Preparation method of an Mn alloy additive

Abstract

The present invention relates to the technical field of alloy additive preparation, and particularly to a preparation method of an Mn alloy additive. In the present invention, a flux and a binder are added to Mn metal powder for mixing to obtain Mn alloy additive powder, which is filled into a die cavity for pulse pressing, and the die cavity is heated for a preset heating duration. The completed pressed Mn alloy additive is demolded, and a temperature decay curve of the temperature over time at several preset points inside the die cavity is obtained. It is determined whether the preset points are powder bonding residue points, and the powder bonding residue category is determined according to the number of powder bonding residue points. A pressing adjustment method for re-filling the Mn alloy additive powder into the die cavity for pulse pressing is selected. Furthermore, the state of powder residue is quickly detected during the continuous pressing process, and the subsequent pressing link is adjusted in a timely manner, improving the stability of the continuous pressing of the manganese alloy additive.

Description

Technical Field

[0001] The present invention relates to the technical field of alloy additive preparation, and particularly to a preparation method of Mn alloy additive. Background Art

[0002] In industrial production, manganese is an important element that can improve the strength, hardness, wear resistance and hardenability of alloys. With the continuous progress of metallurgical technology, the requirements for the quality of alloys are constantly increasing, and the quality and performance requirements for manganese alloy additives are also getting higher and higher. Advanced production processes and detection technologies make the production of manganese alloy additives more efficient and accurate, meeting the needs of different users.

[0003] Traditional preparation methods of Mn alloy additives often face many problems during the pressing process. On the one hand, due to the characteristics of Mn metal powder itself and the limitations of existing preparation processes, powder is likely to adhere to the inner wall of the pressing die cavity during the pressing and forming process. This not only affects the quality and appearance of the product, but also may lead to unstable product performance. On the other hand, the current preparation methods lack effective monitoring and solution means for the powder adhesion problem, and often can only rely on experience for adjustment. This is not only inefficient, but also difficult to ensure the consistency of product quality. Therefore, there is an urgent need for a new preparation method of Mn alloy additives that can effectively monitor and solve the powder adhesion problem and improve product quality and production efficiency.

[0004] For example, Chinese Patent Publication No.: CN116275034A. This invention discloses an alloy powder pressing die, belonging to the technical field of powder metallurgy. It includes an operating table, on the upper surface of which a support plate and a lower module are fixedly installed. On the side wall of the support plate, a fixed plate is fixedly installed. One end of an electric telescopic column is fixedly installed with an upper module, and an oscillation component is arranged on the inner wall of the upper module; by setting the oscillation component, the moving plate drives the ejector pin to move upward along the side of the upper module through the thread on the outer surface. When one end of the movable rod presses against the lower surface of the fixed plate, when the buckle loses its fixation on the moving plate, under the action of the spring rod, the ejector pin will be driven by the moving plate to impact the forming block. After each extrusion, the forming block is automatically impacted. With the oscillation of the forming block, the powder attached to its outer surface can be shaken off, avoiding the influence of the powder attached to the outer surface of the forming block on the subsequent pressing, and further improving the success rate of the die during pressing.

[0005] The following problems also exist in the prior art:

[0006] The prior art does not consider that the manganese alloy additive powder is prone to adhere to the inner wall of the die cavity during continuous pressing, resulting in trace powder residues. The prior art cannot quickly detect the state of powder residues during continuous pressing, and cannot timely adjust the subsequent pressing process, affecting the stability of continuous pressing of manganese alloy additives. Summary of the Invention

[0007] Therefore, the present invention provides a preparation method for Mn alloy additives to overcome the problems that the prior art cannot quickly detect the state of powder residues during continuous pressing and cannot timely adjust the subsequent pressing process.

