A cleaning apparatus for semiconductor processing
CN119634286BActive Publication Date: 2026-08-28SUZHOU GRANI VISION TECH CO LTD
Patent Information
- Application Number
- CN202411753009.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2044-12-02
AI Technical Summary
Technical Problem
[0003]当前的晶圆清洗技术主要包括干法清洗和湿法清洗,干法清洗适用于去除晶圆表面的颗粒,但对有机污染物去除效果不佳
Benefits of technology
[0021]与现有技术相比,本发明的一种半导体加工用清洗设备,能够实现晶圆的流水线式清洗,不仅大幅提高了清洗效率,减少了生产时间和成本,还能够同时有效去除晶圆表面的颗粒和有机污染物,显著提升了清洗质量,从而有效促进半导体行业的技术进步与发展。
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Figure CN119634286B_ABST
Abstract
The application discloses a kind of semiconductor processing cleaning equipment, for cleaning wafer, semiconductor processing cleaning equipment includes machine body, further include: first cleaning component, placement box, clamping component and second cleaning component, first cleaning component is used to clean the fine particle on wafer surface, first cleaning component includes a pair of mounting plate, a pair of mounting plate is fixedly connected on the upper panel of machine body, rotationally connected with rotating wheel on mounting plate, rotating wheel is equipped with first transmission belt, a plurality of fixed blocks are fixedly connected on the side wall of first transmission belt, wafer is placed on a pair of fixed blocks.Compared with prior art, a kind of semiconductor processing cleaning equipment of the application can realize the flow line type cleaning of wafer, not only greatly improve the cleaning efficiency, reduce production time and cost, but also can effectively remove the particle and organic contaminant on wafer surface simultaneously, significantly improve the cleaning quality, to effectively promote the technical progress and development of semiconductor industry.
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Citation Information
Patent Citations
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