Implant processing device and implant processing method

Abstract

The invention relates to the technical field of implant processing equipment, and provides an implant processing device and an implant processing method.The implant processing device comprises a station, a laser and a machine tool; the station is used for placing a material body; the laser is used for emitting a laser beam to the surface of a preset area on the material body and processing a concave part; the machine tool is provided with a cutter used for cutting on the surface of the preset area; wherein the cutting depth of the cutter is smaller than or equal to the depth of the concave part.

Description

Technical Field

[0001] The present invention belongs to the technical field of implant processing equipment, and more specifically, relates to an implant processing device and an implant processing method. Background Art

[0002] Ceramic products are generally made by molding powdered raw materials in a mold and then sintering them at high temperature. The ceramic body will shrink to varying degrees during the sintering process, so the molding method cannot be used to prepare high-precision dental implant products. In addition, ceramic products are characterized by high hardness and high brittleness, making it difficult to ensure their processing accuracy requirements using traditional mechanical processing methods such as turning, milling and grinding. Ceramic products are prone to cracking during processing, and the processing efficiency is low, which is especially difficult for ceramic implant products with complex shapes and high dimensional accuracy. Ceramics or other highly brittle materials are often used in implants, but cracks are prone to occur when processing such implants. Summary of the invention

[0003] The object of the present invention is to provide an implant processing device to solve the technical problem in the prior art that highly brittle implant products are prone to cracks during processing.

[0004] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: providing an implant processing device for processing a material body into an implant; the implant processing device comprises:

[0005] Workstation; the workstation is used to place the material;

[0006] Laser; the laser is used to emit a laser beam to a predetermined area on the surface of the material body and process a recessed portion;

[0007] A machine tool; the machine tool has a tool for cutting the surface of the predetermined area; wherein the cutting depth of the tool is less than or equal to the depth of the recessed portion.

[0008] Furthermore, the recessed portion is a concave hole or a groove.

[0009] Furthermore, there are multiple grooves, and the multiple grooves are arranged in parallel.

[0010] Furthermore, the depths of the plurality of grooves are the same; or the depths of adjacent grooves are different.

[0011] Furthermore, the groove extends along a spiral trajectory.

[0012] Furthermore, the laser is: a laser punching machine or a laser cutting machine.

[0013] Furthermore, it also includes: a mold; the mold has a molding cavity; the molding cavity is used for ceramic powder to be injected and solidified to form the green body.

[0014] Furthermore, the molding cavity is cylindrical; the diameter of the green body after sintering into a ceramic rod is greater than the outer diameter of the implant by 1 mm.

[0015] Furthermore, the laser is a nanosecond laser device or a picosecond laser device.

[0016] Furthermore, it also includes: finishing equipment; the finishing equipment is: any one of picosecond laser equipment, femtosecond laser equipment, and a grinder.

[0017] Furthermore, it also includes: a nozzle and a gas source for providing inert gas; the nozzle is connected to the gas source; and the nozzle sprays toward the predetermined area surface of the material body on the workstation.

[0018] Furthermore, the laser and the tool can process the material body simultaneously.

[0019] Furthermore, it also includes: a control unit for controlling the power of the laser; the control unit controls the drilling or cutting depth by controlling the power of the laser device.

[0020] Furthermore, the tool is a drill bit; the drilling of the drill bit and the laser are processed alternately until the drill bit drills to a specified depth.

[0021] Furthermore, the depth of each hole drilled by the drill bit should be less than or equal to the depth of laser processing.

[0022] Furthermore, a plurality of the grooves are processed along a predetermined path on the surface of the predetermined area, and each of the grooves has a different depth.

[0023] The present invention also provides an implant processing method, comprising:

[0024] S1: Prepare the material for making the implant;

[0025] S2: machining a recessed portion on a surface of a predetermined area of ​​the material body by laser;

[0026] S3: Cutting the surface of the predetermined area by a tool, wherein the cutting depth of the tool is less than or equal to the depth of the recessed portion.

[0027] Furthermore, the material body is cylindrical.

[0028] Furthermore, the step S2 comprises: machining a plurality of parallel first grooves on the side surface of the material body along the required contour of the implant by laser.

[0029] Furthermore, the step S2 includes: machining a plurality of parallel second grooves along a thread spiral trajectory on the side surface of the material body by laser.

[0030] Further, the depths of any adjacent second grooves are different.