[0008] To achieve the above object, the present invention provides a preparation method for Mn alloy additives, including:

[0009] Adding a flux and a binder to Mn metal powder for mixing to obtain Mn alloy additive powder;

[0010] Filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating duration, and demolding the completed pressed Mn alloy additive;

[0011] Obtaining the temperature decay curves of the temperature over time at several preset points inside the die cavity, calculating the coincidence degrees of several curves based on the temperature decay curves corresponding to each preset point to determine whether the preset point is a powder adhesion residue point;

[0012] Determining a powder adhesion residue characterization factor according to the number of powder adhesion residue points to determine the powder adhesion residue category;

[0013] Selecting a pressing adjustment method for filling the Mn alloy additive powder into the die cavity again for pulse pressing according to the powder adhesion residue category, including:

[0014] Adjusting the pulse frequency of the pulse pressing for the Mn alloy additive powder refilled into the die cavity;

[0015] Or, refilling the Mn alloy additive powder into the die cavity in batches, and performing batch pulse pressing on each batch of Mn alloy additive powder filled in the die cavity to obtain Mn alloy additives;

[0016] Wherein, the pulse pressing for each batch lasts for a preset duration.

[0017] Further, the preset points include the point at the center of the bottom and several points at the bottom edge of the die cavity.

[0018] Further, the process of determining the curve coincidence degree includes:

[0019] Obtain the temperature decay curves corresponding to the points selected along the bottom edge and the temperature decay curve corresponding to the point at the center of the bottom.

[0020] Determine the temperature decay curve corresponding to the point at the center of the bottom as the reference curve, and calculate the curve coincidence degree between the temperature decay curves of each bottom edge point and the temperature decay curve.

[0021] Further, the process of determining whether a preset point is a powder bonding residue point includes:

[0022] Compare the curve coincidence degree with a preset curve coincidence degree threshold.

[0023] If the curve coincidence degree is less than the curve coincidence degree threshold, determine that the point on the bottom edge of the die cavity corresponding to the curve coincidence degree is a powder bonding residue point.

[0024] Further, the process of determining the powder bonding residue characterization factor includes:

[0025] Obtain the number of the powder bonding residue points and the total number of the preset points.

[0026] Calculate the ratio of the number of the powder bonding residue points to the total number.

[0027] Determine the ratio as the powder bonding residue characterization factor.

[0028] Further, the process of determining the powder bonding residue category includes:

[0029] Compare the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value.

[0030] If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, determine that the powder bonding residue category is a weakly dominant powder bonding residue category.

[0031] If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, determine that the powder bonding residue category is a strongly dominant powder bonding residue category.

[0032] Further, the process of selecting the pressing adjustment method includes:

[0033] If the powder bonding residue category is a weakly dominant powder bonding residue category, select the pressing adjustment method as adjusting the pulse frequency of the pulse pressing for the Mn alloy additive powder refilled into the die cavity.

[0034] If the powder bonding residue category is a strongly dominant powder bonding residue category, select the pressing adjustment method as batchwise refilling of Mn alloy additive powder into the die cavity, and perform batchwise pulse pressing on each batch of Mn alloy additive powder filled in the die cavity. The pulse pressing for each batch lasts for a preset duration to produce Mn alloy additives.

[0035] Further, adjust the pulse frequency of the pulse pressing for the Mn alloy additive powder refilled into the die cavity again according to the average value of the curve coincidence degrees corresponding to each powder bonding residue point. The pulse frequency has a negative correlation with the average value of the curve coincidence degrees.

[0036] Further, the process of batchwise refilling Mn alloy additive powder into the die cavity further includes:

[0037] Determine the number of batches for refilling Mn alloy additive powder into the die cavity again according to the standard deviation of the curve coincidence degrees corresponding to each powder bonding residue point. The number of batches has a positive correlation with the standard deviation of the curve coincidence degrees.

[0038] Further, the flux is sodium chloride and the binder is aluminum dihydrogen phosphate.

[0039] Compared with the prior art, the beneficial effects of the present invention are as follows. The present invention fills the mixed Mn alloy additive powder into the die cavity for pulse pressing, heats the die cavity for a preset heating duration, demolds the obtained Mn alloy additives after pressing, obtains the temperature decay curve of the temperature over time at several preset points inside the die cavity, determines whether the preset points are powder bonding residue points, determines the powder bonding residue category according to the number of powder bonding residue points, and selects the pressing adjustment method of refilling Mn alloy additive powder into the die cavity again for pulse pressing. Furthermore, it realizes the rapid detection of the powder residue state during the continuous pressing process, timely adjusts the subsequent pressing link, and improves the stability of the continuous pressing of manganese alloy additives.

