Internal recirculation cooling module

Abstract

Improved cooling modules and methods are configured to recirculate a liquid coolant fluid within the cooling module such that the same liquid coolant fluid impacts a surface of a heat-generating electronic component (or a cooling plate in heat exchange with the heat-generating electronic component) multiple times prior to exiting the cooling module, thereby reusing a given flow of coolant fluid multiple times. With each reuse of coolant fluid, the flow demand is reduced, thereby reducing the infrastructure required to achieve higher performance in direct and indirect micro-convective impingement cooling applications.

Description

Technical Field

[0001] The present invention relates generally to the field of liquid cooling modules for data centers, servers, power inverters and other liquid cooled module computing components, and more particularly to micro convective jet impingement liquid cooling apparatus and methods. Background Art

[0002] The cooling performance of a direct-to-chip single-phase liquid cooling (DLC) device is usually measured in terms of heat transfer coefficient. Impingement cooling modules produce very high local heat transfer coefficients. The performance of cooling modules utilizing impingement cooling is affected by both flow rate and pressure drop. Compared to other more mature cooling technologies (e.g., microchannel), impingement cooling performs best when the flow rate of the cooling module is 2 to 4 times higher than that of mature cooling technologies. Even with relatively high flow consumption, using impingement cooling modules has inherent advantages, such as more uniform processor temperature distribution, thermal impedance without heat, and other advantages.

[0003] However, the existing cooling infrastructure in a given application area may not be able to support a 2 to 4 times increase in flow. As a result, jet impingement cooling modules may not achieve peak performance in these environments. Therefore, jet impingement modules would benefit from the ability to reduce flow requirements to ensure more ideal impingement performance even at lower flow rates. Summary of the invention

[0004] Embodiments of the present invention provide improved cooling modules and cooling methods for cooling heat-generating electronic components attached to printed circuit boards in servers and other data processing devices. The improved cooling modules and cooling methods are configured to recirculate liquid coolant fluid within the cooling module so that the same liquid coolant fluid impacts the surface of the heat-generating electronic components (or the cooling plate thermally connected to the heat-generating electronic components) multiple times before leaving the cooling module, thereby reusing a given flow of coolant fluid multiple times. Each time the coolant fluid is reused, the flow demand decreases. For example, in a cooling module constructed and operated according to the devices and techniques described herein, a single recirculation of the coolant fluid can generally reduce the flow requirement of the cooling module by approximately 50%, without significantly reducing the cooling performance. The triple recirculation of the coolant fluid inside the cooling module can generally reduce the flow demand by 67%, and so on. Advantageously, the internal recirculation implemented according to the present invention does not increase the number of external seals required, limits the pressure loss in the internal manifold components, and allows the priority cooling area on the chipset to be treated first by the correct segmentation of the impact area inside the cooling module.

[0005] In summary, embodiments of the present invention provide cooling modules that can reduce flow requirements by implementing internal recirculation of liquid coolant fluid within the cooling module so that the liquid coolant fluid impacts the surface to be cooled multiple times before the liquid coolant fluid leaves the cooling module. Internal recirculation allows exhaust fluid from a given portion within the cooling module to be delivered to the inlet of a second portion without leaving the cooling module housing. This technique of effectively collecting and re-delivering coolant fluid that has impacted the cooling surface allows a large portion of the liquid coolant fluid to remain within the primary external sealed boundary of the cooling module for a longer period of time while its cooling potential can still be effectively utilized. Therefore, the advantages of using embodiments of the present invention include, but are not limited to:

[0006] 1) Allows multiple reuse of coolant fluid, significantly reducing flow requirements.

[0007] 2) Efficiently deliver coolant fluid to minimize manifold pressure drop.

[0008] 3) Avoid additional external seal failure points and additional pressure drops associated with external recirculating coolant fluid.

[0009] The coolant fluid passing through a cooling module constructed and operated according to an embodiment of the present invention is conveyed internally multiple times after impact, so that it can be "reused" multiple times to cool multiple portions of the cooling surface. The coolant fluid is also accelerated onto the surface to be cooled by using a micro-convective nozzle array. However, the coolant fluid is not discharged from the cooling module after a single impact, but is recaptured and re-accelerated by additional micro-convective nozzle arrays in one or more additional stages. By connecting multiple different portions of the micro-convective nozzle array in series, the flow rate can be reduced. In some embodiments, multiple different portions of the nozzle arrays can be connected in series and in parallel with each other.

[0010] The devices and techniques disclosed herein can be implemented in both direct cooling modules and indirect cooling modules. A direct cooling module applies a coolant directly to the surface of a heat source to achieve heat transfer. An indirect cooling module applies a coolant to a plate that is part of the cooling module, where the plate is in thermal contact with the heat source to achieve heat transfer.

[0011] In one embodiment, the present invention provides a cooling module, wherein the cooling module includes: a jet plate; a shell; a ceiling between the jet plate and the shell; a bottom plate; a fastening system; and a fastening system for fastening the cooling module to a circuit board (or server) containing heat-generating electronic components. The jet plate has: an upper surface; a lower surface; a first section, the first section including a first micro-jet nozzle array, the first micro-jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section, the second section including a second micro-jet nozzle array, the second micro-jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate. The ceiling arranged between the jet plate and the shell includes: a first ceiling mounting boundary, the first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate; and a second ceiling mounting boundary, the second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate. The bottom plate includes: a cooling surface; a first cooling surface mounting edge extending from the cooling surface to the lower surface of the jet plate; and a second cooling surface mounting edge extending from the cooling surface to the lower surface of the jet plate.

[0012] The jet plate, ceiling, cooling surface of the base plate, first ceiling mounting boundary, second ceiling mounting boundary, first cooling surface mounting boundary and second cooling surface mounting boundary are arranged to define: a first inlet chamber, which is located between the ceiling and the first micro-jet nozzle array; a second inlet chamber, which is located between the ceiling and the second micro-jet nozzle array; a first impact volume, which is located between the first micro-jet nozzle array and the cooling surface; a second impact volume, which is located between the second micro-jet nozzle array and the cooling surface; and a first couch passage, which connects the first impact volume to the second inlet chamber fluid.

