Light-emitting substrate, preparation method thereof and display panel

Abstract

The invention provides a light-emitting substrate and a preparation method thereof, and a display panel, and relates to the technical field of display, the light-emitting substrate comprises a substrate, a light-emitting unit and a first signal line; the first signal line comprises a body and a first connecting part; the first connecting part is electrically connected with the cathode; the light-emitting unit comprises a plurality of light-emitting subunits; each of the light-emitting subunits and the first signal line comprises a first conductive layer, the part, located in the light-emitting subunits, of the first conductive layer comprises a first conductive pattern, and the first conductive pattern is used for being electrically connected with the anodes of the light-emitting subunits; the part, located at the first connecting part, of the first conductive layer comprises a second conductive pattern, and the second conductive pattern is used for electrically connecting the body of the first signal line and the cathode of the light-emitting subunit; the cathode is located at one side of the anode away from the first conductive layer; wherein the number of sub-layers included in the second conductive pattern is smaller than the number of sub-layers included in the first conductive pattern. The light-emitting substrate is simple in preparation process and high in reliability.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting substrate and a preparation method thereof, and a display panel. Background Art

[0002] With the rapid development of display technology, people have higher and higher requirements for the performance of display products. In the display substrate of the related art, the anode is usually electrically connected to the underlying signal line through the via hole in the passivation layer. However, in the process of anode patterning and forming the via hole in the passivation layer, the underlying signal line is very easy to corrode, resulting in poor contact between the underlying signal line film surface and the anode, thereby causing dark spots in the display screen and reducing the display effect. Summary of the invention

[0003] The embodiments of the present application adopt the following technical solutions:

[0004] In a first aspect, an embodiment of the present application provides a light-emitting substrate, comprising:

[0005] A substrate, a plurality of light emitting units arranged in an array on the substrate, and a first signal line between two adjacent rows of the light emitting units;

[0006] The first signal line includes a body and a first connecting portion; the first connecting portion is used to electrically connect to the cathode;

[0007] The light-emitting unit includes a plurality of light-emitting sub-units;

[0008] The light-emitting subunit and the first signal line both include a first conductive layer disposed on one side of the substrate, a portion of the first conductive layer located at the light-emitting subunit includes a first conductive pattern, and the first conductive pattern is used to electrically connect an anode of the light-emitting subunit;

[0009] The portion of the first conductive layer located at the first connecting portion includes a second conductive pattern, and the second conductive pattern is used to electrically connect the body of the first signal line and the cathode of the light-emitting subunit; the cathode is located on a side of the anode away from the first conductive layer;

[0010] The first conductive layer includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern is smaller than the number of sub-layers included in the first conductive pattern.

[0011] In some light-emitting substrates provided in embodiments of the present application, the first conductive layer located at the body of the first signal line includes a third conductive pattern, and the number of sublayers included in the third conductive pattern is less than or equal to the number of sublayers included in the first conductive pattern.

[0012] In some light-emitting substrates provided in embodiments of the present application, a local area of ​​the second conductive pattern is in direct contact with the cathode.

[0013] In some light-emitting substrates provided by embodiments of the present application, the first conductive pattern includes a first sublayer, a second sublayer, and a third sublayer sequentially arranged in a direction away from the substrate, and a material of the second sublayer is different from that of the first sublayer and the third sublayer;

[0014] The second conductive pattern includes the first sub-layer and the second sub-layer sequentially disposed in a direction away from the substrate.

[0015] In some light-emitting substrates provided in the embodiments of the present application, the light-emitting subunit and the first connecting portion both include a light-emitting functional layer; the light-emitting functional layer includes a first surface facing away from the substrate, and a second surface located between the first surface and the substrate; the light-emitting functional layer is disconnected at the position of the first connecting portion;

[0016] Wherein, along the normal direction of the substrate, the distance between a portion of the first surface located at the first connecting portion and the substrate is smaller than the distance between a portion of the second surface located at the light-emitting subunit and the substrate.

[0017] In some light-emitting substrates provided in the embodiments of the present application, an outer contour of an orthographic projection of a portion of the light-emitting functional layer located at the first connecting portion on the substrate is located within an outer contour of an orthographic projection of the second conductive pattern on the substrate;

[0018] The second conductive pattern includes a middle region and an edge region surrounding the middle region, and a portion of the light-emitting functional layer located at the first connecting portion is in direct contact with the middle region of the second conductive pattern.

[0019] In some light-emitting substrates provided in the embodiments of the present application, the cathode covers the light-emitting functional layer and the second conductive pattern;

[0020] The cathode is in direct contact with a portion of the light-emitting functional layer located at the first connecting portion and an edge region of the second conductive pattern respectively.

[0021] In some light-emitting substrates provided in embodiments of the present application, the materials of the first sublayer and the third sublayer are metals, and the material of the second sublayer is metal oxide.

[0022] In some light-emitting substrates provided in embodiments of the present application, portions of the first conductive layer located in the light-emitting sub-unit include the first sub-layer, the second sub-layer and the third sub-layer sequentially arranged in a direction away from the substrate.

[0023] In some light-emitting substrates provided in the embodiments of the present application, the light-emitting substrate includes a spacer, the spacer is located between two adjacent light-emitting sub-units, and the anode is arranged between the two adjacent spacers;

[0024] The light-emitting substrate further comprises a second conductive layer located between the first conductive layer and the substrate, the second conductive layer comprises a fourth conductive pattern, an orthographic projection of the first conductive pattern on the substrate, an orthographic projection of the fourth conductive pattern on the substrate, and an orthographic projection of the anode on the substrate overlap each other, and the fourth conductive pattern and the first conductive pattern are both electrically connected to the anode;

[0025] The first conductive pattern and the fourth conductive pattern together serve as a first electrode of a storage capacitor in the light-emitting subunit.

[0026] In some light-emitting substrates provided in the embodiments of the present application, the light-emitting substrate further includes a plurality of second signal lines, the second signal lines extend in the same direction as the first signal lines, and two second signal lines are arranged between two adjacent rows of the light-emitting sub-units;

[0027] The second signal line is located in the first conductive layer, and the second signal line includes the first sub-layer, the second sub-layer, and the third sub-layer which are sequentially arranged in a direction away from the substrate.

[0028] In some light-emitting substrates provided in embodiments of the present application, the light-emitting substrate also includes a third conductive layer, wherein the third conductive layer is located between the first conductive layer and the second conductive layer, and the third conductive layer includes a third signal line and a gate of a transistor in the light-emitting sub-unit, and the third signal line intersects with the first signal line.

[0029] In some light-emitting substrates provided in the embodiments of the present application, the anode includes a fourth sublayer and a fifth sublayer, the fourth sublayer is in direct contact with the first conductive layer, and the fifth sublayer is located on a side of the fourth sublayer away from the first conductive layer;

[0030] Wherein, the material of the fourth sub-layer is metal oxide, and the material of the fifth sub-layer is metal.

[0031] In a second aspect, an embodiment of the present application provides a display panel, comprising a light-emitting substrate as described in any one of the first aspects.