[0040] In particular, the present invention obtains the temperature decay curve of the temperature over time at several preset points inside the die cavity. Those skilled in the art can understand that Mn metal powder has a certain heat capacity. When there is powder bonding residue in the die cavity, the different heat conduction capabilities between the powder and the inner wall of the die cavity make the temperature decay trend of the position with powder residue over time different from the temperature decay trend of the material of the inner wall of the die cavity itself. Under the condition of heating the die cavity, the powder bonding residue phenomenon at different points inside the die cavity can be characterized by obtaining the temperature decay curve of the temperature over time at several preset points. Furthermore, it realizes the rapid discovery of the powder residue phenomenon during the continuous pressing process.

[0041] In particular, the present invention selects the point at the center of the bottom and several points at the bottom edge of the die cavity as the preset points. It can be understood that the surface of the die cavity at the center of the bottom is smooth, and the alloy additive powder is evenly and sufficiently pressed, and it is not easy to leave residual alloy additive powder at this position. The temperature decay curve at this point can represent the temperature change inside the die cavity in a theoretical state. Due to the limitation of the die geometry at the bottom edge of the die cavity, the internal structure is likely to be uneven during the pressing process. By selecting the point at the center of the bottom and several points at the bottom edge of the die cavity as the preset points and comparing the temperature decay, the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0042] In particular, the present invention determines whether the point at the bottom edge of the preset die cavity is a powder bonding residue point through the curve coincidence degree of the temperature decay curve. Those skilled in the art can understand that the curve coincidence degree represents the powder bonding residue situation of the Mn alloy additive powder at the point at the bottom edge of the die cavity. The higher the curve coincidence degree, the less obvious the powder bonding residue phenomenon of the Mn alloy additive powder at the point at the bottom edge of the die cavity corresponding to the curve coincidence degree. The lower the curve coincidence degree, the less obvious the powder bonding residue phenomenon of the Mn alloy additive powder at the point at the bottom edge of the die cavity corresponding to the curve coincidence degree. Furthermore, the screening of the powder bonding residue points is realized, and the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0043] In particular, under the condition that the powder bonding residue phenomenon of the Mn alloy additive powder is less obvious, the present invention improves the powder residue phenomenon in the die cavity by adjusting the pulse frequency during the pulse pressing process. It can be understood that different pulse frequencies will affect the pressure distribution in the die cavity. By increasing the pulse frequency, the Mn alloy additive powder in the edge area can be subjected to more pressure actions in a short time, thereby enhancing the compaction effect and ensuring that the Mn alloy additive powder can be fully compacted in the edge area where powder residue is likely to occur, thus improving the powder residue phenomenon in the die cavity. Furthermore, the adjustment of the subsequent pressing link is realized in a timely manner, and the stability of the continuous pressing of the manganese alloy additive is improved.

[0044] In particular, under the condition that the powder bonding residue phenomenon of the Mn alloy additive powder is more obvious, the present invention fills the die cavity with the Mn alloy additive powder in batches, avoiding the uneven local pressure distribution caused by a large amount of Mn alloy additive powder remaining at the bottom of the die cavity during the subsequent pressing process, resulting in local powder agglomeration and affecting the stability of continuous pressing of the manganese alloy additive. By injecting the powder in batches and performing multiple pulse pressings, the present invention can make the powder better fill the mold through pulse pressing after each powder injection, reduce the adverse impact of the remaining powder agglomerates on the pressure uniformity during the pressing process, and make the internal fusion of the Mn alloy additive powder more uniform. Furthermore, it realizes timely adjustment of the subsequent pressing link and improves the stability of continuous pressing of the manganese alloy additive. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 is a step diagram of the preparation method of the Mn alloy additive in the embodiment of the present invention;

[0046] Figure 2 is a distribution schematic diagram of several preset points in the embodiment of the present invention;

[0047] Figure 3 is a schematic diagram of the temperature decay curve of each point in the die cavity in the embodiment of the present invention;

[0048] Figure 4 is a logic flow chart for determining whether a preset point is a powder bonding residue point in the embodiment of the present invention;

[0049] Figure 5 is a logic flow chart for determining the type of powder bonding residue in the embodiment of the present invention;

[0050] In the figure, die cavity 1, point 2 at the center position of the bottom, and point 3 at the edge of the bottom of the die cavity. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0051] In order to make the objectives and advantages of the present invention clearer and more understandable, the present invention will be further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0052] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present invention and do not limit the protection scope of the present invention.