[0013] A fastening system, which may include screws, pins, or tensioning plates, for example, attaches the cooling module to a circuit board having one or more heat-generating electronic components attached thereto. In one embodiment, the fastening system attaches the cooling module to the circuit board so that the cooling surface of the base plate will be in direct thermal communication with the one or more heat-generating electronic components on the circuit board. In this configuration, the cooling surface of the base plate can absorb heat generated by the heat-generating electronic components when the circuit board is in operation.

[0014] The cooling module also includes an inlet connector attached to the housing, the inlet connector being configured to allow pressurized coolant fluid delivered from an external source, such as an external pump or a central distribution unit (CDU), to enter the cooling module. An inlet flow channel inside the cooling module carries the pressurized coolant fluid from the inlet connector to a first inlet chamber. When the pressurized coolant fluid enters the first inlet chamber, a first microjet nozzle array in a first section of the jet plate is configured to receive the pressurized coolant fluid from the first inlet chamber and accelerate the pressurized coolant fluid, while directing the accelerated pressurized coolant fluid to flow at a high velocity into a first impact volume below the jet plate to impact a first portion of the cooling surface of the base plate, thereby removing heat that has been absorbed from the one or more heat-generating electronic components by the first portion of the cooling surface.

[0015] At this time, the bench passage is configured to carry a portion of the pressurized coolant fluid that strikes the first portion of the cooling surface out of the first impact volume and into the second inlet chamber. Then, a second microjet nozzle array in the jet plate introduces the pressurized coolant fluid from the second inlet chamber, accelerates the pressurized coolant fluid, and directs the accelerated pressurized coolant fluid to flow into the second impact volume at a high velocity to strike the second portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

[0016] In a preferred embodiment, the cooling module of the present invention further comprises one or more effluent collection channels to capture a portion of the pressurized coolant fluid in the first impact volume and the second impact volume and to convey the captured pressurized coolant fluid to an outlet connector attached to the housing for discharge from the cooling module.

[0017] Note that the ceiling may or may not be manufactured as an integral part of the housing. In some embodiments, the cooling module of the present invention may include an insert plate disposed between the housing and the fluidic plate, and the ceiling is integrated into the insert plate instead of the housing.

[0018] In another embodiment, the bottom plate of the cooling module has openings on the bottom side instead of on the cooling surface, which allows the coolant fluid accelerated by the micro jet array in the jet plate to directly impact the surface of the heat generating electronic component multiple times instead of impacting the cooling surface in thermal contact with the heat generating electronic component. After the first impact, the cooling fluid is then carried by the bench passage to the downstream inlet chamber to be accelerated and guided by the second (third or fourth) micro jet nozzle array in the jet plate to directly impact other parts of the heat generating electronic component for a second (third or fourth) time.

[0019] In yet another embodiment, a method for cooling one or more heat-generating electronic components attached to a circuit board is provided. Step 1 of the method is to provide a cooling module, the cooling module comprising: a jet plate; a housing; a ceiling arranged between the jet plate and the housing; a bottom plate having a cooling surface; and a fastening system for fastening the cooling module to the circuit board. For this step, the jet plate comprises a first section and a second section, the first section comprising a first micro-jet nozzle array extending through the jet plate, and the second section comprising a second micro-jet nozzle array extending through the jet plate. The jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first cooling surface mounting boundary and the second cooling surface mounting boundary are all arranged to define: a first inlet chamber, which is located between the ceiling and the first micro-jet nozzle array; a second inlet chamber, which is located between the ceiling and the second micro-jet nozzle array; a first impact volume, which is located between the first micro-jet nozzle array and the cooling surface; a second impact volume, which is located between the second micro-jet nozzle array and the cooling surface; and a first bench passage, which connects the first impact volume to the second inlet chamber fluid.

[0020] Step 2 is to attach the cooling module to the circuit board using a fastening system so that the cooling surface of the base plate will be in thermal communication with the one or more heat generating electronic components on the circuit board and absorb the heat generated by the one or more heat generating electronic components when the circuit board is in operation. Step 3 of the method is to connect an external source for pressurized coolant fluid to an inlet port on the housing of the cooling module. Step 4 is to pass the pressurized coolant fluid received at the inlet port into the first inlet chamber of the jet plate.

[0021] In step 5, a first micro jet nozzle array in a first section of the jet plate receives pressurized coolant fluid from a first inlet chamber, accelerates the pressurized cooling fluid, and directs the accelerated pressurized cooling fluid to flow at a high velocity into a first impact volume to impact a first portion of a cooling surface of the base plate, thereby removing heat that has been absorbed from the one or more heat generating electronic components by the first portion of the cooling surface. Typically, but not necessarily, the coolant exits via a boundary of the impact volume. In step 6, a bench passage in the cooling module transfers at least a portion of the pressurized coolant fluid that impacts the first portion of the cooling surface from the first impact volume to a second inlet chamber. And finally, in step 6, a second microjet nozzle array in the jet plate receives the pressurized coolant fluid from the second inlet chamber, accelerates the pressurized coolant fluid, and then directs the accelerated pressurized coolant fluid to flow into a second impact volume at a high velocity to impact a second portion of the cooling surface of the base plate without allowing the pressurized coolant fluid to exit the cooling module before entering the second inlet chamber, thereby removing heat that has been absorbed from the one or more heat-generating electronic components by the second portion of the cooling surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are included in and constitute a part of the specification, illustrate preferred embodiments of the present invention and, together with the specification, are used to explain the principles of the present invention. In the accompanying drawings, the same reference numerals represent the same or functionally similar elements. In addition, the leftmost digit of a reference numeral represents the figure number in which the reference numeral first appears.

[0023] Figure 1 shows a prior art cooling module in cross-section. Low temperature inlet coolant enters the entire jet plate and is accelerated through the jet plate toward the surface to be cooled (direct module) or the base plate (indirect module). The coolant, which is increased in temperature by heat transfer, is collected and flows to the outlet.

[0024] Figure 2A , 2B 2C show in cross-section an example of an internal recirculation cooling module according to one embodiment of the invention. In this example, the cooling module has four stages.

[0025] Figure 3 The difference between the flow path of a conventional prior art cooling module (A) and the flow path of a cooling module equipped with internal recirculation according to an embodiment of the present invention (B) is shown.