[0032] In a third aspect, an embodiment of the present application provides a method for preparing a light-emitting substrate, wherein the method is used to prepare the light-emitting substrate as described in any one of the first aspects, and the method comprises:

[0033] providing a substrate;

[0034] forming an intermediate structure of a first conductive layer, wherein the intermediate structure of the first conductive layer comprises a first sublayer, a second sublayer and a third sublayer sequentially arranged in a direction away from the substrate;

[0035] Forming a passivation film;

[0036] At the same time, etching the intermediate structure of the first conductive layer and the passivation film to obtain the first conductive layer and the passivation layer;

[0037] Among them, the first conductive layer includes a first conductive pattern and a second conductive pattern; the first conductive pattern includes a first sublayer, a second sublayer and a third sublayer arranged in sequence along a direction away from the substrate, and the second conductive pattern includes the first sublayer and the second sublayer arranged in sequence along a direction away from the substrate; the first conductive pattern is used to electrically connect the anode of the light-emitting sub-unit, and the second conductive pattern is used to electrically connect the body of the first signal line and the cathode of the light-emitting sub-unit.

[0038] In some methods for preparing light-emitting substrates provided in embodiments of the present application, the step of simultaneously etching the intermediate structure of the first conductive layer and the passivation film to obtain the first conductive layer and the passivation layer includes:

[0039] forming a photoresist film on a side of the passivation film away from the substrate;

[0040] Using a half-tone mask to pattern the photoresist film to obtain a first mask pattern;

[0041] Using the first mask pattern as a mask, the passivation film is etched for the first time to obtain the intermediate structure of the passivation layer; the intermediate structure of the passivation layer includes a first through hole, and the first through hole overlaps with the orthographic projection of a partial area of ​​the intermediate structure of the first conductive layer located at the first connecting portion;

[0042] Using the first mask pattern and the intermediate structure of the passivation layer as a mask, etching the third sublayer at the position of the first connecting portion of the intermediate structure of the first conductive layer to obtain the first conductive layer; wherein the portion of the first conductive layer located at the first connecting portion includes a second conductive pattern, and the second conductive pattern includes the first sublayer and the second sublayer sequentially arranged in a direction away from the substrate;

[0043] performing patterning processing on the first mask pattern to obtain a second mask pattern;

[0044] The passivation film is etched a second time using the second mask pattern as a mask to obtain the passivation layer; the passivation layer includes the first through hole and the second through hole, and the orthographic projection of the second through hole and a partial area of ​​the first conductive pattern overlap.

[0045] In some methods for preparing light-emitting substrates provided in embodiments of the present application, after the step of etching the passivation film for the second time using the second mask pattern as a mask to obtain the passivation layer, the method further includes:

[0046] forming a spacer;

[0047] forming an anode, wherein the anode is electrically connected to the first conductive pattern through the second through hole;

[0048] forming a light-emitting functional layer; the light-emitting functional layer covers the anode, the spacer and the second conductive pattern, the light-emitting functional layer is disconnected at the position of the first through hole, the second conductive pattern includes a middle area and an edge area surrounding the middle area, and the portion of the light-emitting functional layer located at the first connecting portion is in direct contact with the middle area of ​​the second conductive pattern;

[0049] A cathode is formed; the cathode covers the light-emitting functional layer, and the cathode is in direct contact with a portion of the light-emitting functional layer located at the first connecting portion and an edge region of the second conductive pattern.

[0050] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0052] Figure 1 A schematic cross-sectional structure diagram of a light-emitting substrate in the related art provided in an embodiment of the present application;

[0053] Figure 2 A schematic diagram of a cross-sectional structure of corrosion of a conductive layer in a related art provided in an embodiment of the present application;

[0054] Figure 3A schematic diagram of a top view structure of an abnormal display screen in a related technology provided in an embodiment of the present application;

[0055] Figure 4 A schematic cross-sectional structure diagram of a light-emitting substrate provided in an embodiment of the present application;

[0056] Figure 5 and Figure 6 Schematic diagrams of cross-sectional structures of two light-emitting substrates provided in the embodiments of the present application;

[0057] Figure 7 A schematic diagram of a top view structure of a light-emitting substrate provided in an embodiment of the present application;

[0058] Figure 8 A schematic diagram of a top view structure of a first conductive layer provided in an embodiment of the present application;

[0059] Fig.9A A schematic diagram of a top view structure of a second conductive layer and a semiconductor layer after being stacked is provided in an embodiment of the present application;

[0060] Fig. 9B A schematic diagram of a top view of an anode provided in an embodiment of the present application;

[0061] Fig.10 A schematic diagram of a top view structure of another light-emitting substrate provided in an embodiment of the present application; wherein: Figure 5 for Fig.10 Schematic diagram of the cross-sectional structure along the M1M2 direction, Figure 6 for Fig.10 Schematic diagram of the cross-sectional structure along the M3M4 direction;

[0062] Fig.11 for Fig.10 Schematic diagram of the cross-sectional structure along the M5M6 direction;

[0063] Fig.12 A schematic diagram of a top view structure of a third conductive layer and a semiconductor layer after being stacked is provided in an embodiment of the present application;

[0064] Figures 13 to 20 A schematic diagram of an intermediate structure in the process of preparing a light-emitting substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0065] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0066] In the embodiments of the present application, words such as "first", "second", "third", and "fourth" are used to distinguish between identical or similar items with basically the same functions and effects. This is only for the purpose of clearly describing the technical solutions of the embodiments of the present application and shall not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0067] In the embodiments of the present application, the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0068] In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" are intended to indicate that a specific feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0069] In the embodiments of the present application, “plurality” means two or more, and “at least one” means one or more, unless otherwise clearly defined.

[0070] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present application include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances related to the measurement of specific quantities (e.g., the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0071] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be construed in an open, inclusive sense, ie, meaning "including, but not limited to."

[0072] The polygon in this specification is not a strict polygon, and may be an approximate triangle, parallelogram, trapezoid, pentagon or hexagon, etc., and there may be some small deformations caused by tolerance.

[0073] In this specification, "electrically connected" and "coupled" include the situation where the components are connected together through an element having some electrical function. There is no particular limitation on the "element having some electrical function" as long as it can transmit and receive electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements having various functions.

[0074] With the rapid development of display technology, people have higher and higher requirements for the performance of display products. In the display substrate of the related art, the anode is usually electrically connected to the underlying signal line through the via hole in the passivation layer. However, in the process of anode patterning and forming the via hole in the passivation layer, the underlying signal line is very easy to corrode, resulting in poor contact between the underlying signal line film surface and the anode, thereby causing dark spots in the display screen and reducing the display effect.

[0075] Figure 1 A display substrate in the related art is shown in FIG. Figure 1 In the embodiment, the conductive layer SD is made of a single-layer structure of copper metal, and the anode AN is made of a stacked structure of ITO / Cu / ITO; the anode AN is electrically connected to the conductive structure in the conductive layer SD through a via in the passivation layer Pvx. However, in the process of forming the anode AN and preparing the connection part VSS-L using the anode layer, the copper etching solution can penetrate through the ITO into the via of Pvx, thereby corroding the copper metal in the conductive layer SD, such as Figure 2 As shown, a rough and uneven top-view structure is formed on the surface of the conductive layer SD, which results in poor contact between the anode AN and the conductive structure in the conductive layer SD, for example, poor contact between the anode AN and the underlying signal line, or poor contact between the connecting portion VSS-L and the VSS line (thereby resulting in poor conduction between the VSS line and the cathode CA).

[0076] Secondly, when the display panel formed by the display substrate displays images, the anode AN has poor contact with the underlying conductive structure and is prone to produce local dark spots, such as Figure 3 As shown, dark spot clusters are formed in the display image of the display panel, thereby reducing the display effect.

[0077] In addition, the structural design in the related art has many steps in the preparation process and the process is complicated, resulting in a low overall product yield.

