Integrated circuit board glue filling and packaging device

Abstract

The invention discloses an integrated circuit board glue filling packaging device which comprises a base, a placing groove is formed in the upper end of the base, two connecting frames are symmetrically and fixedly connected to the upper end of the base, a shell is fixedly connected to the upper ends of the two connecting frames together, a glue cavity is formed in the shell, and a glue outlet is formed in the glue cavity. A feeding opening is formed in the inner top of the colloid cavity; and the cleaning mechanism comprises a rectangular box fixedly connected to the right side of the shell, two columnar grooves are symmetrically formed in the upper end of the rectangular box, first piston plates capable of sliding up and down are arranged in the two columnar grooves, and the inner bottom of the columnar groove located on the right side communicates with the outside through a one-way opening. When the device is actually used, comprehensive dust removal treatment can be automatically carried out, dust on a circuit board is prevented from affecting the subsequent glue filling quality, in addition, glue filling uniformity can be achieved, glue liquid can be conveniently and rapidly turned into a horizontal state, and therefore subsequent treatment is carried out.

Description

Technical Field

[0001] The invention relates to the field of circuit board packaging, and in particular to a glue-filling packaging device for an integrated circuit board. Background Art

[0002] With the increasing reliability requirements of electronic products, potting and packaging has become a common means to improve product reliability. Glue potting is to use equipment or manual methods to pour polyurethane potting glue, silicone potting glue, epoxy resin potting glue into devices with electronic components and circuits, and solidify them at room temperature or under heating conditions to become thermosetting polymer insulation materials with excellent performance, thereby achieving the purpose of bonding, sealing, potting and coating protection; During the use of the existing glue potting and packaging device, due to the residual dust on the circuit board, the actual glue potting quality will be affected after the glue potting. In addition, it is difficult to achieve uniform glue potting during the glue potting, and it takes a long time to allow the glue to seal the circuit board horizontally under the force of gravity. Therefore, how to solve the above problems needs to be considered. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings existing in the prior art, and to propose an integrated circuit board glue filling and packaging device. When used in practice, the device can automatically perform a comprehensive dust cleaning process to prevent dust on the circuit board from affecting the subsequent glue filling quality. In addition, the uniformity of the glue injection can be achieved, and the glue liquid can be quickly horizontalized for subsequent processing.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions: A device for encapsulating integrated circuit boards with glue, comprising a base, a placement groove is provided at the upper end of the base, two connecting frames are symmetrically fixedly connected to the upper end of the base, a shell is fixedly connected to the upper ends of the two connecting frames, a colloid cavity is provided in the shell, and a delivery port is provided at the inner top of the colloid cavity; a cleaning mechanism, the cleaning mechanism comprises a rectangular box fixedly connected to the right side of the shell, two columnar grooves are symmetrically provided at the upper end of the rectangular box, first piston plates that can slide up and down are provided in the two columnar grooves, the inner bottom of the columnar groove located on the right side is connected to the outside through a one-way port, the inner bottom of the columnar groove located on the right side is connected to a third one-way tube, the other end of the third one-way tube is connected to a hose, a hollow bar is provided above the base, the other end of the hose is connected to the hollow bar, and a plurality of drainage ports are provided at the inner bottom of the hollow bar; a moving mechanism, the moving mechanism is used to move the hollow bar left and right; a driving mechanism, the driving mechanism is used to realize the reciprocating up and down movement of the two first piston plates; a glue injection mechanism, the glue injection mechanism is located inside the shell.

[0005] Preferably, the moving mechanism includes two vertical plates symmetrically fixedly connected to the lower end of the shell, a reciprocating screw is rotatably connected between the two vertical plates, a slider is threadedly connected to the reciprocating screw, the upper end of the slider is in contact with the lower end of the shell and is slidably connected, and the lower end of the slider is fixedly connected to the upper end of the hollow bar.

[0006] Preferably, a second mounting bracket is fixedly connected to the left side of the shell, and an output shaft of the second mounting bracket passes through the vertical plate on the left side and is fixedly connected to the left end of the reciprocating screw rod.

[0007] Preferably, the driving mechanism includes a first mounting frame installed on the upper end of the shell, a first motor on the upper end of the first mounting frame, the output shaft of the first motor is fixedly connected to a rotating circular plate, the upper ends of the two first piston plates are commonly fixedly connected to a U-shaped rod, the eccentric part of the rotating circular plate is rotatably connected to a connecting rod, and the other end of the connecting rod is rotatably connected to the horizontal part of the U-shaped rod.

[0008] Preferably, the glue injection mechanism includes a columnar cavity opened inside the shell, a second piston plate that can slide left and right is arranged in the columnar cavity, the left side of the second piston plate is elastically connected to the left inner wall of the columnar cavity through a spring, and the left space of the columnar cavity is connected to the outside through a connecting port.