[0026] Figure 4 It is shown that within a given cooling module, the segmentation of the sections of the fluidic plate can be arbitrary.

[0027] Figure 5A schematic diagram of a surface segmentation is shown, wherein an initial central impact zone is connected to two separate subsequent jet plate sections, both of which convey their outflow into a common annular collection passage to flow toward an outlet.

[0028] Fig. 6A and 6B An isometric cross-sectional view of an indirect cooling module 600 with internal recirculation constructed in accordance with one embodiment of the present invention (Example A) is shown.

[0029] Figure 7 The same cooling module (Example A) is shown with the housing removed to better identify the bench passages between the impingement volume of each jet plate section and the inlet side of the downstream section. For this example, the bench passages are repeated at both ends of the cooling module (A and B).

[0030] Figure 8 An exploded view of another example of a cooling module (Example B) constructed in accordance with another embodiment of the present invention is shown with the housing removed to better illustrate some of the internal components.

[0031] Fig. 9 Shown in Figure 8 A partial cross-sectional view of cooling module 900 (Example B) shown in an exploded view of FIG.

[0032] Fig.10 A cooling module assembly constructed in accordance with the invention described herein is shown (Example C).

[0033] Fig.11 An exploded view of Example C of an embodiment of the present invention is shown. The base plate contains a number of channel features to help form the bench passages with the jet plate and housing.

[0034] Fig.12 Shown in Fig.10 A partial top view of an exemplary cooling module assembly (Example C) is shown in FIG.

[0035] Fig.13 Further clarified in Figures 10 to 12 Flow paths in an exemplary cooling module are shown in FIG.

[0036] Fig.14 An exploded view of another cooling module (Example D) constructed in accordance with one embodiment of the present invention is shown. The cooling module shown is mounted directly to a heat source and is therefore considered a direct (contact) cooling module.

[0037] Fig.15 Shown in Fig.14 Flow arrangement of a direct contact cooling module (Example D) shown in .

[0038] Fig.16A and 16B Shown in Fig.14 A partial cross-sectional view of the direct contact cooling module (Example D) shown in FIG. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present invention will now be described in detail, examples of which are shown in the accompanying drawings. Note that the following drawings and examples are not intended to limit the scope of the present invention or its embodiments or their equivalents. For the purpose of this detailed discussion, the terms "part" and "section" may be used interchangeably and therefore may be considered to have the same meaning unless otherwise specifically stated.

[0040] Summary of the Invention

[0041] The present invention utilizes the geometry of the jet plate, ceiling and floor to divide the inner cavity of the cooling module into several sections so that the flow passes through at least two sections in series, where the exhaust from one or more sections is transmitted to the inlet of the subsequent section within the cooling module. By making the same coolant fluid contact the cooling surface (floor cooling surface or heat source) multiple times, the flow consumption of the cooling module is significantly reduced. By not allowing the coolant fluid to leave the outer sealing boundary of the cooling module to recool and recirculate it, the number of external seals required is reduced, and the overall pressure drop of the recirculating cooling module is reduced because the flow path is more compact.

[0042] There are many possibilities for internal manifold arrangements for implementing the present invention within the framework of both direct cooling modules and indirect cooling modules. The flow path that collects the effluent from one section of the cold plate and conveys it to the inlet side of the next section is called a bench path. The bench path is used to isolate the effluent area of ​​the starting jet plate section from the effluent portion of any downstream jet plate section. The bench path can also be sealed to prevent the coolant fluid from flowing through the next jet plate section. The bench path is formed by a combination of surfaces associated with other internal components of the cooling module. Thus, the bench path can be formed, for example, by the walls and structures of the following sections:

[0043] A) Jet plate (possibly with cutouts), ceiling and floor.

[0044] B) Fluidic plate (possibly with cutouts), insert plate and base plate.

[0045] C) Fluidic plate (possibly with cutouts), housing and insert plate.

[0046] D) Fluidic plate (possibly with cutouts) and insert plate.

[0047] E) Jet panels (possibly with cutouts), borders extending from the ceiling, inset panels and base panels.

[0048] Each segment of the jet plate includes an array of micro jet nozzles configured to introduce a coolant fluid from an adjacent inlet chamber and then accelerate the coolant fluid to flow into and through an associated impact volume below the jet plate at a high velocity so that the accelerated coolant fluid impacts a portion of a cooling surface, which may include a cooling surface on a base plate of the cooling module or a cooling surface on a heat source, and thereby promote heat transfer from the heat source to the coolant fluid.

[0049] If an insert plate is present, it is used to help direct the flow from the outlet of one section to the inlet of the next section. Modern manufacturing techniques can construct the jet plate, the ceiling, or both as an integral part of the insert plate. Cooling performance can be improved by using gaskets, adhesives, or welding processes to seal the joints between the jet plate and the housing, insert plate, ceiling, and / or floor.

[0050] The fastening system can be directly engaged in the housing, that is, the housing has mounting holes for connecting the cooling module to the heat source. The fastening system can also use another structure, sometimes called a tension plate, which transfers the mounting force of the fastener from the plate where the heat generating component is mounted to the housing.

[0051] Additional geometry (e.g., walls or boundaries) may be added to the direct cooling module, the indirect cooling module, or both to help form a bench path beneath the jet plate to help ensure that flow does not short-circuit between the various effluent portions. The additional geometry is intended to simplify the geometry required for the base plate, thereby reducing manufacturing and assembly costs. Optional assembly of the cooling module and implementation of the present invention in a cooling module may be accomplished by constructing the housing in two parts, fastening, bonding, or welding the two parts together.

[0052] Furthermore, it may be beneficial to manufacture sections of the fluidic plate as separate components and retain these separate components within the assembly rather than using one continuous fluidic plate.

[0053] Turning to the drawings, FIG1 shows a prior art cooling module 100 in cross-sectional view. As shown in FIG1 , the prior art cooling module 100 generally includes a housing 102, an inlet 104, an outlet 106, and a jet plate 108. The housing 102 is attached to a surface 110 to be cooled. A low temperature coolant enters the inlet 104, enters the entire jet plate 108, and is accelerated through the jet plate 108 toward the surface 110 to be cooled (direct module) or the base plate (indirect module). Due to the heat transfer generated by contact with the cooling surface 110, the temperature of the coolant fluid increases. The coolant fluid is collected and flows to the outlet 106 to be discharged from the cooling module 100.