[0031] Furthermore, the step S2 also includes: machining a spiral third groove at a desired drilling position on the end surface of the material body by laser.

[0032] The beneficial effect of the implant processing device provided by the present invention is that compared with the prior art, in the implant processing device provided by the present invention, a material body is placed on a work station, and a laser can emit a laser beam to a surface of a predetermined area on the material body, and the laser beam burns a recessed portion on the surface of the predetermined area; a tool on a machine tool can cut the surface of the predetermined area, and the cutting depth of the tool is less than or equal to the depth of the recessed portion. Since a recessed portion is arranged on the surface of the predetermined area, when the tool cuts the surface of the predetermined area, part of the deformation of the surface of the predetermined area can be released into the recessed portion, thereby reducing cracks on the surface of the predetermined area during the processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of a common tool for cutting a material provided by an embodiment of the present invention;

[0034] Figure 2 A schematic diagram of a laser provided in an embodiment of the present invention drilling a hole in a material body;

[0035] Figure 3 A schematic diagram of a laser provided in an embodiment of the present invention forming a groove on a material body;

[0036] Figure 4 A three-dimensional schematic diagram of a material processed by a laser according to an embodiment of the present invention Figure 1 ;

[0037] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0038] Figure 6 A three-dimensional schematic diagram of a material processed by a laser according to an embodiment of the present invention Figure 2 ;

[0039] Figure 7 A three-dimensional schematic diagram of a material processed by a laser according to an embodiment of the present invention Figure 3 ;

[0040] Figure 8 for Figure 7 Enlarged view of point B in the middle;

[0041] Fig. 9A three-dimensional schematic diagram of a material processed by a laser according to an embodiment of the present invention Figure 3 (end surface of processed material);

[0042] Fig.10 for Fig. 9 Enlarged view of point C in the middle.

[0043] Among them, the reference numerals in the figure are:

[0044] 1-material body; 11-recessed portion; 12-predetermined area surface; 2-work station; 3-laser; 4-tool; 5-finishing equipment; 6-turntable; 7-radial laser equipment; 8-nozzle. DETAILED DESCRIPTION

[0045] It should be noted that the specific embodiments are only used to explain the present invention, and are not used to limit the present invention.

[0046] It should be noted that, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. Among them, A and B can be singular or plural respectively.

[0047] It should be noted that when an element is referred to as being "fixed on" or "set on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" or "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element. When an element is referred to as being "fixed on" or "set on" another element, it may be directly on the other element or indirectly on the other element.

[0048] It should be noted that the directions or positional relationships indicated by terms such as “length”, “width”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0049] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0050] It should be noted that the term "plurality" means two or more than two, unless otherwise clearly and specifically defined.

[0051] Please also read Figures 1 to 10 The implant processing device provided by the present invention is now described. The implant processing device is used to process a material body 1 into an implant; the implant processing device comprises: a station 2, a laser 3, and a machine tool; the station 2 is used to place the material body 1; the laser 3 is used to emit a laser beam to a predetermined area surface 12 on the material body 1 and process a recessed portion 11; the machine tool has a tool 4 for cutting on the predetermined area surface 12; wherein the cutting depth of the tool 4 is less than or equal to the depth of the recessed portion 11.

[0052] In this way, the material body 1 is placed on the work station 2, and the laser 3 can emit a laser beam to the surface 12 of the predetermined area on the material body 1, and the laser beam burns a recessed portion 11 on the surface 12 of the predetermined area; the tool 4 on the machine tool can cut the surface 12 of the predetermined area, and the cutting depth of the tool 4 is less than or equal to the depth of the recessed portion 11. Since the recessed portion 11 is arranged on the surface 12 of the predetermined area, when the tool 4 cuts the surface 12 of the predetermined area, part of the deformation of the surface 12 of the predetermined area can be released into the recessed portion 11, thereby reducing the cracks generated on the surface 12 of the predetermined area during the processing.

[0053] In one embodiment, the station 2 is a space or a positioning groove into which the material body 1 is placed. In one embodiment, the station 2 is a space on the frame.

[0054] In one embodiment, the implant may be referred to in the Chinese invention patent: (Publication No.: CN114767299A; Name: Self-drilling oral implant; Applicant: Guangdong Jianchi Biotechnology Co., Ltd.).

[0055] In one embodiment, the machine tool is a CNC machine tool.