[0009] Preferably, the right side space of the columnar cavity is connected to the inner bottom of the left columnar groove through the second one-way tube, the inner bottom space of the columnar groove on the left is connected to the inner bottom space of the colloid cavity through the first one-way tube, and the right side space of the columnar cavity is connected to a glue discharge tube, and the other end of the glue discharge tube is connected to the inside of the third one-way tube.

[0010] Preferably, one-way valves are installed inside the first one-way tube, the second one-way tube, the third one-way tube and the one-way port. The one-way valve inside the first one-way tube flows in a one-way direction from the colloid cavity to the bottom of the left cylindrical groove, the one-way valve inside the second one-way tube flows in a one-way direction from the bottom of the left cylindrical groove to the right side space of the cylindrical cavity, the one-way valve inside the third one-way tube flows in a one-way direction from the bottom of the right cylindrical groove to the inside of the hose, and the one-way valve inside the one-way port flows from right to left.

[0011] Preferably, a normally open solenoid valve is installed in the rubber discharge pipe, and the first motor and the normally open solenoid valve are in the same series circuit.

[0012] Compared with the prior art, the present invention has the following beneficial effects: 1. A cleaning mechanism is provided. With the use of the moving mechanism, the slider and the hollow bar reciprocate left and right, so that the hollow bar can spray high-speed gas by reciprocating left and right, which can evenly blow and clean the surface of the circuit board, realize dust removal, and avoid dust affecting the subsequent glue filling process.

[0013] 2. Through the use of the moving mechanism, the glue is evenly injected onto the surface of the circuit board. After the glue injection is completed, there is no need to wait for a long time, and the upper layer of the glue is in a horizontal state, which is convenient for subsequent processing.

[0014] 3. In actual use, the amount of glue injected can be changed by controlling the start-up time of the first motor, so that the amount of glue injected can be controlled, thereby improving the adaptability of actual use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural schematic diagram of an integrated circuit board glue filling and packaging device proposed by the present invention; Figure 2 for Figure 1 Rectangle and enlarged schematic diagram; Figure 3 It is a structural schematic diagram of the mobile mechanism; Figure 4 It is a bottom view schematic diagram of the hollow bar; Figure 5 Schematic diagram of the three-dimensional structure of the hollow bar; Figure 6 It is a three-dimensional schematic diagram of the connection between the connecting rod and the U-shaped rod.