[0054] Figure 2A , 2B2C show in cross-sectional view an example of an internal recirculation cooling module 200 according to one embodiment of the present invention. In this example, the cooling module 200 has four stages, which means that the same coolant fluid is accelerated four times through four separate sections 210a-210d of the jet plate, and the four separate sections 210a-210d are respectively targeted at different areas on the surface 212 to be cooled. The surface 212 to be cooled may include a base plate in thermal contact with the surface of one or more heat-generating electronic devices, where the base plate is a component of the cooling module 200. In this configuration, the cooling module 200 is referred to as an "indirect" cooling module. Alternatively, the surface 212 to be cooled may include the heat-generating electronic device itself, in which case the cooling module 200 may be referred to as a "direct" cooling module.

[0055] like Figure 2A As best shown in FIG. 2 , the cooling module 200 includes: an inlet port 202 connected to a housing 206; an outlet port 208 connected to the housing 206; and segmented jet plates 210a-210d. The cooling module 200 also includes a ceiling 216 located on the inner side of the top wall of the housing 206. Figure 2B As best shown in FIG. 2 , the ceiling 216 has a set of ceiling mounting edges 218a-218d (i.e., walls) extending downwardly from the ceiling 216 to the upper surface of each of the different sections 210a-210d of the jet plates. If the cooling surface is a floor (such as in an indirect cooling version of the cooling module), the cooling surface 212 has a set of cooling surface mounting edges 220a-220d extending from the floor 212 to the lower surface 222 of the jet plates 210a-210d.

[0056] The shapes, arrangements, and relative positions of the jet plate segments 210a-210d, ceiling 216, ceiling mounting boundaries 218a-218c, cooling surface 212, and cooling surface mounting boundaries 220a-220c together serve to define: four inlet chambers 222a-222d located above the jet plate segments 210a-210d; four impact volumes 224a-224d located below the jet plate segments 210a-210d; and three bench passages 214a-214c. Figure 2C The bench passages 214a-214c are configured to connect the outlets of the impact volumes 224a-224c to the inlet fluids of the inlet chambers 222b-222d in the cooling module 200, so that the cooling fluid that has entered the impact volumes 224a-224c to impact different portions of the cooling surface 212 will next be transferred to the inlet chambers 222b-222d, where the coolant fluid will be introduced into and accelerated by subsequent microjet arrays in the jet plate segments 210b-210d.

[0057] Figure 3 The difference between the flow path (A) for a conventional prior art cooling module and the flow path (B) for a cooling module equipped with internal recirculation according to an embodiment of the present invention is shown. The bench passage connects the impact volume below each section of the jet plate with the inlet chamber of the subsequent section of the jet plate. Although it may be more efficient to form the bench passage by controlling the shape, arrangement and relative position of the boundaries extending from the ceiling and cooling surface in the cooling module, it will be understood that in alternative embodiments of the present invention, the bench passage may include a physical tube or conduit (independent of the boundaries extending from the ceiling and cooling surface).

[0058] Figure 4 Shown in given cooling module, the distribution of each section of jet plate can be arbitrary.Here, central inlet is connected to subsequent annular section from central jet plate part, then connected to annular outlet collecting passage, and finally connected to outlet.

[0059] Figure 5 A schematic diagram of the surface distribution is shown, where an initial central impact zone is connected to two separate subsequent jet plate sections, both of which then convey their outflow into a common annular collecting passage to convey the flow to the outlet. This schematic diagram shows that not all jet plate sections must be connected in series.

[0060] Fig. 6A and 6B An isometric cross-sectional view of an indirect cooling module 600 with internal recirculation constructed according to one embodiment of the present invention (Example A) is shown. The cooling module 600 has a housing 602, a jet plate 605, a bottom plate 610, an inlet 615, and an outlet 620. The jet plate 605 is divided into three separate sections 605a-605c. The three sections 605a-605c are separated from each other by two ceiling mounting borders 625a and 625b, which extend from a ceiling 630 on the inner top wall of the housing 602. Suitably, seals 635a and 635b are located where the ceiling mounting edges 625a and 625b join the jet plate 605 to prevent coolant fluid from flowing directly from one section to another without flowing through the jet plate or the bench passages ( ) formed by the shape, arrangement and relative positions of the jet plate 605, the base plate 610, the ceiling 630 and the ceiling mounting edges 625a and 625b. Figure 7 and Fig.12 605a, 605b, and 605c are best shown in FIG. 606, discussed in detail below). The effluent collection passage 640 ensures that the coolant fluid that has passed through the micro-jet nozzle arrays in the jet plate sections 605a, 605b, and 605c is collected into the bench passage and / or the outlet of the cooling module 600.

[0061] Figure 7 The same cooling module 600 shown in FIG. 6 (Example A) is shown, but with the housing 602 removed to show and identify bench passages 705a and 705b that are fluidly connected to the impact volume below each microjet nozzle array 715a, 715b, and 715c in each of the three jet plate sections and the inlet chamber associated with the microjet nozzle array in the downstream jet plate section. For this example, there are two bench passages on each side (side A and side B) of each microjet array in the jet plate section of the cooling module. Figure 7 As shown, the two bench passages 705a (side A and side B) are configured to capture and guide the coolant fluid that has undergone a first impact through the operation of the first microjet nozzle array 715a in the first section of the jet plate ( Figure 7 The two bench passages 705b (A side and B side) are configured to capture and guide the coolant fluid that has undergone a second impact through the operation of the second microjet nozzle array 715b in the second section of the jet plate. And the two outflow channels 740 (A side and B side) capture and guide the coolant fluid that has undergone a third impact through the operation of the third microjet nozzle array 715c in the third section of the jet plate.

[0062] The bench passage 705a directs coolant fluid from the impact volume ( Figure 7 2 ) is directed to an inlet chamber ( ) located above the microjet nozzle array 715 b. Figure 7 2 ). The bench passage 705 b delivers the coolant fluid from the impact volume located below the micro jet nozzle array 715 b to the inlet chamber located above the micro jet nozzle array 715 c. And the effluent collection channel 740 is configured to deliver the coolant fluid from the impact volume located below the micro jet nozzle array 715 c to the outlet in the cooling module 700.