[0053] It should be noted that in the description of the present invention, the terms indicating directions or positional relationships such as "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0054] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Please refer to Figure 1 as shown, which is a step diagram of the preparation method of the Mn alloy additive in the embodiment of the present invention. A preparation method of a Mn alloy additive of the present invention includes:

[0056] Step S100, adding a flux and a binder to Mn metal powder and mixing to obtain Mn alloy additive powder;

[0057] Step S200, filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating duration, and demolding the Mn alloy additive after pressing is completed;

[0058] Specifically, the present invention does not limit the process of pulse pressing. The amplitude and frequency of pulse pressing can be set by those skilled in the art according to the pressing process requirements of the Mn alloy additive powder. Preferably, the value range of the amplitude of pulse pressing can be [150, 200], and the interval unit is MPa. The value range of the frequency of pulse pressing can be [10, 15], and the interval unit is Hz.

[0059] Specifically, the setting of the preset heating duration can be set by those skilled in the art according to the pressing process requirements of the Mn alloy additive powder. Preferably, for the preparation of the Mn alloy additive powder, the value of the preset heating duration can be set to [10, 30], and the interval unit is min. The preset heating duration starts at the start time of each die pressing process and ends at the end time of each die pressing process.

[0060] Specifically, the temperature setting for heating the die cavity is not higher than the melting points of the Mn metal powder, the binder, and the flux. Preferably, the value range of the heating temperature can be [35, 50], and the interval unit is degrees Celsius.

[0061] Step S300: Obtain the temperature decay curves of several preset points inside the die cavity over time, and calculate the coincidence degrees of several curves based on the temperature decay curves corresponding to each preset point to determine whether the preset points are powder bonding residue points;

[0062] Specifically, in the present invention, by obtaining the temperature decay curves of several preset points inside the die cavity over time, those skilled in the art can understand that Mn metal powder has a certain heat capacity. When there is powder bonding residue in the die cavity, the different heat conduction capabilities between the powder and the inner wall of the die cavity cause the temperature decay trend of the position with powder residue over time to be different from the temperature decay trend of the material of the inner wall of the die cavity itself. Under the condition of heating the die cavity, the powder bonding residue phenomenon at different points inside the die cavity can be characterized by obtaining the temperature decay curves of several preset points over time. Furthermore, the powder residue phenomenon in the pressing process can be quickly detected during the continuous pressing process.

[0063] Step S400: Determine the powder bonding residue characterization factor according to the number of the powder bonding residue points to determine the powder bonding residue category;

[0064] Step S500: Select the pressing adjustment method of repacking the Mn alloy additive powder into the die cavity for pulse pressing according to the powder bonding residue category, including:

[0065] Adjust the pulse frequency of the pulse pressing for the Mn alloy additive powder repacked into the die cavity;

[0066] Or, repack the Mn alloy additive powder into the die cavity in batches, and perform batch pulse pressing on each batch of the Mn alloy additive powder filled in the die cavity to obtain the Mn alloy additive;

[0067] Among them, the pulse pressing of each batch lasts for a preset duration.

[0068] Specifically, please refer to Figure 2 As shown, it is a schematic diagram of the distribution of several preset points in an embodiment of the present invention. The preset points include point 2 at the bottom center position and several points at the bottom edge of the die cavity.

[0069] Specifically, in the present invention, by selecting the point at the center of the bottom and several points at the bottom edge of the die cavity as the preset points, it can be understood that the surface of the die cavity at the center of the bottom is smooth, and the alloy additive powder is uniformly and sufficiently pressed. It is not easy to leave residual alloy additive powder at this position, and the temperature decay curve at this point can represent the temperature change inside the die cavity in a theoretical state. Due to the limitation of the die geometry at the bottom edge of the die cavity, the internal structure is likely to be uneven during the pressing process. By selecting the point at the center of the bottom and several points at the bottom edge of the die cavity as the preset points and comparing the temperature decay, the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0070] Specifically, the process of determining the curve coincidence degree includes:

[0071] Obtain the temperature decay curves corresponding to each point 3 selected along the bottom edge and the temperature decay curve corresponding to the point 2 at the center of the bottom;

[0072] Determine the temperature decay curve corresponding to the point 2 at the center of the bottom as the reference curve, and calculate the curve coincidence degree between the temperature decay curves of each bottom edge point 3 and the temperature decay curve.