[0078] Based on this, an embodiment of the present application provides a light-emitting substrate and a preparation method thereof, a display panel, the light-emitting substrate including a substrate, a light-emitting unit and a first signal line; the first signal line includes a main body and a first connecting portion; the first connecting portion is used to electrically connect to a cathode; the light-emitting unit includes a plurality of light-emitting sub-units; the light-emitting sub-units and the first signal line both include a first conductive layer, the portion of the first conductive layer located at the light-emitting sub-unit includes a first conductive pattern, the first conductive pattern is used to electrically connect to an anode of the light-emitting sub-unit; the portion of the first conductive layer located at the first connecting portion includes a second conductive pattern, the second conductive pattern is used to electrically connect the main body of the first signal line and the cathode of the light-emitting sub-unit; the cathode is located on the side of the anode away from the first conductive layer; wherein the first conductive layer includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern is less than the number of sub-layers included in the first conductive pattern.

[0079] The embodiment of the present application provides a new light-emitting substrate, in which the first conductive pattern is used to electrically connect the anode of the light-emitting sub-unit, and the second conductive pattern is used to electrically connect the body of the first signal line and the cathode of the light-emitting sub-unit; thus, on the one hand, the first conductive pattern and the anode can be electrically connected; on the other hand, since the first conductive layer includes multiple sub-layers, and the number of sub-layers included in the second conductive pattern arranged in the first conductive layer is less than the number of sub-layers included in the first conductive pattern, there is a step difference between the second conductive pattern and the light-emitting functional layer in the area where the light-emitting unit is located. In the subsequent process of forming the light-emitting functional layer and the cathode, the step difference causes the light-emitting functional layer to be naturally disconnected at the position of the first connecting portion, so that the cathode can be directly contacted and connected with the second conductive pattern at the disconnected position of the light-emitting functional layer, which is beneficial to the conductive connection between the first signal line and the cathode.

[0080] In addition, due to the formation of the above-mentioned step difference, the light-emitting functional layer can be naturally disconnected at the first connection portion. In this way, the light-emitting substrate provided in the embodiment of the present application can greatly simplify the preparation process during the preparation process, reduce the number of times the mask is used, thereby improving the yield and reducing costs.

[0081] The light-emitting substrate and the preparation method thereof and the display panel provided in the embodiments of the present application are specifically introduced and described below in conjunction with the accompanying drawings.

[0082] Combination Figure 4 and Figure 7 As shown, an embodiment of the present application provides a light-emitting substrate, which includes:

[0083] A substrate G1s, a plurality of light emitting units PX arranged in an array on the substrate G1s, and a first signal line (eg, VSS) between two adjacent rows of light emitting units PX;

[0084] like Figure 7As shown, the first signal line (eg, VSS) includes a body VSS-B and a first connection portion VSS-L; the first connection portion VSS-L is used to electrically connect to the cathode CA;

[0085] The light emitting unit PX includes a plurality of light emitting subunits PX1 (eg Figure 7 R, G, B, W shown in );

[0086] Light-emitting subunit PX1 (e.g. Figure 7 The R, G, B, W) and the first signal line VSS shown in the figure all include a first conductive layer SD disposed on one side of the substrate Gls, and the portion of the first conductive layer SD located at the light-emitting subunit PX1 includes a first conductive pattern SD-1, combined with Fig.10 As shown, the first conductive pattern SD-1 is used to electrically connect the anode AN of the light emitting subunit PX1;

[0087] The portion of the first conductive layer SD located at the first connection portion VSS-L includes a second conductive pattern SD-2, the second conductive pattern SD-2 is used to electrically connect the body VSS-B of the first signal line and the cathode CA of the light-emitting subunit PX1; the cathode CA is located on the side of the anode AN away from the first conductive layer SD;

[0088] The first conductive layer SD includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern SD-1 is smaller than the number of sub-layers included in the first conductive pattern SD-1.

[0089] Figure 7 The top view of a light-emitting unit and its surrounding wiring in the light-emitting substrate is shown. Figure 7 The anode AN, the light-emitting functional layer EL and the cathode CA are not drawn in the figure, wherein the cathode CA may cover the entire light-emitting functional layer EL. Fig.10 For Figure 7 Schematic diagram of the top view structure after the anode AN is set on the basis. Figure 4 for Fig.10 Schematic diagram of the cross-sectional structure along the A1A2 direction.

[0090] In an exemplary embodiment, the light-emitting substrate may be applied to an OLED (Organic Light-Emitting Diode) display panel.

[0091] In an exemplary embodiment, the substrate Gls may be a glass substrate. For example, the thickness of the glass substrate may range from 0.3 mm to 0.7 mm. Specifically, the thickness may be 0.3 mm, 0.4 mm, 0.5 mm or 0.6 mm.

[0092] In an exemplary embodiment, the substrate Gls may be made of one or more materials selected from the group consisting of polyimide, polycarbonate, polyacrylate, polyetherimide, and polyethersulfone, and this embodiment includes but is not limited to these.

[0093] In some embodiments, the above-mentioned light-emitting unit PX may include a plurality of light-emitting sub-units PX1 with different light-emitting colors. For example, the light-emitting unit PX may include a red light-emitting sub-unit, a green light-emitting sub-unit and a blue light-emitting sub-unit; for another example, the light-emitting unit PX may include a red light-emitting sub-unit, a green light-emitting sub-unit, a blue light-emitting sub-unit and a white light-emitting sub-unit.

[0094] In some embodiments, the light-emitting unit PX may include multiple light-emitting subunits PX1 with the same light-emitting color, and then colorization is achieved by setting a color filter (CF) or a quantum dot film. For example, the light-emitting unit PX may include multiple light-emitting subunits PX1 with white light-emitting colors, and for another example, the light-emitting unit PX may include multiple light-emitting subunits PX1 with blue light-emitting colors.

[0095] Among them, Figure 7 As shown, the first signal line VSS is arranged along the column direction. The first signal line VSS is electrically connected to the cathode CA through its first connection portion VSS-L.

[0096] In some examples, the first signal line VSS may be electrically connected to a ground line.

[0097] The first conductive layer SD (also referred to as a source-drain conductive layer) may include a plurality of sub-layers, and different regions of the first conductive layer SD may include different numbers of sub-layers.

[0098] "Plurality" refers to two or more than two.

[0099] The portion of the first conductive layer SD located in the light emitting subunit PX1 includes (referred to as)

[0100] The first conductive pattern SD-1 and the portion of the first conductive layer SD located at the first connection portion VSS-L include (referred to as) a second conductive pattern SD-2.

[0101] The number of sublayers included in the second conductive pattern SD-1 is less than the number of sublayers included in the first conductive pattern SD-1. For example, the number of sublayers included in the second conductive pattern SD-1 is one layer less than the number of sublayers included in the first conductive pattern SD-1. For another example, the number of sublayers included in the second conductive pattern SD-1 is two layers less than the number of sublayers included in the first conductive pattern SD-1.