[0063] Figure 8An exploded view of another example (Example B) of a cooling module 800 constructed in accordance with another embodiment of the present invention is shown, with the housing removed to better illustrate some of the internal components. In this embodiment, an insert plate 805 and a sealing gasket 810 are embedded between a jet plate 815 and a housing (not shown). The jet plate 815 is divided into three sections, each section containing a microjet nozzle array 817. After the coolant fluid has passed through the first and second microjet nozzle arrays to impinge on the cooling surface 825 of the base plate 820, the coolant fluid will be located in an impingement volume below the plane of the segmented jet plate 815. The bench passage (at Figure 7 and Fig.12 815) is used to move coolant fluid out of the impingement volume located below the plane of the segmented jet plate 815 and into the inlet chamber located above the plane of the segmented jet plate 815. Therefore, as the bench passage moves coolant fluid from the impingement volume to the downstream inlet chamber, it is necessary to configure the bench passage to "lift" the coolant fluid from the height of the plane below the segmented jet plate 815 to the height of the plane above the segmented jet plate 815. Therefore, at least some portions of the bench passage will exist below the plane of the segmented jet plate 815, while other portions of the bench passage will exist above the plane of the segmented jet plate 815.

[0064] The formation of bench access in the cooling module 800 can be facilitated by the embedding and use of an embed plate 805, which includes a ceiling 807 on its bottom side, and the ceiling 807 has a ceiling mounting border (and / or wall or support) extending downward. These ceiling mounting borders, combined with the upper surface of the segmented jet plate 815 and the structure of the ceiling 807, can be conveniently used to form a portion of the bench access that exists above the plane of the segmented jet plate 815. In some embodiments, the ceiling 807 is an integral part of the embed plate 805. When the embed plate is not used, the features of the ceiling 807 can be formed on the inner top wall of the shell. In other embodiments, the ceiling 807 can include separately manufactured components that can be embedded below the embed plate 805 or the inner top wall of the shell. The base plate 820 includes a cooling surface 825 having an upwardly extending cooling surface mounting boundary 830 that is appropriately shaped and arranged to cooperate with the lower surface of the segmented jet plate 815 and the structure of the cooling surface 825 to form a portion of a bench passage that exists below the plane of the segmented jet plate 815.

[0065] The sealing gasket 810 prevents cooling fluid in one section of the segmented jet plate 815 from flowing directly into another section of the segmented jet plate 815 without passing through the bench passage. The cutout 840 in the segmented jet plate 815 and the corresponding portion of the sealing gasket 810 are portions of the bench passages that allow coolant to pass through the plane of the segmented jet plate 815 as the coolant fluid is lifted from a height below the plane of the segmented jet plate 815 to a height above the plane of the segmented jet plate 815.

[0066] Fig. 9 Shows Figure 8 FIG. 9 is a partial cross-sectional view of a cooling module 900 (Example B) shown in an exploded view of FIG. 9A . In this case, an inlet flow channel 905 cut into the top of an insert plate 910 first delivers cooling fluid from an inlet port on a housing (not shown) to approximately the center 915 of the cooling module 900. A first bench passage is formed by a combination of structures associated with the bottom plate 930, the segmented jet plate 925, and the border in the insert plate 910, which delivers the coolant fluid back toward the inlet side of the segmented jet plate 920 before the coolant fluid flows through the nozzle array in the second section 925 of the jet plate. A second bench passage 935 is also formed by the boundaries in the bottom plate 930, the jet plate 925 and the embed plate 910, and the second bench passage 935 guides the coolant fluid from the second section of the segmented jet plate 925 to the third section, wherein the coolant fluid is collected in the effluent collection passage 940 within the embed plate 910 after impact in the third section, and can then flow to the outlet port (not shown) via several external flow channels 950 located between the bottom side of the top wall of the shell and the top side of the embed plate 910.

[0067] Fig.10 A cooling module assembly 1000 (Example C) is shown in which a cooling module 1005 with internal recirculation constructed according to one embodiment of the present invention is used. In this example, the base plate 1010 of the cooling module 1005 is attached and secured to a surface 1015 to be cooled (in this example, a processor) using a fastening system, which in this example includes a tensioning plate 1020 that transmits compressive forces from a processor mounting bracket 1025 (in this case, a support plate) and fasteners 1030 to a cooling module housing 1040. An inlet port 1050 attached to the housing 1040 is configured to allow pressurized coolant fluid generated by an external source to be introduced into the cooling module 1005, and an outlet port 1055 attached to the housing 1040 is configured to exhaust the coolant fluid from the cooling module 1005. The base plate 1010 of the cooling module is in thermal communication with the surface 1015 to be cooled using a thermal interface material (not shown).

[0068] Fig.11 Shows Fig.10 The cooling surface 1103 of the base plate 1105 includes a number of cooling surface mounting boundaries 1110 (walls or standoffs or channel features) which, along with structures and cutouts built into the jet plate 1015, sealing gasket 1020, and housing 1025, help form appropriately configured bench passages to move cooling fluid from one section of the jet plate 1015 to the next.

[0069] Fig.12 Shows Fig.10 A partial top view of an exemplary cooling module assembly is shown in FIG. For ease of understanding, the housing, inlet port, and outlet port have been removed from the image in this figure. Fig.12 As shown, the inlet flow of the coolant fluid is divided between two parallel sections of the jet plate (section 1A and section 1B), each section including a microjet nozzle array containing a plurality of microjet nozzles. The discharge from these parallel sections is collected together through a plurality of bench passages to direct the coolant to section 2. The bench passages of section 2 convey the flow to the top volume in fluid communication with the inlet chamber in section 3. Section 3 in turn has a bench passage that connects section 3 to the fourth and final section. Example C shows the ability to combine parallel sections (1A and 1B) to form further series sections (2, 3, 4). Fig.12 It is also shown that these sections can be used to target specific areas of the processor chip to customize the heat transfer in each area.

[0070] Fig.13 Further clarified in Figure 10-12 Flow paths in an exemplary cooling module shown in FIG, with emphasis on the formation of bench paths leading from sections 1A and 1B to section 2. Note that the baseplate channel features, typically formed of copper, can be used to help form the bench paths. These form-locking features on the baseplate (protruding from the copper) can also be implemented with separate components. Fig.13 The arrows in show the flow path taken by the coolant fluid as it travels in the bench passage connecting the impact volume of section 1 to the inlet chamber of section 2.

