Vertical LED light-emitting device and manufacturing method thereof

Abstract

The invention relates to the technical field of light-emitting semiconductors, and particularly discloses a vertical LED light-emitting device and a manufacturing method thereof.The vertical LED light-emitting device comprises a metal substrate, a light-emitting diode, a Zener diode, a first bonding wire, a second bonding wire and a packaging adhesive layer; the light-emitting diode is fixed above the metal substrate, the Zener diode is fixed on one side of the upper surface of the light-emitting diode, one end of the first bonding wire is connected with an electrode at one end of the metal substrate, the other end of the first bonding wire is connected with the light-emitting diode, and the other end of the first bonding wire is connected with the metal substrate. One end of the second bonding wire is connected with an electrode at the other end of the metal substrate, and the other end of the second bonding wire is connected with the Zener diode; and the packaging adhesive layer covers the metal substrate, the light emitting diode, the Zener diode, the first bonding wire and the second bonding wire. Through the design that the Zener diode and the light emitting diode are connected in parallel, an additional electrostatic protection mechanism is provided for the LED.

Description

Technical Field

[0001] The present invention relates to the technical field of light-emitting semiconductors, and in particular to a vertical LED light-emitting device and a manufacturing method thereof. Background Art

[0002] With the continuous advancement of semiconductor lighting technology, LED light-emitting diodes (LEDs) have become an important light source in the fields of modern lighting, display and backlighting. At present, LED light-emitting diodes mainly exist in three forms: upright, flip-chip and vertical structures. Although the flip-chip structure has many advantages in performance, its high technical threshold leads to high related costs. Therefore, in terms of market share, upright and vertical chip structure LED light sources have occupied a dominant position due to the maturity of their packaging technology and the perfection of the industrial chain.

[0003] However, in the process of LED packaging, manufacturing, testing, packaging, storage and transportation, one issue that cannot be ignored is the impact of static electricity. The PN junction inside the LED is prone to accumulate charge during these processes, forming a potential difference. When the charge accumulates to a certain level and exceeds the tolerance limit of the LED, static electricity will discharge the LED in a very short time. This instantaneous impact current is very likely to damage the internal structure of the LED, causing leakage, dead light and other undesirable phenomena, seriously affecting the reliability and service life of the LED.

[0004] In order to improve the anti-static ability of LED devices, a common practice in the industry is to connect the light-emitting diode and the Zener diode in parallel. As an electronic component with stable voltage characteristics, the Zener diode can provide a bypass channel during electrostatic discharge, effectively protecting the light-emitting diode from electrostatic shock. However, this design also has certain limitations. Since the Zener diode requires additional planar space for fixing, this limits the utilization rate of the light-emitting / refractive space of the package to a certain extent. Especially for LED packages that pursue high brightness and high compactness, this design will undoubtedly have an adverse effect on the luminous efficiency and vulcanization performance of the package, thereby affecting the overall performance and market competitiveness of the product.

[0005] Therefore, how to optimize the packaging structure and improve the utilization rate of the light-emitting / refractive space while ensuring the anti-static ability of LED devices has become an important issue that needs to be urgently solved in the current field of LED packaging technology. Summary of the invention

[0006] In order to overcome the problems existing in the prior art, an object of the present invention is to provide a vertical LED light emitting device and a manufacturing method thereof.

[0007] The technical solution adopted by the present invention to solve the technical problem is: a vertical LED light emitting device, comprising:

[0008] A metal substrate, a vertical structure light emitting diode, a vertical structure Zener diode, a plurality of bonding wires and a packaging adhesive layer;

[0009] The light-emitting diode is fixed above the metal substrate, and the Zener diode is fixed on the upper surface of the electrode of the light-emitting diode. The remaining electrodes on the upper surface of the light-emitting diode are connected to the metal substrate through bonding wires, and the upper surface electrodes of the Zener diode are connected to the metal substrate through the bonding wires; the Zener diode has opposite polarity to the light-emitting diode and forms a parallel circuit with the light-emitting diode; the encapsulation glue layer covers the metal substrate, the light-emitting diode, the Zener diode, and the plurality of bonding wires.