[0016] In the figure: 1 base, 2 placement groove, 3 connecting frame, 4 shell, 5 colloid cavity, 6 delivery port, 7 first mounting frame, 8 first motor, 9 rotating shaft, 10 rectangular box, 11 columnar groove, 12 first piston plate, 13 first one-way tube, 14 second one-way tube, 15 third one-way tube, 16 second mounting frame, 17 second motor, 18 hollow bar, 19 hose, 20 rubber discharge hose, 21 columnar cavity, 22 normally open solenoid valve, 23 second piston plate, 24 spring, 25 connecting port, 26 one-way port, 27 rotating circular plate, 28 connecting rod, 29 U-shaped rod, 30 vertical plate, 31 reciprocating screw rod, 32 discharge port, 33 slider. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0018] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0019] Reference Figure 1-Figure 6, a device for filling and packaging integrated circuit boards, comprising a base 1, a placement groove 2 is provided at the upper end of the base 1, the placement groove 2 is used to place the circuit board, two connecting frames 3 are symmetrically fixedly connected to the upper end of the base 1, the upper ends of the two connecting frames 3 are commonly fixedly connected to a shell 4, a colloid cavity 5 is provided in the shell 4, and a delivery port 6 is provided at the inner top of the colloid cavity 5, which is convenient for injecting glue; As an embodiment of the present invention, a cleaning mechanism is also included. The cleaning mechanism includes a rectangular box 10 fixedly connected to the right side of the shell 4. Two columnar grooves 11 are symmetrically provided at the upper end of the rectangular box 10. A first piston plate 12 that can slide up and down is provided in the two columnar grooves 11. The inner bottom of the columnar groove 11 located on the right side is connected to the outside through a one-way port 26. The inner bottom of the columnar groove 11 located on the right side is connected to a third one-way tube 15. The other end of the third one-way tube 15 is connected to a hose 19. A hollow bar 18 is provided above the base 1. The other end of the hose 19 is connected to the hollow bar 18. A plurality of drainage ports 32 are provided at the inner bottom of the hollow bar 18. By using the cleaning mechanism, a uniform cleaning operation can be achieved, and dust is prevented from affecting the subsequent glue filling process. As an embodiment of the present invention, it also includes a moving mechanism, which is used to move the hollow bar 18 left and right. The moving mechanism includes two vertical plates 30 symmetrically fixedly connected to the lower end of the shell 4, and a reciprocating screw rod 31 is rotatably connected between the two vertical plates 30. A slider 33 is threadedly connected to the reciprocating screw rod 31. The unidirectional rotation of the reciprocating screw rod 31 can make the slider 33 reciprocate left and right. The upper end of the slider 33 contacts the lower end of the shell 4 and is slidably connected. The lower end of the slider 33 is fixedly connected to the upper end of the hollow bar 18. The left side of the shell 4 is fixedly connected to the second mounting frame 16. The output shaft of the second mounting frame 16 passes through the vertical plate 30 on the left side and is fixedly connected to the left end of the reciprocating screw rod 31. As an embodiment of the present invention, it also includes a driving mechanism, which is used to realize the reciprocating up and down movement of the two first piston plates 12, and the driving mechanism includes a first mounting frame 7 mounted on the upper end of the housing 4, a first motor 8 on the upper end of the first mounting frame 7, and the output shaft of the first motor 8 is fixedly connected to a rotating circular plate 27, and the upper ends of the two first piston plates 12 are commonly fixedly connected to a U-shaped rod 29, and the eccentric part of the rotating circular plate 27 is rotatably connected to a connecting rod 28, and the other end of the connecting rod 28 is rotatably connected to the horizontal part of the U-shaped rod 29; As an embodiment of the present invention, it also includes a glue injection mechanism, which is located inside the shell 4. The glue injection mechanism includes a columnar cavity 21 opened inside the shell 4, and a second piston plate 23 that can slide left and right is arranged in the columnar cavity 21. The left side of the second piston plate 23 is elastically connected to the left inner wall of the columnar cavity 21 through a spring 24. The left space of the columnar cavity 21 is connected to the outside through a connecting port 25. The right space of the columnar cavity 21 is connected to the inner bottom of the left columnar groove 11 through the second one-way tube 14. The inner bottom space of the columnar groove 11 located on the left is connected to the inner bottom space of the colloid cavity 5 through the first one-way tube 13. The right space of the columnar cavity 21 is connected with a glue discharge pipe 20, and the other end of the glue discharge pipe 20 is connected to the inside of the third one-way tube 15. As an embodiment of the present invention, one-way valves are installed inside the first one-way tube 13, the second one-way tube 14, the third one-way tube 15 and the one-way port 26. The one-way valve inside the first one-way tube 13 flows in a one-way direction from the colloid cavity 5 to the bottom of the left cylindrical groove 11, the one-way valve inside the second one-way tube 14 flows in a one-way direction from the bottom of the left cylindrical groove 11 to the right side space of the cylindrical cavity 21, the one-way valve inside the third one-way tube 15 flows in a one-way direction from the bottom of the right cylindrical groove 11 to the inside of the hose 19, the one-way valve in the one-way port 26 flows from right to left, a normally open solenoid valve 22 is installed in the discharge hose 20, and the first motor 8 and the normally open solenoid valve 22 are in the same series circuit.

[0020] In the present invention, when in use, the circuit board is placed on the placement slot 2, and then the first motor 8 and the second motor 17 are started at the same time. The start of the first motor 8 will drive the rotating circular plate 27 to rotate, and the rotation of the rotating circular plate 27 will drive the U-shaped rod 29 and the two first piston plates 12 to reciprocate up and down through the connecting rod 28. At this time, the normally open solenoid valve 22 is energized and sealed, and the first piston plate 12 on the left side moves up and down, and the one-way valve inside the first one-way tube 13 and the second one-way tube 14 will press the glue into the right side space of the columnar cavity 21, and push the second piston plate 23 to move left, and compress the spring 24, while the first piston plate 12 on the right side moves up and down, which will continuously press the gas into the hose 19, and finally discharge it from the multiple drainage ports 32 at the bottom of the hollow bar 18, and spray high-speed gas. In this process, the second motor 17 can be started. After the second motor 17 is started, it will drive the reciprocating screw 31 to rotate, so as to realize the left and right reciprocating motion of the slider 33 and the hollow bar 18; The left and right reciprocating motion of the hollow bar 18 ejects high-speed gas, which can blow and clean the surface of the circuit board to achieve dust removal; After the dust cleaning is completed, the first motor 8 is turned off, the normally open electromagnetic valve 22 is powered off and turned on, and the glue in the right space of the columnar cavity 21 enters the hose 19 through the glue discharge pipe 20, and is finally discharged from the multiple drainage ports 32 at the bottom of the hollow bar 18. In this way, glue injection can be carried out. During the glue injection process, the movement of the hollow bar 18 allows the glue to be evenly injected onto the surface of the circuit board. After the glue injection is completed, there is no need to wait for a long time, and the upper layer of the glue is in a horizontal state, which is convenient for subsequent processing; Specifically, the amount of glue injected can be changed by controlling the start time of the first motor 8, thereby achieving controllable glue injection amount.