[0071] Fig.14 An exploded view of another cooling module (Example D) constructed according to one embodiment of the present invention is shown. The cooling module shown is mounted directly to a heat source and is therefore considered a direct cooling module. In this example, the internal passages are not gasketed. In this example, the jet plate includes three separate parts that are manufactured as three separate physical components.

[0072] Fig.15 Shows Fig.14 The flow arrangement of a direct contact cooling module (Example D) shown in FIG. 1 is shown, and illustrates how a single jet plate section connected to an inlet is divided into two parallel sections (Section 2A and Section 2B), and the effluent from these sections is then brought together and passed to an outlet (not shown).

[0073] Fig.16A and 16B Shows Fig.14 FIG. 16 is a partial cross-sectional view of a direct contact cooling module (Example D) shown in FIG. The cross-sectional view shows the flow path from section 1 to section 2A in more detail. The bench passage in this example is formed by the jet plate, the lower half of the shell, and the surface being cooled. FIG. 16 has an inset that provides a close-up of the flow path from section 1 to section 2A through the bench passage.

[0074] The above preferred embodiments are intended to illustrate the principles of the present invention, but do not limit the scope thereof. Those skilled in the art, when reading this disclosure or practicing the claimed invention, may expect various other embodiments, modifications and equivalents of these preferred embodiments. These variations, modifications and equivalents are all intended to be included within the scope of the present invention and the appended claims.

Claims

1. A cooling module, comprising: (a) a jet plate, the jet plate comprising: an upper surface; a lower surface; a first section comprising a first micro jet nozzle array, the first micro jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section comprising a second micro jet nozzle array, the second micro jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and (b) housing; (c) a ceiling disposed between the jet plate and the housing, the ceiling comprising: a first ceiling mounting edge extending from the ceiling to the upper surface of the jet plate; and a second ceiling mounting edge extending from the ceiling to the upper surface of the jet plate; (d) a bottom plate, the bottom plate comprising: a cooling surface; a first cooling surface mounting edge extending from the cooling surface to the lower surface of the ejection plate; and a second cooling surface mounting edge extending from the cooling surface to the lower surface of the ejection plate; (e) wherein the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first cooling surface mounting boundary, and the second cooling surface mounting boundary are arranged to define: a first inlet chamber, the first inlet chamber is located between the ceiling and the first micro-jet nozzle array; a second inlet chamber, the second inlet chamber is located between the ceiling and the second micro-jet nozzle array; a first impact volume, the first impact volume is located between the first micro-jet nozzle array and the cooling surface; a second impact volume, the second impact volume is located between the second micro-jet nozzle array and the cooling surface; and a first bench passage, the first bench passage fluidly connecting the first impact volume to the second inlet chamber; (f) a fastening system for attaching the cooling module to a circuit board having one or more heat-generating electronic components attached thereto so that the cooling surface of the base plate will be in thermal communication with the one or more heat-generating electronic components on the circuit board and absorb heat generated by the one or more heat-generating electronic components when the circuit board is in operation; and (g) an inlet fitting attached to the housing and configured to allow pressurized coolant fluid delivered from an external source to enter the cooling module; and (h) an inlet flow path for carrying pressurized liquid coolant fluid from the inlet fitting to the first inlet chamber; (i) Of which: (i) the first microjet nozzle array in the first section of the jet plate is configured to receive pressurized coolant fluid from the first inlet chamber, accelerate the pressurized coolant fluid, and flow the accelerated pressurized coolant fluid into the first impact volume at a high velocity to impact a first portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat generating electronic components; (ii) the bench passage is configured to carry a portion of the pressurized coolant fluid of the first impact volume and into the second inlet chamber; and (iii) the second microjet nozzle array in the jet plate is configured to receive the pressurized coolant fluid from the second inlet chamber, accelerate the pressurized coolant fluid and flow the accelerated pressurized coolant fluid into the second impact volume at a high velocity to impact the second portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

2. The cooling module according to claim 1, further comprising: (a) an outlet fitting connected to the housing and configured to discharge the pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid from the first surge volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

3. The cooling module of claim 1 , further comprising a second effluent collection channel configured to capture a portion of the pressurized coolant fluid from the second impact volume and to convey the captured pressurized coolant fluid to the outlet connector for discharge from the cooling module.

4. The cooling module according to claim 1, wherein: The roof is manufactured as an integral part of the shell.

5. The cooling module according to claim 1, wherein: The roof is not manufactured as an integral part of the shell.

6. The cooling module according to claim 5, further comprising: (a) an insert plate, the insert plate being arranged between the housing and the jet plate; (b) wherein the ceiling is manufactured as an integral component of the insert panel.

7. The cooling module of claim 1, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the fluidic plate from directly entering the second section of the fluidic plate without flowing through the first bench passage.

8. The cooling module according to claim 1, wherein: (a) the second section of the jet plate surrounds and encloses the first section of the jet plate; (b) the second ceiling mounting edge of the ceiling surrounds and encloses the first ceiling mounting edge; and (c) The second cooling surface mounting edge of the base plate surrounds and encloses the first cooling surface mounting edge.

9. The cooling module according to claim 1, wherein: (a) the jet plate further comprises a third section, the third section comprises a third micro jet nozzle array, the third micro jet nozzle array extends through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further includes a third ceiling mounting edge extending from the ceiling to the upper surface of the jet plate; and (c) the base plate further comprises a third cooling surface mounting boundary, the third cooling surface mounting boundary extending from the cooling surface to the lower surface of the ejector plate; (d) wherein the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first cooling surface mounting boundary, the second cooling surface mounting boundary and the third cooling surface mounting boundary are arranged to define: a third inlet chamber, the third inlet chamber is located between the ceiling and the third microjet nozzle array; a third impact volume, the third impact volume is located between the cooling surface and the third microjet nozzle array; and a second bench passageway fluidly connecting the first impact volume or the second impact volume or both to the third inlet chamber; and (e) the third microjet nozzle array in the jet plate is configured to receive the pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid and direct the accelerated pressurized coolant fluid to flow into the third impact volume at a high velocity to impact the third portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the third portion of the cooling surface from the one or more heat-generating electronic components.