[0073] Specifically, the present invention does not limit the method of calculating the curve coincidence degree. The correlation coefficient of the values of the corresponding points on the two curves can be calculated through relevant algorithms. The closer the correlation coefficient is to 1, the higher the coincidence degree of the two curves; the closer the correlation coefficient is to 0, the greater the difference between the two curves. The algorithm for calculating the correlation coefficient of the curves is a prior art and will not be elaborated here.

[0074] Specifically, the process of determining the curve coincidence degree can refer to the following Embodiment 1; Embodiment 1

[0075] The temperature values at each moment after demolding of the point at the center of the bottom and the temperature values at each moment after demolding of each bottom edge point are shown in Table 1.

[0076] Table 1 Temperature measurement records of each point of the die cavity

[0077]

[0078] Please refer to Figure 3 As shown, it is a schematic diagram of the temperature decay curves of each point of the die cavity in the embodiment of the present invention. The temperature values at each moment after demolding of each point are used as the vertical axis, and time is used as the horizontal axis to draw the temperature decay curves corresponding to each point. Figure 3The temperature decay curves corresponding to the temperature values at +1 min after demolding from high to low are respectively the temperature decay curve of the bottom edge point 5, the temperature decay curve of the bottom edge point 3, the temperature decay curve of the bottom edge point 4, the temperature decay curve of the bottom edge point 1, the temperature decay curve of the bottom edge point 2, and the temperature decay curve corresponding to the bottom center position. The curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 1 is 0.98, the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 2 is 0.95, the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 3 is 0.6, the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 4 is 0.7, and the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 5 is 0.75.

[0079] Specifically, please refer to Figure 4 As shown, it is a logic flowchart for determining whether a preset point is a powder adhesion residue point in an embodiment of the present invention. The process of determining whether a preset point is a powder adhesion residue point includes:

[0080] Comparing the curve coincidence degree with a preset curve coincidence degree threshold;

[0081] If the curve coincidence degree is less than the curve coincidence degree threshold, it is determined that several points 3 on the bottom edge of the mold cavity corresponding to the curve coincidence degree are powder adhesion residue points;

[0082] If the curve coincidence degree is greater than or equal to the curve coincidence degree threshold, the points 3 on the bottom edge of the mold cavity corresponding to the curve coincidence degree are not screened.

[0083] Specifically, the preset curve coincidence degree threshold can be set by those skilled in the art according to the requirements for the pressing stability of the Mn alloy additive powder. The higher the requirements for the pressing stability of the Mn alloy additive powder, the larger the value of the curve coincidence degree threshold. Preferably, the value range of the curve coincidence degree threshold can be [0.8, 0.9].

[0084] Specifically, the present invention determines whether a point at the bottom edge of a preset die cavity is a powder bonding residue point through the curve coincidence degree of a temperature decay curve. Those skilled in the art can understand that the curve coincidence degree characterizes the powder bonding residue situation of the Mn alloy additive powder at the point at the bottom edge of the die cavity. The higher the curve coincidence degree, the less obvious the powder bonding residue phenomenon of the Mn alloy additive powder at the point at the bottom edge of the die cavity corresponding to the curve coincidence degree; the lower the curve coincidence degree, the less obvious the powder bonding residue phenomenon of the Mn alloy additive powder at the point at the bottom edge of the die cavity corresponding to the curve coincidence degree. Furthermore, the screening of powder bonding residue points is realized, and the data representativeness of the powder residue phenomenon during the pressing process is improved.