[0010] Main working principle: The vertical LED light-emitting device includes a metal substrate, a vertical structure light-emitting diode, a vertical structure Zener diode, bonding wires and a packaging glue layer. The light-emitting diode is fixed on the metal substrate, and the Zener diode is fixed on the upper surface of a certain electrode of the light-emitting diode. The remaining electrodes of the LED are connected to the metal substrate through bonding wires. The upper surface electrode of the Zener diode is also connected to the metal substrate through bonding wires. The Zener diode has opposite polarity to the light-emitting diode, so they form a parallel circuit. The packaging glue layer covers the entire structure to provide protection and insulation.

[0011] When a forward voltage is applied to the LED, the LED begins to emit light. At the same time, because the Zener diode is connected in parallel with the LED and has opposite polarity, it actually does not conduct electricity when the LED is working normally. The main function of the Zener diode is to act as an overvoltage protection component. If the voltage in the circuit exceeds the rated voltage of the LED (i.e., an overvoltage condition), the Zener diode will begin to conduct electricity and shunt the excess voltage to the ground, thereby protecting the LED from damage. The encapsulation glue layer not only protects the LED and Zener diode from physical damage, but also prevents moisture, dust and other contaminants from entering the device, ensuring the long-term stability and reliability of the device.

[0012] Under normal operating conditions, current mainly flows through the LED, causing it to emit light. Under overvoltage conditions, part of the current will flow through the Zener diode, bypassing the LED, thereby protecting the LED from overvoltage damage. The breakdown voltage of the Zener diode is designed to be slightly higher than the rated voltage of the LED. Therefore, under normal operating voltage, the Zener diode does not conduct electricity. When the voltage rises to the breakdown voltage of the Zener diode, it will quickly conduct electricity, bypassing the current from the LED, thereby limiting the voltage across the LED and preventing it from being damaged.

[0013] In summary, the vertical LED light-emitting device achieves overvoltage protection for the light-emitting diode by connecting a Zener diode with opposite polarity in parallel, while maintaining the normal light-emitting function of the light-emitting diode. The encapsulation glue layer provides additional physical and chemical protection to ensure the long-term stable operation of the device.

[0014] Preferably, the light emitting diode comprises an active layer, a light emitting protection layer, a first conductive layer, and a second conductive layer;

[0015] The active layer is connected to the first electrode plate through the first conductive layer, the luminescent protection layer is arranged above the active layer, the second conductive layer is arranged around the luminescent protection layer and connected to the active layer, and the second conductive layer is connected to the second electrode plate through the bonding wire.

[0016] Preferably, a third electrode plate is disposed above the Zener diode, and a fourth electrode plate is disposed below the Zener diode. The third electrode plate is connected to the bonding wire, and the fourth electrode plate is connected to the second conductive layer.

[0017] Preferably, an insulating accommodating groove is provided between the Zener diode and the light-emitting protection layer.

[0018] Preferably, a white glue layer is provided on the surface of the Zener diode, and the encapsulation glue layer is a transparent glue layer.

[0019] A method for manufacturing a vertical LED light emitting device, used to manufacture the vertical LED light emitting device, the steps are as follows:

[0020] S1. Clean the surface of the metal substrate to ensure that there is no dust and oil, and fix the second electrode plate in the metal substrate on both sides of the first electrode plate, and ensure that they are isolated by an insulating groove;

[0021] S2, fixing the active layer of the light-emitting diode on the first electrode plate of the metal substrate through the first conductive layer to ensure good contact, and setting a light-emitting protection layer above the active layer, and then applying a conductive material on the second conductive layer to form a conductive connection;

[0022] S3, installing a Zener diode on one side of the upper surface of the second conductive layer, and providing an insulating accommodating groove between the light-emitting diode and the Zener diode;