10. The cooling module according to claim 9, further comprising: (a) an outlet fitting connected to the housing and configured to discharge pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid from the third surge volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

11. The cooling module of claim 9, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the fluid ejection plate from directly entering the second section of the fluid ejection plate without flowing through the second bench passage.

12. The cooling module according to claim 11, wherein: The sealing gasket prevents pressurized coolant fluid entering the second section of the fluid ejection plate from flowing directly into the third section of the fluid ejection plate without flowing through the second bench passageway.

13. The cooling module according to claim 9, wherein: (a) the third section of the jet plate surrounds and encloses the first section of the jet plate and the second section of the jet plate; (b) the third ceiling mounting boundary of the ceiling surrounds and encloses the first ceiling mounting boundary and the second ceiling mounting boundary; and (c) The third cooling surface mounting boundary of the base plate surrounds and encloses the first cooling surface mounting boundary and the second cooling surface mounting boundary.

14. The cooling module according to claim 9, wherein: The roof is manufactured as an integral part of the shell.

15. The cooling module according to claim 9, wherein: The roof is not manufactured as an integral part of the shell.

16. The cooling module according to claim 15, further comprising: (a) an insert plate, the insert plate being arranged between the housing and the jet plate; (b) wherein the ceiling is manufactured as an integral component of the insert panel.

17. The cooling module according to claim 1, further comprising: (a) a second jet plate, the second jet plate comprising another upper surface, another lower surface and a third section, the third section comprising a third micro jet nozzle array, the third micro jet nozzle array extending through the second jet plate from the other upper surface of the second jet plate to the other lower surface of the second jet plate; (b) of which: (i) the ceiling further comprises a third ceiling mounting boundary, the third ceiling mounting boundary extending from the ceiling to the other upper surface of the second jet plate, and (ii) the bottom plate further comprises a third cooling surface mounting boundary, the third cooling surface mounting boundary extending from the cooling surface to the other lower surface of the second jet plate, (iii) wherein the second jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first cooling surface mounting boundary, the second cooling surface mounting boundary and the third cooling surface mounting boundary are arranged to define: a third inlet chamber, the third inlet chamber is located between the ceiling and the third micro-jet nozzle array; a third impact volume, the third impact volume is located between the cooling surface and the third micro-jet nozzle array; and a second bench passage, the second bench passage fluidically connecting the first impact volume or the second impact volume or both to the third inlet chamber, and (iv) the third microjet nozzle array in the second fluidic plate is configured to receive the pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid and direct the accelerated pressurized coolant fluid to flow into the third impact volume at a high velocity to impact the third portion of the cooling surface of the base plate, thereby removing a portion of the heat that has been absorbed by the third portion of the cooling surface from the one or more heat generating electronic components.

18. A method for cooling one or more heat-generating electronic components attached to a circuit board, the method comprising the steps of: (a) providing a cooling module, the cooling module comprising: a jet plate; a housing; a ceiling arranged between the jet plate and the housing; a bottom plate having a cooling surface; and a fastening system for fastening the cooling module to the circuit board; (b) wherein (i) the jet plate includes a first section and a second section, the first section including a first microjet nozzle array extending through the jet plate, the second section including a second microjet nozzle array extending through the jet plate, and (ii) the jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first cooling surface mounting boundary, and the second cooling surface mounting boundary are arranged to define: a first inlet chamber, the first inlet chamber is located between the ceiling and the first microjet nozzle array; a second inlet chamber, the second inlet chamber is located between the ceiling and the second microjet nozzle array; a first impact volume, the first impact volume is located between the first microjet nozzle array and the cooling surface; a second impact volume, the second impact volume is located between the second microjet nozzle array and the cooling surface; and a first bench passage, the first bench passage fluidly connecting the first impact volume to the second inlet chamber; (c) attaching the cooling module to the circuit board using the fastening system so that the cooling surface of the base plate will be in thermal communication with the one or more heat-generating electronic components on the circuit board and absorb heat generated by the one or more heat-generating electronic components when the circuit board is in operation; (d) connecting an external source for pressurized coolant fluid to an inlet port on the housing of the cooling module; (e) passing pressurized coolant fluid received at the inlet port into the first inlet chamber of the ejector plate; (f) receiving, with the first microjet nozzle array in the first section of the jet plate, pressurized coolant fluid from the first inlet chamber, accelerating the pressurized cooling fluid, and directing the accelerated pressurized cooling fluid to flow at a high velocity into the first impact volume to impact a first portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat generating electronic components; (g) transferring, using the bench passage, a portion of the pressurized coolant fluid that impinges on the first portion of the cooling surface from the first impingement volume to the second inlet chamber; and (h) receiving, using the second microjet nozzle array in the jet plate, pressurized coolant fluid from the second inlet chamber, accelerating the pressurized coolant fluid, and directing the accelerated pressurized coolant fluid to flow at a high velocity into the second impact volume to impact a second portion of the cooling surface of the base plate without allowing the pressurized coolant fluid to exit the cooling module before entering the second inlet chamber, thereby removing heat that has been absorbed from the one or more heat-generating electronic components by the second portion of the cooling surface.

19. The method according to claim 18, further comprising the steps of: (a) a portion of the pressurized coolant fluid captured in the first surge volume that is not passed by the bench passage to the second inlet chamber; (b) delivering the captured pressurized coolant fluid to an outlet connection connected to the housing; and (c) exhausting the pressurized coolant fluid out of the cooling module.