[0102] The embodiment of the present application provides a new light-emitting substrate. Since the first conductive pattern SD-1 is used to electrically connect the anode AN of the light-emitting sub-unit, and the second conductive pattern SD-2 is used to electrically connect the body VSS-B of the first signal line and the cathode CA of the light-emitting sub-unit, on the one hand, the first conductive pattern SD-1 can be electrically connected to the anode AN; on the other hand, since the first conductive layer SD includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern SD-2 arranged in the first conductive layer SD is less than the number of sub-layers included in the first conductive pattern SD-1, there is a step difference between the second conductive pattern SD-2 and the light-emitting functional layer EL in the area where the light-emitting unit PX is located. In the subsequent process of forming the light-emitting functional layer EL and the cathode CA, as shown in FIG. Figure 4 As shown in the dotted ellipse, the step difference causes the light-emitting functional layer EL to be naturally disconnected at the position of the first connection portion VSS-L, thereby enabling the cathode CA to be directly contacted and connected with the second conductive pattern SD-2 at the disconnected position of the light-emitting functional layer EL, which is beneficial to the conductive connection between the first signal line VSS and the cathode CA.

[0103] In addition, due to the formation of the above-mentioned step difference, the light-emitting functional layer EL can be naturally disconnected at the first connection part VSS-L position. In this way, the light-emitting substrate provided in the embodiment of the present application can greatly simplify the preparation process during the preparation process, reduce the number of times the mask is used, thereby reducing costs and improving yields.

[0104] In some light-emitting substrates provided in embodiments of the present application, the first conductive layer SD located at the body VSS-B of the first signal line includes a third conductive pattern, and the number of sublayers included in the third conductive pattern is less than or equal to the number of sublayers included in the first conductive pattern SD-1.

[0105] In an exemplary embodiment, the number of sublayers included in the third conductive pattern is less than the number of sublayers included in the first conductive pattern SD-1. For example, the first signal line body VSS-B can have the same number of sublayers as the first connection part VSS-L, that is, the first signal line body VSS-B can include the same sublayer structure as the first connection part VSS-L.

[0106] In an exemplary embodiment, in order to improve the conductivity of the signal line, the number of sublayers included in the third conductive pattern may be set equal to the number of sublayers included in the first conductive pattern SD-1, thereby reducing the transmission loss of the signal in the signal line.

[0107] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4 or Figure 5 As shown, a partial area of ​​the second conductive pattern SD-2 is in direct contact with the cathode CA.

[0108] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4 As shown, the first conductive pattern SD-1 includes a first sublayer Z1, a second sublayer Z2 and a third sublayer Z3 sequentially arranged in a direction away from the substrate Gls, and the material of the second sublayer Z2 is different from the materials of the first sublayer Z1 and the third sublayer Z3;

[0109] The second conductive pattern SD-2 includes a first sub-layer Z1 and a second sub-layer Z2 which are sequentially arranged in a direction away from the substrate G1s.

[0110] In the embodiments of the present application, Figure 4 As shown, by setting the first conductive pattern SD-1 to include the first sublayer Z1, the second sublayer Z2 and the third sublayer Z3 sequentially arranged in the direction away from the substrate Gls, the second conductive pattern SD-2 includes the first sublayer Z1 and the second sublayer Z2 sequentially arranged in the direction away from the substrate Gls; in the process of preparing the light-emitting substrate, a large step difference is made between the second conductive pattern SD-2 and the light-emitting functional layer EL in the area where the light-emitting unit PX is located, and the step difference is greater than the step difference between the first conductive pattern SD-1 and the light-emitting functional layer EL. When the light-emitting functional layer EL is subsequently prepared, the large step difference causes the light-emitting functional layer EL to be naturally broken at the first connection portion VSS-L, and the light-emitting functional layer EL ( Figure 4 The area marked by the dotted circle in the middle) falls on the second conductive pattern SD-2 through the first through hole Via1 on the passivation layer Pvx. In this way, when the cathode CA is subsequently prepared, the cathode CA can be deposited on the second conductive pattern SD-2 through the position where the light-emitting functional layer EL is broken and contact and conduct with the second conductive pattern SD-2.

[0111] It should be noted that, when preparing the cathode CA, part of the light-emitting functional layer EL is supported above the second conductive pattern SD-2. During the deposition of the cathode CA, the stress borne by the cathode material is reduced, and the portion of the cathode CA located at the position of the first connection portion VSS-L will not break. The portion of the cathode CA located at the position of the first connection portion VSS-L follows the Figure 4 The side surface of the light emitting functional layer EL in the middle dotted circle extends onto the second conductive pattern SD-2, so that the second conductive pattern SD-2 has good contact with the cathode CA, thereby achieving conduction between the first signal line VSS and the cathode CA.

[0112] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4As shown, the light-emitting subunit PX1 and the first connection part VSS-L both include a light-emitting functional layer EL; the light-emitting functional layer EL includes a first surface B1 on the side away from the substrate Gls, and a second surface B2 located between the first surface B1 and the substrate Gls; the light-emitting functional layer EL is disconnected at the position of the first connection part VSS-L; wherein, along the normal direction of the substrate Gls, the distance H1 between the part of the first surface B1 located at the first connection part VSS-L and the substrate Gls is smaller than the distance H2 between the part of the second surface B2 located at the light-emitting subunit PX1 and the substrate Gls.

[0113] In the light-emitting substrate provided in the embodiment of the present application, by setting the distance H1 between the part of the first surface B1 located at the first connection part VSS-L and the substrate Gls to be smaller than the distance H2 between the part of the second surface B2 located at the light-emitting sub-unit PX1 and the substrate Gls, the light-emitting functional layer EL can automatically break at the position of the first connection part VSS-L, which is beneficial to the direct contact and conduction between the subsequent cathode CA and the second conductive pattern SD-2.

[0114] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 5 As shown, the outer contour S1 of the positive projection of the part of the light-emitting functional layer EL located at the first connection part VSS-L on the substrate Gls is located within the outer contour S2 of the positive projection of the second conductive pattern SD-2 on the substrate Gls; the second conductive pattern SD-2 includes a middle area and an edge area surrounding the middle area, and the part of the light-emitting functional layer EL located at the first connection part VSS-L is in direct contact with the middle area of ​​the second conductive pattern SD-2.

[0115] Exemplarily, when the size of the surface of the second conductive pattern SD-2 away from the substrate Gls is different from the size of the surface of the second conductive pattern SD-2 close to the substrate Gls, for example, the size (for example, the area) of the surface of the second conductive pattern SD-2 away from the substrate Gls is smaller than the size (for example, the area) of the surface of the second conductive pattern SD-2 close to the substrate Gls, the outer contour S1 of the positive projection of the part of the light-emitting functional layer EL located at the first connection part VSS-L on the substrate Gls is located within the outer contour of the positive projection of the surface of the second conductive pattern SD-2 away from the substrate Gls on the substrate Gls.

[0116] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4 or Figure 5 As shown, the cathode CA covers the light emitting functional layer EL and the second conductive pattern SD-2; the cathode CA is in direct contact with the portion of the light emitting functional layer EL located at the first connection portion VSS-L and the edge region of the second conductive pattern SD-2.

[0117] In the embodiment of the present application, by setting the second conductive pattern SD-2 to include a middle area and an edge area surrounding the middle area, the portion of the light-emitting functional layer EL located at the first connection portion VSS-L is in direct contact with the middle area of ​​the second conductive pattern SD-2, so that when the cathode CA is subsequently prepared, the cathode CA can be deposited on the edge area of ​​the second conductive pattern SD-2 and contact and conduct with the second conductive pattern SD-2. It should be noted that, since the middle area of ​​the second conductive pattern SD-2 is partially supported by the light-emitting functional layer EL when the cathode CA is prepared, the stress borne by the cathode material is reduced during the deposition of the cathode CA, and the portion of the cathode CA located at the position of the first connection portion VSS-L will not be broken. The portion of the cathode CA located at the position of the first connection portion VSS-L extends along the side of the light-emitting functional layer EL set in the middle area of ​​the second conductive pattern SD-2 to the edge area of ​​the second conductive pattern SD-2, so that the edge area of ​​the second conductive pattern SD-2 has good contact with the cathode CA, and the conduction between the first signal line VSS and the cathode CA is achieved.

