying tank, the drying tank having an upper opening and an air blast port, the air blast port being provided with a plurality of ports and being arranged on the inner wall of the drying tank, the air blast port being connected to an air blast device to blow and dry the silicon wafer after texturing, and the upper opening of the drying tank being openable and closable to connect to a cover body; A grid basket, wherein the side walls and the bottom of the grid basket are provided with a plurality of grid holes evenly distributed, the grid basket is suitable for placing silicon wafers to be cleaned, and the top of the grid basket is provided with a hanging point, so that the grid basket can be hung into the texturing tank for texturing through a lifting device, and after the texturing is completed, the grid basket is hung into the drying tank for drying.

2. The silicon wafer texturing device for heterojunction cells according to claim 1, characterized in that: Four support seats are fixedly connected to the bottom of the drying tank to support the grille basket.

3. The silicon wafer texturing device for heterojunction cells according to claim 2, characterized in that: The bottom of the drying tank is a conical bottom, a liquid discharge port is arranged at the center of the conical bottom, and the support seat is fixedly connected to the conical bottom.

4. The silicon wafer texturing device for heterojunction cells according to claim 1, characterized in that: The blast port is connected to a high-pressure nozzle with an adjustable inclination angle.

5. The silicon wafer texturing device for heterojunction cells according to claim 1, characterized in that: The texturing tank is connected with an ultrasonic oscillator.

6. The silicon wafer texturing device for heterojunction cells according to claim 3, characterized in that: The liquid discharge port of the drying tank is connected to the collecting tank through a liquid discharge pipe. The collecting tank has a liquid outlet. The liquid outlet of the collecting tank is connected to the feed hopper through a circulation pipeline.

7. The silicon wafer texturing device for heterojunction cells according to claim 6, characterized in that: The circulation pipeline is connected with a pump body.

8. The silicon wafer texturing device for heterojunction cells according to claim 1, characterized in that: A connecting plate is arranged between the upper edge of the texturing tank and the upper edge of the drying tank. The height of the upper edge of the texturing tank is smaller than the height of the upper edge of the drying tank. The connecting plate is inclined downward toward one side of the texturing tank to collect the treatment liquid dripping from the grille basket during the process of moving from the texturing tank to the drying tank.

9. The silicon wafer texturing device for heterojunction cells according to claim 1, characterized in that: A plurality of placement racks are stacked in the grid basket, and each of the placement racks is suitable for placing a plurality of silicon wafers to be cleaned at intervals.

10. The silicon wafer texturing device for heterojunction cells according to claim 9, characterized in that: The placement rack includes four mounting plates connected end to end to form a rectangular structure with openings at both ends. The interior of the placement rack is provided with a placement cavity for placing silicon wafers. The inner wall of the placement rack is provided with several groups of card slots for temporarily fixing silicon wafers. Silicon wafers are inserted and removed from the openings at both ends of the placement rack, and the bottom of the card slot is fixedly connected to a silicone pad.

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