20. The method according to claim 18, wherein: The roof is manufactured as an integral part of the shell.

21. The method according to claim 18, wherein: The roof is not manufactured as an integral part of the shell.

22. A cooling module, comprising: (a) a jet plate, the jet plate comprising: an upper surface; a lower surface; a first section, the first section comprising a first micro jet nozzle array, the first micro jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section, the second section comprising a second micro jet nozzle array, the second micro jet nozzle array extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, and (b) a housing, the housing comprising a top cover and a bottom plate; (c) a ceiling disposed between the jet plate and the top cover of the housing, the ceiling comprising a first ceiling mounting edge extending from the ceiling to the upper surface of the jet plate and a second ceiling mounting edge extending from the ceiling to the upper surface of the jet plate, (d) the base plate of the housing comprises: an opening; a flange surrounding the opening; a first flange mounting edge; and a second flange mounting edge, wherein both the first flange mounting edge and the second flange mounting edge extend through the opening in the base plate and abut the lower surface of the jet plate; (e) wherein the jet plate, the ceiling, the flange of the base, the first ceiling mounting boundary, the second ceiling mounting boundary, the first flange mounting boundary, and the second flange mounting boundary are arranged to define: a first inlet chamber, the first inlet chamber being located between the ceiling and the first micro-jet nozzle array; a second inlet chamber, the second inlet chamber being located between the ceiling and the second micro-jet nozzle array; a first impact volume, the first impact volume being located within the opening immediately below the first micro-jet nozzle array; a second impact volume, the second impact volume being located within the opening and immediately below the second micro-jet nozzle array; and a first bench passage, the first bench passage fluidically connecting the first impact volume to the second inlet chamber; (f) a fastening system for attaching the cooling module to a circuit board having one or more heat-generating electronic components attached thereto such that the one or more heat-generating electronic components on the circuit board will be located within or directly below the first inlet chamber and the second inlet chamber in the opening in the base plate; (g) an inlet fitting attached to the top cover and configured to allow pressurized coolant fluid delivered from an external source to enter the cooling module; and (h) an inlet flow passage for carrying pressurized coolant fluid from the inlet fitting to the first inlet chamber; (i) Of which: the first microjet nozzle array in the first section of the jet plate being configured to receive pressurized coolant fluid from the first inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow into the first impact volume at a high velocity to directly impact a first portion of the one or more heat generating electronic components, thereby removing heat generated by the first portion of the one or more heat generating electronic components when the first portion of the one or more heat generating electronic components is in an operating state, The bench passage is configured to carry a portion of the pressurized coolant fluid impinging the one or more heat generating electronic components out of the first impingement volume and into the second inlet chamber, and The second microjet nozzle array in the jet plate is configured to receive the pressurized coolant fluid from the second inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow into the second impact volume at a high velocity to impact the second portion of the one or more heat-generating electronic components, thereby removing a portion of the heat generated by the second portion of the one or more heat-generating electronic components when the second portion of the one or more heat-generating electronic components is in an operating state.

23. The cooling module according to claim 22, further comprising: (a) an outlet fitting connected to the top cover and configured to discharge pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid in the first surge volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

24. The cooling module of claim 22, further comprising a second effluent collection channel configured to capture a portion of the pressurized coolant fluid in the second impact volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

25. The cooling module according to claim 22, wherein: The roof is manufactured as an integral part of the roof.

26. The cooling module according to claim 22, wherein: The roof is not manufactured as an integral part of the roof.

27. The cooling module according to claim 26, further comprising: (a) an insert plate, the insert plate being arranged between the top cover and the jet plate; (b) wherein the ceiling is manufactured as an integral component of the insert panel.

28. The cooling module of claim 22, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the fluidic plate from directly entering the second section of the fluidic plate without flowing through the first bench passage.

29. The cooling module of claim 22, wherein: (a) the second section of the jet plate surrounds and encloses the first section of the jet plate; (b) the second ceiling mounting edge of the ceiling surrounds and encloses the first ceiling mounting edge; and (c) The second flange mounting edge of the base plate surrounds and encloses the first flange mounting edge.

30. The cooling module of claim 22, wherein: (a) the jet plate further comprises a third section, the third section comprises a third micro jet nozzle array, the third micro jet nozzle array extends through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further comprises a third ceiling mounting boundary, the third ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate; as well as (c) the base plate further comprising a third flange mounting edge extending through the opening in the base plate and abutting the lower surface of the jet plate; (d) wherein the jet plate, the ceiling, the flange of the base, the first ceiling mounting boundary, the second ceiling mounting boundary, the third ceiling mounting boundary, the first flange mounting boundary, the second flange mounting boundary and the third flange mounting boundary are arranged to define: a third inlet chamber, the third inlet chamber is located between the ceiling and the third micro-jet nozzle array; a third impact volume, the third impact volume is located within the opening and is located immediately below the third micro-jet nozzle array; and a second bench passage, the second bench passage connects the first impact volume or the second impact volume or both to the third inlet chamber fluid; and (e) the third microjet nozzle array in the jet plate is configured to introduce pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid and direct the accelerated pressurized coolant fluid to flow into the third impact volume at a high velocity to directly impact the third portion of the one or more heat-generating electronic components, thereby removing heat generated by the third portion of the one or more heat-generating electronic components when the third portion of the one or more heat-generating electronic components is in an operating state.

31. The cooling module according to claim 30, further comprising: (a) an outlet fitting connected to the top cover and configured to discharge pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid in the third surge volume and to convey the captured pressurized coolant fluid to the outlet nipple for discharge from the cooling module.

32. The cooling module of claim 30, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the fluidic plate from directly entering the second section of the fluidic plate without flowing through the second bench passage.

33. The cooling module according to claim 32, wherein: The sealing gasket prevents pressurized coolant fluid entering the second section of the fluid ejection plate from flowing directly into the third section of the fluid ejection plate without flowing through the second bench passageway.

34. The cooling module of claim 30, wherein: (a) the third section of the jet plate surrounds and encloses the first section of the jet plate and the second section of the jet plate; (b) the third ceiling mounting boundary of the ceiling surrounds and encloses the first ceiling mounting boundary and the second ceiling mounting boundary; and (c) The third flange mounting edge of the base plate surrounds and encloses the first flange mounting edge and the second flange mounting edge.

35. The cooling module according to claim 30, wherein: The roof is manufactured as an integral part of the roof.

36. The cooling assembly of claim 30, wherein: The roof is not manufactured as an integral part of the roof.

37. The cooling module according to claim 36, further comprising: (a) an insert plate, the insert plate being arranged between the top cover and the jet plate; (b) wherein the ceiling is manufactured as an integral component of the insert panel.

38. A method of removing heat from a heat generating electronic component on a circuit board attached to a computer processor, the method comprising: (a) providing the apparatus of claim 22; (b) attaching the apparatus of claim 22 to an external source of pressurized coolant fluid; and (c) Using the apparatus of claim 22 to remove heat from the heat-generating electronic component.

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