[0023] S4, using bonding wires to connect the second electrode plate of the metal substrate to the second conductive layer of the light-emitting diode; one bonding wire connects the second electrode plate of the metal substrate to the Zener diode;

[0024] S5. Apply a white glue layer on the Zener diode, and the excess white glue layer will flow into the insulation receiving groove;

[0025] S6. Apply a transparent encapsulation adhesive layer over the entire structure to ensure that the metal substrate, light-emitting diode, Zener diode and bonding wire are covered, and the encapsulation adhesive layer is cured to form the final encapsulation protection.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention connects a Zener diode with opposite polarity in parallel in the LED circuit, and the device can effectively prevent the light-emitting diode from being damaged due to excessive voltage. When the Zener diode reaches its breakdown voltage, it will start to conduct electricity and shunt the excess voltage, thereby protecting the LED from overvoltage and improving the stability and reliability of the entire circuit. An effective overvoltage protection mechanism can significantly reduce the risk of light-emitting diodes being damaged due to voltage fluctuations, thereby extending the service life of the entire device and reducing maintenance costs.

[0028] Traditional overvoltage protection schemes may require additional circuit components and complex wiring, but this device implements overvoltage protection function through a built-in Zener diode, simplifying circuit design and reducing manufacturing costs.

[0029] The vertical structure of the light-emitting diode and Zener diode enables the entire device to be compactly arranged in the vertical direction, improving space utilization, and is particularly suitable for application scenarios with strict requirements on size.

[0030] The encapsulation layer not only provides physical and chemical protection to prevent moisture, dust and other pollutants from entering the device, but also enhances the device's vibration and impact resistance, thereby improving the product's durability and reliability.

[0031] In summary, the vertical LED light-emitting device realizes overvoltage protection through the built-in Zener diode, simplifies the circuit design, improves stability and reliability, enhances the protection effect, prolongs the product life, and has good packaging protection performance. These beneficial effects make the device have broad application prospects in the fields of LED lighting, display, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0033] Figure 1 Schematic diagram of the vertical LED light-emitting device.

[0034] 1. Metal substrate; 11. First electrode plate; 12. Second electrode plate; 2. Light-emitting diode; 20. Active layer; 21. Light-emitting protection layer; 22. First conductive layer; 23. Second conductive layer; 3. Zener diode; 30. Third electrode plate; 31. Fourth electrode plate; 4. Bonding wire; 6. White glue layer; 7. Insulating accommodating groove. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0037] Example 1

[0038] This embodiment discloses a vertical LED light emitting device, such as Figure 1 As shown, it includes a metal substrate 1, a vertical structure light emitting diode 2, a vertical structure Zener diode 3, bonding wires 4 and a packaging glue layer. The light emitting diode 2 is fixed on the metal substrate 1, and the Zener diode 3 is fixed on the upper surface of a certain electrode of the light emitting diode 2. The remaining electrodes of the LED are connected to the metal substrate 1 through bonding wires 4. The upper surface electrode of the Zener diode 3 is also connected to the metal substrate 1 through bonding wires 4. The Zener diode 3 and the light emitting diode 2 have opposite polarities, so they form a parallel circuit. The packaging glue layer covers the entire structure to provide protection and insulation.

[0039] When a forward voltage is applied to the LED 2, the LED 2 starts to emit light. At the same time, since the Zener diode 3 is connected in parallel with the LED 2 and has opposite polarity, it actually does not conduct electricity when the LED 2 is working normally. The main function of the Zener diode 3 is to act as an overvoltage protection element. If the voltage in the circuit exceeds the rated voltage of the LED 2 (i.e., an overvoltage condition), the Zener diode 3 will start to conduct electricity and shunt the excess voltage to the ground, thereby protecting the LED 2 from damage. The encapsulation glue layer not only protects the LED 2 and the Zener diode 3 from physical damage, but also prevents moisture, dust and other contaminants from entering the device, ensuring the long-term stability and reliability of the device.