[0118] In some light-emitting substrates provided in the embodiments of the present application, the materials of the first sub-layer Z1 and the third sub-layer Z3 are metals, and the material of the second sub-layer Z2 is metal oxide.

[0119] Exemplarily, the metal includes at least one of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti).

[0120] Exemplarily, the metal oxide includes indium tin oxide (ITO) and indium zinc oxide (IZO).

[0121] Exemplarily, the thickness of the first sublayer Z1 and the third sublayer Z3 are both greater than the thickness of the second sublayer Z2.

[0122] Exemplarily, the thicknesses of the first sub-layer Z1 and the third sub-layer Z3 are substantially the same.

[0123] In an embodiment of the present application, by setting the materials of the first sublayer Z1 and the third sublayer Z3 to metals, and the material of the second sublayer Z2 to metal oxide, in the process of preparing the optical substrate, when etching the third sublayer Z3 to form the second conductive pattern SD-2, since the material of the second sublayer Z2 is different from that of the third sublayer Z3, the process of etching the third sublayer Z3 is not easy to cause film surface corrosion to the second sublayer Z2, thereby improving the preparation yield of the light-emitting substrate.

[0124] In some light-emitting substrates provided in the embodiments of the present application, Figure 6 , Figure 8 and Fig.11As shown, the portion of the first conductive layer SD located in the light-emitting sub-unit PX includes a first sub-layer Z1, a second sub-layer Z2 and a third sub-layer Z3 which are sequentially arranged in a direction away from the substrate Gls.

[0125] Among them, Figure 8 As shown, the portion of the first conductive layer SD located in the light-emitting sub-unit PX may include a portion of the conductive structure of the pixel driving circuit, for example, including: the first electrode Cst-1 of the storage capacitor, the source and drain of the transistor TFT, the connecting wiring between the transistors, and the connecting wiring between the transistor and the storage capacitor; the portion of the first conductive layer SD located in the light-emitting sub-unit PX may also be a conductive structure between the pixel driving circuit and the anode AN.

[0126] Fig.11 A schematic diagram of the cross-sectional structure of the light-emitting substrate at the position of the transistor is shown.

[0127] In the light-emitting substrate provided in the embodiment of the present application, the first conductive layer SD can be arranged so that the portion located in the light-emitting sub-unit PX includes a first sub-layer Z1, a second sub-layer Z2 and a third sub-layer Z3 which are arranged in sequence along a direction away from the substrate Gls. In this way, on the one hand, the process difficulty can be reduced, and on the other hand, the conductivity of the first conductive layer SD can be improved, and the signal transmission stability in the pixel driving circuit can be improved, thereby improving the performance of the light-emitting substrate.

[0128] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4 As shown, the light-emitting substrate includes a spacer PDL, the spacer PDL is located between two adjacent light-emitting sub-units PX1, and the anode AN is arranged between the two adjacent spacers PDL;

[0129] Combination Fig.9A and Fig.11 As shown, the light emitting substrate further includes a second conductive layer Sheild located between the first conductive layer SD and the substrate Gls. Fig.9A As shown, the second conductive layer Sheild includes a fourth conductive pattern sh-4, and then combined with Figure 6 , Figure 7 and Fig. 9B As shown, the orthographic projection of the first conductive pattern SD-1 on the substrate Gls, the orthographic projection of the fourth conductive pattern sh-4 on the substrate Gls, and the orthographic projection of the anode AN on the substrate Gls overlap each other, and the fourth conductive pattern sh-4 and the first conductive pattern SD-1 are both electrically connected to the anode AN;

[0130] The first conductive pattern SD-1 and the fourth conductive pattern sh-4 together serve as the first electrode of the storage capacitor Cst in the light-emitting sub-unit.

[0131] In some light-emitting substrates provided in the embodiments of the present application, Figure 4 , Figure 6 , Figure 7 , Figure 8 and Fig.10 As shown, the first conductive pattern SD-1 may also be referred to as the second connection portion AN-L, and the second connection portion AN-L is in direct contact with the fourth conductive pattern sh-4 and the anode AN respectively.

[0132] In some light-emitting substrates provided in the embodiments of the present application, such as Fig.10 As shown, the light-emitting substrate also includes a plurality of second signal lines, such as data signal lines DL. The second signal lines DL (including DL-R, DL-G, DL-B, and DL-W) are consistent in extension direction with the first signal lines VSS, and two second signal lines DL are arranged between two adjacent rows of light-emitting sub-units PX1; the second signal lines DL are located in the first conductive layer SD, and the second signal lines DL include a first sub-layer Z1, a second sub-layer Z2, and a third sub-layer Z3 arranged in sequence in a direction away from the substrate Gls.

[0133] In the light-emitting substrate provided in the embodiment of the present application, the data signal line DL can be arranged on the first conductive layer SD, and the signal line DL includes a first sublayer Z1, a second sublayer Z2 and a third sublayer Z3 which are arranged in sequence along a direction away from the substrate Gls. In this way, on the one hand, the process difficulty can be reduced, and on the other hand, the conductivity of the signal line DL can be improved, and the signal transmission stability in the signal line can be improved, thereby improving the performance of the light-emitting substrate.

[0134] In some light-emitting substrates provided in the embodiments of the present application, Figure 10 to Figure 12 As shown, the light-emitting substrate also includes a third conductive layer Gate, which is located between the first conductive layer SD and the second conductive layer Sheild. The third conductive layer Gate includes a third signal line GL and a gate of the transistor TFT in the light-emitting subunit PX1, and the third signal line GL intersects with the first signal line VSS.

[0135] Exemplarily, the third conductive layer Gate also includes a second electrode Cst-2 of the storage capacitor Cst, wherein the combination Figure 7 As shown, the second electrode Cst-2 of the storage capacitor Cst is electrically connected to the gate of a transistor (eg, T3) in the light-emitting subunit.

[0136] It should be noted that Figure 7The positions of multiple transistors included in the light-emitting sub-unit PX1 are marked in the figure, for example, the source of the first transistor T1 is electrically connected to the data line DL, the drain of the first transistor T1 is electrically connected to the second electrode Cst-2 of the storage capacitor Cst, and the gate of the first transistor T1 is electrically connected to the gate line GL; the source of the second transistor T2 is electrically connected to the first electrode Cst-1 of the storage capacitor Cst, the drain of the second transistor T2 is electrically connected to the Sense signal line, and the gate of the second transistor T2 is electrically connected to the gate line GL; the gate of the third transistor T3 is electrically connected to the second electrode Cst-2 of the storage capacitor Cst, the source of the third transistor T3 is electrically connected to the VDD line, the drain of the third transistor T3 is electrically connected to the first electrode Cst-1 of the storage capacitor Cst, and the gate of the third transistor T3 is electrically connected to the second electrode Cst-2 of the storage capacitor Cst.

[0137] Among them, Fig.12 As shown, the third conductive layer Gate includes a gate line GL-1 and a gate line GL-2, and a repair ring RPR is arranged on the gate line. There is an overlap between the repair ring RPR and the signal line arranged on the first conductive layer SD. When the gate line GL and the signal line arranged on the first conductive layer SD are short-circuited, the short-circuited part can be directly cut off, and the gate line GL can continue to be used normally through the repair ring RPR, thereby improving the use yield of the light-emitting substrate and reducing the cost.