[0085] Specifically, the process of determining whether a preset point is a powder bonding residue point can refer to the following Embodiment 2; Embodiment 2

[0086] The value of the curve coincidence degree threshold is set to 0.8;

[0087] When the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 1 is 0.98, the curve coincidence degree of 0.98 is greater than the curve coincidence degree threshold of 0.8, and the bottom edge point 1 is not screened;

[0088] When the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 2 is 0.95, the curve coincidence degree of 0.95 is greater than the curve coincidence degree threshold of 0.8, and the bottom edge point 2 is not screened;

[0089] When the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 3 is 0.6, the curve coincidence degree of 0.6 is less than the curve coincidence degree threshold of 0.8, and the bottom edge point 3 is determined to be a powder bonding residue point;

[0090] When the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 4 is 0.7, the curve coincidence degree of 0.7 is less than the curve coincidence degree threshold of 0.8, and the bottom edge point 4 is determined to be a powder bonding residue point;

[0091] When the curve coincidence degree between the temperature decay curve corresponding to the bottom center position and the temperature decay curve corresponding to the bottom edge point 5 is 0.75, the curve coincidence degree of 0.75 is less than the curve coincidence degree threshold of 0.8, and the bottom edge point 5 is determined to be a powder bonding residue point.

[0092] Specifically, the process of determining the powder bonding residue characterization factor includes:

[0093] Obtain the number of the powder bonding residue points and the total number of the preset points;

[0094] Calculate the ratio of the number of the powder bonding residue points to the total number;

[0095] Determine the ratio as the powder bonding residue characterization factor.

[0096] Specifically, the process of determining the powder bonding residue characterization factor can refer to the following Embodiment 3; Embodiment 3

[0097] According to Embodiment 2, the number of the powder bonding residue points is 3, the total number of the preset points is 5, and the ratio of the number of the powder bonding residue points to the total number is 0.6, that is, the powder bonding residue characterization factor is 0.6.

[0098] Specifically, please refer to Figure 5 As shown, it is a logic flowchart for determining the category of the powder bonding residue in the embodiment of the present invention. The process of determining the category of the powder bonding residue includes:

[0099] Compare the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value;

[0100] If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, it is determined that the category of the powder bonding residue is the powder bonding residue weak dominance category;

[0101] If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, it is determined that the category of the powder bonding residue is the powder bonding residue strong dominance category.

[0102] Specifically, the preset powder bonding residue characterization factor reference value can be set by those skilled in the art according to the requirements for the pressing stability of the Mn alloy additive powder. The higher the requirements for the pressing stability of the Mn alloy additive powder, the smaller the value of the powder bonding residue characterization factor reference value. Preferably, the value range of the powder bonding residue characterization factor reference value can be [0.4, 0.6].

[0103] Specifically, the process of selecting the pressing adjustment method includes:

[0104] If the category of the powder bonding residue is the powder bonding residue weak dominance category, select the pressing adjustment method as adjusting the pulse frequency of the pulse pressing for the Mn alloy additive powder refilled into the die cavity;

[0105] If the powder bonding residue category is a strongly dominant powder bonding residue category, select the pressing adjustment method to refill the Mn alloy additive powder into the die cavity in batches, and perform pulsed pressing on each batch of the Mn alloy additive powder filled in the die cavity. The pulsed pressing for each batch lasts for a preset duration to produce the Mn alloy additive.

[0106] Specifically, adjust the pulse frequency of the pulsed pressing for the Mn alloy additive powder refilled into the die cavity according to the average value of the curve coincidence degrees corresponding to each powder bonding residue point. The pulse frequency has a negative correlation with the average value of the curve coincidence degrees.

[0107] Specifically, under the condition that the powder bonding residue phenomenon of the Mn alloy additive powder is less obvious, by adjusting the pulse frequency during the pulsed pressing process, the powder residue phenomenon in the die cavity can be improved. It can be understood that different pulse frequencies will affect the pressure distribution in the die cavity. By increasing the pulse frequency, the Mn alloy additive powder in the edge area can be subjected to more pressure actions in a short time, thereby enhancing the compaction effect and ensuring that the Mn alloy additive powder can be fully compacted in the edge area where powder residue is likely to occur, thus improving the powder residue phenomenon in the die cavity. Furthermore, the adjustment of the subsequent pressing link is realized in a timely manner, and the stability of the continuous pressing of the manganese alloy additive is improved.

[0108] Specifically, the process of refilling the Mn alloy additive powder into the die cavity in batches further includes:

[0109] Determine the number of batches for refilling the Mn alloy additive powder into the die cavity according to the standard deviation of the curve coincidence degrees corresponding to each powder bonding residue point. The number of batches has a positive correlation with the standard deviation of the curve coincidence degrees.