[0040] Under normal operating conditions, current mainly flows through the LED 2, causing it to emit light. Under overvoltage conditions, part of the current will flow through the Zener diode 3, bypassing the LED 2, thereby protecting the LED 2 from overvoltage damage. The breakdown voltage of the Zener diode 3 is designed to be slightly higher than the rated voltage of the LED 2. Therefore, under normal operating voltage, the Zener diode 3 does not conduct electricity. When the voltage rises to the breakdown voltage of the Zener diode 3, it will quickly conduct electricity, bypassing the current from the LED 2, thereby limiting the voltage across the LED 2 and preventing it from being damaged.

[0041] In summary, the vertical LED light-emitting device achieves overvoltage protection for the light-emitting diode 2 by connecting a Zener diode 3 with opposite polarity in parallel, while maintaining the normal light-emitting function of the light-emitting diode 2. The encapsulation glue layer provides additional physical and chemical protection to ensure the long-term stable operation of the device.

[0042] In some optional embodiments, a first electrode plate 11 and a second electrode plate 12 are added to the metal substrate 1, and the two are isolated by an insulating region. The first electrode plate 11 is connected to the light-emitting diode 2, and the second electrode plate 12 is connected to the electrode of the light-emitting diode 2 and the Zener diode 3 through the bonding wire 4. The first electrode plate 11 provides a forward voltage for the light-emitting diode 2, and the second electrode plate 12 serves as another part of the current loop and is connected to the Zener diode 3 to achieve overvoltage protection. The design of the separated first and second electrode plates 12 improves the flexibility of current distribution and the safety of the device.

[0043] In some optional embodiments, the internal structure of the light-emitting diode 2 includes an active layer 20, a light-emitting protection layer 21, a first conductive layer 22, and a second conductive layer 23. The active layer 20 is connected to the first electrode plate 11 through the first conductive layer 22, the light-emitting protection layer 21 covers the active layer 20, and the second conductive layer 23 is arranged around the light-emitting protection layer 21 and connected to the active layer 20. Finally, the second conductive layer 23 is connected to the second electrode plate 12 through the bonding wire 4. When a forward voltage is applied to the light-emitting diode 2, the current enters the active layer 20 through the first conductive layer 22, and excites the phosphor in the light-emitting protection layer 21 to emit light. The second conductive layer 23 serves as a path for the current to be extracted.

[0044] In some optional embodiments, a third electrode plate 30 and a fourth electrode plate 31 are respectively provided above and below the Zener diode 3. The third electrode plate 30 is connected to the upper surface electrode of the Zener diode 3 through the bonding wire 4, and the fourth electrode plate 31 is connected to the second conductive layer 23 of the light-emitting diode 2. The third electrode plate 30 provides the necessary electrical connection for the Zener diode 3, and the fourth electrode plate 31 serves as an electrical bridge between the Zener diode 3 and the light-emitting diode 2.

[0045] Beneficial effect: By adding the third and fourth electrode plates 31 , the electrical connection stability and reliability between the Zener diode 3 and the light-emitting diode 2 are improved.

[0046] In some optional embodiments, an insulating accommodating groove 7 is provided between the Zener diode 3 and the light emitting protection layer 21. An insulating accommodating groove 7 is dug around the light emitting protection layer 21 of the light emitting diode 2, and then the Zener diode 3 is fixed in the groove. The insulating accommodating groove 7 ensures electrical isolation between the Zener diode 3 and the light emitting protection layer 21, and prevents potential short circuit risks. The design of the insulating accommodating groove 7 improves the safety and stability of the device.