[0056] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the recessed portion 11 is a concave hole or a groove. In this way, the surface 12 of the predetermined area can be punched or grooved by the laser 3.

[0057] For further information, see Figures 1 to 10As a specific embodiment of the implant processing device provided by the present invention, there are multiple grooves, and the multiple grooves are arranged in parallel. In this way, the material body 1 between the multiple grooves will form a sheet structure; then the tool 4 starts to cut these sheet structures. It can be imagined that these sheet structures will break under the action of external shear, and their stress cannot be transmitted to the next sheet structure, so the slope and the size of the depression are separated by the grooves between the sheet structures, thereby effectively limiting the further expansion of the crack, improving the quality of the processed surface, and avoiding the breakage of the ceramic block. In addition, since the stress cannot be transmitted to the next sheet structure, the cutting stress of the tool 4 can be reduced, thereby reducing the vibration of the machine tool and the wear of the tool 4.

[0058] In one embodiment, the distance between the sheet structures (depressions) is adjusted according to the required precision of the machined surface. The closer the distance between the sheet structures (depressions), the smaller the area where stress cannot be transmitted, and thus the smaller the slope and depression, and the less likely it is to break, so the precision and surface quality after machining are higher.

[0059] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the depths of the plurality of grooves are the same; or the depths of adjacent grooves are different. In this way, grooves of different depths can match the surface shape to be processed.

[0060] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the groove extends along a spiral track. In this way, it can be processed into a thread; when the ceramic rod material is processed into an implant external thread, its laser pretreatment is performed by punching or cutting along three mutually parallel spiral tracks in sequence to form a preprocessed profile of the thread, and then the thread cutter 4 is used to turn along the preprocessed profile of the thread to form an implant external thread.

[0061] For further information, see Figures 1 to 10 As a specific implementation of the implant processing device provided by the present invention, the laser 3 is: a laser drilling machine or a laser cutting machine.

[0062] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a mold; the mold has a molding cavity; the molding cavity is used for injecting ceramic powder and solidifying to form a green body 1.

[0063] For further information, see Figures 1 to 10As a specific embodiment of the implant processing device provided by the present invention, the molding cavity is cylindrical; the diameter of the raw material body 1 after sintering into a ceramic rod is greater than the outer diameter of the implant by 1 mm. In this way, because the ceramic rod green body obtained by molding will shrink to varying degrees during the sintering process, the size of the molding mold can be enlarged according to the shrinkage ratio of the ceramic rod green body to obtain the expected ceramic rod diameter; because the ceramic rod green body will shrink to varying degrees after sintering, this causes the radial surface of the ceramic rod to have different degrees of depression or protrusion (that is, some areas are larger than the rod diameter, and some areas are smaller than the rod diameter). Therefore, when the diameter of the ceramic rod after sintering is the same as the diameter of the pre-processed implant, it will cause the surface of the implant after processing to have depressions. For this reason, it is characterized in that the diameter of the ceramic rod after sintering is slightly larger than the diameter of the pre-processed implant, preferably greater than 1 mm. This is advantageous, and 1 mm can be reserved as a removal surface, that is, before the implant is processed, the device or grinder is used to radially remove 1 mm from the surface of the ceramic rod to obtain a relatively flat and smooth surface.

[0064] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the laser 3 is a nanosecond laser device or a picosecond laser device. In this way, the laser 3 is a rough processing laser device; the rough processing laser device is a nanosecond laser device (1 to 100 holes / second, the hole diameter is 10-300 microns, and the hole depth is hundreds of microns to several millimeters) or a picosecond laser device (100 to 1000 holes / second, the hole diameter is 1-50 microns, and the hole depth is tens of microns to hundreds of microns). Therefore, the rough processing laser device has deeper drilling / cutting, and can prepare a deeper laser pre-treated surface, which is suitable for the rough processing stage with a large cutting amount of the tool 4.