[0110] Specifically, under the condition that the powder bonding residue phenomenon of the Mn alloy additive powder is more obvious, by filling the Mn alloy additive powder into the die cavity in batches, it is avoided that a large amount of Mn alloy additive powder remaining at the bottom of the die cavity causes uneven pressure distribution in the local area of the powder residue during the subsequent pressing process, resulting in local powder agglomeration and affecting the stability of the continuous pressing of the manganese alloy additive. By injecting the powder in batches and performing pulsed pressing multiple times, the powder can be better filled into the mold through pulsed pressing after each powder injection, reducing the adverse impact of the residual powder agglomerates on the pressure uniformity during the pressing process, and making the internal fusion of the Mn alloy additive powder more uniform. Furthermore, the adjustment of the subsequent pressing link is realized in a timely manner, and the stability of the continuous pressing of the manganese alloy additive is improved.

[0111] Specifically, the flux is sodium chloride and the binder is aluminum dihydrogen phosphate.

[0112] So far, the technical solution of the present invention has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easily understood by those skilled in the art that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present invention.

[0113] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A method for preparing a Mn alloy additive, characterized in that: include: Adding flux and binder to Mn metal powder and mixing them to obtain Mn alloy additive powder; Filling the Mn alloy additive powder into a die cavity for pulse pressing, heating the die cavity for a preset heating time, and demolding the pressed Mn alloy additive; Obtaining temperature decay curves of the temperature of several preset points inside the die cavity over time, and calculating the overlap of several curves based on the temperature decay curves corresponding to the preset points to determine whether the preset points are powder bonding residual points, the preset points including the points at the bottom center and several points at the bottom edge of the die cavity; Comparing the curve coincidence with a preset curve coincidence threshold; If the curve overlap is less than the curve overlap threshold, then determining that the point on the bottom edge of the die cavity corresponding to the curve overlap is a powder bonding residual point; Determining a powder bonding residue characterization factor according to the number of the powder bonding residue points to determine the powder bonding residue category; The pressing adjustment method of selecting the Mn alloy additive powder to be filled into the die cavity again for pulse pressing according to the powder bonding residue category includes: If the powder bonding residue category is a weakly dominant category of powder bonding residue, the pulse frequency of pulse pressing for adjusting the Mn alloy additive powder refilled into the die cavity is selected, and the pulse frequency is negatively correlated with the average value of the curve coincidence corresponding to each powder bonding residue point; If the powder bonding residue category is a powder bonding residue strong dominant category, the die cavity is selected to be filled with Mn alloy additive powder again in batches, and each batch of Mn alloy additive powder filled in the die cavity is pulse pressed in batches to obtain the Mn alloy additive, and the number of batches of pulse pressing is positively correlated with the standard deviation of the curve coincidence corresponding to each powder bonding residue point; The pulse suppression of each batch lasts for a preset time.

2. The method for preparing the Mn alloy additive according to claim 1, characterized in that: The process of determining curve coincidence includes: Obtaining the temperature attenuation curve corresponding to each point selected along the bottom edge and the temperature attenuation curve corresponding to the point at the center position of the bottom; The temperature attenuation curve corresponding to the point at the center of the bottom is determined as a reference curve, and the degree of overlap between the temperature attenuation curves at the edge points of the bottom and the temperature attenuation curve is calculated.

3. The method for preparing the Mn alloy additive according to claim 2, characterized in that: The process of determining the powder bonding residue characterization factor includes: Obtaining the number of the powder bonding residual points and the total number of the preset points; Calculating the ratio of the number of the powder bonding residual points to the total number; The ratio is determined as the powder bonding residue characterization factor.

4. The method for preparing the Mn alloy additive according to claim 3, characterized in that: The process of determining the powder bonding residue category includes: Comparing the powder bonding residue characterization factor with a preset powder bonding residue characterization factor reference value; If the powder bonding residue characterization factor is less than or equal to the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue weakly dominant category; If the powder bonding residue characterization factor is greater than the powder bonding residue characterization factor reference value, the powder bonding residue category is determined to be a powder bonding residue strong dominant category.

5. The method for preparing the Mn alloy additive according to claim 1, characterized in that: The flux is sodium chloride, and the binder is aluminum dihydrogen phosphate.

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