[0047] In some optional embodiments, a white glue layer 6 is provided on the surface of the Zener diode 3. White resin has been widely used in the packaging of the light-emitting diode 2 to cover the black Zener and suppress the light absorption of the black Zener, thereby ensuring the overall brightness of the package of the light-emitting diode 2. However, when the white resin is used in a package that requires a metal bonding wire 4 to connect the light-emitting diode 2 to the bracket, the white resin is easy to contaminate the surface of the light-emitting diode 2 along the bonding wire 4, affecting the brightness of the package. The existence of the insulating area provides a place to accommodate the white glue, preventing the white glue from contaminating the light-emitting surface of the chip. Thereby improving the optical performance of the device, enhancing the light-emitting effect, protecting the Zener diode 3, and extending the service life of the device.

[0048] In some optional embodiments, the encapsulation layer is made of a transparent material. A transparent encapsulation layer is coated on the entire device structure and cured. The transparent encapsulation layer not only protects the internal components, but also allows light to be emitted from the light-emitting diode 2 and pass through the encapsulation layer. The design of the transparent encapsulation layer makes the light-emitting effect of the device more intuitive and beautiful.

[0049] In summary, the vertical LED light-emitting device of the present invention realizes effective overvoltage protection of LED through fine structural design and optimized assembly method, improves the stability and reliability of the device, and optimizes the luminous efficiency and aesthetics. These beneficial effects make the device have a wide range of application prospects in the fields of light-emitting diode 2 lighting, display, etc.

[0050] Example 2

[0051] A method for manufacturing a vertical LED light emitting device, used to manufacture the vertical LED light emitting device, the steps are as follows:

[0052] S1: Pretreatment of metal substrate 1 and fixation of electrode plate. First, the surface of metal substrate 1 needs to be deeply cleaned. Use professional cleaning agents and precision cleaning tools to thoroughly remove dust, oil and other impurities on the surface to ensure the absolute cleanliness of the substrate surface. Then, the second electrode plate 12 in the metal substrate 1 is fixed on both sides of the first electrode plate 11 at a precise angle and position. In this process, it is necessary to ensure that the second electrode plate 12 is completely isolated from the first electrode plate 11 by a carefully designed insulation groove to prevent the occurrence of electrical short circuits.

[0053] S2: Assembling and conductively connecting the light-emitting diode 2, the active layer 20 of the light-emitting diode 2 is firmly fixed on the first electrode plate 11 of the metal substrate 1 through the highly conductive first conductive layer 22 by welding or bonding technology to ensure that the electrical connection between the two is stable and reliable. A light-emitting protective layer 21 is carefully laid above the active layer 20 to protect the active layer 20 from damage by the external environment and ensure the effective output of light. On the second conductive layer 23, a layer of conductive material is applied by advanced sputtering or electroplating technology to form a conductive connection with the second electrode plate 12 to ensure the smooth flow of current.

[0054] S3: Installation of Zener diode 3 and setting of insulating accommodating groove 7. The Zener diode 3 is installed on one side of the upper surface of the second conductive layer 23. In this process, it is necessary to ensure the electrical isolation between the Zener diode 3 and the light-emitting diode 2, as well as the correct connection between them and their respective electrode plates. Between the light-emitting diode 2 and the Zener diode 3, an insulating accommodating groove 7 is set through precise machining technology to further ensure the electrical isolation between the two and provide additional mechanical support.

[0055] S4: Bonding wire 4 connection and electrical testing, using high-quality bonding wire 4, connect the second electrode plate 12 of the metal substrate 1 to the second conductive layer 23 of the light-emitting diode 2. At the same time, another bonding wire 4 connects the second electrode plate 12 of the metal substrate 1 to the Zener diode 3 to ensure the integrity of the entire circuit and the stability of the electrical connection. After completing the bonding wire 4 connection, the entire circuit needs to be strictly electrically tested to ensure that the electrical performance of all connection points meets the design requirements.

[0056] S5: Applying and filling a white glue layer 6, a layer of white glue layer 6 is evenly applied on the Zener diode 3. This glue layer not only protects the Zener diode 3, but also improves the reflection efficiency of the device, thereby enhancing the luminous effect. The excess white glue layer 6 will naturally flow into the insulating accommodating groove 7, further fill and solidify, and form a more stable protective layer.