[0138] In addition, other wirings in the third conductive layer Gate may also be provided with repair rings RPR. Here, only the gate line GL is used as an example for description, which does not represent a limitation thereto.

[0139] In some light-emitting substrates provided in the embodiments of the present application, such as Figure 4 and Figure 6 As shown, the anode AN includes a fourth sublayer Z4 and a fifth sublayer Z5, the fourth sublayer Z4 is in direct contact with the first conductive layer SD, and the fifth sublayer Z5 is located on the side of the fourth sublayer Z4 away from the first conductive layer SD; wherein the material of the fourth sublayer Z4 is metal oxide, and the material of the fifth sublayer Z5 is metal.

[0140] Exemplarily, the metal includes at least one of copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti). For example, the fifth sublayer Z5 may be a laminated structure of copper (Cu) / aluminum (Al).

[0141] Exemplarily, the metal oxide includes indium tin oxide (ITO) and indium zinc oxide (IZO).

[0142] In the embodiment of the present application, the anode AN is provided to include a fourth sublayer Z4 and a fifth sublayer Z5, the fourth sublayer Z4 is in direct contact with the first conductive layer SD, and the fifth sublayer Z5 is located on the side of the fourth sublayer Z4 away from the first conductive layer SD; wherein the material of the fourth sublayer Z4 is a metal oxide, and the material of the fifth sublayer Z5 is a metal. The conductivity of the anode AN can be greatly improved, and the reflectivity of the anode AN can also be improved, thereby improving the efficiency of the subsequent light emitted by the light-emitting functional layer EL, improving the light efficiency of the light-emitting substrate, and reducing energy consumption.

[0143] An embodiment of the present application provides a display panel, which includes a light-emitting substrate as described in any one of the above descriptions.

[0144] In an exemplary embodiment, the display panel may be an organic light emitting diode (OLED) display panel.

[0145] The embodiment of the present application provides a new display panel. Since the first conductive pattern SD-1 in the display panel is used to electrically connect the anode AN of the light-emitting sub-unit, and the second conductive pattern SD-2 is used to electrically connect the body VSS-B of the first signal line and the cathode CA of the light-emitting sub-unit, on the one hand, the first conductive pattern SD-1 can be electrically connected to the anode AN; on the other hand, since the first conductive layer SD includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern SD-2 arranged in the first conductive layer SD is less than the number of sub-layers included in the first conductive pattern SD-1, there is a step difference between the second conductive pattern SD-2 and the light-emitting functional layer EL in the area where the light-emitting unit PX is located. In the subsequent process of forming the light-emitting functional layer EL and the cathode CA, as shown in FIG. Figure 4 As shown in the dotted ellipse, the step difference causes the light-emitting functional layer EL to be naturally disconnected at the position of the first connection portion VSS-L, thereby enabling the cathode CA to be directly contacted and connected with the second conductive pattern SD-2 at the disconnected position of the light-emitting functional layer EL, which is beneficial to the conductive connection between the first signal line VSS and the cathode CA.

[0146] In addition, due to the formation of the above-mentioned step difference, the light-emitting functional layer EL can be naturally disconnected at the first connection part VSS-L position. In this way, the light-emitting substrate provided in the embodiment of the present application can greatly simplify the preparation process during the preparation process, reduce the number of times the mask is used, thereby reducing costs and improving yields.

[0147] An embodiment of the present application provides a display device, comprising the display panel as described above.

[0148] Exemplarily, the display device may be a transparent display device.

[0149] The display device provided by the embodiments of the present application has the characteristics of high manufacturing yield, stable performance and good product quality.

[0150] The display device provided in the present application can be: a display module, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a car display device, a smart watch, a fitness wristband, a personal digital assistant, or any other product or component with a display function.

[0151] An embodiment of the present application provides a method for preparing a light-emitting substrate, which is used to prepare a light-emitting substrate as described in any of the above, and the method comprises:

[0152] S1, providing a substrate Gls;

[0153] Among them, after S1, the step of providing a substrate Gls, and before S2, the step of forming an intermediate structure of the first conductive layer SD, the method may also include other steps and processes, such as forming a second conductive layer (also called a light shielding layer) Shield, forming a buffer layer Buf, forming a semiconductor layer (such as IGZO), forming a gate insulating layer GI, forming a third conductive layer Gate, and forming an interlayer dielectric layer ILD. The preparation method in this specification is only described and introduced around the invention point, and the specific process of these steps and processes can refer to the description in the relevant technology, which will not be repeated here.

[0154] S2, such as Fig.13 As shown, the intermediate structure of the first conductive layer SD is formed

[0155] S2, such as Fig.13 As shown, the intermediate structure of the first conductive layer SD is formed, and the intermediate structure of the first conductive layer SD includes a first sublayer Z1, a second sublayer Z2 and a third sublayer Z3 arranged in sequence in a direction away from the substrate Gls; that is, the intermediate structure of the first conductive layer SD includes a first conductive pattern SD-1 and an intermediate structure SD-2' of a second conductive pattern;

[0156] In practical applications, a first conductive film may be formed first, and then patterned to obtain a Fig.13 The intermediate structure of the first conductive layer SD shown in FIG. 1 is further processed by a subsequent etching process to remove the third sub-layer Z3 on the intermediate structure SD-2′ of the second conductive pattern, thereby obtaining the first conductive layer SD.

[0157] S3, forming a passivation film Pvx';

[0158] S4, etching the intermediate structure of the first conductive layer SD and the passivation film Pvx' at the same time to obtain the first conductive layer SD and the passivation layer Pvx;

[0159] Among them, the first conductive layer SD includes a first conductive pattern SD-1 and a second conductive pattern SD-2; the first conductive pattern SD-1 includes a first sublayer Z1, a second sublayer Z2 and a third sublayer Z3 arranged in sequence along a direction away from the substrate Gls, and the second conductive pattern SD-2 includes a first sublayer Z1 and a second sublayer Z2 arranged in sequence along a direction away from the substrate Gls; the first conductive pattern SD-1 is used to electrically connect the anode AN of the light-emitting sub-unit, and the second conductive pattern SD-2 is used to electrically connect the body VSS-B of the first signal line and the cathode CA of the light-emitting sub-unit.

[0160] It should be noted that, in this specification, a “layer” represents a structure that has been patterned, and a thin film represents a structure that has not been patterned.

[0161] The embodiment of the present application prepares a new light-emitting substrate through the preparation method. Since the first conductive pattern SD-1 is used to electrically connect the anode AN of the light-emitting sub-unit, and the second conductive pattern SD-2 is used to electrically connect the body VSS-B of the first signal line and the cathode CA of the light-emitting sub-unit, on the one hand, the first conductive pattern SD-1 can be connected to the anode AN; on the other hand, since the first conductive layer SD includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern SD-2 arranged in the first conductive layer SD is less than the number of sub-layers included in the first conductive pattern SD-1, there is a step difference between the second conductive pattern SD-2 and the light-emitting functional layer EL in the area where the light-emitting unit PX is located. In the subsequent process of forming the light-emitting functional layer EL and the cathode CA, as shown in FIG. Figure 4 As shown in the dotted ellipse, the step difference causes the light-emitting functional layer EL to be naturally disconnected at the position of the first connection portion VSS-L, thereby enabling the cathode CA to be directly contacted and connected with the second conductive pattern SD-2 at the disconnected position of the light-emitting functional layer EL, which is beneficial to the conductive connection between the first signal line VSS and the cathode CA.