[0065] For further information, see Figures 1 to 10, as a specific embodiment of the implant processing device provided by the present invention, it also includes: a finishing device 5; the finishing device 5 is: any one of a picosecond laser device, a femtosecond laser device, and a grinder. In this way, the finishing device 5 is a picosecond laser device or a femtosecond laser device (100 to 1000 holes / second, the hole diameter is from a few hundred nanometers to 10 microns, and the hole depth is from a few microns to tens of microns). After the rough processing is completed, the finishing laser device is enabled to punch / cut the rough-processed surface to obtain a laser pre-processed surface with a closer distance between the sheet structures (depressions) and a shallower distance. At this time, the processing tool 4 can complete the finishing with a shallower cutting amount, thereby preparing an implant surface quality that meets the implant technical requirements. In one embodiment, grinding can be used to replace the finishing laser equipment to complete the finishing part. Although the grinding efficiency is extremely low and cannot be used in the entire processing and production process of the ceramic implant, the finishing surface removal is small, which can effectively avoid the defect of low grinding efficiency. Therefore, grinding can be used to replace finishing, and grinding can also produce a better ceramic surface. The radial laser device can emit laser in the radial direction to perform laser pretreatment on the drilling part of the implant.

[0066] In one embodiment, the roughing laser device, the finishing laser device and the radial laser device are all arranged on the turntable 6, and the turntable 6 can rotate along its axial direction. When the ceramic bar material is rough-processed, the finishing laser device can be rotated to the position of the roughing laser device by rotating the turntable 6, thereby facilitating the implementation of the finishing step. In addition, the turntable 6 can move along its axial direction, and the ceramic bar material can rotate along its axial direction. Therefore, the surface laser pretreatment of the entire ceramic bar material can be achieved by controlling the axial movement of the laser device and the axial rotation of the ceramic bar material.

[0067] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a nozzle 8 and a gas source for providing inert gas; the nozzle 8 is connected to the gas source; the nozzle 8 sprays toward the surface 12 of the predetermined area of ​​the material body 1 on the work station 2. In this way, oxidation reaction due to high temperature in the laser irradiation area can be avoided.

[0068] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the laser 3 and the tool 4 can process the material body 1 at the same time. In this way, after a small area of ​​the ceramic rod material is laser processed, the processing tool 4 can be used to cut the laser processed area. This is beneficial and can improve the processing efficiency of the implant. At the same time, the temperature of the area is high in a short time after the drilling / cutting is completed, so the brittleness of the area becomes low, so cutting the area in a short time can improve the surface quality of the cutting.

[0069] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, it also includes: a control unit for controlling the power of the laser 3; the control unit controls the drilling or cutting depth by controlling the power of the laser device. In this way, the outer contour of the implant is composed of a cylinder and a cone, so there is an inclined surface (curved surface) during laser drilling / cutting. The laser drilling / cutting depth is controlled by controlling the power of the laser device to form the desired contour (such as an inclined surface, a cone surface, or a curved surface contour).

[0070] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the tool 4 is a drill bit; the drill bit drilling and the laser 3 are processed alternately until the drill bit drills to a specified depth. In this way, since the depth of laser drilling or cutting is limited, it is necessary to laser pre-process the bottom of the previous drilling again, and repeat this several times to reach the specified drilling depth.

[0071] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, the depth of each hole drilled by the drill bit should be less than or equal to the depth processed by the laser 3. In this way, the drill bit is prevented from over-drilling and the conduction of stress is reduced.

[0072] For further information, see Figures 1 to 10 As a specific embodiment of the implant processing device provided by the present invention, multiple grooves are processed along a predetermined path on the surface 12 of the predetermined area, and each groove has different depths. In this way, different surface shapes can be processed through grooves of different depths.

[0073] See also Figures 1 to 10 The present invention also provides an implant processing method, comprising: S1: preparing a material body 1 for manufacturing an implant; S2: processing a recessed portion 11 on a predetermined area surface 12 on the material body 1 by laser; S3: cutting the predetermined area surface 12 by a tool 4, and the cutting depth of the tool 4 is less than or equal to the depth of the recessed portion 11. In this way, the material body 1 is placed on the work station 2, and the laser 3 can emit a laser beam to the predetermined area surface 12 on the material body 1, and the laser beam burns the recessed portion 11 on the predetermined area surface 12; the tool 4 on the machine tool can cut the predetermined area surface 12, and the cutting depth of the tool 4 is less than or equal to the depth of the recessed portion 11. Since the predetermined area surface 12 is provided with the recessed portion 11, when the tool 4 cuts the predetermined area surface 12, part of the deformation of the predetermined area surface 12 can be released into the recessed portion 11, thereby reducing the cracks generated on the predetermined area surface 12 during the processing.

[0074] For further information, see Figures 1 to 10 As a specific implementation of the implant processing method provided by the present invention, the material body 1 is cylindrical.