[0021] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0022] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An integrated circuit board glue filling and packaging device, characterized in that: include: A base (1), wherein the upper end of the base (1) is provided with a placement groove (2), the upper end of the base (1) is symmetrically fixedly connected to two connecting frames (3), the upper ends of the two connecting frames (3) are commonly fixedly connected to a shell (4), a colloid cavity (5) is provided in the shell (4), and a delivery port (6) is provided at the inner top of the colloid cavity (5); a cleaning mechanism, wherein the cleaning mechanism comprises a rectangular box (10) fixedly connected to the right side of the shell (4), the upper end of the rectangular box (10) is symmetrically provided with two columnar grooves (11), the two columnar grooves (11) are provided with a first piston plate (12) that can slide up and down, and the columnar groove (11) located on the right side The inner bottom is connected to the outside through a one-way port (26); the inner bottom of the columnar groove (11) located on the right side is connected to a third one-way tube (15); the other end of the third one-way tube (15) is connected to a hose (19); a hollow bar (18) is arranged above the base (1); the other end of the hose (19) is connected to the hollow bar (18); a plurality of drainage ports (32) are provided at the inner bottom of the hollow bar (18); a moving mechanism, the moving mechanism is used to move the hollow bar (18) left and right; a driving mechanism, the driving mechanism is used to realize the reciprocating up and down movement of the two first piston plates (12); and a glue injection mechanism, the glue injection mechanism is located inside the shell (4).

2. The integrated circuit board glue potting packaging device according to claim 1, characterized in that: The moving mechanism comprises two vertical plates (30) symmetrically fixedly connected to the lower end of the housing (4); a reciprocating screw rod (31) is rotatably connected between the two vertical plates (30); a slider (33) is threadedly connected to the reciprocating screw rod (31); the upper end of the slider (33) contacts the lower end of the housing (4) and is slidably connected; the lower end of the slider (33) is fixedly connected to the upper end of the hollow bar (18).

3. The integrated circuit board glue potting packaging device according to claim 2, characterized in that: A second mounting frame (16) is fixedly connected to the left side of the housing (4); an output shaft of the second mounting frame (16) passes through the vertical plate (30) on the left side and is fixedly connected to the left end of the reciprocating screw rod (31).

4. The integrated circuit board glue potting packaging device according to claim 1, characterized in that: The driving mechanism comprises a first mounting frame (7) mounted on the upper end of the housing (4), a first motor (8) on the upper end of the first mounting frame (7), an output shaft of the first motor (8) being fixedly connected to a rotating circular plate (27), upper ends of the two first piston plates (12) being commonly fixedly connected to a U-shaped rod (29), an eccentric portion of the rotating circular plate (27) being rotatably connected to a connecting rod (28), and the other end of the connecting rod (28) being rotatably connected to a horizontal portion of the U-shaped rod (29).

5. The integrated circuit board glue potting packaging device according to claim 1, characterized in that: The glue injection mechanism comprises a columnar cavity (21) opened inside the housing (4), a second piston plate (23) slidable left and right is arranged inside the columnar cavity (21), the left side of the second piston plate (23) is elastically connected to the left inner wall of the columnar cavity (21) via a spring (24), and the left space of the columnar cavity (21) is connected to the outside via a connecting port (25).

6. The integrated circuit board glue potting packaging device according to claim 5, characterized in that: The right side space of the columnar cavity (21) is connected to the inner bottom of the left columnar groove (11) via the second one-way tube (14); the inner bottom space of the columnar groove (11) on the left is connected to the inner bottom space of the colloid cavity (5) via the first one-way tube (13); the right side space of the columnar cavity (21) is connected to a rubber discharge tube (20); the other end of the rubber discharge tube (20) is connected to the inside of the third one-way tube (15).

7. The integrated circuit board glue potting packaging device according to claim 6, characterized in that: One-way valves are installed inside the first one-way tube (13), the second one-way tube (14), the third one-way tube (15) and the one-way port (26). The one-way valve inside the first one-way tube (13) flows in a direction from the colloid cavity (5) to the bottom of the left columnar groove (11) in a one-way direction. The one-way valve inside the second one-way tube (14) flows in a direction from the bottom of the left columnar groove (11) to the right side of the columnar cavity (21). The one-way valve inside the third one-way tube (15) flows in a direction from the bottom of the right columnar groove (11) to the inside of the hose (19). The one-way valve inside the one-way port (26) flows from right to left.

8. The integrated circuit board glue potting packaging device according to claim 6, characterized in that: A normally open solenoid valve (22) is installed in the rubber discharge pipe (20), and the first motor (8) and the normally open solenoid valve (22) are in the same series circuit.

Images