[0162] In addition, due to the formation of the above-mentioned step difference, the light-emitting functional layer EL can be naturally disconnected at the first connection part VSS-L position. In this way, the light-emitting substrate provided in the embodiment of the present application can greatly simplify the preparation process during the preparation process, reduce the number of times the mask is used, thereby reducing costs and improving yields.

[0163] In some methods for preparing light-emitting substrates provided in embodiments of the present application, S4, the step of simultaneously etching the intermediate structure of the first conductive layer SD and the passivation film Pvx' to obtain the first conductive layer SD and the passivation layer Pvx includes:

[0164] S41, such as Fig.13 As shown, a photoresist film PR is formed on the side of the passivation film Pvx' away from the substrate Gls;

[0165] S42, using a half-tone mask to pattern the photoresist film PR, and obtaining the following Fig.14 The first mask pattern PR-1 shown;

[0166] S43, such as Fig.15 As shown, the first mask pattern PR-1 is used as a mask to perform the first etching on the passivation film Pvx' to obtain the intermediate structure of the passivation layer Pvx ( Fig.15 The intermediate structure Pvx' is still marked in the figure); the intermediate structure Pvx' of the passivation layer includes a first through hole Via1, and the first through hole Via1 overlaps with the orthographic projection of a partial area of ​​the intermediate structure of the first conductive layer SD located at the position of the first connection portion VSS-L;

[0167] S44, such as Fig.16 As shown, the first mask pattern PR-1 and the intermediate structure Pvx' of the passivation layer are used as masks to etch the third sublayer Z2 of the intermediate structure of the first conductive layer SD at the position of the first connection portion VSS-L, thereby obtaining the first conductive layer SD; wherein the portion of the first conductive layer SD located at the first connection portion VSS includes a second conductive pattern SD-2, and the second conductive pattern SD-2 includes a first sublayer Z1 and a second sublayer Z2 sequentially arranged in a direction away from the substrate Gls;

[0168] S45, such as Fig.17 As shown, the first mask pattern PR-1 is patterned to obtain a second mask pattern PR-2;

[0169] S46, such as Fig.17 As shown, the passivation film is etched a second time using the second mask pattern PR-2 as a mask to obtain a passivation layer Pvx (i.e., the intermediate structure Pvx' of the passivation layer is further etched); the passivation layer Pvx includes a first through hole Via1 and a second through hole Via2, and the second through hole Via2 overlaps with the orthographic projection of a partial area of ​​the first conductive pattern SD-1.

[0170] In the embodiment of the present application, the third sub-layer Z3 on the second conductive pattern SD-2 is removed by the above-mentioned etching method to obtain a hollow structure ( Fig.17 The oval circle marked area), combined with Figure 4As shown in the mark, the distance H1 between the portion of the first surface B1 located at the first connection portion VSS-L and the substrate Gls along the normal direction of the substrate Gls can be smaller than the distance H2 between the portion of the second surface B2 located at the light-emitting subunit PX1 and the substrate Gls. In this way, the formed light-emitting functional layer EL can be automatically broken at the position of the first connection portion VSS-L, which is conducive to direct contact and conduction between the subsequent cathode CA and the second conductive pattern SD-2.

[0171] In some methods for preparing light-emitting substrates provided in embodiments of the present application, after the step of performing a second etching on the passivation film using the second mask pattern as a mask to obtain a passivation layer in S46, the method further includes:

[0172] S5, such as Fig.18 As shown, a spacer PDL is formed;

[0173] S6, such as Fig.19 As shown, an anode AN is formed, wherein the anode AN is electrically connected to the first conductive pattern SD-1 through the second through hole Via2; wherein the top view of the anode AN is as shown Fig. 9B shown.

[0174] S7, such as Fig. 20 As shown, a light-emitting functional layer EL is formed; the light-emitting functional layer EL covers the anode AN, the spacer PDL and the second conductive pattern SD-2, the light-emitting functional layer EL is disconnected at the position of the first through hole Via1, the second conductive pattern SD-2 includes a middle area and an edge area surrounding the middle area, and the portion of the light-emitting functional layer EL located at the first connection portion VSS-L is in direct contact with the middle area of ​​the second conductive pattern SD-2;

[0175] Among them, Figure 4 As shown, the light-emitting functional layer EL includes a first surface B1 on the side away from the substrate Gls, and a second surface B2 located between the first surface B1 and the substrate Gls; the light-emitting functional layer EL is disconnected at the position of the first connection portion VSS-L; wherein, along the normal direction of the substrate Gls, the distance H1 between the portion of the first surface B1 located at the first connection portion VSS-L and the substrate Gls is smaller than the distance H2 between the portion of the second surface B2 located at the light-emitting subunit PX1 and the substrate Gls. In this way, the light-emitting functional layer EL can be automatically broken at the position of the first connection portion VSS-L, which is conducive to direct contact and conduction between the subsequent cathode CA and the second conductive pattern SD-2.

[0176] For example, Figure 5 As shown, the portion of the light emitting function layer EL located at the first connection portion VSS-L is in direct contact with the middle area of ​​the second conductive pattern SD-2.

[0177] S8, such as Fig. 20 As shown, a cathode CA is formed; the cathode CA covers the light-emitting functional layer EL, and the cathode CA is in direct contact with a portion of the light-emitting functional layer EL located at the first connection portion VSS-L and an edge region of the second conductive pattern SD-2.

[0178] In an embodiment of the present application, by setting the second conductive pattern SD-2 to include a middle area and an edge area surrounding the middle area, the portion of the light-emitting functional layer EL located at the first connection portion VSS-L is in direct contact with the middle area of ​​the second conductive pattern SD-2. In this way, when preparing the cathode CA, the cathode CA can be deposited on the edge area of ​​the second conductive pattern SD-2 and be in contact and conductive with the second conductive pattern SD-2.

[0179] It should be noted that, since the middle area of ​​the second conductive pattern SD-2 is partially supported by the light-emitting functional layer EL when preparing the cathode CA, the stress borne inside the cathode material is reduced during the deposition of the cathode CA, and the portion of the cathode CA located at the position of the first connection part VSS-L will not break. The portion of the cathode CA located at the position of the first connection part VSS-L extends along the side of the light-emitting functional layer EL set in the middle area of ​​the second conductive pattern SD-2 to the edge area of ​​the second conductive pattern SD-2, thereby achieving better contact between the edge area of ​​the second conductive pattern SD-2 and the cathode CA, thereby achieving conduction between the first signal line VSS and the cathode CA.

[0180] It should be noted that the light-emitting substrate provided in the embodiments of the present application may also include other structures and components, and the above-mentioned preparation method may also include preparation processes of other structures and components. This specification only introduces the structures and designs related to the invention points and their preparation methods. The other structures and components included in the light-emitting substrate and their preparation methods can be referred to in the introduction of relevant technologies.