[0075] Further, step S2 includes: machining a plurality of parallel first grooves along the required contour of the implant on the side surface of the material body 1 by laser. In this way, the tool 4 can manufacture the required contour of the implant by cutting the positions where the first grooves are located.

[0076] Further, step S2 includes: machining multiple parallel second grooves along the thread spiral track on the side surface of the material body 1 by laser. In this way, the tool 4 can manufacture the external thread required for the implant by cutting the position where the first groove is located.

[0077] Furthermore, the depths of any adjacent second grooves are different. In this way, the user can realize structures with different depths at different positions on the external thread.

[0078] Furthermore, step S2 further includes: machining a spiral third groove at a desired drilling position on the end face of the material body 1 by laser. In this way, the tool 4 can manufacture the external thread required for the implant by cutting the position where the first groove is located. In one embodiment, a hole is drilled on the end face of the material body 1 by a radial laser device 7.

[0079] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. An implant processing device, characterized in that: Used to process the material into implants, including: Workstation; the workstation is used to place the material; Laser; the laser is used to emit a laser beam to a predetermined area on the surface of the material body and process a recessed portion; A machine tool; the machine tool has a tool for cutting on the surface of the predetermined area; wherein the cutting depth of the tool is less than or equal to the depth of the recessed portion.

2. The implant processing device according to claim 1, characterized in that: The recessed portion is a concave hole or a groove.

3. The implant processing device according to claim 2, characterized in that: The number of the grooves is multiple, and the multiple grooves are arranged in parallel.

4. The implant processing device according to claim 3, characterized in that: The depths of the plurality of grooves are the same; or the depths of adjacent grooves are different.

5. The implant processing device according to claim 2, characterized in that: The groove extends along a spiral path.

6. The implant processing device according to claim 1, characterized in that: The laser is: a laser punching machine or a laser cutting machine.

7. The implant processing device according to claim 1, characterized in that: Also includes: Mould; The mold has a molding cavity; the molding cavity is used for ceramic powder to be injected and solidified to form the green body.

8. The implant processing device according to claim 7, characterized in that: The molding cavity is cylindrical; the diameter of the green body after sintering into a ceramic rod is 1 mm larger than the outer diameter of the implant.

9. The implant processing device according to claim 1, characterized in that: The laser is a nanosecond laser device or a picosecond laser device.

10. The implant processing device according to claim 9, characterized in that: Also includes: Finishing equipment; the finishing equipment is: any one of a picosecond laser device, a femtosecond laser device, and a grinder.

11. The implant processing device according to claim 1, characterized in that: Also includes: A nozzle and a gas source for providing an inert gas; the nozzle is connected to the gas source; the nozzle sprays toward the surface of the predetermined area of ​​the material body on the workstation.

12. The implant processing device according to claim 1, characterized in that: The laser and the tool can process the material body simultaneously.

13. The implant processing device according to claim 1, characterized in that: Also includes: A control unit for controlling the power of the laser; the control unit controls the drilling or cutting depth by controlling the power of the laser device.

14. The implant processing device according to claim 1, characterized in that: The tool is a drill bit; the drill bit and the laser are used to perform drilling operations alternately until the drill bit drills to a specified depth.

15. The implant processing device according to claim 14, characterized in that: The depth of each hole drilled by the drill bit should be less than or equal to the depth of laser processing.

16. The implant processing device according to claim 2, characterized in that: A plurality of grooves are processed on the surface of the predetermined area along a predetermined path, and each groove has a different depth.

17. An implant processing method, characterized in that: include: S1: Prepare the material for making the implant; S2: machining a recessed portion on a surface of a predetermined area of ​​the material body by laser; S3: Cutting the surface of the predetermined area by a tool, wherein the cutting depth of the tool is less than or equal to the depth of the recessed portion.

18. The implant processing method according to claim 17, characterized in that: The material body is cylindrical.

19. The implant processing method according to claim 18, characterized in that: The step S2 includes: machining a plurality of parallel first grooves on the side surface of the material body along the required contour of the implant by laser.

20. The implant processing method according to claim 18, characterized in that: The step S2 includes: machining a plurality of parallel second grooves along a thread spiral track on the side surface of the material body by laser.

21. The implant processing method according to claim 18, characterized in that: The depths of any adjacent second grooves are different.

22. The implant processing method according to claim 18, characterized in that: The step S2 also includes: machining a spiral third groove at a desired drilling position on the end surface of the material body by laser.

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