[0057] S6: Application and curing of transparent encapsulation adhesive layer. A layer of transparent encapsulation adhesive layer is evenly applied on the entire structure. This adhesive layer must have excellent light transmittance, weather resistance and chemical stability to ensure effective protection of internal components. The device coated with the transparent encapsulation adhesive layer is placed in a professional curing equipment and subjected to a certain period of heating and curing treatment to ensure complete curing of the encapsulation adhesive layer and close integration with the internal structure. The above is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A vertical LED light emitting device, characterized in that: include: A metal substrate, a vertical structure light emitting diode, a vertical structure Zener diode, a plurality of bonding wires and a packaging adhesive layer; The light-emitting diode is fixed above the metal substrate, and the Zener diode is fixed on the upper surface of the electrode of the light-emitting diode. The remaining electrodes on the upper surface of the light-emitting diode are connected to the metal substrate through bonding wires, and the upper surface electrodes of the Zener diode are connected to the metal substrate through the bonding wires; the Zener diode has opposite polarity to the light-emitting diode and forms a parallel circuit with the light-emitting diode; the encapsulation glue layer covers the metal substrate, the light-emitting diode, the Zener diode, and the plurality of bonding wires.

2. The vertical LED light emitting device according to claim 1, characterized in that: The metal substrate includes a first electrode plate and a second electrode plate, an insulating region is provided between the first electrode plate and the second electrode plate, the first electrode plate is connected to the light emitting diode, and the second electrode plate is connected to the electrode of the light emitting diode and the Zener diode through the bonding wire.

3. The vertical LED light emitting device according to claim 2, characterized in that: The light emitting diode comprises an active layer, a light emitting protection layer, a first conductive layer, and a second conductive layer; The active layer is connected to the first electrode plate through the first conductive layer, the luminescent protective layer is arranged above the active layer, the second conductive layer is arranged around the luminescent protective layer and connected to the active layer, and the second conductive layer is connected to the second electrode plate through the bonding wire.

4. The vertical LED light emitting device according to claim 3, characterized in that: A third electrode plate is disposed above the Zener diode, and a fourth electrode plate is disposed below the Zener diode. The third electrode plate is connected to the bonding wire, and the fourth electrode plate is connected to the second conductive layer.

5. The vertical LED light emitting device according to claim 3, characterized in that: An insulating accommodating groove is arranged between the Zener diode and the light-emitting protection layer.

6. The vertical LED light emitting device according to claim 5, characterized in that: A white glue layer is arranged on the surface of the Zener diode.

7. The vertical LED light emitting device according to claim 1, characterized in that: The packaging adhesive layer is a transparent adhesive layer.

8. A method for manufacturing a vertical LED light-emitting device, used for manufacturing the vertical LED light-emitting device according to any one of claims 6 to 7, characterized in that: Here are the steps: S1. Clean the surface of the metal substrate to ensure that there is no dust and oil, and fix the second electrode plate in the metal substrate on both sides of the first electrode plate, and ensure that they are isolated by an insulating groove; S2, fixing the active layer of the light-emitting diode on the first electrode plate of the metal substrate through the first conductive layer to ensure good contact, and setting a light-emitting protection layer above the active layer, and then applying a conductive material on the second conductive layer to form a conductive connection; S3, installing a Zener diode on one side of the upper surface of the second conductive layer, and providing an insulating accommodating groove between the light-emitting diode and the Zener diode; S4, connecting the second electrode plate of the metal substrate to the second conductive layer of the light-emitting diode using a bonding wire; One of the bonding wires connects the second electrode plate of the metal substrate to the Zener diode; S5. Apply a white glue layer on the Zener diode, and the excess white glue layer will flow into the insulation receiving groove; S6. Apply a transparent encapsulation adhesive layer over the entire structure to ensure that the metal substrate, light-emitting diode, Zener diode and bonding wire are covered, and the encapsulation adhesive layer is cured to form the final encapsulation protection.

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