[0181] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A light-emitting substrate, wherein: include: A substrate, a plurality of light emitting units arranged in an array on the substrate, and a first signal line between two adjacent rows of the light emitting units; The first signal line includes a body and a first connecting portion; the first connecting portion is used to electrically connect to the cathode; The light-emitting unit includes a plurality of light-emitting sub-units; The light-emitting subunit and the first signal line both include a first conductive layer disposed on one side of the substrate, a portion of the first conductive layer located at the light-emitting subunit includes a first conductive pattern, and the first conductive pattern is used to electrically connect an anode of the light-emitting subunit; The portion of the first conductive layer located at the first connecting portion includes a second conductive pattern, the second conductive pattern is used to electrically connect the body of the first signal line and the cathode of the light-emitting subunit; the cathode is located on a side of the anode away from the first conductive layer; The first conductive layer includes a plurality of sub-layers, and the number of sub-layers included in the second conductive pattern is smaller than the number of sub-layers included in the first conductive pattern.

2. The light-emitting substrate according to claim 1, wherein: A portion of the first conductive layer located at the body of the first signal line includes a third conductive pattern, and the number of sub-layers included in the third conductive pattern is less than or equal to the number of sub-layers included in the first conductive pattern.

3. The light-emitting substrate according to claim 1, wherein: A local area of ​​the second conductive pattern is in direct contact with the cathode.

4. The light-emitting substrate according to claim 3, wherein: The first conductive pattern includes a first sublayer, a second sublayer and a third sublayer sequentially arranged in a direction away from the substrate, and a material of the second sublayer is different from that of the first sublayer and the third sublayer; The second conductive pattern includes the first sub-layer and the second sub-layer sequentially disposed in a direction away from the substrate.

5. The light emitting substrate according to claim 4, wherein: The light-emitting subunit and the first connecting portion both include a light-emitting functional layer; the light-emitting functional layer includes a first surface facing away from the substrate, and a second surface located between the first surface and the substrate; the light-emitting functional layer is disconnected at the position of the first connecting portion; Wherein, along the normal direction of the substrate, the distance between a portion of the first surface located at the first connecting portion and the substrate is smaller than the distance between a portion of the second surface located at the light-emitting subunit and the substrate.

6. The light emitting substrate according to claim 5, wherein: The outer contour of the orthographic projection of the portion of the light-emitting functional layer located at the first connecting portion on the substrate is located within the outer contour of the orthographic projection of the second conductive pattern on the substrate; The second conductive pattern includes a middle region and an edge region surrounding the middle region, and a portion of the light-emitting functional layer located at the first connecting portion is in direct contact with the middle region of the second conductive pattern.

7. The light-emitting substrate according to claim 6, wherein: The cathode covers the light-emitting functional layer and the second conductive pattern; The cathode is in direct contact with a portion of the light-emitting functional layer located at the first connecting portion and an edge region of the second conductive pattern respectively.

8. The light emitting substrate according to any one of claims 5 to 7, wherein The materials of the first sub-layer and the third sub-layer are metals, and the material of the second sub-layer is metal oxide.

9. The light emitting substrate according to claim 8, wherein: The portion of the first conductive layer located in the light-emitting sub-unit includes the first sub-layer, the second sub-layer and the third sub-layer which are sequentially arranged in a direction away from the substrate.

10. The light emitting substrate according to claim 9, wherein: The light-emitting substrate comprises a spacer, the spacer is located between two adjacent light-emitting sub-units, and the anode is arranged between the two adjacent spacers; The light-emitting substrate further comprises a second conductive layer located between the first conductive layer and the substrate, the second conductive layer comprises a fourth conductive pattern, an orthographic projection of the first conductive pattern on the substrate, an orthographic projection of the fourth conductive pattern on the substrate, and an orthographic projection of the anode on the substrate overlap each other, and the fourth conductive pattern and the first conductive pattern are both electrically connected to the anode; The first conductive pattern and the fourth conductive pattern together serve as a first electrode of a storage capacitor in the light-emitting subunit.

11. The light emitting substrate according to claim 10, wherein: The light-emitting substrate further includes a plurality of second signal lines, the second signal lines extending in the same direction as the first signal lines, and two second signal lines are arranged between two adjacent rows of light-emitting sub-units; The second signal line is located in the first conductive layer, and the second signal line includes the first sub-layer, the second sub-layer, and the third sub-layer which are sequentially arranged in a direction away from the substrate.

12. The light emitting substrate according to any one of claims 9 to 11, wherein The anode includes a fourth sublayer and a fifth sublayer, the fourth sublayer is in direct contact with the first conductive layer, and the fifth sublayer is located on a side of the fourth sublayer away from the first conductive layer; Wherein, the material of the fourth sub-layer is metal oxide, and the material of the fifth sub-layer is metal.

13. A display panel, wherein: The light-emitting substrate comprises the light-emitting substrate according to any one of claims 1 to 12.

14. A method for preparing a light-emitting substrate, wherein: For preparing a light-emitting substrate according to any one of claims 4 to 12, the method comprises: providing a substrate; forming an intermediate structure of a first conductive layer, wherein the intermediate structure of the first conductive layer comprises a first sublayer, a second sublayer and a third sublayer sequentially arranged in a direction away from the substrate; Forming a passivation film; At the same time, etching the intermediate structure of the first conductive layer and the passivation film to obtain the first conductive layer and the passivation layer; Among them, the first conductive layer includes a first conductive pattern and a second conductive pattern; the first conductive pattern includes a first sublayer, a second sublayer and a third sublayer arranged in sequence along a direction away from the substrate, and the second conductive pattern includes the first sublayer and the second sublayer arranged in sequence along a direction away from the substrate; the first conductive pattern is used to electrically connect the anode of the light-emitting sub-unit, and the second conductive pattern is used to electrically connect the body of the first signal line and the cathode of the light-emitting sub-unit.

15. The preparation method according to claim 14, wherein: The step of simultaneously etching the intermediate structure of the first conductive layer and the passivation film to obtain the first conductive layer and the passivation layer comprises: forming a photoresist film on a side of the passivation film away from the substrate; Using a half-tone mask to pattern the photoresist film to obtain a first mask pattern; Using the first mask pattern as a mask, the passivation film is etched for the first time to obtain the intermediate structure of the passivation layer; the intermediate structure of the passivation layer includes a first through hole, and the first through hole overlaps with the orthographic projection of a partial area of ​​the intermediate structure of the first conductive layer located at the first connecting portion; Using the first mask pattern and the intermediate structure of the passivation layer as a mask, etching the third sublayer at the position of the first connecting portion of the intermediate structure of the first conductive layer to obtain the first conductive layer; wherein the portion of the first conductive layer located at the first connecting portion includes a second conductive pattern, and the second conductive pattern includes the first sublayer and the second sublayer sequentially arranged in a direction away from the substrate; performing patterning processing on the first mask pattern to obtain a second mask pattern; The passivation film is etched a second time using the second mask pattern as a mask to obtain the passivation layer; the passivation layer includes the first through hole and the second through hole, and the orthographic projection of the second through hole and a partial area of ​​the first conductive pattern overlap.

16. The preparation method according to claim 15, wherein: After the step of etching the passivation film for the second time using the second mask pattern as a mask to obtain the passivation layer, the method further comprises: forming a spacer; forming an anode, wherein the anode is electrically connected to the first conductive pattern through the second through hole; forming a light-emitting functional layer; the light-emitting functional layer covers the anode, the spacer and the second conductive pattern, the light-emitting functional layer is disconnected at the position of the first through hole, the second conductive pattern includes a middle area and an edge area surrounding the middle area, and the portion of the light-emitting functional layer located at the first connecting portion is in direct contact with the middle area of ​​the second conductive pattern; A cathode is formed; the cathode covers the light-emitting functional layer, and the cathode is in direct contact with a portion of the light-emitting functional layer located at the first connecting portion and an edge region of the second conductive pattern.

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